JP6918541B2 - Manufacturing method of screen printing plate - Google Patents

Description

The present invention relates to a method for manufacturing a screen printing plate in which a metal mesh portion and a metal mask portion are integrally provided.

Conductor paste printing by a screen printing method is often used in the process of manufacturing a conductor layer in electronic components such as multilayer ceramic capacitors and multilayer ceramic inductors. However, since electronic components that are becoming smaller and smaller require a conductor layer having a small outer shape and thickness, conventional screen printing plates (screen printing plates in which openings are formed in a mesh with an emulsion) meet this requirement. It is becoming difficult to be satisfied with the accuracy. Therefore, recently, instead of the conventional screen printing plate, a screen printing plate having a metal mesh portion and a metal mask portion integrally used is used in the process of manufacturing the conductor layer.

Regarding a screen printing plate in which a metal mesh portion and a metal mask portion are integrally provided, Patent Document 1 described later describes (1) a step of forming a resist for forming a print opening pattern on the surface of a base material, and (2) a base material. The process of forming the base metal by plating on the surface part not covered with the resist, (3) the process of adhering the metal mesh to the surface of the base metal, and (4) the process of attaching the base metal and the metal mesh by plating. Manufacture of a suspended metal mask for printing, which comprises a step of joining, (5) a step of peeling the joined base metal and the metal mesh from the master mold, and (6) a step of peeling the resist from the printing opening pattern of the base metal. The method is disclosed.

However, in the manufacturing method disclosed in Patent Document 1 described later, when the base metal and the metal mesh joined in the step (5) are peeled from the master mold, the resist is also peeled off from the master mold, so that the base The step (6) of peeling the metal and the metal mesh from the base metal and then peeling the resist from the printing opening pattern of the base metal is indispensable. Further, when the inner shape of the printing opening pattern of the base metal becomes smaller, it becomes difficult to peel the resist from the printing opening pattern of the base metal in the step (6), so that peeling failure occurs and the resist is applied to the printing opening pattern. There is also a concern that

International Publication No. 2014/098118

An object to be solved by the present invention is to provide a method for manufacturing a screen printing plate capable of accurately manufacturing a desired screen printing plate by a simple method.

In order to solve the above problems, the method for manufacturing a screen printing plate according to the present invention is a method for manufacturing a screen printing plate in which a metal mesh portion and a metal mask portion having an opening are integrally provided, and is a method for manufacturing a screen printing plate of a metal substrate. By the step of producing a master mold in which the insulator convex portion corresponding to the opening is integrally formed on the outer surface and the first electric casting, the electrodeposited metal is formed on the outer surface region of the metal substrate where the insulator convex portion does not exist. In the step of forming the foil and in a state where the metal mesh is in close contact with the outer surface of the electrodeposited metal foil of the master mold, an electrodeposited metal film is formed on the surface of the metal mesh by the second electric casting, and , The electrodeposited metal foil is joined to a part of the electrodeposited metal film, and the metal mesh portion made of the metal mesh and the electrodeposited metal film and the metal mask portion made of the electrodeposited metal foil are integrated. And the step of peeling the electrodeposited metal film of the integrated product from the outer surface of the insulator convex portion, and removing the electrodeposited metal foil from the outer surface region of the metal substrate where the insulator convex portion does not exist. The metal foil is thickened in the first electrocasting, comprising a step of removing the integrated material from the master mold while leaving the convex portion of the insulator on the outer surface of the metal substrate. The metal is formed so as to be larger than the thickness of the convex portion of the insulator .

According to the screen printing plate manufacturing method according to the present invention, the desired screen printing plate can be accurately manufactured by a simple method.

1 (A) and 1 (B) are explanatory views of a manufacturing process of a printing plate main body. 2 (A) and 2 (B) are explanatory views of a process of manufacturing a master mold. FIG. 3 is an explanatory diagram of the first electroforming process. 4 (A) and 4 (B) are explanatory views of the first electroforming process. FIG. 5 is an explanatory diagram of a process of bringing the metal mesh of the printing plate body into close contact with the electrodeposited metal foil of the master mold. FIG. 6 is an explanatory diagram of the second electroforming process. 7 (A) and 7 (B) are explanatory views of the second electroforming process. FIG. 8 is an explanatory diagram of the mold release process. FIG. 9 is an explanatory diagram of the finishing process. 10 (A) to 10 (D) are explanatory views of a modified example of the first electroforming process.

Hereinafter, a method for manufacturing a screen printing plate to which the present invention is applied will be described in order of steps with reference to FIGS. 1 to 9. By the way, the screen printing plate manufactured by this manufacturing method is useful for performing conductor paste printing by the screen printing method in the process of manufacturing the conductor layer in electronic parts such as multilayer ceramic capacitors and multilayer ceramic inductors. ..

<< Manufacturing process of printing plate main body 10: See FIG. 1 >>
When manufacturing the printing plate main body 10 shown in FIG. 1 (B), as shown in FIG. 1 (A), a metal mesh 11 having a rectangular outer shape is prepared, and a frame having a rectangular outer shape is provided on the outer peripheral portion thereof. The inner peripheral portion of the auxiliary mesh 12 forming the shape is fixed. Although not shown, an adhesive capable of obtaining high adhesive strength, preferably an adhesive such as an ultraviolet curable adhesive or a cyanoacrylate adhesive, can be used for fixing the metal mesh 11 and the auxiliary mesh 12.

The metal mesh 11 is formed by weaving metal wires such as stainless steel and tungsten in a grid pattern, and has a large number of holes. Incidentally, the thickness t2 of the metal mesh 11 (see FIG. 7A) is preferably 15 to 30 μm, and the opening is preferably 20 to 35 μm.

Since the metal mesh 11 shown in FIG. 7A has been subjected to calendar processing, a flat surface is formed at a portion where the metal wires on both sides in the thickness direction intersect. This calendar processing is a construction method whose main purpose is to reduce the thickness t2 of the metal mesh 11, but a metal wire having a small wire diameter is used for the metal mesh 11, and the thickness t2 is within the above numerical range. If it is in, calendar processing is not always necessary.

The auxiliary mesh 12 is formed by weaving synthetic resin wires such as polyester and polyarylate in a grid pattern, and has a large number of holes. Since the auxiliary mesh 12 serves to apply tension to the metal mesh 11, there is no particular limitation on its thickness.

Then, as shown in FIG. 1 (B), a plate frame 13 having a rectangular outer shape is prepared, and the outer peripheral portion of the auxiliary mesh 12 shown in FIG. 1 (A) is pulled outward on the lower surface thereof. While sticking. Although not shown, an adhesive capable of obtaining high adhesive strength, preferably an adhesive such as an ultraviolet curable adhesive or a cyanoacrylate adhesive, can be used for fixing the auxiliary mesh 12 to the plate frame 13.

The plate frame 13 is made of a metal such as stainless steel or an aluminum alloy. The plate frame 13 serves to support the metal mesh 11 and the auxiliary mesh 12, and as long as it has rigidity that does not deform due to the tension, there are no particular restrictions on its cross-sectional shape and cross-sectional area.

Although FIG. 1 shows a printing plate main body 10 having an auxiliary mesh 12, the auxiliary mesh 12 is not always necessary, and a metal mesh 11 having a large size is prepared and the outer peripheral portion thereof is used as a plate. It may be directly fixed to the frame 13.

<< Manufacturing process of mother mold 20: See Fig. 2 >>
When producing the master mold 20 shown in FIG. 2 (B), as shown in FIG. 2 (A), a metal substrate 21 having a rectangular outer shape is prepared, and the outer surface 21a is subjected to polishing and cleaning treatments. Give. Electrolytic polishing and buffing can be preferably used for the polishing treatment, and alkaline degreasing cleaning and electrolytic cleaning can be preferably used for the cleaning treatment.

The metal substrate 21 is made of a metal such as stainless steel. The outer shape of the outer surface 21a of the metal substrate 21 is slightly smaller than the outer shape of the exposed portion of the metal mesh 11 shown in FIG. 1 (B). The metal substrate 21 is the main body of the master mold 20, and its thickness is not particularly limited as long as it has rigidity that does not deform due to close contact, which will be described later.

Then, as shown in FIG. 2B, the insulator convex portion 22 corresponding to the opening portion 31a (see FIG. 8) of the metal mask portion 31 described later is integrally formed on the outer surface 21a of the metal substrate 21. .. When the metal mask portion 31 has a large number of openings 31a, the same number and arrangement of the insulator convex portions 22 as those openings 31a are formed on the outer surface 21a of the metal substrate 21.

The insulator convex portion 22 is made of an insulator material, preferably an insulating ceramic material such as aluminum oxide, silicon dioxide, or aluminum nitride. Of course, as the insulator material, in addition to the insulating ceramic material, a material having an insulating property such as silicon carbide or diamond-like carbon can also be used. Incidentally, the thickness (reference numeral omitted) of the insulator convex portion 22 is preferably 0.3 to 4 μm, and this thickness is referred to the thickness t1 of the electrodeposited metal leaf EF1 described later (see FIG. 4 (B)). Equivalent to. Further, the outer shape of the insulator convex portion 22 when viewed from above in FIG. 2B corresponds to the outer shape when the opening 31a of the metal mask portion 31 described later is viewed from below in FIG. For example, when the outer shape of the opening 31a when viewed from the bottom of FIG. 8 is rectangular, the outer shape of the insulator convex portion 22 when viewed from above of FIG. 2B has a corresponding rectangular shape. Is. Of course, it goes without saying that various shapes other than the rectangle can be adopted as the outer shape of the insulator convex portion 22 when viewed from above in FIG. 2 (B).

Here, a method of integrally forming a large number of insulating convex portions 22 made of an insulating ceramic material on the outer surface 21a of the metal substrate 21 will be introduced.

<First Method> First, a commercially available negative photoresist sheet is attached to the outer surface 21a of the metal substrate 21, or a commercially available positive or negative photoresist agent is applied, and then photolithography is performed. By the method, unnecessary portions are eliminated to form a resist pattern having a large number of concave portions corresponding to a large number of insulating convex portions 22. Subsequently, a large number of resist patterns are formed by a physical vapor deposition method (PVD method) such as vacuum deposition, ion plating, or sputtering, or a chemical vapor deposition method (CVD method) such as plasma CVD, thermal CVD, or optical CVD. Insulating ceramic material is deposited to the desired thickness in the recesses of the. Subsequently, the resist pattern is peeled off from the outer surface 21a of the metal substrate 21 and removed, leaving only a large number of insulator convex portions 22 on the outer surface 21a of the metal substrate 21.

<Second Method> First, a mask sheet prepared in advance is attached to the outer surface 21a of the metal substrate 21. This mask sheet has a large number of holes corresponding to a large number of insulator protrusions 22. Subsequently, as in the first method, an insulating ceramic material is formed in a large number of holes in the mask sheet by a physical vapor deposition method (PVD method) or a chemical vapor deposition method (CVD method) to obtain a desired thickness. Accumulate until now. Subsequently, the mask sheet is peeled off from the outer surface 21a of the metal substrate 21 and removed so that only a large number of insulator convex portions 22 remain on the outer surface 21a of the metal substrate 21.

<< First electroforming process: see FIGS. 3 and 4 >>
As shown in FIG. 3, the master mold 20 described above is placed in a bathtub (not shown) containing a bath liquid and an anode, and the first electroplating is performed using the metal substrate 21 of the master mold 20 as a cathode. conduct.

As the bath liquid for performing the first electroforming, a watt bath, a nickel sulfamate bath, a nickel sulfamate bath, or the like can be preferably used. Further, as the anode, a titanium mesh bag containing nickel pieces or nickel grains, a polypropylene mesh bag containing nickel pieces or nickel grains and a titanium energizing rod, or the like can be preferably used. Further, the electrolytic conditions for performing the first electroforming are preferably a bath temperature of 40 to 60 ° C. and an anode and cathode current densities of 1 to 4 A / dm ^{2 in the case of a watt bath and a nickel sulfamate bath.} , The electrolysis time is 0.6 to 20 minutes. In the case of a sulfamate nickel bath, the bath temperature is preferably 25 to 70 ° C., the current densities of the anode and cathode are 1 to 5 A / dm ² , and the electrolysis time is 0.5 to 20 minutes.

At the start stage of the first electroplating, as shown in FIG. 4A, the outer surface region 21a1 of the metal substrate 21 in which the insulator convex portion 22 does not exist corresponds to the thickness of the insulator convex portion 22. There is a dent (sign omitted). At the final stage of the first electroplating, as shown in FIG. 4B, an electrodeposited metal foil EF1 having a thickness of t1 is formed in the outer surface region 21a1 in which the insulator convex portion 22 of the metal substrate 21 does not exist. NS. Incidentally, in FIG. 4B, since the electrodeposited metal foil EF1 is formed so that the thickness t1 thereof substantially matches the thickness of the insulator convex portion 22, the thickness t1 of the electrodeposited metal foil EF1. Corresponds to the thickness of the insulator convex portion 22 (preferably 0.3 to 4 μm).

<< Step of bringing the metal mesh 11 of the printing plate body 10 into close contact with the electrodeposited metal foil EF1 of the master mold 20: see FIG. 5 >>
The printing plate main body 10 and the master mold 20 described above are prepared, and as shown in FIG. 5, the metal mesh 11 of the printing plate main body 10 is relative to the outer surface (reference numeral omitted) of the electrodeposited metal foil EF1 of the master mold 20. The metal mesh 11 is brought into close contact with the outer surface of the electrodeposited metal foil EF1. When the thickness t1 of the electrodeposited metal foil EF1 (see FIG. 4B) is substantially the same as the thickness of the insulator convex portion 22, the metal mesh 11 is also applied to the outer surface 22a of the insulator convex portion 22. In close contact. When the number of electrodeposited metal foils EF1 is large, sufficient adhesion cannot be obtained if the pressing force is small, and conversely, if the pressing force is too strong, the metal mesh 11 may be deformed to partially create a gap. It is preferable to repeat the trial to determine the optimum pressing force. After the metal mesh 11 is brought into close contact with the outer surface of the electrodeposited metal foil EF1, a holder such as a tape (not shown) hung from the outer surface opposite to the outer surface 21a of the metal substrate 21 toward the plate frame 13 is used. The close contact state is maintained.

<< Second electroforming process: see FIGS. 6 and 7 >>
As shown in FIG. 6, the contact object (reference numeral omitted) between the printing plate main body 10 and the master mold 20 described above is placed in a bathtub (not shown) containing the bath liquid and the anode, and the master mold 20 is placed. The second electroforming is performed using the metal substrate 21 of the above as a cathode.

As the bath liquid for performing the second electroforming, a watt bath, a nickel sulfamate bath, a nickel sulfamate bath, or the like can be preferably used. Further, as the anode, a titanium mesh bag containing nickel pieces or nickel grains, a polypropylene mesh bag containing nickel pieces or nickel grains and a titanium energizing rod, or the like can be preferably used. Further, the electrolytic conditions for performing the second electroforming are preferably a bath temperature of 40 to 60 ° C. and an anode and cathode current densities of 0.3 to 0 in the case of a watt bath and a nickel sulfamate bath. 5 A / dm ² , electrolysis time is 5 to 30 minutes. In the case of a sulfamate nickel bath, the bath temperature is preferably 25 to 70 ° C., the current densities of the anode and cathode are 0.3 to 0.5 A / dm ² , and the electrolysis time is 5 to 30 minutes.

At the start stage of the second electroforming, as shown in FIG. 7A, the lower surface of the metal mesh 11 is in close contact with the outer surface (reference numeral omitted) of the electrodeposited metal foil EF1. When the thickness t1 of the electrodeposited metal foil EF1 shown in FIG. 7A (see FIG. 4B) substantially matches the thickness of the insulator convex portion 22, the lower surface of the metal mesh 11 is formed. It also adheres to the outer surface 22a of the insulator convex portion 22. At the final stage of the second electroforming, as shown in FIG. 7B, the electrodeposited metal film EF2 is formed on the surface of the metal mesh 11, and the electrodeposition metal film EF2 is formed in the vicinity of the electrodeposited metal foil EF1. The electrodeposited metal foil EF1 is bonded to the electrodeposited metal film EF2 by a part of the metal electrodeposition film EF2. Incidentally, the thickness (reference numeral omitted) of the electrodeposited metal film EF2 formed here is preferably 0.3 to 2 μm, and the thickness t1 of the electrodeposited metal foil EF1 bonded to the electrodeposited metal film EF2 is first. As explained in. That is, in the second electrocasting step, the metal mesh portion 32 made of the metal mesh 11 and the electrodeposited metal film EF2 and the metal mask portion 31 made of the electrodeposited metal film EF2 and the continuous electrodeposited metal foil EF1 are integrated. 30 is made.

<< Mold release process: see Fig. 8 >>
After producing the integrated product 30 shown in FIG. 7 (B), the material in close contact between the printing plate main body 10 and the mother mold 20 is taken out from the bathtub, and the holder is removed to release the holding of the product in the close contact state. Then, as shown in FIG. 8, the electrodeposited metal film EF2 of the integrated body 30 is peeled off from the outer surface 22a of the insulator convex portion 22, and the electrodeposited metal foil EF1 is present on the insulator convex portion 22 of the metal substrate 21. The integrated product 30 is separated from the master mold 20 by extracting it from the outer surface region 21a1.

By this release, an opening 31a having a depth and an inner shape substantially matching the thickness and outer shape of the insulator convex portion 22 is formed in the metal mask portion 31 made of the electrodeposited metal foil EF1. Further, since the bonding force of the insulator convex portion 22 to the outer surface 21a of the metal substrate 21 is much higher than the bonding force when the photoresist-made convex portion is formed on the outer surface 21a of the metal substrate 21, the integrated body 30 is used as a mother. When the mold is released from the mold 20, the insulator convex portion 22 does not come off from the outer surface 21a of the metal substrate 21.

<< Finishing process: see Fig. 9 >>
After the mold release shown in FIG. 8 is completed, the outer peripheral portion of the metal mesh portion 32 shown in FIG. 9, that is, the portion not used for screen printing is covered with an emulsion portion (not shown) and shown in FIG. A reinforcing film (not shown) such as a silver film is attached to the upper surface of the auxiliary mesh 12 for reinforcement.

Here, a modified example of the first electroforming process described with reference to FIGS. 3 and 4 will be described with reference to FIG. FIG. 4B describes a method of forming an electrodeposited metal leaf EF1 having a thickness t1 that substantially matches the thickness of the insulator convex portion 22 (reference numeral omitted), but it is larger than the thickness of the insulator convex portion 22. The thickness of the electrodeposited metal foil EF1 may be increased.

FIG. 10A shows that the thickness of the insulator convex portion 22'is smaller than the thickness of the insulator convex portion 22 shown in FIG. 4B, so that the thickness of the insulator convex portion 22'is increased. Also shows a method in which the thickness t1 of the electrodeposited metal foil EF1 is increased. In this way, as shown in FIG. 10B, when the lower surface of the metal mesh 11 is brought into close contact with the outer surface (reference numeral omitted) of the electrodeposited metal foil EF1, the insulator of the lower surface of the metal mesh 11 Since a gap is generated between the portion of the convex portion 22 facing the outer surface 22a and the outer surface 22a of the insulator convex portion 22, as shown in FIG. 10 (C), the metal mesh 11 is said to have a gap. An electrodeposited metal foil EF2'that extends to a portion can be formed by a second electroplating. Further, as shown in FIG. 10 (D), when the integrated body 30 is released from the master mold 20, the thickness and outer shape of the insulator convex portion 22'are attached to the metal mask portion 31 made of the electrodeposited metal foil EF1. It is possible to form an opening 31a'with a depth and an internal shape that substantially matches.

Although not shown, a method of increasing the thickness of the electrodeposited metal leaf EF1 without changing the thickness of the insulator convex portion 22 also forms the same electrodeposited metal leaf EF2'by the second electroplating. be able to. Further, it is preferable that the gap is at least the thickness of the electrodeposited metal film EF2'formed on the surface of the metal mesh 11 by the second electroforming.

In the above-mentioned manufacturing method, (1) a master mold 20 in which an insulator convex portion 22 (22') corresponding to an opening 31a (31a') of a metal mask portion 31 is integrally formed on an outer surface 21a of a metal substrate 21 is formed. By (2) the first electric casting, the electrodeposited metal foil EF1 is formed in the outer surface region 21a1 in which the insulator convex portion 22 (22') of the metal substrate 21 does not exist, and (3) the electric metal of the master mold 20 is formed. The electrodeposited metal film EF2 (EF2') is formed on the surface of the metal mesh 11 by the second electric casting with the metal mesh 11 in close contact with the outer surface of the metallized foil EF1, and the electrodeposited metal film EF2 An electrodeposited metal foil EF1 is joined to a part of (EF2'), and a metal mesh portion 32 made of a metal mesh 11 and an electrodeposited metal film EF2 (EF2') and a metal mask portion 31 made of an electrodeposited metal foil EF1 are attached. The integrated material 30 is produced, (4) the electrodeposited metal film EF2 (EF2') of the integrated material 30 is peeled off from the outer surface 22a of the insulator convex portion 22 (22'), and the electrodeposited metal foil EF1 is attached to the metal substrate. The integrated body 30 is removed from the master mold 20 while the insulator convex portion 22 (22') of the metal substrate 21 is extracted from the outer surface region 21a1 where the insulator convex portion 22 (22') does not exist, and the insulator convex portion 22 (22') remains on the outer surface 21a of the metal substrate 21. It is released from the mold.

That is, by using the master mold 20 in which the insulator convex portion 22 (22') is integrally formed on the outer surface 21a of the metal substrate 21, the metal mesh portion 32 composed of the metal mesh 11 and the electrodeposited metal film EF2 (EF2'). A screen printing plate including the metal mask portion 31 composed of the electrodeposited metal foil EF1 and the metal mask portion 31 integrally can be manufactured by a simple method and accurately.

Further, even if the integrated body 30 of the metal mesh portion 32 and the metal mask portion 31 is separated from the master mold 20, the insulator convex portion 22 (22') is not removed from the outer surface 21a of the metal substrate 21. Therefore, the master mold 20 can be repeatedly used to manufacture a screen-printed plate having the same shape. That is, also in this respect, the production of the screen printing plate is simplified.

Further, the thickness t1 of the electrodeposited metal foil EF1 formed in the first electroforming is formed so as to substantially match the thickness of the insulator convex portion 22, or is more than the thickness of the insulator convex portion 22'. The aspect of the electrodeposited metal film EF2 (EF2') formed on the surface of the metal mesh 11 in the second electroforming by forming the metal mesh 11 so as to be large, specifically, the insulator convex on the lower surface of the metal mesh 11. The mode of the portion of the portion 22 facing the outer surface 22a can be easily changed.

Further, since the depth and inner shape of the opening 31a (31a') of the metal mask portion 31 can be adjusted by adjusting the thickness and outer shape of the insulator convex portion 22 of the master mold 20, the opening 31a of the metal mask portion 31 ( The depth and inner shape of 31a') can be controlled extremely easily, and the desired depth and inner shape of the opening 31a (31a') can be accurately formed in the metal mask portion 31.

10 ... Printing plate body, 11 ... Metal mesh, 12 ... Auxiliary mesh, 13 ... Plate frame, 20 ... Mother mold, 21 ... Metal substrate, 21a ... Outer surface of metal substrate, 21a1 ... Insulator convex part of metal substrate does not exist Outer surface region, 22, 22'... insulator convex portion, 22a ... outer surface of insulator convex portion, 30 ... integral body of metal mesh portion and metal mask portion, 31 ... metal mask portion, 31a, 31a'... opening, EF1 ... Electroplated metal foil, 32 ... Metal mesh part, EF2, EF2'... Electroplated metal film.

Claims (5)

A method for manufacturing a screen printing plate in which a metal mesh portion and a metal mask portion having an opening are integrally provided.
A step of producing a master mold in which an insulator convex portion corresponding to the opening is integrally formed on the outer surface of the metal substrate, and
A step of forming an electrodeposited metal foil on an outer surface region of the metal substrate of the master mold in which the insulator convex portion does not exist by the first electroforming.
With the metal mesh in close contact with the outer surface of the electrodeposited metal foil of the master mold, an electrodeposited metal film is formed on the surface of the metal mesh by the second electric casting, and the electrodeposited metal film is formed. A step of joining the electrodeposited metal foil to a part thereof to prepare an integrated product of the metal mesh portion made of the metal mesh and the electrodeposited metal film and the metal mask portion made of the electrodeposited metal foil.
The electrodeposited metal film of the integrated product is peeled off from the outer surface of the convex portion of the insulator, and the electrodeposited metal foil is extracted from the outer surface region of the metal substrate where the convex portion of the insulator does not exist, so that the insulator A step of removing the integrated product from the master mold while leaving the convex portion on the outer surface of the metal substrate is provided.
In the first electrocasting, the electrodeposited metal foil is formed so as to be larger than the thickness of the convex portion of the insulator.
How to make a screen printing plate. The depth and inner shape of the opening of the metal mask portion are adjusted by the thickness and outer shape of the convex portion of the insulator.
The method for manufacturing a screen printing plate according to claim 1. The insulator convex portion is formed by a physical vapor deposition method using an insulator material.
The method for manufacturing a screen printing plate according to claim 1 or 2. The insulator convex portion is formed by a chemical vapor deposition method using an insulator material.
The method for manufacturing a screen printing plate according to any one of claims 1 to 3. An insulating ceramic material is used as the insulator material.
The method for manufacturing a screen printing plate according to claim 3 or 4.

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