JP6920581B2 - Parts mounting method and parts mounting device - Google Patents

Description

The present invention relates to a component mounting method and a component mounting device for mounting a component having a lead on a substrate.

Conventionally, as a kind of component mounting device that mounts components on a board to produce a mounting board, a component having a lead is held and picked up, and the lead is imaged and recognized from below by an imaging unit, and then the lead is inserted into the board. It is known that it is inserted into a hole. In such a component mounting device, the component is usually supplied in an upright position with the leads facing downward, and the top surface of the component is attracted and held by a nozzle. , When the part is supplied in a sideways posture, the side surface of the part is gripped by a pair of finger portions, or the side surface of the part is sucked by a nozzle, instead of sucking the upper surface of the part. .. Then, when the parts supplied in the sideways posture are held, the parts are subsequently raised and the leads are directed downward (for example, Patent Document 1 below).

Japanese Unexamined Patent Publication No. 2016-58468

However, as described above, when the component is picked up by gripping the side surface of the component, the position of the lower end of the lead with respect to the imaging unit is not constant, so that the lead is based on the obtained image of the lower end of the lead. Recognition is not always successful, and there is a problem that a recognition error may occur and the production efficiency of the mounting board may decrease.

Therefore, an object of the present invention is to provide a component mounting method and a component mounting device capable of suppressing the occurrence of lead recognition errors and improving the production efficiency of the mounting board.

The component mounting method of the present invention is a component mounting method for mounting a component having leads on a substrate, in which a pickup step of holding a side surface of the component by a component holding portion and a lead of the component held in the pickup process are held. An observation position moving step of moving the component holding portion holding the component while facing the imaging unit to an observation position separated by a predetermined distance from the imaging unit, and a position at the observation position in the observation position moving step. A component recognition step in which the lead of the component held by the component holding unit is imaged by the imaging unit, and recognition is attempted to detect the position of the lead based on the obtained image of the lead, and the component recognition. When the recognition of the lead fails in the process, the distance from the component holding portion to the imaging unit is changed to image the lead, and the recognition of the lead is attempted based on the obtained image of the lead. The recognition step includes a mounting step of moving the component holding portion based on the recognition result of the lead succeeded in the component recognition step or the re-recognition step, and mounting the component on the substrate.

The component mounting device of the present invention is a component mounting device that mounts a component having a lead on a substrate, and includes a substrate holding portion that holds the substrate, a component holding portion that holds a side surface of the component, and the component holding portion. A component mounting head having a component holding portion moving mechanism for approaching and separating from the substrate, a head moving mechanism for moving the component mounting head, and an imaging unit for imaging the leads of the component held by the component holding portion. The head moving mechanism and the component holding portion moving mechanism are controlled to move the component holding portion holding the component to an observation position separated from the imaging unit by a predetermined distance, and the imaging unit moves to the imaging unit at the observation position. An imaging control unit that images the lead, a component recognition unit that the imaging unit attempts to recognize the position of the lead based on an image obtained by imaging the lead, and a component recognition unit that performs the lead. The reimaging control unit that controls the component holding unit moving mechanism to change the distance from the component holding unit to the imaging unit and causes the imaging unit to image the lead, and the component recognition. Based on the successful recognition result of the lead in the unit, the head moving mechanism and the component holding unit moving mechanism are controlled to align the lead of the component held by the component holding unit with the substrate and hold the component. It is provided with a mounting control unit for mounting the component on the substrate by bringing the unit close to the substrate.

According to the present invention, it is possible to suppress the occurrence of lead recognition error and improve the production efficiency of the mounting board.

Configuration diagram of the main part of the component mounting device according to the embodiment of the present invention Side view of the component supply unit included in the component mounting device according to the embodiment of the present invention. A perspective view showing a state in which a component is held by a component holding portion included in the component mounting device according to the embodiment of the present invention. (A) (b) The figure which shows the state which the component is held by the component holding part provided in the component mounting apparatus in one Embodiment of this invention. (A)-(g) The figure which shows the state which the part holding part was moved up and down by the part holding part raising and lowering mechanism provided in the part mounting apparatus in one Embodiment of this invention. A block diagram showing a control system of a component mounting device according to an embodiment of the present invention. A flow chart of a main routine showing an execution procedure of a component mounting operation by a component mounting device according to an embodiment of the present invention. A flow diagram of a subroutine showing an execution procedure of a component mounting operation by the component mounting device according to the embodiment of the present invention. (A) (b) The figure which shows the procedure of mounting the component picked up by the component holding part provided in the component mounting device according to the embodiment of the present invention on a substrate. (A) (b) The figure which shows an example of the operation procedure of the component holding part at the time of execution of the component mounting operation by the component mounting device in one embodiment of the present invention. A side view of a component supply unit according to a modified example of the component mounting device according to the embodiment of the present invention. (A) (b) A diagram showing a state in which a component is picked up by a component holding portion according to a first modification provided in the component mounting device according to the embodiment of the present invention and imaged by a camera. (A) (b) A diagram showing a state in which a component is picked up by a component holding portion according to a second modification provided in the component mounting device according to the embodiment of the present invention and imaged by a camera. (A) (b) The figure which shows the procedure of mounting the component picked up by the component holding part which concerns on the 2nd modification provided in the component mounting device in one Embodiment of this invention on a substrate.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a component mounting device 1 according to an embodiment of the present invention. The component mounting device 1 is a device for mounting the component 3 on the board 2, and includes a board holding unit 11 for holding the board 2 in a horizontal posture, a component supply unit 12 for supplying the component 3, a component mounting head 13 and a component mounting head 13. It includes a head moving mechanism 14 for moving in the horizontal plane, a camera 15 (imaging unit), and an illumination unit 16.

In FIG. 2, component 3 includes a body portion 3B and two leads 3L extending from the body portion 3B (see also FIG. 3). The component supply unit 12 holds the component 3 in a standing posture in which the lead 3L faces downward.

In FIGS. 1 and 3, the component mounting head 13 includes a plurality of component holding / elevating units 20. Each component holding elevating unit 20 has a shaft member 22 that is elevated and lowered by the component holding portion moving mechanism 21, and a component holding portion 23 attached to the lower end of the shaft member 22. In FIG. 3, the component holding portion 23 includes a holding portion base 31 and a pair of finger portions 32 provided extending downward from the holding portion base 31. The pair of finger portions 32 can be opened and closed at different intervals by a finger portion drive mechanism 33 provided inside the holding portion base 31, and the component 3 can be opened and closed by gripping the side surface of the body portion 3B of the component 3. Can be held.

When the component holding elevating unit 20 holds the component 3 supplied by the component supply unit 12 by the component holding unit 23, the finger unit is driven while the shaft member 22 is lowered by the component holding unit moving mechanism 21 from above the component 3. The mechanism 33 is operated to make the distance between the pair of finger portions 32 larger than the width of the body portion 3B. Then, the pair of finger portions 32 are positioned on the side of the body portion 3B. After the pair of finger portions 32 are positioned on the side of the body portion 3B, the finger portion drive mechanism 33 is operated to narrow the distance between the pair of finger portions 32. As a result, the side surface of the component 3 is gripped by the pair of finger portions 32, and the component 3 is held by the component holding portion 23.

In FIGS. 4A and 4B, the camera 15 has a focal position F above and images an object located at the focal position F. Therefore, by locating the lower end of the lead 3L of the component 3 held by the component holding unit 23 at the focal position F, the lower end of the lead 3L can be imaged by the camera 15. The illumination unit 16 intensively illuminates the vicinity of the focal position F of the camera 15 so that the image captured by the camera 15 at the focal position F becomes clear (FIG. 1).

In FIGS. 4A and 4B, when the camera 15 is made to image the lead 3L of the component 3 held by the component holding unit 23, the distance of the component holding unit 23 with respect to the camera 15 (here, the distance in the height direction). (Hereinafter referred to as a distance H to the camera) is first positioned at an observation position separated from the camera 15 by a predetermined distance H0. As can be seen from FIGS. 4 (a) and 4 (b), even when the component holding unit 23 is located at the observation position where the distance H to the camera is a predetermined distance H0, the component holding unit 23 remains. The height (lead height J) of the lower end of the lead 3L of the holding component 3 with respect to the camera 15 is not always constant, and is different if the location where the component holding portion 23 holds the component 3 is different.

Therefore, when the pair of finger portions 32 grip the standard position on the side surface of the component 3, the component holding portion 23 is positioned at the observation position where the distance to the camera is H = H0, so that the lead 3L When the lower end is located at the focal position F of the camera 15 (FIG. 4A), but the finger portion 32 grips a position deviated from the standard position (position determined from the design data) on the side surface of the component 3. Even if the component holding portion 23 is positioned at the observation position where the distance to the camera is H = H0, the lower end of the lead 3L is not located at the focal position F of the camera 15 and is displaced in the vertical direction from the focal position F. It will be located in the position. FIG. 4B shows the observation that the component holding portion 23 has a distance to the camera H = H0 because the finger portion 32 grips the position shifted to the lead 3L side by a distance Δh from the standard position on the side surface of the component 3. Despite being positioned at the position, the lower end of the lead 3L is not located at the focal position F of the camera 15, and is located above the focal position F by Δh.

As described above, the camera 15 captures an object located at the focal position F. Therefore, the camera 15 can clearly image the lower end of the lead 3L because the finger portion 32 grips a standard position on the side surface of the component 3 and the lower end of the lead 3L is located at the focal position F of the camera 15. Only when you are.

The component holding elevating unit 20 included in the component mounting head 13 raises or lowers the shaft member 22 by the component holding portion moving mechanism 21, and causes the component holding portion 23 in a state of holding the component 3 to approach and separate from the substrate 2. Then, the component 3 can be moved (moved up and down here) with respect to the substrate 2 (FIGS. 5 (a) to 5 (g)). As a result, the lead height J of the lead 3L of the component 3 held by the component holding portion 23 can be positioned at the focal position F or a position close to the focal position F. Here, FIG. 5A shows a case where the component holding portion 23 is positioned at an observation position where the distance to the camera is H = H0, and FIGS. 5 (b), 5 (c), and 5 (Fig. 5) d) shows a state in which the distance H to the camera of the component holding unit 23 is increased in order from a predetermined distance H0 (the component holding unit 23 is raised) to obtain H1, H2, and H3, respectively. Further, in FIGS. 5 (e), 5 (f), and 5 (g), the distance H to the camera of the component holding portion 23 is decreased in order from a predetermined distance H0 (the component holding portion 23 is lowered) to H4. The state of H5 and H6 is shown. The vertical distance when increasing or decreasing the distance H to the camera of the component holding unit 23 from the predetermined distance H0 is arbitrary, but increases or decreases in steps of a fixed distance (for example, 1 mm) (the component holding unit 23 is increased or decreased). It is preferable that it is raised or lowered).

As described above, the value of the predetermined distance H0 is such that the lower end of the lead 3L is located at the focal position F of the camera 15 when the finger portion 32 of the component holding portion 23 grips the standard position of the side surface of the component 3. It is determined as the distance (height) of the component holding unit 23 from the camera 15, but this may be determined based on the design value of the component mounting device 1, or it is determined based on the teaching result. There may be.

In FIG. 6, the control unit 40 included in the component mounting device 1 moves the component mounting head 13 by the head moving mechanism 14 and moves the component holding unit 23 by the component holding unit moving mechanism 21 (directly, the shaft member 22. (Up / down) operation, opening / closing operation of the finger unit 32 by the finger unit drive mechanism 33, and illumination operation (lighting on / off, adjustment of illuminance, etc.) by the lighting unit 16 are controlled. A camera 15 is connected to the control unit 40, and image data obtained by imaging the camera 15 is input to the control unit 40.

In FIG. 6, the control unit 40 includes an image pickup control unit 41, a component recognition unit 42, a reimaging control unit 43, and a mounting control unit 44. The image pickup control unit 41 controls the head moving mechanism 14 and the component holding unit moving mechanism 21 to move the component holding unit 23 holding the component 3 to an observation position, and causes the camera 15 to image the lead 3L at the observation position. The component recognition unit 42 attempts to recognize the lead 3L based on the image obtained by the camera 15 taking an image of the lead 3L. When the component recognition unit 42 fails to recognize the lead 3L, the reimaging control unit 43 controls the component holding unit moving mechanism 21 to change the distance H of the component holding unit 23 to the camera, and causes the camera 15 to receive the lead 3L. Have an image taken. The mounting control unit 44 controls the head moving mechanism 14 and the component holding unit moving mechanism 21 based on the successful recognition result of the lead 3L in the component recognition unit 42, and controls the lead 3L of the component 3 held by the component holding unit 23. The component 3 is mounted on the substrate 2 while being aligned with the substrate 2 and the component holding portion 23 being brought close to the substrate 2. The alignment of the lead 3L with respect to the substrate 2 includes the alignment of the tip of the lead 3L with respect to the substrate 2 in the height direction and the alignment of the shaft member 22 in the rotational direction around the axis (upper and lower axes).

Next, the execution procedure (component mounting method) of the component mounting work performed by the component mounting device 1 will be described with reference to the flow charts shown in FIGS. 7 and 8. FIG. 7 is a flow chart of a main routine of control executed by the control unit 40, and FIG. 8 is a flow chart of a subroutine in the main routine of FIG. In the component mounting work, first, the head moving mechanism 14 moves the component mounting head 13 to position each component holding / elevating unit 20 above the component supply unit 12. Then, each component holding elevating unit 20 lowers the shaft member 22 by the component holding portion moving mechanism 21 to move the component holding portion 23, and opens and closes the finger portion 32 by the finger portion driving mechanism 33, whereby the component holding portion 23 is opened and closed. Holds the component 3 supplied by the component supply unit 12.

After each component holding and lowering unit 20 holds the component 3 by the component holding unit 23, the shaft member 22 is raised by the component holding unit moving mechanism 21 to move the component holding unit 23, and the component 3 gripped by the finger portion 32 is held. The component 3 is picked up by extracting it from the component supply unit 12 (pickup process in FIG. 7). Here, as described above, since the component supply unit 12 holds the component 3 in a vertical position, the component supply unit 12 is pulled out from the component supply unit 12 as it is in a posture in which the lead 3L is directed downward.

When each component holding / elevating unit 20 pulls out the component 3 from the component supply unit 12, the component mounting head 13 moves above the camera 15 and causes the camera 15 to take an image of each component 3 (FIG. 1). At this time, the component mounting head 13 moves the component holding unit 23 holding the component 3 to the observation position (that is, the component holding unit 23 to a position where the distance H to the camera is a predetermined distance H0) (observation position moving step in step ST2). ). When the component holding unit 23 is positioned at the observation position, the camera 15 takes an image of the lead 3L of the component 3 held by the component holding unit 23, and the component recognition unit 42 moves the lead 3L based on the obtained image of the lead 3L. Attempts to recognize the position of (part recognition step in step ST3). When the component recognition unit 42 attempts to recognize the lead 3L, the control unit 40 determines whether or not the recognition of the lead 3L is successful in all of the picked up components 3 (step ST4).

As a result of the determination in step ST4, if the recognition of the lead 3L is successful for all the picked up parts 3, the mounting control unit 44 recognizes the lead 3L of each component 3 that was successful in the component recognition process in step ST3. Based on the result, the component holding unit 23 is moved (the component mounting head 13), and the tip of the lead 3L of each component 3 held by the component holding unit 23 is aligned with the insertion hole 2H of the substrate 2 (lead alignment step). ). Then, the component holding portion 23 is brought close to the substrate 2 and the lead 3L is inserted into the insertion hole 2H of the substrate 2 (lead insertion step) to mount the component 3 on the substrate 2 (mounting step of step ST5. FIG. 9 (a) → FIG. 9 (b)).

On the other hand, if there is a component 3 that fails to recognize the lead 3L as a result of the determination in step ST4, the reimaging control unit 43 executes the rerecognition process (rerecognition step) in step ST6. In the re-recognition process, first, the distance H to the camera of the component holding unit 23 is changed to H1 (step ST11 in FIG. 8). In this case, the distance H to the camera may be changed for all the component holding portions 23 included in the component mounting head 13, or the distance H to the camera may be changed only for the component holding portion 23 holding the component 3 for which the recognition of the lead 3L has failed. (The same applies when the distance H to the camera of the component holding portion 23 is changed thereafter). When the distance H to the camera of the component holding unit 23 is changed to H1, the camera 15 retries the recognition of the lead 3L for the component 3 that has failed to recognize the lead 3L (step ST12). When the component recognition unit 42 tries to recognize the lead 3L, the control unit 40 determines whether or not all the re-trial recognition of the lead 3L is successful (step ST13).

As a result of the determination in step ST13, if the recognition of the retried lead 3L is all successful, the process returns to the main routine. Then, the mounting control unit 44 executes a lead alignment step of moving the component holding unit 23 based on the recognition result of the lead 3L of each component 3 that was successful in the component recognition step of step ST3 and the rerecognition step of step ST6. After that, a lead insertion step of bringing the component holding portion 23 closer to the substrate 2 and inserting the lead 3L into the insertion hole 2H is executed, and each component 3 is mounted on the substrate 2 (mounting step of step ST5).

Here, in the mounting process of step ST5, when the distance from the component holding unit 23 to the camera 15 is changed in the re-recognition process of step ST6 (here, the distance H to the camera of the component holding unit 23 is changed to H1). Corrects (changed distance) the movement amount Dm (FIG. 9A) that brings the component holding portion 23 closer to the substrate 2 in the lead insertion step based on the changed distance (here | H1-H0 |). (Calculated by reflecting).

On the other hand, if there is a component 3 that fails to re-recognize the lead 3L as a result of the determination in step ST13, the distance H to the camera of the component holding unit 23 is changed to H2 (step ST14). After changing the distance H to the camera of the component holding unit 23 to H2, the camera 15 retries the recognition of the lead 3L for the component 3 that failed to recognize the lead 3L (step ST15). When the component recognition unit 42 tries to recognize the lead 3L, the control unit 40 determines whether or not all the re-trial recognition of the lead 3L is successful (step ST16).

As a result of the determination in step ST16, if the recognition of the retried lead 3L is all successful, the process returns to the main routine. Then, the mounting control unit 44 executes a lead alignment step of moving the component holding unit 23 based on the recognition result of the lead 3L of each component 3 that was successful in the component recognition step of step ST3 and the rerecognition step of step ST6. After that, a lead insertion step of bringing the component holding portion 23 closer to the substrate 2 and inserting the lead 3L into the insertion hole 2H is executed, and each component 3 is mounted on the substrate 2 (mounting step of step ST5).

Here, in the mounting process of step ST5, when the distance from the component holding unit 23 to the camera 15 is changed in the re-recognition process of step ST6 (here, the distance H to the camera of the component holding unit 23 is changed to H2). Corrects (changed distance) the movement amount Dm (FIG. 9A) that brings the component holding portion 23 closer to the substrate 2 in the lead insertion step based on the changed distance (here | H2-H0 |). (Calculated by reflecting).

On the other hand, if there is a component 3 that fails to re-recognize the lead 3L as a result of the determination in step ST16, the distance H to the camera of the component holding unit 23 is changed to H3 (step ST17). After changing the distance H to the camera of the component holding unit 23 to H3, the camera 15 retries the recognition of the lead 3L for the component 3 that failed to recognize the lead 3L (step ST18). When the component recognition unit 42 tries to recognize the lead 3L, the control unit 40 determines whether or not all the re-trial recognition of the lead 3L is successful (step ST19).

As a result of the determination in step ST19, if the recognition of the retried lead 3L is all successful, the process returns to the main routine. Then, the mounting control unit 44 executes a lead alignment step of moving the component holding unit 23 based on the recognition result of the lead 3L of each component 3 that was successful in the component recognition step of step ST3 and the rerecognition step of step ST6. After that, a lead insertion step of bringing the component holding portion 23 closer to the substrate 2 and inserting the lead 3L into the insertion hole 2H is executed, and each component 3 is mounted on the substrate 2 (mounting step of step ST5).

Here, in the mounting process of step ST5, when the distance from the component holding unit 23 to the camera 15 is changed in the re-recognition process of step ST6 (here, the distance H to the camera of the component holding unit 23 is changed to H3). Corrects (changed distance) the movement amount Dm (FIG. 9A) that brings the component holding portion 23 closer to the substrate 2 in the lead insertion step based on the changed distance (here | H3-H0 |). (Calculated by reflecting).

On the other hand, if there is a component 3 that fails to re-recognize the lead 3L as a result of the determination in step ST19, the distance H to the camera of the component holding unit 23 is changed to H4 (step ST20). After changing the distance H to the camera of the component holding unit 23 to H4, the camera 15 retries the recognition of the lead 3L for the component 3 that failed to recognize the lead 3L (step ST21). When the component recognition unit 42 tries to recognize the lead 3L, the control unit 40 determines whether or not all the re-trial recognition of the lead 3L is successful (step ST22).

As a result of the determination in step ST22, if the recognition of the retried lead 3L is all successful, the process returns to the main routine. Then, the mounting control unit 44 executes a lead alignment step of moving the component holding unit 23 based on the recognition result of the lead 3L of each component 3 that was successful in the component recognition step of step ST3 and the rerecognition step of step ST6. After that, a lead insertion step of bringing the component holding portion 23 closer to the substrate 2 and inserting the lead 3L into the insertion hole 2H is executed, and each component 3 is mounted on the substrate 2 (mounting step of step ST5).

Here, in the mounting process of step ST5, when the distance from the component holding unit 23 to the camera 15 is changed in the re-recognition process of step ST6 (here, the distance H to the camera of the component holding unit 23 is changed to H4). Corrects (changed distance) the movement amount Dm (FIG. 9A) that brings the component holding portion 23 closer to the substrate 2 in the lead insertion step based on the changed distance (here | H4-H0 |). (Calculated by reflecting).

On the other hand, if there is a component 3 that fails to re-recognize the lead 3L as a result of the determination in step ST22, the distance H to the camera of the component holding unit 23 is changed to H5 (step ST23). After changing the distance H to the camera of the component holding unit 23 to H5, the camera 15 retries the recognition of the lead 3L for the component 3 that failed to recognize the lead 3L (step ST24). When the component recognition unit 42 tries to recognize the lead 3L, the control unit 40 determines whether or not all the re-trial recognition of the lead 3L is successful (step ST25).

As a result of the determination in step ST25, if the recognition of the retried lead 3L is all successful, the process returns to the main routine. Then, the mounting control unit 44 executes a lead alignment step of moving the component holding unit 23 based on the recognition result of the lead 3L of each component 3 that was successful in the component recognition step of step ST3 and the rerecognition step of step ST6. After that, a lead insertion step of bringing the component holding portion 23 closer to the substrate 2 and inserting the lead 3L into the insertion hole 2H is executed, and each component 3 is mounted on the substrate 2 (mounting step of step ST5).

Here, in the mounting process of step ST5, when the distance from the component holding unit 23 to the camera 15 is changed in the re-recognition process of step ST6 (here, the distance H to the camera of the component holding unit 23 is changed to H5). Corrects (changed distance) the movement amount Dm (FIG. 9A) that brings the component holding portion 23 closer to the substrate 2 in the lead insertion step based on the changed distance (here | H5-H0 |). (Calculated by reflecting).

On the other hand, if there is a component 3 that fails to re-recognize the lead 3L as a result of the determination in step ST25, the distance H to the camera of the component holding unit 23 is changed to H6 (step ST26). After changing the distance H to the camera of the component holding unit 23 to H6, the camera 15 retries the recognition of the lead 3L for the component 3 that failed to recognize the lead 3L (step ST27). When the component recognition unit 42 tries to recognize the lead 3L, the control unit 40 determines whether or not all the re-trial recognition of the lead 3L is successful (step ST28).

As a result of the determination in step ST28, if the recognition of the retried lead 3L is all successful, the process returns to the main routine. Then, the mounting control unit 44 executes a lead alignment step of moving the component holding unit 23 based on the recognition result of the lead 3L of each component 3 that was successful in the component recognition step of step ST3 and the rerecognition step of step ST6. After that, a lead insertion step of bringing the component holding portion 23 closer to the substrate 2 and inserting the lead 3L into the insertion hole 2H is executed, and each component 3 is mounted on the substrate 2 (mounting step of step ST5).

Here, in the mounting process of step ST5, when the distance from the component holding unit 23 to the camera 15 is changed in the re-recognition process of step ST6 (here, the distance H to the camera of the component holding unit 23 is changed to H6). Corrects (changed distance) the movement amount Dm (FIG. 9A) that brings the component holding portion 23 closer to the substrate 2 in the lead insertion step based on the changed distance (here | H6-H0 |). (Calculated by reflecting).

On the other hand, as a result of the determination in step ST28, if there is a component 3 that fails to re-recognize the lead 3L, the process returns to the main routine. Then, the component 3 for which the recognition of the lead 3L has been successfully recognized is mounted on the substrate 2, and the component 3 for which the recognition of the lead 3L has failed is discarded or collected (step ST8).

When executing the mounting step of step ST5 described above, information on the amount of change of the component holding unit 23 with respect to the camera distance H from the predetermined distance H0, which was clarified in the component recognition step or the re-recognition step performed so far. The distance of each component 3 to the component holding portion 23 (here, the height from the camera 15) is grasped based on the above, and the pressing amount of the component 3 against the substrate 2 is adjusted with reference to the grasped distance of the component 3. Is preferable. As a result, when the component 3 is mounted on the substrate 2, it is less likely that the component 3 is pressed too much or insufficiently pressed against the substrate 2, and the occurrence of defective mounting of the component 3 can be suppressed.

In the component mounting device 1 (component mounting method) in the present embodiment, the component holding unit 23 holds the side surface of the body portion 3B of the component 3 (pickup process), and the lead 3L of the held component 3 is an imaging unit. After the component holding unit 23 that holds the component 3 while facing the camera 15 is positioned at an observation position separated from the camera 15 by a predetermined distance H0 (observation position moving step), the component holding portion located at the observation position is held. The lead 3L of the component 3 held by the unit 23 is imaged by the camera 15, and recognition is attempted to detect the position of the lead 3L based on the obtained image of the lead 3L (part recognition step). Then, when the recognition of the lead 3L fails, the distance from the component holding unit 23 to the camera 15 (with respect to the camera distance H) is changed to image the lead 3L, and the lead 3L is imaged based on the obtained image of the lead 3L. 3L recognition is tried (re-recognition step), the part holding unit 23 is moved based on the recognition result that has been successful so far (that is, in the part recognition step or the re-recognition step), and the part 3 is mounted on the substrate 2. (Mounting process). Therefore, even if the recognition of the lead 3L fails based on the image of the lead 3L captured with the component holding unit 23 positioned at the observation position, the component holding unit 23 with respect to the camera distance H is changed. There is a possibility that the lead 3L can be successfully recognized based on the captured image of the lead 3L, and the occurrence of the recognition error of the lead 3L can be suppressed to improve the production efficiency of the mounting substrate.

In the above example, the order in which the distance H to the camera of the component holding unit 23 is changed from the predetermined distance H0 in the re-recognition step of step ST6 is H0 → H1 → H2 → H3 → H4 → H5 → H6 (FIG. 10 (FIG. 10). a)). The order of changing the distance H to the camera of the component holding portion 23 is only an example, and may be another order. The re-recognition of the lead 3L is stopped when the recognition of the lead 3L is successful, and the component holding unit 23 is positioned at a distance where the distance H to the camera of the component holding unit 23 becomes a predetermined distance H0. , The lower end of the lead 3L should be located in the vicinity of the focal position F even if it does not coincide with the focal position F. From this, the order is set to H0 → H1 → H4 → H5 → H2 → H3 → H6 (FIG. 10B), and the lead 3L is tried to be recognized from a distance as close to the predetermined distance H0 as possible. It may be.

Further, in the above-described embodiment, the component supply unit 12 is configured to hold the component 3 in a standing posture in which the lead 3L faces downward. However, as in the component supply unit 12 shown in FIG. 11, the tray In some cases, the component 3 may be supplied in a sideways posture by the TR. In this case, as shown in FIGS. 12A and 12B, the pair of finger portions 32 that grip the side surface of the component 3 are swingable around the horizontal swing axis YJ. It is preferable to use the holding portion 23 (first modification of the component holding portion 23). Alternatively, as shown in FIGS. 13A and 13B, the component holding portion 23 (second deformation) having a configuration in which the nozzle 32N that attracts the side surface of the component 3 is swingable around the horizontal swing axis YJ. It is preferable to use the component holding unit 23) according to the example.

In the component holding portion 23 having the above configuration, even if the component 3 is supplied in a sideways posture and the leads 3L are oriented in the substantially horizontal direction when gripped by the pair of finger portions 32, the component 3 can be used. After grasping or sucking, the lead 3L can be directed downward by swinging the pair of finger portions 32 or the nozzle 32N around the swing axis YJ to raise and lower the component 3, and the component 3 can be moved downward to the camera 15. An image can be taken (FIG. 12 (a)-> FIG. 12 (b), FIG. 13 (a)-> FIG. 13 (b)).

Here, FIGS. 13A and 13B show an example in which the lead 3L of the component 3 has a shape for surface mounting. In this case, in the mounting process of step ST5 described above, the component holding unit 23 is moved based on the recognition result of the lead 3L succeeded in the component recognition step (step ST3) or the re-recognition step (step ST6) to hold the component. Successful in the lead alignment step (FIG. 14A) in which the lead 3L of the component 3 held by the portion 23 is aligned with the electrode 2D of the substrate 2 to which the solder paste Pst is supplied, and the component recognition step or re-recognition step. Based on the recognition result of the lead 3L, the component holding portion 23 is brought closer to the substrate 2, and the lead 3L of the component 3 held by the component holding portion 23 is brought into contact with the solder paste Pst (FIG. 14B). Consists of. When the distance from the component holding unit 23 to the camera 15 (distance H to the camera of the component holding unit 23) is changed in the re-recognition step (step ST6), the component holding unit 23 is attached to the substrate 2 in the lead contact process. The amount of movement Dm (FIG. 14 (a)) to be approached is corrected (calculated by reflecting the changed distance) based on the changed distance (| H-H0 |).

It should be noted that the component holding portion 23 according to the first modification shown in FIGS. 12A and 12B holds the component 3 having the lead 3L of the type surface-mounted on the substrate 2 and mounts the component 3 on the substrate 2. You can also. Similarly, the component holding portion 23 according to the second modification shown in FIGS. 13 (a) and 13 (b) holds the component 3 having the lead 3L of the type to be inserted into the substrate 2, and mounts the component 3 on the substrate 2. You can also.

Although the present embodiment has been described so far, the present invention is not limited to the above. For example, in the above-described embodiment, the method of raising and lowering the component holding portion 23 holding the component 3 from the observation position where the distance H to the camera is H = H0 is 3 steps in the ascending direction and 3 steps in the downward direction. However, this is an example, and the method of raising and lowering the component holding portion 23 from the observation position is completely arbitrary. The range of increase / decrease (distance) is also completely arbitrary in each step. Further, in the above-described embodiment, the observation position of the lead 3L is regarded as the height from the camera 15 (position in the height direction), but the observation position of the lead 3L is not limited to the height from the camera 15. It is possible to use a camera other than the camera 15 as a reference, or to capture from a direction other than the height direction (oblique direction, etc.).

Further, in the above-described embodiment, the component holding portion 23 has a configuration in which the side surface of the component 3 is gripped by a pair of finger portions 32 or the side surface of the component 3 is sucked by the nozzle 32N. Any other configuration may be used as long as the lead 3L can be directed downward while holding the above. Further, the camera 15 as the imaging unit in the above-described embodiment may be any one that images the lead 3L of the component 3 held by the component holding unit 23 from below, and is not limited to the line scanner type and the area imaging type. It may be of the type of.

Further, in the component recognition step of step ST3, the component supply unit 12 supplies the component holding unit 23 based on the information of the amount of change from the predetermined distance H0 of the component holding unit 23 with respect to the camera, which was clarified in the re-recognition step of step ST6. By estimating the variation in the arrangement (height, etc.) of the parts 3 to be performed and adjusting the distance H of the part holding unit 23 to the camera with respect to the parts 3 at the time of picking up the parts 3 next time, the lead 3L is set at a predetermined distance H0 as much as possible. It is preferable that the function is provided so that the recognition of the camera can be successful. Further, it is preferable that this function can be turned on / off according to the packing style of the component 3.

Provided are a component mounting method and a component mounting device capable of suppressing the occurrence of lead recognition errors and improving the production efficiency of a mounting board.

1 Parts mounting device 2 Board 2H insertion hole 2D electrode 3 Parts 3L lead 11 Board holding part 13 Parts mounting head 14 Head moving mechanism 15 Camera (imaging part)
21 Parts holding part movement mechanism 23 Parts holding part 32 Finger part 41 Imaging control part 42 Parts recognition part 43 Reimaging control part 44 Mounted control part Pst Solder paste

Claims (9)

This is a component mounting method in which components with leads are mounted on a board.
A pickup process that holds the side surface of the part by the part holding part,
An observation position moving step of moving the component holding unit holding the component to an observation position separated from the imaging unit by a predetermined distance while the lead of the component held in the pickup step is directed toward the imaging unit.
Recognition that the lead of the component held by the component holding unit located at the observation position is imaged by the imaging unit in the observation position moving step, and the position of the lead is detected based on the obtained image of the lead. The parts recognition process to try
When the lead recognition fails in the component recognition step, the lead is imaged by changing the distance from the component holding unit to the imaging unit, and the lead recognition is performed based on the obtained image of the lead. Re-recognition process to try and
A component mounting method including a mounting step of moving the component holding portion based on the recognition result of the lead succeeded in the component recognition step or the re-recognition step and mounting the component on the substrate. The component mounting method according to claim 1, wherein the pick-up step holds the side surface of the component by gripping it with a pair of finger portions included in the component holding portion or by sucking and holding it with a nozzle. The component is mounted with the lead inserted in the insertion hole of the substrate.
The mounting process is
A lead position in which the component holding portion is moved based on the recognition result of the lead succeeded in the component recognition step or the re-recognition step, and the tip of the lead of the component held by the component holding portion is aligned with the insertion hole. The component mounting method according to claim 1 or 2, further comprising a alignment step and a lead insertion step of bringing the component holding portion close to the substrate and inserting the lead into the insertion hole. When the distance from the component holding portion to the imaging unit is changed in the re-recognition step, the amount of movement of the component holding portion to approach the substrate in the lead insertion step is calculated by reflecting the changed distance. The component mounting method according to claim 3. The component mounts the lead on a solder paste supplied on the electrodes of the substrate.
The mounting process is
A lead alignment step of moving the component holding portion based on the recognition result of the lead succeeded in the component recognition step or the re-recognition step, and aligning the lead of the component held by the component holding unit with the electrode. ,
Lead contact in which the component holding portion is brought closer to the substrate based on the recognition result of the lead succeeded in the component recognition step or the re-recognition step, and the lead of the component held by the component holding portion is brought into contact with the solder paste. The component mounting method according to claim 1 or 2, which includes a step. When the distance from the component holding portion to the imaging unit is changed in the re-recognition step, the amount of movement of the component holding portion to approach the substrate in the lead contact step is calculated by reflecting the changed distance. The component mounting method according to claim 5. A component mounting device that mounts components with leads on a board.
A substrate holding portion that holds the substrate and
A component mounting head having a component holding portion that holds the side surface of the component and a component holding portion moving mechanism that brings the component holding portion closer to and away from the substrate.
A head moving mechanism for moving the component mounting head and
An imaging unit that captures the leads of the component held by the component holding unit, and an imaging unit.
The head moving mechanism and the component holding portion moving mechanism are controlled to move the component holding portion holding the component to an observation position separated from the imaging unit by a predetermined distance, and the imaging unit moves to the imaging unit at the observation position. An imaging control unit that captures the lead and
A component recognition unit in which the imaging unit attempts recognition to detect the position of the lead based on an image obtained by imaging the lead, and a component recognition unit.
When the component recognition unit fails to recognize the lead, the component holding unit moving mechanism is controlled to change the distance from the component holding unit to the imaging unit, and the imaging unit is made to image the lead. Control unit and
Based on the successful recognition result of the lead in the component recognition unit, the head moving mechanism and the component holding unit moving mechanism are controlled to align the lead of the component held in the component holding unit with the substrate. A component mounting device including a mounting control unit for mounting the component on the board by bringing the component holding unit close to the board. The component mounting device according to claim 7, wherein the component holding portion holds the side surface of the component by gripping it with a pair of finger portions or by sucking and holding it with a nozzle. When the recognition result is obtained after the reimaging control unit changes the distance from the component holding unit to the imaging unit, the mounting control unit brings the component holding unit closer to the substrate. The component mounting device according to claim 7 or 8, wherein the movement amount is calculated by reflecting the changed distance.

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