JP6922298B2 - Substrate manufacturing method - Google Patents

Description

The present invention relates to a method for manufacturing a substrate device.

In the method of manufacturing a printed circuit board in which surface mount components and insert mount components are mixedly mounted, a metal mask having openings arranged at corresponding positions of lands and through holes formed on the printed circuit board is placed on the printed circuit board. A method including a step and a step of applying a solder paste to the surface of the land and the inside of the through hole through the opening is conventionally known (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2016-143774

In the present invention, the coating agent applied to the adjacent through holes is compared with the configuration in which the linear convex portion of the component to be mounted is not arranged between the coating agents applied to the plurality of through holes formed in the substrate. An object of the present invention is to obtain a method for manufacturing a substrate device capable of suppressing the occurrence of bridges that are connected to each other during heating.

In order to achieve the above object, the method for manufacturing a substrate device according to claim 1 according to the present invention includes a plurality of through holes formed side by side in one direction on a substrate and the one direction of the through holes. A coating process in which a coating agent is linearly applied to one surface of the substrate on the outside in the intersecting direction with a width smaller than the inner diameter of the through hole, and a component having a linear convex portion between a plurality of terminals. In a state where the plurality of terminals in the above are inserted into the plurality of through holes from the one side thereof, and the convex portions close both ends of the through holes in one direction and do not come into contact with the coating agent. A step of arranging the convex portion along the coating direction of the coating agent between the coating agents so as to partition each other, and a step of heating and melting the coating agent to fix the component to the substrate. ,have.

According to the invention of claim 1, adjacent penetrations are made as compared with a configuration in which the linear protrusions of the parts to be mounted are not arranged between the coating agents applied to the plurality of through holes formed in the substrate. It is possible to suppress the occurrence of bridges in which the coating agents applied to the holes are connected to each other during heating.

Further , according to the invention of claim 1 , in the coating step, as compared with the case where the coating agent is applied in one direction in which a plurality of through holes are lined up, when the coating agents applied to the adjacent through holes are heated. It is possible to suppress the occurrence of bridges that connect to each other.

(A) It is a perspective view of the component mounted on the substrate which concerns on this embodiment. (B) It is a top view of the component mounted on the substrate which concerns on this embodiment. (A) It is a top view which shows the state which put the metal mask on the substrate which concerns on this embodiment. (B) It is a top view which shows the state which applied the cream solder on the metal mask to the substrate which concerns on this embodiment, and removed the metal mask. (A) to (D) It is a process drawing which shows the manufacturing method of the substrate apparatus which concerns on this Embodiment. (A) It is a top view which shows the state which put the metal mask on the substrate which concerns on the modification of this Embodiment. (B) It is a top view which shows the state which applied the cream solder on the metal mask to the substrate which concerns on the modification of this Embodiment, and removed the metal mask.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings. For convenience of explanation, the arrow UP shown in each figure is upward, the arrow FR is forward, and the arrow LH is left, but the direction is not particularly limited. Further, the method of manufacturing the substrate device 10 according to the present embodiment is a method of mounting a component 20 having a linear convex portion 28 between a plurality of terminals 26 on a substrate 12 constituting the substrate device 10. Therefore, the component 20 will be described first, but the component 20 and the substrate 12 shown in each drawing are drawn exaggeratedly as compared with the actual ones.

〔parts〕
As shown in FIG. 1 (A), the component 20 in the present embodiment is, for example, a connector, which is a substantially rectangular block-shaped resin component body 22 that is long in one direction (front-back direction in FIG. 1 (B)). have. The component main body 22 has a plurality (for example, four) along a direction orthogonal to the longitudinal direction (one direction) (the left-right direction in FIG. 1B, which may be hereinafter referred to as a "short direction"). The groove portion 24 is formed, and a substantially columnar terminal 26 projects from the central portion on the bottom surface of each groove portion 24.

That is, the component 20 includes a component main body 22 and a plurality of (for example, four) terminals 26 arranged in a row in the longitudinal direction (one direction) thereof, and is formed between the terminals 26. A plurality (for example, three) of linear convex portions 28 are formed along the lateral direction. In the present embodiment, the convex portions 28 equivalent to the convex portions 28 are formed at both ends of the component main body 22 in the longitudinal direction, and a total of five convex portions 28 are formed. ing.

Further, in the component 20 of the present embodiment, the width (length in the front-rear direction) W1 of the convex portion 28 shown in FIG. 1 (B) is W1 = 2 mm, and the width of the groove portion 24 (length in the front-rear direction). W2 is W2 = 1.4 mm. The length L1 of the component 20 in the lateral direction (left-right direction) is L1 = 8 mm.

〔substrate〕
Next, the substrate 12 will be described. As shown in FIG. 2B, the substrate 12 has a flat plate-shaped substrate main body 14, and a wiring pattern (not shown) is formed on the substrate main body 14. That is, the substrate 12 is configured by forming a wiring pattern on the substrate main body 14. A plurality of (for example, four) through holes 16 corresponding to each terminal 26 are formed in the substrate 12 in order to insert at least each terminal 26 of the component 20.

As shown in FIGS. 2A and 2B, each through hole 16 is formed in a circular shape in a plan view, and is separated by a predetermined interval in the longitudinal direction (one direction) of the component 20. They are formed in a row (at equal intervals). The inner diameter D of each through hole 16 is determined by the outer diameter of each terminal 26 in the component 20 and the amount of cream solder 18 to be filled inside, but in the substrate 12 according to the present embodiment, D = 2.5 mm. It is said that. Further, the inner diameter D of each through hole 16 may be determined regardless of the amount of cream solder 18 depending on the outer diameter of each terminal 26 in the component 20 and the space of the wiring pattern in the substrate 12. In this case, the amount of the cream solder 18 is adjusted so that the cream solder 18 can be filled in each through hole 16.

〔Metal mask〕
Next, the metal mask 30 will be described. As shown in FIG. 2A, the substrate 12 (board body 14) includes a cream solder 18 as an example of a coating agent, and each through hole 16 on the surface (one surface) of the substrate 12. When the metal mask 30 is linearly applied to the portion (the radial outer side including at least a part of each through hole 16 and the peripheral portion of each through hole 16), the metal mask 30 is superposed on the surface thereof. It has become like.

More specifically, the metal mask 30 is formed with a plurality of (for example, four) openings 32 corresponding to the through holes 16 formed in the substrate 12. The openings 32 are formed in a row (equally spaced) at predetermined intervals in the longitudinal direction (one direction) of the component 20, and are arranged in a row in the plan view of FIG. It is formed in a rectangular shape in a plan view that is long in the orthogonal direction (horizontal direction).

The dimensions of each opening 32 are calculated from the clearance between the component 20 and the substrate 12 in the height (thickness) direction, the inner diameter D of the through hole 16, the outer diameter of the terminal 26 in the component 20, the thickness of the metal mask 30, and the like. It depends on the amount of cream solder 18 to be made. In the metal mask 30 of the present embodiment, the width (length in the front-rear direction) W3 of each opening 32 is W3 = 1 mm, and the length L2 in the left-right direction of each opening 32 is L2 = 8 mm. Has been done.

Further, the metal mask 30 is positioned by a positioning member (not shown) so that each through hole 16 is located at the center of each opening 32 in the longitudinal direction, and is superimposed on the surface of the substrate 12. Then, by applying the cream solder 18 from above the metal mask 30, as shown in FIG. 2 (B), a part of the surface of the substrate 12 (board body 14) exposed from each opening 32. The cream solder 18 is linearly applied to (including the through hole 16).

The width and length of the cream solder 18 are equivalent to the width and length of the opening 32. That is, the width (length in the front-rear direction) W4 of the cream solder 18 is W4 = W3 = 1 mm, and the length L3 in the left-right direction of the cream solder 18 is L3 = L2 = 8 mm. Further, the height of the cream solder 18 is equivalent to the thickness of the metal mask 30, and is 0.12 mm in the present embodiment.

[Manufacturing method of substrate equipment]
The substrate device 10 is manufactured by fixing the component 20 to the substrate 12 having the above configuration. Next, the manufacturing method thereof will be described.

(Applying process)
First, as shown in FIG. 2A, the metal mask 30 is superposed on the surface of the substrate 12 (board body 14). That is, the metal mask 30 is positioned by the positioning member and overlapped with the surface of the substrate 12 so that the through holes 16 are located at the center of each opening 32 in the longitudinal direction.

Then, the cream solder 18 is applied from above the metal mask 30 by screen printing (application step). Specifically, the cream solder 18 on the metal mask 30 is squeezed (illustrated) in a direction (horizontal direction) orthogonal (intersecting) with one direction (front-back direction) in which the openings 32 (each through hole 16) are lined up. Omitted) is moved and applied. After applying the cream solder 18 in this way, the metal mask 30 is removed from the surface of the substrate 12 (board body 14).

As a result, as shown in FIG. 2B, a part of the surface of the substrate 12 including each through hole 16 (at least a part of each through hole 16 is closed, and at least one of the peripheral portions of each through hole 16 is closed. On the outer side in the radial direction including the portion), each cream solder 18 having the same shape as each opening 32 in a plan view and having a long rectangular shape in a plan view in the left-right direction is linearly applied along the groove portion 24 of the component 20. It will be. FIG. 3A shows a part thereof in cross section.

(Placement process)
After that, the component 20 is mounted on the surface of the substrate 12. That is, as shown in FIG. 3B, each terminal 26 in the component 20 is inserted into each through hole 16 from the surface (one surface) side of the substrate 12 coated with the cream solder 18. At this time, as shown by a virtual line in FIG. 2B, each convex portion 28 in the component 20 is arranged between the cream solders 18 (arrangement step). That is, the component 20 is inserted until each convex portion 28 comes into contact with the surface of the substrate 12.

To be described in detail, each convex portion 28 in the component 20 is formed in a linear shape along the coating direction (left-right direction) of the cream solder 18, and the width W2 of each groove portion 24 in the component 20 and each cream solder 18 Width W4 and the above dimensions (W2 = 1.4 mm, W4 = 1.0 mm).

Therefore, the convex portions 28 are arranged between the cream solders 18 in a state where they do not come into contact with the cream solders 18 (for example, they have clearances C of 0.2 mm on both sides in the front-rear direction and are not in contact with each other). NS. As a result, each cream solder 18 is prevented from being crushed by each convex portion 28, and the occurrence of a bridge, which will be described later, is suppressed or prevented.

(Process of fixing parts to the board)
Then, in this state, as shown in FIG. 3C, each cream solder 18 is heated. That is, the substrate 12 in which each terminal 26 of the component 20 is inserted into each through hole 16 is put into the reflow furnace. Then, each cream solder 18 applied to the surface of the substrate 12 is melted and filled in each through hole 16 without excess or deficiency (without the excess solder becoming ball-shaped). Then, the substrate 12 is taken out from the reflow oven and cooled to room temperature. As a result, as shown in FIG. 3D, the component 20 is fixed to the substrate 12 (heating and fixing steps).

Here, each convex portion 28 in the component 20 is arranged between each cream solder 18 (each adjacent cream solder 18 is partitioned by each convex portion 28). Therefore, when the cream solder 18 is melted, the convex portion 28 prevents the cream solder 18 from flowing toward the adjacent cream solder 18.

Therefore, the generation of bridges in which the cream solders 18 applied to the adjacent through holes 16 are connected to each other at the time of heating and melting is suppressed or prevented. That is, the occurrence of a problem that the component 20 is short-circuited is suppressed or prevented. In this way, the substrate device 10 in which the occurrence of bridges (shorts) is suppressed or prevented is manufactured.

The shape of the component 20 is not limited to the shape shown in FIG. For example, although not shown, the component 20 may have a shape in which a plurality of (for example, four) terminals 26 project in a grid pattern. In this case, as in the modified example shown in FIG. 4B, the substrate 12 has a plurality of (for example, four) through holes 16 arranged in a grid pattern.

When the cream solder 18 is applied to a part of the surface of the substrate 12 including the through holes 16, as shown in FIG. 4A, openings extending outward to the left and right with respect to the through holes 16 A metal mask 30 having 32 is used. That is, in the case of each through hole 16 on the left side in the drawing, each opening 32 extending to the left side is arranged with respect to each through hole 16, and in the case of each through hole 16 on the right side in the drawing, each through hole 16 is provided. On the other hand, each opening 32 extending to the right side is arranged.

In the metal mask 30, the width W5 of the portion arranged between the left and right adjacent through holes 16 is, for example, W5 = 0.35 mm. Then, the cream solder 18 is applied from above the metal mask 30 by screen printing, and then the metal mask 30 is removed from the substrate 12, so that each penetration on the surface of the substrate 12 is as shown in FIG. 4 (B). The cream solder 18 is linearly applied to a part including the holes 16.

That is, a rectangular cream solder 18 in a plan view is applied to a part of the surface of the substrate 12 including the through holes 16 so as to be offset to the left and right outside with respect to the through holes 16. As a result, when the cream solder 18 is heated and melted, the amount of the cream solder 18 filled in each through hole 16 is secured. Then, due to the cross-shaped convex portions (not shown) of the parts 20 arranged between the cream solders 18, the cream solders 18 are formed in the left and right adjacent portions and the front and rear adjacent portions of the through holes 16. The occurrence of bridges that connect to each other is suppressed or prevented.

Although the manufacturing method of the substrate device 10 according to the present embodiment has been described above with reference to the drawings, the manufacturing method of the substrate device 10 according to the present embodiment is not limited to the one shown in the drawing, and is not limited to the one shown in the drawing. The design can be changed as appropriate within the range that does not deviate from the gist. For example, the shape of each through hole 16 is not limited to the illustrated circular shape in a plan view, and may be a square shape in a plan view.

Further, the terminals 26 of the component 20 are not limited to the configuration in which they are projected in a row in one direction (front-back direction) in a plan view, or are projected in a grid pattern, for example. They may be arranged in a staggered pattern in a plan view. That is, the through holes 16 formed in the substrate 12 may be formed in a staggered pattern in a plan view. Further, the number of terminals 26 may be a plurality, and is not limited to the four terminals shown in the figure. That is, the number of through holes 16 may be a plurality, and is not limited to the four as shown.

Further, the dimensions (width and length) of each groove 24 and each convex portion 28 in the component 20 and the dimensions (width and length) of each opening 32 (cream solder 18) in the metal mask 30 are also shown in the above embodiment. It is not limited to the dimensions. As long as each cream solder 18 is not crushed by each convex portion 28 and each cream solder 18 is filled in each through hole 16 without excess or deficiency when each cream solder 18 is heated and melted. good.

10 Substrate equipment 12 Substrate 16 Through holes 18 Cream solder (an example of coating agent)
20 parts 26 terminals 28 convex parts

Claims (1)

A plurality of through holes formed side by side in a substrate and one surface of the substrate on the outside of the through holes in a direction intersecting the one direction, linearly having a width smaller than the inner diameter of the through holes. And the coating process of applying the coating agent to
The plurality of terminals in a component having a linear convex portion between the plurality of terminals are inserted into the plurality of through holes from the one side thereof, and the convex portions are both ends of the through hole in one direction. An arrangement step of arranging the convex portion along the coating direction of the coating agent between the coating agents so as to close the coating agent and partition the coating agents from each other without contacting the coating agent.
The step of heating and melting the coating agent to fix the component to the substrate, and
A method for manufacturing a substrate device having the above.

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