JP6923815B2 - Wiring board and light emitting module - Google Patents

Description

The present disclosure relates to a wiring board and a light emitting module.

A light emitting module in which a light emitting device such as an LED (Light Emitting Diode) using a semiconductor light emitting element (hereinafter, also referred to as “light emitting element”) is mounted on a wiring substrate is known.

The wiring board used for such a light emitting module includes an insulating base material, patterned wiring on the insulating base material, and an insulating film covering wiring other than a portion on which electronic components such as a light emitting device and a connector are mounted. Be prepared. Further, in order to arrange the electronic components at accurate positions, a part of the wiring board is used as a reference mark, the position of the reference mark is recognized, and the mounting position on the two-dimensional coordinate plane is defined. The reference mark is placed inside the opening of the insulating film, and there is a gap between the opening of the insulating film and the reference mark (the reference mark is made only by wiring, and the reference mark is not affected by the displacement of the resist). An overresist structure is known in which the wiring is arranged in the opening of the insulating film, the size of the opening is smaller than the size of the reference mark, and a part of the wiring is covered with the insulating film (for example, patent). Document 1).

Japanese Unexamined Patent Publication No. 2006-278597

However, in the overresolder structure disclosed in Patent Document 1, even if the opening of the insulating film is displaced in either the X direction or the Y direction, the opening is used as a reference. Therefore, when the opening is displaced, the position of the reference mark is also displaced, and the component mounting position is displaced from the board land. Due to the self-alignment effect at the time of solder melting, the electronic component tries to move in the direction of the substrate land, which may cause mounting defects such as the electronic component moving in the rotation direction. Even in the reference mark made only by wiring, the component mounting position is often formed by making the opening of the insulating film smaller than the land. While the reference mark is not affected by the displacement of the insulating film, the component mounting position is affected by the displacement of the insulating film, so that the component mounting position deviates from the board land as in the overresold structure. As a result, the self-alignment effect at the time of solder melting may cause mounting defects such as movement of electronic components in the rotational direction.

Embodiments of the present invention include the following configurations.
A wiring board including a base material, a metal film arranged on the upper surface of the base material, and an insulating film that covers a part of the metal film. The metal film is a pair of lands on which electronic components are mounted. The insulating film has a first opening in which the land is exposed and a second opening in which the reference mark is exposed, and the land has an X. The width of the second opening in the X direction is larger than the width of the reference mark, and the width of the second opening in the Y direction orthogonal to the X direction includes the first land and the second land arranged side by side in the direction. A wiring board that is smaller than the width of the reference mark.

As described above, even if the opening of the insulating film is displaced, it is possible to reduce the occurrence of mounting defects of electronic components.

It is a schematic plan view which shows an example of the wiring board used in the manufacturing method of the light emitting module which concerns on embodiment. FIG. 3 is an enlarged schematic plan view of a part of the wiring board shown in FIG. 1A. It is an enlarged schematic plan view of a part of the wiring board shown in FIG. 1B. FIG. 5 is a schematic cross-sectional view taken along the ID-ID line shown in FIG. 1C. FIG. 1C is an enlarged schematic plan view of a part of the wiring board shown in FIG. 1C, a schematic cross-sectional view in the X direction, and a schematic cross-sectional view in the Y direction. FIG. 5 is a schematic plan view showing an example of a wiring board used in the method for manufacturing a light emitting module according to an embodiment, which is formed at a position where an opening of an insulating film is displaced. It is a schematic perspective view which shows an example of the light emitting device used in the manufacturing method of the light emitting module which concerns on embodiment. FIG. 3 is a schematic perspective view of the light emitting device shown in FIG. 3A as viewed from the lower surface side. FIG. 3A is a schematic cross-sectional view taken along the line IIIC-IIIC of FIG. 3A. It is a schematic plane which shows an example of the light emitting module obtained by the manufacturing method of the light emitting module which concerns on embodiment. FIG. 6 is a schematic cross-sectional view taken along the line IVB-IVB of FIG. 4A. FIG. 6 is a schematic cross-sectional view taken along the line IVC-IVC of FIG. 4A.

A mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below exemplifies a wiring board for embodying the technical idea of the present invention, and the present invention does not limit the wiring board to the following. In the following description, terms indicating a specific direction or position (for example, "right", "left", "top", "bottom", and other terms including those terms) are used as necessary. Use. The use of these terms is for facilitating the understanding of the invention with reference to the drawings, and the meaning of these terms does not limit the technical scope of the invention.

The parts having the same reference numerals appearing in a plurality of drawings indicate the same or equivalent parts or members. In addition, the same name shall be used for each member even if the state, shape, etc. are different before and after cutting. For convenience of explanation, "m" is added to the reference numerals of the openings, reference marks, lands, etc. at the predetermined positions and the openings, reference marks, lands, etc. at positions deviated from the predetermined positions. May be explained.

In addition, the dimensions, materials, shapes, relative arrangements, etc. of the components described below are not intended to limit the scope of the present invention to the specific description, but are exemplified. It was intended. Further, the contents described in one embodiment and the embodiment can be applied to other embodiments and the examples. In addition, the size and positional relationship of the members shown in the drawings may be exaggerated in order to clarify the explanation. In addition, some elements may be omitted in order to avoid overly complicated drawings.

1A to 1E show an example of the wiring board 10. The wiring board 10 includes a base material 20, a metal film 30 arranged on the upper surface of the base material 20, and an insulating film 40 that covers a part of the metal film 30. The metal film 30 includes a pair of lands L on which electronic components are mounted, and a reference mark M used when mounting electronic components. The pair of lands L are exposed in the first opening R1 provided in the insulating film 40. The reference mark M is exposed in the second opening R2 provided in the insulating film 40.

The rands L arranged in the first opening R1 are arranged side by side in the X direction, and the first land L1 located on the left side and the second land L2 arranged on the right side of the first land L1 are arranged. Have. The first exposed portion E1 of the base material 20 is exposed between the first land L1 and the second land L2. Although the case where there are two lands L in the opening R1 is illustrated here, three or more lands may be provided depending on the electronic component used. In such a case, the leftmost land may be the first land L1, the rightmost land may be the second land L2, and a third land may be provided between them.

The reference mark M arranged in the second opening R2 is arranged substantially in the center of the second opening R2. The second exposed portion E2 of the base material 20 is exposed on the left side of the reference mark M, and the third exposed portion E3 of the base material 20 is exposed on the right side of the reference mark M.

The width of the second opening R2 in the X direction is larger than the width of the reference mark M. Further, the width of the second opening R2 in the Y direction orthogonal to the X direction is smaller than the reference mark M. As a result, even when the positions of the openings (first opening R1 and second opening R2) of the insulating film 40 deviate from the predetermined positions, it is possible to reduce the occurrence of mounting defects of electronic components. It becomes.

The reason why the occurrence of mounting defects of electronic components can be reduced even when the position of the opening of the insulating film 40 is displaced in this way will be described below.

1A to 1E show an example in which the first opening R1 and the second opening R2 of the insulating film 40 are formed at predetermined positions. Here, the left side of the second opening R2 is the first side (left side) R21, the right side is the second side (right side) R22, the upper side is the third side (upper side) R23, and the lower side is the lower side. Let it be the third side (lower side) R24.

The left side of the reference mark M exposed in the second opening R2 is the first side (left side) M1, the right side is the second side (right side) M2, and the upper side is the third side (upper side) M3. , The lower side is the fourth side (lower side) M4.

Regarding the second exposed portion E2 in the second opening R2, the left side is the first side (left side) E21, the right side is the second side (right side) E22, and the upper side is the third side (upper side) E23. , The lower side is the fourth side (lower side) E24. Similarly, for the third exposed portion E3, the left side is the first side (left side) E31, the right side is the second side (right side) E32, the upper side is the third side (upper side) E33, and the lower side is the lower side. Let the side be the fourth side (lower side) E34.

The first side R21 of the second opening R2 coincides with the first side E21 of the second exposed portion E2. The second side R22 of the second opening R2 coincides with the second side E32 of the third exposed portion E3. The third side R23 of the second opening R2 coincides with the side connecting the third side E23 of the second exposed portion E2, the third side M3 of the reference mark M, and the third side E33 of the third exposed portion E3. The fourth side R24 of the second opening R2 coincides with the side connecting the fourth side E24 of the second exposed portion E2, the fourth side M4 of the reference mark M, and the fourth side E34 of the third exposed portion E3.

The first side (left side) M1 of the reference mark M coincides with the second side (right side) E22 of the second exposed portion E2. The second side (right side) M2 of the reference mark M coincides with the first side (left side) E31 of the third exposed portion E3. The third side (upper side) M3 of the reference mark M coincides with a part of the third side (upper side) R23 of the first opening R1. The fourth side (lower side) M4 of the reference mark M coincides with a part of the fourth side (lower side) of the first opening R1.

Similarly, for the first opening R1, the left side is the first side (left side) R11, the right side is the second side (right side) R12, the upper side is the third side (upper side) R13, and the lower side is the lower side. Let the side be the fourth side (lower side) R14.

In the first opening R1, the first land L1 is arranged on the left side, and the second land L2 is arranged on the right side with the first exposed portion E1 of the base material 20 interposed therebetween. The left side of the first land L1 is the first side (left side) L11, the right side is the second side (right side) L12, the upper side is the third side (upper side) L13, and the lower side is the fourth side (4th side). Lower side) L14. Similarly, the left side of the second land L2 is the first side (left side) L21, the right side is the second side (right side) L22, the upper side is the third side (upper side) L23, and the lower side is the first side. It is assumed that the four sides (lower side) are L24.

The first side R11 of the first opening R coincides with the first side L11 of the first land L1. The second side R12 of the first opening R1 coincides with the second side L22 of the second land L2. The third side R13 of the first opening R1 coincides with the side connecting the third side L13 of the first land L1, the third side E13 of the first exposed portion E1, and the third side L23 of the second land L2. The fourth side R14 of the first opening R1 coincides with the side connecting the fourth side L14 of the first land L1, the fourth side E14 of the first exposed portion E1, and the fourth side L24 of the second land L2.

The first side (left side) E11 of the first exposed portion E1 coincides with the second side (right side) L12 of the first land L1. The second side (right side) E12 of the first exposed portion E1 coincides with the first side (left side) L21 of the second land L2.

Here, as a wiring board, as shown in FIG. 2, the openings (first opening R1 and second opening R2) at predetermined positions are displaced diagonally upward to the right (first opening). A wiring board 10 m provided with a portion R1 m and a second opening R2 m) will be described as an example. In the wiring board 10m, the first opening R1m and the second opening R2m are deviated to the right from a predetermined position in the X direction, and are deviated upward from the predetermined position in the Y direction. The plurality of openings of the insulating film 40 m are all formed at the same time. Therefore, all the openings are formed at positions shifted by the same amount in the same direction. Similarly, the outer circumference of the insulating film 40 m is also formed at a position shifted by the same amount.

As the electronic component mounted on the wiring board, the light emitting device 110 shown in FIGS. 3A to 3C will be described as an example. The light emitting device 110 includes a package 111 and a semiconductor light emitting element 114 arranged in a recess of the package 111. The semiconductor light emitting device 114 is sealed by a sealing member 115. The package 111 includes an insulating support member 112 and a conductive connection terminal 113, and the connection terminal 113 is exposed to the outside on the lower surface of the package 111. The shape, size, and the like of the light emitting device 110 can be appropriately selected. 4A to 4C are views showing a state in which the light emitting device 110 shown in FIG. 3A and the like is mounted on the wiring board 10 m shown in FIG.

First, pay attention to the second opening R2m where the reference mark M is exposed. The second opening R2m of the insulating film 40m has a first side R21m, a second side R22m, a third side R23m, and a fourth side R24m at predetermined positions on the first side R21, the second side R22, and the third side R23. , The fourth side R24 is deviated diagonally upward to the right. Therefore, the first side E21m, the third side E23m, and the fourth side E24m of the second exposed portion E2m also deviate diagonally upward to the right from the first side E21, the third side E23, and the fourth side E24 at predetermined positions. ing. However, although the second side E22m of the second exposed portion E2m is displaced upward (Y direction) from the second side E22 at a predetermined position, it is not displaced in the right direction (X direction).

Similarly, the second side E32m, the third side E33m, and the fourth side E34m of the third exposed portion E3m exposed in the second opening R2m also have the second side E32, the third side E33, and the third side E33 at predetermined positions. They are offset diagonally upward to the right from the fourth side E34. However, although the first side E31m of the third exposed portion E3m is displaced upward (Y direction) from the first side E31 at a predetermined position, it is not displaced in the right direction (X direction).

That is, the second side E22 of the second exposed portion E2 in the second opening R2 at the predetermined position and the first side E31 of the third exposed portion E3 are predetermined in the second opening R2m at the displaced positions. It is not displaced in the X direction from the position of, and is in the same position. In other words, the first side M1 of the reference mark M that coincides with the second side E22 of the second exposed portion E2 at a predetermined position, and the second side of the reference mark M that coincides with the first side E31 of the third exposed portion E3. The side M2 is not displaced in the X direction and is in the same position even within the second opening R2m at the displaced position.

Next, pay attention to the first opening R1m in which the land L is arranged. As shown in FIG. 2, the first opening R1m of the insulating film 40m also has a predetermined side R11m, a second side R12m, a third side R13m, and a fourth side R14m, similarly to the second opening R2m. The positions are deviated diagonally upward to the right from the first side R11, the second side R12, the third side R13, and the fourth side R14, respectively. Therefore, the first side L11m, the third side L13m, and the fourth L14m of the first land L1m are all displaced diagonally upward to the right from the first side L11, the third side L13, and the fourth side L14 at predetermined positions. However, although the second side L12m of the first land L1m is displaced upward (Y direction) from the second side L12 at a predetermined position, it is not displaced in the right direction (X direction).

Similarly, the second side L22m, the third side L23m, and the fourth side L24m of the second land L2m in the second opening R1m are also from the second side L22, the third side L23, and the fourth side L24 at predetermined positions. , Each is shifted diagonally upward to the right. However, although the first side L21m of the second land L2m is displaced upward (Y direction) from the first side L21 at a predetermined position, it is not displaced in the right direction (X direction).

That is, the second side L12m of the first land L1m and the first side L21m of the second land L2m in the first opening R1m at the displaced positions are the first land L1 of the first opening R1 at a predetermined position. It is not displaced in the X direction from the first side L12 of the two sides L12 and the second land L2, and is in the same position. In other words, the first side E11m and the second side E12m of the first exposed portion E1m at the displaced positions are displaced in the X direction from the first side E11 and the second side E12 of the first exposed portion E1 at the predetermined positions. Not in the same position.

As described above, even if the opening of the insulating film 40 m is formed at a position deviated from the predetermined position, the first side M1 m and the second side M2 m of the reference mark Mm, the first land L1 m, and the second land L2 m are formed. The first side E11m and the second side L12m of the first exposed portion E1m between them are the first side M1 and the second side M2 of the reference mark M at predetermined positions and the first exposed portion E1 in the X direction, respectively. It is in the same position as the first side E11 and the second side L12.

Therefore, in the X direction, by using the first side M1 or the second side M2 of the reference mark Mm as a reference, electronic components can be mounted on the first land L1m and the second land L2m without shifting in the X direction. can do.

Next, the alignment in the Y direction (vertical direction) will be described. As shown in FIG. 2, when the second opening R2m is displaced diagonally upward to the right, the third side (upper side) M3m and the fourth side M4m of the reference mark Mm are the third side of the reference mark M at a predetermined position. It deviates from the side M3 and the fourth side M4 in the Y direction (upward). Similarly, the third side L13m and the fourth side L14m of the first land L1m of the first opening R1m, the third side L23m and the fourth side L24m of the second land L2m are also the first of the first land L1 at a predetermined position. It deviates from the third sides L13 and L14 of the three sides L13 and L14 and the third sides L23 and L24 of the second land L2 in the Y direction (upward direction).

The alignment in the Y direction is based on the third side M3m or the fourth side M4m of the reference mark Mm located at a position deviated from the predetermined position. That is, in the Y direction, as shown in FIG. 4C, the electronic component 110 follows the position of the second opening R2m formed at a position deviated from the predetermined position, and the first electronic component 110 is formed at the deviated position. It is mounted at a position deviated from a predetermined position in the Y direction at the opening R1 m. As a result, in the Y direction, the center of the first opening R1m at the displaced position can be mounted so that the center of the electronic component (light emitting device) 110 coincides with each other.

As described above, assuming that the position of the opening of the insulating film may deviate from a predetermined position, the first side or the second side of the reference mark whose position does not change even if the position deviates is used as a reference. Therefore, although it deviates from the center of the first opening of the insulating film in the X direction, it can be mounted at a predetermined position. Further, in the Y direction, by using the third side or the fourth side of the position deviated from the predetermined position as a reference, the mounting should be performed at the center of the first land and the second land at the position deviated from the predetermined position. Can be done. Since the connection terminals of electronic components are arranged side by side in the X direction, they are accurately arranged on the first land and the second land in the X direction, so that when the components move due to self-alignment, they rotate at the same time. It is possible to reduce mounting defects such as the occurrence of the above and the occurrence of floating.

Hereinafter, each member will be described in detail.

(Wiring board)
The wiring board is a member for mounting electronic components such as a light emitting device and a connector. One wiring board includes a first region serving as a light emitting module and a second region connecting the first regions. FIG. 1A is a plan view showing the entire wiring board 10. FIG. 1B is an enlarged view of the S1 portion shown in FIG. 1A, and the portion surrounded by the alternate long and short dash line (the portion indicated by hatching) is the first region 11. FIG. 1C is an enlarged view of the S2 portion shown in FIG. 1B, and illustrates one first region 11 and a part of a second region 12 surrounding the first region 11. FIG. 1D shows an end view of the ID-ID line of FIG. 1C. Further, FIG. 1E is an enlarged view of S3 shown in FIG. 1B, and shows one second opening R2. As shown in FIGS. 1A and 1B, the second opening R2 is arranged in the vicinity of the second opening R2b arranged in the vicinity of each of the plurality of first regions 11 and in the vicinity of the corner portion of the wiring board 10. A second opening R2a is provided. Since these have substantially the same shape and only their size and formation position change, they will be described as the second opening R2 unless otherwise specified.

The wiring board 10 can include a plurality of first regions 11. For example, the wiring board 10 shown in FIG. 1A includes 132 first regions 11 in 11 rows × 12 columns. That is, 132 light emitting modules can be obtained from one wiring board 10. However, the number of the first region 11 is not limited to this, and can be any number.

In the first region 11, the plan view shape is a polygon such as a quadrangle, a triangle, or a pentagon, a circle, an ellipse, a shape obtained by combining these, a shape in which a part thereof is cut out, or a deformation. It can have various shapes such as a formed shape.

The second region 12 is located so as to connect the first region 11, and in the example shown in FIG. 1A and the like, a grid-like portion arranged between the first regions 11 arranged in a matrix and a grid-like portion are used. It includes a frame-shaped portion arranged so as to surround the entire plurality of first regions 11.

The wiring board 10 may further include a through hole 13 between the first region 11 and the adjacent first region 11. The through hole 13 can be arranged at an arbitrary position and with an arbitrary size. For example, in the example shown in FIG. 1A and the like, one through hole 13 is provided between the first regions 11 adjacent to the X direction, and one through hole is provided between the first regions 11 adjacent to the Y direction. No.

Such a wiring board 10 includes an insulating base material 20, a metal film 30 arranged on the upper surface of the base material 20, and an insulating film 40 that covers a part of the metal film 30.

As the base material 20, an insulating base material such as ceramic, glass epoxy resin, or paper phenol, or a conductive base material using a metal such as aluminum can be used. The size of the base material 20 may be any size as long as it includes a first region 11 serving as at least one light emitting module and a second region 12 having at least one reference mark M, depending on the size of the light emitting module. Can be selected as appropriate. The shape of the base material 20 can be various shapes such as a polygon such as a quadrangle, a triangle, and a pentagon in a plan view, a shape in which these are combined, or a shape in which a part thereof is deformed. The thickness of the base material 20 can be, for example, 300 μm to 2.0 mm.

The metal film 30 includes a wiring portion including a plurality of lands L for mounting and energizing electronic components. Specifically, each land L includes a first land L1 and a second land L2, which are X in the first opening R1 of the insulating film 40 via the first exposed portion E1 of the base material 20. Arranged side by side in the direction. The first land L1 and the second land L2 are arranged so as to be electrically separated from each other when they are separated as a light emitting module, and one of them becomes a cathode side land and the other becomes an anode side land. Become. The light emitting module may include a plurality of electronic components. In that case, the insulating film 40 may include a plurality of first openings R1 in the first region 11, and each of the first openings R1 has a first position. It includes one land L1 and a second land L2. The first land L1 and the second land L2 preferably have substantially the same shape as the connection terminal of the electronic component.

The width of the first exposed portion E1 in the X direction is preferably substantially equal to the width between the connection terminals of the electronic components mounted on the first land L1 and the second land L2 sandwiching the first exposed portion E1.

Further, the metal film 30 includes the reference mark M, and can further include a polarity recognition mark (cathode mark, anode mark) and the like. The metal film 30 serving as the reference mark or the polarity recognition mark may be electrically separated from the metal film 30 serving as the wiring portion. It is preferable that the metal films 30 on one wiring board are formed at the same time. As a result, the land L and the reference mark M do not shift in position and are formed in a constant positional relationship.

The metal film 30 is provided in both the first region 11 and the second region 12 of the wiring board 10. In the example shown in FIG. 1A and the like, the metal film 30 in the first region 11 and the metal in the second region 12 are provided. It is electrically separated from the membrane 30. However, the metal film 30 in the first region 11 and the metal film 30 in the second region 12 may be electrically continuous. In the example shown in FIGS. 1E and 1D, the metal film 30 is formed in a wide range of the first region 11. By making the metal film 30 a large area, it is possible to improve the heat dissipation of the electronic components. However, since the edge surface distance is required, it is preferable that the metal film 30 is separated from the end portion of the first region 11.

Examples of the material of the metal film 30 include Cu, Au, Ag, Ni, Pd and alloys thereof. Further, the metal film 30 may have a single-layer structure or a laminated structure of these materials. The thickness of the metal film 30 can be, for example, 9 μm to 105 μm. When the base material 20 is a metal material, an insulating film is arranged on the base material 20 and the metal film 30 is provided on the insulating film.

The insulating film 40 is an insulating film, and materials such as epoxy resin, silicone resin, and polyimide resin can be used. The thickness of the insulating film 40 is preferably lower than the height of the conductive joining member after joining the electronic components, and can be, for example, 5 μm to 30 μm.

The insulating film 40 includes a first opening R1 in which the land L is arranged and a second opening R2 in which the reference mark M is arranged. Specifically, in the first opening R1, the first land L1 and the second land L2, and the first exposed portion E1 of the base material 20 exposed between the first land L1 and the second land L2 , Are placed. A reference mark M, a second exposed portion E2 sandwiching the reference mark M, and a third exposed portion E3 are arranged in the second opening R2.

The insulating film 40 preferably covers a region other than the land L and the reference mark M of the metal film 30. The insulating film 40 is preferably provided in both the first region 11 and the second region 12 of the wiring board 10. For example, the insulating film 40 can be a continuous insulating film 40 from the first region 11 to the second region 12. In this case, the first opening R1 and the second opening R2 are provided in one insulating film 40. Alternatively, as shown in FIG. 1C, the insulating film 40 in the first region 11 and the insulating film 40 in the second region 12 may be separated. That is, the insulating film 40 having the first opening R1 and the insulating film 40 having the second opening R2 may be separated. In this case, in addition to the first exposed portion E1 in the first opening R1 and the second exposed portion E2 and the third exposed portion E3 in the second opening R2, the fourth exposed portion E4 as shown in FIG. 1C. To be equipped.

In the example shown in FIG. 1C and the like, the first opening R1 of the insulating film 40 is arranged in the first region 11, and the second opening R2 is arranged in the second region 12. In such a case, only the first opening R1 is finally provided in the light emitting module, and the second opening R2 does not form a part of the light emitting module, and is used for positioning in the manufacturing process. It is used only for visually recognizing the reference mark M. However, the present invention is not limited to this, and the second opening R2 may be arranged in the first region 11, in which case the second opening R2 constitutes a part of the light emitting module.

The size and shape of the first opening R1 can be appropriately selected depending on the size and shape of the connection terminals of the electronic components to be mounted. For example, when mounting an electronic component such as a light emitting device 110 having a quadrangular shape in a plan view and a substantially quadrangular shape (outer edge) of the pair of connection terminals 113 as shown in FIG. 3A, the first insulating film 40 is used. The opening R1 is preferably a quadrangle as shown in FIG. 1C. The first opening R1 is preferably made to have substantially the same size as the shape of the connection terminal of the electronic component.

One first region 11 of the wiring board 10 may include one or more first openings R1. In the example shown in FIG. 1A and the like, two first openings R1 (R1a, R1b) are arranged in one first region 11. More specifically, an example is shown in which one first opening R1a is arranged in the center of the first region 11 and the first opening R1b is provided in the Y direction (upward direction) when viewed from the first opening R1a. A first land L1a, a first exposed portion E1a, and a second land L2a are arranged in the first opening R1a. Similarly, the first land L1b, the first exposed portion E1b, and the second land L2b are arranged in the first opening R1b. For example, the light emitting device 110 can be mounted as an electronic component in the first opening R1a, and the connector 120 can be mounted in the first opening R1b. However, the position and number of the first openings R1 (R1a, R1b) are not limited to this, and can be appropriately selected according to the purpose, application, and the like. When a plurality of first openings R1 are provided in the first region 11, the plurality of first lands L1 may be continuous in the region covered with the insulating film 40, depending on the circuit of the light emitting module, or may be continuous. , May be separated. Similarly, the plurality of second lands L2 may be continuous or separated in the region covered with the insulating film 40.

The width of the second opening R2 in the X direction is larger than the width of the reference mark M, and the width of the second opening R2 in the Y direction orthogonal to the X direction is smaller than the width of the reference mark M. As shown in FIG. 2, the size and shape of the second opening R2 are such that the second exposed portion E2, the reference mark M, and the third opening are inside the second opening R2 even at a position shifted diagonally upward to the right. Set so that the exposed portion E3 is arranged.

That is, in the X direction, even when the second opening R2m is formed at the expected maximum deviation position, the first side M1m or the second side M2m of the reference mark Mm is within the second opening R2m. Set so that it can be visually recognized in. For example, it is desirable that the length of the reference mark in the X direction be a size that can be read by an inspection device. For example, the length of the reference mark in the X direction can be set in the range of 500 μm to 2 mm. The length (opening width) of the second opening of the insulating film in the X direction is preferably twice or more the length of the assumed deviation amount in the X direction in addition to the length of the reference mark.

For example, a case where the amount of the opening of the insulating film deviating from a predetermined position in the X direction is 100 μm at the maximum (right direction or left direction) is taken as an example. In this case, when the length of the metal film 30 serving as the reference mark in the X direction is 500 μm to 2 mm, the length of the second opening in the X direction is the length of the metal film 30 plus the length of the insulating film in the X direction. It is preferable that the amount is 200 μm or more, which is twice the maximum amount of deviation (100 μm). As a result, even if the second opening R2 deviates from the predetermined position in the X direction (leftward or rightward), the first side (left side) M1m and the second side (left side) M1m of the reference mark Mm in the second opening R2m. The side (right side) M2m is visible as a boundary with the second exposed portion E2m or the third exposed portion E3m.

Further, in the Y direction, the reference mark Mm is the third side (upper side) R23m or the fourth side of the second opening R2m even when the second opening Rm is formed at the expected maximum deviation position. (Lower side) Set so that it is in contact with R23m. Preferably, the reference mark Mm is set so as to be in contact with both the third side R23m and the fourth side R24m of the second opening R2m. For example, when the amount of deviation of the opening of the insulating film in the Y direction from a predetermined position is 100 μm at the maximum (upward or downward), the portion covered with the insulating film 40 m and which can be the reference mark Mm is included. The length of the metal film 30 in the Y direction is preferably 10 μm or more larger than the length of the second opening R2m in the Y direction. As a result, even if the second opening Rm is formed at a position deviated from the predetermined position in the Y direction (upward or downward), the third side M3m (upper side) of the reference mark Mm in the second opening R2m. And the fourth side (lower side) M4m is visible as a boundary with the insulating film 40m.

One or a plurality of the second openings R2 may be provided in the second region 12 of the wiring board 10. In the example shown in FIGS. 1A and 1B, one second opening R2 (R2a) is provided in the vicinity of the upper left corner of the wiring board 10. Further, one second opening R2 (R2a) is provided in the vicinity of the lower right corner of the wiring board 10. As described above, the reference mark M (Ma) exposed in the second opening R2a formed at a position slightly distant from the first region 11 serves as a reference mark for recognizing the position of the entire wiring board 10. Can be used. Further, one reference mark M (Mb) is provided in the vicinity of one first region 11. This reference mark Mb can be used as a reference mark for each of the first regions 11 serving as the light emitting module 100. In the example shown in FIG. 1A, 132 first regions 11 are provided, and one second opening R2 (R2b) is provided in the second region 12 on the X direction (upward) side of each first region 11. Be prepared. That is, in the example shown in FIG. 1A, 132 second openings R2b are provided in the vicinity of the first region 11, two second openings R2a are provided at the corners of the wiring board 10, and a total of 134 second openings are provided. The unit R2 is provided.

The wiring board 10 may include both of these two types of reference marks M (Ma, Mb), or may include only one of them. Further, when both of the two types of reference marks M (Ma ,, Mb) are provided, both of the reference marks may be used in the manufacturing process of the light emitting module, or only one of them may be used. For example, in the manufacturing process of a light emitting module, when the production speed is prioritized, by mounting all the light emitting elements and parts based on the reference mark Ma, the reference mark can be read once, and the production per unit time is performed. The number can be improved. Further, when the electronic component is mounted with high position accuracy, the reference mark Mb is used to recognize the reference mark Mb for each electronic component. As a result, the number of products produced per unit time is lower than that of the above method, but the positional accuracy of the electronic components is improved.

The shape of the second opening R2 is preferably such that the third side (upper side) R23 and the fourth side (lower side) R24 are straight lines parallel to the X direction. For example, it is preferably a quadrangle such as a square, a rectangle, a trapezoid, or a parallelogram, and more preferably a rectangle. Further, the corners of the quadrangle may be rounded. Further, since the first side (left side) R21 and the second side (right side) R22 of the second opening R2 are not used as a reference for positioning, they may include curved lines and curves. .. That is, the shape of the second opening R2 can be hexagonal, octagonal, or the like.

(Manufacturing method of light emitting module)
FIG. 4A shows an example of the light emitting module 100 using the wiring board according to the embodiment. Here, as shown in FIG. 2, a light emitting module obtained by using a wiring board 10 m in which an opening of an insulating film is formed at a position deviated from a predetermined position is illustrated. The light emitting module 100 includes a wiring board 10 m, a light emitting device 110 and a connector 120 as electronic components. The inside of the first opening R2m is shifted diagonally upward to the right from the predetermined position. Therefore, the width of the first land L1m in the X direction is smaller than the width of the second land L2m. The widths of the first land L1m and the second land L2m in the Y direction are the same.

3A to 3B show an example of the light emitting device 110. The light emitting device 110 includes a package 111 including a pair of connection terminals 113 and a support member 112 that integrally holds them. Further, a semiconductor light emitting element 114 is placed in the recess of the package 111, and a sealing member 115 that covers the semiconductor light emitting element 114 is provided. The upper surface of the light emitting device 110 is a light emitting surface, and the connection terminal 113 on the lower surface is connected to the land Lm of the wiring board 10 m. The pair of connection terminals 113 are rectangular shapes of the same size on the lower surface of the light emitting device 110.

A method of manufacturing such a light emitting module 100 will be described. First, the wiring board is prepared. Here, as shown in FIG. 2, a wiring board 10m having a first opening R1m and a second opening R2m at positions deviated from a predetermined position is prepared.

Next, the meltable conductive joining member 200 is arranged on the first land L1m and the second land L2m. In this case, the position of the conductive joining member 200 is determined with reference to the first side or the second side of the reference mark M in the X direction and the third side or the fourth side of the reference mark M in the Y direction. .. Examples of the conductive bonding member 200 include solder materials such as AuSn, SnAgCu, SnCu, and SnZnBi. As a method of arranging the conductive joining member 200, printing and coating using a mask plate, dispensing using a dispensing nozzle, and the like can be used. The conductive joining member 200 is preferably arranged at 50% to 100% with respect to the respective areas of the first land L1m and the second land L2m.

In the case of the first opening R1m deviated from the predetermined position, the sizes of the first land L1m and the second land L2m are different, but even in such a case, the first opening R1 formed at the predetermined position The same amount of conductive joining members 200 as in the case of is arranged. Further, at this time, although it depends on the amount of deviation, a part of the conductive joining member may be arranged outside the first opening R1m, that is, on the insulating film 40.

Next, the wiring board 10 m on which the conductive joining member 200 is arranged is placed on the support base of the mounter device on which the light emitting device is mounted. Above the support base, a camera and a sensor that recognize the positions of the reference mark Mm and the land (first land L1m, second land L2m) are arranged. Here, the X coordinate (X1 or X2) of the position of the first side M1m and the second side M2m of the reference mark Mm is read, and the X coordinate is stored as the reference position in the first direction (X direction). Similarly, the Y coordinate (Y3 or Y4) of the position of the third side M3m and the fourth side M4m of the reference mark Mm is read, and the Y coordinate is stored as the reference position in the Y direction.

Next, the light emitting device 110 is picked up by vacuum suction using a nozzle or the like, and the light emitting device 110 is placed on the first land L1m and the second land L2m. At this time, in the first direction, the alignment is performed with reference to the X coordinate of the first side (left side) M1m or the second side (right side) M2m of the reference mark Mm. Further, with respect to the second direction (Y direction), the alignment is performed with reference to the Y coordinate of the third side (upper side) M3m or the fourth side (lower side) M4m of the reference mark Mm.

The wiring board 10 m on which the light emitting device 110 is placed is heated in the reflow furnace to melt the conductive joining member 200. The melting temperature is appropriately adjusted according to the material of the conductive joining member 200. When the conductive bonding member 200 melts, the light emitting device 110 causes the support member 112 between the connection terminals 113 of the light emitting device 110 to be placed on the first exposed portion E1 m of the wiring board 10 m in the X direction due to the self-alignment effect. The light emitting device 110 moves so as to be positioned. Further, in the Y direction, the center of each connection terminal 113 of the light emitting device 110 is arranged on the center of the first land L1m and the second land L2m.

Similarly, the connector 120 is also mounted. After that, by cutting between the first region 11 and the second region 12, the light emitting module 100 shown in FIGS. 4A to 4C can be obtained.

In the obtained light emitting module 100, as shown in FIGS. 4A and 4B, the center of the light emitting device 110 and the center of the first opening R1m are deviated from each other in the X direction. A support member 112 between the connection terminals 113 of the light emitting device 110 is arranged on the first exposed portion E1 m of the wiring board 10 m.

In the Y direction, as shown in FIGS. 4A and 4C, the center of the light emitting device 110 and the center of the first opening R1m coincide with each other.

10, 10 m ... Wiring board 11 ... First area (area to be a light emitting module)
12 ... 2nd region 13 ... Through hole 20 ... Base material E1, E1m ... 1st exposed part E11, E11m ... 1st side (left side) of the 1st exposed part
E12, E12m ... The second side (right side) of the first exposed part
E13, E13m ... Third side (upper side) of the first exposed part
E14, E14m ... 4th side (lower side) of the 1st exposed part
E2, E2m ... 2nd exposed part E21, E22m ... 1st side (left side) of the 2nd exposed part
E22, E22m ... The second side (right side) of the second exposed part
E23, E23m ... Third side (upper side) of the second exposed part
E24, E24m ... 4th side (lower side) of the 2nd exposed part
E3, E3m ... 3rd exposed part E31, E31m ... 1st side (left side) of the 3rd exposed part
E32, E32m ... The second side (right side) of the third exposed part
E33, E33m ... Third side (upper side) of the third exposed part
E34, E34m ... 4th side (lower side) of the 3rd exposed part
E4 ... 4th exposed portion 30 ... Metal film L, La, Lm ... Land L1, L1a, L1b, L1m ... 1st land
L11, L11m ... The first side (left side) of the first land
L12, L12m ... The second side (right side) of the first land
L13, L13m ... Third side (upper side) of the first land
L14, L14m ... 4th side (lower side) of the 1st land
L2, L2a, L2b, L2m ... 2nd land
L21, L21m ... 1st side (left side) of the 2nd land
L22, L22m ... The second side (right side) of the second land
L23, L23m ... Third side (upper side) of the second land
L24, L24m ... 4th side (lower side) of the 2nd land
M, Mm, Ma, Mb ... Reference mark M1, M1m ... First side (left side) of the first reference mark
M2, M2m ... The second side (right side) of the first reference mark
M3, M3m ... Third side (upper side) of the first reference mark
M4, M4m ... 4th side (lower side) of the 1st reference mark
40, 40a ... Insulating films R1, R1a, R1b, R1m ... First opening R11, R11m ... First side (left side) of the first opening
R12, R12m ... The second side (right side) of the first opening
R13, R13m ... Third side (upper side) of the first opening
R14, R14m ... Fourth side (lower side) of the first opening
R2, R2m, R2a, R2b ... 2nd opening R21, R21m ... 1st side (left side) of the 2nd opening
R22, R22m ... The second side (right side) of the second opening
R23, R23m ... Third side (upper side) of the second opening
R24, R24m ... Fourth side (lower side) of the second opening
100 ... Light emitting module 110 ... Electronic component (light emitting device)
111 ... Package 112 ... Support member 113 ... Connection terminal 114 ... Semiconductor light emitting element 115 ... Sealing member 120 ... Electronic component (connector)
200 ... Conductive joining member

Claims (5)

A wiring board comprising a base material, a metal film arranged on the upper surface of the base material, and an insulating film covering a part of the metal film.
The metal film has a pair of lands on which electronic components are mounted and a reference mark used when mounting the electronic components.
The insulating film includes a first opening in which the land is exposed and a second opening in which the reference mark is exposed.
The land includes a first land and a second land arranged side by side in the X direction.
In the first opening, the first exposed portion of the base material is exposed between the first land and the second land.
In the second opening, the second exposed portion and the third exposed portion sandwiching the reference mark are exposed along the X direction.
A wiring board in which the width of the second opening in the X direction is larger than the width of the reference mark, and the width of the second opening in the Y direction orthogonal to the X direction is smaller than the width of the reference mark. The width of the second opening in the X direction is at least twice the length of the reference mark when the amount of the second opening deviating from the predetermined position in the X direction is 100 μm at the maximum. The wiring board according to claim 1, which is the width to which the width is added. The wiring board according to claim 1 or 2, wherein the length of the reference mark in the X direction is 500 μm to 2 mm. When the amount of the second opening deviating from the predetermined position in the Y direction is 100 μm at the maximum, the length of the metal film including the portion covered with the insulating film and which can serve as the reference mark is the length in the Y direction. The wiring board according to any one of claims 1 to 3, which is 10 μm or more larger than the length of the second opening in the Y direction. The wiring board according to any one of claims 1 to 4.
A light emitting device mounted on the wiring board and
Luminous module with.

Images