Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JP6927732B2 - Method for producing irregularly shaped silica particles - Google Patents
[go: Go Back, main page]

JP6927732B2 - Method for producing irregularly shaped silica particles - Google Patents

Method for producing irregularly shaped silica particles Download PDF

Info

Publication number
JP6927732B2
JP6927732B2 JP2017077872A JP2017077872A JP6927732B2 JP 6927732 B2 JP6927732 B2 JP 6927732B2 JP 2017077872 A JP2017077872 A JP 2017077872A JP 2017077872 A JP2017077872 A JP 2017077872A JP 6927732 B2 JP6927732 B2 JP 6927732B2
Authority
JP
Japan
Prior art keywords
particles
deformed
gel
silica
porous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017077872A
Other languages
Japanese (ja)
Other versions
JP2018177576A (en
Inventor
達也 向井
達也 向井
瞬 田中
瞬 田中
勇樹 三輪
勇樹 三輪
田中 哲也
哲也 田中
祐二 俵迫
祐二 俵迫
中山 和洋
和洋 中山
小松 通郎
通郎 小松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JGC Catalysts and Chemicals Ltd
Original Assignee
JGC Catalysts and Chemicals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JGC Catalysts and Chemicals Ltd filed Critical JGC Catalysts and Chemicals Ltd
Priority to JP2017077872A priority Critical patent/JP6927732B2/en
Publication of JP2018177576A publication Critical patent/JP2018177576A/en
Application granted granted Critical
Publication of JP6927732B2 publication Critical patent/JP6927732B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Silicon Compounds (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Description

本発明は、研磨材として好適な大きさの粒子径と強度を有する異形シリカ粒子の製造方法に関する。 The present invention relates to a method for producing deformed silica particles having a particle size and strength suitable for an abrasive.

Siウエハ、ガラスHD、アルミHDなどの基材用の高速研磨用砥粒としては、ダイヤモンド砥粒やαアルミナなどのような硬い結晶の砥粒が用いられている。しかし、これらの硬い砥粒は、研磨速度は高いが、破砕面をもった異形状の粒子であり、粒度分布の制御も困難なため粗大な粒子を含む場合が多く、研磨面に深いスクラッチを生じて、その後の仕上げ研磨工程に負荷がかかり、結局、生産性を低下させることがあった。 As the abrasive grains for high-speed polishing for substrates such as Si wafers, glass HD, and aluminum HD, abrasive grains of hard crystals such as diamond abrasive grains and α-alumina are used. However, although these hard abrasive grains have a high polishing rate, they are irregularly shaped particles having a crushed surface, and since it is difficult to control the particle size distribution, they often contain coarse particles, which causes deep scratches on the polished surface. As a result, the subsequent finish polishing process is overloaded, which may eventually reduce productivity.

そこで、硬度は低いが、鋭い破砕面を持たない非晶質の粒子径の大きな異形シリカ粒子を用いれば、一次径が大きいことによる研磨基板に対する接触面積の増加と異形による動的な接触面積(Feret径)の増加により、高い研磨速度が得られる効果が期待できる。 Therefore, if amorphous silica particles with a large particle size, which have low hardness but do not have a sharp crushed surface, are used, the contact area with the polished substrate increases due to the large primary diameter, and the dynamic contact area due to the deformation ( By increasing the Feret diameter), the effect of obtaining a high polishing speed can be expected.

研磨材に適する粒子径を有する異形シリカ粒子を調製する方法として、水ガラスなどから調製した異形のシード粒子に珪酸液を添加して粒子径を大きく成長させる方法が従来から知られている(特許文献1)。 As a method for preparing deformed silica particles having a particle size suitable for an abrasive, a method of adding a silicic acid solution to a deformed seed particle prepared from water glass or the like to grow a large particle size has been conventionally known (patented). Document 1).

特許第5127452号公報Japanese Patent No. 5127452

ハードディスクや半導体の製造プロセスでは、基板を平坦化させるために、研磨が製造プロセスに適用されている。研磨時にはシリカやセリアなどの砥粒を水に分散させ、研磨性能を制御するためにケミカル成分を添加した、いわゆる研磨スラリーが用いられている。特に砥粒は研磨性能に大きな影響を及ぼすことが知られており、砥粒に求められる性能として、高い研磨速度でかつ研磨面にスクラッチなどのディフェクトがない事が挙げられる。 In the manufacturing process of hard disks and semiconductors, polishing is applied to the manufacturing process in order to flatten the substrate. At the time of polishing, so-called polishing slurry in which abrasive grains such as silica and ceria are dispersed in water and a chemical component is added to control the polishing performance is used. In particular, it is known that abrasive grains have a great influence on polishing performance, and the performance required for abrasive grains is that the polishing speed is high and there is no defect such as scratches on the polished surface.

高い研磨速度を得る方法として、大きな粒子径の砥粒を使用する事が一般的であるが、粒子径が大きくなり過ぎると粒子個数が減少するため逆に研磨速度が低下し、さらにスクラッチも増加する傾向にある。そこでスクラッチが発生せず高い研磨速度を得るために、砥粒を非球形とする方法が検討されており、異形形状の粒子とすることで高い研磨速度が得られる事が分かっている。 As a method of obtaining a high polishing rate, it is common to use abrasive grains having a large particle size, but if the particle size becomes too large, the number of particles decreases, so that the polishing rate decreases and scratches also increase. Tend to do. Therefore, in order to obtain a high polishing rate without causing scratches, a method of making the abrasive grains non-spherical has been studied, and it is known that a high polishing rate can be obtained by using irregularly shaped particles.

異形シリカ粒子を得る方法として、水硝子を原料として核生成時にシリカ粒子を凝集させる方法が知られているが、この方法では粒子径が100nm以上の異形シリカ粒子を得ることは困難であった。また、この方法で得られるような粒子径100nm以下の異形シリカ粒子をシード粒子として用い、珪酸液を添加して粒子径を大きく成長させる方法では、粒子径が200nm以上となるように珪酸液を使用すると、シード粒子は球状又は略球状に成長するため、異形のシード粒子を異形のまま成長させて、比較的大きな異形シリカ粒子を得ることは困難であった。 As a method for obtaining deformed silica particles, a method of aggregating silica particles during nucleation using water glass as a raw material is known, but it has been difficult to obtain deformed silica particles having a particle size of 100 nm or more by this method. Further, in a method in which irregularly shaped silica particles having a particle diameter of 100 nm or less as obtained by this method are used as seed particles and a silicic acid solution is added to grow the particle size to a large size, the silicic acid solution is prepared so that the particle size is 200 nm or more. When used, the seed particles grow spherically or substantially spherically, so that it is difficult to grow the deformed seed particles in a deformed state to obtain relatively large deformed silica particles.

また、本願発明者らが異形シリカ粒子を調製する別の方法として、湿式シリカなどを粉砕することにより異形シリカ粒子を得る方法を検討したところ、異形シリカ粒子は得られたものの、ゲル構造の湿式シリカからなる異形シリカ粒子は、粉砕によって粒子径や粒度分布制御を行うには、その粒子強度が弱く、また得られた異形シリカ粒子は、同じく粒子強度が弱いため、研磨粒子として使用した場合、必要な研磨速度を得ることができなかった。 Further, as another method for preparing the deformed silica particles, the inventors of the present application examined a method for obtaining the deformed silica particles by pulverizing wet silica or the like, and although the deformed silica particles were obtained, the wet type having a gel structure was obtained. The deformed silica particles made of silica have a weak particle strength in order to control the particle size and particle size distribution by pulverization, and the obtained deformed silica particles also have a weak particle strength. Therefore, when used as abrasive particles, The required polishing rate could not be obtained.

本発明において、シード粒子として、従来の水ガラスから得られた異形シード粒子に代えて、多孔質シリカゲルを特定の条件で解砕し得られた異形多孔質ゲルからなる粒子を用い、珪酸液を加えて該シード粒子を成長させてなる異形シリカ粒子の製造方法が検討された。この異形多孔質ゲルからなる粒子は、柔らかい多孔質のシリカゲルをビーズミルで、例えば、pH8.0〜11.5のアルカリ性下で平均粒子径が150nmから400nmになるまで湿式解砕して得られたものであり、粗大粒子が殆ど無く、比較的粒度の揃ったものであり、原料の多孔質シリカゲルの有する細孔構造を概ね保持したものである。 In the present invention, as the seed particles, instead of the deformed seed particles obtained from the conventional water glass, particles made of a deformed porous gel obtained by crushing porous silica gel under specific conditions are used to prepare a silicic acid solution. In addition, a method for producing irregularly shaped silica particles obtained by growing the seed particles was studied. The particles made of this irregularly shaped porous gel were obtained by wet-crushing soft porous silica gel with a bead mill, for example, under alkaline pH of 8.0 to 11.5 until the average particle size became 150 nm to 400 nm. It has almost no coarse particles, has a relatively uniform particle size, and generally retains the pore structure of the raw material porous silica gel.

このような異形多孔質ゲルからなる粒子をシード粒子として用い、珪酸液の共存下でシード粒子を成長させると、シリカ表面に沈着する珪酸はシード粒子の細孔(凹部)を優先的に埋めるため、該シード粒子を異形のまま成長させることができ、しかも珪酸がシード粒子内部の細孔を埋めることにより、得られた異形シリカ粒子の粒子強度が高められる。また、シード粒子として粗大粒子の少ない異形多孔質ゲルを用いているので、得られた異形シリカ粒子は粗大粒子を殆ど含まない。この異形シリカ粒子を研磨粒子として使用すると、研磨速度が比較的速く、かつ、研磨面上でのスクラッチ(線条痕)の発生が大幅に抑制することを見出した。 When the particles made of such a deformed porous gel are used as seed particles and the seed particles are grown in the coexistence of a silicic acid solution, the silicic acid deposited on the silica surface preferentially fills the pores (recesses) of the seed particles. The seed particles can be grown in a deformed state, and the silicic acid fills the pores inside the seed particles to increase the particle strength of the obtained deformed silica particles. Further, since the deformed porous gel having few coarse particles is used as the seed particles, the obtained deformed silica particles contain almost no coarse particles. It has been found that when these irregularly shaped silica particles are used as polishing particles, the polishing speed is relatively high and the generation of scratches (streak marks) on the polished surface is significantly suppressed.

本発明は、前記知見に基づき、多孔質のシリカゲルを解砕してなる異形多孔質ゲルからなる粒子をシード粒子にし、珪酸液を加えて該シード粒子を成長させる方法を用いることによって、研磨材として好適な大きさの粒子径と強度を有する異形シリカ粒子を効率よく製造する方法を提供する。なお、以下の説明において、珪酸液がシード粒子のシリカ表面に沈積し、溶解度差によって、粒子径に関与しない細孔と優先的に反応して該細孔が埋められながら、粒子外表面にシリカが沈着することで、粒子が成長することをビルドアップと云う。 Based on the above findings, the present invention uses a method in which particles made of a deformed porous gel obtained by crushing porous silica gel are used as seed particles, and a silicic acid solution is added to grow the seed particles. Provided is a method for efficiently producing irregularly shaped silica particles having a particle size and strength suitable for the above. In the following description, the silicic acid solution is deposited on the silica surface of the seed particles, and due to the difference in solubility, it preferentially reacts with the pores that are not related to the particle size to fill the pores, and the silica is formed on the outer surface of the particles. The growth of particles by depositing silica is called build-up.

本発明の製造方法は、下記工程a〜cを含むことを特徴とする異形シリカ粒子の製造方法であり、下記工程a〜cの構成によって従来の前記課題を解決した製造方法である。
(工程a) 多孔質シリカゲルをアルカリ性下で湿式解砕して異形多孔質ゲルからなる粒子を含む溶液にする工程
(工程b) 前記異形多孔質ゲルからなる粒子を含む溶液にアルカリ性下で珪酸液を添加して加温し、前記異形多孔質ゲルからなる粒子の細孔を前記珪酸との反応によって埋めながら異形のまま粒子を成長させて異形シリカ粒子にする工程、
(工程c) 成長した異形シリカ粒子を回収する工程。
The production method of the present invention is a method for producing deformed silica particles, which comprises the following steps a to c, and is a production method that solves the above-mentioned conventional problems by the configuration of the following steps a to c.
(Step a) A step of wet-crushing porous silica gel under alkaline conditions to obtain a solution containing particles composed of a deformed porous gel.
(Step b) A siliceous solution is added to a solution containing particles made of the deformed porous gel under alkaline conditions to heat the solution, and the pores of the particles made of the deformed porous gel are filled by reaction with the silicic acid to form a deformed shape. The process of growing the particles as they are into irregularly shaped silica particles,
(Step c) A step of recovering the grown irregularly shaped silica particles.

本発明の製造方法は、具体的には、
工程aにおいて、比表面積300〜800m/gの多孔質シリカゲルを平均粒子径150〜400nmの異形多孔質ゲルからなる粒子にし、
工程bにおいて、該異形多孔質ゲルからなる粒子の細孔を前記珪酸との反応によって埋めて該異形多孔質ゲルからなる粒子の比表面積を100m/g以下にすると共に、平均粒子径200〜500nmの異形シリカ粒子に成長させる前記異形シリカ粒子の製造方法である。
Specifically, the production method of the present invention
In step a, the porous silica gel having a specific surface area of 300 to 800 m 2 / g is made into particles made of a deformed porous gel having an average particle diameter of 150 to 400 nm.
In step b, the pores of the particles made of the deformed porous gel are filled by the reaction with the silica acid to reduce the specific surface area of the particles made of the deformed porous gel to 100 m 2 / g or less, and the average particle diameter is 200 to 200 to This is a method for producing the deformed silica particles, which are grown into the deformed silica particles having a diameter of 500 nm.

また、本発明の製造方法は、具体的には、
工程aにおいては、多孔質シリカゲルをpH8.0〜11.5のアルカリ性下で湿式解砕して異形多孔質ゲルからなる粒子を含む溶液する。前記pH範囲のアルカリ性下で湿式粉砕することによって、多孔質シリカゲルを構成する粒子間のネック部分のシリカを溶解せしめることで解砕の進行を促進すると同時に、粗大粒子は優先的に解砕される。また解砕された粒子は溶液のpHが高いので負の電荷が付与されて安定化し、再凝集が起こらないので、新たな粗大粒子の生成が起こり難いため、粗大粒子を殆ど含まない異形多孔質ゲルからなる粒子を含む溶液にすることができる。
工程bにおいては、前記異形多孔質ゲルからなる粒子を含む溶液のSiO濃度を1〜10質量%にし、60℃〜170℃に加温し、pH9〜12.5のアルカリ性下で、珪酸液を連続的または断続的に添加して、前記異形多孔質ゲルからなる粒子の細孔を珪酸との反応によって埋めて、該粒子の比表面積を減少させると共に、粒子を異形のまま成長させる。
工程cにおいては、成長した異形シリカ粒子を含む溶液を濃縮して該異形シリカ粒子を回収する。
Further, specifically, the production method of the present invention is described.
In step a, the porous silica gel is wet-crushed under alkalinity of pH 8.0 to 11.5 to prepare a solution containing particles composed of a deformed porous gel. By wet pulverization under alkaline conditions in the pH range, the silica in the neck portion between the particles constituting the porous silica gel is dissolved to promote the progress of pulverization, and at the same time, the coarse particles are preferentially pulverized. .. In addition, since the pH of the solution is high, the crushed particles are given a negative charge to stabilize them, and reaggregation does not occur, so that new coarse particles are unlikely to be generated. It can be a solution containing particles of gel.
In step b, the SiO 2 concentration of the solution containing the particles of the irregularly shaped porous gel is adjusted to 1 to 10% by mass, heated to 60 ° C. to 170 ° C., and a silicic acid solution under alkaline pH of 9 to 12.5. Is continuously or intermittently added to fill the pores of the particles made of the deformed porous gel by reaction with silicic acid to reduce the specific surface area of the particles and grow the particles in a deformed state.
In step c, the solution containing the grown deformed silica particles is concentrated to recover the deformed silica particles.

また、本発明の製造方法は、更に具体的には
工程bにおいて、珪酸液の添加量が、異形多孔質ゲルからなる粒子を含む溶液のSiOモル濃度に対して該珪酸液のSiOモル濃度が2〜5モル倍になる範囲である前記異形シリカ粒子の製造方法である。
The manufacturing method of the present invention, in step b and more specifically, the addition amount of the silicic acid solution is, SiO 2 moles of該珪acid liquid to SiO 2 molar concentration of the solution containing the particles consisting of irregular porous gel This is a method for producing the deformed silica particles whose concentration is in the range of 2 to 5 mol times.

さらに、本発明は、前記何れかの製造方法によって得られた異形シリカ粒子を含む研磨砥粒分散液を含む。 Further, the present invention includes a polishing abrasive grain dispersion liquid containing deformed silica particles obtained by any of the above-mentioned production methods.

本発明の製造方法は、多孔質シリカゲルをアルカリ性下で湿式解砕して異形多孔質ゲルからなる粒子を含む溶液にし、この異形多孔質ゲルからなる粒子をシード粒子として用いることによって、珪酸液を添加すると、珪酸液がシード粒子の細孔と優先的に反応して該細孔を埋めながら粒子が成長し、珪酸液は細孔との反応にも消費されるので、シード粒子を異形のまま大きく成長させることができる。さらに、粒子の細孔が珪酸との反応によって埋められることによって比表面積が低下して粒子の強度が上がる。この結果、研磨材として好適な粒子径と強度を有する異形シリカ粒子を得ることができる。 In the production method of the present invention, the porous silica gel is wet-crushed under alkaline conditions to form a solution containing particles made of a deformed porous gel, and the particles made of the deformed porous gel are used as seed particles to prepare a silicic acid solution. When added, the silica gel solution preferentially reacts with the pores of the seed particles to grow the particles while filling the pores, and the silica gel solution is also consumed in the reaction with the pores, so that the seed particles remain deformed. It can grow big. Further, the pores of the particles are filled by the reaction with silicic acid, so that the specific surface area is reduced and the strength of the particles is increased. As a result, irregularly shaped silica particles having a particle size and strength suitable for an abrasive can be obtained.

本発明に製造方法によって得られる異形シリカ粒子は、研磨材として好適な粒子径と強度を有しているので、研磨材として用いたときに、研磨速度が早く、砥粒の基材への突き刺さりがなく、スクラッチは後工程の二次研磨工程で容易にリカバリーできる程度なので研磨作業の効率を格段に高めることができる。 Since the deformed silica particles obtained by the production method in the present invention have a particle size and strength suitable for an abrasive, the polishing speed is high when used as an abrasive, and the abrasive grains pierce the base material. Since there is no scratch and the scratch can be easily recovered in the secondary polishing process of the subsequent process, the efficiency of the polishing work can be significantly improved.

実施例1の異形多孔質ゲルからなる粒子のSEM写真SEM photograph of particles made of irregularly shaped porous gel of Example 1 実施例1の製造した異形シリカ粒子のSEM写真SEM photograph of the deformed silica particles produced in Example 1

以下、本発明の製造方法を具体的に説明する。
本発明の製造方法は、多孔質シリカゲルをアルカリ性下で湿式解砕して異形多孔質ゲルからなる粒子を含む溶液にする工程a、前記異形多孔質ゲルからなる粒子を含む溶液にアルカリ性下で珪酸液を添加して加温し、前記異形多孔質ゲルからなる粒子の細孔を前記珪酸との反応によって埋めながら異形のまま粒子を成長させて異形シリカ粒子にするビルドアップの工程b、成長した異形シリカ粒子を回収する工程cを有することを特徴とする異形シリカ粒子の製造方法である。
Hereinafter, the production method of the present invention will be specifically described.
The production method of the present invention comprises the step a of wet crushing porous silica gel under alkaline conditions to obtain a solution containing particles made of deformed porous gel, and silicic acid under alkaline conditions in a solution containing particles made of the deformed porous gel. The build-up step b, in which the liquid was added and heated to grow the particles in the deformed shape while filling the pores of the particles made of the deformed porous gel by the reaction with the silicic acid to form the deformed silica particles, was grown. A method for producing deformed silica particles, which comprises a step c of recovering the deformed silica particles.

〔工程a〕
本発明の製造方法は、出発原料として多孔質シリカゲルを用いる。多孔質シリカゲルを用いることによって、添加した珪酸が異形多孔質ゲルからなる粒子の細孔と反応して該細孔が埋められながら粒子の外表面に沈着するシリカが粒子の成長を促す。このビルドアップによって、粒子外表面の凸部はより外径の増加に寄与し、凹部は外形への寄与が小さいので、成長粒子の強度が高くなると共に粒子の異形が崩れるのが抑制され、粒子径の大きな異形シリカ粒子を製造することができる。
[Step a]
The production method of the present invention uses porous silica gel as a starting material. By using porous silica gel, the added silicic acid reacts with the pores of the particles made of the irregularly shaped porous gel, and the silica deposited on the outer surface of the particles while filling the pores promotes the growth of the particles. By this build-up, the convex part of the outer surface of the particle contributes to the increase of the outer diameter, and the concave part contributes less to the outer shape. It is possible to produce irregularly shaped silica particles having a large diameter.

多孔質シリカゲルは解砕され易いゲルが好ましく、例えば、水硝子法のゲルを洗浄したウエットのヒドロゲルや、アルコキシド法によるゲルなどが好ましい。アルコキシド法によるゲルは脱水縮合する水酸基が少ないため、その乾燥パウダーは軟らかく、生産性の良い乾燥パウダーを用いることができる。多孔質シリカゲルを解砕して得られる異形多孔質ゲルからなる粒子の粒度分布は一定範囲に制御されていることが好ましく、解砕し難い大きなゲルの塊であると、解砕に時間がかかり、粒度分布が広くなるので好ましくない。 The porous silica gel is preferably a gel that is easily crushed, and for example, a wet hydrogel obtained by washing a gel of the water glass method, a gel of the alkoxide method, or the like is preferable. Since the gel obtained by the alkoxide method has few hydroxyl groups that dehydrate and condense, the dry powder is soft and highly productive dry powder can be used. It is preferable that the particle size distribution of the particles composed of the irregularly shaped porous gel obtained by crushing the porous silica gel is controlled within a certain range, and if it is a large gel mass that is difficult to crush, it takes time to crush it. , It is not preferable because the particle size distribution becomes wide.

多孔質シリカゲルの多孔性を示すパラメーターとして細孔容積や比表面積が挙げられ、細孔がオープンな細孔の場合は細孔径が同じであれば、比表面積と細孔容積は概ね比例関係にある。なお、本発明では多孔質シリカゲルの多孔性を示すパラメーターとして比表面積を用いた。 Porosity and specific surface area are examples of parameters indicating the porosity of porous silica gel. In the case of pores with open pores, if the pore diameters are the same, the specific surface area and the pore volume are generally in a proportional relationship. .. In the present invention, the specific surface area was used as a parameter indicating the porosity of the porous silica gel.

多孔質シリカゲルは、比表面積が300〜800m/gの範囲が好ましい。比表面積が300m/gより小さいと、該ゲルの細孔が少ないので、解砕して得た異形多孔質ゲルからなる粒子を含む溶液に珪酸液を添加したときに、異形多孔質ゲルからなる粒子の細孔に浸透する珪酸の量が少ないので、該細孔が珪酸との反応によって埋められ難く、添加した珪酸液は粒子を丸く成長させるように消費され、異形を保ち難くなる。また、比表面積が800m/gより大きいと強度が弱すぎ、解砕して得た異形多孔質ゲルからなる粒子内部を珪酸との反応によってビルドアップして部分的に埋めても十分な強度の異形シリカ粒子を得ることが難しい。 The porous silica gel preferably has a specific surface area in the range of 300 to 800 m 2 / g. When the specific surface area is smaller than 300 m 2 / g, the pores of the gel are small. Since the amount of silicic acid that permeates the pores of the particles is small, it is difficult for the pores to be filled by the reaction with silicic acid, and the added silicic acid solution is consumed so as to grow the particles round, making it difficult to maintain the irregular shape. Further, if the specific surface area is larger than 800 m 2 / g, the strength is too weak, and the strength is sufficient even if the inside of the particles made of the deformed porous gel obtained by crushing is built up by the reaction with silicic acid and partially filled. It is difficult to obtain irregularly shaped silica particles.

前記多孔質シリカゲルを解砕して異形多孔質ゲルからなる粒子にする。比表面積が300〜800m/g程度の比較的柔らかいシリカゲルをビーズミルなどの強いシェアの下で変形と解砕を同時に行うことによって、異形多孔質ゲルからなる粒子を調製する。解砕は、例えば、ガラスメジアを入れたサンドミル粉砕機やビーズミルなどを用いると良い。解砕は複数回行うのが好ましい。 The porous silica gel is crushed into particles made of a deformed porous gel. Particles made of a deformed porous gel are prepared by simultaneously deforming and crushing relatively soft silica gel having a specific surface area of about 300 to 800 m 2 / g under a strong share such as a bead mill. For crushing, for example, a sand mill crusher containing a glass medium or a bead mill may be used. Crushing is preferably performed multiple times.

粒子の異形は異形度によって評価することができる。異形度はディスク式遠心式粒度分布測定装置で測定された粒子の重量平均粒子径[nm]を、粒子の比表面積[m/g]から計算される等価球換算粒子径[nm]で割ることによって表わされる。本発明の異形シリカ粒子は異形度が1.5〜10.0の範囲であるのが好ましい。なお、等価球換算粒子径(r)は、BET法により測定される比表面積(SA)と、粒子の密度(ρ)[シリカの場合ρ=2.2]を用いて次式から算定される。r=6000/(SA×ρ) The deformation of particles can be evaluated by the degree of deformation. The degree of deformation is obtained by dividing the weight average particle size [nm] of the particles measured by the disk-type centrifugal particle size distribution measuring device by the equivalent sphere-equivalent particle size [nm] calculated from the specific surface area [m 2 / g] of the particles. It is represented by. The deformed silica particles of the present invention preferably have a degree of deformity in the range of 1.5 to 10.0. The equivalent sphere-equivalent particle size (r) is calculated from the following equation using the specific surface area (SA) measured by the BET method and the particle density (ρ) [ρ = 2.2 in the case of silica]. .. r = 6000 / (SA × ρ)

本発明において、異形多孔質ゲルからなる粒子の平均粒子径と、粒子成長後の異形シリカ粒子の平均粒子径は、重量換算粒子径分布の平均粒子径を意味する。(本願においては、この重量換算粒子径分布の平均粒子径を「重量平均粒子径」とも表記する)。重量換算粒子径分布の平均粒子径の求め方については後記した。 In the present invention, the average particle size of the particles made of the deformed porous gel and the average particle size of the deformed silica particles after the particle growth mean the average particle size of the weight-equivalent particle size distribution. (In the present application, the average particle size of this weight-equivalent particle size distribution is also referred to as "weight average particle size"). The method of obtaining the average particle size of the weight-equivalent particle size distribution is described later.

通常、ビーズミルなどで粉体を粉砕する場合には、粉砕時間に比例して粉体の粒子径が小さくなるが、シリカゲルのような高表面積の柔らかいものは、粉砕時間に対する粒子径の変化が緩慢であり、光散乱方式で測定された粒子径が200nm程度の異形状の粒子に砕かれ、解砕前の比表面積を保ったままかなり多くの細孔を含んだ粗な構造を有している。従って、この異形シリカ粒子のまま研磨材として用いても、強度不足のため崩れやすく、非常に低い研磨速度しか得られない。そこで、本発明の製造方法では、異形多孔質ゲルからなる粒子を含む溶液に珪酸液を添加して異形多孔質ゲルからなる粒子内部の細孔を珪酸液でビルドアップして埋めることによって粒子の強度を高めている。 Normally, when powder is crushed with a bead mill or the like, the particle size of the powder decreases in proportion to the crushing time, but for soft materials with a high specific surface area such as silica gel, the change in particle size with respect to the crushing time is slow. It is crushed into irregularly shaped particles with a particle size of about 200 nm measured by the light scattering method, and has a coarse structure containing a considerable number of pores while maintaining the specific surface area before crushing. .. Therefore, even if the deformed silica particles are used as an abrasive as they are, they tend to collapse due to insufficient strength, and only a very low polishing rate can be obtained. Therefore, in the production method of the present invention, a siliceous solution is added to a solution containing particles made of a deformed porous gel, and the pores inside the particles made of the deformed porous gel are built up and filled with the siliceous solution to fill the particles. The strength is increased.

多孔質シリカゲルの解砕はアルカリ性下で湿式解砕するのが良く、アルカリ性はpH8.0〜11.5の範囲が好ましい。pHがアルカリ領域より下がるにつれて徐々にマイナスの電位が下がり、中性領域〜酸性領域では不安定になるため、解砕により生じた粒子が安定に存在できずに直ぐ凝集してしまう。また、pHが11.5以上であるとシリカの溶解が促進されるため、やはり凝集するので好ましくない。前記湿式解砕時のpHは好適には、8.5〜11.0の範囲が推奨される。 The porous silica gel is preferably crushed by wet crushing under alkaline conditions, and the alkalinity is preferably in the range of pH 8.0 to 11.5. As the pH drops below the alkaline range, the negative potential gradually drops and becomes unstable in the neutral to acidic range, so that the particles generated by crushing cannot exist stably and immediately aggregate. Further, when the pH is 11.5 or more, the dissolution of silica is promoted, which is also not preferable because it aggregates. The pH at the time of wet crushing is preferably in the range of 8.5 to 11.0.

異形多孔質ゲルからなる粒子の平均粒子径は150〜400nmの範囲が好ましい。該粒子の平均粒子径が150nmより小さいと、珪酸液を添加して粒子を成長させても、研磨材に適する大きさの粒子径にするのが難しい。また、異形多孔質ゲルからなる粒子の平均粒子径が400nmより大きいと、研磨材に適する粒子径を超えるので好ましくない。さらに、平均粒子径が400nmを越える粗大な粒子はスクラッチの原因となるため好ましくない。異形多孔質ゲルに含まれる粗大粒子を除去することを目的として、遠心分離を行っても構わない。前記異形多孔質ゲルからなる粒子の平均粒子径は好ましくは、160〜350nmの範囲が推奨される。 The average particle size of the particles made of the irregularly shaped porous gel is preferably in the range of 150 to 400 nm. If the average particle size of the particles is smaller than 150 nm, it is difficult to obtain a particle size suitable for the abrasive even if the silicate solution is added to grow the particles. Further, if the average particle size of the particles made of the irregularly shaped porous gel is larger than 400 nm, it exceeds the particle size suitable for the abrasive, which is not preferable. Further, coarse particles having an average particle size of more than 400 nm are not preferable because they cause scratches. Centrifugation may be performed for the purpose of removing coarse particles contained in the irregularly shaped porous gel. The average particle size of the particles made of the deformed porous gel is preferably in the range of 160 to 350 nm.

解砕は大きさの異なるメジアで多段階に行うことにより、異形多孔質ゲルからなる粒子の粒度分布の広がりを抑えることができる。また、粒子径の調整もメジアの大きさを変えることによって制御することができる。 By performing the crushing in multiple stages with media of different sizes, it is possible to suppress the spread of the particle size distribution of the particles made of the irregularly shaped porous gel. Further, the adjustment of the particle size can also be controlled by changing the size of the media.

〔工程b〕
異形多孔質ゲルからなる粒子を含む溶液にアルカリ性下で珪酸液を添加して加温し、異形多孔質ゲルからなる粒子内部の細孔を珪酸との反応によって埋めると共に異形のまま粒子を成長させる。前記異形多孔質ゲルからなる粒子を含む溶液のSiO濃度は1〜10質量%の範囲が好ましい。異形多孔質ゲルからなる粒子を含む溶液のSiO濃度が1質量%より少ないと、得られる異形シリカ粒子を製造する効率が低下する。また、SiO2濃度が10質量%より多いと、得られる異形シリカ粒子の粒子成長が不均一になりやすいので好ましくない。
また異形多孔質ゲルの細孔を埋める別の方法として、異形多孔質ゲルを水熱処理しながら珪酸液を添加する方法も挙げられる。添加した珪酸液による細孔の穴埋めと同時に、異形多孔質ゲルの一部が溶解し、細孔を優先的に埋めるからである。
[Step b]
A silicic acid solution is added to a solution containing particles made of a deformed porous gel under alkaline conditions to heat the solution, and the pores inside the particles made of the deformed porous gel are filled by a reaction with silicic acid and the particles are grown in a deformed shape. .. The SiO 2 concentration of the solution containing the particles of the irregularly shaped porous gel is preferably in the range of 1 to 10% by mass. If the SiO 2 concentration of the solution containing the particles made of the deformed porous gel is less than 1% by mass, the efficiency of producing the obtained deformed silica particles is lowered. Further, if the SiO2 concentration is more than 10% by mass, the particle growth of the obtained deformed silica particles tends to be non-uniform, which is not preferable.
Further, as another method of filling the pores of the deformed porous gel, there is also a method of adding a silicic acid solution while hydrothermally treating the deformed porous gel. This is because at the same time as filling the pores with the added silicic acid solution, a part of the deformed porous gel dissolves and the pores are preferentially filled.

加温する温度は60℃〜170℃の範囲が好ましい。60℃より低いと異形多孔質ゲルからなる粒子の成長が遅く、170℃より高いと得られる異形シリカ粒子が球状になりやすいからである。前記加温する温度は、より好適には60℃〜100℃の範囲が推奨される。 The heating temperature is preferably in the range of 60 ° C to 170 ° C. This is because if the temperature is lower than 60 ° C., the growth of the particles made of the deformed porous gel is slow, and if the temperature is higher than 170 ° C., the obtained deformed silica particles tend to be spherical. The heating temperature is more preferably in the range of 60 ° C to 100 ° C.

異形多孔質ゲルからなる粒子を含む溶液に珪酸液を添加する時のpHは9〜12.5の範囲が好ましい。pHが9未満ではシリカの溶解度が低いため、過飽和度が著しく高くなり、添加した珪酸液は粒子成長に消費されずに微粒子として生成し易い。また負の電位も低くなるため、粒子が凝集し易くなるので好ましくない。また、pH12.5より高いとシリカの溶解が促進されるので好ましくない。 The pH when the silicic acid solution is added to the solution containing the particles of the irregularly shaped porous gel is preferably in the range of 9 to 12.5. When the pH is less than 9, the solubility of silica is low, so that the degree of supersaturation becomes extremely high, and the added silicic acid solution is not consumed for particle growth and is easily generated as fine particles. In addition, since the negative potential is also low, the particles tend to aggregate, which is not preferable. Further, if the pH is higher than 12.5, the dissolution of silica is promoted, which is not preferable.

異形多孔質ゲルからなる粒子を含む溶液は、必要に応じてpHを調整する。調整手段は格別に制限されるものではないが、通常はアルカリ性物質を添加して調整する。この様なアルカリ性物質の例としては、水酸化ナトリウム、水硝子などを挙げることができる。異形多孔質ゲルからなる粒子を含む溶液に珪酸液を添加する時のpHとして好適には、9.5〜12.0の範囲が推奨される。 The pH of the solution containing the particles of the irregularly shaped porous gel is adjusted as necessary. The adjusting means is not particularly limited, but it is usually adjusted by adding an alkaline substance. Examples of such alkaline substances include sodium hydroxide, water glass and the like. A suitable pH range of 9.5 to 12.0 is recommended when the silicic acid solution is added to the solution containing the particles of the irregularly shaped porous gel.

珪酸液の添加量は、前記異形多孔質ゲルからなる粒子を含む溶液のSiOモル濃度に対して該珪酸液のSiOモル濃度が2〜5モル倍になる範囲が好ましい。珪酸液の添加量が前記範囲より少ないと、得られる異形シリカ粒子の成長が不十分になり、異形シリカ粒子の製造効率が低下する。一方、珪酸液の添加量が前記範囲より多いと、未反応の珪酸残量が多くなるので好ましくない。珪酸液は連続的または断続的に添加することが望ましい。 The addition amount of the silicic acid solution is in the range of SiO 2 molar該珪acid liquid to SiO 2 molar concentration of the solution containing the particles consisting of the profiled porous gel is 2 to 5 times by mole are preferable. If the amount of the silicic acid solution added is less than the above range, the growth of the obtained deformed silica particles becomes insufficient, and the production efficiency of the deformed silica particles is lowered. On the other hand, if the amount of the silicic acid solution added is larger than the above range, the remaining amount of unreacted silicic acid increases, which is not preferable. It is desirable to add the silicic acid solution continuously or intermittently.

珪酸液は、異形多孔質ゲルからなる粒子の細孔を通じて粒子内部に浸透し、ビルドアップして該粒子の比表面積を小さくし、該粒子の強度を高める。異形多孔質ゲルからなる粒子の比表面積を100m/g以下、好ましくは比表面積15m/g〜50m/gの範囲にすることが望ましい。異形多孔質ゲルからなる粒子の比表面積が100m/gより大きいと得られる異形シリカ粒子の強度が不足し、研磨材として使用したときに崩れやすく研磨速度が遅くなる傾向がある。 The silicate liquid penetrates into the inside of the particles through the pores of the particles made of the irregularly shaped porous gel, and builds up to reduce the specific surface area of the particles and increase the strength of the particles. The specific surface area of the particles consisting of irregular porous gel 100 m 2 / g or less, it is desirable that preferably in the range of a specific surface area of 15m 2 / g~50m 2 / g. If the specific surface area of the particles made of the deformed porous gel is larger than 100 m 2 / g, the strength of the obtained deformed silica particles is insufficient, and when used as an abrasive, the particles tend to collapse and the polishing speed tends to be slow.

また、珪酸液は異形多孔質ゲルからなる粒子の表面に結合して粒子を成長させるので、異形を保ったままで粒子径の大きな異形シリカ粒子を得ることができる。粒子成長後の異形シリカ粒子の粒子径は平均粒子径200〜500nmが好ましい。 Further, since the silicic acid solution binds to the surface of the particles made of the deformed porous gel to grow the particles, it is possible to obtain the deformed silica particles having a large particle size while maintaining the deformed shape. The particle size of the deformed silica particles after the particle growth is preferably an average particle size of 200 to 500 nm.

〔工程c〕
成長した異形シリカ粒子を回収する。具体的には、例えば、成長した異形シリカ粒子を含む溶液を室温〜40℃程度に冷却し、限外ろ過膜などを用いて濃縮し、エバポレータなどを用いてさらに濃縮して残った異形シリカ粒子を回収すればよい。さらに粗大な粒子を除去するために、遠心分離してもよい。
[Step c]
Collect the grown variant silica particles. Specifically, for example, the solution containing the grown deformed silica particles is cooled to about room temperature to about 40 ° C., concentrated using an ultrafiltration membrane or the like, and further concentrated using an evaporator or the like, and the remaining deformed silica particles remain. Should be collected. Centrifugation may be performed to remove even coarser particles.

以下、本発明の実施例を比較例と共に示す。実施例および比較例において、比表面積および平均粒子径の測定、および研磨試験は以下のように行った。
〔窒素吸着法による比表面積の測定〕
シリカゾル50mlをHNOでpHを3.5に調整し、1−プロパノールを40ml加え、110℃で16時間乾燥した試料について、乳鉢で粉砕後、マッフル炉にて500℃、1時間焼成して測定用試料とした。そして、比表面積測定装置(ユアサアイオニクス製、型番マルチソーブ12)を用いて窒素吸着法(BET法)を用いて、窒素の吸着量からBET1点法により比表面積を算出した。
比表面積測定装置では、焼成後の試料0.5gを測定セルに取り、窒素30v%/ヘリウム70v%混合ガス気流中、300℃で20分間脱ガス処理を行い、その上で試料を上記混合ガス気流中で液体窒素温度に保ち、窒素を試料に平衡吸着させた。次いで、上記混合ガスを流しながら試料温度を徐々に室温まで上昇させ、その間に脱離した窒素の量を検出し、予め作成した検量線により試料中のシリカ微粒子の比表面積を算出した。
Hereinafter, examples of the present invention will be shown together with comparative examples. In the examples and comparative examples, the specific surface area and the average particle size were measured, and the polishing test was performed as follows.
[Measurement of specific surface area by nitrogen adsorption method]
Adjust the pH of 50 ml of silica sol to 3.5 with HNO 3 , add 40 ml of 1-propanol, and dry the sample at 110 ° C. for 16 hours. It was used as a sample for use. Then, the specific surface area was calculated from the amount of nitrogen adsorbed by the BET 1-point method using the nitrogen adsorption method (BET method) using a specific surface area measuring device (manufactured by Yuasa Ionics, model number Multisorb 12).
In the specific surface area measuring device, 0.5 g of the sample after firing is taken in a measuring cell, degassed in a mixed gas stream of 30 v% nitrogen / 70 v% helium at 300 ° C. for 20 minutes, and then the sample is subjected to the above mixed gas. The temperature was maintained at the liquid nitrogen temperature in the air stream, and nitrogen was equilibrium-adsorbed to the sample. Next, the sample temperature was gradually raised to room temperature while flowing the mixed gas, the amount of nitrogen desorbed during that period was detected, and the specific surface area of the silica fine particles in the sample was calculated from a calibration curve prepared in advance.

〔平均粒子径の測定〕
シリカ粒子分散液を0.5質量%ドデシル硫酸ナトリウム水溶液で希釈し、固形分濃度で2質量%としたものを、ディスク遠心式粒度分布測定装置(型番:DC24000UHR米国CPS instruments社製)に、0.1mlをシリンジで注入して、8%から24%のショ糖の密度勾配溶液中で18000rpmの条件で測定を行った。シリカヒドロゲルの解砕品(異形多孔質ゲルからなる粒子)については、重量換算粒子径分布の平均粒子径とした。また、この解砕品に珪酸液を添加してビルドアップして得られた異形シリカ粒子についても、重量換算粒度分布の平均粒子径とした。
[Measurement of average particle size]
The silica particle dispersion was diluted with a 0.5% by mass aqueous sodium dodecyl sulfate solution to a solid content concentration of 2% by mass, and the solution was applied to a disk centrifugal particle size distribution measuring device (model number: DC24000UHR, manufactured by CPS instruments, USA). .1 ml was injected with a syringe and measurements were taken at 18000 rpm in a density gradient solution of 8% to 24% sucrose. For the crushed silica hydrogel (particles made of irregularly shaped porous gel), the average particle size of the weight-equivalent particle size distribution was used. In addition, the deformed silica particles obtained by adding a silicic acid solution to this crushed product and building up were also used as the average particle size of the weight-equivalent particle size distribution.

〔研磨試験〕
被研磨基板
被研磨基板として、ハードディスク用ニッケルメッキしたアルミ基板(東洋鋼鈑社製ニッケルメッキサブストレート)を使用した。本基板はドーナツ形状の基板である(外径95mmφ、内径25mmφ、厚さ1.27mm)。
研磨試験
30%濃度の大粒子異形シリカ粒子にイオン交換水を添加して9%濃度の分散液344gを作製し、これに31%のH2O2を5.65g加えた後に10%の硝酸にてpHを1.5に調整して研磨スラリーを作製した。
上記被研磨基板を研磨装置(ナノファクター社製:NF300)にセットし、研磨パッド(ニッタ・ハース社製「SUBA−800」)を使用し、基板荷重0.35MPa、定盤回転数90rpm、ヘッド回転数60rpmで、研磨スラリーを20g/分の速度で供給しながら5分間研磨を行った。
研磨速度
研磨前後の研磨基板の重量差と研磨時間より研磨速度を算出した。
[Polishing test]
Substrate to be polished As the substrate to be polished, a nickel-plated aluminum substrate for hard disks (nickel-plated substrate manufactured by Toyo Kohan Co., Ltd.) was used. This substrate is a donut-shaped substrate (outer diameter 95 mmφ, inner diameter 25 mmφ, thickness 1.27 mm).
Polishing test 344 g of a 9% concentration dispersion was prepared by adding ion-exchanged water to 30% concentration large particle deformed silica particles, and 5.65 g of 31% H2O2 was added thereto, followed by pH with 10% nitric acid. Was adjusted to 1.5 to prepare a polishing slurry.
The above-mentioned substrate to be polished is set in a polishing device (Nanofactor Co., Ltd .: NF300), and a polishing pad (Nitta Haas Co., Ltd. "SUBA-800") is used, the substrate load is 0.35 MPa, the surface plate rotation speed is 90 rpm, and the head. Polishing was performed for 5 minutes at a rotation speed of 60 rpm while supplying a polishing slurry at a speed of 20 g / min.
Polishing speed The polishing speed was calculated from the weight difference of the polishing substrate before and after polishing and the polishing time.

〔実施例1〕
シリカヒドロゲルの調製
珪酸ナトリウム462.5gを水に溶解し、SiO換算で24重量%の珪酸ナトリウム水溶液を調整した後、pHが4.5となるように25重量%の硫酸を添加してシリカヒドロゲルを含む溶液を得た。このシリカヒドロゲル溶液を、恒温槽で21℃の温度に維持し、5.75時間静置して熟成を行った後、シリカヒドロゲルに含まれるSiOとしての珪素に対し、硫酸ナトリウムの含有量が0.05重量%となるまで純水で洗浄して精製シリカヒドロゲルを得た。この精製シリカヒドロゲルの濃度は、SiO含有量(濃度)が5重量%であった。また比表面積は600m/gであった。
シリカヒドロゲルの解砕
次に、2Lガラスビーカーにシリカヒドロゲル500gを入れ、4.8重量%NaOH水溶液を添加してpH10に調整した。これに0.25mmφのガラスメジアを1135g入れてサンドミル粉砕機にかけて解砕を行った。同様に数バッチ解砕を行い、4重量%の解砕ゲル(異形多孔質ゲルからなる粒子を含む溶液)が2000g得られた。異形多孔質ゲルからなる粒子の平均粒子径は184nmであった。SEM像を図1に示す。次にイオン交換水でシリカ濃度を2.76重量%に調整した解砕ゲル(異形多孔質ゲルからなる粒子を含む溶液)2716gを10Lのセパラブルフラスコに入れて攪拌しながら水酸化ナトリウム水溶液(濃度48質量%)を6.54g加え、pHを10.5に調整した。続いて、98℃に昇温して30分保持した。次に98℃に保持したまま、4.6重量%の珪酸液5380gを20時間かけて添加した後に更に1時間攪拌を継続して、シリカ粒子の調合液を得た。この調合液のpHは10.2であった。この調合液を約40℃まで冷却した後に、限外ろ過膜(旭化成製SIP1013)にてSiO濃度を12重量%まで濃縮した。
次にロータリーエバポレーターにてSiO2濃度を30重量%まで濃縮し、大粒子異形シリカ粒子を回収した。この異形シリカ粒子の平均粒子径は230nmであった。このシリカ粒子のSEM像を図2に示す。この異形シリカ粒子について研磨試験を行った。結果を表1に示す。
[Example 1]
Preparation of silica hydrogel 462.5 g of sodium silicate is dissolved in water , a 24 wt% sodium silicate aqueous solution is prepared in terms of SiO 2 , and then 25 wt% sulfuric acid is added so that the pH becomes 4.5 to obtain silica. A solution containing hydrogel was obtained. After maintaining this silica hydrogel solution at a temperature of 21 ° C. in a constant temperature bath and allowing it to stand for 5.75 hours for aging, the content of sodium sulfate is higher than that of silicon as SiO 2 contained in the silica hydrogel. Purified silica hydrogel was obtained by washing with pure water until it became 0.05% by weight. The concentration of the purified silica hydrogel was such that the SiO 2 content (concentration) was 5% by weight. The specific surface area was 600 m 2 / g.
Crushing of silica hydrogel Next, 500 g of silica hydrogel was placed in a 2 L glass beaker, and a 4.8 wt% NaOH aqueous solution was added to adjust the pH to 10. 1135 g of a 0.25 mmφ glass medium was added thereto and crushed by a sand mill crusher. Similarly, several batches of crushing were carried out to obtain 2000 g of a 4% by weight crushed gel (a solution containing particles composed of a deformed porous gel). The average particle size of the particles made of the irregularly shaped porous gel was 184 nm. The SEM image is shown in FIG. Next, 2716 g of a crushed gel (a solution containing particles composed of a deformed porous gel) whose silica concentration was adjusted to 2.76% by weight with ion-exchanged water was placed in a 10 L separable flask, and an aqueous sodium hydroxide solution (aqueous solution of sodium hydroxide) was stirred. A concentration of 48% by mass) was added in an amount of 6.54 g, and the pH was adjusted to 10.5. Subsequently, the temperature was raised to 98 ° C. and held for 30 minutes. Next, while maintaining the temperature at 98 ° C., 5380 g of a 4.6 wt% silicic acid solution was added over 20 hours, and then stirring was continued for another 1 hour to obtain a mixed solution of silica particles. The pH of this formulation was 10.2. After cooling this preparation to about 40 ° C., the SiO 2 concentration was concentrated to 12% by weight with an ultrafiltration membrane (Asahi Kasei SIP1013).
Next, the SiO2 concentration was concentrated to 30% by weight with a rotary evaporator, and large-sized irregularly shaped silica particles were recovered. The average particle size of the deformed silica particles was 230 nm. The SEM image of the silica particles is shown in FIG. A polishing test was performed on these irregularly shaped silica particles. The results are shown in Table 1.

〔実施例2〕
実施例1で得たシリカゲル500gを2Lのガラスーカーに入れて4.8重量%NaOH水溶液を添加してpH10に調整した。これに1.0mmφのジルコニアメジアを2390g入れてサンドミル粉砕機にかけて解砕を行った。同様に数バッチ解砕を行い、4重量%の解砕ゲル(異形多孔質ゲルからなる粒子を含む溶液)が2000g得られた。次にこの解砕ゲル500gに0.25mmφのガラスメジアを1135g加えて2段目の解砕を数バッチ行い、3.5重量%の解砕ゲル(異形多孔質ゲルからなる粒子を含む溶液)が1900g得られた。得られた異形多孔質ゲルからなる粒子の平均粒子径は230nmであった。その後の工程は実施例1と同様にして、得られた異形シリカ粒子について平均粒子径測定と研磨試験を行った。結果を表1に示す。
[Example 2]
500 g of silica gel obtained in Example 1 was placed in a 2 L glass-ker and a 4.8 wt% NaOH aqueous solution was added to adjust the pH to 10. 2390 g of 1.0 mmφ zirconia medium was added thereto and crushed by a sand mill crusher. Similarly, several batches of crushing were carried out to obtain 2000 g of a 4% by weight crushed gel (a solution containing particles composed of a deformed porous gel). Next, 1135 g of 0.25 mmφ glass medium was added to 500 g of this crushed gel to perform several batches of crushing in the second stage, and 3.5% by weight of the crushed gel (a solution containing particles composed of a deformed porous gel) was obtained. 1900 g was obtained. The average particle size of the particles made of the obtained irregularly shaped porous gel was 230 nm. In the subsequent steps, the average particle size was measured and the polishing test was performed on the obtained deformed silica particles in the same manner as in Example 1. The results are shown in Table 1.

〔実施例3〕
実施例1で得たシリカゲル500gを2Lのガラスーカーに入れて4.8重量%NaOH水溶液を添加してpH10に調整した。これに1.0mmφのジルコニアメジアを2390g入れてサンドミル粉砕機にかけて解砕を行った。同様に数バッチ解砕を行い、4重量%の解砕ゲル(異形多孔質ゲルからなる粒子を含む溶液)が2000g得られた。異形多孔質ゲルからなる粒子の平均粒子径は298nmであった。その後の工程は実施例1と同様にして、得られた異形シリカ粒子について平均粒子径測定と研磨試験を行った。結果を表1に示す。
[Example 3]
500 g of silica gel obtained in Example 1 was placed in a 2 L glass-ker and a 4.8 wt% NaOH aqueous solution was added to adjust the pH to 10. 2390 g of 1.0 mmφ zirconia medium was added thereto and crushed by a sand mill crusher. Similarly, several batches of crushing were carried out to obtain 2000 g of a 4% by weight crushed gel (a solution containing particles composed of a deformed porous gel). The average particle size of the particles made of the irregularly shaped porous gel was 298 nm. In the subsequent steps, the average particle size was measured and the polishing test was performed on the obtained deformed silica particles in the same manner as in Example 1. The results are shown in Table 1.

〔比較例1〕
実施例1で得た解砕ゲル(異形多孔質ゲルからなる粒子を含む溶液)を限外ろ過膜(旭化成製SIP1013)にてSiO濃度を9重量%まで濃縮した。その後、珪酸液によるビルドアップは行わずに得られたシリカ粒子について実施例1と同様に研磨試験を行った。結果を表1に示す。
[Comparative Example 1]
The crushed gel (solution containing particles composed of irregularly shaped porous gel) obtained in Example 1 was concentrated to 9% by weight in SiO 2 concentration with an ultrafiltration membrane (SIP1013 manufactured by Asahi Kasei). Then, the silica particles obtained without the build-up with the silicic acid solution were subjected to a polishing test in the same manner as in Example 1. The results are shown in Table 1.

〔比較例2〕
実施例1においてイオン交換水でシリカ濃度を2.76重量%に調整した解砕ゲル(異形多孔質ゲルからなる粒子を含む溶液)2716gを、10Lのセパラブルフラスコに入れて、攪拌しながら水酸化ナトリウム水溶液(濃度48質量%)を6.54g加え、pHを10.5に調整した。続いて、98℃に昇温して30分保持した。次に98℃に保持したまま、4.6重量%の珪酸液1304gを4.8時間かけて添加しpHを10.4にした以外は実施例1と同様にして異形シリカ粒子を製造し、平均粒子径測定と研磨試験を行った。結果を表1に示す。
[Comparative Example 2]
In Example 1, 2716 g of a crushed gel (a solution containing particles composed of atypical porous gel) whose silica concentration was adjusted to 2.76% by weight with ion-exchanged water was placed in a 10 L separable flask, and water was stirred while stirring. 6.54 g of an aqueous sodium oxide solution (concentration 48% by mass) was added to adjust the pH to 10.5. Subsequently, the temperature was raised to 98 ° C. and held for 30 minutes. Next, while maintaining the temperature at 98 ° C., 1304 g of a 4.6 wt% silicic acid solution was added over 4.8 hours to adjust the pH to 10.4, and the modified silica particles were produced in the same manner as in Example 1. The average particle size was measured and the polishing test was performed. The results are shown in Table 1.

〔比較例3〕
実施例1で得たシリカヒドロゲルを100℃の乾燥機で1晩乾燥させた後に、メノウ乳鉢ですり潰して550℃で2時間焼成して表面積が200m/gのシリカゲルからなる粒子を含む溶液を得た。これを実施例3と同様の条件で解砕しようとしたが解砕出来なかった。
[Comparative Example 3]
The silica hydrogel obtained in Example 1 was dried overnight in a dryer at 100 ° C., then ground in an agate mortar and baked at 550 ° C. for 2 hours to prepare a solution containing particles of silica gel having a surface area of 200 m 2 / g. Obtained. An attempt was made to crush this under the same conditions as in Example 3, but it could not be crushed.

Figure 0006927732
Figure 0006927732

Claims (2)

下記工程a〜cを含むことを特徴とする異形シリカ粒子の製造方法。
(工程a)比表面積300〜800m 2 /gの多孔質シリカゲルをアルカリ性下で湿式解砕して平均粒子径150〜400nmの異形多孔質ゲルからなる粒子を含む溶液にする工程
(工程b)前記異形多孔質ゲルからなる粒子を含む溶液にアルカリ性下で珪酸液を添加して加温し、前記異形多孔質ゲルからなる粒子の細孔を前記珪酸との反応によって埋めて該異形多孔質ゲルからなる粒子の比表面積を100m 2 /g以下にすると共に、異形のまま粒子を成長させて平均粒子径200〜500nmの異形シリカ粒子にする工程、
(工程c)成長した異形シリカ粒子を回収する工程。
A method for producing deformed silica particles, which comprises the following steps a to c.
(Step a) A step of wet-crushing a porous silica gel having a specific surface area of 300 to 800 m 2 / g under alkaline conditions to obtain a solution containing particles composed of a deformed porous gel having an average particle diameter of 150 to 400 nm.
(Step b) the profiled porous silicic acid solution with an alkaline under the solution containing the particles consisting of the gel was heated by adding, filled by reaction with the pores of the particles consisting of the profiled porous gel the silicic acid the A step of reducing the specific surface area of particles made of a deformed porous gel to 100 m 2 / g or less and growing the particles in a deformed shape to obtain deformed silica particles having an average particle diameter of 200 to 500 nm.
(Step c) A step of recovering the grown irregularly shaped silica particles.
工程aにおいて、多孔質シリカゲルをpH8.0〜11.5のアルカリ性下で湿式解砕して異形多孔質ゲルからなる粒子を含む溶液にし、
工程bにおいて、前記異形多孔質ゲルからなる粒子を含む溶液のSiO濃度を1〜10質量%にし、60℃〜170℃に加温し、pH9〜12.5のアルカリ性下で、珪酸液を連続的または断続的に添加して、前記異形多孔質ゲルからなる粒子の細孔を珪酸との反応によって埋めて該粒子の比表面積を減少させると共に、粒子を異形のまま成長させ、
工程cにおいて、成長した異形シリカ粒子を含む溶液を濃縮して該異形シリカ粒子を回収する請求項1に記載する異形シリカ粒子の製造方法。
In step a, the porous silica gel is wet-crushed under alkalinity of pH 8.0 to 11.5 to obtain a solution containing particles composed of a deformed porous gel.
In step b, the SiO 2 concentration of the solution containing the particles of the irregularly shaped porous gel is adjusted to 1 to 10% by mass, the temperature is increased to 60 ° C. to 170 ° C., and the silicic acid solution is prepared under alkaline pH of 9 to 12.5. It is added continuously or intermittently to fill the pores of the particles made of the deformed porous gel by reaction with silicic acid to reduce the specific surface area of the particles and to grow the particles in a deformed state.
The method for producing deformed silica particles according to claim 1, wherein in step c, the solution containing the grown deformed silica particles is concentrated to recover the deformed silica particles.
JP2017077872A 2017-04-10 2017-04-10 Method for producing irregularly shaped silica particles Active JP6927732B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017077872A JP6927732B2 (en) 2017-04-10 2017-04-10 Method for producing irregularly shaped silica particles

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017077872A JP6927732B2 (en) 2017-04-10 2017-04-10 Method for producing irregularly shaped silica particles

Publications (2)

Publication Number Publication Date
JP2018177576A JP2018177576A (en) 2018-11-15
JP6927732B2 true JP6927732B2 (en) 2021-09-01

Family

ID=64280982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017077872A Active JP6927732B2 (en) 2017-04-10 2017-04-10 Method for producing irregularly shaped silica particles

Country Status (1)

Country Link
JP (1) JP6927732B2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7591376B2 (en) * 2019-10-09 2024-11-28 日揮触媒化成株式会社 Silica-based particle dispersion and method for producing same
JP7356924B2 (en) * 2020-01-31 2023-10-05 日揮触媒化成株式会社 Polishing abrasive dispersion liquid
JP7436268B2 (en) * 2020-04-06 2024-02-21 日揮触媒化成株式会社 Silica-based particle dispersion and its manufacturing method
JP7681551B2 (en) * 2021-07-19 2025-05-22 日揮触媒化成株式会社 Silica-based particle dispersion, polishing slurry for polishing magnetic disk substrates, polishing composition for polishing magnetic disk substrates, and method for producing silica-based particles
JP7813651B2 (en) * 2022-05-17 2026-02-13 日揮触媒化成株式会社 Silica-based particle dispersion, polishing slurry for polishing magnetic disk substrates, polishing composition for polishing magnetic disk substrates, and method for producing silica-based particle groups
JP2024002535A (en) * 2022-06-24 2024-01-11 日揮触媒化成株式会社 Silica fine particle dispersion, its manufacturing method, and polishing abrasive dispersion containing the silica fine particle dispersion
WO2024237073A1 (en) 2023-05-12 2024-11-21 日揮触媒化成株式会社 Silica fine particle dispersion for polishing, composition for polishing, and method for producing silica fine particle dispersion for polishing

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003146644A (en) * 1995-09-12 2003-05-21 Tokuyama Corp Silica dispersion
JP2002338232A (en) * 2001-05-18 2002-11-27 Nippon Chem Ind Co Ltd Secondary aggregated colloidal silica, method for producing the same, and abrasive composition using the same
JP4493320B2 (en) * 2002-12-12 2010-06-30 日揮触媒化成株式会社 Method for producing silica sol and silica sol
JP5103707B2 (en) * 2003-10-06 2012-12-19 東ソー株式会社 High concentration silica slurry and method for producing the same
JP5127452B2 (en) * 2005-08-10 2013-01-23 日揮触媒化成株式会社 Method for producing deformed silica sol
JP5137521B2 (en) * 2006-10-12 2013-02-06 日揮触媒化成株式会社 Konpira sugar-like sol and process for producing the same
JP5602358B2 (en) * 2007-11-30 2014-10-08 日揮触媒化成株式会社 Non-spherical silica sol, method for producing the same, and polishing composition

Also Published As

Publication number Publication date
JP2018177576A (en) 2018-11-15

Similar Documents

Publication Publication Date Title
JP6927732B2 (en) Method for producing irregularly shaped silica particles
JP5860587B2 (en) Polishing silica sol, polishing composition, and method for producing polishing silica sol
TWI656098B (en) Oxide-based composite fine particle dispersion, method for producing the same, and abrasive dispersion for polishing containing cerium oxide-based composite fine particle dispersion
JP2010510157A (en) Method for producing cerium oxide powder using organic solvent and CMP slurry containing this powder
JP7591376B2 (en) Silica-based particle dispersion and method for producing same
JP6358899B2 (en) Metal oxide particles and method for producing the same
JP2011511751A (en) Ceria material and method for forming ceria material
JP2019081672A (en) Ceria-based composite fine particle dispersion, production method thereof, and abrasive grain dispersion for polishing including the ceria-based composite fine dispersion
WO2020075654A1 (en) Silica-based particle dispersion and production method therefor
JP2007527945A (en) Cerium oxide abrasive and polishing slurry
JP2019089670A (en) Ceria-based composite fine particle dispersion, production method thereof, and polishing abrasive grain dispersion comprising ceria-based composite fine particle dispersion
TW202136443A (en) Liquid dispersion and powder of cerium based core-shell particles, process for producing the same and uses thereof in polishing
JP2019127405A (en) Ceria-based composite hollow microparticle dispersion, production method thereof, and polishing abrasive grain dispersion comprising ceria-based composite hollow microparticle dispersion
JP7681551B2 (en) Silica-based particle dispersion, polishing slurry for polishing magnetic disk substrates, polishing composition for polishing magnetic disk substrates, and method for producing silica-based particles
JP6371193B2 (en) Method for producing silica-based composite particle dispersion
JP6436018B2 (en) Polishing slurry for oxide single crystal substrate and method for producing the same
CN108821324B (en) A kind of nanometer cerium oxide and its preparation method and application
TWI554603B (en) Method for producing polishing liquid composition and polishing liquid composition produced thereby
CN108862273A (en) The preparation method and Nano diamond twice dispersing method of Nano diamond colloid
JP7436268B2 (en) Silica-based particle dispersion and its manufacturing method
JP2000351956A (en) Abrasive for semiconductor, obtained by adding thickener
JP4471072B2 (en) Method of grinding cerium oxide using a ball mill device
JP7356924B2 (en) Polishing abrasive dispersion liquid
JP7813651B2 (en) Silica-based particle dispersion, polishing slurry for polishing magnetic disk substrates, polishing composition for polishing magnetic disk substrates, and method for producing silica-based particle groups
TWI731113B (en) Manufacturing method of magnetic disk substrate

Legal Events

Date Code Title Description
RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20180615

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200319

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20210119

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210224

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210317

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210803

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210805

R150 Certificate of patent or registration of utility model

Ref document number: 6927732

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250