JP6928286B2 - Luminous module - Google Patents

Description

The present invention relates to a light emitting device.

A light emitting device is known in which the mounting surface of a support (base material) is provided with a recess, and the support (base material) and the mounting substrate are fixed by filling the recess with a brazing material (for example, a patent). Reference 1).

Japanese Unexamined Patent Publication No. 2013-041865

An object of the present invention is to provide a light emitting device capable of improving the bonding strength with a mounting substrate while suppressing a decrease in the strength of the substrate.

The light emitting device according to one aspect of the present invention has a front surface extending in a first direction in the longitudinal direction and a second direction in the lateral direction, a back surface located on the opposite side of the front surface, and adjacent to the front surface. A base material having a bottom surface orthogonal to the front surface and an upper surface located on the opposite side of the bottom surface, a first wiring arranged on the front surface, a second wiring arranged on the back surface, and the first wiring. A substrate including a wiring and a via hole for electrically connecting the second wiring, at least one light emitting element electrically connected to the first wiring and mounted on the first wiring, and the light emitting A light emitting device including a light-reflecting coating member that covers a side surface of an element and a front surface of the substrate, wherein the base material is separated from the via hole in a front view and is located on the back surface and the bottom surface. The substrate has a plurality of recesses that open, the substrate covers the inner walls of the plurality of recesses, includes a third wiring that is electrically connected to the second wiring, and a plurality of portions in the front direction from the back surface. Each of the depths of the depressions is deeper on the bottom surface side than on the top surface side.

According to the light emitting device of the present invention, it is possible to provide a light emitting device capable of improving the bonding strength with a mounting substrate while suppressing a decrease in the strength of the base material.

FIG. 1A is a schematic perspective view 1 of the light emitting device according to the first embodiment. FIG. 1B is a schematic perspective view 2 of the light emitting device according to the first embodiment. FIG. 1C is a schematic front view of the light emitting device according to the first embodiment. FIG. 2A is a schematic end view taken along line 2A-2A of FIG. 1C. FIG. 2B is a schematic end view taken along line 2B-2B of FIG. 1C. FIG. 3A is a schematic bottom view of the light emitting device according to the first embodiment. FIG. 3B is a schematic bottom view of the deformability of the light emitting device according to the first embodiment. FIG. 3C is a schematic front view of the base material according to the first embodiment. FIG. 4A is a schematic rear view of the light emitting device according to the first embodiment. FIG. 4B is a schematic rear view showing a modified example of the light emitting device according to the first embodiment. FIG. 4C is a schematic rear view showing a modified example of the light emitting device according to the first embodiment. FIG. 4D is a schematic bottom view of the deformability of the light emitting device according to the first embodiment. FIG. 4E is a schematic bottom view of the deformability of the light emitting device according to the first embodiment. FIG. 4F is a schematic bottom view of the deformability of the light emitting device according to the first embodiment. FIG. 5A is a schematic right side view of the light emitting device according to the first embodiment. FIG. 5B is a schematic left side view of the light emitting device according to the first embodiment. FIG. 6 is a schematic top view of the light emitting device according to the first embodiment. FIG. 7 is a schematic front view of the light emitting device according to the second embodiment. FIG. 8A is a schematic end view taken along the line 8A-8A of FIG. FIG. 8B is a schematic end view taken along the line 8B-8B of FIG. FIG. 9A is a schematic bottom view of the light emitting device according to the second embodiment. FIG. 9B is a schematic rear view of the light emitting device according to the second embodiment. FIG. 10 is a schematic front view of the light emitting device according to the third embodiment. FIG. 11 is a schematic end view taken along the line 11A-11A of FIG. FIG. 12 is a schematic bottom view of the light emitting device according to the third embodiment. FIG. 13 is a schematic rear view of the light emitting device according to the third embodiment. FIG. 14 is a schematic right side view of the light emitting device according to the third embodiment. FIG. 15 is a schematic front view showing a modified example of the light emitting device according to the third embodiment. FIG. 16 is a schematic end view taken along the line 15A-15A of FIG. FIG. 17 is a schematic front view of the light emitting device according to the fourth embodiment. FIG. 18 is a schematic end view taken along the line 18A-18A of FIG. FIG. 19 is a schematic bottom view of the light emitting device according to the fourth embodiment. FIG. 20 is a schematic rear view of the light emitting device according to the fourth embodiment. FIG. 21 is a schematic right side view of the light emitting device according to the fourth embodiment. FIG. 22 is a schematic rear view of the light emitting device according to the fifth embodiment. FIG. 23 is a schematic rear view of the light emitting device according to the sixth embodiment. FIG. 24 is a schematic rear view of the light emitting device according to the seventh embodiment. FIG. 25A is a schematic bottom view of a land pattern in which the light emitting device according to the first embodiment is shown by a dotted line. FIG. 25B is a schematic bottom view showing a modified example of the land pattern in which the light emitting device according to the first embodiment is described by a dotted line. FIG. 25C is a schematic bottom view showing a modified example of the land pattern in which the light emitting device according to the first embodiment is described by a dotted line. FIG. 26A is a schematic bottom view of a land pattern in which the light emitting device according to the fourth embodiment is described by a dotted line. FIG. 26B is a schematic bottom view showing a modified example of the land pattern in which the light emitting device according to the fourth embodiment is described by a dotted line. FIG. 27 is a schematic front view of the light emitting device according to the eighth embodiment. FIG. 28A is a schematic end view taken along the line 28A-28A of FIG. 27. FIG. 28B is a schematic end view taken along the line 28B-28B of FIG. 27. FIG. 29 is a schematic bottom view of the light emitting device according to the eighth embodiment. FIG. 30 is a schematic rear view of the light emitting device according to the eighth embodiment. FIG. 31 is a schematic end view of a modified example of the light emitting device according to the eighth embodiment.

Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the light emitting device described below is for embodying the technical idea of the present invention, and the present invention is not limited to the following unless otherwise specified. In addition, the size and positional relationship of the members shown in the drawings may be exaggerated in order to clarify the explanation.

<Embodiment 1>
The light emitting device 1000 according to the embodiment of the present invention will be described with reference to FIGS. 1A to 6. The light emitting device 1000 includes a substrate 10, at least one light emitting element 20, and a covering member 40. The substrate 10 includes a base material 11, a first wiring 12, a second wiring 13, a third wiring 14, and a via hole 15. The base material 11 has a front surface 111 extending in the first direction in the longitudinal direction and a second direction in the lateral direction, a back surface 112 located on the opposite side of the front surface, and a bottom surface adjacent to the front surface 111 and orthogonal to the front surface 111. It has 113 and a top surface 114 located on the opposite side of the bottom surface 113. The base material 11 further has a plurality of recesses 16. The first wiring 12 is arranged on the front surface 111 of the base material 11. The second wiring 13 is arranged on the back surface 112 of the base material 11. The via hole 15 electrically connects the first wiring 12 and the second wiring 13. The light emitting element 20 is electrically connected to the first wiring 12 and is placed on the first wiring 12. The covering member 40 has light reflectivity and covers the side surface 202 of the light emitting element 20 and the front surface 111 of the substrate. The plurality of recesses 16 are separated from the via hole 15 in the front view and open to the back surface 112 and the bottom surface 113. The third wiring 14 covers the inner walls of the plurality of recesses 16 and is electrically connected to the second wiring 13. Each of the depths of the plurality of depressions 16 in the direction from the back surface 112 to the front surface 111 has a depth W1 of the depression on the bottom surface side deeper than the depth W2 of the depression on the upper surface side. In addition, in this specification, orthogonal means 90 ± 3 °.

The light emitting device 1000 can be fixed to the mounting substrate by a joining member such as solder formed in the plurality of recesses 16. Since the joining member can be located in the plurality of recesses, the bonding strength between the light emitting device 1000 and the mounting substrate can be improved as compared with the case where there is only one recess. As shown in FIG. 2A, the depths of the plurality of recesses in the front direction (Z direction) from the back surface are deeper on the bottom surface side than on the top surface side, so that the top surface side of the recesses in the front surface direction (Z direction) from the back surface. The thickness W5 of the base material located in can be made thicker than the thickness W6 of the base material located on the bottom surface side of the recess. As a result, it is possible to suppress a decrease in the strength of the base material. Further, since the volume of the joining member formed in the recess is increased by the depth W1 of the recess on the bottom surface side, the bonding strength between the light emitting device 1000 and the mounting substrate can be improved. Even in the top light emitting type (top view type) in which the light emitting device 1000 mounts the back surface 112 of the base material 11 and the mounting substrate facing each other, the bottom surface 113 of the base material 11 and the mounting substrate are mounted facing each other. Even in the side light emitting type (side view type), the bonding strength with the mounting substrate can be improved by increasing the volume of the bonding member. In this specification, the direction from the back to the front is also referred to as the Z direction.

The bonding strength between the light emitting device 1000 and the mounting substrate can be improved particularly in the case of the side light emitting type. Since the depth of the dent in the Z direction is deeper on the bottom surface side than on the upper surface side, the area of the dent opening on the bottom surface can be increased. By increasing the area of the recess opening on the bottom surface facing the mounting substrate, the area of the joining member located on the bottom surface can also be increased. As a result, the area of the bonding member located on the surface facing the mounting substrate can be increased, so that the bonding strength between the light emitting device 1000 and the mounting substrate can be improved.

As shown in FIG. 2A, the depth W1 of the recess 16 in the Z direction is shallower than the thickness W3 of the base material in the Z direction. That is, the recess 16 does not penetrate the base material. Forming holes that penetrate the base material reduces the strength of the base material. Therefore, it is possible to suppress a decrease in the strength of the base material by providing a recess that does not penetrate the base material. The maximum depth of each of the plurality of recesses in the Z direction is preferably 0.4 to 0.8 times the thickness of the base material. When the depth of the recess is deeper than 0.4 times the thickness of the base material, the volume of the bonding member formed in the recess increases, so that the bonding strength between the light emitting device and the mounting substrate can be improved. Since the depth of the recess is shallower than 0.8 times the thickness of the base material, it is possible to suppress a decrease in the strength of the base material.

In a cross-sectional view, the recess 16 preferably includes a parallel portion 161 extending from the back surface 112 in a direction parallel to the bottom surface 113 (Z direction). By providing the parallel portion 161 it is possible to increase the volume of the recess even if the area of the opening of the recess on the back surface is the same. By increasing the volume of the recess, the amount of bonding members such as solder that can be formed in the recess can be increased, so that the bonding strength between the light emitting device 1000 and the mounting substrate can be improved. In the present specification, "parallel" means that an inclination of about ± 3 ° is allowed. Further, in the cross-sectional view, the recess 16 includes an inclined portion 162 that inclines from the bottom surface 113 in the direction in which the thickness of the base material 11 increases. The inclined portion 162 may be straight or curved. Since the inclined portion 162 is straight, it can be easily formed by a drill having a sharp tip. The straight line in the inclined portion 162 means that fluctuations such as bending and deviation of about 3 μm are allowed.

As shown in FIG. 3A, it is preferable that the central depth W1 of each of the plurality of recesses 16 on the bottom surface is the maximum depth of the recesses in the Z direction. By doing so, it is possible to increase the thickness W8 of the base material in the Z direction at the end of the recess in the X direction on the bottom surface, so that the strength of the base material can be improved. In the present specification, the center means that a fluctuation of about 5 μm is allowed. As shown in FIG. 3B, which is a modification of the first embodiment, the depth W7 of the recess 16 in the Z direction may be substantially constant on the bottom surface. In other words, the deepest portion of the recess 16 may be a flat surface. The recess 16 can be formed by a known method such as a drill or a laser. On the bottom surface, the depression with the maximum central depth can be easily formed by a drill with a sharp tip. Further, by using a drill, it is possible to form a recess having a substantially conical shape at the deepest portion and having a substantially cylindrical shape continuous from the circular shape of the bottom surface of the substantially conical shape. By cutting a part of the dent by dicing or the like, a dent having a substantially semi-cylindrical shape at the deepest portion and a substantially semi-cylindrical shape continuous from a substantially semicircular shape can be formed.

As shown in FIG. 4A, it is preferable that the shapes of the plurality of recesses 16 are the same on the back surface. Since the shapes of the plurality of dents are the same, it is easier to form the dents than when the shapes of the dents are different from each other. For example, in the case of forming a dent by a drill method, if the shapes of the plurality of dents are the same, the dent can be formed by one drill. In the present specification, the same means that a difference of about 5 μm is allowed.

Further, the areas of the openings of the plurality of recesses in the rear view may be the same or different. For example, as shown in FIG. 4B, the area of the opening of the recess 16C located in the center of the base material in the rear view is the opening of the recess 16L located on the X + side and the recess 16R located on the X− side. It may be larger than the area. In the rear view shown in FIGS. 4B and 4C, the right side on the X-axis from the center of the light emitting device is the X + side, and the left side is the X− side. By increasing the area of the opening of the recess 16C located in the center of the base material, the bonding strength between the light emitting device and the mounting substrate can be improved. Further, since the area of the opening of the recess 16L located on the X + side and the recess 16R located on the X− side is small, it becomes easy to increase the area of the second wiring 13. Since the area of the second wiring 13 is large, the inspection becomes easy when the probe needle is brought into contact with the second wiring in the characteristic inspection of the light emitting device or the like. Further, as shown in FIG. 4C, the area of each opening of the recess 16L located on the X + side and the recess 16R located on the X− side in the rear view is the area of the opening of the recess 16C located in the center of the base material. May be larger than. By increasing the area of each opening of the recess 16L located on the X + side and the recess 16R located on the X− side, the bonding strength between the light emitting device and the mounting substrate can be improved. Further, it is preferable that the areas of the openings of the recess 16L located on the X + side and the recess 16R located on the X− side in the rear view are substantially the same. By doing so, it becomes easy to suppress the bias between the joining member formed in the recess 16L located on the X + side and the joining member formed in the recess 16R located on the X− side. This makes it easier to prevent the light emitting device from being mounted on the mounting board at an angle.

As shown in FIGS. 3A and 3B, the depths W1 and W7 of the plurality of depressions in the Z direction may be the same, or as shown in FIG. 4D, the depths of the plurality of depressions in the Z direction may be different. good. For example, as shown in FIG. 4D, the depth W1C of the recess 16C located in the center of the base material in the bottom view is located at the depths W1L and the X− side of the recess 16L located on the X + side in the Z direction. The depth of the recess 16R to be formed may be deeper than the depth W1R in the Z direction. In the bottom view shown in FIGS. 4D, 4E, and 4F, the left side on the X-axis from the center of the light emitting device is the X + side, and the right side is the X− side. Since the depth W1C of the recess 16C located in the center of the base material is deep, the bonding strength between the light emitting device and the mounting substrate can be improved. The depth W1L of the recess 16L located on the X + side in the bottom view and the depth W1R of the recess 16R located on the X− side in the Z direction are deeper than the recess W1C of the recess 16C located in the center of the base material. You may. Further, it is preferable that the depth W1L of the recess 16L located on the X + side in the Z direction and the depth W1R of the recess 16R located on the X− side in the Z direction are substantially the same. By doing so, it becomes easy to suppress the bias between the joining member formed in the recess located on the X + side and the joining member formed in the recess located on the X− side, so that the light emitting device can be mounted on the mounting substrate. It becomes easier to suppress the mounting at an angle.

As shown in FIG. 4D, the width D1C of the recess 16C located in the center of the base material in the bottom view, the width D1L of the recess 16L located on the X + side in the X direction, and the X of the recess 16R located on the X− side. The widths D1R in the directions may be substantially the same, and as shown in FIGS. 4E and 4F, the widths D1C of the recess 16C located in the center of the base material in the bottom view in the X direction and the X direction of the recess 16L located on the X + side. The width D1L and / or the width D1R of the recess 16R located on the X− side in the X direction may be different. In bottom view, the width D1C of the recess 16C located in the center of the base material in the X direction, the width D1L of the recess 16L located on the X + side in the X direction and / or the width D1R of the recess 16R located on the X− side in the X direction Even if they are different, the depths of the plurality of depressions in the Z direction may be the same or different. Further, it is preferable that the width D1L of the recess 16L located on the X + side and the width D1R of the recess 16R located on the X− side in the X direction are substantially the same in the bottom view. By doing so, it becomes easy to suppress the bias between the joining member formed in the recess 16L located on the X + side and the joining member formed in the recess 16R located on the X− side. This makes it easier to prevent the light emitting device from being mounted on the mounting board at an angle.

On the back surface, it is preferable that the plurality of recesses 16 are located symmetrically with respect to the center line of the base material parallel to the second direction (Y direction). By doing so, when the light emitting device is mounted on the mounting substrate via the bonding member, the self-alignment works effectively, and the light emitting device can be mounted within the mounting range with high accuracy.

On the back surface, it is preferable that the opening shape of each of the plurality of recesses is a substantially semicircular shape. A dent having a circular opening shape can be formed by drilling, and a substantially semicircular dent can be easily formed on the back surface by cutting a part of the circular dent by dicing or the like. .. Further, on the back surface, since the opening shape of the dent is a substantially semicircular shape without corners, it is possible to suppress the concentration of stress related to the dent, so that the base material can be suppressed from cracking.

As shown in FIGS. 1A, 2A, and 2B, the light emitting device 1000 may include a translucent member 30. The translucent member 30 is preferably located on the light emitting element 20. By locating the translucent member on the light emitting element, the light emitting element 20 can be protected from external stress. The covering member 40 preferably covers the side surface of the translucent member 30. By doing so, the light from the light emitting device can be brought closer to the point light source. By moving the light emitting device closer to a point light source, for example, it becomes easy to adjust the light distribution by an optical system such as a lens.

The light emitting element 20 includes a mounting surface facing the substrate 10 and a light extraction surface 201 located on the opposite side of the mounting surface. As shown in FIG. 2A, when the light emitting element is flip-chip mounted, the surface on the opposite side to the surface on which the positive and negative electrodes of the light emitting element are located is the light extraction surface. The translucent member 30 may be joined to the light emitting element 20 via the light guide member 50. The light guide member 50 may be located only between the light extraction surface 201 of the light emitting element and the light transmitting member 30, and the light emitting element 20 and the covering member 40 may be adhered to each other, or light may be emitted from the light extraction surface 201 of the light emitting element. The light emitting element 20 and the covering member 40 may be adhered by covering up to the side surface 202 of the element. The light guide member 50 has a higher transmittance of light from the light emitting element 20 than the covering member 40. Therefore, when the light guide member 50 covers the side surface 202 of the light emitting element, the light emitted from the side surface of the light emitting element 20 can be easily taken out to the outside of the light emitting device through the light guide member 50, so that the light extraction efficiency can be improved. Can be done.

When there are a plurality of light emitting elements 20, the peak wavelengths of one light emitting element and the other light emitting element may be the same or different. When the peak wavelengths of one light emitting element and the other light emitting element are different, the light emitting element having the peak wavelength of light emission in the range of 430 nm or more and less than 490 nm (wavelength range in the blue region) and the peak wavelength of light emission are 490 nm or more and 570 nm or less. It is preferable that the light emitting element is in the range of (wavelength range in the green region). By doing so, the color rendering property of the light emitting device can be improved.

As shown in FIGS. 2A and 2B, the translucent member 30 may contain a wavelength converting substance 32. The wavelength conversion substance 32 is a member that absorbs at least a part of the primary light emitted by the light emitting element 20 and emits secondary light having a wavelength different from that of the primary light. By including the wavelength conversion substance 32 in the translucent member 30, it is possible to output a mixed color light in which the primary light emitted by the light emitting element 20 and the secondary light emitted by the wavelength conversion substance 32 are mixed. For example, if a blue LED is used for the light emitting element 20 and a phosphor such as YAG is used for the wavelength conversion substance 32, the blue light of the blue LED and the yellow light emitted by the phosphor excited by the blue light are mixed to obtain the mixture. A light emitting device that outputs the white light to be produced can be configured.

The wavelength conversion substance may be uniformly dispersed in the translucent member, or the wavelength conversion substance may be unevenly distributed in the vicinity of the light emitting element rather than the upper surface of the translucent member 30. By doing so, even if the wavelength conversion substance 32 that is weak against moisture is used, the base material 31 of the translucent member 30 also functions as a protective layer, so that deterioration of the wavelength conversion substance 32 can be suppressed. Further, as shown in FIGS. 2A and 2B, the translucent member 30 may include a layer containing the wavelength conversion substance 32 and a layer 33 substantially not containing the wavelength conversion substance. By locating the layer 33 that does not substantially contain the wavelength conversion substance on the layer that the translucent member 30 contains the wavelength conversion substance 32, the layer 33 that does not substantially contain the wavelength conversion substance can be used as a protective layer. Since it fulfills the function, deterioration of the wavelength conversion substance 32 can be suppressed. Examples of the wavelength conversion substance 32 that is sensitive to moisture include a manganese-activated fluoride phosphor. The manganese-activated fluoride-based phosphor is a preferable member from the viewpoint of color reproducibility because it can emit light with a relatively narrow spectral line width.

As shown in FIG. 2B, the via hole 15 is provided in a hole penetrating the front surface 111 and the back surface 112 of the base material 11. The via hole 15 includes a fourth wiring 151 that covers the surface of the through hole of the base material and a filling member 152 that is filled in the fourth wiring 151. The filling member 152 may be conductive or insulating. It is preferable to use a resin material for the filling member 152. Generally, the resin material before curing has higher fluidity than the metal material before curing, so that it is easy to fill the fourth wiring 151. Therefore, the use of a resin material for the filling member facilitates the manufacture of the substrate. Examples of the resin material that can be easily filled include epoxy resin. When a resin material is used as the filling member, it is preferable to include an additive member in order to reduce the coefficient of linear expansion. By doing so, the difference in the coefficient of linear expansion from the fourth wiring becomes small, so that it is possible to suppress the formation of a gap between the fourth wiring and the filling member due to heat from the light emitting element. Examples of the additive member include silicon oxide. When a metal material is used for the filling member 152,
The heat dissipation can be improved.

As shown in FIG. 4A, the area of the via hole 15 on the back surface is smaller than the area of the opening of the recess 16 on the back surface. Therefore, although the via hole 15 penetrates the base material 11, it is smaller than the area of the opening of the recess 16 on the back surface, so that it is possible to suppress a decrease in the strength of the base material 11.

As shown in FIG. 4A, it is preferable that the recess 16 is located between the via hole 15 and the adjacent via hole in the rear view. In other words, it is preferable that the recess 16 is located on a straight line connecting the via hole 15 and the adjacent via hole in the rear view. By doing so, the heat from the light emitting element can be efficiently transferred from the via hole 15 to the third wiring 14 located in the recess 16. Since the heat transferred to the third wiring 14 is transferred to the mounting substrate via the joining member, the heat dissipation of the light emitting device is improved.

Further, as shown in FIG. 4A, it is preferable that the via hole 15 is located between the recess 16 and the adjacent recess in the rear view. In other words, it is preferable that the via hole 15 is located on a straight line connecting the recess 16 and the adjacent recess in the rear view. By doing so, the heat from the light emitting element can be efficiently transferred from the via hole 15 to the third wiring 14 located in the recess. This improves the heat dissipation of the light emitting device.

As shown in FIG. 2B, the light emitting element 20 includes at least the semiconductor laminate 23, and the semiconductor laminate 23 is provided with positive and negative electrodes 21 and 22. The positive and negative electrodes 21 and 22 are formed on the same side surface of the light emitting element 20, and it is preferable that the light emitting element 20 is flip-chip mounted on the substrate 10. This eliminates the need for wires that supply electricity to the positive and negative electrodes of the light emitting element, so that the light emitting device can be miniaturized. In the present embodiment, the light emitting element 20 has the element substrate 24, but the element substrate 24 may be removed. When the light emitting element 20 is flip-chip mounted on the substrate 10, the positive and negative electrodes 21 and 22 of the light emitting element are connected to the first wiring 12 via the conductive adhesive member 60.

As shown in FIG. 2B, when the light emitting device 1000 includes a plurality of light emitting elements 20, it is preferable that the plurality of light emitting elements are provided side by side in the first direction (X direction). By doing so, the width of the light emitting device 1000 in the second direction (Y direction) can be shortened, so that the light emitting device can be made thinner. The number of light emitting elements may be three or more or one.

As shown in FIGS. 3C and 4A, the substrate 10 includes a base material 11, a first wiring 12, and a second wiring 13. The base material 11 has a front surface 111 extending in the first direction in the longitudinal direction and a second direction in the lateral direction, a back surface 112 located on the opposite side of the front surface, and a bottom surface adjacent to the front surface 111 and orthogonal to the front surface 111. It has 113 and a top surface 114 located on the opposite side of the bottom surface 113.

As shown in FIG. 4A, the light emitting device 1000 may include an insulating film 18 that covers a part of the second wiring 13. By providing the insulating film 18, it is possible to secure the insulating property on the back surface and prevent a short circuit. In addition, it is possible to prevent the second wiring from being peeled off from the base material.

As shown in FIG. 5A, it is preferable that the side surface 403 in the longitudinal direction of the covering member 40 located on the bottom surface 113 side is inclined inward of the light emitting device 1000 in the Z direction. By doing so, when the light emitting device 1000 is mounted on the mounting substrate, the contact between the side surface 403 of the covering member 40 and the mounting board is suppressed, and the mounting posture of the light emitting device 1000 is likely to be stable. Further, when the covering member 40 is thermally expanded, the stress due to the contact with the mounting substrate can be suppressed. The side surface 404 in the longitudinal direction of the covering member 40 located on the upper surface 114 side is the light emitting device 1000 in the Z direction.
It is preferable that the slope is inward. By doing so, the contact between the side surface of the covering member 40 and the suction nozzle (collet) can be suppressed, and damage to the covering member 40 at the time of suction of the light emitting device 1000 can be suppressed. Further, when the light emitting device 1000 is incorporated into a lighting unit or the like, the upper surface 114 of the base material 11 preferentially contacts the peripheral member rather than the side surface 404 of the covering member 40, thereby suppressing the stress related to the covering member 40. be able to. As described above, the longitudinal side surface 403 of the covering member 40 located on the bottom surface 113 side and the longitudinal side surface 404 of the covering member 40 located on the upper surface 114 side of the light emitting device 1000 in the front direction (Z direction) from the back surface. It is preferably inclined inward. The inclination angle θ of the covering member 40 can be appropriately selected, but from the viewpoint of ease of exerting such an effect and the strength of the covering member 40, it is preferably 0.3 ° or more and 3 ° or less, preferably 0.5 °. It is more preferably 2 ° or more, and even more preferably 0.7 ° or more and 1.5 ° or less.

As shown in FIGS. 5A and 5B, it is preferable that the right side surface and the left side surface of the light emitting device 1000 have substantially the same shape. By doing so, the light emitting device 1000 can be miniaturized.

As shown in FIG. 6, it is preferable that the lateral side surface 405 of the covering member 40 and the lateral side surface 105 of the substrate 10 are substantially coplanar. By doing so, the width in the longitudinal direction (X direction) can be shortened, so that the light emitting device can be miniaturized.

<Embodiment 2>
The light emitting device 2000 according to the second embodiment of the present invention shown in FIGS. 7 to 9B has the number of light emitting elements mounted on the substrate and the depression provided in the base material as compared with the light emitting device 1000 according to the first embodiment. And the number of beer holes is different. The shape of the recess 16 is the same as that of the first embodiment.

As shown in FIG. 8A, in the light emitting device 2000, similarly to the first embodiment, the depth of the recess in the direction from the back to the front is deeper on the bottom surface side than on the top surface side, so that the base material located on the upper surface side of the recess is formed. The thickness can be made thicker than the thickness of the base material located on the bottom surface side of the recess. As a result, it is possible to suppress a decrease in the strength of the base material. Further, since the volume of the joining member formed in the recess is increased due to the deep recess on the bottom surface side, the bonding strength between the light emitting device 2000 and the mounting substrate can be improved.

As shown in FIG. 8B, the number of light emitting elements may be one. Since there is only one light emitting element, the width in the first direction (X direction) can be shortened as compared with the case where there are a plurality of light emitting elements, so that the light emitting device can be miniaturized. The number of dents may be appropriately changed by shortening the width of the light emitting device in the first direction (X direction). For example, as shown in FIG. 9A, the number of recesses 16 may be two. The number of depressions 16 may be one or three or more.

As shown in FIG. 9B, it is preferable that a plurality of via holes 15 are located between the recess 16 and the adjacent recess in the rear view. In other words, it is preferable that the plurality of via holes 15 are located on a straight line connecting the recess 16 and the adjacent recess in the rear view. By doing so, the heat from the light emitting element can be efficiently transferred from the via hole 15 to the third wiring 14 located in the recess. This improves the heat dissipation of the light emitting device.

<Embodiment 3>
The light emitting device 3000 according to the third embodiment of the present invention shown in FIGS. 10 to 14 is different from the light emitting device 1000 according to the first embodiment in that it includes a recess 16 having a different shape.

Like the light emitting device 1000, the light emitting device 3000 includes a substrate 10, at least one light emitting element 20, and a covering member 40. The substrate 10 includes a base material 11, a first wiring 12, and a second substrate.
A wiring 13, a third wiring 14, and a via hole 15 are provided. The base material 11 has a front surface 111 extending in the first direction in the longitudinal direction and a second direction in the lateral direction, a back surface 112 located on the opposite side of the front surface, and a bottom surface adjacent to the front surface 111 and orthogonal to the front surface 111. It includes 113, an upper surface 114 located on the opposite side of the lower surface 113, and a side surface 115 located between the front surface 111 and the back surface 112. The base material 11 further has a plurality of recesses 16. The plurality of recesses 16 include a central recess 161 opened on the back surface 112 and the bottom surface 113, and an end recess 162 opened on the back surface 112, the bottom surface 113, and the side surface 115. The third wiring 14 covers the inner wall of the recess 16 and is electrically connected to the second wiring 13.

As shown in FIG. 14, in the light emitting device 3000, the depth of the central recess 161 and / or the end recess 162 in the front direction from the back surface is deeper on the bottom surface side than on the upper surface side, so that the central recess 161 and / or the end portion The thickness of the base material located on the upper surface side of the recess 162 can be made thicker than the thickness of the base material located on the bottom surface side of the central recess 161 and / or the end recess 162. As a result, it is possible to suppress a decrease in the strength of the base material. Further, since the central recess 161 and / or the end recess 162 on the bottom surface side is deep, the volume of the joining member formed in the central recess 161 and / or the end recess 162 increases, so that the light emitting device 3000 and the mounting substrate The joint strength with and can be improved. It should be noted that there may be at least one central recess 161 and / or end recess 162.

The end recess 162 is also open to the side surface 115 of the base material, as shown in FIGS. 11 to 14. As a result, since the bonding member is also located on the side surface 115 side of the base material, the bonding strength between the light emitting device 3000 and the mounting substrate can be further improved. When the light emitting device 3000 is a side light emitting type in which the bottom surface 113 of the base material 11 and the mounting substrate are mounted so as to face each other, it is particularly preferable that the light emitting device 3000 is provided with an end recess 162. By providing the end recess 162, the side surface 115 of the base material can be fixed, so that the light emitting device 3000 is tilted on the mounting substrate or the back surface of the base material stands up facing the mounting substrate. The occurrence of the Manhattan phenomenon can be suppressed. The number of end recesses 162 may be at least one, but it is preferable that there are a plurality of recesses 162. By having a plurality of end recesses 162, the bonding strength between the light emitting device 3000 and the mounting substrate can be further improved. When there are a plurality of end recesses 162, it is preferable that the edge recesses are located at both ends of the base material in the rear view. By doing so, the occurrence of the Manhattan phenomenon can be further suppressed.

When the shape of the central recess 161 is a substantially semicircular shape that is half of the circular shape and the shape of the end recess 162 is approximately a quarter of the circular shape in the rear view, the central recess 161 and the end are formed. The diameter of the circular shape of the recess 162 may be different or substantially the same. If the circular diameters of the central recess 161 and the end recess 162 are substantially the same, it is preferable because the central recess 161 and the end recess 162 can be formed by one drill. Further, when the central recess 161 and the end recess 162 are provided with an inclined portion that is inclined in the direction in which the thickness of the base material 11 is increased from the bottom surface 113 in the cross-sectional view, the inclined portion and the end recess 162 of the central recess 161 are provided. The angles of the inclined portions of the above may be different or substantially the same. If the angle between the inclined portion of the central recess 161 and the inclined portion of the end recess 162 is substantially the same, it is preferable because the central recess 161 and the end recess 162 can be formed by one drill.

As shown in FIGS. 15 and 16, one translucent member 30 may be located on a plurality of light emitting elements. By doing so, the area of the translucent member in the front view can be increased, so that the light extraction efficiency of the light emitting device is improved. Further, by having one light emitting surface of the light emitting device, it is possible to reduce the uneven brightness of the light emitting device.

When one translucent member 30 is located on a plurality of light emitting elements, the light guide members 50 that join each light emitting element 20 and the translucent member 30 are separated from each other even if they are connected. You may be doing it. As shown in FIG. 16, it is preferable that the light guide member is positioned so as to connect between one light emitting element and the other light emitting element. By doing so, the light of the light emitting element can be guided to the light transmitting member from between one light emitting element and the other light emitting element via the light guide member, so that the brightness unevenness of the light emitting device is reduced. can do. Further, since the portion of the covering member located between one light emitting element and the other light emitting element is reduced, the covering member can be suppressed from being deteriorated by the light from the light emitting element. As the light guide member, it is preferable to use a material that is less likely to be deteriorated by light from the light emitting element than the covering member.

<Embodiment 4>
The light emitting device 4000 according to the fourth embodiment of the present invention shown in FIGS. 17 to 21 is different from the light emitting device 2000 according to the second embodiment in that it includes a recess 16 having a different shape.

As shown in FIG. 21, the light emitting device 4000 includes an end recess 162. Since the depth of the end recess in the direction from the back to the front is deeper on the bottom side than on the top surface side, the thickness of the base material located on the upper surface side of the end recess is larger than the thickness of the base material located on the bottom surface side of the recess. Can be thickened. As a result, it is possible to suppress a decrease in the strength of the base material. Further, since the volume of the joining member formed in the end recess is increased due to the deep end recess on the bottom surface side, the bonding strength between the light emitting device 4000 and the mounting substrate can be improved.

The end recess 162 is also open to the side surface 115 of the base material, as shown in FIGS. 18 to 21. As a result, since the bonding member is also located on the side surface 115 side of the base material, the bonding strength between the light emitting device 4000 and the mounting substrate can be further improved.

<Embodiment 5>
The light emitting device 5000 according to the fifth embodiment of the present invention shown in FIG. 22 is different from the light emitting device 4000 according to the fourth embodiment in that it includes a central recess 161.

Since the light emitting device 5000 includes the central recess 161 and the end recess 162, the number of places that can be fixed by the joining member increases, so that the bonding strength between the light emitting device and the mounting substrate can be improved. The depth of the central recess 161 and / or the edge recess 162 in the front direction from the back surface is deeper on the bottom surface side than on the top surface side. Thereby, the bonding strength between the light emitting device 5000 and the mounting substrate can be improved.

<Embodiment 6>
Compared with the light emitting device 1000 according to the first embodiment, the light emitting device 6000 according to the sixth embodiment of the present invention shown in FIG. 23 has the shape of the second wiring and the insulating film and a recess (central recess) in the center of the light emitting device. It differs in that it does not have.

The second wiring 13 of the light emitting device 6000 is located between the two end recesses in the rear view, and includes an exposed portion 131 exposed from the insulating film 18. The exposed portion 131 is surrounded by the insulating film 18 except for the bottom surface 113 side. By arranging the bonding member on the exposed portion 131, the bonding strength between the light emitting device and the mounting substrate can be improved. The shape of the exposed portion 131 in the rear view may be a quadrangular shape, a hemispherical shape, or any shape. The shape of the exposed portion 131 in the rear view can be easily changed by changing the shape of the insulating film. As for the shape of the exposed portion 131 in the rear view, it is preferable that the narrow portion 132 is provided on the bottom surface side and the wide portion 133 is provided at a position extending in the second direction (Y direction). By arranging a portion having a narrow width, it is possible to prevent flux and the like contained in the joining member from infiltrating under the light emitting element along the surface of the exposed portion 131 when the light emitting device is mounted. can. Further, the shape of the second wiring 13 exposed from the insulating film 18 is preferably located symmetrically with respect to the center line of the base material parallel to the second direction (Y direction). By doing so, when the light emitting device is mounted on the mounting substrate via the bonding member, the self-alignment works effectively, and the light emitting device can be mounted within the mounting range with high accuracy.

<Embodiment 7>
The light emitting device 7000 according to the seventh embodiment of the present invention shown in FIG. 24 is different from the light emitting device 4000 according to the fourth embodiment in the shape of the second wiring and the insulating film.

The second wiring 13 of the light emitting device 7000 is located between the two end recesses in the rear view like the light emitting device 6000, and includes an exposed portion 131 exposed from the insulating film 18. The exposed portion 131 is surrounded by the insulating film 18 except for the bottom surface 113 side. By arranging the bonding member on the exposed portion 131, the bonding strength between the light emitting device 7000 and the mounting substrate can be improved.

The shape of the land pattern of the mounting substrate on which the light emitting device is mounted is not particularly limited, and may be a substantially quadrangular shape or a substantially circular shape. For example, as shown in FIG. 25A, the land pattern of the mounting substrate on which the light emitting device according to the first embodiment is mounted may include a wide portion W10 having a wide width and a narrow portion W9 having a narrow width in the X direction. .. By locating the narrow portion W9 at a position overlapping the recess in the bottom view, it is possible to improve the self-alignment property when the light emitting device is mounted on the mounting substrate. Further, since the land pattern includes the wide portion W10, the area of the land pattern in the bottom view can be increased. As a result, it is possible to suppress variations in the thickness of the joining member. Further, as shown in FIG. 25B, the land pattern of the mounting substrate on which the light emitting device in which the central depth of the recess is the maximum depth of the recess in the Z direction as in the light emitting device according to the first embodiment is mounted. It is preferable that the length W12 in the Z direction at the center of the land pattern is longer than the length W11 in the Z direction at the end of the land pattern. By doing so, it is possible to improve the self-alignment property when the light emitting device is mounted on the mounting substrate. Further, as shown in FIG. 25C, the land pattern includes a wide portion W10 and a narrow portion W9, and the length W14 in the central Z direction of the narrow portion of the land pattern is the narrow portion of the land pattern. It may be longer than the length W13 of the end portion in the Z direction. By doing so, it is possible to improve the self-alignment property when the light emitting device according to the first embodiment is mounted on the mounting substrate and to suppress the variation in the thickness of the joining member.

Further, as shown in FIG. 26A, the land pattern of the mounting substrate for mounting the light emitting device in which the depth of the recess in the Z direction becomes deeper as the distance from the center of the light emitting device increases, such as the light emitting device according to the fourth embodiment, is the light emitting device. It is preferable that the length W15 of the land pattern on the side far from the center of the light emitting device in the Z direction is longer than the length W16 of the land pattern on the side closer to the center of the light emitting device in the Z direction. By doing so, it is possible to improve the self-alignment property when the light emitting device is mounted on the mounting substrate. Further, as shown in FIG. 26B, the land pattern includes a wide portion W10 having a wide width and a narrow portion W9 having a narrow width in the X direction, and the narrow portion of the land pattern on the side far from the center of the light emitting device. It is preferable that the length W17 of the end portion in the Z direction is longer than the length W18 of the end portion of the narrow portion of the land pattern on the side closer to the center of the light emitting device in the Z direction. By locating the narrow portion at a position overlapping the end recess in the bottom view, it is possible to improve the self-alignment property when the light emitting device is mounted on the mounting substrate. Further, since the land pattern is provided with a wide portion, the area of the land pattern in the bottom view can be increased. As a result, it is possible to suppress variations in the thickness of the joining member. Further, the length W17 in the Z direction of the end portion of the narrow portion of the land pattern on the side far from the center of the light emitting device is the length in the Z direction of the end portion of the narrow portion of the land pattern on the side closer to the center of the light emitting device. By making it longer than W18, it is possible to improve the self-alignment property when the light emitting device is mounted on the mounting substrate.

<Embodiment 8>
The light emitting device 8000 according to the eighth embodiment of the present invention shown in FIGS. 27 to 30 has a number of light emitting elements mounted on the substrate and a recess provided in the base material as compared with the light emitting device 1000 according to the first embodiment. And the number of via holes and the shape of the translucent member are different. The shape of the recess 16 is the same as that of the first embodiment.

As shown in FIG. 28A, as in the first embodiment, the light emitting device 8000 has a base material located on the upper surface side of the recess because the depth of the recess in the front direction from the back surface is deeper on the bottom surface side than on the upper surface side. The thickness can be made thicker than the thickness of the base material located on the bottom surface side of the recess. As a result, it is possible to suppress a decrease in the strength of the base material. Further, since the volume of the joining member formed in the recess is increased due to the deep recess on the bottom surface side, the bonding strength between the light emitting device 8000 and the mounting substrate can be improved.

As shown in FIG. 28B, the number of light emitting elements may be three. The peak wavelengths of the three light emitting elements may be the same, or the peak wavelengths of the three light emitting elements may be different from each other. It may be different from the peak wavelength. In the present specification, the same peak wavelength of the light emitting element means that a fluctuation of about 5 nm is allowed. When the peak wavelengths of the light emitting elements are different, as shown in FIG. 28B, the peak wavelengths of light emission are different from those of the first light emitting element 20B in which the peak wavelength of light emission is in the range of 430 nm or more and less than 490 nm (wavelength range in the blue region). It is preferable to include a second light emitting element 20G in a range of 490 nm or more and 570 nm or less (wavelength range in the green region). In particular, as the second light emitting element 20G, it is preferable to use a light emitting element having a half width of 40 nm or less, and more preferably to use a light emitting element having a half width of 30 nm or less. As a result, the green light can easily have a sharp peak as compared with the case where the green light is obtained by using the green phosphor. As a result, the liquid crystal display device provided with the light emitting device 8000 can achieve high color reproducibility.

The arrangement of the first light emitting element 20B and the second light emitting element 20G is not particularly limited, but as shown in FIG. 28B, the first light emitting element 20B which is a blue light emitting element and the second light emitting element which is a green light emitting element are arranged in this order from the left. It is preferable that the 20G and the first light emitting element 20B, which is a blue light emitting element, are arranged side by side. By arranging the first light emitting element 20B and the second light emitting element 20G alternately side by side, the color mixing property of the light emitting device can be improved. The second light emitting element, the first light emitting element, and the second light emitting element may be arranged side by side in order from the left. Further, the number of the first light emitting elements 20B may be larger than the number of the second light emitting elements 20G depending on the light emitting characteristics to be obtained, and the number of the second light emitting elements 20G is larger than the number of the first light emitting elements. The number may be larger than the number of 20B, and the number of the first light emitting element 20B and the number of the second light emitting element 20G may be the same. By adjusting the number of light emitting elements, it is possible to obtain a light emitting device having an arbitrary color tone and amount of light.

As shown in FIG. 28B, when one translucent member 30 is located on the first light emitting element 20B and the second light emitting element 20G, the wavelength converting substance 32 absorbs the green light of the second light emitting element 20G. It is preferable that the red light is hardly emitted. That is, it is preferable that the wavelength converting substance 32 does not substantially convert green light into red light. The reflectance of the wavelength converting substance 32 with respect to green light is preferably 70% or more on average in the wavelength range of green light. By making the wavelength conversion material 32 a phosphor having a high reflectance to green light, that is, a phosphor that absorbs less green light, that is, a phosphor that hardly converts green light into wavelength, the design of a light emitting device can be facilitated. can do.
If a red phosphor that absorbs a large amount of green light is used, not only the first light emitting element 20B but also the second light emitting element 20G must be examined for the output balance of the light emitting device in consideration of the wavelength conversion by the wavelength converting substance 32. No. On the other hand, when the wavelength conversion substance 32 that hardly converts the wavelength of green light is used, the output balance of the light emitting device can be designed only by considering only the wavelength conversion of the blue light emitted by the first light emitting element 20B.

Examples of such a preferable wavelength conversion substance 32 include the following red phosphors. The wavelength conversion substance 32 is at least one or more of these.
The first type is a red phosphor whose composition is represented by the following general formula (I).

A ₂ MF ₆ : Mn ⁴⁺ (I)

However, in the above general formula (I), A is ^{at least one selected from the group consisting of K, Li, Na, Rb, Cs and NH 4+} , and M is from Group 4 elements and Group 14 elements. It is at least one element selected from the group.

Group 4 elements are titanium (Ti), zirconium (Zr) and hafnium (Hf). Group 14 elements are silicon (Si), germanium (Ge), tin (Sn) and lead (Pb).
As a specific example of the first type of red phosphor, K ₂ SiF ₆ : Mn ⁴⁺ , K ₂ (Si, Ge).
) F ₆ : Mn ⁴⁺ , K ₂ TiF ₆ : Mn ⁴⁺ can be mentioned.

The second type is a red phosphor whose composition is represented by 3.5 MgO, 0.5 MgF ₂ , GeO ₂ : Mn ⁴⁺ , or a red phosphor whose composition is represented by the following general formula (II). ..

(X-a) MgO ・ a (Ma) O ・ b / 2 (Mb) ₂ O ₃・ yMgF ₂・ c (Mc) X ₂・ (1-d-e) GeO ₂・ d (Md) O ₂・e (Me) ₂ O ₃ : Mn ⁴⁺ (II)

However, in the above general formula (II), Ma is at least one selected from Ca, Sr, Ba, and Zn, Mb is at least one selected from Sc, La, and Lu, and Mc is. , Ca, Sr, Ba, Zn, X is at least one selected from F, Cl, and Md is at least one selected from Ti, Sn, Zr. Yes, Me is at least one selected from B, Al, Ga, and In. Regarding x, y, a, b, c, d, and e, 2 ≦ x ≦ 4, 0 <y ≦ 2, 0 ≦ a ≦ 1.5, 0 ≦ b <1, 0 ≦ c ≦ 2,0 ≦ d ≦ 0.5 and 0 ≦ e <1.

Since the light emitting device 8000 has three light emitting elements, the width in the first direction (X direction) tends to be longer than in the case where the light emitting device has one light emitting element. Therefore, the number of dents and via holes may be changed as appropriate. For example, as shown in FIG. 30, the number of recesses 16 and via holes may be four.

As shown in FIG. 31, one translucent member 30 may be located on each of the first light emitting element and the second light emitting element, and as shown in FIG. 28B, one translucent member 30 may be located. However, it may be located on a plurality of light emitting elements. When one translucent member 30 is located on each of the first light emitting element and the second light emitting element as shown in FIG. 31, the translucent member 30 located on the first light emitting element 20B. , The material of the wavelength converting substance 32 contained in the translucent member 30 located on the second light emitting element 20G may be the same or different. For example, when the wavelength converting substance 32 absorbs the green light of the second light emitting element 20G and hardly emits red light, the translucent member 30 located on the first light emitting element 20B has red fluorescence. The wavelength converting substance 32 which is a body is contained, and the translucent member 30 located on the second light emitting element 20G does not have to contain the wavelength converting substance 32 which is a red phosphor. By doing so, the output balance of the light emitting device can be designed only by considering only the wavelength conversion of the blue light emitted by the first light emitting element 20B. When one translucent member 30 is located on each of the first light emitting element and the second light emitting element, the translucent member 30 located on the first light emitting element 20B and the second light emitting element 20G are topped. A covering member is formed between the translucent member 30 and the translucent member 30 located at. As shown in FIG. 28B, when one translucent member 30 is located on a plurality of light emitting elements, the area of the translucent member 30 in the front view can be increased, so that the light of the light emitting device can be increased. Extraction efficiency is improved. Further, by having one light emitting surface of the light emitting device, it is possible to reduce the uneven brightness of the light emitting device.

When one translucent member 30 is located on a plurality of light emitting elements, the light guide members 50 that join each light emitting element 20 and the translucent member 30 are separated from each other even if they are connected. You may be doing it. As shown in FIG. 28B, it is preferable that the light guide member 50 is positioned so as to connect between one light emitting element and the other light emitting element. By doing so, the light of the light emitting element can be guided to the light transmitting member from between one light emitting element and the other light emitting element via the light guide member, so that the brightness unevenness of the light emitting device is reduced. can do.

As shown in FIGS. 28B and 31, the translucent member 30 may include a layer containing the wavelength converting substance 32 and a layer 33 substantially not containing the wavelength converting substance. By locating the layer 33 that does not substantially contain the wavelength conversion substance on the layer that the translucent member 30 contains the wavelength conversion substance 32, the layer 33 that does not substantially contain the wavelength conversion substance can be used as a protective layer. Since it fulfills the function, deterioration of the wavelength conversion substance 32 can be suppressed. As shown in FIG. 31, when one translucent member 30 is located on each of the first light emitting element and the second light emitting element, the translucent member 30 located on the first light emitting element 20B. The thickness of the layer 33 that does not substantially contain the wavelength converting substance of No. 30 and the thickness of the layer 33 that does not substantially contain the translucent member 30 wavelength converting substance located on the second light emitting element 20G are the same but different. May be good. Further, when one translucent member 30 is located on each of the first light emitting element and the second light emitting element, the wavelength conversion material of the translucent member 30 located on the first light emitting element 20B. The thickness of the layer containing 32 and the thickness of the layer containing the translucent member 30 wavelength converting substance 32 located on the second light emitting element 20G may be the same or different. In the present specification, the same thickness means that a difference of about 5 μm is allowed.

Hereinafter, each component in the light emitting device according to the embodiment of the present invention will be described.

(Board 10)
The substrate 10 is a member on which a light emitting element is placed. The substrate 10 is composed of at least a base material 11, a first wiring 12, a second wiring 13, a third wiring 14, and a via hole 15.

(Base material 11)
The base material 11 can be constructed by using an insulating member such as a resin or a fiber reinforced resin, ceramics, or glass. Examples of the resin or fiber reinforced resin include epoxy, glass epoxy, bismaleimide triazine (BT), and polyimide. Examples of the ceramics include aluminum oxide, aluminum nitride, zirconium oxide, zirconium nitride, titanium oxide, titanium nitride, or a mixture thereof. Among these base materials, it is particularly preferable to use a base material having physical properties close to the coefficient of linear expansion of the light emitting element. The lower limit of the thickness of the base material can be appropriately selected, but from the viewpoint of the strength of the base material, it is preferably 0.05 mm or more, and more preferably 0.2 mm or more. Further, the upper limit of the thickness of the base material is preferably 0.5 mm or less, more preferably 0.4 mm or less, from the viewpoint of the thickness (depth) of the light emitting device.

(1st wiring 12, 2nd wiring 13, 3rd wiring 14)
The first wiring is arranged in front of the substrate and is electrically connected to the light emitting element. The second wiring is arranged on the back surface of the substrate and is electrically connected to the first wiring through the via hole. The third wiring covers the inner wall of the recess and is electrically connected to the second wiring. The first wiring, the second wiring and the third wiring can be formed of copper, iron, nickel, tungsten, chromium, aluminum, silver, gold, titanium, palladium, rhodium, or an alloy thereof. These metals or alloys may be single-layered or multi-layered. In particular, copper or a copper alloy is preferable from the viewpoint of heat dissipation. Further, the surface layer of the first wiring and / or the second wiring is a layer of silver, platinum, aluminum, rhodium, gold or an alloy thereof from the viewpoint of wettability and / or light reflectivity of the conductive adhesive member. May be provided.

(Beer hall 15)
The via hole 15 is provided in a hole penetrating the front surface and the back surface of the base material 11, and is a member that electrically connects the first wiring and the second wiring. The via hole 15 is composed of a fourth wiring 151 that covers the surface of the through hole of the base material, and a filling member 152 that is filled in the fourth wiring 151. For the fourth wiring 151, the same conductive members as those of the first wiring, the second wiring, and the third wiring can be used. As the filling member 152, a conductive member or an insulating member may be used.

(Insulating film 18)
The insulating film 18 is a member for ensuring insulation on the back surface and preventing a short circuit. The insulating film may be formed of any of those used in the art. For example, a thermosetting resin or a thermoplastic resin can be mentioned.

(Light emitting element 20)
The light emitting element 20 is a semiconductor element that emits light by itself when a voltage is applied, and a known semiconductor element composed of a nitride semiconductor or the like can be applied. Examples of the light emitting element 20 include an LED chip. The light emitting element 20 includes at least a semiconductor laminate 23, and in many cases further includes an element substrate 24. The top view shape of the light emitting element is preferably a rectangle, particularly a square shape or a rectangular shape long in one direction, but other shapes may be used, and for example, a hexagonal shape can increase the luminous efficiency. The side surface of the light emitting element may be perpendicular to the upper surface, or may be inclined inward or outward. Further, the light emitting element has positive and negative electrodes. The positive and negative electrodes can be composed of gold, silver, tin, platinum, rhodium, titanium, aluminum, tungsten, palladium, nickel or alloys thereof. The emission peak wavelength of the light emitting element can be selected from the ultraviolet region to the infrared region depending on the semiconductor material and its mixed crystal ratio. As the semiconductor material, it is preferable to use a nitride semiconductor, which is a material capable of emitting short-wavelength light capable of efficiently exciting a wavelength conversion substance. Nitride semiconductors are mainly represented by the general formula In _x Al _y Ga _1-x-y N (0 ≦ x, 0 ≦ y, x + y ≦ 1). The emission peak wavelength of the light emitting element is preferably 400 nm or more and 530 nm or less, more preferably 420 nm or more and 490 nm or less, and more preferably 450 nm or more and 475 nm or less from the viewpoint of luminous efficiency, excitation of the wavelength converting substance and the color mixing relationship with the emission thereof. More preferable. In addition, InAlGaAs-based semiconductors, InAlGaP-based semiconductors, zinc sulfide, zinc selenide, silicon carbide and the like can also be used. The element substrate of the light emitting element is mainly a crystal growth substrate capable of growing semiconductor crystals constituting the semiconductor laminate, but may be a bonding substrate for joining to a semiconductor element structure separated from the crystal growth substrate. .. Since the element substrate has translucency, it is easy to adopt flip-chip mounting, and it is easy to improve the light extraction efficiency. Examples of the base material of the element substrate include sapphire, gallium nitride, aluminum nitride, silicon, silicon carbide, gallium arsenide, gallium phosphorus, indium phosphorus, zinc sulfide, zinc oxide, zinc selenide, and diamond. Of these, sapphire is preferable. The thickness of the element substrate can be appropriately selected, for example, 0.02 mm or more and 1 mm or less, and preferably 0.05 mm or more and 0.3 mm or less from the viewpoint of the strength of the element substrate and / or the thickness of the light emitting device. ..

(Translucent member 30)
The translucent member is provided on the light emitting element and is a member that protects the light emitting element. The translucent member is composed of at least the following base materials. Further, the translucent member can function as a wavelength conversion substance by containing the following wavelength conversion substance 32 in the base material. Even when the translucent member includes a layer containing a wavelength converting substance and a layer substantially not containing a wavelength converting substance, the base material of each layer is configured as follows. The base material of each layer may be the same or different. However, it is not essential that the translucent member has a wavelength converting substance. Further, as the translucent member, a sintered body of a wavelength converting substance and an inorganic substance such as alumina, or a plate-shaped crystal of the wavelength converting substance can also be used.

(Base material 31 of translucent member)
The base material 31 of the translucent member may be any as long as it has translucency with respect to the light emitted from the light emitting element. The "translucency" means that the light transmittance at the emission peak wavelength of the light emitting element is preferably 60% or more, more preferably 70% or more, and even more preferably 80% or more. Say that. As the base material of the translucent member, a silicone resin, an epoxy resin, a phenol resin, a polycarbonate resin, an acrylic resin, or a modified resin thereof can be used. It may be glass. Among them, the silicone resin and the modified silicone resin are excellent in heat resistance and light resistance, and are preferable. Specific examples of the silicone resin include dimethyl silicone resin, phenyl-methyl silicone resin, and diphenyl silicone resin. The translucent member can be configured by using one of these base materials in a single layer or laminating two or more of these base materials. The "modified resin" in the present specification shall include a hybrid resin.

The base material of the translucent member may contain various fillers in the resin or glass. Examples of this filler include silicon oxide, aluminum oxide, zirconium oxide, zinc oxide and the like. As the filler, one of these can be used alone, or two or more of these can be used in combination. In particular, silicon oxide having a small coefficient of thermal expansion is preferable. Further, by using nanoparticles as a filler, it is possible to increase the scattering of light emitted by the light emitting element and reduce the amount of the wavelength converting substance used. The nanoparticles are particles having a particle size of 1 nm or more and 100 nm or less. Further, "particle size" herein, for example, it is defined by the D _50.

(Wavelength conversion substance 32)
The wavelength conversion substance absorbs at least a part of the primary light emitted by the light emitting element and emits secondary light having a wavelength different from that of the primary light. As the wavelength conversion substance, one of the following specific examples can be used alone or in combination of two or more.

The wavelength converting material emitting green light, yttrium-aluminum-garnet fluorescent material (e.g., _{Y 3 (Al, Ga) 5} O 12: Ce), lutetium-aluminum-garnet fluorescent material (e.g., _Lu 3 (Al, Ga) ₅ O ₁₂ : Ce), terbium aluminum garnet phosphor (eg Tb ₃ (Al, Ga) ₅ O ₁₂ : Ce) phosphor, silicate phosphor (eg (Ba, Sr) ₂ SiO ₄ : Eu ), Chlorosilicate-based phosphors (for example, Ca ₈ Mg (SiO ₄ ) ₄ Cl ₂ : Eu), β-sialon-based phosphors (for example, Si _6-z Al _{z Oz} N _8-z : Eu (0 <z <4) .2)), SGS phosphors (for example, SrGa ₂ S ₄ : Eu) and the like. As the wavelength conversion substance for yellow emission, an α-sialon phosphor (for example, M _z (Si, Al) ₁₂ (O, N) ₁₆ (where 0 <z ≦ 2 and M is Li, Mg, Ca, Y) , And lanthanide elements other than La and Ce). In addition, among the wavelength conversion substances that emit green light, there is also a wavelength conversion substance that emits yellow light. By substituting a part of Y with Gd, the emission peak wavelength can be shifted to the long wavelength side, and yellow emission is possible. In addition, among these, wavelength conversion substances capable of orange emission are also available. Examples of the wavelength converting substance that emits red light include nitrogen-containing calcium aluminosilicate (CASN or SCANSN) -based phosphors (for example, (Sr, Ca) AlSiN ₃ : Eu), and manganese-activated fluoride-based fluorescence. _{It is a phosphor represented by a} body (general formula (I) A ₂ [M _1-a Mn a F ₆ ] (however, in the above general formula (I), A is K, Li, Na, Rb, Cs. and at least one selected from the group consisting of NH _4, M is at least one element selected from the group consisting of group IV and group 14 elements, a is 0 <a <0.2 the fill)) can be mentioned as a representative example of the manganese-activated fluoride phosphors, phosphor manganese-activated fluoride potassium silicate (e.g. K ₂ SiF 6:. _Mn) is.

(Coating member 40)
From the viewpoint of upward light extraction efficiency, the light-reflecting coating member preferably has a light reflectance at the emission peak wavelength of the light emitting element of 70% or more, more preferably 80% or more, 90%. It is even more preferable that it is% or more. Further, the covering member is preferably white. Therefore, it is preferable that the coating member contains a white pigment in the base material. The covering member goes through a liquid state before being cured. The covering member can be formed by transfer molding, injection molding, compression molding, potting or the like.

(Base material of covering member)
A resin can be used as the base material of the coating member, and examples thereof include silicone resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, and modified resins thereof. Among them, the silicone resin and the modified silicone resin are excellent in heat resistance and light resistance, and are preferable. Specific examples of the silicone resin include dimethyl silicone resin, phenyl-methyl silicone resin, and diphenyl silicone resin. Further, the base material of the covering member may contain the same filler as the above-mentioned translucent member.

(White pigment)
White pigments include titanium oxide, zinc oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, magnesium silicate, barium titanate, barium sulfate, aluminum hydroxide, aluminum oxide, zirconium oxide, One of the silicon oxides can be used alone or in combination of two or more of them. The shape of the white pigment can be appropriately selected and may be amorphous or crushed, but spherical is preferable from the viewpoint of fluidity. The particle size of the white pigment is, for example, about 0.1 μm or more and 0.5 μm or less, but the smaller the particle size is preferable in order to enhance the effect of light reflection and coating. The content of the white pigment in the light-reflecting coating member can be appropriately selected, but from the viewpoint of light reflectivity and viscosity in the liquid state, for example, 10 wt% or more and 80 wt% or less is preferable, and 20 wt% or more and 70 wt% or less is preferable. More preferably, 30 wt% or more and 60 wt% or less are even more preferable. In addition, "wt%" is a weight percent, and represents the ratio of the weight of the material to the total weight of the light-reflecting coating member.

(Light guide member 50)
The light guide member is a member that adheres a light emitting element and a translucent member and guides light from the light emitting element to the translucent member. Examples of the base material of the light guide member include silicone resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, and modified resins thereof. Among them, the silicone resin and the modified silicone resin are excellent in heat resistance and light resistance, and are preferable. Specific examples of the silicone resin include dimethyl silicone resin, phenyl-methyl silicone resin, and diphenyl silicone resin. Further, the base material of the light guide member may contain the same filler as the above-mentioned translucent member. Further, the light guide member can be omitted.

(Conductive adhesive member 60)
The conductive adhesive member is a member that electrically connects the electrodes of the light emitting element and the first wiring. Conductive adhesive members include bumps such as gold, silver and copper, metal powders such as silver, gold, copper, platinum, aluminum and palladium and metal pastes containing resin binders, tin-bismuth, tin-copper and tin. Any one of solders such as -silver-based and gold-tin-based, and brazing materials such as low melting point metals can be used.

The light emitting device according to the embodiment of the present invention includes a liquid crystal display backlight device, various lighting fixtures, a large display, various display devices such as advertisements and destination guides, a projector device, and a digital video camera, a facsimile, and a copier. , Can be used as an image reading device in a scanner or the like.

1000, 2000 Light emitting device 10 Board 11 Base material 12 1st wiring 13 2nd wiring 14 3rd wiring 15 Via hole
151 4th wiring
152 Filling member 16 Indentation 18 Insulating film 20 Light emitting element 30 Translucent member 40 Coating member 50 Light guide member 60 Conductive adhesive member

Claims (5)

A light emitting module including a light emitting device and a mounting board on which the light emitting device is mounted.
The light emitting device is
A front surface extending in the first direction which is the longitudinal direction and the second direction which is the lateral direction, a back surface located on the opposite side of the front surface, a bottom surface adjacent to the front surface and orthogonal to the front surface, and a bottom surface of the bottom surface. A base material having an upper surface located on the opposite side, a first wiring arranged on the front surface, a second wiring arrangement arranged on the back surface, and the first wiring and the second wiring are electrically connected. Via holes, including substrates,
With at least one light emitting element electrically connected to the first wiring and mounted on the first wiring,
A light-reflecting coating member that covers the side surface of the light emitting element and the front surface of the substrate, and
With
The base material has a plurality of recesses that are open to the back surface and the bottom surface and are arranged in the first direction.
The plurality of recesses are separated from the via hole when viewed from the front.
The substrate has a third wire that covers the inner walls of the plurality of recesses and is electrically connected to the second wire.
Each of the depths of the plurality of recesses in the front direction from the back surface is deeper on the bottom surface side than on the top surface side.
The mounting board is
Includes a plurality of land patterns arranged at positions corresponding to the openings of the plurality of recesses on the bottom surface of the base material provided on the substrate of the light emitting device.
Each of the multiple land patterns is
It has a narrow portion and a wide portion arranged in a third direction orthogonal to the first direction and the second direction with respect to the narrow portion.
The width of the wide portion in the first direction is wider than that of the narrow portion.
The entire narrow portion overlaps the bottom surface,
A light emitting module in which the narrow portion is aligned with one of the openings of the plurality of recesses on the bottom surface. The narrow portion of the land pattern, wherein the length of the central portion in the first direction in the third direction is longer than the length of the end portion in the first direction in the third direction, according to claim 1. Luminous module. In the narrow portion of the land pattern, the length in the third direction on the side close to the center of the light emitting device in the first direction is the length on the side far from the center of the light emitting device in the first direction. The light emitting module according to claim 1, which is longer than the length in three directions. A light emitting module including a light emitting device and a mounting board on which the light emitting device is mounted.
The light emitting device is
A front surface extending in the first direction which is the longitudinal direction and the second direction which is the lateral direction, a back surface located on the opposite side of the front surface, a bottom surface adjacent to the front surface and orthogonal to the front surface, and a bottom surface of the bottom surface. A base material having an upper surface located on the opposite side, a first wiring arranged on the front surface, a second wiring arrangement arranged on the back surface, and the first wiring and the second wiring are electrically connected. Via holes, including substrates,
With at least one light emitting element electrically connected to the first wiring and mounted on the first wiring,
A light-reflecting coating member that covers the side surface of the light emitting element and the front surface of the substrate is provided.
The base material has a plurality of recesses that are open to the back surface and the bottom surface and are arranged in the first direction.
The plurality of recesses are separated from the via hole when viewed from the front.
The substrate has a third wire that covers the inner walls of the plurality of recesses and is electrically connected to the second wire.
Each of the depths of the plurality of recesses in the front direction from the back surface is deeper on the bottom surface side than on the top surface side.
The mounting board is
Includes a plurality of land patterns arranged at positions corresponding to the openings of the plurality of recesses on the bottom surface of the base material provided on the substrate of the light emitting device.
In each of the plurality of land patterns, the length of the central portion in the first direction in the first direction and the length in the third direction orthogonal to the second direction is set in the third direction of the end portion in the first direction. A light emitting module that is longer than the length. A light emitting module including a light emitting device and a mounting board on which the light emitting device is mounted.
The light emitting device is
A front surface extending in the first direction which is the longitudinal direction and the second direction which is the lateral direction, a back surface located on the opposite side of the front surface, a bottom surface adjacent to the front surface and orthogonal to the front surface, and a bottom surface of the bottom surface. A base material having an upper surface located on the opposite side, a first wiring arranged on the front surface, a second wiring arrangement arranged on the back surface, and the first wiring and the second wiring are electrically connected. Via holes, including substrates,
With at least one light emitting element electrically connected to the first wiring and mounted on the first wiring,
A light-reflecting coating member that covers the side surface of the light emitting element and the front surface of the substrate is provided.
The base material has a plurality of recesses that are open to the back surface and the bottom surface and are arranged in the first direction.
The plurality of recesses are separated from the via hole when viewed from the front.
The substrate has a third wire that covers the inner walls of the plurality of recesses and is electrically connected to the second wire.
Each of the depths of the plurality of recesses in the front direction from the back surface is deeper on the bottom surface side than on the top surface side.
The mounting board is
Includes a plurality of land patterns arranged at positions corresponding to the openings of the plurality of recesses on the bottom surface of the base material provided on the substrate of the light emitting device.
In each of the plurality of land patterns, the length in the third direction orthogonal to the first direction and the second direction on the side close to the center of the light emitting device in the first direction is the length in the first direction. A light emitting module that is longer than the length in the third direction on the side far from the center of the light emitting device.

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