JP6932609B2 - Data generation device, board inspection device and data generation method - Google Patents

Description

The present invention is a data generator that generates a first voltage value data indicating a voltage value of an inspection voltage when inspecting a multilayer substrate, a substrate inspection apparatus that inspects a multilayer substrate using the first voltage value data, and the like. And a data generation method for generating the first voltage value data.

As a substrate inspection apparatus of this type, a circuit board inspection apparatus disclosed by the applicant in Patent Document 1 below is known. This circuit board inspection device is provided with a signal generation unit, a storage unit, a control unit, etc., and can determine the quality of the insulation state between each conductor pattern on the circuit board, and can inspect the quality of the circuit board from the judgment result. Has been done. In this case, the storage unit stores inspection conditions such as the voltage value of the inspection signal applied to the conductor pattern, and the control unit performs the inspection according to the inspection conditions. Specifically, the control unit applies an inspection signal of the voltage value specified in the inspection conditions to the pair of conductor patterns, and at this time, the current flowing between each conductor pattern and the voltage value of the inspection signal are set. Based on this, the resistance value between each conductor pattern is calculated. Next, the control unit determines whether or not the calculated resistance value is equal to or higher than the reference value, and when it is equal to or higher than the reference value, determines that the insulation state between the conductor patterns is good, and when it is less than the reference value. Judge that the insulation state is poor. Further, when the control unit determines that the insulation state between the conductor patterns is good, it determines that the circuit board is good, and when it determines that the good or bad insulation state is poor, the circuit board is defective. Is determined.

Japanese Unexamined Patent Publication No. 2012-78276 (Pages 6-8, Fig. 1)

However, the circuit board inspection device described above has the following problems to be improved. Specifically, in this circuit board inspection device, the quality of the insulation state between each conductor pattern is good or bad based on the resistance value calculated by applying the inspection signal of the voltage value specified in the inspection conditions to the pair of conductor patterns. Is determined, and further, the quality of the circuit board is determined from the judgment result of the quality of the insulation state. However, even if the circuit board is judged to be good by the inspection under the predetermined inspection conditions, when the circuit board has a potential defect that cannot be found under the inspection conditions, the circuit board is caused by the potential defect. Problems may occur during use of the board. For example, in a multilayer substrate in which a conductor pattern (inner layer conductor pattern) is formed inside the substrate, voids may occur between the inner layer conductor patterns, and when such voids are generated, each inner layer Since sufficient insulation between conductor patterns is not ensured, even if the insulation condition is judged to be good by the inspection under the inspection conditions, an electric signal with a voltage value higher than the voltage value specified by the inspection conditions is generated. When applied while the multilayer board is in use, air discharge may occur in the portion where the voids are generated, and the multilayer board may be damaged. That is, the circuit board inspection device has a problem that a multilayer board having gaps between inner layer conductor patterns may not be determined as a defective product. In this case, a configuration is also conceivable in which an inspection signal having a voltage value equal to or higher than the voltage value at which air discharge occurs at a location where an air gap is generated is applied to determine the quality of the multilayer board. However, in this configuration, when the voltage value is too high, even when there are no gaps between the inner layer conductor patterns (that is, the multilayer board is a good product), in the portion where the inner layer conductor patterns are close to each other. Dielectric breakdown occurs or air discharge occurs between the conductor patterns on the surface of the multilayer board to which the inspection signal is applied, which damages the multilayer board and makes a good multilayer board defective. There is a risk.

The present invention has been made in view of such a problem, and is a data generation device capable of generating voltage value data capable of determining that a gap is generated between inner layer conductors of a multilayer substrate while preventing damage to the multilayer substrate. An object of the present invention is to provide a data generation method and a substrate inspection apparatus capable of determining that a gap is generated between inner layer conductors of a multilayer substrate while preventing damage to the multilayer substrate.

In order to achieve the above object, the data generation device according to claim 1 has an inner layer conductor provided inside the substrate, and surface conductors connected to the inner layer conductors are adjacent to each other in a multilayer substrate provided on the surface of the substrate. The voltage value of the inspection voltage when the inspection voltage is applied to the pair of the inner layer conductors through the pair of the surface conductors to inspect the quality of the multilayer substrate is specified as the specified voltage value, and the specified voltage value is specified. A data generation device including a processing unit that executes a data generation process for generating the first voltage value data indicating the above, wherein the pair of inner layer conductors are closest to each other in the data generation process. Based on the first distance between the inner layer conductors in the first proximity portion and the insulation strength value of the substrate, the first voltage value at which insulation failure occurs in the first proximity portion is calculated. , Air discharge occurs at the second proximity portion based on the second distance between the surface conductors at the second proximity portion where the pair of surface conductors are closest to each other and the insulation strength value of air. The process of calculating the second voltage value to be generated and defining the specified voltage value based on the lower of the first voltage value and the second voltage value is performed on the pair of inner layer conductors. This is executed for each combination, and the first voltage value data indicating the specified voltage value for each combination is generated.

Further, the data generation device according to claim 2 is the data generation device according to claim 1, wherein the processing unit obtains a voltage value obtained by multiplying a predetermined coefficient less than 1 by the lower voltage value. It is specified as the specified voltage value.

Further, the data generation device according to claim 3 includes a storage unit for storing board data capable of specifying the structure of the multilayer board in the data generation device according to claim 1 or 2, and the processing unit is the substrate. The first distance and the second distance are specified based on the data.

Further, the data generation device according to claim 4 is the data generation device according to any one of claims 1 to 3, wherein the processing unit is the first proximity portion when the first proximity portion is a gap. The process of calculating the third voltage value at which the air discharge is generated based on the first distance and the dielectric strength value of the air is executed for each combination of the pair of inner layer conductors, and the said for each combination. Generates second voltage value data that can identify the third voltage value.

Further, the substrate inspection device according to claim 5 uses the inspection voltage of the specified voltage value indicated by the first voltage value data generated by the data generation device according to any one of claims 1 to 4. A voltage output unit to be output and the inspection voltage output from the voltage output unit are applied to the surface conductor and each inner layer conductor in a state of being applied to the pair of inner layer conductors via the pair of surface conductors. Based on the measuring unit that measures the current value of the flowing current and the current value measured by the measuring unit, the presence or absence of voids in the first proximity portion is determined, and the multi-layer substrate is determined based on the result of the determination. It is equipped with an inspection unit that determines the quality.

The board inspection device according to claim 6 includes a voltage output unit that outputs the inspection voltage of the specified voltage value indicated by the first voltage value data generated by the data generation device according to claim 4. , The current value of the current flowing through each surface conductor and each inner layer conductor in a state where the inspection voltage output from the voltage output unit is applied to the pair of inner layer conductors via the pair of surface conductors. An inspection unit that determines the presence or absence of voids in the first proximity portion based on the measuring unit to be measured and the current value measured by the measuring unit, and determines the quality of the multilayer substrate based on the result of the determination. In the case where the specified voltage value is lower than the third voltage value specified by the second voltage value data generated by the data generator, the inspection unit is in the first proximity portion. When it is determined that the void does not exist, it is notified that the specified voltage value is lower than the third voltage value.

Further, in the data generation method according to claim 7, an inner layer conductor is provided inside the substrate, and a pair of adjacent inner layers in a multilayer substrate in which surface conductors connected to the inner layer conductors are provided on the surface of the substrate. When an inspection voltage is applied to a conductor via a pair of the surface conductors to inspect the quality of the multilayer substrate, the voltage value of the inspection voltage is defined as a specified voltage value, and the specified voltage value is shown. It is a data generation method for executing a data generation process for generating voltage value data of the above, and in the data generation process, between the inner layer conductors in a first proximity portion where the pair of inner layer conductors are closest to each other. Based on the first distance and the insulation strength value of the substrate, the first voltage value at which insulation failure occurs at the first proximity portion is calculated, and the pair of surface conductors are closest to each other. Based on the second distance between the surface conductors at the two proximity portions and the insulation strength value of the air, the second voltage value at which the air discharge occurs at the second proximity portion is calculated, and the first voltage value is calculated. The process of defining the specified voltage value based on the lower of the voltage value of the above and the second voltage value is executed for each combination of the pair of inner layer conductors, and the specified voltage value for each combination is calculated. The first voltage value data shown is generated.

The data generator according to claim 1 and the data method according to claim 7 calculate a first voltage value at which dielectric breakdown occurs at a first proximity portion of a pair of inner layer patterns, and at the same time, a pair of surface conductors. The second voltage value at which air discharge occurs in the vicinity of 2 is calculated, and the specified voltage value of the inspection voltage is set based on the lower voltage value of the first voltage value and the second voltage value. The specified process is executed for each combination of the pair of inner layer patterns, and the first voltage value data indicating the specified voltage value for each combination is generated. In this case, when the inspection voltage of the specified voltage value indicated by the first voltage value data is applied to the pair of inner layer patterns to inspect the quality of the multilayer substrate, dielectric breakdown occurs in the first proximity portion. Or, it is possible to surely prevent the occurrence of an air discharge at the second proximity portion. Therefore, according to this data generation device and data generation method, it is possible to determine that a gap is generated between the inner layer patterns of the multilayer board while surely preventing damage to the good multilayer board due to dielectric breakdown or air discharge. It is possible to generate first voltage value data indicating a specified voltage value.

Further, according to the data generator according to claim 2, the voltage value obtained by multiplying the lower voltage value of the first voltage value and the second voltage value by a coefficient less than 1 is set as the specified voltage value. By specifying, the specified voltage value can be specified as a voltage value lower than the first voltage value and the second voltage value, so that insulation failure may occur at the first proximity portion or the second proximity may occur. Voids are generated between the inner layer patterns while more reliably preventing the occurrence of air discharge at the site and more reliably preventing insulation breakage and damage to the good multilayer substrate due to air discharge. It is possible to generate first voltage value data indicating a specified voltage value capable of determining.

Further, according to the data generation device according to claim 3, the first distance and the second distance used for calculating the first voltage value and the second voltage value based on the board data that can specify the structure of the multilayer board. By specifying the distance, the first distance and the second distance can be automatically specified, so that the first distance and the second distance can be compared with the configuration and method of manually calculating the first distance and the second distance. , The efficiency of the process of generating the first voltage value data can be sufficiently improved.

Further, in the data generation device according to claim 4, when the first proximity portion is a gap, the third voltage value at which an air discharge occurs in the first proximity portion is set to the first distance and the dielectric strength value of air. The process of calculating based on the above is executed for each combination of the pair of inner layer patterns, and the second voltage value data indicating each third voltage value is generated. In this case, when the specified voltage value is specified to be lower than the third voltage value, it may not be possible to correctly determine the presence or absence of voids in the first proximity portion, but the specified voltage value is the third voltage. This second voltage value data is a combination of a pair of inner layer patterns defined by a voltage value lower than the value, that is, a combination of a pair of inner layer patterns in which the presence or absence of voids in the first proximity portion may not be correctly determined. And the first voltage value data can be specified. Therefore, for a usage pattern that notifies the user of the inner layer pattern that may not be able to correctly determine the presence or absence of voids in the first proximity portion, the second data generation device and the second data generation method are used. The voltage value data of can be effectively used.

Further, according to the substrate inspection apparatus according to claim 5, the voltage output unit that outputs the inspection voltage of the specified voltage value indicated by the first voltage value data and the inspection voltage are applied to the pair of inner layer patterns. A measuring unit that measures the current value of the current flowing through each inner layer pattern in the state of being present, and a multi-layer substrate that determines the presence or absence of voids in the first proximity portion of the pair of inner layer patterns based on the current value and based on the determination result. By providing an inspection unit that determines the quality of the product, it is possible to ensure that the application of the inspection voltage causes dielectric breakdown in the first proximity portion and aerial discharge in the second proximity portion. Can be prevented. Therefore, according to this substrate inspection device, the presence or absence of voids between the inner layer conductors of the multilayer substrate is determined while reliably preventing damage to the multilayer substrate due to dielectric breakdown or air discharge, and the quality of the multilayer substrate is accurately determined. It can be determined.

Further, when the substrate inspection apparatus according to claim 6 determines that there is no void in the first proximity portion when the specified voltage value is lower than the third voltage value indicated by the second voltage value data. , Notifies that the specified voltage value is lower than the third voltage value. Therefore, according to this substrate inspection device, the presence or absence of voids in the first proximity portion is not correctly determined for the inner layer pattern whose specified voltage value is defined as a voltage value lower than the third voltage value. It is possible to make the user aware that there is a risk. Further, by performing such notification, for example, the coefficient is changed to redefine the specified voltage value to a voltage value higher than the third voltage value, and the inspection for the target inner layer pattern is re-executed. You can take action.

It is a block diagram which shows the structure of the substrate inspection apparatus 1. It is a block diagram which shows the structure of the multilayer board 100. It is a flowchart of data generation processing 50. It is a flowchart of inspection process 70. It is explanatory drawing explaining the content of voltage value data Da.

Hereinafter, embodiments of a data generation device, a substrate inspection device, and a data generation method will be described with reference to the accompanying drawings.

First, the configuration of the substrate inspection device 1 shown in FIG. 1 will be described. The substrate inspection device 1 is an example of a substrate inspection device, and is configured to be capable of inspecting, for example, the multilayer substrate 100 shown in FIG.

Here, as an example, as shown in FIG. 2, a plurality of multilayer boards 100 are used (for example, one inner layer) in the thickness direction of the board 101 (direction from the front side to the back side of the paper surface in the figure). For example, four) inner layer patterns 102a to 102d (corresponding to inner layer conductors, hereinafter also referred to as "inner layer patterns 102" when not distinguished) are provided, and lands 103a to 103h (corresponding to each inner layer pattern 102) connected to each inner layer pattern 102, respectively. Corresponding to the surface conductor, hereinafter, also referred to as “land 103” when not distinguished) is provided on the surface 101a of the substrate 101. In the figure, the multilayer board 100 is shown in a plan view, and the land 103 provided on the surface 101a of the board 101 (exposed on the surface 101a) is shown by a solid line, and the inside 101b of the board 101 is shown. The inner layer pattern 102 provided in the above is shown by a broken line.

Further, as shown in FIG. 1, the substrate inspection device 1 includes a voltage output unit 2, a probing mechanism 3, a measurement unit 4, a storage unit 5, a display unit 6, and a processing unit 7. In this case, the data generation device is configured by the storage unit 5 and the processing unit 7.

The voltage output unit 2 outputs the inspection voltage Vi used in the inspection process 70 described later according to the control of the processing unit 7.

The probing mechanism 3 follows the control of the processing unit 7 in a direction parallel to the surface 101a of the substrate 101 (XY direction) in the multilayer substrate 100 held by the holding portion (not shown) and a direction in which the probing mechanism 3 is brought into contact with and separated from the multilayer substrate 100. Probing is performed by moving the pair of probes 31 in the (Z direction) and bringing the probes 31 and 31 into contact with the pair of lands 103 and 103 provided on the surface 101a of the substrate 101.

In the measuring unit 4, each land 103 is in a state where the inspection voltage Vi output from the voltage output unit 2 is applied to the pair of inner layer patterns 102 adjacent to each other via the pair of lands 103 in the probe 31 and the multilayer board 100. And the current value Ia of the current I flowing through each inner layer pattern 102 is measured according to the control of the processing unit 7.

The storage unit 5 stores the substrate data Ds used in the data generation process 50 (see FIG. 3), which will be described later, executed by the processing unit 7. In this case, the substrate data Ds includes data that can specify the structure of the multilayer substrate 100, specifically, design data indicating the shape and arrangement position of the inner layer pattern 102 and the land 103 on the multilayer substrate 100, and the multilayer substrate 100. Data indicating the dielectric strength value Sda of the substrate 101 (the dielectric strength value of the material constituting the substrate 101) is included. Further, the storage unit 5 stores numerical data Dv indicating the dielectric strength value Sdb of air. Further, the storage unit 5 stores the voltage value data Da (first voltage value data) and the voltage value data Db (second voltage value data) generated in the data generation process 50.

The display unit 6 displays various information in the inspection process 70, which will be described later, executed by the processing unit 7 under the control of the processing unit 7.

The processing unit 7 controls each unit constituting the substrate inspection device 1. Further, the processing unit 7 executes the data generation process 50 (see FIG. 3) according to the data generation method, defines the specified voltage value Vr of the inspection voltage Vi used in the inspection process 70 (see FIG. 4), and defines the specified voltage value. The voltage value data Da (first voltage value data) indicating Vr is generated and stored in the storage unit 5. Further, the processing unit 7 functions as an inspection unit, executes the inspection process 70, and determines the quality of the multilayer board 100.

Next, a method of inspecting, for example, the multilayer substrate 100 shown in FIG. 2 using the substrate inspection device 1 will be described with reference to the drawings.

First, prior to the inspection of the multilayer board 100, an operation unit (not shown) is operated to instruct the generation of voltage value data Da indicating the specified voltage value Vr of the inspection voltage Vi used in the inspection (inspection process 70). In response to this, the processing unit 7 executes the data generation process 50 (process according to the data generation method) shown in FIG.

In the data generation process 50, the processing unit 7 reads the substrate data Ds for the multilayer substrate 100 from the storage unit 5 (step 51). Next, the processing unit 7 specifies the shape and arrangement position of the inner layer pattern 102 provided on the multilayer substrate 100 and the shape and arrangement position of the land 103 connected to the inner layer pattern 102 based on the substrate data Ds (). Step 52).

Subsequently, the processing unit 7 selects a pair of adjacent inner layer patterns 102 (for example, inner layer patterns 102a and 102b shown in FIG. 2) among the respective inner layer patterns 102 (step 53). Next, the processing unit 7 identifies the lands 103 (in this example, lands 103a to 103d) connected to the selected pair of inner layer patterns 102 (step 54).

Subsequently, the processing unit 7 moves between the inner layer patterns 102a and 102b in the proximity portion Pa (first proximity portion: see FIG. 2) in which the pair of inner layer patterns 102a and 102b selected in step 53 are closest to each other. The shortest distance La (first distance) of is specified based on the substrate data Ds (step 55).

Next, the processing unit 7 is based on the dielectric strength value Sda of the substrate 101 shown in the substrate data Ds and the distance La (specifically, multiplying the dielectric strength value Sda and the distance La) at the proximity portion Pa. The voltage value Va (first voltage value) at which dielectric breakdown occurs is calculated (step 56). In this case, for example, as shown in FIG. 5, when the dielectric strength value Sda is 15 kV / mm and the distance La is 0.2 mm, the voltage value Va is 15 kV / mm × 0.2 mm = 3 kV.

Subsequently, the processing unit 7 uses one of the lands 103a and 103b connected to the inner layer pattern 102a specified in step 54 above and the lands 103c and 103d connected to the inner layer pattern 102b based on the substrate data Ds. From the combination with any one of the above, the combination in which both lands 103 are closest to each other (in this example, the combination of lands 103a and 103c) is specified, and the proximity parts Pb in which the lands 103a and 103c are closest to each other are specified. The shortest distance Lb (second distance) between the lands 103a and 103b in (second proximity portion: see FIG. 2) is specified (step 57).

Next, the processing unit 7 reads the numerical data Dv from the storage unit 5, and based on the dielectric strength value Sdb and the distance Lb of the air shown in the numerical data Dv (specifically, the dielectric strength value Sdb and the distance Lb). To calculate the voltage value Vb (second voltage value) at which the air discharge occurs at the proximity portion Pb (step 58). In this case, for example, as shown in FIG. 5, when the dielectric strength value Sdb is 3 kV / mm and the distance Lb is 2 mm, the voltage value Vb is 3 kV / mm × 2 mm = 6 kV.

Subsequently, the processing unit 7 determines which of the voltage value Va and the voltage value Vb is lower (step 59). Next, the processing unit 7 defines a voltage value obtained by multiplying one of the voltage values Va and Vb determined to be low by a predetermined coefficient α (for example, 0.8) of less than 1 as the specified voltage value Vr. (Step 60). In this example, as described above, since the voltage value Va is 3 kV and the voltage value Vb is 6 kV, the processing unit 7 sets the specified voltage value Vr to 2.4 kV obtained by multiplying the low voltage value 3 kV by 0.8. (See Fig. 5).

Next, the processing unit 7 multiplies the dielectric strength value Sdb of air shown in the numerical data Dv and the distance La specified in step 55 above (specifically, multiplying the dielectric strength value Sdb and the distance La). ), The voltage value Vc (third voltage value) at which air discharge occurs in the proximity portion Pa when a gap is generated in the proximity portion Pa is calculated (step 61). In this case, for example, when all the regions of the proximity portion Pa are voids (the proximity portion Pa is filled with air), the dielectric strength value Sdb is 3 kV / mm, and the distance La is 0.2 mm. The voltage value Vc is 3 kV / mm × 0.2 mm = 0.6 kV (see FIG. 5).

Subsequently, the processing unit 7 determines whether or not the processing of defining the specified voltage value Vr and calculating the voltage value Vc for all combinations of the pair of adjacent inner layer patterns 102 is completed (step 62). In this case, since each of these processes for all combinations has not been completed at this point, the processing unit 7 selects another pair of inner layer patterns 102 (for example, inner layer patterns 102b and 102c) (step 53). ), Then, each of the processes of steps 54 to 61 described above is executed to define the specified voltage value Vr for the inner layer patterns 102b and 102c and to calculate the voltage value Vc (see FIG. 5).

Hereinafter, in the same manner, the processing unit 7 executes each of the processes of steps 54 to 61 for all combinations of the pair of adjacent inner layer patterns 102, and as shown in FIG. 5, each of the pair of inner layer patterns 102. The specified voltage value Vr for the combination is specified and the voltage value Vc is calculated.

Subsequently, when the processing unit 7 determines in step 62 that the processing for defining the specified voltage value Vr and calculating the voltage value Vc for all combinations has been completed, the processing unit 7 determines that the specified voltage for each combination of the pair of inner layer patterns 102 has been completed. The voltage value data Da indicating the value Vr is generated, the voltage value data Db indicating the voltage value Vc for each combination of the pair of inner layer patterns 102 is generated, and the generated voltage value data Da and Db are stored in the storage unit 5. (Step 63), the data generation process 50 is completed.

Next, the operation unit is operated to instruct the start of the inspection. In response to this, the processing unit 7 executes the inspection process 70 shown in FIG. In this inspection process 70, the processing unit 7 reads out the substrate data Ds, the voltage value data Da, and the voltage value data Db for the multilayer substrate 100 from the storage unit 5 (step 71). Subsequently, the processing unit 7 identifies each inner layer pattern 102 provided on the multilayer substrate 100 based on the substrate data Ds (step 72). Next, the processing unit 7 selects a pair of inner layer patterns 102 (for example, inner layer patterns 102a and 102b) from each inner layer pattern 102 (step 73). Subsequently, the processing unit 7 puts the lands 103a and 103c closest to each other among the lands 103 connected to the selected inner layer patterns 102a and 102b, respectively (land 103 targeted when specifying the distance Lb). Is specified based on the substrate data Ds (step 74).

Next, the processing unit 7 controls the probing mechanism 3 to move the probe 31, and causes the lands 103a and 103c to prob the probe 31 (step 75). Subsequently, the processing unit 7 specifies the specified voltage value Vr (2.4 kV (see FIG. 5 in this example)) for the inner layer patterns 102a and 102b based on the voltage value data Da (step 76). Next, the processing unit 7 controls the voltage output unit 2 to output the inspection voltage Vi having the specified voltage value Vr (step 77). In this case, the average supply power can be controlled to a value equal to or less than a predetermined value by forming the inspection voltage Vi to be output to the voltage output unit 2 in a pulse shape. As a result, the inspection voltage Vi is applied to the inner layer patterns 102a and 102b via the probes 31 and the lands 103a and 103c.

Subsequently, the processing unit 7 controls the measuring unit 4 to measure the current value Ia of the current I flowing through each land 103 and each inner layer pattern 102 by applying the inspection voltage Vi (step 78). Next, the processing unit 7 determines the insulation state and the presence / absence of voids in the inner layer patterns 102a and 102b based on the current value Ia measured by the measuring unit 4 (step 79).

Here, for example, when the inner layer patterns 102a and 102b are short-circuited, the measuring unit 4 measures a current value Ia of a predetermined reference value Ir1 or more. Therefore, when the current value Ia is equal to or higher than the reference value Ir1, the processing unit 7 determines that the inner layer patterns 102a and 102b are short-circuited (insulation state is poor).

Further, when a void is generated in the proximity portion Pa of the inner layer patterns 102a and 102b, and the specified voltage value Vr of the inspection voltage Vi exceeds the above-mentioned voltage value Vc, the air is in the air in the proximity portion Pa. A discharge occurs, and the measuring unit 4 measures a current value Ia that is equal to or higher than the predetermined reference value Ir2 (the reference value Ir2 is lower than the reference value Ir1) and less than the reference value Ir1. Therefore, when the current value Ia is equal to or more than the reference value Ir2 and less than the reference value Ir1, the processing unit 7 determines that a gap is generated in the proximity portion Pa of the inner layer patterns 102a and 102b.

Further, when there is no gap between the inner layer patterns 102a and 102b and the insulation state between the inner layer patterns 102a and 102b is good, the current value Ia less than the reference value Ir2 is measured by the measuring unit 4. Therefore, when the current value Ia is less than the reference value Ir2, the processing unit 7 determines that the insulation state between the inner layer patterns 102a and 102b is good. Since the air discharge occurs intermittently, the current value Ia of the current I from which the pulse component is removed is measured via a low-pass filter, and the presence or absence of voids is compared with the current value Ia and the reference value Ir2. It is also possible to adopt a configuration and a method for determining. It is also possible to adopt a configuration and method in which the pulse current flowing due to the air discharge is detected and the presence or absence of the air discharge is determined based on the presence or absence of the pulse current.

In this case, in this configuration and method, the inspection voltage of the specified voltage value Vr specified based on the lower voltage value of the voltage values Va and Vb (specified to be lower than the lower voltage value). Vi is applied to the pair of inner layer patterns 102 to determine the presence or absence of voids in each inner layer pattern 102. Therefore, with this configuration and method, it is possible to reliably prevent dielectric breakdown at the proximity portion Pa and air discharge at the proximity portion Pb. Therefore, with this configuration and method, it is possible to determine that a gap is generated between the inner layer patterns 102 of the multilayer substrate 100 while reliably preventing damage to the non-defective multilayer substrate 100 due to dielectric breakdown or air discharge. It has become.

Subsequently, the processing unit 7 determines whether or not the processing for determining the insulation state and the presence / absence of voids for all the inner layer patterns 102 has been completed (step 80).

In this case, at this point in time, the process of determining the insulation state and the presence or absence of voids in all the inner layer patterns 102 has not been completed, so that the processing unit 7 performs another pair of inner layer patterns 102 (for example, the inner layer pattern 102b, 102c) is selected (step 73), and then the above-mentioned processes of steps 74 to 79 are executed to determine the insulation state and the presence or absence of voids in the inner layer patterns 102b and 102c.

Hereinafter, in the same manner, the processing unit 7 executes each of the processes of steps 74 to 79 for all the combinations of the pair of inner layer patterns 102, and the insulation state and the presence or absence of voids for each combination of the pair of inner layer patterns 102. To judge.

Subsequently, when the processing unit 7 determines in step 80 that the determination of the insulation state and the presence / absence of voids for all combinations of the pair of inner layer patterns 102 has been completed, the quality of the multilayer substrate 100 is based on the determination result. The determination is performed, and the determination result is displayed on the display unit 6 (step 81). In this case, when the processing unit 7 determines that the insulation state of all the combinations of the pair of inner layer patterns 102 is good (no voids are generated), the processing unit 7 determines that the multilayer substrate 100 is good, and displays that fact. Display on 6. Further, when it is determined that the insulation state of one or more combinations of the pair of inner layer patterns 102 is defective or voids are generated, the multilayer substrate 100 is determined to be defective, and that fact and the insulation state are defective or voids. Information indicating the inner layer pattern 102 determined to have occurred is displayed on the display unit 6, and the inspection process 70 is terminated.

Here, with respect to the inner layer patterns 102c and 102d shown in FIG. 2, as shown in FIG. 5, the specified voltage value Vr is set to a voltage value lower than the voltage value Vc (voltage value at which air discharge occurs in the vicinity portion Pa). It is stipulated. At this time, even when a gap is generated in the proximity portion Pa, the current value Ia measured by the measuring unit 4 becomes equal to or less than the reference value Ir2 without generating an air discharge in the proximity portion Pa, and the gap is generated. If not, it may be misjudged. That is, when the specified voltage value Vr is specified to be a voltage value lower than the voltage value Vc, there is a possibility that the presence or absence of a gap in the proximity portion Pa cannot be correctly determined. Therefore, in the substrate inspection device 1, the processing unit 7 defines a pair of inner layer patterns in which the specified voltage value Vr is defined as a voltage value lower than the voltage value Vc based on the voltage value data Da and the voltage value data Db. When the combination of 102 is specified and it is determined that no void is generated in the proximity portion Pa of the pair of inner layer patterns 102, the specified voltage value Vr is specified as a voltage value lower than the voltage value Vc, and the voltage value thereof is specified. Information such as a number indicating the pair of inner layer patterns 102 is displayed (notified) on the display unit 6 together with the determination result of the quality determination of the multilayer substrate 100. By displaying such information, it is possible to make the user recognize that the presence or absence of voids in the proximity portion Pa may not be correctly determined for the pair of inner layer patterns 102. Further, by displaying such information, for example, the above-mentioned coefficient α is changed from 0.8 to 0.9, and the specified voltage value Vr is redefined to a voltage value higher than the voltage value Vc. It is possible to take measures such as re-execution of the inspection for the inner layer pattern 102.

As described above, in this data generation device and the data generation method, the voltage value Va at which dielectric breakdown occurs at the proximity portion Pa of the pair of inner layer patterns 102 is calculated, and the air discharge occurs at the proximity portion Pb of the pair of lands 103. The voltage value Vb to be performed is calculated, and the process of defining the specified voltage value Vr of the inspection voltage Vi based on the lower voltage value of the voltage values Va and Vb is executed for each combination of the pair of inner layer patterns 102. The voltage value data Da indicating the specified voltage value Vr for each combination is generated. In this case, when the inspection voltage Vi of the specified voltage value Vr indicated by the voltage value data Da is applied to the pair of inner layer patterns 102 to inspect the quality of the multilayer substrate 100, dielectric breakdown occurs at the proximity portion Pa. In addition, it is possible to reliably prevent the occurrence of air discharge at the nearby portion Pb. Therefore, according to this data generation device and data generation method, a gap is generated between the inner layer patterns 102 of the multilayer substrate 100 while surely preventing damage to the non-defective multilayer substrate 100 due to dielectric breakdown or air discharge. It is possible to generate voltage value data Da indicating a specified voltage value Vr that can determine.

Further, according to this data generator and the data generation method, the voltage value obtained by multiplying the lower voltage value of the voltage values Va and Vb by the coefficient α less than 1 is defined as the specified voltage value Vr. Since the specified voltage value Vr can be specified to a voltage value lower than the voltage values Va and Vb, it is possible to cause dielectric breakdown at the proximity portion Pa or air discharge at the proximity portion Pb. A voltage indicating a specified voltage value Vr that can be determined to have a gap between the inner layer patterns 102 while reliably preventing damage to the non-defective multilayer substrate 100 due to dielectric breakdown or air discharge. Value data Da can be generated.

Further, according to this data generation apparatus and data generation method, the distance La is specified by specifying the distances La and Lb used for calculating the voltage values Va and Vb based on the substrate data Ds that can specify the structure of the multilayer substrate 100. , Lb can be specified automatically, so that the efficiency of the process of generating the voltage value data Da can be sufficiently improved as compared with the configuration and method of manually calculating the distances La and Lb. ..

Further, in this data generation device and data generation method, a process of calculating a voltage value Vc at which an air discharge occurs in a proximity portion Pa when the proximity portion Pa is a void is calculated based on a distance La and an air dielectric strength value Sdb. Is executed for each combination of the pair of inner layer patterns 102 to generate voltage value data Db indicating each voltage value Vc. In this case, when the specified voltage value Vr is specified as a voltage value lower than the voltage value Vc, the presence or absence of a gap in the proximity portion Pa may not be correctly determined, but the specified voltage value Vr is lower than the voltage value Vc. The combination of the pair of inner layer patterns 102 defined by the voltage value, that is, the combination of the pair of inner layer patterns 102 that may not be able to correctly determine the presence or absence of voids in the proximity portion Pa, is combined with the voltage value data Db and the voltage value data Da. Can be identified based on. Therefore, the voltage value data generated by this data generation device and the data generation method is used for a usage pattern that notifies the user of the inner layer pattern 102 that may not be able to correctly determine the presence or absence of a gap in the proximity portion Pa. Db can be effectively used.

Further, according to the substrate inspection device 1, the voltage output unit 2 that outputs the inspection voltage Vi of the specified voltage value Vr indicated by the voltage value data Da and the inspection voltage Vi are applied to the pair of inner layer patterns 102. Based on the current value Ia and the measuring unit 4 that measures the current value Ia of the current I flowing through each inner layer pattern 102 in the state of being present, the presence or absence of voids in the proximity portion Pa of the pair of inner layer patterns 102 is determined and the determination result is used. By providing the processing unit 7 for determining the quality of the multilayer substrate 100 based on the above, the application of the inspection voltage Vi causes dielectric breakdown at the proximity portion Pa or causes an air discharge at the proximity portion Pb. This can be reliably prevented. Therefore, according to this substrate inspection device 1, the presence or absence of voids between the inner layer conductors of the multilayer substrate is determined while reliably preventing damage to the multilayer substrate due to dielectric breakdown and air discharge, and the quality of the multilayer substrate 100 is determined. It can be determined accurately.

Further, when the substrate inspection device 1 determines that there is no void in the proximity portion Pa when the specified voltage value Vr is lower than the voltage value Vc indicated by the voltage value data Db, the specified voltage value Vr is the voltage value. Notifies that it is lower than Vc. Therefore, according to the substrate inspection device 1, the presence or absence of voids in the proximity portion Pa may not be correctly determined for the inner layer pattern 102 whose specified voltage value Vr is defined as a voltage value lower than the voltage value Vc. It is possible to make the user recognize that there is. Further, by performing such notification, for example, the coefficient α is changed to redefine the specified voltage value Vr to a voltage value higher than the voltage value Vc, and the inspection for the target inner layer pattern 102 is re-executed. Can be taken.

The data generation device, the substrate inspection device, and the data generation method are not limited to the above configurations and methods. For example, although the example applied to the substrate inspection device 1 provided with the data generation device (data generation function) has been described above, it can also be applied to the data generation device having no inspection function (device having only the data generation function). .. Further, the voltage value data Da and Db generated by the data generator having no inspection function can be applied to the substrate inspection apparatus 1 having no data generation function when inspecting the multilayer substrate 100. ..

Further, the above is described for an example in which the specified voltage value Vr is specified by multiplying the lower voltage value of the voltage values Va and Vb by 0.8 as a coefficient α of less than 1, but the value of the coefficient α less than 1 is , 0.8 is not limited, and can be arbitrarily specified. Further, instead of the configuration and method for defining the specified voltage value Vr by multiplying the lower voltage value of the voltage values Va and Vb by the coefficient α, the lower voltage value of the voltage values Va and Vb is started in advance. It is also possible to adopt a configuration and method in which the specified voltage value Vr is specified by subtracting the determined value.

Further, the example of generating the voltage value data Db indicating the voltage value Vc for each combination of the pair of inner layer patterns 102 has been described above, but the data indicating the difference value between the specified voltage value Vr and the voltage value Vc is used as the voltage value data Db. Alternatively, or by adopting a configuration and method of generating with the voltage value data Db.

Further, the above-mentioned example of notifying that the specified voltage value Vr is lower than the voltage value Vc when it is determined that there is no void in the proximity portion Pa has been described above, but regardless of the determination result of the presence or absence of the void in the proximity portion Pa. , A configuration and a method for notifying that the specified voltage value Vr is lower than the voltage value Vc can also be adopted.

Further, the example applied when defining the specified voltage value of the inspection voltage applied to the pair of inner layer patterns 102 in the multilayer substrate 100 in which the plurality of inner layer patterns 102 are provided in one inner layer has been described above. It can also be applied when defining a specified voltage value of an inspection voltage applied to a pair of inner layer patterns 102 in each inner layer in a multilayer substrate 100 in which a plurality of inner layer patterns 102 are formed in the inner layer. Further, it is applied when defining a specified voltage value of an inspection voltage applied to a pair of inner layer patterns 102 provided in different layers in a multilayer substrate 100 in which a plurality of inner layer patterns 102 are formed in a plurality of inner layers. You can also do it.

1 Board inspection device 2 Voltage output unit 4 Measuring unit 5 Storage unit 6 Display unit 7 Processing unit 50 Data generation processing 100 Multi-layer board 101 Board 101a Surface 101b Internal 102a-102d Inner layer pattern 103a-103h Land Da, Db Voltage value data Ds board Data I Current Ia Current value La, Lb Distance Pa, Pb Proximity part Sda, Sdb Insulation strength value Va, Vb, Vc Voltage value Vi Inspection voltage Vr Specified voltage value α coefficient

Claims (7)

An inner layer conductor is provided inside the substrate, and surface conductors connected to the inner layer conductors are used for inspection via a pair of surface conductors on a pair of adjacent inner layer conductors in a multilayer substrate provided on the surface of the substrate. The voltage value of the inspection voltage when inspecting the quality of the multilayer substrate by applying a voltage is specified as a specified voltage value, and a data generation process for generating a first voltage value data indicating the specified voltage value is executed. A data generator equipped with a processing unit
In the data generation process, the processing unit is based on the first distance between the inner layer conductors at the first proximity portion where the pair of inner layer conductors are closest to each other and the dielectric strength value of the substrate. The first voltage value at which insulation failure occurs at the first proximity portion is calculated, and the second distance between the surface conductors at the second proximity portion where the pair of surface conductors are closest to each other. And the dielectric strength value of the air, the second voltage value at which the air discharge occurs at the second proximity portion is calculated, and either the first voltage value or the second voltage value is calculated. A data generation device that executes a process of defining the specified voltage value based on a low voltage value for each combination of the pair of inner layer conductors, and generates the first voltage value data indicating the specified voltage value for each combination. The data generation device according to claim 1, wherein the processing unit defines a voltage value obtained by multiplying a predetermined coefficient less than 1 by the lower voltage value as the specified voltage value. A storage unit for storing board data capable of identifying the structure of the multilayer board is provided.
The data generation device according to claim 1 or 2, wherein the processing unit specifies the first distance and the second distance based on the substrate data. The processing unit uses a third voltage value at which an air discharge occurs in the first proximity portion when the first proximity portion is a void, based on the first distance and the dielectric strength value of the air. The process according to any one of claims 1 to 3, wherein the process of calculating the above is executed for each combination of the pair of inner layer conductors, and the second voltage value data capable of specifying the third voltage value for each combination is generated. Data generator. From the voltage output unit that outputs the inspection voltage of the specified voltage value indicated by the first voltage value data generated by the data generator according to any one of claims 1 to 4, and the voltage output unit. A measuring unit that measures the current value of the current flowing through each surface conductor and each inner layer conductor in a state where the output voltage for inspection is applied to the pair of inner layer conductors via the pair of surface conductors. A substrate provided with an inspection unit that determines the presence or absence of voids in the first proximity portion based on the current value measured by the measuring unit and determines the quality of the multilayer substrate based on the result of the determination. Inspection device. A voltage output unit that outputs the inspection voltage of the specified voltage value indicated by the first voltage value data generated by the data generator according to claim 4, and the inspection unit output from the voltage output unit. A measuring unit that measures the current value of the current flowing through each surface conductor and each inner layer conductor in a state where a voltage is applied to the pair of inner layer conductors via the pair of surface conductors, and a measuring unit that measures the voltage. It is provided with an inspection unit that determines the presence or absence of voids in the first proximity portion based on the current value and determines the quality of the multilayer substrate based on the result of the determination.
In the inspection unit, when the specified voltage value is lower than the third voltage value specified by the second voltage value data generated by the data generator, there is no void in the first proximity portion. A substrate inspection device that notifies that the specified voltage value is lower than the third voltage value when it is determined. An inner layer conductor is provided inside the substrate, and surface conductors connected to the inner layer conductors are used for inspection via a pair of surface conductors on a pair of adjacent inner layer conductors in a multilayer substrate provided on the surface of the substrate. The voltage value of the inspection voltage when inspecting the quality of the multilayer substrate by applying a voltage is specified as a specified voltage value, and a data generation process for generating a first voltage value data indicating the specified voltage value is executed. It is a data generation method to do
In the data generation process, the first proximity is based on the first distance between the inner layer conductors at the first proximity portion where the pair of inner layer conductors are closest to each other and the dielectric strength value of the substrate. The first voltage value at which insulation failure occurs at the site is calculated, and the second distance between the surface conductors and the dielectric strength of air at the second proximity site where the pair of surface conductors are closest to each other. A second voltage value at which air discharge occurs at the second proximity portion is calculated based on the value, and is based on the lower voltage value of the first voltage value and the second voltage value. A data generation method in which the process of defining the specified voltage value is executed for each combination of the pair of inner layer conductors, and the first voltage value data indicating the specified voltage value for each combination is generated.

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