JP6933499B2 - Molded sensor manufacturing method and molded sensor - Google Patents

Description

The present invention relates to a molded sensor in which the sensor is sealed with a mold.

As a mold-type sensor in which a sensor is sealed by using a mold, a mold-type sensor in which the entire sensor unit including a substrate and a sensor mounted on the substrate is sealed by a mold is known (for example, Patent Document 1). ).

Further, as a mold type sensor in which the sensor is sealed by using a mold, a microphone is placed on a molded substrate formed by sealing a substrate having a through hole with a resin so as not to block the through hole. There is also known a technique in which a lid is attached to a mold substrate after the sound collecting portion is adhered so as to be located above the through hole, and the microphone is sealed with the mold substrate and the lid. (For example, Patent Document 2).

Japanese Unexamined Patent Publication No. 2017-9401 Japanese Unexamined Patent Publication No. 2010-187277

When the entire sensor unit is sealed with a mold as described above to form a molded sensor, the sensor captures an event to be detected (for example, sound in the case of a microphone) to the outside. For a sensor that needs to be exposed, it is necessary to mold the mold so that a hole that serves as a passage between the sensor's sensitive portion and the outside is formed.

In this case, if the mold is molded based on the outer shape of the substrate, if the mounting accuracy of the sensor on the substrate is low, the sensor's sensitive portion and the mold hole formation position will be displaced, and the sensor's sensitive portion and the outside will be displaced. The passage to and from may not be formed properly.

Therefore, the present invention manufactures a molded sensor in which the entire sensor unit formed by mounting a sensor whose sensitive portion for capturing an event to be detected needs to be exposed to the outside is mounted on a substrate and sealed with a mold. In the present invention, it is an object of the present invention to form a mold so that a hole serving as a passage between the sensitive portion of the sensor and the outside is appropriately formed.

In order to achieve the above object, the present invention provides a method for manufacturing a molded sensor in which a sensor unit having a substrate and a sensor mounted on the substrate is sealed with a mold. Here, the substrate is provided with a through hole, and the sensor is mounted on the substrate so as to include a sensitive portion for capturing an event to be detected and to expose the sensitive portion in the through hole. It is what has been done. A method of manufacturing the molded sensor is a primary method including a first pin that fits into a through hole of the substrate and an end support surface that supports at least a part of the end of the substrate of the sensor unit. Using a molding die, the end support surface supports at least a part of the end of the substrate of the sensor unit, and the first pin is inserted into the through hole of the substrate to form the through hole. A first step of injection molding a first mold covering a portion of the substrate of the sensor unit excluding at least a part of the end portion in a fitted state, and the first step formed by the first pin. Fits the opening arrangement surface support surface that supports the opening arrangement surface that is the surface of the first mold where the opening of the communication hole that is the hole of 1 mold is located, and the communication hole that stands up from the opening arrangement surface support surface. The opening arrangement surface of the first mold is used with a secondary molding die provided with a matching second pin and a positioning surface that abuts the first mold and positions the first mold. Is supported by the opening arrangement surface support surface, the second pin is inserted into the communication hole of the first mold and fitted with the communication hole, and the first mold is brought into contact with the positioning surface. The first mold is a second mold that does not cover the opening arrangement surface of the first mold and covers all the portions of the edges of the substrate that are not covered by the first mold in the positioned state. It includes a second step of injection molding on the outside of the mold.

According to the method for manufacturing such a mold sensor, in the injection molding in the first step, the sensor unit is supported by at least a part of the end of the substrate, and the first pin of the primary molding mold penetrates the substrate. Since the process is performed in the state of being fitted into the holes, the resin does not flow into the occupied space of the first pin and the through holes of the substrate. Therefore, it is possible to form a communication hole in the first mold that appropriately communicates with the through hole of the substrate from the outside while preventing the resin from entering the through hole of the substrate by the first step. Then, a second mold that covers at least a part of the end of the substrate, which is a portion that is not covered by the first mold of the sensor unit because it is used to support the sensor unit, has a first mold in which the opening of the communication hole is located. It is formed so as not to cover the opening arrangement surface which is the surface of the mold. As a result, a molded sensor is obtained in which the entire sensor unit is sealed with a mold in which a hole serving as a passage between the sensitive portion of the sensor and the outside is appropriately formed.

The present invention also provides the following manufacturing method as a manufacturing method of a molded sensor in which a sensor unit having a substrate and a sensor mounted on the substrate is sealed with a mold in order to achieve the above-mentioned problems. do. Here, the sensor includes a sensitive unit that captures an event to be detected. Further, the sensor is formed with a hole for communicating from an opening in the surface of the sensor on the side opposite to the substrate to the sensitive portion. A method for manufacturing the molded sensor is a primary molding including a first pin that fits into a hole of the sensor and an end support surface that supports at least a part of the end of the substrate of the sensor unit. A mold is used to support at least a part of the end of the substrate of the sensor unit with the end support surface, and the first pin is inserted into the hole of the sensor and fitted into the hole. A first step of injection molding a first mold covering a portion of the substrate of the sensor unit excluding at least a part of the end portion, and the first step formed by the first pin. The opening arrangement surface supporting surface that supports the opening arrangement surface that is the surface of the first mold where the opening of the communication hole that is the hole of the mold is located is fitted with the communication hole that stands up from the opening arrangement surface support surface. Using a secondary molding die provided with a second pin and a positioning surface that comes into contact with the first mold and positions the first mold, the opening arrangement surface of the first mold is said to be the same. It is supported by the opening arrangement surface support surface, the second pin is inserted into the communication hole of the first mold and fitted with the communication hole, and the first mold is brought into contact with the positioning surface. In the positioned state, the first mold is a second mold that does not cover the opening arrangement surface of the first mold and covers all the portions of the edges of the substrate that are not covered by the first mold. It includes a second step of injection molding on the outside of the.

According to such a mold sensor manufacturing method, in the injection molding in the first step, the sensor unit is supported by at least a part end of the substrate, and the first pin of the primary molding mold is a hole of the sensor. Since it is carried out in a state of being fitted to the sensor, the resin does not flow into the occupied space of the first pin and the hole of the sensor. Therefore, in the first step, it is possible to form a contact hole in the first mold that appropriately communicates with the hole of the sensor from the outside while preventing the resin from entering the hole of the sensor. Then, a second mold that covers at least a part of the end of the substrate, which is a portion that is not covered by the first mold of the sensor unit because it is used to support the sensor unit, has a first mold in which the opening of the communication hole is located. It is formed so as not to cover the opening arrangement surface which is the surface of the mold. As a result, it is possible to obtain a molded sensor in which the entire sensor unit is sealed with a mold in which a hole serving as a passage between the sensitive portion of the sensor and the outside is appropriately formed.

Here, in such a method for manufacturing a mold sensor, the primary molding mold is composed of a first mold and a second mold that can be opened and closed relative to the first mold. The first mold is provided with an end mounting surface on which at least a part of the end of the substrate of the sensor unit can be mounted with play in a direction parallel to the substrate surface of the substrate. The second metal having an end support surface sandwiching at least a part of the end portion of the substrate between the end mounting surface of the first mold and the end mounting surface. The mold may be composed of a surface facing the end mounting surface of the first mold.

By doing so, even if the size and shape of the substrate and the position of the through hole of the substrate are slightly different from those of the normal one, the sensor unit can be set in the primary molding die, and the sensor unit can be set on the mold. Therefore, it is possible to manufacture a mold-type sensor in which the sensor's sensitive portion and the communication hole are arranged at regular positions and which do not cause any functional problem without any trouble. Further, when there is such a deviation, the sensor unit is tilted with respect to the first mold, but the entire sensor unit is sealed by the first mold and the second mold and is visually recognizable from the outside. Since it cannot be done, there is no aesthetic problem.

In the above method for manufacturing a molded sensor, the sensor may be, for example, a microphone.
Further, in the present invention, as a molded sensor in which a sensor is sealed with a mold, a sensor unit having a substrate and a sensor mounted on the substrate, and at least a part of an end portion of the substrate of the sensor unit are provided. A mold-type sensor including a first mold that covers a portion to be removed and a second mold provided on the outside of the first mold so as to cover a portion of the edge of the substrate that is not covered by the first mold. offer. Here, the sensor mounted on the substrate is provided with a sensitive portion for capturing an event to be detected, and the first mold is provided with a communication hole which is a hole for communicating with the sensitive portion of the sensor. The two molds are molded so as not to cover the surface where the opening of the communication hole of the first mold is located.

In the above molded sensor, the sensor may be, for example, a microphone.

As described above, according to the present invention, the entire sensor unit formed by mounting a sensor whose sensitive portion for capturing an event to be detected needs to be exposed to the outside on a substrate is sealed with a mold. In the manufacture of a molded sensor, the mold can be molded so that a hole serving as a passage between the sensitive portion of the sensor and the outside is appropriately formed.

It is a figure which shows the mold type sensor which concerns on 1st Embodiment of this invention. It is a figure which shows the primary molding mold of the mold type sensor which concerns on 1st Embodiment of this invention. It is a figure which shows the procedure of the primary molding of the mold type sensor which concerns on 1st Embodiment of this invention. It is a figure which shows the secondary molding mold of the mold type sensor which concerns on 1st Embodiment of this invention. It is a figure which shows the procedure of the secondary molding of the mold type sensor which concerns on 1st Embodiment of this invention. It is a figure which shows the mold type sensor which concerns on 2nd Embodiment of this invention. It is a figure which shows the procedure of molding of the mold type sensor which concerns on 2nd Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described.
First, the first embodiment will be described.
FIG. 1 shows the configuration of the molded sensor according to the first embodiment.
Here, the up-down, front-back, left-right directions shown in FIG. 1a1 are taken as the up-down, front-back, left-right directions of the mold-type sensor, FIG. 1a1 shows a perspective view of the mold-type sensor, FIG. FIG. 1a4 represents the lower surface of the mold sensor, FIG. 1a4 represents the front surface of the mold sensor, and FIG. 1a5 represents the rear surface of the mold sensor.

Further, FIG. 1b1 represents a cross section taken along the cross section line AA of FIG. 1a2, and FIG. 1b2 shows a cross section taken along the cross section line BB of FIG. 1a2.
Further, FIG. 1c1 is a perspective view of the mold sensor viewed from diagonally above, FIG. 1c2 is a perspective view of the mold sensor viewed from above, and FIG. 1c3 is a perspective view of the mold sensor viewed from the front.

As shown in the figure, the molded sensor is a sensor unit 4 in which a microphone 2 and other elements 3 are mounted on a substrate 1 and is sealed with a mold 7 including a first mold 5 and a second mold 6. Further, the mold type sensor includes a cable 8, one end of the cable 8 is connected to the substrate 1 inside the mold 7, and the other end is extended outside the mold 7.

Here, as shown in FIGS. 1b1 and 1b2, the substrate 1 is provided with through holes 11 penetrating vertically, and the microphone 2 has a sound receiving portion for collecting sound located below the through holes 11. As described above, it is mounted on the lower surface of the substrate 1.

Then, as shown in FIGS. 1b1, b2, c2, and c3, the first mold 5 includes the upper, lower, rear, and the end of the cable 8 on the substrate 1 side of the sensor unit 4 excluding the left and right ends and the front end of the substrate 1. It is provided so as to seal the portion. Then, the second mold 6 seals the left and right ends and the front end of the substrate 1 not sealed by the first mold 5, and the left, right, and front ends of the first mold 5, and the mold type sensor as a whole. It is provided so as to be a rectangular parallelepiped.

Here, the upper part of the first mold 5 is not covered with the second mold 6 and is exposed. Further, the first mold 5 is provided with a communication hole 51 which is a hole extending downward from the opening on the upper surface of the first mold 5 and connecting to the opening of the through hole 11 on the upper surface of the substrate 1. The sound receiving portion of the microphone 2 is exposed to the outside through the communication hole 51 of the first mold 5 and the through hole 11 of the substrate 1 without being covered by the mold 7, and the first mold 5 has a sound receiving portion. External sound reaches the sound receiving portion of the microphone 2 through the communication hole 51 and the through hole 11 of the substrate 1, and is picked up by the microphone 2.

Hereinafter, a method for manufacturing such a molded sensor will be described.
The mold type sensor has a first step of molding the first mold 5 on the sensor unit 4 by injection molding and a second step of molding the second mold 6 on the sensor unit 4 and the first mold 5 by injection molding. Manufactured through.

First, the first step will be described.
FIG. 2 shows a mold used for injection molding of the first mold 5 in the first step.
The mold comprises an upper mold 21 for primary molding shown in FIG. 2a and a lower mold 22 for primary molding shown in FIG. 2b.
Here, in FIG. 2a, FIG. 2a1 shows the shape of the upper mold 21 for primary molding as viewed from above, FIG. 2a2 shows the cross section taken along the cross-sectional line CC of FIG. 2a1, and FIG. 2a3 shows the cross-sectional line of FIG. 2a1. It represents a cross section by DD.

Further, in FIG. 2b, FIG. 2b1 shows the shape of the lower mold 22 for primary molding as viewed from above, FIG. 2b2 shows the cross section taken along the cross-sectional line EE of FIG. 2b1, and FIG. 2b3 shows the cross-sectional line F of FIG. 2b1. -F represents a cross section.

As shown in FIG. 2a, the lower surface of the primary molding upper mold 21 includes an upper concave portion 211 recessed upward along the outer shape of a portion below the lower surface of the substrate 1 of the first mold 5. .. Further, the primary molding upper mold 21 is provided with a gate 212 for allowing the resin to flow in.

Next, as shown in FIG. 2b, the upper surface of the lower mold 22 for primary molding has a downward concave shape portion 221 that is recessed downward along the outer shape of the portion above the lower surface of the substrate 1 of the first mold 5. It has a step-shaped portion 222 that forms a step for supporting the sensor unit 4 on which the left and right ends and the front end of the substrate 1 that are not sealed by the first mold 5 are placed. Further, an upwardly projecting pin 223 having a shape that fits with the through hole 11 of the substrate 1 is provided inside the downward concave portion 221.

Next, FIG. 3 shows a procedure for injection molding of the first mold 5 using such a primary molding upper mold 21 and a primary molding lower mold 22.
As shown in FIG. 3a, first, the sensor unit 4 is set in the lower mold 22 for primary molding. To set the sensor unit 4 on the primary molding lower mold 22, the left and right ends and the front end of the substrate 1 are placed on the stepped portion 222 of the primary molding lower mold 22 with the upper surface of the sensor unit 4 facing downward. It is carried out by placing the pin 223 of the lower mold 22 for primary molding into the through hole 11 of the substrate 1 and fitting the pin 223. Here, the pin 223 is provided so that the through hole 11 of the substrate 1 is located at the position of the pin 223 when the left and right ends and the front end of the substrate 1 are placed on the stepped portion 222 of the lower mold 22 for primary molding. It is arranged.

Further, even if the size and shape of the substrate 1 and the position of the through hole 11 of the substrate 1 are slightly different from those of the normal one, the left and right ends and the front end of the substrate 1 are placed on the stepped portion 222 of the lower mold 22 for primary molding. The size of the stepped portion 222 is such that the left and right ends and the front end of the substrate 1 can be loosely fitted so that the pin 223 can be fitted into the through hole 11 of the substrate 1 in the placed state, that is, the size of the substrate 1 in the horizontal direction. The size is slightly wider than the regular size.

Then, as shown in FIG. 3b, the primary molding upper mold 21 is set on the primary molding lower mold 22 in which the sensor unit 4 is set and the mold is fastened. 3b1 shows a cross section taken along the cross-sectional line GG of FIG. 3a in a state where the upper mold 21 for primary molding is set on the lower mold 22 for primary molding, and FIG. 3b2 shows the upper mold 21 for primary molding. Is shown on the cross-sectional line HH of FIG. 3a in a state where is set on the lower mold 22 for primary molding.

As shown in the figure, the primary molding upper mold 21 is placed on the step-shaped portion 222 of the primary molding lower mold 22 in a state where the primary molding upper mold 21 is set on the primary molding lower mold 22 in which the sensor unit 4 is set. The left and right ends and the front end of the placed substrate 1 are sandwiched between the lower surface of the stepped portion 222 (the surface that comes into contact with the upper surface of the substrate 1) and the lower surface of the primary molding upper mold 21 without a gap.

Further, as shown in the figure, in a state where the primary molding upper mold 21 is set on the primary molding lower mold 22 in which the sensor unit 4 is set, the portion outside the first mold 5 of the cable 8 is positioned. A gap is formed between the lower surface portion of the lower mold 22 for primary molding and the upper surface portion of the upper mold 21 for primary molding through which the cable 8 is passed, and the cable 8 is sandwiched between the two without any gap. The shape is as follows.

Then, when the primary molding upper mold 21 is molded on the primary molding lower mold 22, the molten resin is applied from the gate 212 of the primary molding upper mold 21 to the upper side of the primary molding upper mold 21. It is injected into the space between the concave shape portion 211 and the lower concave shape portion 221 of the lower mold 22 for primary molding to flow in, and after holding pressure and cooling, the upper mold 21 for primary molding is moved to open the mold. , As shown in FIG. 3c, an intermediate product 30 in which the first mold 5 is molded with respect to the sensor unit 4 is obtained.

Since the injection molding in the above first step is performed in a state where the pin 223 of the lower mold 22 for primary molding is fitted into the through hole 11 of the substrate 1, the occupied space of the pin 223 and the through hole 11 of the substrate 1 are formed. No resin flows in. Therefore, while preventing the resin from entering the through hole 11 of the substrate 1 by the first step, the resin extends downward from the opening of the upper surface of the first mold 5 into the first mold 5, and the upper surface of the substrate 1 is formed. A communication hole 51, which is a hole that communicates with the opening of the through hole 11 of the above, can be formed.

The first step of molding the first mold 5 with respect to the sensor unit 4 by injection molding has been described above.
Next, a second step of molding the second mold 6 by injection molding with respect to the sensor unit 4 and the first mold 5 will be described.
FIG. 4 shows a mold used for injection molding of the second mold 6 in the second step.
The mold comprises an upper mold 41 for secondary molding shown in FIG. 4a and a lower mold 42 for secondary molding shown in FIG. 4b.
Here, in FIG. 4a, FIG. 4a1 shows the shape of the upper mold 41 for secondary molding as viewed from above, FIG. 4a2 shows the cross section taken along the cross-sectional line JJ of FIG. 4a1, and FIG. 4a3 shows the cross section of FIG. 4a1. It represents a cross section taken along the line KK.

Further, in FIG. 4b, FIG. 4b1 shows the shape of the lower mold 42 for secondary molding as viewed from above, FIG. 4b2 shows the cross section taken along the cross-sectional line LL of FIG. 4b1, and FIG. 4b3 shows the cross-sectional line of FIG. 4b1. It represents a cross section by MM.

As shown in FIG. 4a, the lower surface of the upper mold 41 for secondary molding is recessed upward along the outer shape of the portion below the lower surface of the substrate 1 of the mold 7 including the first mold 5 and the second mold 6. However, it is provided with an upward concave shape portion 411.

Next, as shown in FIG. 4b, the upper surface of the lower mold 42 for secondary molding follows the outer shape of a portion of the mold 7 including the first mold 5 and the second mold 6 above the lower surface of the substrate 1. It has a downward concave shape portion 421 that is recessed downward. Further, inside the concave portion 421, an upwardly projecting pin 422 having a shape that fits with the communication hole 51 of the first mold 5 and the through hole 11 of the substrate 1 is provided. Further, a gate 50 for injecting the molten resin is provided on the upper surface of the lower mold 42 for secondary molding.

Next, FIG. 5 shows a procedure for injection molding of the second mold 6 using such an upper mold 41 for secondary molding and a lower mold 42 for secondary molding.
As shown in FIG. 5a, first, the intermediate product 30 including the sensor unit 4 and the first mold 5 shown in FIG. 3c is set in the lower mold 42 for secondary molding. In the setting of the sensor unit 4 to the lower mold 42 for secondary molding, the portion around the cable 8 at the rear end of the first mold 5 of the intermediate product 30 with the upper surface side of the sensor unit 4 facing downward is secondary. The intermediate product 30 is placed on the lower mold 42 for secondary molding while being fitted into the recessed portion 4211 corresponding to the portion of the lower concave shape portion 421 of the lower mold 42 for molding, and the first mold 5 is used. This is performed by inserting and fitting the pin 422 of the lower mold 42 for secondary molding into the communication hole 51 and the through hole 11 of the substrate 1. Here, the pin 422 has a communication hole 51 of the first mold 5 and a through hole 11 of the substrate 1 at the position of the pin 422 when the intermediate product 30 is placed on the lower mold 42 for secondary molding as described above. Is arranged so that is located.

Then, as shown in FIG. 5b, the secondary molding upper mold 41 is set on the secondary molding lower mold 42 in which the intermediate product 30 is set, and the mold is fastened. 5b1 shows a cross section taken along the cross-sectional line NN of FIG. 5a in a state where the upper mold 41 for secondary molding is set on the lower mold 42 for secondary molding, and FIG. 5b2 shows the upper mold for secondary molding. A cross section taken along the cross-sectional line PP of FIG. 5a in a state where the mold 41 is set on the lower mold 42 for secondary molding is shown.

Then, the molten resin is injected from the gate 50 into the space between the upper concave portion 411 of the secondary molding upper mold 41 and the lower concave portion 421 of the secondary molding lower mold 42 to flow into the space. After holding pressure and cooling, the upper mold 41 for secondary molding is moved to open the mold, and as shown in FIG. 5c, the second mold 6 is molded with respect to the intermediate product 30, that is, the sensor. The mold type sensor shown in FIG. 1 in which the first mold 5 and the second mold 6 are molded with respect to the unit 4 is completed.

As shown in the figure, a portion of the cable 8 outside the first mold 5 of the cable 8 in a state where the secondary molding upper mold 41 is set on the secondary molding lower mold 42 in which the intermediate product 30 is set. There is a gap between the lower surface of the lower mold 42 for secondary molding and the upper surface of the upper mold 41 for secondary molding where the cable 8 is passed, and the cable 8 is formed by both. The shape is such that it can be sandwiched without gaps.

The second step of molding the second mold 6 by injection molding with respect to the sensor unit 4 and the first mold 5 has been described above.
Here, when the size and shape of the substrate 1 and the position of the through hole 11 of the substrate 1 deviate from the normal ones, in the intermediate product 30 manufactured in the first step described above, as shown in FIG. 5d1, as shown in FIG. The first mold 5 may be tilted with respect to the sensor unit 4.

However, according to the above first and second steps, the positional relationship between the sound receiving portion of the microphone 2, the through hole 11 of the substrate 1, the communication hole 51 of the first mold 5, and the mold 7 is always regular. It becomes a positional relationship. Therefore, even in such a case, no functional problem occurs.

Further, as shown in FIG. 5d2, since the second mold 6 is molded so as to conceal the sensor unit 4 in the second step, there is no aesthetic problem.
The first embodiment of the present invention has been described above.
As described above, according to the first embodiment, the entire sensor unit 4 is sealed with a mold 7 in which a hole serving as a passage between the sound receiving portion of the microphone 2 and the outside is appropriately formed. A type sensor can be manufactured.

Hereinafter, a second embodiment of the present invention will be described.
The sensor unit 4 used in the second embodiment shown in FIG. 6a is shown.
As shown in the figure, the sensor unit 4 of the second embodiment also includes a substrate 1, a microphone 2 mounted on the substrate 1, and other elements 3.
The microphone 2 according to the second embodiment includes a hole 60 in which an opening is located on a surface opposite to the substrate 1 when mounted on the substrate 1. The hole 60 of the microphone 2 communicates with the sound receiving portion of the microphone 2, and the sound receiving portion collects the sound arriving through the hole 60.

The substrate 1 according to the second embodiment is not provided with the through hole 11 provided in the substrate 1 according to the first embodiment.
Next, FIG. 6b shows a perspective view of the mold sensor viewed from diagonally above, with the up / down / front / rear / left / right directions shown in the drawing as the up / down / front / rear / left / right directions of the mold sensor.
As shown in the figure, the appearance of the mold type sensor according to the second embodiment is the same as that of the mold type sensor according to the first embodiment, and the upper surface of the mold type sensor is represented by FIG. 1a2.

Next, FIG. 6c1 shows a cross section taken along the cross section line AA of FIG. 1a2, and FIG. 6c2 shows a cross section taken along the cross section line BB of FIG. 1a2.
As shown in FIGS. 6b, 6c1 and 6c2, in the mold type sensor according to the second embodiment, the sensor unit 4 is composed of the first mold 5 and the second mold 6 as in the first embodiment. It is sealed with a mold 7.

However, the communication hole 51 extending downward from the opening on the upper surface of the first mold 5 is provided so as to be connected to the opening of the hole 60 of the microphone 2 mounted on the substrate 1. The sound receiving portion of the microphone 2 is exposed to the outside through the communication hole 51 of the first mold 5 and the hole 60 of the microphone 2 without being covered by the mold 7, and the communication of the first mold 5 is performed. External sound reaches the sound receiving portion of the microphone 2 through the hole 51 and the hole 60 of the microphone 2, and is picked up by the microphone 2.

Hereinafter, a method for manufacturing the molded sensor according to the second embodiment will be described.
In the second embodiment as well, the mold type sensor has the first step of molding the first mold 5 with respect to the sensor unit 4 by injection molding, and the sensor unit 4 and the first mold 5 as in the first embodiment. On the other hand, the second mold 6 is manufactured through a second step of molding by injection molding.

First, the first step of injection molding the first mold 5 with respect to the sensor unit 4 will be described.
In the first step, as shown in FIGS. 7a1 and 7a2, the first mold 5 is injection-molded using the primary molding upper mold 21 and the primary molding lower mold 22.
The primary molding upper mold 21 and the primary molding lower mold 22 are substantially the same as the primary molding upper mold 21 and the primary molding lower mold 22 according to the first embodiment shown in FIGS. 2a and 2b. However, it differs from those of FIGS. 2a and 2b in that the pin 223 of the lower mold 22 for primary molding has a shape that fits into the hole 60 of the microphone 2.

In the injection molding of the first mold 5, first, as shown in FIGS. 7a1 and 7a2, with the upper surface of the sensor unit 4 facing downward, the left and right ends and the front end of the substrate 1 are placed on the lower mold 22 for primary molding. The sensor unit 4 is set in the primary molding lower mold 22 by placing it on the stepped portion 222 and inserting and fitting the pin 223 of the primary molding lower mold 22 into the hole 60 of the microphone 2. Here, the pin 223 is a microphone at the position of the pin 223 when the left and right ends and the front end of the substrate 1 are placed on the stepped portion 222 of the lower mold 22 for primary molding and set on the lower mold 22 for primary molding. It is arranged so that the hole 60 of 2 is located.

Next, the primary molding upper mold 21 is molded onto the primary molding lower mold 22 in which the sensor unit 4 is set, and the molten resin is poured from the gate 212 of the primary molding upper mold 21. After holding the pressure and cooling, the upper mold 21 for primary molding is moved to open the mold to obtain an intermediate product 30 in which the first mold 5 is molded with respect to the sensor unit 4 as shown in FIG. 7b.

Here, the injection molding in the above first step is performed in a state where the pin 223 of the lower mold 22 for primary molding is fitted in the hole 60 of the microphone 2, so that the occupied space of the pin 223 and the hole 60 of the microphone 2 are performed. The resin does not flow into the. Therefore, while preventing the resin from entering the hole 60 of the microphone 2 in the first step, the hole 60 of the microphone 2 extends downward from the opening on the upper surface of the first mold 5 into the first mold 5. A communication hole 51, which is a hole for communicating with the opening of the above, can be formed.

Next, a second step of injection molding the second mold 6 with respect to the sensor unit 4 and the first mold 5 will be described.
In the second step, as shown in FIGS. 7c1 and 7c2, the second mold 6 is injection-molded using the upper mold 41 for secondary molding and the lower mold 42 for secondary molding.
The secondary molding upper mold 41 and the secondary molding lower mold 42 are the secondary molding upper mold 41 and the secondary molding lower mold 42 according to the first embodiment shown in FIGS. 4a and 4b. Although it is almost the same as that of FIG. 4a, FIG. 4a, FIG. It is different from that of FIG. 4b.

In the injection molding of the second mold 6, first, as shown in FIGS. 7c1 and 7c2, the intermediate product 30 with the upper surface side of the sensor unit 4 facing downward is placed on the lower mold 42 for secondary molding, and the second mold 6 is injected. 1 The intermediate product 30 is set in the secondary molding lower mold 42 by inserting and fitting the pin 422 of the secondary molding lower mold 42 into the communication hole 51 of the mold 5 and the hole 60 of the microphone 2. .. Here, the pin 422 is arranged so that the communication hole 51 of the first mold 5 and the hole 60 of the microphone 2 are located at the positions of the pins 422 when the intermediate product 30 is placed on the lower mold 42 for secondary molding. It is arranged.

Then, next, the secondary molding upper mold 41 is set on the secondary molding lower mold 42 in which the intermediate product 30 is set, the mold is fastened, and the molten resin is injected from the gate 50 to flow in and retain the mold. After pressure and cooling, the upper mold 41 for secondary molding is moved to open the mold, and the second mold 6 is molded with respect to the intermediate product 30, that is, the first mold with respect to the sensor unit 4. The molded sensor shown in FIG. 6b, in which the 5 and the second mold 6 are molded, is completed.

The second embodiment of the present invention has been described above.
According to the second embodiment, there is also a case where the sensor unit 4 provided with a microphone in which the opening of the hole 60 communicating with the sound receiving portion is located on the surface opposite to the substrate 1 in the state of being mounted on the substrate 1. It is possible to manufacture a molded sensor in which the entire sensor unit is sealed with a mold 7 in which a hole serving as a passage between the sound receiving portion of the microphone 2 and the outside is appropriately formed.

In each of the above embodiments, the case where the microphone 2 is used as the sensor has been described. However, in each of the above embodiments, the sensitive unit other than the microphone 2 that captures the event to be detected is external to the outside. The same can be applied to the case where any sensor that needs to be exposed is used. For example, the present embodiment can be similarly applied when an optical sensor, an odor sensor, a temperature sensor, or the like is used as the sensor.

1 ... Substrate, 2 ... Microphone, 3 ... Element, 4 ... Sensor unit, 5 ... 1st mold, 6 ... 2nd mold, 7 ... Mold, 8 ... Cable, 11 ... Through hole, 21 ... Upper mold for primary molding , 22 ... Lower mold for primary molding, 30 ... Intermediate product, 41 ... Upper mold for secondary molding, 42 ... Lower mold for secondary molding, 50 ... Gate, 51 ... Communication hole, Hole ... 60, 211 ... Upper concave shape part, 212 ... Gate, 221 ... Lower concave shape part, 222 ... Step shape part, 223 ... Pin, 411 ... Upper concave shape part, 421 ... Lower concave shape part, 422 ... Pin.

Claims (4)

A method for manufacturing a molded sensor in which a sensor unit having a substrate and a sensor mounted on the substrate is sealed with a mold.
The substrate is provided with a through hole.
The sensor is mounted on the substrate so as to include a sensitive portion that captures an event to be detected and to expose the sensitive portion in the through hole.
The manufacturing method of the molded sensor is
Using a primary molding die provided with a first pin that fits into a through hole in the substrate and an end support surface that supports at least a portion of the end of the substrate in the sensor unit, the end In a state where the support surface supports at least a part of the end portion of the substrate of the sensor unit, and the first pin is inserted into the through hole of the substrate and fitted with the through hole of the sensor unit, the sensor unit A first step of injection molding a first mold that covers a portion of the substrate excluding at least a part of the end.
An opening arrangement surface supporting surface that supports an opening arrangement surface that is a surface of the first mold where an opening of a communication hole that is a hole of the first mold formed by the first pin is located, and the opening arrangement. Using a secondary molding die provided with a second pin that fits into the connecting hole that rises from the surface support surface and a positioning surface that comes into contact with the first mold and positions the first mold. The opening arrangement surface of the first mold is supported by the opening arrangement surface support surface, and the second pin is inserted into the communication hole of the first mold to be fitted with the communication hole, and the first In a state where the mold 1 is brought into contact with the positioning surface and positioned, a portion of the end portion of the substrate that is not covered by the first mold without covering the opening arrangement surface of the first mold. A method for manufacturing a mold type sensor, which comprises a second step of injecting and molding a second mold covering the entire surface on the outside of the first mold. A method for manufacturing a molded sensor in which a sensor unit having a substrate and a sensor mounted on the substrate is sealed with a mold.
The sensor is provided with a sensitive portion that captures an event to be detected, and the sensor is formed with a hole that communicates from an opening in the surface of the sensor opposite to the substrate to the sensitive portion.
The manufacturing method of the molded sensor is
The end support using a primary molding die comprising a first pin that fits into the sensor hole and an end support surface that supports at least a portion of the end of the substrate of the sensor unit. The substrate of the sensor unit is supported by a surface at least a part of the end of the substrate of the sensor unit, and the first pin is inserted into the hole of the sensor and fitted into the hole. The first step of injection molding the first mold covering the portion excluding at least a part of the end portion of the above.
An opening arrangement surface supporting surface that supports an opening arrangement surface that is a surface of the first mold where an opening of a communication hole that is a hole of the first mold formed by the first pin is located, and the opening arrangement. Using a secondary molding die provided with a second pin that fits into the connecting hole that rises from the surface support surface and a positioning surface that comes into contact with the first mold and positions the first mold. The opening arrangement surface of the first mold is supported by the opening arrangement surface support surface, and the second pin is inserted into the communication hole of the first mold to be fitted with the communication hole, and the first In a state where the mold 1 is brought into contact with the positioning surface and positioned, a portion of the end portion of the substrate that is not covered by the first mold without covering the opening arrangement surface of the first mold. A method for manufacturing a mold type sensor, which comprises a second step of injecting and molding a second mold covering the entire surface on the outside of the first mold. The method for manufacturing a molded sensor according to claim 1 or 2.
The primary molding die comprises a first die and a second die that can be opened and closed relative to the first die.
The first mold has an end mounting surface on which at least a part of the end of the substrate of the sensor unit can be mounted with play in a direction parallel to the substrate surface of the substrate.
The second end support surface sandwiches at least a part of the end portion of the substrate between the end mounting surface of the first mold and the end mounting surface. A method for manufacturing a mold sensor, which comprises a surface of the mold that faces the end mounting surface of the first mold. The method for manufacturing a molded sensor according to claim 1, 2 or 3.
A method for manufacturing a molded sensor, wherein the sensor is a microphone.

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