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JP6933756B2 - Metallized film capacitor - Google Patents
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JP6933756B2 - Metallized film capacitor - Google Patents

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JP6933756B2
JP6933756B2 JP2020106798A JP2020106798A JP6933756B2 JP 6933756 B2 JP6933756 B2 JP 6933756B2 JP 2020106798 A JP2020106798 A JP 2020106798A JP 2020106798 A JP2020106798 A JP 2020106798A JP 6933756 B2 JP6933756 B2 JP 6933756B2
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metallized film
capacitor element
sound wave
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直也 猪阪
直也 猪阪
安立 智哉
智哉 安立
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Nichicon Corp
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Description

本発明は、巻回型のコンデンサ素子の本体部を外装ケースに収容した上で樹脂封止された金属化フィルムコンデンサ、詳しくは、軸方向の両端に引き出し電極が接続された金属化フィルム巻回型のコンデンサ素子と、前記引き出し電極の一部を除いて前記コンデンサ素子の本体部を収容する樹脂製の外装ケースと、前記外装ケース内に充填され固化によって前記コンデンサ素子の本体部を覆う封止樹脂とを備えた金属化フィルムコンデンサに関する。 According to the present invention, a metallized film capacitor in which the main body of a wound type capacitor element is housed in an outer case and then sealed with a resin. A mold capacitor element, a resin outer case that houses the main body of the capacitor element except for a part of the lead-out electrode, and a seal that is filled in the outer case and solidifies to cover the main body of the capacitor element. The present invention relates to a metallized film capacitor equipped with a resin.

例えばインバータ装置(直流‐交流変換装置)用のコンデンサ素子は、その軸方向両端の一対の引き出し電極間に電圧を高周波で印加することに起因して、誘電体フィルムを挟み込む異極の金属薄膜電極間にクーロン力が作用し、機械的振動が発生する。近年では、インバータ装置におけるスイッチング周波数の高周波化に伴い機械的振動の周波数も高周波化し、不快な雑音(例えば「キーン」と鳴る耳障りな唸り音)が発生することが問題となってきている。 For example, a capacitor element for an inverter device (DC-AC conversion device) is a metal thin film electrode having a different electrode that sandwiches a dielectric film due to the application of a voltage at a high frequency between a pair of lead-out electrodes at both ends in the axial direction. A Coulomb force acts between them, causing mechanical vibration. In recent years, as the switching frequency of an inverter device has increased, the frequency of mechanical vibration has also increased, and an unpleasant noise (for example, an unpleasant roaring sound of "keen") has become a problem.

金属化フィルムコンデンサには、そのコンデンサ素子として巻回型(円柱型、扁平柱状型)、積層型などがあるが、巻回型の場合、金属化フィルムの巻き取りの際に巻き取りのテンション(張力)を強くして強固な巻き取りを行い、フィルム層間を狭めることにより雑音を抑制することが従来から行われている。 Metallized film capacitors include winding type (cylindrical type, flat columnar type), laminated type, etc. as their capacitor elements, but in the case of winding type, the winding tension (winding tension) when winding the metallized film. Conventionally, noise is suppressed by increasing the tension) to perform strong winding and narrowing the film layers.

また、振動(雑音)を低減する対策として、樹脂製の外装ケースの内壁に凹部(ケース開口端まで軸方向に延びる溝状の凹部、周方向と軸方向にほぼ等間隔で点在する穴状の凹部、底面から開口端まで螺旋状に延びる溝状の凹部)を形成し、その凹部にも封止樹脂を充填する方式の金属化フィルムコンデンサが提案されている(例えば特許文献1参照)。 In addition, as a measure to reduce vibration (noise), recesses (groove-shaped recesses extending in the axial direction to the opening end of the case, holes scattered at approximately equal intervals in the circumferential direction and the axial direction) are formed on the inner wall of the resin outer case. A metallized film capacitor has been proposed in which a concave portion, a groove-shaped concave portion extending spirally from the bottom surface to the opening end) is formed, and the concave portion is also filled with a sealing resin (see, for example, Patent Document 1).

この従来例の場合、コンデンサ素子を封入する封止樹脂に振動を吸収させるに当たり、外装ケースの内壁に形成した凹部の内部にも封止樹脂を喰い込ませる状態で充填することにより、振動吸収する封止樹脂を介してコンデンサ素子の固定を堅固にし、振動吸収を効果的にするとしている。この方式は、振動をその発生場所において吸収するという考え方に従っている。 In the case of this conventional example, when the sealing resin that encloses the capacitor element absorbs the vibration, the vibration is absorbed by filling the inside of the recess formed in the inner wall of the outer case with the sealing resin biting into the inside. It is said that the capacitor element is firmly fixed via the sealing resin to effectively absorb vibration. This method follows the idea of absorbing vibration at its location.

従来、上記の特許文献1の方式とは異なる二重壁遮音タイプの電気機器容器が提案されている。それは、容器側板部を二重壁の構成とし、その二重壁内の空間を空気層、真空層あるいはグラスファイバー等の充填層としている。ただし、電気機器容器は金属製で、二重壁を構成する内側板と外側板はともに金属板で、同じく金属板である底板に溶接をもって固着されるものとなっている。そして、二重壁を含んで構成される金属製の電気機器容器は、その内部空間にコンデンサなどの電気機器とそれを覆う絶縁油を収容するものとなっている(例えば特許文献2参照)。 Conventionally, a double-wall sound insulation type electric appliance container different from the method of Patent Document 1 described above has been proposed. The container side plate portion has a double wall structure, and the space inside the double wall is a filling layer such as an air layer, a vacuum layer, or glass fiber. However, the electrical equipment container is made of metal, and both the inner plate and the outer plate constituting the double wall are metal plates, which are fixed to the bottom plate, which is also a metal plate, by welding. The metal electric device container including the double wall accommodates the electric device such as a capacitor and the insulating oil covering the electric device in its internal space (see, for example, Patent Document 2).

特開2009−94266号公報Japanese Unexamined Patent Publication No. 2009-94266 実開昭63−67218号公報Jikkai Sho 63-67218

本発明は、巻回型のコンデンサ素子の本体部を外装ケースに収容した上で樹脂封止された金属化フィルムコンデンサにおいて、高周波化に伴って避けがたく発生するコンデンサ素子の軸方向での唸り音などの雑音を効果的に低減することを課題とするものであるが、上述した2つの特許文献に記載の技術は、この課題を解決する上では充分なものではなかった。 The present invention is a metallized film capacitor in which the main body of a wound capacitor element is housed in an outer case and then sealed with a resin. An object of the present invention is to effectively reduce noise such as sound, but the techniques described in the above two patent documents have not been sufficient to solve this problem.

図17および図18(a),(b),(c)に示す金属化フィルムコンデンサは、その基本の構成が本発明と共通しているもので、冒頭で述べたように、コンデンサ素子1の本体部1aを収容する樹脂製の外装ケース3と、外装ケース3内に充填され固化によってコンデンサ素子の本体部1aを覆う封止樹脂4とを備えたタイプの従来例である。外装ケース3は上方開口の箱形を呈し、コンデンサ素子1の軸方向に相当するZ方向で対向する一対の側板部3a′,3a′と、Y方向で対向する一対の正面板部3b,3bと、X方向下方の下端の底板部3cとを有し、全体が合成樹脂によって一体的に成形されている。2は引き出し電極、3dは収容空間部である。 The metallized film capacitors shown in FIGS. 17 and 18 (a), (b), and (c) have the same basic configuration as the present invention, and as described at the beginning, the capacitor element 1 This is a conventional example of a type including a resin outer case 3 for accommodating the main body 1a and a sealing resin 4 which is filled in the outer case 3 and covers the main body 1a of the capacitor element by solidification. The outer case 3 has a box shape with an upper opening, and a pair of side plate portions 3a ′ and 3a ′ facing each other in the Z direction corresponding to the axial direction of the capacitor element 1 and a pair of front plate portions 3b and 3b facing each other in the Y direction. And the bottom plate portion 3c at the lower end in the X direction, and the whole is integrally molded with synthetic resin. Reference numeral 2 is a lead-out electrode, and 3d is a storage space.

巻回型の金属化フィルムコンデンサの場合には、その軸心部(中心部)に振動エネルギーが集中し、そこから軸方向の両外側方に向けて振動が伝搬し、最終的に軸方向両側の外方へ抜けるという現象を伴う傾向がある。近時のインバータ装置の高周波化に伴い、その傾向は強くなっている。 In the case of a wound metallized film capacitor, the vibration energy is concentrated in the axial center (center), and the vibration propagates from there to both outer sides in the axial direction, and finally both sides in the axial direction. It tends to be accompanied by the phenomenon of coming out of. With the recent increase in the frequency of inverter devices, this tendency is becoming stronger.

図17、図18の従来例の場合、軸方向に沿って側板に垂直に入射してきた高周波音波束は、その1枚ものの側板部3a′の外方に向けて抜ける。このとき、1枚ものの側板部3a′の振動を介して、ある立体角をもって広がって伝搬する。しかし、その立体角はメガホンのような細い截頭円錐筒状の比較的小さいものに限定され、拡散領域は1方向のみである。すなわち、軸方向の延長線周りの単一の比較的狭い立体角領域にすぎない。そのためと思われるが、コンデンサ素子の軸方向(Z方向)での唸り音などの雑音が相当に大きなものとなっている。 In the case of the conventional example of FIGS. 17 and 18, the high-frequency sound wave bundle vertically incident on the side plate along the axial direction escapes toward the outside of the side plate portion 3a'of the single piece. At this time, it spreads and propagates at a certain solid angle through the vibration of one side plate portion 3a'. However, its solid angle is limited to a relatively small one with a thin conical cylinder such as a megaphone, and the diffusion region is only in one direction. That is, it is only a single relatively narrow solid angle region around the extension in the axial direction. This is probably because of this, but the noise such as howling noise in the axial direction (Z direction) of the capacitor element is considerably large.

本発明者は、巻回型の金属化フィルムコンデンサについて、コンデンサ素子の軸方向とそれに直交する2方向につき、唸り音などの雑音の測定試験を行った。コンデンサ素子の軸方向をZ方向とし、Z方向に直交する2方向でコンデンサ素子を収容する樹脂製の外装ケースの開放方向(上方向)に沿った方向をX方向、Z方向とX方向とに直交する方向をY方向とする。 The present inventor has conducted a measurement test of noise such as a growl in the axial direction of the capacitor element and two directions orthogonal to the axial direction of the wound type metallized film capacitor. The axial direction of the capacitor element is the Z direction, and the directions along the opening direction (upward direction) of the resin outer case accommodating the capacitor element in two directions orthogonal to the Z direction are the X direction, the Z direction and the X direction. The direction orthogonal to each other is the Y direction.

測定試験として、外装ケースに注入充填する封止樹脂の種類を変更して測定を行った。この結果、唸り音などの雑音の低減に効果のある封止樹脂の種類があることが分かってきたが、近時のユーザーの要求に充分に応えることのできるレベルには達しないことが判明した。 As a measurement test, the measurement was performed by changing the type of sealing resin to be injected and filled in the outer case. As a result, it has become clear that there are types of sealing resins that are effective in reducing noise such as growls, but it has been found that they do not reach a level that can sufficiently meet the demands of recent users. ..

詳しくは、唸り音などの雑音に対する低減効果には方向性があることが分かってきた。すなわち、X方向やY方向では相応の雑音低減効果が認められたものの、Z方向では満足のできる雑音低減効果は認められなかった。その原因としては、次のような現象が考えられる。 Specifically, it has become clear that the effect of reducing noise such as growls has a direction. That is, although a corresponding noise reduction effect was observed in the X direction and the Y direction, a satisfactory noise reduction effect was not observed in the Z direction. The following phenomena can be considered as the cause.

上述したように、巻回型のコンデンサ素子において周辺部から軸心部に集中した振動エネルギーは軸心部で軸方向の両外側方に向けて伝搬し外方へ抜けるもので、インバータ装置の高周波化に伴い軸方向への抜けの強度が強くなっている。その結果、上述のように様々な工夫を凝らしても、雑音低減効果はZ方向では満足のできるものとはならなかったのである。 As described above, in the winding type capacitor element, the vibration energy concentrated from the peripheral part to the axial center portion propagates toward both outer sides in the axial direction at the axial center portion and escapes to the outside. Along with this, the strength of pulling out in the axial direction is increasing. As a result, the noise reduction effect was not satisfactory in the Z direction even if various measures were taken as described above.

本発明はこのような事情に鑑みて創作したものであり、巻回型のコンデンサ素子の本体部を外装ケースに収容した上で樹脂封止された金属化フィルムコンデンサに関して、特にコンデンサ素子の軸方向(Z方向)での唸り音などの雑音の低減効果を優れたものにすることを目的としている。 The present invention has been created in view of such circumstances. Regarding a metallized film capacitor in which the main body of a wound capacitor element is housed in an outer case and then sealed with a resin, particularly in the axial direction of the capacitor element. The purpose is to improve the effect of reducing noise such as howling noise in the (Z direction).

本発明は、次の手段を講じることにより上記の課題を解決する。 The present invention solves the above problems by taking the following measures.

本発明による金属化フィルムコンデンサは、
軸方向の両端に引き出し電極が接続された金属化フィルム巻回型のコンデンサ素子と、
前記引き出し電極の一部を除いて前記コンデンサ素子の本体部を収容する樹脂製の外装ケースと、
前記外装ケース内に充填され固化によって前記コンデンサ素子の本体部を覆う封止樹脂とを備えた金属化フィルムコンデンサであって、
前記外装ケースにおける前記軸方向の両端の側板部がそれぞれ前記軸方向で対向する外側板と内側板との二重壁に構成され、前記外側板と前記内側板との間に前記軸方向に垂直な方向で展開する音波束拡散用の空隙部が形成され、さらに、
前記外装ケースは、その内側板と外側板を含めて全体が樹脂の射出成形によって一体成形品に構成されていることを特徴とする。
The metallized film capacitor according to the present invention
A metallized film-wound capacitor element with lead-out electrodes connected to both ends in the axial direction,
A resin outer case that houses the main body of the capacitor element except for a part of the lead-out electrode, and
A metallized film capacitor provided with a sealing resin that is filled in the outer case and covers the main body of the capacitor element by solidification.
The side plates at both ends in the axial direction of the outer case are formed as a double wall of an outer plate and an inner plate facing each other in the axial direction, and are perpendicular to the axial direction between the outer plate and the inner plate. A gap for diffusion of sound wave bundles is formed, which develops in various directions .
The outer case is characterized in that the entire outer case including the inner plate and the outer plate is integrally molded by injection molding of resin .

本発明による上記の構成は、次のような作用効果を発揮する。 The above configuration according to the present invention exerts the following effects.

外装ケースにおける軸方向両端の側板部を軸方向で対向する外側板と内側板との二重壁に構成することにより、その外側板と内側板との間に、唸り音などの雑音を拡散して低減する機能を有する音波束拡散用の空隙部を形成している。それは、雑音の発生を抑制の直接の対象(ターゲット)とするものではなく、発生した雑音をその発生後に拡散することによって低減するものとなっている。 By forming the side plates at both ends of the outer case into a double wall consisting of an outer plate and an inner plate facing each other in the axial direction, noise such as a growl is diffused between the outer plate and the inner plate. It forms a gap for diffusing the sound wave bundle, which has a function of reducing the sound wave bundle. It does not directly target the generation of noise for suppression, but reduces the generated noise by diffusing it after it is generated.

音波束拡散用の空隙部は、軸方向の最外側に位置する外側板とそれの内側で軸方向に対向する内側板との二重壁で挟まれた空間である。空隙部が形成される前記の外装ケース軸方向両端の側板部のそれぞれは、前記の二重壁を構成する外側板および内側板に相当する。 The space for diffusing the sound wave bundle is a space sandwiched between a double wall of an outer plate located on the outermost side in the axial direction and an inner plate facing the inner side in the axial direction. Each of the side plate portions at both ends in the axial direction of the outer case in which the gap portion is formed corresponds to the outer plate and the inner plate constituting the double wall.

そして、音波束拡散用の空隙部は、内側板とこれに対向する外側板との二重壁によって挟み込まれて形成されている。したがって、コンデンサ素子の軸心部から軸方向に沿って両外側に伝搬してくる高周波音波束の振動エネルギーを内側板から音波束拡散用の空隙部へと導入させることができる。内側板を通過した高周波音波束は通過後の空隙部で伝搬方向の拡散を受ける。その高周波音波束の拡散の方向は、空隙部が展開する方向である軸方向(素子軸方向)に垂直な方向、およびその垂直な方向と軸方向との様々な傾斜角度での合成方向である。その様々な方向を集約した全領域は、コンデンサ素子軸心の周囲360度の広がりをもつ立体角領域となる。このこと自体については、その伝搬方向の先に外部に連通開放する開口部があるかないかは問題ではない。高周波音波束は内側板を抜けた直後には、音波束拡散用の空隙部において、周囲360度の広がりをもつ立体角領域で拡散する。 The gap for diffusing the sound wave bundle is formed by being sandwiched by a double wall of an inner plate and an outer plate facing the inner plate. Therefore, the vibration energy of the high-frequency sound wave bundle propagating from the axial center portion of the capacitor element to both outer sides along the axial direction can be introduced from the inner plate into the gap portion for diffusion of the sound wave bundle. The high-frequency sound wave bundle that has passed through the inner plate is diffused in the propagation direction in the gap after passing. The direction of diffusion of the high-frequency sound wave bundle is a direction perpendicular to the axial direction (element axial direction), which is the direction in which the gap is developed, and a synthesis direction at various inclination angles between the vertical direction and the axial direction. .. The entire region that aggregates the various directions is a solid angle region that extends 360 degrees around the axis of the capacitor element. Regarding this itself, it does not matter whether or not there is an opening that communicates with the outside in the propagation direction. Immediately after passing through the inner plate, the high-frequency sound wave bundle diffuses in the gap portion for diffusing the sound wave bundle in a solid angle region having a spread of 360 degrees around.

コンデンサ素子軸心周りの360度の拡散において、その先に外部に連通開放する開口部があれば、その方向に沿っての高周波音波束の外部逃げ出しは促進される。また、その先に外部に連通開放する開口部がなければ、そこは内側板と外側板とを軸方向に沿って連接(連設)する繋ぎ梁部であるが、高周波音波束はその繋ぎ梁部の振動を介して外部空間へと拡散する。いずれにしても、内側板(従来例では1枚ものの側板)から抜け出た後の、軸方向に対して垂直方向での高周波音波束の拡散立体角領域が、本発明では従来例に比べて充分に大きなものとなっている。 In the diffusion of 360 degrees around the axis of the capacitor element, if there is an opening that communicates and opens to the outside, the escape of the high-frequency sound wave bundle along the direction is promoted. If there is no opening that communicates with the outside and opens to the outside, it is a connecting beam that connects (continuously) the inner plate and the outer plate along the axial direction, but the high-frequency sound wave bundle is the connecting beam. It diffuses into the external space through the vibration of the part. In any case, the diffusion solid angle region of the high-frequency sound wave bundle in the direction perpendicular to the axial direction after coming out of the inner plate (one side plate in the conventional example) is sufficient in the present invention as compared with the conventional example. It has become a big one.

上記のように、本発明においては、上方開口の外装ケース内に横置き姿勢で収容した金属化フィルム巻回型のコンデンサ素子を封止樹脂で覆い、そのコンデンサ素子の軸心部から軸方向に沿って伝搬してきた高周波音波束が外装ケースの内側板とこれに対向する外側板との二重壁によって挟み込まれて形成される音波束拡散用の空隙部の存在によって軸方向に対して垂直方向に広範囲に拡散されるため、特に軸方向(Z方向)での唸り音などの雑音の低減効果を優れたものにすることが可能となる。 As described above, in the present invention, the metallized film-wound capacitor element housed in the outer case of the upper opening in a horizontal position is covered with a sealing resin, and the capacitor element is axially oriented from the axial center portion. The high-frequency sound wave bundle propagating along the line is sandwiched between the double walls of the inner plate of the outer case and the outer plate facing the outer plate, and is formed by sandwiching the sound wave bundle in the direction perpendicular to the axial direction due to the presence of a gap for sound wave diffusion. Since it is diffused over a wide area, it is possible to improve the effect of reducing noise such as a roaring sound in the axial direction (Z direction).

上記構成の本発明の金属化フィルムコンデンサには、次のようないくつかの好ましい態様ないし変化・変形の態様がある。 The metallized film capacitor of the present invention having the above configuration has several preferable modes or changes / deformation modes as follows.

〔1〕前記音波束拡散用の空隙部は、前記コンデンサ素子の軸心の延長線と交差する位置関係にあること。この場合、コンデンサ素子の軸心部から軸方向に沿って両外側に伝搬してくる高周波音波束の振動エネルギーを音波束拡散用の空隙部に対して効率良く導入させることが可能となる。 [1] The gap portion for diffusing the sound wave bundle is in a positional relationship that intersects with the extension line of the axial center of the capacitor element. In this case, it is possible to efficiently introduce the vibration energy of the high-frequency sound wave bundle propagating from the axial center portion of the capacitor element to both outer sides along the axial direction into the gap portion for diffusing the sound wave bundle.

〔2〕前記音波束拡散用の空隙部は、その中心部が前記コンデンサ素子の軸心の延長線の近傍に位置していること。この場合、音波束拡散用の空隙部に入ってくる高周波音波束を軸心部まわりの360度範囲の全方位に対してほぼ均等に拡散させることが可能となる。 [2] The central portion of the gap portion for diffusing the sound wave bundle is located near the extension line of the axial center of the condenser element. In this case, the high-frequency sound wave bundle entering the gap for diffusing the sound wave bundle can be diffused substantially evenly in all directions in the 360-degree range around the axial center.

〕前記コンデンサ素子は、その軸心部が空洞となった円筒形であり、その軸心部の空洞にも前記封止樹脂が充填されていること。 [ 3 ] The capacitor element has a cylindrical shape in which the axial core portion is hollow, and the cavity in the axial core portion is also filled with the sealing resin.

本発明によれば、互いに対向する内側板と外側板で挟まれて形成される音波束拡散用の空隙部を巻回型のコンデンサ素子の軸方向両外側に配置してあるので、コンデンサ素子の軸心部から軸方向に沿って両外側に伝搬してくる高周波音波束の振動エネルギーを内側板から空隙部へと導入させることができる。その音波束拡散用の空隙部は軸方向に対して垂直な方向で展開しており、内側板を通して空隙部に入った振動エネルギーは空隙部内を軸心部から放射方向に拡散してゆく。その結果として、コンデンサ素子から軸方向に沿って伝搬してきた高周波音波束を音波束拡散用の空隙部において広範囲に拡散でき、特に軸方向での唸り音などの雑音の低減効果を優れたものにすることができる。 According to the present invention, since the gaps for diffusion of sound wave bundles formed by being sandwiched between the inner plate and the outer plate facing each other are arranged on both outer sides in the axial direction of the winding type condenser element, the condenser element The vibration energy of the high-frequency sound wave bundle propagating from the axial center portion to both outer sides along the axial direction can be introduced from the inner plate to the gap portion. The gap portion for diffusing the sound wave bundle develops in a direction perpendicular to the axial direction, and the vibration energy entering the gap portion through the inner plate diffuses in the gap portion in the radial direction from the axial center portion. As a result, the high-frequency sound wave bundle propagating from the capacitor element along the axial direction can be diffused over a wide range in the gap for diffusing the sound wave bundle, and the effect of reducing noise such as roaring sound in the axial direction is particularly excellent. can do.

本発明の第1の実施例における金属化フィルムコンデンサを示す斜視図Perspective view showing a metallized film capacitor in the first embodiment of the present invention. 第1の実施例における金属化フィルムコンデンサの平面図、正面図および側面図Top view, front view and side view of the metallized film capacitor in the first embodiment. 第1の実施例における金属化フィルムコンデンサの要部の斜視図および縦断面図Perspective view and vertical sectional view of the main part of the metallized film capacitor in the first embodiment. 本発明の第2の実施例における金属化フィルムコンデンサを示す斜視図Perspective view showing a metallized film capacitor in the second embodiment of the present invention. 第2の実施例における金属化フィルムコンデンサの平面図、正面図および側面図Top view, front view and side view of the metallized film capacitor in the second embodiment. 第2の実施例における金属化フィルムコンデンサの要部の斜視図および縦断面図Perspective view and vertical sectional view of the main part of the metallized film capacitor in the second embodiment. 本発明の第3の実施例における金属化フィルムコンデンサを示す斜視図Perspective view showing a metallized film capacitor in the third embodiment of the present invention. 第3の実施例における金属化フィルムコンデンサの平面図、正面図および側面図Top view, front view and side view of the metallized film capacitor in the third embodiment. 第3の実施例における金属化フィルムコンデンサの要部の斜視図および縦断面図Perspective view and vertical sectional view of the main part of the metallized film capacitor in the third embodiment. 本発明の第4の実施例における金属化フィルムコンデンサを示す斜視図Perspective view showing the metallized film capacitor in the 4th Example of this invention. 第4の実施例における金属化フィルムコンデンサの平面図、正面図および側面図Top view, front view and side view of the metallized film capacitor in the fourth embodiment. 第4の実施例における金属化フィルムコンデンサの要部の斜視図および縦断面図Perspective view and vertical sectional view of the main part of the metallized film capacitor in the fourth embodiment. 本発明の第5の実施例における金属化フィルムコンデンサを示す斜視図A perspective view showing a metallized film capacitor according to a fifth embodiment of the present invention. 第5の実施例における金属化フィルムコンデンサの平面図、正面図および側面図Top view, front view and side view of the metallized film capacitor in the fifth embodiment. 第6の実施例における金属化フィルムコンデンサの要部の斜視図および縦断面図Perspective view and vertical sectional view of the main part of the metallized film capacitor in the sixth embodiment. 5つの実施例と従来例について行った唸り音などの雑音測定試験の結果で得られた雑音強度‐周波数特性図Noise intensity-frequency characteristic diagram obtained as a result of noise measurement tests such as growls performed for the five examples and the conventional example. 従来例の金属化フィルムコンデンサの構成を示す斜視図A perspective view showing the configuration of a conventional metallized film capacitor. 従来例の金属化フィルムコンデンサの平面図、正面図および側面図Top view, front view and side view of the conventional metallized film capacitor

以下、上記構成の本発明の金属化フィルムコンデンサにつき、その実施の形態を具体的な実施例のレベルで詳しく説明する。 Hereinafter, embodiments of the metallized film capacitor of the present invention having the above configuration will be described in detail at the level of specific examples.

〔第1の実施例〕
本発明の第1の実施例を図1、図2および図3を用いて説明する。図1は本発明の第1の実施例における金属化フィルムコンデンサを示す斜視図、図2(a),(b),(c)はその平面図、正面図および側面図、図3(a),(b)は要部の斜視図、図3(c)は要部の縦断面図である。
[First Example]
A first embodiment of the present invention will be described with reference to FIGS. 1, 2 and 3. FIG. 1 is a perspective view showing a metallized film capacitor according to the first embodiment of the present invention, FIGS. 2 (a), 2 (b) and 2 (c) are a plan view, a front view and a side view thereof, and FIG. 3 (a). , (B) is a perspective view of the main part, and FIG. 3 (c) is a vertical sectional view of the main part.

これらの図において、1は金属化フィルム巻回型のコンデンサ素子、1aはコンデンサ素子1の本体部、2は引き出し電極、3は樹脂製の外装ケース、4は封止樹脂である。3aは外装ケース3における軸方向両端の側板部、3bは外装ケース3における正面板部、3cは外装ケース3における底板部、5は側板部に形成された音波束拡散用の空隙部、3a1 は側板部3aにおける内側板、3a2 は側板部3aにおける外側板である。 In these figures, 1 is a metallized film winding type capacitor element, 1a is a main body of the capacitor element 1, 2 is a lead-out electrode, 3 is a resin outer case, and 4 is a sealing resin. 3a is a side plate portion at both ends in the axial direction in the outer case 3, 3b is a front plate portion in the outer case 3, 3c is a bottom plate portion in the outer case 3, 5 is a gap portion for sonic bundle diffusion formed in the side plate portion, 3a 1 Is the inner plate in the side plate portion 3a, and 3a 2 is the outer plate in the side plate portion 3a.

図3は一方の側板部3aとその周辺部を拡大して示しており、図3(a)は外装ケース3の部分を実線で、音波束拡散用の空隙部5の部分を破線でそれぞれ示し、図3(b)は空隙部5の部分を実線で、外装ケース3の部分は破線でそれぞれ示し、図3(c)は空隙部5をXY2次元方向で縦断した断面図を示す。 FIG. 3 shows an enlarged view of one side plate portion 3a and its peripheral portion, and FIG. 3A shows a portion of the outer case 3 with a solid line and a portion of the gap portion 5 for sound wave bundle diffusion with a broken line. 3 (b) shows the gap portion 5 with a solid line, the outer case 3 portion with a broken line, and FIG. 3 (c) shows a cross-sectional view of the gap portion 5 longitudinally crossed in the XY two-dimensional direction.

図1に示すように、コンデンサ素子1は、金属化フィルムを多重巻きして円筒状に形成したコンデンサ素子の本体部1aと、その本体部1aの軸方向両端に対して金属溶射して形成した金属溶射電極(メタリコン)にはんだ付けした正極・負極一対の引き出し電極2,2とを有している。 As shown in FIG. 1, the capacitor element 1 is formed by spraying metal onto the main body 1a of the capacitor element formed by repeatedly winding a metallized film to form a cylindrical shape and both ends of the main body 1a in the axial direction. It has a pair of lead-out electrodes 2 and 2 of a positive electrode and a negative electrode soldered to a metal spray electrode (metallic capacitor).

ここで、金属化フィルムは誘電体フィルムの片面に蒸着などにより金属薄膜電極を形成したものであり、その金属化フィルムを2枚重ね合わせした状態で巻回している。巻回に際しては、先巻用フィルムを多重に巻回して作製した薄肉円筒状の巻芯を芯材として、その外周に2枚重ね合わせ状態の金属化フィルムを多重に巻回し、さらに最外層に外装フィルムを巻回する。このようにして作製された円筒状巻回体の軸方向両端面に金属微粒子を溶射して金属溶射電極を形成するのであるが、溶射前に円筒状巻回体から巻芯を引き抜いておく。この段階では、コンデンサ素子の本体部1aの軸心部には巻芯を抜き取ったあとの軸方向両側に開放している円柱状の空洞が形成されている。 Here, the metallized film is formed by forming a metal thin film electrode on one side of a dielectric film by vapor deposition or the like, and the two metallized films are wound in a state of being overlapped with each other. At the time of winding, a thin-walled cylindrical winding core produced by multiple winding of the pre-winding film is used as a core material, and two metallized films in a state of being superposed are wound multiple times on the outer circumference thereof, and further to the outermost layer. Wind the exterior film. Metal fine particles are sprayed on both end faces in the axial direction of the cylindrical winding body thus produced to form a metal spraying electrode, and the winding core is pulled out from the cylindrical winding body before spraying. At this stage, a columnar cavity that is open on both sides in the axial direction after the winding core is removed is formed in the axial center portion of the main body portion 1a of the capacitor element.

図1および図2に示すように、樹脂製の外装ケース3は、上方開口の箱形を呈し、Z方向(コンデンサ素子の本体部1aの軸方向。水平横方向)で平行に対向する一対の側板部3a,3aと、Y方向(Z方向に垂直に交差する水平横方向)で平行に対向する一対の正面板部3b,3bと、X方向(Z方向およびY方向に垂直に交差する縦方向)に直交する平面内で平坦に展開する底板部3cとを有している。側板部3a,3aはX方向・Y方向の2次元平面に沿って平坦に展開し、正面板部3b,3bはZ方向・X方向の2次元平面に沿って平坦に展開している。一対の側板部3a,3aと一対の正面板部3b,3bと1枚の底板部3cとは合成樹脂によって一体的に成形されている。 As shown in FIGS. 1 and 2, the resin outer case 3 has a box shape with an upper opening, and a pair of facing each other in parallel in the Z direction (axial direction of the main body 1a of the capacitor element, horizontal and horizontal direction). A pair of front plate portions 3b and 3b that face each other in parallel with the side plate portions 3a and 3a in the Y direction (horizontal and horizontal directions that intersect vertically in the Z direction) and in the X direction (vertically intersect in the Z direction and the Y direction). It has a bottom plate portion 3c that unfolds flatly in a plane orthogonal to the direction). The side plate portions 3a and 3a are flatly developed along the two-dimensional planes in the X and Y directions, and the front plate portions 3b and 3b are flatly developed along the two-dimensional planes in the Z and X directions. The pair of side plate portions 3a, 3a, the pair of front plate portions 3b, 3b, and the one bottom plate portion 3c are integrally formed of synthetic resin.

図3にも示すように、各側板部3aには音波束拡散用の空隙部5が形成されている。その空隙部5はX方向・Y方向の2次元平面に沿って展開している。この空隙部5は互いに平行な姿勢でZ方向に対向する内側板3a1 と外側板3a2 とで挟まれた形態となっている。 As shown in FIG. 3, a gap portion 5 for diffusing the sound wave bundle is formed in each side plate portion 3a. The gap portion 5 develops along a two-dimensional plane in the X direction and the Y direction. The gap portion 5 is sandwiched between an inner plate 3a 1 and an outer plate 3a 2 facing each other in the Z direction in a parallel posture.

音波束拡散用の空隙部5は、コンデンサ素子1の軸心の延長線と交差する位置関係にある。より詳しくは、空隙部5は、その中心部がコンデンサ素子1の軸心の延長線の近傍に位置している。 The gap portion 5 for diffusing the sound wave bundle is in a positional relationship that intersects with the extension line of the axial center of the capacitor element 1. More specifically, the central portion of the gap portion 5 is located near the extension line of the axial center of the capacitor element 1.

空隙部5はX方向での上方向に開放されているが、X方向での下方向では閉塞し、Y方向での両方向でも閉塞している。底板部3cは外装ケース3の底面全体にわたっている。空隙部5の態様は一対の側板部3a,3aで同様の構成となっている。 The gap 5 is open upward in the X direction, but is closed in the downward direction in the X direction and closed in both directions in the Y direction. The bottom plate portion 3c covers the entire bottom surface of the outer case 3. The aspect of the gap portion 5 is the same configuration as the pair of side plate portions 3a, 3a.

なお、図3では空隙部5の形状について、端縁部(エッジ部)を直角に描いているが、それは空隙部5の存在を明確化するための工夫である。実際的には、図1や図2のように半円弧上の曲線を描くものである。もっとも、空隙部5の端縁部(エッジ部)を積極的に直角にしてもよい。 In FIG. 3, the edge portion (edge portion) is drawn at a right angle with respect to the shape of the gap portion 5, which is a device for clarifying the existence of the gap portion 5. In practice, a curve on a semicircle is drawn as shown in FIGS. 1 and 2. However, the edge portion (edge portion) of the gap portion 5 may be positively made at a right angle.

以上のような形態の外装ケース3が合成樹脂の射出成形によって一体的に形成されている。その合成樹脂としては、PET(ポリエチレンテレフタレート)、PBT(ポリブチレンテレフタレート)やPPS(ポリフェニレンサルファイド)などが用いられる。 The exterior case 3 having the above-described form is integrally formed by injection molding of synthetic resin. As the synthetic resin, PET (polyethylene terephthalate), PBT (polybutylene terephthalate), PPS (polyphenylene sulfide) and the like are used.

外装ケース3において底板部3cと一対の正面板部3b,3bと一対の内側板3a1 ,3a1 で囲まれた収容空間部3dにコンデンサ素子1の本体部1aが上方から収容される。コンデンサ素子の本体部1aの軸方向が外装ケース3のZ方向に沿う姿勢で収容される。このとき、コンデンサ素子の本体部1aはその全体が収容空間部3dの内部に入り込んだ状態で収容されるが、正極・負極一対の引き出し電極2,2のほぼ上半分が収容空間部3dの上方開口部から外部上方に突出している。 In the outer case 3, the main body portion 1a of the capacitor element 1 is accommodated from above in the accommodation space portion 3d surrounded by the bottom plate portion 3c, the pair of front plate portions 3b, 3b, and the pair of inner plates 3a 1 , 3a 1. The axial direction of the main body 1a of the capacitor element is accommodated in a posture along the Z direction of the outer case 3. At this time, the main body 1a of the capacitor element is accommodated in a state where the entire body is contained inside the accommodation space 3d, but the substantially upper half of the pair of positive electrode and negative electrode lead electrodes 2 and 2 is above the accommodation space 3d. It protrudes outward and upward from the opening.

音波束拡散用の空隙部5のY方向の端部位置は収容空間部3dのY方向の端部位置と一致している。空隙部5のX方向下方の端部位置は収容空間部3dのX方向下方の端部位置と一致している。空隙部5のZ方向での幅は空隙部5の全体にわたって均一であり、その幅は内側板3a1 や外側板3a2 の幅とほぼ同じとなっている。空隙部5はX方向上方においてのみ外部に開放しており、X方向下方、Y方向の両方向およびZ方向の両方向では閉じた状態となっている。 The position of the end portion of the gap portion 5 for diffusing the sound wave bundle in the Y direction coincides with the position of the end portion of the accommodation space portion 3d in the Y direction. The position of the lower end portion of the gap portion 5 in the X direction coincides with the position of the lower end portion of the accommodation space portion 3d in the X direction. The width of the gap portion 5 in the Z direction is uniform over the entire gap portion 5, and the width thereof is substantially the same as the width of the inner plate 3a 1 and the outer plate 3a 2. The gap 5 is open to the outside only in the upper direction of the X direction, and is closed in both the lower direction of the X direction, both directions of the Y direction, and both directions of the Z direction.

外装ケース3の収容空間部3dにはエポキシ樹脂などの封止樹脂4が充填固化されており(ポッティング)、その封止樹脂4によってコンデンサ素子の本体部1aと引き出し電極2,2の基部側が封入されている。封止樹脂4はコンデンサ素子の本体部1aや本体部1aと引き出し電極2,2との接続部を保護するものである。この封止樹脂4は本体部1aの軸心部で巻芯を抜き取ったあとの軸方向の円柱状の空洞にも充填される。 A sealing resin 4 such as an epoxy resin is filled and solidified in the accommodation space 3d of the outer case 3 (potting), and the sealing resin 4 encloses the main body 1a of the capacitor element and the base side of the extraction electrodes 2 and 2. Has been done. The sealing resin 4 protects the main body 1a of the capacitor element and the connection between the main body 1a and the lead-out electrodes 2 and 2. The sealing resin 4 is also filled in the cylindrical cavity in the axial direction after the winding core is pulled out at the axial center portion of the main body portion 1a.

〔第2の実施例〕
本発明の第2の実施例を図4、図5および図6を用いて説明する。図4は本発明の第2の実施例における金属化フィルムコンデンサを示す斜視図、図5(a),(b),(c)はその平面図、正面図および側面図、図6(a),(b)は要部の斜視図、図6(c)は要部の縦断面図である。第2の実施例のこれらの各図において第1の実施例の各図で用いたのと同一符号は同一の構成要素を指すものとし、詳しい説明は省略する。
[Second Example]
A second embodiment of the present invention will be described with reference to FIGS. 4, 5 and 6. FIG. 4 is a perspective view showing a metallized film capacitor according to a second embodiment of the present invention, FIGS. 5 (a), 5 (b) and 5 (c) are a plan view, a front view and a side view thereof, and FIG. 6 (a). , (B) is a perspective view of the main part, and FIG. 6C is a vertical sectional view of the main part. In each of these figures of the second embodiment, the same reference numerals used in each of the figures of the first embodiment refer to the same components, and detailed description thereof will be omitted.

第2の実施例においては、第1の実施例に比べて、音波束拡散用の空隙部5の寸法(内容積)が拡張されたものとなっている。すなわち、空隙部5のZ方向の幅、Y方向の幅、X方向の幅のいずれもが第1の実施例のそれらに比べてより広幅となっている。ただし、第1の実施例の場合と同様に、空隙部5はX方向上方においてのみ外部に開放しており、下方向、Y方向の両方向およびZ方向の両方向では閉じた状態となっている。 In the second embodiment, the dimension (internal volume) of the gap portion 5 for diffusing the sound wave bundle is expanded as compared with the first embodiment. That is, the width of the gap portion 5 in the Z direction, the width in the Y direction, and the width in the X direction are all wider than those in the first embodiment. However, as in the case of the first embodiment, the gap portion 5 is open to the outside only in the upper direction in the X direction, and is closed in both the downward direction, the Y direction, and the Z direction.

幅が拡張されたことに伴い、空隙部5のX方向下方に位置する底板部3cの肉厚は第1の実施例よりも薄くなっている。空隙部5のY方向に位置する正面板部3bの肉厚は第1の実施例よりも薄くなっている。内側板3a1 および外側板3a2 の肉厚も第1の実施例よりも薄くなっている。 As the width is expanded, the wall thickness of the bottom plate portion 3c located below the gap portion 5 in the X direction is thinner than that of the first embodiment. The wall thickness of the front plate portion 3b located in the Y direction of the gap portion 5 is thinner than that of the first embodiment. The wall thickness of the inner plate 3a 1 and the outer plate 3a 2 is also thinner than that of the first embodiment.

その他の構成については第1の実施例の場合と同様である。 Other configurations are the same as in the case of the first embodiment.

この第2の実施例では音波束拡散用の空隙部5の幅の拡張(板部の薄肉化)がX方向、Y方向、Z方向の3方向のいずれにおいても行われているが、変形の実施例として、3方向のうちのいずれか1方向での拡張としてもよいし、あるいは3方向のうちのいずれか2方向(組み合わせは任意)での拡張としてもよい。 In this second embodiment, the width of the gap portion 5 for diffusing the sound wave bundle is expanded (thinning of the plate portion) in any of the three directions of the X direction, the Y direction, and the Z direction. As an embodiment, it may be extended in any one of the three directions, or may be extended in any two of the three directions (the combination is arbitrary).

〔第3の実施例〕
本発明の第3の実施例を図7、図8および図9を用いて説明する。図7は本発明の第3の実施例における金属化フィルムコンデンサを示す斜視図、図8(a),(b),(c)はその平面図、正面図および側面図、図9(a),(b)は要部の斜視図、図9(c)は要部の縦断面図である。第3の実施例のこれらの各図において第1の実施例の各図で用いたのと同一符号は同一の構成要素を指すものとし、詳しい説明は省略する。
[Third Example]
A third embodiment of the present invention will be described with reference to FIGS. 7, 8 and 9. 7 is a perspective view showing a metallized film capacitor according to a third embodiment of the present invention, FIGS. 8 (a), 8 (b) and 8 (c) are a plan view, a front view and a side view thereof, and FIG. 9 (a). , (B) is a perspective view of the main part, and FIG. 9 (c) is a vertical sectional view of the main part. In each of these figures of the third embodiment, the same reference numerals used in each of the figures of the first embodiment refer to the same components, and detailed description thereof will be omitted.

第1の実施例では音波束拡散用の空隙部5の外部開放の方向がX方向の一側方(上方向)のみであったのに対して、第3の実施例においては、空隙部5の外部開放の方向がX方向の両側方(上方向と下方向)となっている。このことは、特に図8(b)および図9(c)でよく分かる。すなわち、空隙部5での底は外部(下方)開放となっている。第1の実施例の場合と同様に、Y方向の両方向およびZ方向の両方向では閉じた状態となっている。 In the first embodiment, the direction of opening the gap portion 5 for diffusing the sound wave bundle to the outside is only one side (upward direction) in the X direction, whereas in the third embodiment, the gap portion 5 is opened. The direction of opening to the outside is both sides (upward and downward) in the X direction. This is especially clear in FIGS. 8 (b) and 9 (c). That is, the bottom of the gap 5 is open to the outside (downward). As in the case of the first embodiment, it is in a closed state in both the Y direction and the Z direction.

その他の構成については第1の実施例の場合と同様である。 Other configurations are the same as in the case of the first embodiment.

〔第4の実施例〕
本発明の第4の実施例を図10、図11および図12を用いて説明する。図10は本発明の第4の実施例における金属化フィルムコンデンサを示す斜視図、図11(a),(b),(c)はその平面図、正面図および側面図、図12(a),(b)は要部の斜視図、図12(c)は要部の縦断面図である。第4の実施例のこれらの各図において第1の実施例の各図で用いたのと同一符号は同一の構成要素を指すものとし、詳しい説明は省略する。
[Fourth Example]
A fourth embodiment of the present invention will be described with reference to FIGS. 10, 11 and 12. 10 is a perspective view showing a metallized film capacitor according to a fourth embodiment of the present invention, FIGS. 11 (a), 11 (b) and 11 (c) are a plan view, a front view and a side view thereof, and FIG. 12 (a). , (B) is a perspective view of the main part, and FIG. 12 (c) is a vertical sectional view of the main part. In each of these figures of the fourth embodiment, the same reference numerals as those used in the respective figures of the first embodiment refer to the same components, and detailed description thereof will be omitted.

第4の実施例においては、音波束拡散用の空隙部5の外部開放の方向がX方向の両側方およびY方向の両側方となっている。図12(c)に示すように、空隙部5の4つの角部においては、外側板3a2 を内側板3a1 に連接(連設)しておくための小さな断面積の柱状の連接部3e‥がある。これら4つの連接部3e‥は、外部開放の開口面積を可能な限り大きくするために、その断面はほぼ正方形で、その上下寸法および左右寸法は正面板部3bの肉厚とほぼ同じ寸法となっている。 In the fourth embodiment, the directions of opening the gap 5 for diffusing the sound wave bundle to the outside are both sides in the X direction and both sides in the Y direction. As shown in FIG. 12 (c), at the four corners of the gap portion 5, a columnar connecting portion 3e having a small cross-sectional area for connecting (continuously connecting) the outer plate 3a 2 to the inner plate 3a 1 There is. The cross section of these four connecting portions 3e ... Is approximately square in order to make the opening area of the external opening as large as possible, and the vertical and horizontal dimensions thereof are substantially the same as the wall thickness of the front plate portion 3b. ing.

その他の構成については第1の実施例の場合と同様である。 Other configurations are the same as in the case of the first embodiment.

第4の実施例の変形の実施例として、X方向のいずれか一側方とY方向のいずれか一側方との組み合わせ、X方向の両側方とY方向のいずれか一側方との組み合わせ、X方向のいずれか一側方とY方向の両側方との組み合わせなどであってもよい。 As an embodiment of the modification of the fourth embodiment, a combination of either one side of the X direction and any one side of the Y direction, or a combination of both sides of the X direction and any one side of the Y direction. , Either one side in the X direction and both sides in the Y direction may be combined.

〔第5の実施例〕
本発明の第5の実施例を図13、図14および図15を用いて説明する。図13は本発明の第5の実施例における金属化フィルムコンデンサを示す斜視図、図14(a),(b),(c)はその平面図、正面図および側面図、図15(a),(b)は要部の斜視図、図15(c)は要部の縦断面図である。第5の実施例のこれらの各図において第1の実施例、第4の実施例の各図で用いたのと同一符号は同一の構成要素を指すものとし、詳しい説明は省略する。
[Fifth Example]
A fifth embodiment of the present invention will be described with reference to FIGS. 13, 14 and 15. 13 is a perspective view showing a metallized film capacitor according to a fifth embodiment of the present invention, FIGS. 14 (a), 14 (b) and 14 (c) are a plan view, a front view and a side view thereof, and FIG. 15 (a). , (B) is a perspective view of the main part, and FIG. 15C is a vertical sectional view of the main part. In each of these figures of the fifth embodiment, the same reference numerals as those used in the drawings of the first embodiment and the fourth embodiment refer to the same components, and detailed description thereof will be omitted.

音波束拡散用の空隙部5の外部開放の方向がX方向の両側方でありかつY方向の両側方である点は第4の実施例と同様であるが(図15(c)参照)、Y方向端での開口のX方向幅が第4の実施例よりも狭くなっている。外側板3a2 を内側板3a1 に連接しておくための4つの連接部3e‥は第4の実施例の場合より縦長となっている。Y方向端での空隙部5の開口の位置はX方向での中央位置となっている。 It is the same as the fourth embodiment in that the direction of opening the gap 5 for diffusing the sound wave bundle to the outside is both sides in the X direction and both sides in the Y direction (see FIG. 15C). The width of the opening in the X direction at the end in the Y direction is narrower than that in the fourth embodiment. The four connecting portions 3e ... for connecting the outer plate 3a 2 to the inner plate 3a 1 are vertically longer than in the case of the fourth embodiment. The position of the opening of the gap 5 at the end in the Y direction is the central position in the X direction.

その他の構成については第1の実施例の場合と同様である。 Other configurations are the same as in the case of the first embodiment.

変形の実施例として、Y方向端での音波束拡散用の空隙部5の開口の位置がX方向での中央位置ではなく、上方向または下方向に偏っていてもよいし、開口の数を2以上としてもよい。 As an embodiment of the modification, the position of the opening of the gap 5 for diffusing the sound wave bundle at the end in the Y direction may be biased upward or downward instead of the central position in the X direction, and the number of openings may be set. It may be 2 or more.

上記の5つの実施例の金属化フィルムコンデンサについて唸り音などの雑音の強度‐周波数特性の測定試験を行った。その結果を図17、図18に示す従来例と対応させながら図16(a),(b)に示す。図16(a)は実測データを示し、図16(b)は各周波数において従来例の場合の雑音強度をすべて0にして正規化したデータである。周波数範囲は10.0kHzから13.0kHzまでの7点(0.5kHz刻み)と11.8kHzとである。 The metallized film capacitors of the above five examples were tested for measuring the intensity-frequency characteristics of noise such as roaring noise. The results are shown in FIGS. 16 (a) and 16 (b) in correspondence with the conventional examples shown in FIGS. 17 and 18. FIG. 16A shows actual measurement data, and FIG. 16B is data normalized by setting all the noise intensities in the conventional example to 0 at each frequency. The frequency range is 7 points (in 0.5 kHz increments) from 10.0 kHz to 13.0 kHz and 11.8 kHz.

この図において、(1)は第1の実施例(上方向のみ開放)の結果、(2)は第2の実施例(上方向のみ開放かつ拡張タイプ)の結果、(3)は第3の実施例(上下両方向に開放)の結果、(4)は第4の実施例(上下左右方向に開放)の結果、(5)は第5の実施例(上下左右方向に開放かつ左右方向開口縮小タイプ)の結果、(0)は従来例の結果である。 In this figure, (1) is the result of the first embodiment (open only in the upward direction), (2) is the result of the second embodiment (open only in the upward direction and is an extended type), and (3) is the third. As a result of the embodiment (opening in both the vertical and horizontal directions), (4) is the result of the fourth embodiment (opening in the vertical and horizontal directions), and (5) is the result of the fifth embodiment (opening in the vertical and horizontal directions and reducing the opening in the horizontal direction). As a result of (type), (0) is the result of the conventional example.

第1の実施例から第5の実施例までのすべてにつき、音波束拡散用の空隙部5の存在は唸り音などの雑音を各周波数において低減する効果があることが分かる。また、上下左右開放タイプの(3),(5)の場合は(1),(2),(4)より優れた雑音低減効果をもつ傾向があるといえる。 In all of the first to fifth embodiments, it can be seen that the presence of the gap portion 5 for sound wave flux diffusion has the effect of reducing noise such as a growl at each frequency. Further, it can be said that the vertical and horizontal open types (3) and (5) tend to have a better noise reduction effect than (1), (2) and (4).

いずれにしても、内側板3a1 と外側板3a2 との二重壁によって形成される音波束拡散用の空隙部5の存在により、内側板3a1 を通過した高周波音波束の伝搬方向を大きく拡散する。その高周波音波束の拡散の方向は様々な方向を集約したコンデンサ素子軸心の周囲360度の広がりをもつ立体角領域となる。 In any case, the propagation direction of the high-frequency sound wave bundle passing through the inner plate 3a 1 is increased due to the presence of the gap portion 5 for diffusing the sound wave bundle formed by the double wall of the inner plate 3a 1 and the outer plate 3a 2. Spread. The direction of diffusion of the high-frequency sound wave bundle is a solid angle region having a spread of 360 degrees around the axis of the capacitor element, which is a collection of various directions.

このように、本発明実施例においては、コンデンサ素子の本体部1aの軸心部から軸方向に沿って伝搬してきた高周波音波束が音波束拡散用の空隙部5の存在によって広範囲に拡散されるため、特に軸方向(Z方向)での唸り音などの雑音の低減効果を優れたものにすることができる。 As described above, in the embodiment of the present invention, the high-frequency sound wave bundle propagating along the axial direction from the axial center portion of the main body portion 1a of the capacitor element is widely diffused by the presence of the gap portion 5 for diffusing the sound wave bundle. Therefore, the effect of reducing noise such as howling noise in the axial direction (Z direction) can be made excellent.

なお、上記実施例では、コンデンサ素子の本体部1aを円筒状にしているが、これに代えて円筒形を半径方向内方に圧迫変形した扁平柱状体としてもよい。もっとも素子断面を真円形状に近くするほど、強固に巻き取りを行うことができ、雑音抑制に効果的である。 In the above embodiment, the main body 1a of the capacitor element is formed into a cylindrical shape, but instead of this, a flat columnar body obtained by compressing and deforming the cylindrical shape inward in the radial direction may be used. However, the closer the element cross section is to a perfect circular shape, the stronger the winding can be performed, which is effective in suppressing noise.

上記の実施例では円筒状のコンデンサ素子の本体部1aの中心部の空洞には封止樹脂が充填されているが、そこに空気が残存していてもよい。 In the above embodiment, the cavity at the center of the main body 1a of the cylindrical capacitor element is filled with the sealing resin, but air may remain there.

本発明は、巻回型のコンデンサ素子の本体部を外装ケースに収容した上で樹脂封止された金属化フィルムコンデンサに関して、特にコンデンサ素子の軸方向(Z方向)での唸り音などの雑音の低減効果を優れたものにする技術として有用である。 The present invention relates to a metallized film capacitor in which the main body of a wound capacitor element is housed in an outer case and then sealed with a resin, in particular, noise such as roaring noise in the axial direction (Z direction) of the capacitor element. It is useful as a technique to improve the reduction effect.

1 コンデンサ素子
1a コンデンサ素子の本体部
2 引き出し電極
3 外装ケース
3a 側板部
3a1 内側板
3a2 外側板
4 封止樹脂
5 音波束拡散用の空隙部
1 Capacitor element 1a Capacitor element body 2 Drawer electrode 3 Exterior case 3a Side plate 3a 1 Inner plate 3a 2 Outer plate 4 Encapsulating resin 5 Air gap for sonic bundle diffusion

Claims (4)

軸方向の両端に引き出し電極が接続された金属化フィルム巻回型のコンデンサ素子と、
前記引き出し電極の一部を除いて前記コンデンサ素子の本体部を収容する樹脂製の外装ケースと、
前記外装ケース内に充填され固化によって前記コンデンサ素子の本体部を覆う封止樹脂とを備えた金属化フィルムコンデンサであって、
前記外装ケースにおける前記軸方向の両端の側板部がそれぞれ前記軸方向で対向する外側板と内側板との二重壁に構成され、前記外側板と前記内側板との間に前記軸方向に垂直な方向で展開する音波束拡散用の空隙部が形成され、さらに、
前記外装ケースは、その内側板と外側板を含めて全体が樹脂の射出成形によって一体成形品に構成されていることを特徴とする金属化フィルムコンデンサ。
A metallized film-wound capacitor element with lead-out electrodes connected to both ends in the axial direction,
A resin outer case that houses the main body of the capacitor element except for a part of the lead-out electrode, and
A metallized film capacitor provided with a sealing resin that is filled in the outer case and covers the main body of the capacitor element by solidification.
The side plates at both ends in the axial direction of the outer case are formed as a double wall of an outer plate and an inner plate facing each other in the axial direction, and are perpendicular to the axial direction between the outer plate and the inner plate. A gap for diffusion of sound wave bundles is formed, which develops in various directions .
The outer case is a metallized film capacitor characterized in that the entire body including the inner plate and the outer plate is integrally molded by injection molding of resin.
前記音波束拡散用の空隙部は、前記コンデンサ素子の軸心の延長線と交差する位置関係にある請求項1に記載の金属化フィルムコンデンサ。 The metallized film capacitor according to claim 1, wherein the gap portion for diffusing the sound wave bundle is in a positional relationship intersecting with an extension line of the axial center of the capacitor element. 前記音波束拡散用の空隙部は、その中心部が前記コンデンサ素子の軸心の延長線の近傍に位置している請求項2に記載の金属化フィルムコンデンサ。 The metallized film capacitor according to claim 2, wherein the gap portion for diffusing the sound wave bundle has a central portion located in the vicinity of an extension line of the axial center of the capacitor element. 前記コンデンサ素子は、その軸心部が空洞となった円筒形であり、その軸心部の空洞にも前記封止樹脂が充填されている請求項1から請求項3までのいずれか1項に記載の金属化フィルムコンデンサ。 According to any one of claims 1 to 3 , the capacitor element has a cylindrical shape having a hollow axial core, and the hollow of the axial core is also filled with the sealing resin. The metallized film capacitor described.
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