JP6933966B2 - Parts recognition device and component mounting device - Google Patents

Description

This specification discloses a technique relating to a component recognition device and a component mounting device.

Conventionally, there has been known a component recognition device that recognizes the presence or absence of component defects or adsorption defects by imaging a component attracted to a mounting head with an imaging device in order to mount the component on a substrate. The component mounting machine of Patent Document 1 includes an imaging monitoring device for determining the component suction state of the suction nozzle of the component transfer device and the quality of the component. This image pickup monitoring device stores the image data in which the suction nozzle sucks the component in the storage unit, and determines the presence or absence of an abnormality based on the image data. The image data is stored at an event that causes the operating status of the component supply device or the component transfer device to change, for example, a break of a component, a timing at which a tray as a medium for supplying the component is changed, and the like. As a result, it is possible to extend the storage period of the image data stored in the storage unit as compared with the case where the image data is constantly stored. The image data stored in the storage unit is used as a clue when elucidating the event of the occurrence of a defective substrate or device abnormality or investigating the cause.

Japanese Patent No. 5737989

By the way, in the configuration of Patent Document 1, the amount of image data stored in the storage unit is reduced by limiting the time for storing the image data. However, since the image of the component sucked by the suction nozzle is stored in the storage unit as it is, it is conceivable that the amount of image data stored in the storage unit increases according to the size of the component. In some cases, there is a concern that the free space of the storage unit will be exhausted. On the other hand, if the image quality of the image of the captured component is deteriorated, the amount of image data stored in the storage unit becomes small, and the exhaustion of the free area of the storage unit can be suppressed. When confirming the recognition state of, it becomes a factor that the recognition reproducibility is lowered.

The technique described in the present specification has been completed based on the above circumstances, and the storage unit is free while suppressing the deterioration of the recognition reproducibility due to the image data of the parts imaged by the imaging unit. It is an object of the present invention to provide a component recognition device and a component mounting device capable of suppressing the exhaustion of a region.

The component recognition device described in the present specification is a component recognition device that recognizes a component attracted to a mounting head, and includes an imaging unit that captures an image of the component and the image captured by the imaging unit. It includes a storage unit that stores an image of a selected area selected from the above, and an output unit that outputs an image of the selected area.
According to this configuration, the image of the selected area selected from the images captured by the imaging unit is stored in the storage unit, so that the entire captured image is stored in the storage unit as compared with the configuration in which the entire image is stored in the storage unit. Therefore, it is possible to reduce the amount of image data stored in the storage unit without deteriorating the image quality. This makes it possible to suppress the depletion of the free area of the storage unit while suppressing the deterioration of the recognition reproducibility of the image data. In addition, since the amount of image data output from the output unit to an external device or the like can be reduced, defect analysis is performed using the image data in the selected area while suppressing the exhaustion of the free memory area and the tact delay of the external device or the like. And products can be improved.

The following embodiments are preferred as embodiments of the techniques described herein.
A determination unit that determines whether or not the state of the component is normal based on the image of the component captured by the imaging unit, the storage unit stores the image of the selected area, and the output unit stores the image of the selected area. The output image area reduction mode and the average image of the plurality of images captured by the imaging unit when the determination unit determines that the image is normal are stored in the storage unit, and the output unit outputs the average image. It is provided with a mode switching unit that can switch between a mode for reducing the number of images to be displayed and a mode for switching between them.
In this way, in the image number reduction mode, the amount of image data stored in the storage unit can be reduced as compared with the configuration in which all of the plurality of images captured by the imaging unit are stored in the storage unit. It is possible to suppress the exhaustion of the free area of the storage unit. Also, if you want to use images other than the selected area for defect analysis or product improvement, you can switch from the image area reduction mode to the image number reduction mode based on the entire image including the area other than the selected area. This makes it possible to analyze defects and improve products.

In the image number reduction mode, a change image relating to an image in which the state of the component is changed with respect to the average image stored in the storage unit when the determination unit determines that the state of the component is not normal. Information is output from the output unit.
In this way, it becomes possible to perform defect analysis, product improvement, and the like based on the change image information.

The storage unit stores the area identification information for specifying the selected area, and the output unit outputs the area identification information.
In this way, not only the image of the selected area but also the area identification information is output from the output unit, so a reproduction test for defect analysis, product improvement, etc. is performed based on the image of the selected area and the area identification information. It becomes easy.

The storage unit stores additional information that can be used for a reproduction test related to component mounting.
In this way, the accuracy of the reproduction test can be improved by the additional information.

The component recognition device, the board transport section for transporting the board, and the mounting head are provided, and the output section is a component mounting device that outputs the image when the board is transported by the board transport section. ..
In this way, the component mounting device can output an image when the substrate has a low load, so that the tact delay can be suppressed.

According to the technique described in the present specification, it is possible to suppress the depletion of the free area of the storage unit while suppressing the deterioration of the recognition reproducibility due to the image data of the component imaged by the imaging unit.

Top view showing the component mounting apparatus of the first embodiment Enlarged front view of the component mounting device Block diagram showing the electrical configuration of the component mounting device The figure which shows the image which the image pickup unit has taken. The figure which shows the selection area specified from the image which the image pickup unit has taken. The figure explaining the average image of a plurality of images imaged by an image pickup unit. Flow chart showing processing of image data captured by the image pickup unit Flowchart showing area reduction processing Flowchart showing the number of sheets reduction process The figure which shows the selection area of the image in Embodiment 2. The figure which shows the selection area different from FIG.

1. Overall Configuration of Component Mounting Device The component mounting device 10 of the embodiment will be described with reference to FIGS. 1 to 9. In the following description, the long side direction of the base 11 (horizontal direction in FIG. 1) and the transport direction of the transport conveyor 13 are the X-axis directions, and the short side direction of the base 11 (vertical direction in FIG. 1) is the Y-axis direction. The height direction of the base 11 (vertical direction in FIG. 2) is the Z-axis direction.

The component mounting device 10 includes a base 11, a transfer conveyor 13 (an example of a “board transfer section”) for transporting a printed circuit board P (an example of a “board”) in a transfer direction (X-axis direction), and electronic components. It has a mounting device main body 20 having a mounting head 30 for sucking 50 (an example of a “component”) and mounting it on the printed circuit board P, and an imaging unit 41 for imaging the electronic component 50 sucked on the mounting head 30. It includes a component recognition device 40. The base 11 has a rectangular shape in a plan view and has a flat upper surface.

The conveyor 13 is provided on the base 11 and includes a pair of conveyor belts 14 that are circulated and driven in the transport direction, and the printed circuit board P is set so as to be erected on both conveyor belts 14. The printed circuit board P was carried from one side in the transport direction (right side in FIG. 1) to a working position on the base 11 (position of the alternate long and short dash line in FIG. 1) along the conveyor belt 14, and stopped at this working position. After the electronic component 50 is mounted in this state, it is carried out along the conveyor belt 14 to the other side (left side in FIG. 1). During automatic operation, the component mounting device 10 alternately alternates between a transport state in which the printed circuit board P is conveyed by the transfer conveyor 13 and a mounting state in which the electronic component 50 is mounted on the printed circuit board P at the work position. Will be done.

On both sides of the conveyor 13 (both upper and lower sides in FIG. 1), feeder type supply devices 16 are arranged at two locations arranged in the X-axis direction, for a total of four locations. A plurality of feeders 17 are arranged side by side and attached to the feeder type feeder 16. Each feeder 17 is a reel (not shown) on which an electronic component supply tape (not shown) containing a plurality of electronic components 50 is wound, and an electric sending device (not shown) that pulls out the electronic component supply tape from the reel. ) And the like, and the electronic components 50 are supplied one by one from the end located on the transfer conveyor 13 side.

The mounting device main body 20 is composed of a pair of support frames 21 provided above the base 11 and the feeder type supply device 16, a head unit 22, and a head unit drive mechanism for driving the head unit 22. Each support frame 21 is located on both sides of the base 11 in the X-axis direction and extends in the Y-axis direction. The support frame 21 is provided with an X-axis servo mechanism and a Y-axis servo mechanism that constitute a head unit drive mechanism. The X-axis servo mechanism and the Y-axis servo mechanism cause the head unit 22 to X within a certain movable region. It is movable in the axial direction and the Y-axis direction. The Y-axis servo mechanism is attached to each Y-axis guide rail 24Y extending in the Y-axis direction and installed on each support frame 21 and to each Y-axis guide rail 24Y extending in the Y-axis direction. It has a screwed Y-axis ball screw 25Y and a Y-axis servo motor 26Y attached to the Y-axis ball screw 25Y. A head support 28 fixed to a ball nut so as to extend in the X-axis direction is attached to each Y-axis guide rail 24Y. When the Y-axis servomotor 26Y is energized and controlled, the ball nut moves back and forth along the Y-axis ball screw 25Y, and as a result, the head support 28 fixed to the ball nut and the head unit 22 described below move on the Y-axis. It moves in the Y-axis direction along the guide rail 24Y.

The X-axis servo mechanism is attached to the X-axis guide rail 24X (see FIG. 2) installed on the head support 28 extending in the X-axis direction and the head support 28 extending in the X-axis direction, and is not shown. It has an X-axis ball screw 25X in which a ball nut is screwed, and a Y-axis servo motor 26Y attached to the X-axis ball screw 25X. A head unit 22 is movably attached to the X-axis guide rail 24X along the axial direction thereof. When the X-axis servomotor 26X is energized and controlled, the ball nut advances and retreats along the X-axis ball screw 25X, and as a result, the head unit 22 fixed to the ball nut moves in the X-axis direction along the X-axis guide rail 24X. Move to.

The head unit 22 takes out the electronic component 50 supplied on the base 11 from the feeder type supply device 16 and mounts it on the printed circuit board P. As shown in FIG. 2, a plurality of mounting heads 30 for mounting the electronic component 50 are mounted in a row on the head unit 22. Each mounting head 30 projects downward from the lower surface of the head unit 22, and a suction nozzle 32 for sucking the electronic component 50 by negative pressure is provided at the tip thereof. The head unit 22 has a built-in pressure sensor that detects a negative pressure state generated in the suction nozzle 32 by a negative pressure generator among various sensors 33 (see FIG. 3), and the suction nozzle 32 is an electronic component 50. Negative pressure is detected by the pressure sensor, and when the suction nozzle 32 does not suck the electronic component 50 at a predetermined position, air flows in from the suction nozzle 32 and the pressure sensor determines Since the negative pressure is not detected, the control unit 60 can detect the presence or absence of suction of the electronic component 50 and the air leak due to the deviation of the suction position of the electronic component 50 based on the difference in the detected negative pressure state.

Each mounting head 30 can be rotated around an axis by an R-axis servomotor 26R (see FIG. 3) or the like. Further, each mounting head 30 can be moved up and down with respect to the frame of the head unit 22 by driving a Z-axis servomotor 26Z (see FIG. 3) or the like. In the component mounting device 10, by driving these various servomotors, the suction position of the electronic component 50 supplied from the feeder type supply device 16 and the mounting position with respect to the printed circuit board P are controlled to be the optimum positions. It has become so.

2. Electrical configuration of component mounting device 10 The electrical configuration of the component mounting device 10 will be described with reference to FIG.
As shown in FIG. 3, the component mounting device 10 is entirely controlled and controlled by the control unit 60. The control unit 60 includes an arithmetic processing unit 61 composed of a CPU and the like. The arithmetic processing unit 61 is connected to the motor control unit 62, the storage unit 63, the determination unit 68, the image processing unit 69, and the input / output unit 55 in the control unit 60. Further, the arithmetic processing unit 61 is connected to the display unit 53 and the operation unit 54 (an example of the “mode switching unit”) outside the control unit 60, and the image processing unit 69 is connected to the image pickup unit 41 outside the control unit 60. It is connected to the. The input / output unit 55 is a so-called interface, and is connected to various sensors 33 and various actuators 34.

The imaging unit 41 is fixed on the base 11 at two locations (FIG. 1) near the mounting position by the head unit 22. As shown in FIG. 4, the imaging unit 41 captures an image of the imaging region 42 including the bottom surface side of the electronic component 50 with respect to the electronic component 50 taken out from the feeder type supply device 16 by the mounting head 30. The electronic component 50 has a main body 51 covered with a synthetic resin, and a plurality of lead terminals 52 protruding side by side from both side surfaces of the main body 51.

The display unit 53 is composed of a liquid crystal display device or the like having a display screen, and displays the state or the like of the component mounting device 10 on the display screen. The operation unit 54 is provided with an input device such as a touch panel, a keyboard, and a mouse, and an operator can operate the operation unit 54 to make various settings. In the present embodiment, by operating the operation unit 54, it is possible to switch between three (plurality) modes related to processing of the image captured by the image pickup unit 41. The three modes include a normal mode in which the amount of data of the image data 65 is not reduced, an image area reduction mode in which the amount of data is reduced by the area of the image, and a mode in which the amount of data is reduced by the number of images.

The normal mode is a mode set by default, and stores the entire image (FIG. 4) captured by the imaging unit 41 in the storage unit 63. In the image area reduction mode, as shown in FIG. 5A, the storage unit 63 cuts out the image data of a plurality of (two places) selected areas SA1 selected from the image pickup areas 42 imaged by the image pickup unit 41. It is stored in the input / output unit 55 (an example of the “output unit”) and output to the outside (FIG. 5 (B)).

In the image number reduction mode, a storage unit stores an average image obtained by synthesizing and averaging a plurality of images captured by the image pickup unit 41 and change image information in which the state of the electronic component 50 is changed with respect to the average image. 63 stores, and the input / output unit 55 outputs the average image and the changed image information. As shown in FIG. 6A, the averaging process on the average image is performed on the position (XY direction) of the electronic component 50 with respect to a plurality of (n) images captured by the imaging unit 41 each time the electronic component 50 is adsorbed. (Position), adsorption inclination state (angle with respect to the XY plane), etc., an average image (n times) with the average position and the average state is generated. Here, the "average position and average state" can be a state in which the center position and the suction inclination state of the electronic component 50 are aligned (aligned) based on the image recognition result. The average image can be overwritten when the same substrate is being produced in order to reduce the number of images, and as shown in FIG. 6B, a newly captured image is added to the average image. The averaging process (n + 1 averaging) may be performed. The electronic component 50, which is likely to cause a difference between lots, may generate an average image only in the same lot. In this way, the average image obtained by synthesizing and averaging a plurality of images can be stored as the state of the electronic component 50 at the normal time, so that a sudden appearance error such as uneven brightness of the lead terminal 52 can be stored. Is less likely to occur in average images.

The change image information is an image in which elements such as position, shape, size, and range are recognized to have changed by a predetermined value or more with respect to the average image. The change image information is not included in the average image. The changed image information may be newly captured image data, but is not limited to this, and may be, for example, information on the difference between the average image and the changed image information.

The motor control unit 62 drives the X-axis servomotor 26X, the Y-axis servomotor 26Y, the Z-axis servomotor 26Z, and the R-axis servomotor 26R of each head unit 22 according to the mounting program 64 described later. Further, the motor control unit 62 drives the conveyor 13 according to the mounting program 64.

The storage unit 63 is composed of a ROM (Read Only Memory) for storing a program or the like for controlling the CU, a RAM (Random Access Memory) for temporarily storing various data during the operation of the apparatus, and the like. The storage unit 63 stores the mounting program 64, the image data 65 (electronic component image), the board data 66, and various data 67 such as the current mode. As the file format of the image data and various information stored in the storage unit 63, various formats can be used, and for example, JPEG or a bitmap can be used.

The mounting program 64 includes board information regarding the number of printed circuit boards P to be mounted, information including the number and types of electronic components 50 mounted on the printed circuit board P, and mounting positions of the electronic components 50 on the printed circuit board P. Information on the suction position of the electronic component 50 by each suction nozzle 32 (suction position in the X-axis direction and the Y-axis direction, the rotation angle of the mounting head 30 around the axis according to the size and shape of the electronic component 50, etc.) Location information etc. are included.

The board data 66 includes area identification information for specifying a selection area SA1 selected from images captured by the image pickup unit 41 when the image area reduction mode is set, dimensions of the printed circuit board P, a reference position of the printed circuit board P, and printing. The production number of the substrate P and the like are included. The area identification information includes, for example, the dimensions of the mounted component, the allowable range of displacement of the component suction position to be considered at the time of recognition, the image size of the imaging area 42 (the image size before cutting the selected area SA1), and the selected area A1. Information such as the number and the shape of the selected area A1 can be included.

The determination unit 68 determines whether or not the image of the electronic component 50 captured by the imaging unit 41 is normal. Specifically, for example, from the image of the electronic component 50 taken by the imaging unit 41, whether or not the adsorbed electronic component 50 is an abnormal product (a product having a shape abnormality such as a different component or a lead bend), and If the electronic component 50 is not an abnormal product, it is detected whether or not it is in a suction state in which mounting misalignment does not occur, and if the electronic component 50 is not an abnormal product and is in a suction state in which mounting misalignment does not occur. , The state of the electronic component 50 is determined to be "normal", and the image of the electronic component 50 is recognized. On the other hand, when the electronic component 50 corresponds to at least one of an abnormal product and an adsorption state in which mounting misalignment may occur, the image of the electronic component 50 cannot be recognized and is judged to be "defective". The mounting misalignment of the electronic component 50 is, for example, a case where the electronic component 50 is mounted at an angle because it is sucked at a position deviated from the center of the nozzle. For example, the amount of deviation between the central axis of the suction nozzle 32 and the central axis of the electronic component 50 is compared with the threshold value stored in the storage unit 63, and when the detected amount of deviation of the central axis is smaller than the threshold value, the mounting deviation is achieved. It is possible to set the adsorption state in which the mounting deviation occurs when the deviation amount of the central axis is larger than the threshold value.

The image data of the image captured by the image pickup unit 41 is taken into the image processing unit 69. The image processing unit 69 performs processing such as cropping and averaging of images based on the captured image data and the current mode stored in the storage unit 63.

The input / output unit 55 is connected to various sensors 33, various actuators 34, and a device 35 provided on the mounting device main body 20 outside the control unit 60. The detection signals output from the various sensors 33 are input to the input / output unit 55, and the operations on the various actuators 34 provided in the mounting device main body 20 are performed based on the control signals output from the arithmetic processing unit 61. It is configured to provide control. The device 35 is an internal or external device of the component mounting device 10, and allows the user to investigate the cause of mounting defects and perform a reproduction test. For example, a device for a reproduction test, a PC (Personal computer), or the like. can do.

3. 3. Processing of the control unit 60 As shown in FIG. 7, when the control unit 60 of the component mounting device 10 detects that the electronic component 50 is attracted by the signal from the sensors 33 (“YES” in S1), the image is taken. The image of the electronic component 50 is imaged by the unit 41, and the image processing unit 69 stores the image data 65 of the image captured by the image pickup unit 41 in the storage unit 63 (S2). Next, the control unit 60 performs a process of recognizing the image of the electronic component 50 captured by the imaging unit 41 (S3), and determines whether or not the recognition of the electronic component 50 is successful (S4). If the image recognition of the electronic component 50 is successful, the selection area SA1 used in the area reduction mode can be set, and if the image recognition of the electronic component 50 fails, the selection area SA1 can be set. Therefore, for example, the entire image can be set as the selection area, or the area corrected to the range in which the image can be recognized can be set as the selection area. The selection method and the correction method of the selection area when the image recognition fails can be stored in the storage unit 63 in advance, for example.

Since the state of the electronic component 50 is normal, the control unit 60 determines which mode is set by the operation unit 54 when the recognition of the electronic component 50 is successful (“YES” in S4) (S5, S7). ). When the current mode is the normal mode (“NO” in S5, “NO” in S7), the entire image data 65 of the imaging region 42 imaged by the imaging unit 41 is stored in the storage unit 63 (S9). .. On the other hand, when the current mode is set to the area reduction mode (“YES” in S5), the area reduction process is performed (S6), and when the current mode is set to the number reduction mode (“YES”). “NO” in S5, “YES” in S7), and the number of sheets reduction process is performed (S8).

On the other hand, when the state of the electronic component 50 is not normal and the image recognition fails (“NO” in S4), the control unit 60 determines which mode is set by the operation unit 54 (S10, S11). ). When the current mode is the normal mode (“NO” in S10, “NO” in S11), the entire image data 65 of the imaging area 42 imaged by the imaging unit 41 is stored in the storage unit 63 (S9). If the current mode is set to the area reduction mode (“YES” in S10), the area reduction process is performed (S13). When the current mode is set to the number reduction mode (“NO” in S10, “YES” in S11), the control unit 60 changes the average image stored in the storage unit 63. The change image information at that time is stored in the storage unit 63 (S12). The average image and the change image stored in the storage unit 63 may be displayed on the display unit 53 of the component mounting device 10.

In the area reduction processing of S6 and S13, as shown in FIG. 8, the control unit 60 reads out the area identification information stored in the storage unit 63 (S21). The image processing unit 69 cuts out an image of the selected area SA1 in which a specific area in which an abnormality can be easily recognized is selected from the images of the imaging area 42 including the bottom surface (one surface) of the electronic component 50 based on the area specifying information. S22), it is stored in the storage unit 63 (S23). The specific selection area SA1 in which an abnormality can be easily recognized can be, for example, a mounting reference position of a component such as a lead terminal 52 or a selected area of a feature portion of the component. It is a plurality of regions including the lead terminal 52 of the above. By cutting out the image of the selected area SA1, the area (size) of the image stored in the storage unit 63 is reduced.

In the number-of-sheet reduction processing, as shown in FIG. 9, the image processing unit 69 of the control unit 60 averaged the position, inclination, size, etc. of the electronic component 50 with respect to the plurality of images captured by the image pickup unit 41. An average image is generated (S31), and the average image is stored in the storage unit 63 (S32).

As shown in FIG. 7, the control unit 60 detects that the electronic component 50 is not adsorbed (“NO” in S1), and when the processes of S6, S8, S9, S12, and S13 are completed. In S14, it is detected whether or not the printed circuit board P is being conveyed by the transfer conveyor 13. When the printed circuit board P is not transported (“NO” in S14), the load on the component mounting device 10 is heavy because the electronic component 50 is being mounted, so the image data and the area identification information are output. Instead, it is determined whether or not the electronic component 50 is attracted (S1). On the other hand, when the printed circuit board P is being conveyed (“YES” in S14), the image data (and area identification information) stored in the storage unit 63 is output to the external device 35 or the like (S15). .. With the external device 35 or the like, a reproduction test can be performed based on the image data (and area identification information), and defect analysis, product improvement, and the like can be performed.

4. The operation and effect of the present embodiment The component recognition device 40 is a component recognition device 40 that recognizes an electronic component 50 attracted to a mounting head 30, and is an imaging unit 41 that captures an image of the electronic component 50 and an imaging unit. It includes a storage unit 63 that stores an image of the selected area SA1 selected from the images captured by 41, and an input / output unit 55 (output unit) that outputs an image of the selected area SA1.
According to the present embodiment, the image of the selection region SA1 selected from the images captured by the imaging unit 41 is stored in the storage unit 63, so that the entire image captured is stored in the storage unit 63. Compared with the configuration, the amount of image data 65 stored in the storage unit 63 can be reduced without degrading the image quality. This makes it possible to suppress the depletion of the free area of the storage unit 63 while suppressing the deterioration of the recognition reproducibility of the image data. Further, since the amount of the image data 65 output from the input / output unit 55 to the external device or the like can be reduced, the image data 65 in the selected area is used while suppressing the exhaustion of the free memory area and the tact delay of the external device or the like. This makes it possible to analyze defects (find the cause of poor adsorption, poor mounting, etc.) and improve the product.

A determination unit 68 that determines whether or not the state of the electronic component 50 is normal based on the image of the electronic component 50 imaged by the imaging unit 41, and an operation unit that can switch between a plurality of different modes of processing the image captured by the imaging unit 41. 54 (mode switching unit) is provided, and the plurality of modes include an image area reduction mode in which the storage unit 63 stores the image of the selection area SA1 and the input / output unit 55 outputs the image of the selection area SA1 and a determination unit. It has a mode for reducing the number of images, in which the storage unit 63 stores an average image for a plurality of images captured by the image pickup unit 41 when 68 is determined to be normal, and the input / output unit 55 outputs the average image.
In this way, in the image number reduction mode, the amount of image data 65 stored in the storage unit 63 is compared with the configuration in which all of the plurality of images captured by the image pickup unit 41 are stored in the storage unit 63. It can be made smaller, and it becomes possible to suppress the exhaustion of the free area of the storage unit 63. Further, if it is desired to use an image other than the selected area SA1 in the image area reduction mode for suction inspection of the electronic component 50 or investigation of the cause such as mounting failure, the area other than the selected area SA1 can be obtained by switching to the image number reduction mode. It is possible to perform defect analysis and product improvement based on the entire image including.

In the image number reduction mode, a change image relating to an image in which the state of the electronic component 50 is changed with respect to the average image stored in the storage unit 63 when the determination unit 68 determines that the state of the electronic component 50 is not normal. Information is output from the input / output unit 55.
In this way, it is possible to analyze defects and improve the product based on not only the average image but also the changed image information.

The storage unit 63 stores the area identification information for specifying the selected area SA1, and the input / output unit 55 outputs the area identification information.
In this way, not only the image of the selected area SA1 but also the area specifying information is output from the input / output unit 55. Therefore, for defect analysis, product improvement, etc. based on the image of the selected area SA1 and the area specifying information. It becomes easy to perform a reproduction test.

The component mounting device 10 includes a component recognition device 40, a transfer conveyor 13 (board transfer unit) that conveys the printed circuit board P, and a mounting head 30, and the input / output unit 55 is the printed circuit board P by the transfer conveyor 13. The image is output at the time of transportation.
In this way, the component mounting device 10 can output an image when the printed circuit board P, which has a low load, is conveyed, so that the tact delay can be suppressed.

<Embodiment 2>
Next, the second embodiment will be described with reference to FIGS. 10 and 11. In the second embodiment, in the image area reduction mode, the positions of the selected areas SA2 and SA3 and the method of specifying the selected areas SA2 and SA3 are different. Hereinafter, the same configurations as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIG. 10, the electronic component 70 includes a flat rectangular main body 71 packaged with a synthetic resin, and a lead terminal 72 protruding outward from the entire circumference of the main body 71. Area-specific information is stored in advance in the storage unit 63. When the area identification information is the selection area SA2 between the predetermined dimension inside B1 of the outer edge of the main body 71 of the electronic component 70 arranged at the regular position and the predetermined dimension outside B2 of the lead terminal 72, this selection area is used. It is used as information that identifies SA2. The selection region SA2 is specified based on lead information such as the position of the electronic component 70 with respect to the imaging region 42, the range and width of the lead terminals, the pitch, and the number of leads. By setting the selection area SA2 wider, it is possible to recognize the mounting position of the lead terminal 72 or the like or the electronic component 70 even when the component suction position is slightly displaced.

Further, the area identification information as described above may not be stored in the storage unit 63 in advance. Specifically, the selection region SA3 is specified by optimizing the region of the image to be cut out from the image captured by the imaging unit 41 based on the position of the lead terminal 72 or the like recognized from the image captured by the imaging unit 41. You may do so. Specifically, as shown in FIG. 11, when the imaging unit 41 captures an image of the electronic component 70, the control unit 60 obtains both end positions T1 in the arrangement direction of the plurality of row-shaped lead terminals 72, and the control unit 60 obtains the positions T1 at both ends in the arrangement direction. The circumscribing rectangle C2 at both end positions T1 is obtained. Then, in order to make the selection region SA3 a size having a margin with respect to the electronic component 70, in the present embodiment, the lead terminal 72 has a predetermined dimension inside C1 and the lead terminal 72 has a predetermined dimension outside C3 with respect to the tangent rectangle C2. The area between them is the selection area SA3. The predetermined dimensions for the lead terminal 72 can be set according to the length, width, and the like of the lead terminal 72. Then, the control unit 60 stores the image of the selection areas SA2 and SA3 and the area identification information for specifying the selection areas SA2 and SA3 in the storage unit 63, and outputs the image from the input / output unit 55.

According to the second embodiment, since the selection areas SA2 and SA3 can be set in an appropriate range, the accuracy of the reproduction test or the like for defect analysis or the like can be improved.

<Embodiment 3>
Next, the third embodiment will be described. In the third embodiment, additional information is output from the input / output unit 55 (output unit) together with the area identification information in the image area reduction mode.
The board data 66 stored in the storage unit 63 includes additional information in addition to the area identification information. The additional information includes component recognition data, recognition error information, recognition result information such as recognition processing progress status, and equipment information. The component recognition data includes, for example, a component type (component type) in an electronic component 50 having a different recognition method, an external dimension of the electronic component 50, lead information (number, dimensions, pitch), a threshold value as a reference for recognition, and the like. Includes tolerances allowed for recognition, component recognition algorithms, etc.

The recognition error information includes, for example, recognition result (pass / fail), center of electronic component 50, inclination, and information (number, dimensions, pitch) of lead terminals 52 and 72. The recognition result information such as the recognition processing progress status includes, for example, the corner position of the electronic component 50, the tip position, width, and brightness of the lead terminals 52 and 72 on the image coordinates. Equipment information includes, for example, application version, imaging camera information (type, scale), irradiation conditions (irradiation type, irradiation level, etc.).
According to the third embodiment, the accuracy of the reproduction test can be improved by the substrate data 66.

<Other embodiments>
The techniques described herein are not limited to the embodiments described above and in the drawings, and for example, the following embodiments are also included in the technical scope of the techniques described herein.

(1) In the above embodiment, the three modes can be switched, but the present invention is not limited to this. For example, it may be possible to switch between two modes that do not have a normal mode or a number reduction mode. Further, the configuration may not include a plurality of modes. For example, the area reduction process may always be executed at the time of imaging by the imaging unit 41.

10: Parts mounting device 13: Conveyor conveyor (board transfer unit)
14: Conveyor belt 20: Mounting device main body 30: Mounting head 32: Suction nozzle 33: Sensors 34: Actuators 35: Equipment 40: Parts recognition device 41: Imaging units 50, 70: Electronic parts (parts)
51, 71: Main body 52, 72: Lead terminal 53: Display unit 54: Operation unit (mode switching unit)
55: Input / output unit 60: Control unit 63: Storage unit 65: Image data 66: Board data 68: Judgment unit 69: Image processing unit P: Printed circuit board (board)
SA1, SA2, SA3: Selected area

Claims (5)

A component recognition device that recognizes components adsorbed on the mounting head.
An imaging unit that captures an image of the component,
A storage unit that stores an image of a selected area selected from the images captured by the imaging unit, and a storage unit.
An output unit that outputs an image of the selected area and
A determination unit that determines whether or not the state of the component is normal based on the image of the component captured by the imaging unit.
The image area reduction mode in which the storage unit stores the image of the selected area and the output unit outputs the image of the selected area, and the image pickup unit imaged when the determination unit determines that the image is normal. A component recognition device including a mode switching unit capable of storing an average image of a plurality of images in the storage unit and switching between an image number reduction mode in which the output unit outputs the average image. In the image number reduction mode, a change image relating to an image in which the state of the component is changed with respect to the average image stored in the storage unit when the determination unit determines that the state of the component is not normal. The component recognition device according to claim 1 , wherein information is output from the output unit. The storage unit stores area identification information for specifying the selected area.
The component recognition device according to claim 1 or 2 , wherein the output unit outputs the area identification information. The component recognition device according to claim 3 , wherein additional information that can be used for a reproduction test related to component mounting is stored in the storage unit. The component recognition device according to any one of claims 1 to 4.
A board transporting unit for transporting a board and a mounting head are provided.
The output unit is a component mounting device that outputs the image when the substrate is transported by the board transport unit.

Images