JP6935913B2 - Electronic components, servers - Google Patents

Description

The present invention relates to electronic components and servers.

Patent Document 1 discloses a configuration including a substrate and components mounted on the substrate.
As described above, in the electronic component including the substrate and the component mounted on the substrate, the component is mounted on both sides of the substrate in order to increase the number of components mounted on the substrate.

Japanese Unexamined Patent Publication No. 2010-153695

By the way, when inserting or removing a component such as a memory from a substrate, it is usual to arrange the substrate with the surface on the side on which the component to be inserted or removed is mounted facing upward. When inserting a component into a socket provided on the upper surface side of the board, the reaction force of the force (load) for inserting the component into the socket is input to the lower surface side of the board from a support surface such as a work table that supports the board. Will be done. Then, when the component is mounted on the lower surface side of the board, the component itself mounted on the lower surface side of the board or the joint portion between the component and the board may be damaged.

The present invention has been made in view of the above-mentioned problems, and when a component is mounted on a substrate, it is possible to suppress a load from being applied to other components mounted on the substrate and suppress damage to the component or the like. Provides electronic components and servers.

According to the first aspect of the present invention, the electronic component includes a first component that can be inserted and removed from the first surface of the substrate, and a second component that is provided on the second surface of the substrate. A support member provided on the second surface of the substrate is provided to relieve a force due to insertion and removal of the first component with respect to the first surface of the substrate.

According to the second aspect of the present invention, the server includes the above-mentioned electronic components and a housing in which the electronic components are housed.

In the electronic component and server of the present invention, when a component is mounted on a substrate, it is possible to suppress a load from being applied to other components mounted on the board and to suppress damage to the component or the like.

It is a figure which shows the minimum structure of the electronic component of this invention. It is a figure which shows the minimum structure of the server of this invention. It is a perspective view which shows the electronic component by this embodiment. It is a perspective development view which shows the component structure of the electronic component by this Embodiment. It is sectional drawing along the longitudinal direction of the substrate of the electronic component by this embodiment. It is sectional drawing of the electronic component by this embodiment along the lateral side of the substrate. FIG. 5 is a cross-sectional view showing a state in which the first component provided on the first surface side of the substrate is inserted and removed in the electronic component according to the present embodiment. FIG. 5 is a cross-sectional view showing a state in which the first component provided on the first surface side of the substrate is inserted and removed in the electronic component according to the present embodiment. It is a perspective view which shows the schematic structure of the server by this embodiment.

A plurality of embodiments of the present invention will be described below with reference to the drawings. However, with respect to the same parts as those of the above-mentioned one conventional example regarding the present embodiment, the same names are used and detailed description thereof will be omitted.

[First Embodiment]
FIG. 1 is a diagram showing a minimum configuration of electronic components according to the present embodiment.
As shown in this figure, the electronic component 1 may include at least a substrate 2, a first component 3, a second component 4, and a support member 5.
The substrate 2 has a first surface 2a and a second surface 2b.
The first component 3 is provided so as to be removable on the first surface 2a of the substrate 2. The second component 4 is provided on the second surface 2b of the substrate 2.
The support member 5 is provided on the second surface 2b of the substrate 2 and relaxes the force due to the insertion and removal of the first component 3 with respect to the first surface 2a of the substrate 2.

When the first component 3 is inserted and removed from the first surface 2a of the substrate 2, the electronic component 1 brings the support member 5 into contact with the support surface F of a work table or the like. As a result, when a force (load) P is applied to mount the first component 3 on the first surface 2a of the substrate 2, the support member 5 receives the reaction force input from the support surface F. Can be done. As a result, the reaction force is suppressed by the second component 4 mounted on the second surface 2b of the substrate 2. As a result, the stress acting on the second component 4 and the joint between the second component 4 and the substrate 2 can be relaxed. Therefore, when the first component 3 (component) is mounted on the board 2, the load is suppressed on the second component 4 (other components) mounted on the board 2, and the second component 4 and the board 2 are suppressed. It is possible to suppress damage to parts such as.

[Second Embodiment]
FIG. 2 is a diagram showing a minimum configuration of a server according to the present embodiment.
As shown in this figure, the server 8 may include at least an electronic component 1 and a housing 9 in which the electronic component 1 is housed.

The electronic component 1 has the same configuration as that of the first embodiment, and includes a substrate 2, a first component 3, a second component 4, and a support member 5.
The substrate 2 has a first surface 2a and a second surface 2b. The first component 3 is provided so as to be removable on the first surface 2a of the substrate 2. The second component 4 is provided on the second surface 2b of the substrate 2. The support member 5 is provided on the second surface 2b of the substrate 2 and relaxes the force P due to the insertion and removal of the first component 3 with respect to the first surface 2a of the substrate 2.

When the first component 3 (component) of the electronic component 1 is mounted on the substrate 2, the server 8 suppresses the load on the second component 4 (other components) mounted on the substrate 2 and suppresses the load. It is possible to suppress damage to components such as component 4 and substrate 2 of 2.

[Third Embodiment]
FIG. 3 is a perspective view showing an electronic component according to the present embodiment. FIG. 4 is a perspective development view showing a component configuration of an electronic component according to the present embodiment. FIG. 5 is a cross-sectional view of the electronic component according to the present embodiment along the longitudinal direction of the substrate. FIG. 6 is a cross-sectional view of the electronic component according to the present embodiment along the lateral direction of the substrate.
As shown in these figures, the electronic component 10 of the present embodiment includes a substrate 20, a memory 21A, a memory 21B, a CPU 23, a first main cover 51, a first memory cover 52, and a second main cover. It includes 55 and a second memory cover 56. In the present embodiment, the first component is the memory 21A, but it may be a component other than the memory 21A. The second component is the memory 21B or the CPU 23, but may be a component other than the above. The second support member is the first memory cover 52, but a member other than the above may be used as the second support member. Similarly, the support member is the second memory cover 56, but a member other than the above may be used as the support member.

The substrate 20 has a substantially rectangular plate shape, has a first surface 20a (first surface) on one side, and a second surface 20b (second surface) on the side opposite to the first surface 20a. have.

The memory 21A is provided on the first surface 20a of the substrate 20. The memory 21A can be inserted and removed from the socket 22A provided on the first surface 20a of the substrate 20 in a direction orthogonal to the first surface 20a of the substrate 20. The sockets 22A are arranged at both ends of the substantially rectangular substrate 20 in the lateral direction D1. A plurality of memory 21A are mounted on each of the sockets 22A at both ends of the D1 in the lateral direction of the substrate 20.

The memory 21B and the CPU (Central Processing Unit) 23 are provided on the second surface 20b of the substrate 20.
The memory 21B is inserted and removed from the socket 22B provided on the second surface 20b of the substrate 20 in a direction orthogonal to the second surface 20b of the substrate 20. The sockets 22B are arranged at both ends of the board 20 in the lateral direction D1 at the center of the substantially rectangular board 20 in the longitudinal direction D2. A plurality of memory 21Bs are mounted on the sockets 22B at both ends of the D1 in the lateral direction of the substrate 20.
The CPU 23 is arranged at the center of the substrate 20 in the longitudinal direction D2 and the lateral direction D1. The CPU 23 includes a heat sink (not shown) on the opposite side of the substrate 20.

The first main cover 51 and the first memory cover 52 are provided on the first surface 20a side of the substrate 20.

The first main cover 51 is fixed to the first surface 20a of the substrate 20 via screws or the like (not shown). The first main cover 51 has openings 51h for exposing the socket 22A at both ends of the substrate 20 in the lateral direction D1. The memory 21A can be inserted and removed from the socket 22A exposed inside the opening 51h while the first main cover 51 is still attached to the first surface 20a of the substrate 20.
The first main cover 51 has a flat plate portion 51f (second support member) parallel to the substrate 20 at the center of the substrate 20 in the lateral direction D1 and the longitudinal direction D2.
Further, the first main cover 51 has a side wall portion 53A (second support) that rises outside the openings (not shown) at both ends of the D1 in the lateral direction of the substrate 20 in a direction away from the first surface 20a of the substrate 20. It has a member) integrally. The side wall portion 53A is continuously formed over a certain length along the longitudinal direction D2 of the substrate 20.
Such a first main cover 51 can be formed by, for example, pressing a metal plate.

The first memory cover 52 is detachably provided in each opening 51h of the first main cover 51. The first memory cover 52 is arranged in parallel with the pair of side plate portions 52a, 52a provided at intervals in the lateral direction D1 of the substrate 20, and straddles the pair of side plate portions 52a, 52a. It has a top plate portion 52b provided on the substrate 20 and an opening 52c on the substrate 20 side. The first memory cover 52 accommodates a plurality of memories 21A mounted in the socket 22A inside the opening 52c. The first memory cover 52 has ventilation openings 52d and 52d at both ends of the substrate 20 in the longitudinal direction D2. As a result, the first memory cover 52 has a duct shape in which cooling air flows along the longitudinal direction D2 of the substrate 20.
The first memory cover 52 is made of resin, for example, and is formed by engaging a locking claw (not shown) formed in the side plate portion 52a with an engaging recess (not shown) formed in the first main cover 51. It is detachably attached to the first main cover 51.

The flat plate portion 51f of the first main cover 51, the top plate portion 52b of the first memory cover 52, and the side wall portion 53A formed on the first main cover 51 have dimensions protruding from the first surface 20a of the substrate 20. (Height) is set to the same dimension. Further, the top plate portion 52b of the first memory cover 52 and the first main cover 51 has a protrusion dimension larger than that of the memory 21A from the first surface 20a of the substrate 20.

The second main cover 55 and the second memory cover 56 are provided on the second surface 20b side of the substrate 20.

The second main cover 55 is fixed to the second surface 20b of the substrate 20 via screws or the like (not shown). The second main cover 55 has openings 55h for exposing the socket 22B at both ends of the substrate 20 in the lateral direction D1. The memory 21B can be inserted and removed from the socket 22B exposed inside the opening 55h while the second main cover 55 is still attached to the second surface 20b of the substrate 20.
The second main cover 55 has a flat plate portion 55f (support member) parallel to the substrate 20 so as to cover the CPU 23 at the central portion of the substrate 20 in the lateral direction D1 and the longitudinal direction D2.
Further, the second main cover 55 is a side wall portion 53B (external support member) that rises outside the openings (not shown) at both ends of the D1 in the lateral direction of the substrate 20 in a direction away from the second surface 20b of the substrate 20. Is integrally possessed. The side wall portion 53B is continuously formed over a certain length along the longitudinal direction D2 of the substrate 20.
Such a second main cover 55 can be formed by, for example, pressing a metal plate.

The second memory cover 56 is detachably provided in each opening 55h of the second main cover 55. The second memory cover 56 is arranged at a position facing the memory 21A with the substrate 20 interposed therebetween. The second memory cover 56 is arranged in parallel with the pair of side plate portions 56a, 56a provided at intervals in the lateral direction D1 of the substrate 20, and straddles the pair of side plate portions 56a, 56a. It has a top plate portion 56b provided on the substrate 20 and an opening 56c on the substrate 20 side. The second memory cover 56 accommodates a plurality of memories 21B mounted in the socket 22B inside the opening 56c. The second memory cover 56 has ventilation openings 56d and 56d at both ends of the substrate 20 in the longitudinal direction D2. As a result, the second memory cover 56 has a duct shape in which cooling air flows along the longitudinal direction D2 of the substrate 20.
The second memory cover 56 is made of resin, for example, and the second main is formed by engaging the locking claw 56t formed on the side plate portion 56a with the engaging recess (not shown) formed on the second main cover 55. It is detachably attached to the cover 55. The second memory cover 56 can be composed of the same parts as the first memory cover 52.

The flat plate portion 55f of the second main cover 55, the top plate portion 56b of the second memory cover 56, and the side wall portion 53B formed on the second main cover 55 have dimensions protruding from the second surface 20b of the substrate 20. (Height) is set to the same dimension. Further, the flat plate portion 55f of the second memory cover 56 and the second main cover 55 has a larger protrusion dimension from the second surface 20b of the substrate 20 than the memory 21B.

The second main cover 55 has a front flat plate portion 55g and a rear flat plate portion 55r on both sides of the substrate 20 in the longitudinal direction D2 with respect to the flat plate portion 55f. The front flat plate portion 55g and the rear flat plate portion 55r are set to have a smaller distance from the second surface 20b of the substrate 20 than the flat plate portion 55f. The second main cover 55 is a first cooling air introduction port that opens in the longitudinal direction D2 of the substrate 20 between the front flat plate portion 55g and the first end 20f of the second surface 20b of the substrate 20 in the longitudinal direction D2. Has 61. Between the front flat plate portion 55g of the second main cover 55 and the second surface 20b of the substrate 20, the cooling air W1 is continuously sent from the first cooling air introduction port 61 along the longitudinal direction D2 to the CPU 23. The leading air passage 62 is formed.
The first air passage 62 includes a first guide blade 65 that narrows the flow path width of the first air passage 62 from the first cooling air introduction port 61 side toward the CPU 23 side. The first guide blade 65 narrows the flow path width of the first air guide 62 from the first cooling air introduction port 61 side toward the CPU 23 side. As a result, the flow velocity of the cooling air W1 guided to the CPU 23 is increased, and the cooling efficiency of the CPU 23 is increased.

Further, in the flat plate portion 55f of the second main cover 55, an opening is made in the longitudinal direction D2 of the substrate 20 between the end portion 55a of the flat plate portion 55f on the first end 20f side of the substrate 20 and the front flat plate portion 55g. The second cooling air introduction port 63 is formed. Between the flat plate portion 55f of the second main cover 55 and the second surface 20b of the substrate 20, the cooling air W2 introduced from the second cooling air introduction port 63 and the cooling air passing through the first head guide 62 A second air duct 64 through which W1 flows is formed.
A second guide blade 66 is provided on the flat plate portion 55f on the side facing the front flat plate portion 55g. The second guide blade 66 is inclined so as to gradually approach the front flat plate portion 55 g as it approaches the CPU 23 along the longitudinal direction D2 of the substrate 20. The second guide blade 66 guides the cooling air W2 introduced from the second cooling air introduction port 63 toward the CPU 23.

FIG. 7 is a cross-sectional view showing a state in which the first component provided on the first surface side of the substrate is inserted and removed in the electronic component according to the present embodiment.
As shown in this figure, in the electronic component 10 as described above, for example, when the memory 21A is inserted into and removed from the socket 22A on the first surface 20a side of the substrate 20, the first surface 20a of the substrate 20 is directed upward. In this state, it is placed on the support surface F of a work table or the like. In this state, the first memory cover 52 is removed, and the memory 21A is inserted and removed.
At this time, the flat plate portion 55f of the second main cover 55 provided on the second surface 20b of the substrate 20, the second memory cover 56, and the side wall portion 53B of the second main cover 55 abut against the support surface F. In other words, the flat plate portion 55f of the second main cover 55, the second memory cover 56, and the side wall portion 53B of the second main cover 55 are support surfaces that support the substrate 20 from below when the memory 21A is inserted and removed. It is in contact with F. As a result, the flat plate portion 55f of the second main cover 55, the second memory cover 56, and the side wall portion 53B of the second main cover 55 are provided with respect to the memory 21B and the CPU 23 provided on the second surface 20b of the substrate 20. , The reaction force input from the support surface F that supports the substrate 20 from below is suppressed. That is, the flat plate portion 55f of the second main cover 55, the second memory cover 56, and the side wall portion 53B provided on the second main cover 55 have a force P due to the insertion and removal of the memory 21A with respect to the first surface 20a of the substrate 20. To alleviate. Here, the second main cover 55 is made of metal, and the contact area of the flat plate portion 55f with the support surface F is larger than that of the second memory cover 56 and the side wall portion 53B. Therefore, the second main cover 55 mainly receives the reaction force input from the support surface F, and suppresses the reaction force from reaching the memory 21B and the CPU 23.

FIG. 8 is a cross-sectional view showing a state in which the first component provided on the first surface side of the substrate is inserted and removed in the electronic component according to the present embodiment.
As shown in this figure, for example, when the memory 21B is inserted into and removed from the socket 22B on the second surface 20b side of the substrate 20, the electronic component 10 has the second surface 20b of the substrate 20 facing upward. Place it on the support surface F of a work table or the like. In this state, the second memory cover 56 is removed, and the memory 21B is inserted and removed.
At this time, the flat plate portion 51f of the first main cover 51 provided on the first surface 20a of the substrate 20, the first memory cover 52, and the side wall portion 53A of the first main cover 51 abut against the support surface F. In other words, the flat plate portion 51f of the first main cover 51, the first memory cover 52, and the side wall portion 53A of the first main cover 51 are support surfaces that support the substrate 20 from below when the memory 21B is inserted and removed. It is in contact with F. As a result, the flat plate portion 51f of the first main cover 51, the first memory cover 52, and the side wall portion 53A of the first main cover 51 are subjected to the substrate with respect to the memory 21A provided on the first surface 20a of the substrate 20. The reaction force input from the support surface F that supports 20 from below is suppressed. That is, the flat plate portion 51f of the first main cover 51, the first memory cover 52, and the side wall portion 53A provided on the first main cover 51 have a force P due to the insertion and removal of the memory 21B with respect to the second surface 20b of the substrate 20. To alleviate. Here, the first main cover 51 is made of metal, and the contact area of the flat plate portion 51f with the support surface F is larger than that of the first memory cover 52 and the side wall portion 53A. Therefore, the first main cover 51 mainly receives the reaction force input from the support surface F, and suppresses the reaction force from reaching the memory 21A.

FIG. 9 is a perspective view showing a schematic configuration of a server according to the present embodiment.
As shown in this figure, the server 90 includes an electronic component 10 as described above, and a housing 80 that houses the electronic component 10 and other modules 81 and the like.

In such an electronic component 10, a memory 21A provided on the first surface 20a of the substrate 20 so as to be removable, a memory 21B provided on the second surface 20b of the substrate 20, and a second surface 20b of the substrate 20 are provided. The second memory cover 56 and the flat plate portion 55f of the second main cover 55 are provided to relax the force P due to the insertion and removal of the memory 21A with respect to the first surface 20a of the substrate 20.
As a result, the reaction force input from the support surface F when the force (load) P is applied to mount the memory 21A on the first surface 20a of the substrate 20 is applied to the second memory cover 56 and the second main cover 55. It can be received by the flat plate portion 55f of. Therefore, the reaction force is suppressed by the memory 21B and the CPU 23 mounted on the second surface 20b of the substrate 20, and the stress acting on the memory 21B and the CPU 23 itself and the joint portion between the memory 21B and the CPU 23 and the substrate 20 is relaxed. can do.

In such an electronic component 10, the flat plate portion 55f of the second memory cover 56 and the second main cover 55 is in contact with the support surface F that supports the substrate 20 from below when the memory 21A is mounted. In this way, when the flat plate portion 55f of the second memory cover 56 and the second main cover 55 abuts on the support surface F, a force P is applied to mount the memory 21A on the first surface 20a of the substrate 20. The reaction force input from the support surface F can be received by the flat plate portion 55f of the second memory cover 56 and the second main cover 55.

In such an electronic component 10, the memory 21A is inserted and removed with the first surface 20a of the substrate 20 facing upward. As a result, when inserting and removing the memory 21A, the flat plate portion 55f of the second memory cover 56 and the second main cover 55 can be brought into contact with the support surface F that supports the substrate 20 from below.

In such an electronic component 10, the flat plate portion 55f of the second memory cover 56 and the second main cover 55 has a larger protrusion dimension from the second surface 20b of the substrate 20 than the memory 21B. As a result, the memory 21B can be prevented from coming into contact with the support surface F, and the reaction force can be reliably received by the flat plate portion 55f of the second memory cover 56 and the second main cover 55.

In such an electronic component 10, the second memory cover 56 is arranged at a position facing the memory 21A with the substrate 20 interposed therebetween. As a result, the force P when the memory 21A is mounted on the substrate 20 can be reliably supported by the second memory cover 56.

In such an electronic component 10, the memory 21B is arranged at a position facing the memory 21A with the substrate 20 interposed therebetween, and the second memory cover 56 is provided so as to cover the memory 21B. As a result, the force P when the memory 21A is mounted on the substrate 20 can be reliably supported by the second memory cover 56.

In such an electronic component 10, the second memory cover 56 is detachably provided with respect to the substrate 20. As a result, the memory 21B covered by the second memory cover 56 can be easily inserted and removed.

In such an electronic component 10, a plurality of second memory covers 56 are provided at intervals in the lateral direction D1 along the second surface 20b of the substrate 20. By providing a plurality of second memory covers 56 at intervals in this way, the substrate 20 can be stably supported.

In such an electronic component 10, the flat plate portion 55f of the second main cover 55 is provided at the center of the second surface 20b of the substrate 20. As a result, the flat plate portion 55f of the second main cover 55 can also support the force P when the memory 21A is mounted on the substrate 20.

In such an electronic component 10, the first memory cover 52, which is provided on the first surface 20a of the substrate 20 and comes into contact with the support surface F when the memory 21B is mounted on the second surface 20b of the substrate 20, A flat plate portion 51f and a side wall portion 53A of the main cover 51 are further provided.
As a result, the reaction force input from the support surface F when the force P is applied to mount the memory 21B on the second surface 20b of the substrate 20 is applied to the flat plate portions of the first memory cover 52 and the first main cover 51. It can be received at 51f and the side wall portion 53A. Therefore, it is possible to suppress the reaction force from being received by the memory 21A mounted on the first surface 20a of the substrate 20, and to relieve the stress acting on the memory 21A and the joint portion between the memory 21A and the substrate 20.

In such an electronic component 10, the first memory cover 52 and the second memory cover 56 have a duct shape continuous in the direction along the second surface 20b of the substrate 20, whereby the first memory cover 52. , The memories 21A and 21B provided inside the second memory cover 56 can be cooled.

In such an electronic component 10, the flat plate portion 55f of the second memory cover 56 and the second main cover 55 is input from the support surface F when the memory 21A is mounted on the first surface 20a of the substrate 20. The force is alleviated to reach the memory 21B. As a result, the stress acting on the memory 21B and the CPU 23 itself and the joint between the memory 21B and the CPU 23 and the substrate 20 can be relaxed.

In such an electronic component 10, the second main cover 55 has a protrusion dimension from the second surface 20b of the substrate 20 equal to the flat plate portion 55f of the second memory cover 56 and the second main cover 55 on the outer peripheral portion of the substrate 20. The side wall portion 53B of the above is further provided. By providing the side wall portion 53B having the same height as the second memory cover 56 in this way, the reaction force due to the load can be dispersed and the electronic component 10 can be stably supported. Further, the side wall portion 53B covers the second memory cover 56 from the side and also functions as a reinforcing element of the second memory cover 56.

Such a server 90 includes the above-mentioned electronic component 10 and a housing 80 in which the electronic component 10 is housed. As a result, in the electronic component 10 constituting the server 90, when a force P is applied to mount the memory 21A on the first surface 20a of the substrate 20, the reaction force input from the support surface F is transferred to the second memory. It can be received by the flat plate portion 55f of the cover 56 and the second main cover 55. Therefore, the reaction force is suppressed by the memory 21B and the CPU 23 mounted on the second surface 20b of the substrate 20, and the stress acting on the memory 21B and the CPU 23 itself and the joint portion between the memory 21B and the CPU 23 and the substrate 20 is relaxed. can do.

In the above embodiment, only the memories 21A, 21B, and CPU 23 are mentioned as the parts to be mounted on the board 20, but the types and arrangement of the parts to be mounted on the board 20 are not limited at all.
Further, although the electronic component 10 is used as a component of the server 90, its use is not limited in any way.
In addition to this, as long as the gist of the present invention is not deviated, the configuration described in the above embodiment can be selected or changed to another configuration as appropriate.

1 ... Electronic component, 2 ... Substrate, 2a ... First surface, 2b ... Second surface, 3 ... First component, 4 ... Second component, 5 ... Support member, 6 ... Support surface, 8 ... Server , 9 ... Case, 10 ... Electronic component, 20 ... Board, 20a ... First surface (first surface), 20b ... Second surface (second surface), 21A ... Memory (first component), 21B ... Memory (second component), 51f ... Flat plate portion (second support member), 52 ... First memory cover (second support member), 53A ... Side wall portion (second support member), 53B ... Side wall Part (external support member), 55f ... Flat plate part (support member), 56 ... Second memory cover (support member), 80 ... Housing, 90 ... Server, F ... Support surface

Claims (10)

A first component that can be inserted and removed from the first surface of the board,
A second component provided on the second surface of the substrate and
A support member provided on the second surface of the substrate to relieve a force due to insertion and removal of the first component with respect to the first surface of the substrate.
Bei to give a,
The support member has a larger protrusion dimension from the second surface of the substrate than the second component.
It is arranged at a position facing the first component across the substrate.
The second component is arranged at a position facing the first component with the substrate interposed therebetween.
The support member is provided so as to cover the second component.
It has a duct shape that is continuous in the direction along the second surface of the substrate.
It has a flat plate portion parallel to the substrate and a side wall portion that is integrated with the flat plate portion and rises in a direction away from the second surface.
One end of the duct shape formed by the support member has a guide blade that rises in a direction away from the second surface of the substrate and guides air from one end of the substrate toward the one end of the support member.
Electronic components. The electronic component according to claim 1, wherein the support member is in contact with a support surface that supports the substrate from below when the first component is mounted. The first component is inserted and removed with the first surface of the substrate facing upward.
The electronic component according to claim 2. The support member is detachably provided with respect to the substrate.
The electronic component according to any one of claims 1 to 3. A plurality of the support members are provided at intervals in the direction along the second surface of the substrate.
The electronic component according to any one of claims 1 to 4. The support member is provided at the center of the second surface of the substrate.
The electronic component according to any one of claims 1 to 5. A second support provided on the first surface of the substrate and in contact with a support surface that supports the substrate from below when the second component is mounted on the second surface of the substrate. With more members,
The electronic component according to any one of claims 1 to 6. In the support member, when the first component is mounted on the first surface of the substrate, a reaction force input from the support surface that supports the substrate from below is applied to the second component. Mitigate the reach,
The electronic component according to any one of claims 1 to 7. An external support member whose protrusion dimension from the second surface of the substrate is equal to that of the support member is further provided on the outer peripheral portion of the substrate.
The electronic component according to any one of claims 1 to 8. The electronic component according to any one of claims 1 to 9,
A housing containing the electronic components and
Server with.

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