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JP6937167B2 - Manufacturing method of gas sensor element - Google Patents
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JP6937167B2 - Manufacturing method of gas sensor element - Google Patents

Manufacturing method of gas sensor element Download PDF

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JP6937167B2
JP6937167B2 JP2017112267A JP2017112267A JP6937167B2 JP 6937167 B2 JP6937167 B2 JP 6937167B2 JP 2017112267 A JP2017112267 A JP 2017112267A JP 2017112267 A JP2017112267 A JP 2017112267A JP 6937167 B2 JP6937167 B2 JP 6937167B2
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conductor
hole
gas sensor
sensor element
conductor paste
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JP2018205194A (en
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章敬 小島
章敬 小島
斉 古田
斉 古田
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Niterra Co Ltd
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NGK Spark Plug Co Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403Cells and electrode assemblies
    • G01N27/406Cells and probes with solid electrolytes
    • G01N27/407Cells and probes with solid electrolytes for investigating or analysing gases
    • G01N27/4071Cells and probes with solid electrolytes for investigating or analysing gases using sensor elements of laminated structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10151Sensor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08Treatments involving gases
    • H05K2203/085Using vacuum or low pressure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Molecular Biology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Measuring Oxygen Concentration In Cells (AREA)

Description

本発明は、例えば燃焼器や内燃機関等の燃焼ガスや排気ガス中に含まれる特定ガスのガス濃度を検出するのに好適に用いられるガスセンサ素子の製造方法に関する。 The present invention relates to a method for manufacturing a gas sensor element that is suitably used for detecting the gas concentration of a specific gas contained in combustion gas or exhaust gas of, for example, a combustor or an internal combustion engine.

従来から、内燃機関の排気ガス中の特定成分(酸素等)の濃度を検出するためのガスセンサが用いられている。このガスセンサは、自身の内部にガスセンサ素子を有している。このガスセンサ素子として、固体電解質体のシートと該固体電解質体に配置された一対の電極とを有するセル、該セルと積層される絶縁シート、及びヒータ等を備えた板状素子が用いられている。
そして、板状素子の内部の電極やヒータを外部装置と電気的に接続するため、これら電極やヒータが形成されたシートと、このシートに積層される他のシートにスルーホールを設け、このスルーホールの内壁に導体ペーストを印刷することが一般に行われている。
Conventionally, a gas sensor for detecting the concentration of a specific component (oxygen or the like) in the exhaust gas of an internal combustion engine has been used. This gas sensor has a gas sensor element inside itself. As this gas sensor element, a cell having a sheet of a solid electrolyte body and a pair of electrodes arranged on the solid electrolyte body, an insulating sheet laminated with the cell, and a plate-shaped element having a heater and the like are used. ..
Then, in order to electrically connect the electrodes and heaters inside the plate-shaped element to the external device, through holes are provided in the sheet on which these electrodes and heaters are formed and other sheets laminated on this sheet, and the through holes are provided. It is common practice to print conductor paste on the inner walls of the holes.

ところで、図4に示すように、シート500に設けたスルーホール500hの角部500pでは、導体ペースト600の厚みが薄くなり、断線するおそれがある。そこで、従来から導体ペースト600を2回塗りすることが行われている。また、角部500pを囲むシート500の表裏面に環状凸部を形成させて角部500pに導体ペースト600が厚く乗るようにさせた技術が開発されている(特許文献1参照)。 By the way, as shown in FIG. 4, at the corner portion 500p of the through hole 500h provided in the sheet 500, the thickness of the conductor paste 600 becomes thin, and there is a risk of disconnection. Therefore, conventionally, the conductor paste 600 has been applied twice. Further, a technique has been developed in which annular convex portions are formed on the front and back surfaces of the sheet 500 surrounding the corner portion 500p so that the conductor paste 600 is thickly placed on the corner portion 500p (see Patent Document 1).

特開平7−183633号公報(図1)Japanese Unexamined Patent Publication No. 7-183633 (Fig. 1)

しかしながら、スルーホールに導体ペーストを2回塗りすると、生産性やコストが劣ると共に、スルーホール内に導体ペーストが詰まり、導体ペーストの供給側と反対面の角部が十分に導体ペーストで覆れない場合がある。
また、特許文献1記載の技術の場合、シートに環状凸部を形成させる余分な工程が必要となり、生産性の低下やコストアップを招く。
そこで、本発明は、スルーホール導体を確実かつ容易に形成できるガスセンサ素子の製造方法の提供を目的とする。
However, if the conductor paste is applied twice to the through holes, the productivity and cost are inferior, and the conductor paste is clogged in the through holes, and the corners on the opposite surface to the supply side of the conductor paste are not sufficiently covered with the conductor paste. In some cases.
Further, in the case of the technique described in Patent Document 1, an extra step of forming an annular convex portion on the sheet is required, which leads to a decrease in productivity and an increase in cost.
Therefore, an object of the present invention is to provide a method for manufacturing a gas sensor element capable of forming a through-hole conductor reliably and easily.

上記課題を解決するため、本発明のガスセンサ素子の製造方法は、セラミック製のグリーンシート、又は該グリーンシートと他部材との積層体にスルーホールを形成した後、前記スルーホールの内壁にスルーホール導体を形成するガスセンサ素子の製造方法であって、前記グリーンシート又は前記積層体の両面にそれぞれ所定の導体部であって、一方の面側の外部の接続端子に接続されるパッドをなす第1導体部と、他の面側の第2導体部とを形成する導体部形成工程と、前記第1及び第2導体部をそれぞれ含むように前記スルーホールを形成するスルーホール形成工程と、前記スルーホール導体の材料となる導体ペーストを、前記グリーンシート又は前記積層体の前記一方の面側の前記第1導体部に形成された前記スルーホールから供給する導体ペースト供給工程と、前記スルーホールを挟んで前記導体ペーストと反対側を負圧状態とする事で、該導体ペーストを前記スルーホールの前記内壁から前記グリーンシート又は前記積層体の前記他の面側の前記第2導体部から突出させる導体供給工程と、を有することを特徴とする。 In order to solve the above problems, in the method for manufacturing a gas sensor element of the present invention, a through hole is formed in a ceramic green sheet or a laminate of the green sheet and another member, and then a through hole is formed in the inner wall of the through hole. A first method for manufacturing a gas sensor element that forms a conductor, the first is a method of manufacturing a gas sensor element, which is a predetermined conductor portion on both sides of the green sheet or the laminate and forms a pad connected to an external connection terminal on one surface side. A conductor portion forming step of forming the conductor portion and the second conductor portion on the other surface side, a through hole forming step of forming the through hole so as to include the first and second conductor portions, respectively, and the through hole forming step. the conductor paste which is a material of the hole conductor, and the conductor paste supplying step of supplying from the green sheet or the through hole formed in said first conductor portion of one side of the laminate, sandwiching the through hole in said conductor paste opposite by a negative pressure state, the conductor projecting the conductor paste from said second conductor portion of the other surface side of the green sheet or the laminate from the inner wall of the through hole It is characterized by having a supply process.

このガスセンサ素子の製造方法によれば、一方の面側のスルーホールの角部では、導体ペーストの厚みが薄くなっているが、角部に予め導体部が形成されている。このため、導体ペーストの厚みが薄い分を導体部が補い、角部における導体ペースト、ひいてはスルーホール導体の断線を抑制し、導通を確実にすることができる。
一方、反対面側のスルーホールの角部では、負圧により導体ペーストが導体部の表面から負圧で吸い出されて突出し、突出部を形成するため、角部でも導体ペースト101sの厚みが薄くならない。その結果、角部における導体ペースト、ひいてはスルーホール導体の断線を抑制し、導通を確実にすることができる。
According to this method of manufacturing a gas sensor element, the thickness of the conductor paste is thin at the corners of the through holes on one surface side, but the conductors are formed in advance at the corners. Therefore, the conductor portion compensates for the thinness of the conductor paste, and the disconnection of the conductor paste at the corner portion and the through-hole conductor can be suppressed to ensure continuity.
On the other hand, at the corners of the through holes on the opposite surface side, the conductor paste is sucked out from the surface of the conductors under negative pressure and protrudes to form the protrusions, so that the thickness of the conductor paste 101s is thin even at the corners. It doesn't become. As a result, it is possible to suppress disconnection of the conductor paste at the corners and, by extension, the through-hole conductor, and ensure continuity.

前記導体ペースト供給工程と、前記導体供給工程とが重複してもよい。
このガスセンサ素子の製造方法によれば、導体ペースト供給工程と導体供給工程とが重複する、つまりスルーホールに導体ペーストを供給している途中から、スルーホールの反対面側を負圧にするので、導体ペーストを負圧で確実に吸い出すことができる。
The conductor paste supply step and the conductor supply step may overlap.
According to this method of manufacturing the gas sensor element, the conductor paste supply process and the conductor supply process overlap, that is, the pressure on the opposite side of the through hole is negative while the conductor paste is being supplied to the through hole. The conductor paste can be reliably sucked out with negative pressure.

前記導体ペースト供給工程の開始よりも前に、前記スルーホールを挟んで前記導体部と反対側を負圧状態とする工程をさらに有してもよい。
このガスセンサ素子の製造方法によれば、導体ペーストを負圧でより確実に吸い出すことができる。
Prior to the start of the conductor paste supply step, there may be further a step of putting the side opposite to the conductor portion into a negative pressure state with the through hole interposed therebetween.
According to this method of manufacturing the gas sensor element, the conductor paste can be sucked out more reliably with a negative pressure.

この発明によれば、ガスセンサ素子のスルーホール導体を確実かつ容易に形成できる。 According to the present invention, the through-hole conductor of the gas sensor element can be formed reliably and easily.

本発明が適用されるガスセンサ(酸素センサ)の一例を示す断面図である。It is sectional drawing which shows an example of the gas sensor (oxygen sensor) to which this invention is applied. 本発明が適用されるガスセンサ素子の一例を示す模式分解斜視図である。It is a schematic disassembled perspective view which shows an example of the gas sensor element to which this invention is applied. 本発明の実施形態に係るガスセンサ素子の製造方法を示す工程図である。It is a process drawing which shows the manufacturing method of the gas sensor element which concerns on embodiment of this invention. 従来のスルーホールの角部の導体ペーストを示す図である。It is a figure which shows the conductor paste of the corner part of the conventional through hole.

以下、本発明の実施形態について説明する。
図1は本発明が適用されるガスセンサ(酸素センサ)1の一例を示す、長手方向(軸線L方向)に沿う断面図、図2はガスセンサ素子100の模式分解斜視図である。
Hereinafter, embodiments of the present invention will be described.
FIG. 1 is a cross-sectional view taken along the longitudinal direction (axis L direction) showing an example of the gas sensor (oxygen sensor) 1 to which the present invention is applied, and FIG. 2 is a schematic exploded perspective view of the gas sensor element 100.

図1に示すように、ガスセンサ1は、ガスセンサ素子100、板状素子300等を内部に保持する主体金具30、主体金具30の先端部に装着されるプロテクタ24等を有している。ガスセンサ素子100は軸線L方向に延びるように配置され、板状素子300、及び板状素子300に積層されるヒータ200から構成されている。 As shown in FIG. 1, the gas sensor 1 has a main metal fitting 30 that holds the gas sensor element 100, a plate-shaped element 300, and the like inside, a protector 24 that is attached to the tip of the main metal fitting 30, and the like. The gas sensor element 100 is arranged so as to extend in the axis L direction, and is composed of a plate-shaped element 300 and a heater 200 laminated on the plate-shaped element 300.

ヒータ200は、図2に示すように、アルミナを主体とする第1基体101及び第2基体103と、第1基体101と第2基体103とに挟まれ、白金を主体とする発熱体102を有している。発熱体102は、先端側に位置する発熱部102aと、発熱部102aから第1基体101の長手方向に沿って延びる一対のヒータリード部102bとを有している。そして、ヒータリード部102bの端末は、第1基体101に設けられるヒータ側スルーホール101aに形成されたスルーホール導体を介してヒータ側パッド120と電気的に接続している。 As shown in FIG. 2, the heater 200 sandwiches the first base 101 and the second base 103 mainly composed of alumina, and the first base 101 and the second base 103, and forms a heating element 102 mainly composed of platinum. Have. The heating element 102 has a heating unit 102a located on the tip side and a pair of heater lead portions 102b extending from the heating unit 102a along the longitudinal direction of the first substrate 101. The terminal of the heater lead portion 102b is electrically connected to the heater side pad 120 via a through hole conductor formed in the heater side through hole 101a provided on the first substrate 101.

板状素子300は、酸素濃度検出セル130と酸素ポンプセル140とを備える。酸素濃度検出セル130は、第1固体電解質体105と、その第1固体電解質105の両面に形成された第1電極104及び第2電極106とから形成されている。第1電極104は、第1電極部104aと、第1電極部104aから第1固体電解質体105の長手方向に沿って延びる第1リード部104bとから形成されている。第2電極106は、第2電極部106aと、第2電極部106aから第1固体電解質体105の長手方向に沿って延びる第2リード部106bとから形成されている。 The plate-shaped element 300 includes an oxygen concentration detection cell 130 and an oxygen pump cell 140. The oxygen concentration detection cell 130 is formed of a first solid electrolyte body 105 and a first electrode 104 and a second electrode 106 formed on both sides of the first solid electrolyte 105. The first electrode 104 is formed of a first electrode portion 104a and a first lead portion 104b extending from the first electrode portion 104a along the longitudinal direction of the first solid electrolyte body 105. The second electrode 106 is formed of a second electrode portion 106a and a second lead portion 106b extending from the second electrode portion 106a along the longitudinal direction of the first solid electrolyte body 105.

そして、第1リード部104bの端末は、第1固体電解質体105に設けられる第1スルーホール105a、後述する絶縁層107に設けられる第2スルーホール107a、第2固体電解質体109に設けられる第4スルーホール109a及び保護層111に設けられる第6スルーホール111aのそれぞれに形成されるスルーホール導体を介して板状素子側パッド121と電気的に接続する。一方、第2リード部106bの端末は、後述する絶縁層107に設けられる第3スルーホール107b、第2固体電解質体109に設けられる第5スルーホール109b及び保護層111に設けられる第7スルーホール111bのそれぞれに形成されるスルーホール導体を介して板状素子側パッド121と電気的に接続する。 The terminal of the first lead portion 104b is provided in the first through hole 105a provided in the first solid electrolyte body 105, the second through hole 107a provided in the insulating layer 107 described later, and the second solid electrolyte body 109. It is electrically connected to the plate-shaped element side pad 121 via through-hole conductors formed in each of the 4 through-holes 109a and the 6th through-holes 111a provided in the protective layer 111. On the other hand, the terminal of the second lead portion 106b has a third through hole 107b provided in the insulating layer 107 described later, a fifth through hole 109b provided in the second solid electrolyte body 109, and a seventh through hole provided in the protective layer 111. It is electrically connected to the plate-shaped element side pad 121 via a through-hole conductor formed in each of 111b.

一方、酸素ポンプセル140は、第2固体電解質体109と、その第2固体電解質体109の両面に形成された第3電極108、第4電極110とから形成されている。第3電極108は、第3電極部108aと、この第3電極部108aから第2固体電解質体109の長手方向に沿って延びる第3リード部108bとから形成されている。第4電極110は、第4電極部110aと、この第4電極部110aから第2固体電解質体109の長手方向に沿って延びる第4リード部110bとから形成されている。 On the other hand, the oxygen pump cell 140 is formed of a second solid electrolyte body 109 and a third electrode 108 and a fourth electrode 110 formed on both sides of the second solid electrolyte body 109. The third electrode 108 is formed of a third electrode portion 108a and a third lead portion 108b extending from the third electrode portion 108a along the longitudinal direction of the second solid electrolyte body 109. The fourth electrode 110 is formed of a fourth electrode portion 110a and a fourth lead portion 110b extending from the fourth electrode portion 110a along the longitudinal direction of the second solid electrolyte body 109.

そして、第3リード部108bの端末は、第2固体電解質体109に設けられる第5スルーホール109b及び保護層111に設けられる第7スルーホール111bのそれぞれに形成されるスルーホール導体を介して板状素子側パッド121と電気的に接続する。一方、第4リード部110bの端末は、後述する保護層111に設けられる第8スルーホール111cに形成されるスルーホール導体を介して板状素子側パッド121と電気的に接続する。なお、第2リード部106bと第3リード部108bは同電位となっている。 The terminal of the third lead portion 108b is a plate via through-hole conductors formed in each of the fifth through-hole 109b provided in the second solid electrolyte body 109 and the seventh through-hole 111b provided in the protective layer 111. It is electrically connected to the pad 121 on the shape element side. On the other hand, the terminal of the fourth lead portion 110b is electrically connected to the plate-shaped element side pad 121 via a through-hole conductor formed in the eighth through-hole 111c provided in the protective layer 111, which will be described later. The second lead portion 106b and the third lead portion 108b have the same potential.

これら第1固体電解質体105、第2固体電解質体109は、ジルコニア(ZrO)に安定化剤としてイットリア(Y)又はカルシア(CaO)を添加してなる部分安定化ジルコニア焼結体から構成されている。 These first solid electrolytes 105 and second solid electrolytes 109 are partially stabilized zirconia sintered bodies obtained by adding yttria (Y 2 O 3 ) or calcia (CaO) as a stabilizer to zirconia (ZrO 2). It is composed of.

発熱体102、第1電極104、第2電極106、第3電極108、第4電極110、ヒータ側パッド120及び板状素子側パッド121は、白金族元素で形成することができる。これらを形成する好適な白金族元素としては、Pt、Rh、Pd等を挙げることができ、これらはその一種を単独で使用することもできるし、又二種以上を併用することもできる。 The heating element 102, the first electrode 104, the second electrode 106, the third electrode 108, the fourth electrode 110, the heater side pad 120, and the plate-shaped element side pad 121 can be formed of a platinum group element. Examples of suitable platinum group elements forming these include Pt, Rh, Pd and the like, and these may be used alone or in combination of two or more.

そして、上記酸素ポンプセル140と酸素濃度検出セル130との間に、絶縁層107が形成されている。絶縁層107は、絶縁部114と拡散律速部115とからなる。この絶縁層107の絶縁部114には、第2電極部106a及び第3電極部108aに対応する位置に中空部のガス検出室107cが形成されている。このガス検出室107cは、絶縁層107の幅方向で外部と連通しており、該連通部分には、外部とガス検出室107cとの間のガス拡散を所定の律速条件下で実現する拡散律速部115が配置されている。
絶縁部114は、絶縁性を有するセラミック焼結体であれば特に限定されなく、例えば、アルミナやムライト等の酸化物系セラミックを挙げることができる。
拡散律速部115は、アルミナからなる多孔質体である。この拡散律速部115によって検出ガスがガス検出室107cへ流入する際の律速が行われる。
An insulating layer 107 is formed between the oxygen pump cell 140 and the oxygen concentration detection cell 130. The insulating layer 107 includes an insulating portion 114 and a diffusion rate controlling portion 115. In the insulating portion 114 of the insulating layer 107, a hollow gas detection chamber 107c is formed at a position corresponding to the second electrode portion 106a and the third electrode portion 108a. The gas detection chamber 107c communicates with the outside in the width direction of the insulating layer 107, and the communication portion communicates with the outside to realize diffusion rate-determining between the outside and the gas detection chamber 107c under a predetermined rate-determining condition. The unit 115 is arranged.
The insulating portion 114 is not particularly limited as long as it is a ceramic sintered body having an insulating property, and examples thereof include oxide-based ceramics such as alumina and mullite.
The diffusion rate-determining portion 115 is a porous body made of alumina. The diffusion rate-determining unit 115 controls the rate when the detected gas flows into the gas detection chamber 107c.

また、第2固体電解質体109の表面には、第4電極110を挟み込むようにして、保護層111が形成されている。この保護層111は、第4電極部110aを挟み込むようにして、第4電極部110aを被毒から防御するための多孔質の電極保護部113aと、第4リード部110bを挟み込むようにして、第2固体電解質体109を保護するための補強部112とからなる。
なお、ガスセンサ100は、酸素濃度検知セル130の電極間に生じる電圧(起電力)が所定の値(例えば、450mV)となるように、酸素ポンプセル140の電極間に流れる電流の方向及び大きさが調整され、酸素ポンプセル140に流れる電流に応じた被測定ガス中の酸素濃度をリニアに検出する酸素センサに相当する。
Further, a protective layer 111 is formed on the surface of the second solid electrolyte body 109 so as to sandwich the fourth electrode 110. The protective layer 111 sandwiches the porous electrode protection portion 113a for protecting the fourth electrode portion 110a from poisoning and the fourth lead portion 110b so as to sandwich the fourth electrode portion 110a. It is composed of a reinforcing portion 112 for protecting the second solid electrolyte body 109.
In the gas sensor 100, the direction and magnitude of the current flowing between the electrodes of the oxygen pump cell 140 are set so that the voltage (electromotive force) generated between the electrodes of the oxygen concentration detection cell 130 becomes a predetermined value (for example, 450 mV). It corresponds to an oxygen sensor that is adjusted and linearly detects the oxygen concentration in the gas to be measured according to the current flowing through the oxygen pump cell 140.

図1に戻り、主体金具30は、SUS430製のものであり、ガスセンサを排気管に取り付けるための雄ねじ部31と、取り付け時に取り付け工具をあてがう六角部32とを有している。また、主体金具30には、径方向内側に向かって突出する金具側段部33が設けられており、この金具側段部33はガスセンサ素子100を保持するための金属ホルダ34を支持している。そしてこの金属ホルダ34の内側にはセラミックホルダ35、滑石36が先端側から順に配置されている。この滑石36は金属ホルダ34内に配置される第1滑石37と金属ホルダ34の後端に渡って配置される第2滑石38とからなる。金属ホルダ34内で第1滑石37が圧縮充填されることによって、ガスセンサ素子100は金属ホルダ34に対して固定される。また、主体金具30内で第2滑石38が圧縮充填されることによって、ガスセンサ素子100の外面と主体金具30の内面との間のシール性が確保される。 Returning to FIG. 1, the main metal fitting 30 is made of SUS430, and has a male screw portion 31 for attaching the gas sensor to the exhaust pipe and a hexagonal portion 32 to which an attachment tool is applied at the time of attachment. Further, the main metal fitting 30 is provided with a metal fitting side step portion 33 projecting inward in the radial direction, and the metal fitting side step portion 33 supports a metal holder 34 for holding the gas sensor element 100. .. A ceramic holder 35 and a talc 36 are arranged in order from the tip side inside the metal holder 34. The talc 36 includes a first talc 37 arranged in the metal holder 34 and a second talc 38 arranged over the rear end of the metal holder 34. The gas sensor element 100 is fixed to the metal holder 34 by compressing and filling the first talc 37 in the metal holder 34. Further, by compressing and filling the second talc 38 in the main metal fitting 30, the sealing property between the outer surface of the gas sensor element 100 and the inner surface of the main metal fitting 30 is ensured.

そして第2滑石38の後端側には、アルミナ製のスリーブ39が配置されている。このスリーブ39は多段の円筒状に形成されており、軸線に沿うように軸孔39aが設けられ、内部にガスセンサ素子100を挿通している。そして、主体金具30の後端側の加締め部30aが内側に折り曲げられており、ステンレス製のリング部材40を介してスリーブ39が主体金具30の先端側に押圧されている。 An alumina sleeve 39 is arranged on the rear end side of the second talc 38. The sleeve 39 is formed in a multi-stage cylindrical shape, a shaft hole 39a is provided along the axis, and the gas sensor element 100 is inserted therein. The crimping portion 30a on the rear end side of the main metal fitting 30 is bent inward, and the sleeve 39 is pressed against the tip end side of the main metal fitting 30 via the stainless steel ring member 40.

また、主体金具30の先端側外周には、主体金具30の先端から突出するガスセンサ素子100の先端部を覆うと共に、複数のガス取り入れ孔24aを有する金属製のプロテクタ24が溶接によって取り付けられている。このプロテクタ24は、二重構造をなしており、外側には一様な外径を有する有底円筒状の外側プロテクタ41、内側には後端部42aの外径が先端部42bの外径よりも大きく形成された有底円筒状の内側プロテクタ42が配置されている。 Further, on the outer periphery on the tip end side of the main metal fitting 30, a metal protector 24 having a plurality of gas intake holes 24a is attached by welding while covering the tip portion of the gas sensor element 100 protruding from the tip of the main metal fitting 30. .. This protector 24 has a double structure, and has a bottomed cylindrical outer protector 41 having a uniform outer diameter on the outer side, and the outer diameter of the rear end portion 42a on the inner side is larger than the outer diameter of the tip portion 42b. A large bottomed cylindrical inner protector 42 is arranged.

一方、主体金具30の後端側には、SUS430製の外筒25の先端側が挿入されている。この外筒25は先端側の拡径した先端部25aを主体金具30にレーザ溶接等により固定している。外筒25の後端側内部には、セパレータ50が配置され、セパレータ50と外筒25の隙間に保持部材51が介在している。この保持部材51は、後述するセパレータ50の突出部50aに係合し、外筒25を加締めることにより外筒25とセパレータ50とにより固定されている。 On the other hand, the tip end side of the outer cylinder 25 made of SUS430 is inserted into the rear end side of the main metal fitting 30. The outer cylinder 25 has an enlarged tip portion 25a on the tip side fixed to the main metal fitting 30 by laser welding or the like. A separator 50 is arranged inside the rear end side of the outer cylinder 25, and a holding member 51 is interposed in the gap between the separator 50 and the outer cylinder 25. The holding member 51 is engaged with the protruding portion 50a of the separator 50, which will be described later, and is fixed by the outer cylinder 25 and the separator 50 by crimping the outer cylinder 25.

また、セパレータ50には、板状素子300やヒータ200用のリード線11〜15を挿入するための挿通孔50bが先端側から後端側にかけて貫設されている(なお、リード線14、15については図示せず)。挿通孔50b内には、リード線11〜15と、板状素子300の板状素子側パッド121及びヒータ200のヒータ側パッド120とを接続する接続端子16が収容されている。各リード線11〜15は、外部において、図示しないコネクタに接続され、コネクタを介してECU等の外部機器と各リード線11〜15とは電気信号の入出力が行われる。 Further, the separator 50 is provided with an insertion hole 50b for inserting the lead wires 11 to 15 for the plate-shaped element 300 and the heater 200 from the front end side to the rear end side (note that the lead wires 14 and 15). Is not shown). In the insertion hole 50b, a connection terminal 16 for connecting the lead wires 11 to 15 and the plate-shaped element side pad 121 of the plate-shaped element 300 and the heater side pad 120 of the heater 200 is housed. The lead wires 11 to 15 are externally connected to a connector (not shown), and an electric signal is input / output between the external device such as an ECU and the lead wires 11 to 15 via the connector.

さらに、セパレータ50の後端側には、外筒25の後端側の開口部25bを閉塞するための略円柱状のゴムキャップ52が配置されている。このゴムキャップ52は、外筒25の後端内に装着された状態で、外筒25の外周を径方向内側に向かって加締めることにより、外筒25に固着されている。ゴムキャップ52にも、リード線11〜15をそれぞれ挿入するための挿通孔52aが先端側から後端側にかけて貫設されている。 Further, on the rear end side of the separator 50, a substantially columnar rubber cap 52 for closing the opening 25b on the rear end side of the outer cylinder 25 is arranged. The rubber cap 52 is fixed to the outer cylinder 25 by crimping the outer circumference of the outer cylinder 25 inward in the radial direction while being mounted inside the rear end of the outer cylinder 25. The rubber cap 52 is also provided with insertion holes 52a for inserting the lead wires 11 to 15, respectively, from the front end side to the rear end side.

次に、本発明の実施形態に係るガスセンサ素子の製造方法について説明する。
図2の例では、本発明は、ヒータ200に適用される。以下、図3を参照して本発明の実施形態に係るガスセンサ素子の製造方法の各工程を説明する。
まず、未焼成第1基体101xの片面に、未焼成発熱体102xをペースト印刷する。次に、未焼成第1基体101xをひっくり返し、その反対面に未焼成ヒータ側パッド120xをペースト印刷する(図3(a)、(b):導体部形成工程)
次に、積層方向に未焼成ヒータ側パッド120x及び未焼成発熱体102xを含むように、スルーホール101aを形成する(図3(c):スルーホール形成工程)。
Next, a method of manufacturing the gas sensor element according to the embodiment of the present invention will be described.
In the example of FIG. 2, the present invention applies to the heater 200. Hereinafter, each step of the method for manufacturing the gas sensor element according to the embodiment of the present invention will be described with reference to FIG.
First, the unfired heating element 102x is paste-printed on one side of the unfired first substrate 101x. Next, the unfired first substrate 101x is turned over, and the unfired heater side pad 120x is paste-printed on the opposite surface (FIGS. 3A and 3B: conductor portion forming step).
Next, a through hole 101a is formed so as to include the unfired heater side pad 120x and the unfired heating element 102x in the stacking direction (FIG. 3 (c): through hole forming step).

さらに、スルーホール導体の材料となる導体ペースト101sを未焼成ヒータ側パッド120x側(図3の上側)のスルーホール101aから供給(充填)する(図3(d):導体ペースト供給工程)。
そして、スルーホール101aを挟んで未焼成ヒータ側パッド120xと反対の未焼成発熱体102x側が負圧NPの状態下で、スルーホール101aに供給した導体ペースト101sを、スルーホール101aから未焼成ヒータ側パッド120xと反対側(図3の下側)の未焼成発熱体102xの表面から突出させる(図3(d):導体供給工程)。
Further, the conductor paste 101s, which is a material for the through-hole conductor, is supplied (filled) from the through-hole 101a on the unfired heater side pad 120x side (upper side in FIG. 3) (FIG. 3 (d): conductor paste supply step).
Then, under a state where the unfired heating element 102x side opposite to the unfired heater side pad 120x sandwiching the through hole 101a has a negative pressure NP, the conductor paste 101s supplied to the through hole 101a is transferred from the through hole 101a to the unfired heater side. It is projected from the surface of the unfired heating element 102x on the side opposite to the pad 120x (lower side in FIG. 3) (FIG. 3 (d): conductor supply step).

このとき、未焼成ヒータ側パッド120x側(図3の上側)のスルーホール101aの角部101p1では、導体ペースト101sの厚みが薄くなっているが、角部101p1に予め未焼成ヒータ側パッド120xが形成されている。このため、導体ペースト101sの厚みが薄い分を未焼成ヒータ側パッド120xが補い、角部101p1における導体ペースト101sの断線を抑制し、導通を確実にすることができる。
一方、未焼成ヒータ側パッド120xと反対の未焼成発熱体102x側(図3の下側)のスルーホール101aの角部101p2では、負圧NPにより導体ペースト101sが未焼成発熱体102xの表面から負圧NPで吸い出されて突出し、突出部101eを形成するため、角部101p2でも導体ペースト101sの厚みが薄くならない。その結果、角部101p2における導体ペースト101sの断線を抑制し、導通を確実にすることができる。


At this time, in the corner portion 101p1 of the through hole 101a on the unfired heater side pad 120x side (upper side in FIG. 3), the thickness of the conductor paste 101s is thin, but the unfired heater side pad 120x is previously formed in the corner portion 101p1. It is formed. Therefore, the thin portion of the conductor paste 101s can be supplemented by the unfired heater side pad 120x, the disconnection of the conductor paste 101s at the corner 101p1 can be suppressed, and the continuity can be ensured.
On the other hand, at the corner 101 p2 of the through hole 101a on the unfired heating element 102x side (lower side in FIG. 3) opposite to the unfired heater side pad 120x, the conductor paste 101s is formed on the surface of the unfired heating element 102x due to the negative pressure NP. The conductor paste 101s does not become thin even at the corners 101 p2 because the conductor paste 101e is sucked out by the negative pressure NP and protrudes to form the protrusion 101e. As a result, disconnection of the conductor paste 101s at the corner portion 101 p2 can be suppressed, and continuity can be ensured.


さらに、未焼成発熱体102x側に、図示しない未焼成第2基体103を積層し、全体を焼成することでヒータ200が完成し、導体ペースト101sはスルーホール導体となる。
以上のように、本実施形態によれば、スルーホールに導体ペーストを2回塗りしたり、シートに環状凸部を形成させる必要がなく、スルーホール導体を確実かつ容易に形成でき、生産性やコストにも優れる。
なお、未焼成第1基体101xが特許請求の範囲の「グリーンシート」に相当する。又、未焼成発熱体102x及び未焼成ヒータ側パッド120xが特許請求の範囲の「導体部」に相当する。
Further, the unfired second substrate 103 (not shown) is laminated on the unfired heating element 102x side, and the whole is fired to complete the heater 200, and the conductor paste 101s becomes a through-hole conductor.
As described above, according to the present embodiment, it is not necessary to apply the conductor paste twice to the through hole or to form the annular convex portion on the sheet, and the through hole conductor can be formed reliably and easily, and the productivity can be improved. It is also excellent in cost.
The unfired first substrate 101x corresponds to the "green sheet" in the claims. Further, the unfired heating element 102x and the unfired heater side pad 120x correspond to the "conductor portion" in the claims.

ここで、上記実施形態では、スルーホール101aに導体ペースト101sを供給(充填)した後、スルーホール101aの未焼成発熱体102x側を排圧して負圧NPとしたが、導体ペースト供給工程と導体供給工程とが重複する、つまりスルーホール101aに導体ペースト101sを供給している途中から、スルーホール101aの未焼成発熱体102x側を負圧NPにしてもよい。この場合、導体ペースト101sを負圧NPで確実に吸い出すことができる。
又、導体ペースト供給工程の開始よりも前に、スルーホール101aの未焼成発熱体102x側を負圧NP状態にしてもよい。この場合、導体ペースト101sを負圧NPでより確実に吸い出すことができる。
Here, in the above embodiment, after the conductor paste 101s is supplied (filled) to the through hole 101a, the unfired heating element 102x side of the through hole 101a is exhausted to obtain a negative pressure NP. The unfired heating element 102x side of the through hole 101a may be set to a negative pressure NP while overlapping with the supply process, that is, while the conductor paste 101s is being supplied to the through hole 101a. In this case, the conductor paste 101s can be reliably sucked out by the negative pressure NP.
Further, the unfired heating element 102x side of the through hole 101a may be put into a negative pressure NP state before the start of the conductor paste supply step. In this case, the conductor paste 101s can be more reliably sucked out by the negative pressure NP.

本発明は上記実施形態に限定されず、グリーンシートを焼成し、導体ペーストをスルーホールに供給してスルーホール導体を形成する板状のあらゆるガスセンサ素子に適用可能であり、本発明の思想と範囲に含まれる様々な変形及び均等物に及ぶことはいうまでもない。例えば、被測定ガス中のNOx濃度を検出するNOxセンサ(NOxセンサ素子)や、HC濃度を検出するHCセンサ(HCセンサ素子)等に本発明を適用してもよい。 The present invention is not limited to the above embodiment, and can be applied to any plate-shaped gas sensor element that forms a through-hole conductor by firing a green sheet and supplying a conductor paste to the through-hole. Needless to say, it extends to various deformations and equivalents contained in. For example, the present invention may be applied to a NOx sensor (NOx sensor element) that detects the NOx concentration in the gas to be measured, an HC sensor (HC sensor element) that detects the HC concentration, and the like.

100 ガスセンサ素子
101a スルーホール
101s 導体ペースト
101x グリーンシート
102x、120x 導体部
NP 負圧
100 Gas sensor element 101a Through hole 101s Conductor paste 101x Green sheet 102x, 120x Conductor part NP Negative pressure

Claims (3)

セラミック製のグリーンシート、又は該グリーンシートと他部材との積層体にスルーホールを形成した後、前記スルーホールの内壁にスルーホール導体を形成するガスセンサ素子の製造方法であって、
前記グリーンシート又は前記積層体の両面にそれぞれ所定の導体部であって、一方の面側の外部の接続端子に接続されるパッドをなす第1導体部と、他の面側の第2導体部とを形成する導体部形成工程と、
前記第1及び第2導体部をそれぞれ含むように前記スルーホールを形成するスルーホール形成工程と、
前記スルーホール導体の材料となる導体ペーストを、前記グリーンシート又は前記積層体の前記一方の面側の前記第1導体部に形成された前記スルーホールから供給する導体ペースト供給工程と、
前記スルーホールを挟んで前記導体ペーストと反対側を負圧状態とする事で、該導体ペーストを前記スルーホールの前記内壁から前記グリーンシート又は前記積層体の前記他の面側の前記第2導体部から突出させる導体供給工程と、
を有することを特徴とするガスセンサ素子の製造方法。
A method for manufacturing a gas sensor element in which a through hole is formed in a ceramic green sheet or a laminate of the green sheet and another member, and then a through hole conductor is formed in the inner wall of the through hole.
A first conductor portion that is a predetermined conductor portion on both sides of the green sheet or the laminate and forms a pad connected to an external connection terminal on one surface side, and a second conductor portion on the other surface side. And the process of forming the conductor part that forms
A through-hole forming step of forming the through-hole so as to include the first and second conductor portions, respectively.
The conductor paste which is a material of the through-hole conductor, and the conductor paste supplying step of supplying from the green sheet or the through hole formed in said first conductor portion of one side of the laminate,
Wherein the opposite side of the conductive paste across the through holes By a negative pressure state, the other surface side of the second conductor of the conductor paste wherein the inner wall of the through-hole green sheet or the laminate The conductor supply process that projects from the part and
A method for manufacturing a gas sensor element.
前記導体ペースト供給工程と、前記導体供給工程とが重複することを特徴とする請求項1に記載のガスセンサ素子の製造方法。 The method for manufacturing a gas sensor element according to claim 1, wherein the conductor paste supply step and the conductor supply step overlap. 前記導体ペースト供給工程の開始よりも前に、前記スルーホールを挟んで前記導体部と反対側を負圧状態とする工程をさらに有することを特徴とする請求項2に記載のガスセンサ素子の製造方法。 The method for manufacturing a gas sensor element according to claim 2, further comprising a step of putting the side opposite to the conductor portion into a negative pressure state with the through hole interposed therebetween before the start of the conductor paste supply step. ..
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