JP6937650B2 - Partial plating method - Google Patents

Description

The present invention relates to a partial plating method, and more particularly to a partial plating method for plating a predetermined portion on a strip-shaped material to be plated.

Conventionally, as a method of plating a predetermined portion of a strip-shaped plate-shaped material to be plated, which is used as a material for terminals and the like, on the outer peripheral surface of a mask member made of a substantially cylindrical non-conductive member that can rotate in the circumferential direction. While transporting the strip-shaped material to be plated in close contact, the plating solution is supplied to the material to be plated through each of the plurality of openings formed in the mask member, and the plating solution is supplied to the inner peripheral surface side of the mask member. A method is known in which a current is passed between an arranged anode and a material to be plated as a cathode to plate a portion of the mask member on the material to be plated that faces each opening.

As a mask member used in such a partial plating method, a plurality of positioning pins are arranged on the outer peripheral portion, and these positioning pins engage with the metal member to convey the metal member along the outer peripheral portion. Is known (see, for example, Patent Document 1). When the metal member is partially plated using such a drum jig, the metal member is engaged with the positioning pin of the drum jig and conveyed, so that the metal member can be accurately plated at a predetermined position on the metal member. ..

However, if partial plating is continuously performed while the strip-shaped material to be plated is brought into close contact with the outer peripheral surface of a mask member such as a drum jig and partially plated, an excess plating solution adhering to the outer peripheral surface of the mask member is performed. It seems that the plating metal was deposited from the surface, and the plating metal deposits adhered to the inner surface and the peripheral edge of the opening formed in the mask member, the current density of that part decreased, and a part of the plating film was chipped. There is a problem that it becomes thin.

In order to solve such a problem, it is proposed to attach a cleaning nozzle that injects a small amount of pure water toward the mask rotating body and a wiping member that drops excess liquid from the surface of the mask rotating body in the non-plated area. (See, for example, Patent Document 2).

Japanese Unexamined Patent Publication No. 2013-100593 (paragraph number 0030) Japanese Unexamined Patent Publication No. 2012-87367 (paragraph number 0018)

However, as in Patent Document 2, when water is sprayed from the cleaning nozzle toward the mask rotating body and excess liquid is dropped from the surface of the mask rotating body by a wiping member, the opening (window) of the mask rotating body is formed. ) Is small, the excess plating solution adhering to the outer peripheral surface of the mask rotating body enters the inside of the opening of the mask rotating body together with the jetted water, and the plating metal is precipitated in the opening. Precipitates of plating metal may adhere to the inner surface, the current density of that portion may decrease, and the plating film may become thin as if a part of the plating film was chipped.

Therefore, in view of such conventional problems, the present invention attaches a strip-shaped plate-shaped material to be plated to one surface of a mask member having a plurality of openings to open the mask member on the material to be plated. Provided is a partial plating method capable of suppressing thinning as if a part of the plating film is chipped even if the opening of the mask member is relatively small in the method of plating the portion facing the portion. With the goal.

As a result of diligent research to solve the above problems, the present inventors have placed a strip-shaped plate-shaped material to be plated on one surface of a mask member having a plurality of openings, and then each of the mask members. A plating solution is supplied to the material to be plated through the opening of the material, and a current is passed between the electrode arranged on the other surface side of the mask member and the material to be plated to flow the mask member on the material to be plated. In the method of plating the part facing the opening of the mask member, after plating the part facing the opening of the mask member, the water supply sponge roll in a state of being impregnated with water is rotated while being in contact with one surface of the mask member. By wiping off the plating solution adhering to one surface of the mask member, even if the opening of the mask member is relatively small, it is possible to prevent the plating film from becoming thin as if a part of the plating film was chipped. We have found and completed the present invention.

That is, in the partial plating method according to the present invention, a strip-shaped material to be plated is placed in close contact with one surface of a mask member having a plurality of openings, and then the plating is applied through each opening of the mask member. A plating solution is supplied to the plating material, and a current is passed between the electrode arranged on the other surface side of the mask member and the material to be plated to form a portion of the material to be plated that faces the opening of the mask member. In the plating method, after plating the portion of the mask member facing the opening, a water supply sponge roll impregnated with water is rotated while being in contact with one surface of the mask member to cause one of the mask members. It is characterized by wiping off the plating solution adhering to the surface.

In this partial plating method, it is preferable that the mask member is a substantially cylindrical member, and one surface and the other surface of the mask member are an outer peripheral surface and an inner peripheral surface, respectively. In this case, while the mask member rotates in the circumferential direction and the material to be plated is brought into close contact with a part of the outer peripheral surface of the mask member and conveyed, the portion of the material to be plated facing the opening of the mask member is plated. Is preferable. In this case, the water supply sponge roll is rotated in the opposite direction by the rotation of the mask member while being in contact with the outer peripheral surface of the mask member at a portion other than the portion of the outer peripheral surface of the mask member that is in close contact with the material to be plated. It is preferable to wipe off the plating solution adhering to the outer peripheral surface of the member.

Further, in the partial plating method according to the present invention, a strip-shaped material to be plated is formed on the mask member while being conveyed in close contact with a part of the outer peripheral surface of a substantially cylindrical mask member that can rotate in the circumferential direction. A plating solution is supplied to the material to be plated through each of the plurality of openings, and a current is passed between the electrode arranged on the inner peripheral surface side of the mask member and the material to be plated to flow the material to be plated. In the method of plating the portion facing the opening of the mask member above, the water supply sponge roll in a state of being impregnated with water is applied to the portion of the outer peripheral surface of the mask member other than the portion in close contact with the material to be plated. It is characterized in that the plating solution adhering to the outer peripheral surface of the mask member is continuously wiped off by rotating the mask member in the opposite direction by rotating the mask member while contacting the outer peripheral surface.

In the above partial plating method, it is preferable that the mask member is made of a non-conductive member.

According to the present invention, in a method in which a strip-shaped material to be plated is brought into close contact with one surface of a mask member having a plurality of openings, and a portion of the material to be plated facing the openings of the mask member is plated. Even if the opening of the mask member is relatively small, it is possible to prevent the mask member from becoming thin as if a part of the plating film was chipped.

It is a figure which shows the side surface of the partial plating apparatus used in embodiment of the partial plating method by this invention. It is sectional drawing which shows the partial plating apparatus of FIG. 1 cut in the horizontal plane. FIG. 5 is an enlarged cross-sectional view showing the partial plating apparatus of FIG. 2 cut along the line III-III.

Hereinafter, embodiments of the partial plating method according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a view showing a side surface of a partial plating apparatus used in the embodiment of the partial plating method according to the present invention, FIG. 2 is a cross-sectional view showing the partial plating apparatus of FIG. 1 cut in a horizontal plane, and FIG. 3 is a view. FIG. 5 is an enlarged cross-sectional view showing the partial plating apparatus No. 2 cut along the line III-III. In addition, in FIG. 1, in order to make it easy to see the material to be plated before and after being arranged on the mask member, a support roll for changing the direction of the material to be plated is shown on the outside of the mask member.

As shown in FIGS. 1 to 3, in the embodiment of the partial plating method according to the present invention, a long strip-shaped plate-shaped material 14 is brought into close contact with one surface of the mask member 12 of the partial plating apparatus 10. After the arrangement, the plating solution is supplied to the material to be plated 14 through each of the plurality of openings 12a of the mask member 12, and the electrode (anode) 16 and the cover are arranged on the other surface side of the mask member 12. A current is passed between the plating material 14 and the portion of the mask member 12 on the material 14 to be plated that faces each opening 12a.

The mask member 12 is formed on a mask member main body (drum-shaped mask member main body) made of a rotatable, substantially cylindrical non-conductive member (such as polyvinyl chloride (PVC) resin) as a support portion in the vertical direction. A recess 12b extending over the entire circumference is formed in the central portion, and the material to be plated 14 is closely arranged on the bottom surface of the recess 12b. Further, the mask member 12 is spaced apart from each other at predetermined intervals (substantially equal intervals in the illustrated embodiment) in the circumferential direction, and has a plurality of predetermined shapes (substantially rectangular in the illustrated embodiment) (the illustrated embodiment). In the form, 10) openings 12a are formed so as to penetrate the side surface. Further, the outer peripheral surface (one surface) of the mask member 12 is separated from the outer peripheral surface (one surface) at a predetermined interval in the circumferential direction (approximately equal intervals in the illustrated embodiment) and has a predetermined shape (a substantially cylindrical shape in the illustrated embodiment). A plurality of positioning pins 12c of the shape) are projected, and when the material 14 to be plated is closely arranged on the outer peripheral surface of the mask member 12, the material 14 to be plated has a predetermined interval (the same as the positioning pins 12c). It is fitted with a plurality of through holes 14a having a predetermined shape (a substantially cylindrical shape slightly larger than the positioning pin 12c in the illustrated embodiment) formed through the through holes (at intervals).

When the material 14 to be plated, which is conveyed in the direction indicated by the arrow A in FIG. 2, changes its direction by the rotatable inlet side support roll 20 and comes into close contact with the outer peripheral surface of the mask member 12, the through hole 14a of the material 14 to be plated Fits with the positioning pin 12c of the mask member 12, rotates the mask member 12 in the direction indicated by the arrow B, and then changes the direction by the rotatable outlet side support roll 22 and is conveyed in the direction indicated by the arrow A. It has become so.

While the material 14 to be plated is placed in close contact with the outer peripheral surface of the mask member 12 in this way, the other surface (inner peripheral surface) of the mask member 12 is passed through each opening 12a of the mask member 12. The plating solution is supplied to the material to be plated 14 from the slit 18a of the plating solution jet portion 18 arranged on the side, and the electrode (anode) 16 arranged on the inner peripheral surface side of the mask member 12 and the object to be plated as the cathode. When a current flows between the material 14 and the material 14, a plating film is formed on a portion of the mask member 12 on the material 14 to be plated, which faces each opening 12a.

The plating solution jet portion 18 is composed of a substantially semi-cylindrical non-conductive member (with a substantially fan-shaped cross section), and is a part of the inner peripheral surface of the mask member 12 (approximately half of the inner peripheral surface of the material support portion 12b to be plated). ) Are arranged so as to face each other. The slit 18a of the plating solution jet portion 18 penetrates from the inner peripheral surface to the outer peripheral surface of the plating solution jet portion 18, and the plating solution is injected from the inner peripheral surface side to the outer peripheral surface side by the plating solution supply unit (not shown). Can be supplied.

The anode 16 is made of a conductive member having a fan-shaped cross section, and is attached to the upper and lower surfaces of the inner wall of the slit 18a of the plating solution jet portion 18.

Further, a rotatable water supply sponge roll 24 is arranged in contact with the outer peripheral surface of the mask member 12 in a portion other than the portion of the outer peripheral surface of the mask member 12 that is in close contact with the material to be plated 14. Water is supplied to the water supply sponge roll 24 from a water dispenser (not shown). The water supply sponge roll 24 extends substantially parallel to the width direction perpendicular to the circumferential direction of the mask member 12, rotates in the opposite direction due to the rotation of the mask member 12, and is in a state of being soaked with water. The outer peripheral surface of 12 (and the peripheral edge of the opening 12a) is wiped off. By wiping the outer peripheral surface (and the peripheral edge of the opening 12a) of the mask member 12 with the water supply sponge roll 24 soaked with water in this way, the inner surface and the peripheral edge of the opening 12a of the mask member 12 are made of plated metal. It is possible to prevent the precipitate from adhering. As this water supply sponge roll, a roll made of a sponge having excellent water absorption, dehydration and abrasion resistance, such as a PVA sponge having a porous continuous pore structure formed by acetalizing polyvinyl alcohol (PVA), is used. preferable.

Hereinafter, examples of the partial plating method according to the present invention will be described in detail.

[Comparison example]
Six 0.2 mm thick plate-shaped materials (plated materials) made of Cu-Ni-Sn alloy (NB109-EH material manufactured by DOWA Metal Tech Co., Ltd.) were prepared, and these materials to be plated were placed in front. As a treatment, it was degreased, washed with water, pickled, and then washed with water.

Next, Ni strike plating was performed as a base plating on the entire surface of each of these pretreated materials to be plated, and then Ni plating was performed to form a Ni plating film having a thickness of 1 μm. A sheet of Ni-plated material to be plated was prepared.

Next, these Ni-plated materials to be plated were electrolytically degreased at 5 V at 50 ° C. for 30 seconds, washed with water for 15 seconds, pickled with sulfuric acid for 15 seconds, and then washed with water.

Next, nine openings of 2.0 mm × 1.2 mm, which are substantially rectangular, are formed so as to be arranged in a row at intervals of 8 mm, and similarly so as to be parallel to the row of the openings. A material to be plated is placed in close contact with a mask member (consisting of polyphenylene sulfide (PPS)) formed so that rows of nine openings are arranged at intervals of 19 mm, and these openings are arranged. The portion corresponding to the above was Au-plated with a commercially available Au plating solution at 55 ° C. at a current density of 28 A / dm ² for 5 minutes so as to form an Au plating film on the Ni plating film of the material to be plated. After this Au plating, the material to be plated was replaced, the same Au plating was repeated, the same Au plating was performed on the Ni plating film of the six materials to be plated, and then the mask member was observed with a digital microscope. .. As a result, precipitation of Au was observed in all of the nine openings in one row, and precipitation of Au was observed in six of the nine openings in the other row.

[Example 1]
After Au plating each of the six materials to be plated using the same mask member as in the comparative example (every time each material to be plated is Au plated), a water supply sponge roll impregnated with water (every time Au plating is performed on each material to be plated). The PVA sponge roll "Durapore" manufactured by Duraron Co., Ltd.) was rotated once on the mask member (the part corresponding to the opening) to wipe off the excess plating solution adhering to the mask member. After Au plating the six materials to be plated by the same method, the mask member was observed with a digital microscope. As a result, no precipitation of Au was observed in any of the openings.

[Example 2]
A mask member after performing Au plating on six materials to be plated by the same method as in Example 1 except that the water supply sponge roll similar to Example 1 was impregnated with Au plating solution instead of water. Was observed with a digital microscope. As a result, Au precipitation was observed in one of the nine openings in one row, but Au precipitation was observed in all nine openings in the other row. There wasn't.

By wiping off the excess plating solution adhering to the mask member with a water supply sponge roll impregnated with water or Au liquid as in Examples 1 and 2, even if the opening of the mask member is relatively small, the plating film can be formed. It is possible to suppress thinning as if a part is chipped.

10 Partial plating equipment 12 Mask member 12a Opening 12b Recess (supporting material to be plated)
12c Positioning pin 14 Material to be plated 14a Through hole 16 Anode 18 Plating liquid jet part 18a Slit 20 Inlet side support roll 22 Outlet side support roll 24 Water supply sponge roll

Claims (5)

Each opening of the mask member is conveyed while the cylindrical mask member having a plurality of openings rotates in the circumferential direction and the strip-shaped material to be plated is brought into close contact with a part of the outer peripheral surface of the mask member. A plating solution is supplied to the material to be plated, and a current is passed between the electrode arranged on the inner peripheral surface side of the mask member and the material to be plated to pass an opening of the mask member on the material to be plated. In the method of plating the portion facing the mask member, after plating the portion facing the opening of the mask member, the water supply sponge roll in a state of being impregnated with water is rotated while being in contact with the outer peripheral surface of the mask member to perform the mask. A partial plating method characterized by wiping off the plating solution adhering to the outer peripheral surface of a member. The water supply sponge roll is rotated in the opposite direction by the rotation of the mask member while being in contact with the outer peripheral surface of the mask member at a portion other than the portion of the outer peripheral surface of the mask member that is in close contact with the material to be plated. The partial plating method according to claim 1 , wherein the plating solution adhering to the outer peripheral surface of the mask member is wiped off. While conveyed close contact so the strip-like material to be plated on a part of the outer peripheral surface of a rotatable circular cylindrical mask member in the circumferential direction, through each of the plurality of openings formed in the mask member , A plating solution is supplied to the material to be plated, and a current is passed between the electrode arranged on the inner peripheral surface side of the mask member and the material to be plated to face the opening of the mask member on the material to be plated. In the method of plating a portion, the water supply sponge roll soaked with water is brought into contact with the outer peripheral surface of the mask member at a portion other than the portion of the outer peripheral surface of the mask member that is in close contact with the material to be plated. A partial plating method, characterized in that the plating solution adhering to the outer peripheral surface of the mask member is continuously wiped off by rotating in the opposite direction. The partial plating method according to any one of claims 1 to 3 , wherein the mask member is made of a non-conductive member. The partial plating method according to any one of claims 1 to 4, wherein the water supply sponge roll in a state of being impregnated with water is a water supply sponge roll in a state of being supplied with water from a water dispenser.

Images