JP6940207B2 - Electronic component mounting device - Google Patents

Description

The present invention relates to the structure of an electronic component mounting device.

Electronic component mounting devices that pick up semiconductor dies from wafers and mount them on substrates or lead frames are often used. In such an electronic component mounting device, the semiconductor die and the mounting position are positioned by recognizing the mounting position on the substrate with a camera and aligning the center position of the mounting collet with the mounting position. On the other hand, the semiconductor die is mounted while the temperature of the substrate is maintained at about 100 ° C. Therefore, if the mounting is continued for a long time, the positional relationship between the camera, the collet, and the substrate may change due to the temperature change over time. It may change and the positioning accuracy may decrease.

For this reason, reference marks are provided on the transport path for transporting the substrate and the bonding head to which the collet is attached, and each reference mark is imaged by a camera to detect the positional deviation between the camera and the bonding head with respect to the transport path. It has been proposed to correct the positional relationship between the camera, the collet, and the substrate (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2016-197630

By the way, in the electronic component mounting apparatus, if the mounting is performed for a long time, the pick-up portion that picks up the semiconductor die from the wafer is also affected by the temperature change with time. In the pickup unit, the semiconductor die to be picked up is recognized by the camera, the center position of the pickup collet is aligned with the center position of the semiconductor die, the semiconductor die is picked up, transferred onto the substrate, and mounted at the mounting position of the substrate. Therefore, if the center position of the pickup collet and the center position of the semiconductor die to be picked up deviate from each other, the mounting accuracy of the semiconductor die on the substrate may decrease.

Therefore, an object of the present invention is to suppress a decrease in mounting accuracy of a semiconductor die on a substrate in an electronic component mounting device.

The electronic component mounting device of the present invention has a wafer ring that holds a wafer, a collet that has a center hole and picks up electronic components from the wafer, a collet drive unit that drives the collet in the horizontal direction, and a collet root side. A wafer-side lighting unit that injects light into the center hole of the collet, a wafer-side imaging device that captures the collet image from the base side of the collet, an image processing unit that processes the image captured by the wafer-side imaging device, and the collet. An electronic component mounting device including a control unit for adjusting the position, the wafer-side imaging device captures an image of reflected light incident on the center hole of the collet and reflected on the surface of the wafer directly under the collet. The image processing unit detects the center position of the center hole of the collet as the collet center position based on the image of the reflected light reflected on the surface of the wafer imaged by the wafer side image pickup device, and detects the collet center position and the wafer side image pickup device. The control unit detects the deviation from the reference position in the field of view of the wafer, and the control unit adjusts the horizontal position of the collet by the collet drive unit based on the deviation.

In this way, the deviation between the center position of the collet and the reference position in the field of view of the wafer-side imaging device is detected, and the horizontal position of the collet is corrected based on the deviation to adjust the position of the collet. If there is a deviation in the positional relationship between the center position of the collet and the reference position in the field of view of the wafer-side imaging device, the amount of deviation can be corrected at any time, and the semiconductor die can be accurately picked up from the wafer. Can be done.

In the electronic component mounting device of the present invention, the electronic component mounting device includes a push-up pin that pushes up the electronic component picked up by the collet from the lower side of the wafer, the wafer-side imaging device captures an image of the push-up pin from the upper side, and the image processing unit is on the wafer side. The center position of the push-up pin may be detected as a pin center based on the image of the push-up pin captured by the image pickup device, and the detected pin center may be set as a reference position in the field of view of the wafer-side image pickup device. Further, the wafer ring driving unit for driving the wafer ring in the horizontal direction is included, the wafer-side imaging device images the electronic components picked up by the collet from the upper side of the wafer, and the image processing unit captures the collet imaged by the wafer-side imaging device. Based on the image of the electronic component picked up by the wafer, the center position of the electronic component picked up by the collet is detected as the chip center, and the control unit rings the wafer so that the chip center becomes the reference position in the field of view of the wafer side image pickup device. The horizontal position of the wafer ring may be adjusted by the drive unit.

In this way, the center position of the push-up pin is set to the reference position in the field of view of the wafer-side image pickup device, and the chip center, which is the center position of the electronic component picked up by the collet, is set to the reference position in the field of view of the wafer-side image pickup device. Since the horizontal position of the wafer ring is adjusted so as to be, the center position of the push-up pin and the semiconductor die to be picked up can be aligned. In addition, if there is a deviation in the positional relationship between the center position of the collet and the reference position in the field of view of the wafer-side imaging device, the amount of deviation is corrected at any time, so the center position of the push-up pin and the semiconductor die to be picked up and the collet The semiconductor die can be picked up with the center position of. As a result, it is possible to suppress the occurrence of chip misalignment during pickup, and it is possible to suppress a decrease in mounting accuracy of the semiconductor die on the substrate even when the temperature changes over time.

The electronic component mounting device of the present invention includes a frame-side illumination unit that injects light into the center hole of the collet from the root side of the collet, and a frame-side image pickup device that captures an image of the collet from the root side of the collet. Mounts the electronic component adsorbed on the tip on the object to be mounted, the image processing unit processes the image captured by the frame-side image pickup device, and the frame-side image pickup device adsorbs the electronic component on the tip of the collet. Then, an image of the reflected light incident on the center hole of the collet and reflected on the surface of the electronic component adsorbed on the tip of the collet is imaged, and the image processing unit is adsorbed on the tip of the collet imaged by the frame-side imaging device. The center position of the center hole of the collet is detected as the collet center position based on the image of the reflected light reflected on the surface of the electronic component, and between the detected collet center position and the reference position in the field of view of the frame side image pickup device. The first deviation may be detected, and the control unit may adjust the horizontal position of the collet by the collet driving unit based on the first deviation.

In this way, in addition to picking up the semiconductor die with the push-up pin, the center position of the semiconductor die to be picked up, and the center position of the collet aligned, the center position of the collet and the reference position in the field of view of the frame-side image pickup device Since the first deviation between the two is detected and the horizontal position of the collet is adjusted based on the first deviation, there is a deviation in the positional relationship between the center position of the collet and the reference position in the field of view of the frame-side imaging device. When it occurs, the deviation amount can be corrected at any time, and the semiconductor die can be mounted accurately.

In the electronic component mounting device of the present invention, the frame-side imaging device captures an image of the mounting object, and the image processing unit mounts the electronic component based on the image of the mounting target captured by the frame-side imaging device. The position is detected, the second deviation between the detected mounting position and the reference position in the field of view of the frame-side imaging device is detected, and the control unit is a collet drive unit based on the first deviation and the second deviation. The horizontal position of the collet may be adjusted by.

In this way, the second deviation between the mounting position of the substrate or lead frame to be mounted and the reference position in the field of view of the frame-side imaging device is detected, and based on the first deviation and the second deviation. Since the horizontal position of the collet is adjusted, if there is a deviation in the positional relationship between the collet center position and the mounting position, the amount of deviation can be corrected at any time, and the semiconductor die can be mounted more accurately. Can be implemented in.

In the electronic component mounting device of the present invention, it is arranged between a pickup unit that picks up an electronic component from a wafer and a mounting unit that mounts the picked up electronic component on a mounting object, and is placed on an image of the tip of a collet and the tip of the collet. A back surface camera that captures an image of the back surface of the attracted electronic component is provided, and the image processing unit is based on the image of the tip of the collet captured by the back surface camera and the image of the back surface of the electronic component, and the image processing unit of the electronic component with respect to the collet. The misalignment amount may be detected, and the control unit may adjust the horizontal position of the collet by the collet drive unit based on the first deviation, the second deviation, and the misalignment amount of the electronic component with respect to the collet.

As a result, even if there is a deviation in the position of the electronic component with respect to the collet, the deviation can be corrected and the electronic component can be mounted on the substrate in a state where the chip center DC of the electronic component matches the mounting position.

In the electronic component mounting device of the present invention, a mounting collet having a center hole and mounting an electronic component attracted to the tip on a mounting object, a mounting collet drive unit for driving the mounting collet in the horizontal direction, and a base of the mounting collet. The image processing unit includes a frame-side illumination unit that injects light into the center hole of the mounting collet from the side and a frame-side imaging device that captures an image of the mounting collet from the root side of the mounting collet. The captured image is processed, the control unit adjusts the position of the mounting collet, and the frame-side imaging device is incident on the center hole of the mounting collet with the electronic components adsorbed on the tip of the mounting collet. The image of the reflected light reflected on the surface of the electronic component adsorbed on the tip of the mounting collet is imaged, and the image processing unit reflects the reflection reflected on the surface of the electronic component adsorbed on the tip of the mounting collet imaged by the frame-side image pickup device. The center position of the center hole of the mounting collet is detected as the mounting collet center position based on the light image, and the first deviation between the detected mounting collet center position and the reference position in the field of view of the frame-side imaging device is detected. However, the control unit may adjust the horizontal position of the mounting collet by the mounting collet driving unit based on the first deviation.

In this way, in addition to picking up the semiconductor die with the center position of the push-up pin and the semiconductor die to be picked up aligned with the center position of the collet, the center position of the mounting collet and the reference position in the field of view of the frame-side image pickup device Since the first deviation between the two is detected and the horizontal position of the mounting collet is adjusted based on the first deviation, the positional relationship between the center position of the mounting collet and the reference position in the field of view of the frame-side imaging device. When a deviation occurs, the amount of the deviation can be corrected at any time, and the semiconductor die can be mounted accurately.

In the electronic component mounting device of the present invention, the frame-side imaging device captures an image of the mounting object, and the image processing unit mounts the electronic component based on the image of the mounting target captured by the frame-side imaging device. The position is detected, the second deviation between the detected mounting position and the reference position in the field of view of the frame-side imaging device is detected, and the control unit drives the mounting collet based on the first deviation and the second deviation. The horizontal position of the mounting collet may be adjusted by the unit.

In this way, the second deviation between the mounting position of the substrate or lead frame to be mounted and the reference position in the field of view of the frame-side imaging device is detected, and based on the first deviation and the second deviation. Since the horizontal position of the mounting collet is adjusted, if there is a deviation in the positional relationship between the center position of the mounting collet and the mounting position, the amount of deviation can be corrected at any time, making the semiconductor die more accurate. It can be mounted at the mounting position.

In the electronic component mounting apparatus of the present invention, the image of the tip of the mounting collet and the mounting collet are arranged between the pickup unit that picks up the electronic component from the wafer and the mounting unit that mounts the picked up electronic component on the mounting object. It is equipped with a back surface camera that captures the image of the back surface of the electronic component adsorbed on the tip, and the image processing unit is based on the image of the tip of the mounting collet captured by the back surface camera and the image of the back surface of the electronic component. The control unit detects the amount of misalignment of the electronic component with respect to the mounting collet, and the control unit adjusts the horizontal position of the mounting collet by the mounting collet drive unit based on the first deviation and the second deviation and the amount of misalignment of the electronic component with respect to the mounting collet. You may.

As a result, even if there is a deviation in the position of the electronic component with respect to the mounting collet, the deviation can be corrected and the electronic component can be mounted on the substrate in a state where the chip center DC of the electronic component matches the mounting position.

The electronic component mounting device of the present invention has a mounting collet that has a center hole and mounts an electronic component attracted to the tip on a mounting object, a mounting collet drive unit that drives the mounting collet in the horizontal direction, and a base of the mounting collet. A frame-side illumination unit that injects light into the center hole of the mounting collet from the side, a frame-side imaging device that captures an image of the mounting collet from the root side of the mounting collet, and image processing that processes the image captured by the frame-side imaging device. An electronic component mounting device including a unit and a control unit for adjusting the position of the mounting collet. The frame-side imaging device is placed in the center hole of the mounting collet in a state where the electronic component is attracted to the tip of the mounting collet. An image of the reflected light that is incident and reflected on the surface of the electronic component that is adsorbed on the tip of the mounting collet is imaged, and the image processing unit captures the surface of the electronic component that is adsorbed on the tip of the mounting collet imaged by the frame-side image pickup device. The center position of the center hole of the mounting collet is detected as the mounting collet center position based on the image of the reflected light reflected by the mounting collet, and the position between the detected mounting collet center position and the reference position in the field of view of the frame-side imaging device is 1 The deviation is detected, and the control unit adjusts the horizontal position of the mounting collet by the mounting collet driving unit based on the first deviation.

As a result, the first deviation between the center position of the mounting collet and the reference position in the field of view of the frame-side imaging device is detected, and the horizontal position of the mounting collet is adjusted based on the first deviation. When a deviation occurs in the positional relationship between the center position and the reference position in the field of view of the frame-side imaging device, the deviation amount can be corrected at any time, and the semiconductor die can be accurately mounted.

In the electronic component mounting device of the present invention, the frame-side imaging device captures an image of the mounting object, and the image processing unit mounts the electronic component based on the image of the mounting target captured by the frame-side imaging device. The position is detected, the second deviation between the detected mounting position and the reference position in the field of view of the frame-side imaging device is detected, and the control unit drives the mounting collet based on the first deviation and the second deviation. The position of the mounting collet may be adjusted depending on the unit.

In this way, the second deviation between the mounting position of the substrate or lead frame to be mounted and the reference position in the field of view of the frame-side imaging device is detected, and based on the first deviation and the second deviation. Since the horizontal position of the mounting collet is adjusted, if there is a deviation in the positional relationship between the center position of the mounting collet and the mounting position, the amount of deviation can be corrected at any time, making the semiconductor die more accurate. It can be mounted at the mounting position.

The electronic component mounting device of the present invention can suppress a decrease in mounting accuracy of a semiconductor die on a substrate.

It is an elevation view which shows the structure of the electronic component mounting apparatus of embodiment. It is a top view which shows the structure of the electronic component mounting apparatus of embodiment. It is a vertical sectional view of the pickup part of the electronic component mounting apparatus of an embodiment (AA sectional view shown in FIGS. 1 and 2). It is a vertical sectional view of the mounting part of the electronic component mounting apparatus of an embodiment (BB sectional view shown in FIGS. 1 and 2). It is a flowchart which shows the operation of the pickup part of the electronic component mounting apparatus of embodiment. FIG. 5 is a vertical cross-sectional view showing a state in which a push-up needle is imaged by a wafer-side camera from above in the electronic component mounting device of the embodiment. It is a figure which shows the field of view of the wafer side camera in the state of FIG. It is a vertical cross-sectional view which shows the state which the collet of a pickup head is moved right above a wafer. It is a figure which shows the field of view of the wafer side camera in the state shown in FIG. FIG. 5 is a vertical cross-sectional view showing a state in which the center position of the collet of the pickup head is aligned with the reference position of the wafer side camera. It is a figure which shows the field of view of the wafer side camera in the state shown in FIG. It is a vertical cross-sectional view which shows the state which picks up a semiconductor die from a wafer. It is a flowchart which shows the operation of the mounting part of the electronic component mounting apparatus of embodiment. FIG. 5 is a vertical cross-sectional view showing a state in which a mounting collet having a semiconductor die adsorbed on its tip is moved directly above a substrate in the semiconductor mounting device of the embodiment. It is a figure which shows the field of view of the frame side camera in the state shown in FIG. It is a vertical cross-sectional view which shows the state which imaged the mounting position of a substrate by the frame side camera. It is a figure which shows the field of view of the frame side camera in the state of FIG. It is the figure which superposed the figure of the field of view shown in FIG. 15 on the figure of the field of view shown in FIG. It is a figure which shows the field of view of the frame side camera in the state where the center position of a mounting collet, the center position of a semiconductor die, and the mounting position coincide with each other. It is a vertical cross-sectional view which shows the state which the semiconductor die is mounted at the mounting position of a substrate by the mounting collet. It is a vertical cross-sectional view which shows the state which the mounting of the semiconductor die is completed. It is a figure which shows the field of view of the frame side camera in the state shown in FIG. It is a vertical sectional view of the pickup part of the electronic component mounting apparatus of another embodiment. It is a vertical sectional view of the mounting part of the electronic component mounting apparatus of another embodiment. It is an elevation view which shows the structure of the electronic component mounting apparatus of another embodiment. It is a top view which shows the structure of the electronic component mounting apparatus of another embodiment. It is a vertical sectional view of the mounting part of the electronic component mounting apparatus of another embodiment (BB sectional view shown in FIGS. 25 and 26). It is an elevation view which shows the structure of the electronic component mounting apparatus of another embodiment. It is a figure which shows the field of view of the back side camera of the electronic component mounting apparatus shown in FIG. 28.

<Configuration of electronic component mounting device>
Hereinafter, the electronic component mounting device 100 of the embodiment will be described with reference to the drawings. In each elevation view, each plan view, and each elevation cross-sectional view other than the view showing the field of view, the semiconductor die 36 and the collet 30 are drawn larger than the actual dimensions for easy understanding.

As shown in FIGS. 1 and 2, the electronic component mounting device 100 of the embodiment includes a base 10, a pickup section 101, a mounting section 102, and a control device 80. In each drawing, the transport direction of the substrate 74 will be described as the X direction, the direction perpendicular to the X direction as the Y direction, and the vertical direction as the Z direction. The XY direction is the horizontal direction.

As shown in FIGS. 1 and 2, the pickup unit 101 includes a wafer ring 42, a push-up unit 43, a pickup head 20 to which a collet 30 is attached, and a wafer-side camera 12 which is a wafer-side image pickup device. ing.

As shown in FIG. 3, the wafer ring 42 holds the wafer 35 on the upper surface and is driven in the XY direction by the wafer ring driving unit 41 arranged on the side surface. The push-up unit 43 is attached to the base 10 on the lower side of the wafer ring 42, and a push-up pin 44 for pushing up the semiconductor die 36 that moves in the Z direction and picks up from the lower side of the wafer 35 is provided in the center. .. The pickup head 20 is fixed to the base 10 and is guided by a linear guide 14 extending in the X direction through the pickup unit 101 and the mounting unit 102, and moves in the X direction between the pickup unit 101 and the mounting unit 102.

The pickup head 20 has a main body 21 that is guided by a linear guide 14 and moves between the pickup portion 101 and the mounting portion 102, a bracket 22 provided on the lower side of the main body 21, and a rotation shaft at the lower end of the bracket 22. It has an arm 23 rotatably attached around 24 and a collet 30 attached to the positive end of the arm 23 in the X direction. The collet 30 of the pickup head 20 picks up the semiconductor die 36 and mounts it on the substrate 74. A spring 26 is provided between the negative end in the X direction of the arm 23 and the protrusion 25 attached to the upper side of the bracket 22. The spring 26 pulls the negative end in the X direction of the arm 23 upward, and presses the upper surface of the negative end in the X direction of the arm 23 against the lower surface of the bracket 22.

The main body 21 includes a Y-direction drive mechanism for driving the pickup head 20 in the Y-direction and a Z-direction drive mechanism for driving the collet 30 in the Z-direction. The drive mechanism in the Y direction may be, for example, a linear motor, and the drive mechanism in the Z direction may be composed of, for example, a servomotor and a screw mechanism. Further, the linear guide 14 is moved in the X direction by a linear guide drive mechanism (not shown). The pickup head 20 and the linear guide drive mechanism form a collet drive unit that drives the collet 30 in the XY directions.

The collet 30 is composed of a shaft 31 on the root side and a collet body 33 on the tip side. The shaft 31 is made of metal, and the collet body 33 is made of, for example, a heat-resistant resin. At the center of the shaft 31 and the collet main body 33, circular center holes 32 and 34 are provided coaxially. The upper end of the shaft 31 is attached to a portion of the arm 23 where the recess 23a is provided, and the center hole 32 of the shaft 31 communicates with the recess 23a provided in the upper part of the arm 23 and is upward in the Z direction from the recess 23a. It is open toward. The center hole 34 of the collet main body 33 communicates with the center hole 32 of the shaft 31 and is opened from the lower end surface downward in the Z direction.

A light source 27 and a beam splitter 28 are provided on the upper surface of the recess 23a of the arm 23. Further, a wafer-side camera 12 that captures an image of the collet 30 from the root side of the collet 30 is attached to the upper base 11 on the upper side of the collet 30. By design, the wafer-side camera 12 is arranged so that the optical axis 13 and the pin center PC at the center of the push-up pin 44 have the same horizontal position.

The beam splitter 28 is arranged directly above the center hole 32 of the shaft 31, reflects the light from the light source 27, and is incident on the center hole 32 of the shaft 31 and the center hole 34 of the collet body 33. Further, the beam splitter 28 transmits the reflected light reflected on the surface of the wafer 35 located directly below the collet 30 toward the upper side in the Z direction, and causes the beam splitter 28 to enter the wafer side camera 12. The light source 27 and the beam splitter 28 form a wafer-side illumination unit 29. Here, the light source 27 may be a high-intensity LED or a laser light source. Further, a half mirror may be used instead of the beam splitter 28.

As shown in FIGS. 1 and 2, the mounting unit 102 has a mounting stage 72 for sucking and fixing the substrate 74, which is a mounting object, and a frame-side camera 63, which is a frame-side imaging device. As described above, the pickup head 20 moves between the pickup unit 101 and the mounting unit 102 guided by the linear guide 14 extending through the pickup unit 101 and the mounting unit 102, and the semiconductor die 36 at the mounting unit 102. Is mounted on the substrate 74.

The mounting stage 72 is attached to the base 10 via the pedestal 71. On both sides of the mounting stage 72 in the Y direction, a transport mechanism 73 composed of two guide rails extending in the X direction and transporting the substrate 74 in the X direction is provided.

As shown in FIG. 4, a frame-side camera 63 that captures an image of the collet 30 from the root side of the collet 30 when the pickup head 20 moves to the mounting portion 102 is attached to the upper side of the mounting stage 72. The frame-side camera 63 is attached to the tip of an arm 62 that is attached to the upper base 11 and is guided by a linear guide 61 that extends in the Y direction and can move in the Y direction. Inside the arm 62, a Y-direction drive mechanism such as a linear motor that moves the arm 62 in the Y direction is attached.

The control device 80 is a computer including a CPU and a memory inside, and has two functional blocks, a control unit 81 and an image processing unit 82, which function by operating the CPU and the memory which is a storage unit in cooperation with each other. Have.

The wafer-side camera 12, the pickup head 20, the wafer ring drive unit 41, the frame-side camera 63, the transfer mechanism 73, and the mounting stage 72 are connected to the control unit 81 and operate according to the command of the control unit 81. The image captured by the wafer-side camera 12 is input to the image processing unit 82, and the image processing unit 82 processes the image. The data obtained by the image processing is input to the control unit 81.

<Pickup operation>
The operation of the pickup unit 101 of the electronic component mounting device 100 configured as described above will be described with reference to FIGS. 5 to 12.

As shown in steps S101 and 6 of FIG. 5, the control unit 81 captures an image of the push-up pin 44 from the upper side of the wafer ring 42 with the wafer side camera 12 and outputs the image to the image processing unit 82. As shown in step S102 of FIG. 5, the image processing unit 82 processes the input image data and detects the position of the tip of the push-up pin 44 as the pin center PC at the center of the push-up pin 44. The image data processing may utilize, for example, that the brightness of the tip image of the push-up pin 44 is higher than the brightness of the image of the tapered surface near the tip of the push-up pin 44.

As described above, since the optical axis 13 of the wafer-side camera 12 and the pin center PC at the center of the push-up pin 44 are arranged at the same position in the design, the optical axis 13 of the wafer-side camera 12 and the push-up pin 44 are arranged at the same position. When is in the position as designed, the pin center PC of the push-up pin 44 shown in FIG. 7 is a reference indicated by the intersection of the reference line 16 in the X direction and the reference line 17 in the Y direction of the field of view 15 of the wafer side camera 12. It is in the same position as position C1. However, as shown in FIG. 7, the position of the pin center PC and the position of the reference position C1 may deviate from each other.

As shown in steps S103 and 7 of FIG. 5, the control unit 81 defines the reference position C1 of the visual field 15 so that the reference position C1 coincides with the pin center PC, and the reference line 16 in the X direction and the reference line in the Y direction. 17 is moved in the XY direction. Then, the moved position is set to the reference position C1 of the field of view 15.

As shown in FIG. 8, the control unit 81 drives the collet 30 directly above the wafer 35 by the drive mechanism of the main body 21 of the pickup head 20 in the XY and Z directions, and the lower surface of the collet main body 33 is, for example, about 0.1 mm from the wafer 35. The position is at a very small height. Then, the central axis of the collet 30 and the optical axis 13 of the wafer side camera 12 are aligned with each other. Next, the control unit 81 turns on the light source 27 provided in the pickup head 20. The light from the light source 27 travels in the X direction, is reflected by the beam splitter 28, travels downward in the Z direction, and is incident on the center hole 32 of the shaft 31 from the root side of the collet 30. The light incident on the center hole 32 passes through the center hole 34 of the collet body 33 from the center hole 32 and is reflected on the surface of the wafer 35 directly below the collet body 33. The reflected light reflected on the surface of the wafer 35 travels upward in the Z direction through the center holes 34 and 32, passes through the beam splitter 28, and enters the wafer side camera 12.

Since the focus of the wafer side camera 12 is aligned with the vicinity of the lower surface of the collet main body 33, as shown in FIG. 9, the reflected light from the surface of the wafer 35 located near the lower surface of the collet main body 33 is the wafer side camera. In the field of view 15 of 12, it appears as a white circular image of the center holes 32 and 34.

As described above, in each elevation view, each plan view, and each elevation cross-sectional view, the sizes of the semiconductor die 36 and the collet 30 are drawn larger than the actual sizes, but in reality, the semiconductor die 36 is drawn. The size of the collet 30 and the center holes 32 and 34 is very small, and the size of the field of view 15 of the wafer-side camera 12 is smaller than that of the recess 23a provided in the upper part of the arm 23. Further, the focus of the wafer side camera 12 is aligned with the vicinity of the lower surface of the collet main body 33. Therefore, around the white circular image of the center holes 32 and 34 of the field of view 15, the arm 23 is located between the wafer side camera 12 and the lower surface of the collet main body 33 which is the focal plane, instead of the image of the bottom surface of the recess 23a. The recess 23a of the above appears as a background of a black shadow.

As shown in step S104 of FIG. 5, the wafer-side camera 12 captures a white image of the reflected light incident on the center holes 32 and 34 of the collet 30 protruding inside on a black background and reflected on the surface of the wafer 35. The captured image is output to the image processing unit 82. If light is reflected on the bottom surface of the recess 23a, a blurred image of the bottom surface of the recess 23a may appear around the white circular image. In this case, the bottom surface of the recess 23a is black. By doing so, a black background can be made to appear around the white circular image.

As shown in step S105 of FIG. 5, the image processing unit 82 processes the input image and detects the center positions of the center holes 32 and 34 of the collet 30 as the collet center position CC1.
There are various image processing methods for detecting the collet center position CC1. For example, the boundary line of the white circular image is detected from the contrast between the black background and the white circular image of the center holes 32 and 34. Then, the collet center position CC1 is detected by calculating the center position of the circle. As shown in FIG. 9, in the field of view 15, the collet center position CC1 is the intersection of the X-direction center line 37 and the Y-direction center line 38.

As shown in FIG. 9, there is a case where a misalignment occurs between the reference position C1 of the field of view 15 of the wafer side camera 12 and the collet center position CC1. The image processing unit 82 detects the deviation ΔX1 in the X direction and the deviation ΔY1 in the Y direction between the collet center position CC1 detected as shown in step S106 of FIG. 5 and the reference position C1 of the visual field 15 and outputs the deviation to the control unit 81. do. The control unit 81 stores the input deviations ΔX1 and ΔY1 in the storage unit.

Further, the image processing unit 82 recognizes the semiconductor die 36 to be picked up in the field of view 15 as shown in steps S107 and 9 of FIG. 5, and as shown in step S108 of FIG. 5, the semiconductor die 36 is recognized. The center position of 36 is detected as the chip center DC and output to the control unit 81. The control unit 81 stores the input chip center DC in the storage unit. To detect the chip center DC, for example, the image of the recognized semiconductor die 36 is processed to obtain the square contour line of the semiconductor die 36, the center line 36x in the X direction and the center line 36y in the Y direction are obtained, and the chip center DC is used as an intersection. May be detected.

The control unit 81 reads the chip center DC from the storage unit, and as shown in step S109 of FIG. 5, the chip center DC of the semiconductor die 36 to be picked up becomes the reference position C1 in the field of view 15 of the wafer side camera 12. The wafer ring 42 is moved by the wafer ring driving unit 41 in this way. As described above, the reference position C1 is set to the same position as the position of the pin center PC of the push-up pin 44. Therefore, by this operation, the chip center DC, the reference position C1 and the pin center PC can be set to the same position. can.

The control unit 81 reads each deviation ΔX1 and ΔY1 from the storage unit, corrects the position by the deviation ΔY1 as shown in step S110 of FIG. 5, and sets the collet center position CC1 in the field of view 15 of the wafer side camera 12. Align with the reference position C1 of. Specifically, as shown in FIG. 9, when the deviation in the Y direction between the collet center position CC1 and the reference position C1 is ΔY1, the control unit 81 moves the pickup head 20 toward the plus side in the Y direction. At this time, the pickup head 20 is moved to a position where the scale of the linear scale for detecting the Y-direction position of the pickup head 20 is larger than the scale corresponding to the reference position C1 by a deviation ΔY1. As a result, the deviation ΔY1 is corrected, and the Y-direction position of the collet 30 coincides with the reference position C1. Further, the deviation ΔX1 is corrected by moving the linear guide 14 in the X direction by the deviation ΔX1 by a linear guide drive mechanism (not shown).

By adjusting the positions of the wafer ring 42 and the collet 30 in this way, in the state shown in FIG. 10, the chip center DC, the reference position C1, the pin center PC, and the collet center position CC1 are at the same position as shown in FIG. Can be.

In this state, as shown in steps S111 and 12 of FIG. 5, the control unit 81 is lowered onto the semiconductor die 36 that picks up the collet 30 by the Z-direction drive mechanism of the main body 21 of the pickup head 20, and the semiconductor die 36 is lowered. The semiconductor die 36 is attracted to the surface of the wafer, and the push-up pin 44 is moved upward to push up the semiconductor die 36 from below, and the semiconductor die 36 is picked up from the wafer 35.

At this time, since the chip center DC, the reference position C1, the pin center PC, and the collet center position CC1 are at the same position, the center of the semiconductor die 36 is pushed up by the push-up pin 44, and the semiconductor die 36 is placed in the center of the collet body 33. Can be adsorbed. Therefore, the semiconductor die 36 can be accurately picked up from the wafer 35, and the deterioration of the mounting accuracy of the semiconductor die 36 on the substrate 74 can be suppressed.

Further, since the semiconductor die 36 can be picked up at the center of the collet main body 33, it is possible to prevent the tip of the collet main body 33 from being deformed by the collet main body 33 picking up the semiconductor die 36 in a biased manner.

In the electronic component mounting device 100 of the present embodiment, light is incident on the center holes 32 and 34 from the upper side of the collet 30 and the collet center position CC1 is detected by the reflected light from the wafer 35 immediately below the collet 30. The operation of detecting the deviation from step S104 to step S106 of step 5 can be performed during the operation of picking up the semiconductor die 36 from the wafer 35.

Therefore, since the deviation can be corrected and the pickup can be continued every time the pickup operation is performed several times, the semiconductor die 36 can be accurately picked up even if there is a change over time, and the substrate 74 can be picked up accurately. It is possible to effectively suppress a decrease in mounting accuracy of the semiconductor die 36 on the semiconductor die 36.

Further, the deviation may be detected and corrected each time the pickup is picked up, instead of every time the pickup is performed several times. In this case, the deviation ΔX1 in the X direction and the deviation ΔY1 in the Y direction detected by the image processing unit 82 are stored in the storage unit of the control unit 81, and in the subsequent mounting, the deviation stored in the storage unit is used. It can be corrected and picked up a predetermined number of times. In this case, it is possible to effectively suppress the decrease in the mounting accuracy of the semiconductor die 36 on the substrate 74 while suppressing the decrease in the bonding efficiency.

<Operation of mounting part>
Next, the operation of the mounting unit 102 will be described with reference to FIGS. 13 and 14 to 22.

As shown in steps S201 and 14 of FIG. 13, the control unit 81 operates a Y-direction drive mechanism arranged inside the main body 21 of the pickup head 20 to move the pickup head 20 to the lower side of the frame-side camera 63. Move. At this time, the control unit 81 moves the pickup head 20 so that the collet center position CC2 of the collet 30 coincides with the position of the optical axis 64 of the frame-side camera 63. Further, since the focus of the frame-side camera 63 is the surface of the substrate 74, the surface of the semiconductor die 36 adsorbed on the tip of the collet 30 is located at a position slightly separated from the surface of the substrate 74, for example, about 0.1 mm. The collet 30 is lowered so that the upper surface of the semiconductor die 36 is within the depth of focus of the frame-side camera 63. The collet 30 is lowered by driving in the Z direction arranged inside the main body 21 of the pickup head 20.

As shown in FIG. 15, the position of the optical axis 64 of the frame-side camera 63 is the reference position C2 indicated by the intersection of the center line 66 in the X direction and the center line 67 in the Y direction in the field of view 65 of the frame-side camera 63. It becomes. Further, in the field of view 65, the collet center position CC2 is an intersection of the center line 55x in the X direction and the center line 55y in the Y direction. When the collet center position CC2 coincides with the position of the optical axis 64 of the frame side camera 63, the collet center position CC2 coincides with the reference position C2. However, as shown in FIG. 15, the collet center position CC2 and the reference position C2 may be misaligned.

The control unit 81 lights the light source 27a provided on the pickup head 20 as described above. The light from the light source 27 enters the center holes 32 and 34 of the collet 30 and becomes a white image of the reflected light reflected on the surface of the wafer 35. As shown in FIG. 15, the periphery of the white image becomes a black background. The frame-side camera 63 captures a white image of the reflected light that emerges inside on a black background. The captured image is output to the image processing unit 82.

As shown in step S203 of FIG. 13, the image processing unit 82 processes the input image and detects the center positions of the center holes 32 and 34 of the collet 30 as the collet center positions CC2, as described above. ..

As shown in FIG. 15, there is a case where a misalignment occurs between the reference position C2 of the field of view 65 of the frame-side camera 63 and the collet center position CC2. The image processing unit 82 detects and controls the first deviation ΔX2 in the X direction and the first deviation ΔY2 in the Y direction between the collet center position CC2 detected as shown in step S204 of FIG. 13 and the reference position C2 of the visual field 65. Output to unit 81. The control unit 81 stores the input X-direction first deviation ΔX2 and Y-direction first deviation ΔY2 in the storage unit.

Further, as shown in FIG. 16, in the control unit 81, the reference position C2 of the field of view 65 of the frame-side camera 63 enters the field of view of the mounting position BC at the center of the mounting area 75 on which the semiconductor die 36 is mounted on the substrate 74. The frame side camera 63 is moved to such a position. The movement in the Y direction is performed by the Y direction drive mechanism arranged in the arm 62.

Then, as shown in step S205 of FIG. 13, the control unit 81 operates the frame-side camera 63 to take an image of the mounting area 75. The captured image is input to the image processing unit 82. As shown in step S206 of FIG. 13, the image processing unit 82 processes the acquired image, detects the mounting position BC at the center of the mounting area 75, and outputs the image to the control unit 81. The control unit 81 stores the input mounting position BC in the storage unit. In the image processing, for example, the recognized mounting area 75 image is processed to obtain the square outline of the mounting area 75, the center line 76 in the X direction and the center line 77 in the Y direction are obtained, and the mounting position BC is detected as the intersection. It may be.

As shown in FIG. 17, there is a case where a positional deviation occurs between the reference position C2 of the field of view 65 of the frame-side camera 63 and the mounting position BC. The image processing unit 82 detects the second deviation ΔX3 in the X direction and the second deviation ΔY3 in the Y direction between the mounted mounting position BC and the reference position C2 in the field of view 65 as shown in step S207 of FIG. 13, and is a control unit. Output to 81. The control unit 81 stores the input X-direction second deviation ΔX3 and the Y-direction second deviation ΔY3 in the storage unit.

The control unit 81 reads the second deviation ΔX3 in the X direction and the second deviation ΔY3 in the Y direction from the storage unit, and as shown in steps S208 and 18 of FIG. 13, the first deviation ΔY2 in the Y direction and the second deviation ΔY3 in the Y direction. 2 The position is corrected by the deviation ΔY3, the first deviation ΔX2 in the X direction and the second deviation ΔX3 in the X direction are corrected, and the collet center position CC2 is aligned with the mounting position BC. Specifically, when the control unit 81 moves the pickup head 20 toward the plus side in the Y direction, the linear scale scale for detecting the Y direction position of the pickup head 20 is larger than the scale corresponding to the mounting position BC. Also, the pickup head 20 is moved to a position where the sum of the first deviation ΔY2 in the Y direction and the second deviation ΔY3 in the Y direction is larger. Further, the control unit 81 corrects the deviation ΔX2 by moving the linear guide 14 in the X direction by a linear guide drive mechanism (not shown). As a result, the first deviation ΔY2 in the Y direction, the second deviation ΔY3 in the Y direction, the first deviation ΔX2 in the X direction, and the second deviation ΔX3 in the X direction are corrected, and the collet center position CC2 coincides with the mounting position BC.

As a result, the collet center position CC2 can be matched with the mounting position BC in a state where the chip center DC is attracted so as to coincide with the collet center position CC2 of the collet 30 as shown in FIG. The semiconductor die 36 can be mounted on the substrate 74 with the chip center DC aligned with the mounting position BC.

In step S209 of FIG. 13, the control unit 81 lowers the collet 30 as shown in FIG. 20 in the state shown in FIG. 19 to mount the semiconductor die 36 on the mounting region 75.

As shown in FIG. 21, when the substrate 74 after the mounting of the semiconductor die 36 is completed is imaged by the frame-side camera 63 from above, the semiconductor die 36 is exactly mounted in the mounting area 75 as shown in FIG. 22. ..

As described above, in the electronic component mounting device 100 of the present embodiment, it is possible to suppress a decrease in mounting accuracy of the semiconductor die 36 on the substrate 74 when there is a change over time.

The electronic component mounting device 100 of the present embodiment detects the collet center position CC2 by incident light into the center holes 32 and 34 from the upper side of the collet 30 and reflected light from the surface of the semiconductor die 36 adsorbed on the tip of the collet 30. The operation of detecting the first deviation from step S201 to step S204 of FIG. 13 and the operation of detecting the second deviation of steps S205 to S207 of FIG. 13 and correcting the first and second deviations are performed. This can be done during mounting of the semiconductor die 36.

For example, when the mounting unit 102 repeatedly picks up and mounts the semiconductor die 36, first starts mounting with the first deviation as a predetermined set value, and after mounting the semiconductor die 36 several times, the semiconductor die 36 is mounted. Immediately before mounting on the substrate 74, the first deviation is detected in a state where the surface of the semiconductor die 36 adsorbed on the tip of the collet 30 is lowered to a position slightly separated from the surface of the substrate 74, for example, about 0.1 mm. The result is stored in the storage unit of the control unit 81, and in the subsequent mounting, correction is performed using the first deviation stored in the storage unit, and mounting can be performed a predetermined number of times.

Similar to the detection of the first deviation, the detection of the second deviation is performed after the implementation is executed many times, and the result is stored in the storage unit of the control unit 81, and is stored in the storage unit in the subsequent implementation. Correction can be performed using the second deviation, and mounting can be performed a predetermined number of times.

Therefore, even if there is a change over time, the first deviation and the second deviation can be corrected and the mounting can be continued every time the mounting is performed several times, so that the reduction in bonding efficiency can be suppressed. However, it is possible to effectively suppress a decrease in mounting accuracy of the semiconductor die 36 on the substrate 74 when there is a change over time.

In the electronic component mounting device 100 of the present embodiment, the pickup head 20 that picks up and mounts the semiconductor die 36 is guided by a linear guide 14 extending between the pickup section 101 and the mounting section 102, and is guided in the X direction. The position of is adjusted by moving the linear guide 14 in the X direction. Therefore, when the mounting unit 102 adjusts the first deviation ΔX2 in the X direction and the second deviation ΔX3 in the X direction, the pickup unit 101 shifts between the collet center position CC1 in the X direction and the reference position C1 and the pin center PC. May occur. In this case, when returning from the mounting unit 102 to the pickup unit 101 and performing the pickup operation, the position of the collet 30 is corrected by using the difference between the deviation ΔX1 and the first deviation ΔX2 in the X direction or the second deviation ΔX3 in the X direction. You may try to do so.

Further, the first deviation and the second deviation may be detected and each deviation may be corrected each time the mounting is performed, instead of every several mountings. In this case, it is possible to more effectively suppress a decrease in mounting accuracy of the semiconductor die 36 on the substrate 74.

In the above description, the semiconductor die 36 is mounted on the substrate 74, but the present invention is not limited to this, and the electronic component mounting device 100 of the present embodiment has another semiconductor die 36 as a mounting object and another semiconductor. It can also be applied when the semiconductor die 36 is mounted on the die 36. In this case, an image of another semiconductor die 36 is imaged instead of the mounting area 75 of the substrate 74, the center position thereof is detected, and the second deviation between the mounting position BC and the reference position C2 of the frame side camera 63 is obtained. It should be detected.

<Other Embodiments>
Next, the electronic component mounting device 200 of another embodiment will be described with reference to FIGS. 23 and 24. FIG. 23 is a vertical cross-sectional view of the pickup unit 101 of the electronic component mounting device 200, and FIG. 24 is a vertical cross-sectional view of the mounting unit 102. The same parts as those of the electronic component mounting device 100 described above with reference to FIGS. 1 to 22 are designated by the same reference numerals, and the description thereof will be omitted.

The electronic component mounting device 100 is configured to incident light into the center holes 32 and 34 of the collet 30 by a light source 27 and a beam splitter 28 provided on the arm 23. Instead of this, in the electronic component mounting device 200, as shown in FIG. 23, ring illuminations 92 and 92a are arranged on the lower end side surfaces of the wafer side camera 12 and the frame side camera 63, and are centered on the upper end of the shaft 31 of the collet 30. A glass cover 91 that covers the hole 32 is attached, and the light from the ring illumination 92 is configured to enter the center holes 32 and 34 through the glass cover 91. The ring illuminations 92 and 92a and the glass cover 91 constitute a wafer-side illumination unit 93 and a frame-side illumination unit 93a.

The electronic component mounting device 200 has the same operation and effect as the electronic component mounting device 100.

Next, the electronic component mounting device 300 of another embodiment will be described with reference to FIGS. 25 to 27. The same parts as those of the electronic component mounting device 100 described above with reference to FIGS. 1 to 22 are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIGS. 25 and 26, the electronic component mounting device 300 includes an intermediate stage 48 on which the semiconductor die 36 picked up by the pickup head 20 by the pickup unit 101 is placed, and a semiconductor die mounted on the intermediate stage 48. It has a mounting head 50 that picks up the 36 and mounts the semiconductor die 36 on the mounting unit 102.

The configuration of the pickup head 20 is the same as that of the pickup head 20 of the electronic component mounting device 100 described with reference to FIG. In the electronic component mounting device 300 of the present embodiment, the pickup head 20 is guided by the linear guide 14 and moves in the X direction. Further, the linear guide 14 moves in the Y direction by a linear guide drive mechanism (not shown).

As shown in FIG. 27, the mounting head 50 includes a main body 51 guided by a linear guide 18 extending in the Y direction, a bracket 52 provided on the lower side of the main body 51, and an arm attached to the lower end of the bracket 22. It has a 53 and a mounting collet 55 attached to the positive end in the X direction of the arm 53. The linear guide 18 moves in the X direction by a linear guide drive mechanism (not shown).

The main body 51 includes a Y-direction drive mechanism for driving the mounting head 50 in the Y direction and an X-direction driving mechanism for driving the mounting collet 55 in the Z direction. The drive mechanism in the Y direction may be composed of, for example, a linear motor, and the drive mechanism in the Z direction may be composed of, for example, a voice coil motor. The mounting head 50 constitutes a mounting collet driving unit that drives the mounting collet 55 in the Y direction.

The mounting collet 55 is composed of a shaft 56 on the root side and a mounting collet body 58 on the tip side. The shaft 56 is made of metal, and the mounting collet body 58 is made of, for example, metal or ceramics. At the center of the shaft 56 and the mounting collet body 58, circular center holes 57 and 59 are provided coaxially. The upper end of the shaft 56 is attached to a portion provided with a recess 53a on the upper side of the arm 53, and the center hole 57 of the shaft 56 communicates with the recess 53a on the upper part of the arm 53 and moves upward from the recess 53a in the Z direction. It is open toward you. The center hole 59 of the mounting collet body 58 communicates with the center hole 57 of the shaft 56 and is opened from the lower end surface downward in the Z direction. A light source 27a and a beam splitter 28a are provided above the recess 53a at the top of the arm 53.

The beam splitter 28a is arranged directly above the center hole 57 of the shaft 56 of the mounting collet 55, reflects the light from the light source 27a, and is the center hole 57 of the shaft 56 and the center of the mounting collet body 58 from the root side of the mounting collet 55. It is incident into the hole 59. Further, the beam splitter 28a transmits the reflected light reflected by the surface of the semiconductor die 36 adsorbed on the tip of the mounting collet main body 58 of the mounting collet 55 toward the upper side in the Z direction, and causes the beam splitter 28a to enter the frame side camera 63. The light source 27a and the beam splitter 28a form a frame-side illumination unit 29a. Here, the light source 27a may be a high-intensity LED or a laser light source. Further, a half mirror may be used instead of the beam splitter 28a.

As shown in FIGS. 25 and 26, the intermediate stage 48 is guided by a linear guide 47, which is a long member arranged between the wafer ring 42 and the transport mechanism 73 and extending in the Y direction, and is Y by a drive mechanism (not shown). Move in the direction.

The operation of the pickup unit 101 of the electronic component mounting device 300 of the above-described embodiment is the same as the operation of the pickup unit 101 of the electronic component mounting device 100 described above except that the X direction and the Y direction are different. be. Further, the operation of the mounting head 50 of the mounting unit 102 is the same as the operation after the pickup head 20 of the electronic component mounting device 100 has moved to the mounting unit 102.

The electronic component mounting device 300 of the present embodiment has the same functions and effects as the electronic component mounting device 100.

Next, the electronic component mounting device 400 of another embodiment will be described with reference to FIG. 28. The electronic component mounting device 400 includes a back surface camera 85 that captures an image of a semiconductor die 36 adsorbed on the tip of a collet 30 between the pickup unit 101 and the mounting unit 102, and a strobe 86 that is a light source. The strobe 86 is connected to the image processing unit 82 and is turned on and off according to a command from the image processing unit 82. Further, the image captured by the back surface camera 85 is input to the image processing unit 82. Other than the above, it is the same as the electronic component mounting device 100 described with reference to FIGS. 1 to 22.

As shown in FIG. 28, the back surface camera 85 focuses on the back surface (lower surface in the Z direction) of the semiconductor die 36 that is attracted to the tip of the collet 30 when the collet 30 moves to a predetermined position directly above. It is arranged at a position where the semiconductor dies 36 are aligned with each other, and is adjusted so that a sharp image of the back surface of the semiconductor die 36 can be obtained. The strobe 86 includes a reflector 86a that directs the emitted light in the direction of the collet 30.

Hereinafter, in the electronic component mounting device 400, an operation of detecting the amount of misalignment of the semiconductor die 36 adsorbed on the tip of the collet 30 with respect to the collet 30 by the back surface camera 85 will be described.

While the control unit 81 moves the pickup head 20 from the pickup unit 101 to the mounting unit 102, as shown in FIG. 28, the collet 30 comes to a predetermined position directly above the back camera 85, and the back camera 85 When the central axis of the collet 30 is aligned with the center position of the lens, a trigger signal for causing the strobe 86 to emit light is output. This trigger signal is transmitted to the image processing unit 82.

When this trigger signal is input, the image processing unit 82 outputs a command to make the strobe 86 emit light. By this command, the strobe 86 emits light. Further, when the trigger signal is input, the image processing unit 82 takes in an image as shown in FIG. 29 from the back camera 85 in synchronization with the light emission of the strobe 86. The captured image is stored in the memory of the image processing unit 82. The image is captured while moving the collet 30 (without stopping the movement).

FIG. 29 is a diagram showing a field of view 87 of the back camera 85. As shown in FIG. 29, a circular image showing the tip of the collet 30 and a quadrangular image showing the outer shape of the semiconductor die 36 appear in the field of view 87 of the back camera 85. The image processing unit 82 processes the captured image to detect a circular image 191 showing the outer shape of the collet 30 and a square image 192 showing the outer shape of the semiconductor die 36. Then, the image processing unit 82 detects the position of the center 197 of the circular image 191 and the position of the center 198 of the square image 192, passes through the center 197 of the circular image 191 and goes toward the X direction of the field of view 87 of the back camera 85. A direction reference line 194 and a Y direction reference line 193 that passes through the center 197 of the circular image 191 and faces the Y direction of the field of view 87 of the back camera 85 are set. Further, the image processing unit 82 passes through the center 198 of the square image 192 and passes through the X-direction measurement line 196 parallel to the side close to the X-direction reference line 194 of the square image 192 and the center 198 of the square image 192, and Y of the square image 192. A Y-direction measurement line 195 parallel to the side close to the direction reference line 193 is set. Then, the image processing unit 82 obtains the deviation amounts ΔX4 and ΔY4 of the position of the center 197 of the circular image 191 and the position of the center 198 of the square image 192 in the X and Y directions, respectively. Further, the image processing unit 82 determines the square image 192 from the angle difference in the θ direction between the X direction reference line 194 and the X direction measurement line 196 or the angle difference in the θ direction between the Y direction reference line 193 and the Y direction measurement line 195. The rotation angle deviation Δθ4 in the θ direction is detected.

The image processing unit 82 outputs the detected deviation amounts ΔX4 and ΔY4 in the X direction and the Y direction, and the rotation angle deviation Δθ4 in the θ direction to the control unit 81. The control unit 81 stores the input ΔX4, ΔY4, Δθ4 in the storage unit.

As described above with reference to FIG. 18, the control unit 81 corrects the positions by the first deviation ΔY2 in the Y direction and the second deviation ΔY3 in the Y direction to align the collet center position CC2 with the mounting position BC, and adjusts the collet center position CC2 to the mounting position BC in the X direction. When adjusting the collet center position CC2 to the mounting position BC by correcting only the first deviation ΔX2 and the second deviation ΔX3 in the X direction, the displacement amounts of the semiconductor die 36 with respect to the collet 30 are taken into consideration, ΔX4, ΔY4, and Δθ4. Align the collet center position CC2 with the mounting position BC.

In the electronic component mounting device 400 of the embodiment described above, even if there is a deviation in the position of the semiconductor die 36 with respect to the collet 30, the deviation is corrected so that the chip center DC of the semiconductor die 36 is aligned with the mounting position BC. The semiconductor die 36 can be mounted on the substrate 74 in the state.

In the electronic component mounting device 400 described above, the pickup head 20 moves between the pickup section 101 and the mounting section 102, and the collet 30 picks up and mounts the semiconductor die 36. The configuration in which the back surface camera 85 and the strobe 86 are arranged between the pickup unit 101 and the mounting unit 102 to detect the amount of misalignment of the semiconductor die 36 with respect to the collet 30 is described above with reference to FIGS. 25 to 27. It can also be applied to the component mounting device 300. In this case, the image processing unit 82 sets the displacement amount ΔX4, ΔY4 of the semiconductor die 36 with respect to the mounting collet 55 based on the image of the tip of the mounting collet 55 captured by the back surface camera 85 and the image of the back surface of the semiconductor die 36. Δθ4 is detected and output to the control unit 81, and the control unit 81 mounts the collet by the mounting collet drive unit based on the first deviation ΔX2, ΔY2, the second deviation ΔX3, ΔY3, and the displacement amounts ΔX4, ΔY4, Δθ4. Adjust the horizontal position of 55.

10 base, 11 upper base, 12 wafer side camera, 13,64 optical axis, 14,18,47,61 linear guide, 15,65,87 field view, 16,17 reference line, 20 pickup head, 21,51 main body, 22,52 bracket, 23,53,62 arm, 23a, 53a recess, 24 rotation shaft, 25 protrusion, 26 spring, 27,27a light source, 28,28a beam splitter, 29,93 wafer side illumination unit, 29a, 93a Frame side lighting unit, 30 collets, 31,56 shafts, 32, 34, 57, 59 center holes, 33 collet bodies, 35 wafers, 36 semiconductor dies, 36x, 37, 55x, 76 X direction center lines, 36y, 38, 55y, 77 Y direction center line, 41 wafer ring drive unit, 42 wafer ring, 43 push-up unit, 44 push-up pin, 48 intermediate stage, 50 mounting head, 55 mounting collet, 58 mounting collet body, 63 frame side camera, 66, 67 Center line, 71 Pedestal, 72 Mounting stage, 73 Conveyance mechanism, 74 Board, 75 Mounting area, 80 Control device, 81 Control unit, 82 Image processing unit, 85 Backside camera, 86 Strobe, 86a reflector, 91 Glass cover, 92,92a Ring illumination, 100,200,300,400 Electronic component mounting device, 101 pickup part, 102 mounting part, 191 circular image, 192 square image, 193 Y direction reference line, 194 X direction reference line, 195 Y direction measurement Line, 196 X direction measurement line, 197,198 center, BC mounting position, C1, C2 reference position, CC1 collet center position, CC2 collet center position, DC chip center, PC pin center.

Claims (11)

Wafer ring to hold the wafer and
A collet that has a center hole and picks up electronic components from the wafer,
A collet drive unit that drives the collet in the horizontal direction,
A wafer-side lighting unit that injects light from the root side of the collet into the center hole of the collet, and
A wafer-side imaging device that captures an image of the collet from the root side of the collet, and
An image processing unit that processes the image captured by the wafer-side imaging device, and
An electronic component mounting device including a control unit for adjusting the position of the collet.
The wafer-side imaging device captures an image of reflected light incident on the center hole of the collet and reflected on the surface of the wafer immediately below the collet.
The image processing unit detects the center position of the center hole of the collet as the collet center position based on the image of the collet captured by the wafer-side imaging device and the image of the reflected light reflected on the surface of the wafer. The deviation between the detected center position of the collet and the reference position in the field of view of the wafer-side image pickup apparatus is detected.
The control unit moves the collet with respect to the wafer-side imaging device by the collet drive unit based on the deviation, and adjusts the horizontal position of the collet.
An electronic component mounting device characterized by. The electronic component mounting device according to claim 1.
Includes a push-up pin that pushes up the electronic components picked up by the collet from underneath the wafer.
The wafer-side imaging device captures an image of the push-up pin from above and obtains an image of the push-up pin.
The image processing unit
The center position of the push-up pin is detected as a pin center based on the image of the push-up pin captured by the wafer-side imaging device.
Setting the detected pin center at a reference position in the field of view of the wafer-side imaging device,
An electronic component mounting device characterized by. The electronic component mounting device according to claim 2.
A wafer ring drive unit that drives the wafer ring in the horizontal direction is included.
The wafer-side imaging device images an electronic component picked up by the collet from above the wafer.
The image processing unit
The center position of the electronic component picked up by the collet is detected as a chip center based on the image of the electronic component picked up by the collet captured by the wafer-side imaging device.
The control unit adjusts the horizontal position of the wafer ring by the wafer ring drive unit so that the chip center becomes a reference position in the field of view of the wafer-side imaging device.
An electronic component mounting device characterized by. The electronic component mounting device according to any one of claims 1 to 3.
A frame-side lighting unit that allows light to enter the center hole of the collet from the root side of the collet,
A frame-side imaging device that captures an image of the collet from the root side of the collet, and the like.
The collet mounts an electronic component adsorbed on the tip on the object to be mounted, and then mounts the electronic component on the object to be mounted.
The image processing unit processes the image captured by the frame-side image pickup apparatus and processes the image.
The frame-side imaging device captures an image of reflected light incident on the center hole of the collet and reflected on the surface of the electronic component adsorbed on the tip of the collet in a state where the electronic component is adsorbed on the tip of the collet. Take an image and
The image processing unit detects the center position of the center hole of the collet as the collet center position based on the image of the reflected light reflected on the surface of the electronic component adsorbed on the tip of the collet imaged by the frame-side imaging device. Then, the first deviation between the detected center position of the collet and the reference position in the field of view of the frame-side image pickup apparatus is detected.
The control unit adjusts the horizontal position of the collet by the collet drive unit based on the first deviation.
An electronic component mounting device characterized by. The electronic component mounting device according to claim 4.
The frame-side image pickup apparatus captures an image of the mounting object and obtains an image.
The image processing unit detects a mounting position for mounting the electronic component based on an image of the mounting object captured by the frame-side image pickup device, and within the field of view of the detected mounting position and the frame-side image pickup device. Detects the second deviation from the reference position of
The control unit
Adjusting the horizontal position of the collet by the collet drive unit based on the first deviation and the second deviation.
An electronic component mounting device characterized by. The electronic component mounting device according to claim 5.
It is arranged between a pickup unit that picks up the electronic component from the wafer and a mounting unit that mounts the picked up electronic component on the mounting object, and is attracted to the image of the tip of the collet and the tip of the collet. A backside camera that captures an image of the backside of the electronic component is provided.
The image processing unit detects the amount of misalignment of the electronic component with respect to the collet based on the image of the tip of the collet captured by the back camera and the image of the back surface of the electronic component.
The control unit
Adjusting the horizontal position of the collet by the collet drive unit based on the first deviation, the second deviation, and the amount of misalignment of the electronic component with respect to the collet.
An electronic component mounting device characterized by. The electronic component mounting device according to any one of claims 1 to 3.
A mounting collet that has a center hole and mounts electronic components that are attracted to the tip on the mounting target.
A mounting collet drive unit that drives the mounting collet in the horizontal direction,
A frame-side illumination unit that allows light to enter the center hole of the mounting collet from the root side of the mounting collet, and
Includes a frame-side imaging device that captures an image of the mounting collet from the root side of the mounting collet.
The image processing unit processes the image captured by the frame-side image pickup apparatus and processes the image.
The control unit adjusts the position of the mounting collet and adjusts the position of the mounting collet.
The frame-side image pickup device has the electronic component adsorbed on the tip of the mounting collet, and the reflected light incident on the center hole of the mounting collet and reflected on the surface of the electronic component adsorbed on the tip of the mounting collet. I took an image of
The image processing unit determines the center position of the center hole of the mounting collet based on the image of the reflected light reflected on the surface of the electronic component adsorbed on the tip of the mounting collet imaged by the frame-side imaging device. Detected as the center position, the first deviation between the detected center position of the mounting collet and the reference position in the field of view of the frame-side image pickup device is detected.
The control unit adjusts the horizontal position of the mounting collet by the mounting collet driving unit based on the first deviation.
An electronic component mounting device characterized by. The electronic component mounting device according to claim 7.
The frame-side image pickup apparatus captures an image of the mounting object and obtains an image.
The image processing unit detects a mounting position for mounting the electronic component based on an image of the mounting object captured by the frame-side image pickup device, and within the field of view of the detected mounting position and the frame-side image pickup device. Detects the second deviation from the reference position of
The control unit
Adjusting the horizontal position of the mounting collet by the mounting collet drive unit based on the first deviation and the second deviation.
An electronic component mounting device characterized by. The electronic component mounting device according to claim 8.
It is arranged between the pickup unit that picks up the electronic component from the wafer and the mounting unit that mounts the picked up electronic component on the mounting object, and attracts the image of the tip of the mounting collet and the tip of the mounting collet. A back surface camera that captures an image of the back surface of the electronic component is provided.
The image processing unit detects the amount of misalignment of the electronic component with respect to the mounting collet based on the image of the tip of the mounting collet captured by the back surface camera and the image of the back surface of the electronic component.
The control unit
Adjusting the horizontal position of the mounting collet by the mounting collet drive unit based on the first deviation, the second deviation, and the amount of misalignment of the electronic component with respect to the mounting collet.
An electronic component mounting device characterized by. A mounting collet that has a center hole and mounts electronic components that are attracted to the tip on the mounting target.
A mounting collet drive unit that drives the mounting collet in the horizontal direction,
A frame-side illumination unit that allows light to enter the center hole of the mounting collet from the root side of the mounting collet, and
A frame-side imaging device that captures an image of the mounting collet from the root side of the mounting collet, and
An image processing unit that processes the image captured by the frame-side image pickup device, and
An electronic component mounting device including a control unit for adjusting the position of the mounting collet.
The frame-side image pickup device has the electronic component adsorbed on the tip of the mounting collet, and the reflected light incident on the center hole of the mounting collet and reflected on the surface of the electronic component adsorbed on the tip of the mounting collet. I took an image of
The image processing unit determines the center position of the center hole of the mounting collet based on the image of the reflected light reflected on the surface of the electronic component adsorbed on the tip of the mounting collet imaged by the frame-side imaging device. Detected as a position, the first deviation between the detected center position of the mounting collet and the reference position in the field of view of the frame-side image pickup device is detected.
The control unit adjusts the horizontal position of the mounting collet by the mounting collet driving unit based on the first deviation.
An electronic component mounting device characterized by. The electronic component mounting device according to claim 9.
The frame-side image pickup apparatus captures an image of the mounting object and obtains an image.
The image processing unit detects the mounting position on which the electronic component is mounted based on the image of the mounting object captured by the frame-side imaging device, and the detected mounting position and the field of view of the frame-side imaging device. Detecting the second deviation from the reference position inside,
The control unit
Adjusting the position of the mounting collet by the mounting collet drive unit based on the first deviation and the second deviation.
An electronic component mounting device characterized by.

Images