JP6940982B2 - Power supply - Google Patents

Description

The present invention relates to a power supply device having a heat sink.

Conventionally, it has been known that an electronic element is placed on a heat sink in order to efficiently release heat from an electronic element such as a switching element having high heat generation. Generally, the heat sink has a flat surface, and an electronic element such as a switching element is provided on the flat surface (Patent Document 1). In general, a heat sink is expected to dissipate heat uniformly and efficiently, and has a uniform heat dissipation structure.

Japanese Patent Application Laid-Open No. 2002-120739

The present invention provides a power supply device capable of determining the shape of a heat sink in consideration of the amount of heat generated by an electronic element contained in a power module and efficiently dissipating heat.

The power supply device according to the present invention
With a heat sink
A power module arranged on one side of the heat sink and containing a plurality of electronic elements,
With
The heat sink has a protrusion protruding to the other side and has a protrusion.
A part of the power module is arranged in the area on one side of the protrusion.
The total calorific value of the electronic device located in the region on one side of the protrusion may be larger than the total calorific value of the electronic device not located in the region on one side.

In the power supply device according to the present invention
The number of switching elements arranged in the one-sided region may be larger than the number of switching elements not arranged in the one-sided region.

In the power supply device according to the present invention
The power module is provided on the proximal substrate, the proximal electronic element provided on the proximal substrate, the distal substrate arranged on the side opposite to the heat sink from the proximal electronic element, and the distal substrate. With a distal electronic element,
The total calorific value of the proximal electronic device may be larger than the total calorific value of the distal electronic device.

The power supply device according to the present invention
Further equipped with a current module electrically connected to the power module,
The heat sink has a recess adjacent to the protrusion.
At least a part of the current module may be provided in the recess.

The power supply device according to the present invention
A heat radiating unit arranged on one side of the power module may be further provided.

In the present invention, the heat sink has a protruding portion protruding to the other side. This protrusion is provided corresponding to an electronic element that generates a large amount of heat among the electronic elements included in the power module. Therefore, it is possible to efficiently dissipate heat from a large portion of heat generated from the electronic element.

FIG. 1 is a side view showing a power supply device according to the first embodiment of the present invention. FIG. 2 is a plan view showing the relationship between the power module and the protruding portion that can be used in the first embodiment of the present invention. FIG. 3 is a cross-sectional view of a power module, a heat radiating portion, and a heat sink that can be used in the first embodiment of the present invention. FIG. 4 is a plan view of the first heat sink and current module that can be used in the embodiment of the present invention. FIG. 5 is a view of a part of the power supply device shown in FIG. 1 as viewed from the side opposite to the rotary drive unit (left side of FIG. 1). FIG. 6 is a side view showing a power supply device according to a modified example of the first embodiment of the present invention. FIG. 7 is a side view showing a power supply device according to a second embodiment of the present invention. FIG. 8 is a side view showing a power supply device and a rotary drive unit according to a second embodiment of the present invention. 9 (a) is a plan view of the first heat sink and the first current module that can be used in the second embodiment of the present invention, and FIG. 9 (b) is the second embodiment of the present invention. It is a top view of the 2nd heat sink and the 2nd current module which can be used in. FIG. 10 (a) is a cross-sectional view of the first power module, the first heat radiating unit, and the first heat sink that can be used in the present embodiment, and FIG. It is sectional drawing of the 2 power module, the 2nd heat dissipation part and the 2nd heat sink. FIG. 11 is a view of the power supply device shown in FIG. 7 as viewed from the rotary drive unit side (right side of FIG. 7).

First Embodiment << Configuration >>
In the present embodiment, the "one side" means the upper side of FIG. 1, and the "other side" means the lower side of FIG. Further, the vertical direction of FIG. 1 (the direction from the other to one and the direction from one to the other) is defined as the "first direction", the left-right direction of FIG. 1 is defined as the "second direction", and the front and back directions of the paper surface of FIG. 1 are defined. Let it be the "third direction".

The power supply device of this embodiment may be used, for example, in an electric power steering device (EPS). The power supply device may have a power unit to which a drive current for driving a rotary drive unit such as a motor is energized, and a control unit for controlling the rotary drive unit such as a motor. The power unit may include a current module 610 and a power module 530, which will be described later. Further, the control unit may have a control board 630 described later.

The power supply device of the present embodiment may include a heat sink 510 and a power module 530 arranged on one surface of the heat sink 510 and including a plurality of electronic elements 538. The heat sink 510 has a protrusion 511 protruding to the other side, and a part of the power module 530 may be arranged in a region on one side of the protrusion 511. The total calorific value of the electronic device 538 located in the region on one side corresponding to the protrusion 511 (hereinafter, also referred to as “high heat dissipation region”) is the electronic device 538 outside the high heat dissipation region that is not positioned in the high heat dissipation region. It may be larger than the total calorific value of (see FIG. 2).

Further, the number of switching elements arranged in the high heat dissipation region may be larger than the number of switching elements not arranged in the high heat dissipation region.

The power module 530 is provided on the proximal substrate, the proximal electronic element provided on the proximal substrate, the distal substrate arranged on the side opposite to the heat sink 510 from the proximal electronic element, and the distal substrate. It may have a distal electronic element (see FIG. 3). The total calorific value of the proximal electronic device may be greater than the total calorific value of the distal electronic device. In the present embodiment, the proximal substrate is referred to as a heat sink side substrate 532a, the proximal electronic element is referred to as a heat sink side electronic element 536, the distal substrate is referred to as a heat sink side substrate 532b, and the distal electronic element dissipates heat. It is called a local electronic element 537.

Further, as shown in FIG. 1, a current module 610 electrically connected to the power module 530 may be provided. The heat sink 510 may have a recess 516 adjacent to the protrusion 511. At least a part of the current module 610 may be provided in the recess 516.

A control board 630 that is electrically connected to the power module 530 and controls the power module 530 may be arranged on one side of the power module 530.

A heat radiating unit 550 may be arranged between the power module 530 and the control board 630. More specifically, the heat radiating unit 550 may be provided on one side of the power module 530 and on the other side of the control board 630. The heat radiating unit 550 may have a plate shape, and the heat radiating unit 550 may be composed of a heat radiating plate.

The power module 530 may have a module terminal 531 extending to the control board 630 side and the current module 610 side and electrically connected to the control board 630 and the current module 610.

As shown in FIG. 5, the current module 610 may have a current board 611 and a current device 615 provided on one side and the other side of the current board 611.

As shown in FIG. 1, the current module 610 may be fixed to the control board 630 by a current module fixing member 619 such as a claw member. In the embodiment shown in FIG. 1, another current module fixing member 619 may be provided on the back surface side of the paper surface (see FIG. 5). In this case, the control board 630 is sandwiched between the pair of current module fixing members 619, so that the current module fixing member 619 is fixed to the control board 630.

The current substrate 611 shown in FIG. 4 may be made of a low thermal conductive material. As the low thermal conductivity material, for example, polybutylene terephthalate resin (PBT resin), PA (polyamide), PPS (polyphenylene sulfide) and the like can be used.

On the side (third direction), the heat sink 510 may be exposed. More specifically, a mode in which no control board is provided on the front surface and the back surface side of the paper surface of FIG. 1 of the heat sink 510 may be adopted.

As shown in FIG. 4, the other end (for example, a flat surface) of the protrusion 511 may have a notch 511a. In this case, the current device 615 may be provided in the notch 511a. In the embodiment shown in FIG. 4, the protruding portion 511 has a notch 511a, and a current device 615 such as a choke coil is provided in the notch 511a.

The current device 615 may include a capacitor, a power connector, and the like in addition to the choke coil described above. The capacitors may be arranged so as to extend along the second direction, for example (see FIGS. 4 and 5).

As shown in FIG. 1, the control board 630 may have one or more control elements 635 on the other side. Then, the control element 635 and the heat radiating unit 550 may come into contact with each other, and the heat generated from the control element 635 may be dissipated by the heat radiating unit 550. The control board 630 may have a plurality of control elements 635 on one side.

The mode in which the heat sink 510 and the power module 530 come into contact with each other includes a mode in which a third member or a third material such as a heat radiating sheet, a heat radiating insulation sheet, a heat radiating grease, and a heat radiating insulating grease is interposed. Similarly, in the mode in which the heat radiating unit 550 and the power module 530 are in contact with each other, there is also a mode in which a third member or a third material such as a heat radiating sheet, an insulating sheet, a heat radiating insulating sheet, a heat radiating grease, or a heat radiating insulating grease is interposed. include.

As shown in FIG. 1, the current module 610 may be electrically connected to the power module 530 via the module terminal 531 and electrically connected to the control board 630 via the current terminal 616.

The power module 530 shown in FIG. 3 includes a heat sink side substrate 532a, a heat sink side conductor layer 533a provided on the heat sink side substrate 532a, a heat sink side substrate 532b, and a heat sink side conductor provided on the heat sink side substrate 532b. It has a layer 533b and a connecting body 539 provided between the heat sink side electronic element 536 and the heat sink side electronic element 537. The mode is not limited to that shown in FIG. 3, for example, the heat-dissipating portion-side conductor layer 533b is provided on the upper side of FIG. 3 of the connecting body 539, and the heat-dissipating portion-side electronic element 537 is provided on the upper side of FIG. May be adopted.

The embodiment shown in FIG. 1 is merely an example. For example, as shown in FIG. 6, the current module 610 may not be provided, or the heat radiating unit 550 and the control board 630 may not be provided.

《Action / Effect》
Next, an example of the action / effect according to the present embodiment having the above-described configuration will be described. In addition, all aspects described in "Action / Effect" can be adopted in the above configuration.

In the present embodiment, the power module 530 has a plurality of electronic elements 538, and the total heat generation amount of the electronic element 538 positioned in the high heat dissipation region corresponding to the protrusion 511 is the electronic element 538 outside the high heat dissipation region. When the mode in which the heat generation amount is larger than the total heat generation amount of the above is adopted, it is possible to improve the heat dissipation efficiency in the place where the heat generation is large in the power module 530, and it is advantageous in that the heat dissipation can be balanced.

As an example, since the heat generation of the switching element is large, the number of switching elements positioned in the high heat dissipation region corresponding to the protrusion 511 may be larger than the number of switching elements outside the high heat dissipation region.

As shown in FIG. 1, when the mode of cooling the power module 530 by using both the heat sink 510 and the heat radiating unit 550 is adopted, it is advantageous in that a high cooling effect can be realized for the power module 530.

According to the embodiment in which both the heat sink 510 and the heat radiating unit 550 are used, heat radiating by the heat sink 510 is performed more effectively than heat radiating by the heat radiating unit (particularly the heat radiating plate) 50. Therefore, when the power module 530 has the heat sink side electronic element 536 as shown in FIG. 3, the total heat generation amount by the heat sink side electronic element 536 is larger than the total heat generation amount by the heat sink side electronic element 537. It is conceivable to adopt. In this case, it is advantageous in that the heat generated in the power module 530 can be efficiently dissipated.

As shown in FIG. 1, when a member such as the current module 610 is arranged in the recess 16 of the heat sink 510, the radial direction orthogonal to the longitudinal direction (the surface direction including the first direction and the third direction) is adopted. It is possible to prevent the size from becoming large. In the embodiment shown in FIG. 1, the current module 610 is arranged in the recess 16, but the present invention is not limited to this, and another member may be arranged in the recess 16.

When the current substrate 611 adopts an embodiment made of a low thermal conductive material, it is advantageous in that the heat generated by the current device 615 provided on the other side of the current substrate 611 can be cut off by the current substrate 11.

In particular, when a part of the current module 610 is provided in the recess 16, and the current substrate 611 adopts an embodiment made of a low thermal conductive material, the current device provided on the other side of the current substrate 611. It is advantageous in that the heat generated by the 615 can be reduced from being transmitted to the heat sink 510, and thus the power module 530 can be efficiently cooled.

As shown in FIG. 4, when the protrusion 511 has the notch 511a and the current device 615 is provided in the notch 511a, the size in the longitudinal direction (second direction) becomes large. It is advantageous in that the current device 615 can be arranged while suppressing the above.

As shown in FIG. 1, when a mode is adopted in which a control board 630 that is electrically connected to the power module 530 and controls the power module 530 is provided on one side of the power module 530, the power module 530 It is advantageous in that the control board 630 can be positioned at a close position and is less susceptible to noise and the like.

In particular, when a heat sink is used as the heat sink 550, the control board 630 can be positioned relatively close to the power module 530, so that noise generation can be further suppressed and the size in the radial direction can be further suppressed. Can also be made smaller.

When the power module 530 has a module terminal 531 extending toward the control board 630 and connected to the control board 630, the thickness of the heat sink is larger than the length of the module terminal 531 in the first direction. become thinner.

The power module 530 does not have to have a stack structure as shown in FIG. On the other hand, when the power module 530 has a stack structure, each of the electronic elements 538 may be a heat sink side electronic element 536 or a heat radiating part side electronic element 537.

As shown in FIG. 1, when the aspect in which the heat sink 510 is exposed on the side surface (third direction) is adopted, it is advantageous in that the size in the radial direction (particularly the size in the third direction) can be reduced. Is. Further, by exposing the side surface in this way, it is also advantageous in that the heat dissipation efficiency of the heat sink 510 and the heat radiating unit 550 can be improved.

Second Embodiment Next, a second embodiment of the present invention will be described.

In the first embodiment, the embodiment in which one heat sink 510 is provided has been described, but the present invention is not limited to this. In the second embodiment, the embodiment in which the two heat sinks 10 and 20 are provided facing each other will be described.

The power supply device of this embodiment may also be used for, for example, an electric power steering device (EPS). The power supply device may include a power unit to which a drive current for driving a rotary drive unit 400 (see FIG. 8) such as a motor is energized, and a control unit for controlling the rotary drive unit 400 such as a motor. The power unit may include a first current module 110 and a second current module 120, which will be described later, and a first power module 30 and a second power module 40. Further, the control unit may have a first control board 130 and a second control board 140, which will be described later.

As shown in FIG. 7, the power supply device of this embodiment may have a first assembly and a second assembly. The first assembly is arranged on one side of a first heat sink 10 having a first recess 16 on the other side, a first power module 30 arranged on one side of the first heat sink 10, and a first power module 30. , A first control board 130 that is electrically connected to the first power module 30 and controls the first power module 30 may be provided. The second assembly is arranged on the other side of the second heat sink 20, the second heat sink 20 having the second recess 26 on one side, the second power module 40 arranged on the other side of the second heat sink 20, and the second power module 40. , A second control board 140 that is electrically connected to the second power module 40 and controls the second power module 40 may be provided.

The first assembly may have a first current module 110 that is at least partially located in the first recess 16 and is electrically connected to the first power module 30. The second assembly may have a second current module 120 that is at least partially located in the second recess 26 and is electrically connected to the second power module 40.

The first heat radiating unit 50 may be arranged between the first power module 30 and the first control board 130. More specifically, the first heat radiating unit 50 may be provided on one side of the first power module 30 and on the other side of the first control board 130. Further, the second heat radiating unit 60 may be arranged between the second power module 40 and the second control board 140. More specifically, the second heat radiating unit 60 may be provided on the other side of the second power module 40 and on one side of the second control board 140. The first heat radiating unit 50 and the second heat radiating unit 60 may have a plate shape, the first heat radiating unit 50 may be composed of the first heat radiating plate, and the second heat radiating unit 60 may be composed of the second heat radiating plate. ..

As shown in FIG. 7, the other side of the first heat sink 10 and one side of the second heat sink 20 may be arranged so as to face each other. On the right side of FIG. 7 of the first heat sink 10 and the second heat sink 20, a rotary drive unit 400 such as a motor used in a vehicle such as an automobile or a two-wheeled vehicle may be arranged (see FIG. 8). Then, a position detection board 150 for acquiring information regarding the rotation position of the rotation drive unit 400 may be provided on the rotation drive unit 400 side (right side of FIG. 7) of the first heat sink 10 and the second heat sink 20.

The first heat sink 10 may have a first protruding portion 11 protruding to the other side, and the second heat sink 20 may have a second protruding portion 21 protruding to one side. The other side surface of the first protruding portion 11 may be a flat surface, and the one side surface of the second protruding portion 21 may be a flat surface. The flat surface on the other side of the first protruding portion 11 and the flat surface on one side of the second protruding portion may come into contact with each other.

As shown in FIG. 7, a part of the first power module 30 is provided on one side of the first protrusion 11 (see FIG. 9A), and the second power is provided on the other side of the second protrusion 21. A part of the module 40 may be provided (see FIG. 9B).

As shown in FIG. 7, the first power module 30 extends toward the first control board 130 side and the first current module 110 side, and is electrically connected to the first control board 130 and the first current module 110. It may have a module terminal 31. Even if the second power module 40 has a second module terminal 41 extending to the second control board 140 side and the second current module 120 side and electrically connected to the second control board 140 and the second current module 120. good.

As shown in FIG. 7, the first control board 130 and the position detection board 150 are arranged adjacent to each other at the end of the first control board 130 on the rotation drive unit 400 side, and the second control board 140 and the position detection board 150 are arranged adjacent to each other. May be arranged adjacent to each other at the end of the second control board 140 on the rotation drive unit 400 side. Here, "adjacent" means a mode in which they are arranged without a gap or a mode in which they are arranged with a gap of a certain distance or less (for example, 1 cm or less or several millimeters or less). In the embodiment shown in FIG. 7, the peripheral edge portion of the position detection substrate 150 in the radial direction is located adjacent to the end portion of the first control substrate 130 and the second control substrate 140 on the rotation drive unit 400 side. ..

The position detection substrate 150 may have the position detection element 151 at the center position in the surface direction (paper direction in FIG. 11). The position detection element 151 can detect the rotation position of the rotation drive unit 400 such as a motor.

The first control board 130 and the second control board 140 may be fixed to the position detection board 150 at the end portion (right end portion in FIG. 7) on the rotation drive unit 400 side. More specifically, by inserting the first control fixing portion 139 of the first control board 130 into the fixing hole 159 (see FIG. 11) provided in the position detection board 150, the first control board 130 is inserted into the position detection board. The second control board 140 is fixed to the 150, and the second control board 140 is positioned by inserting the second control fixing portion 149 of the second control board 140 into the fixing hole 159 (see FIG. 11) provided in the position detection board 150. It may be fixed to the substrate 150. Further, a fastening hole 153 for inserting a fastening member such as a screw is provided in the position detecting main body plate 154, and the fastening member is inserted into the fastening hole 153 so that the position detecting main body plate 154 becomes a heat sink 10, 20. It may be fixed to.

As shown in FIG. 7, the first current module 110 may be fixed to the first control board 130 by a first current module fixing member 119 such as a claw member. Similarly, the second current module 120 may be fixed to the second control board 140 by a second current module fixing member 129 such as a claw member. In the embodiment shown in FIG. 7, another first current module fixing member 119 may be provided on the back surface side of the paper surface. In this case, the first control board 130 is sandwiched between the pair of first current module fixing members 119, so that the first current module fixing member 119 is fixed to the first control board 130. Similarly, in the embodiment shown in FIG. 7, another second current module fixing member 129 may be provided on the back surface side of the paper surface. In this case, the second control board 140 is sandwiched between the pair of second current module fixing members 129, so that the second current module fixing member 129 is fixed to the second control board 140.

The first heat sink 10 has a first extending portion 12 on the side opposite to the rotation driving portion 400 side (left side in FIG. 7) of the first protruding portion 11, and the second heat sink 20 rotates the second protruding portion 21. The second extending portion 22 may be provided on the side opposite to the driving portion 400 side. The other side surface of the first extending portion 12 may be a flat surface, and the one side surface of the second extending portion 22 may be a flat surface. The flat surface on the other side of the first extending portion 12 and the flat surface on one side of the second extending portion 22 may come into contact with each other. A fastening hole for inserting a fastening member 15 such as a screw may be provided in the first extending portion 12 and the second extending portion 22, and by inserting the fastening member 15 into the fastening hole, the first extending portion 12 and the second extending portion 22 may be provided. One heat sink 10 may be fixed to the second heat sink 20. FIG. 7 shows the fastening member 15 inserted into the first extending portion 12, but on the back side of the paper surface of FIG. 7, the fastening member is inserted into the second extending portion 22.

As shown in FIG. 7, the first control board 130 may have one or more first control elements 135 on the other side. Then, the first control element 135 and the first heat radiating unit 50 may come into contact with each other, and the heat generated from the first control element 135 may be dissipated by the first heat radiating unit 50. The second control board 140 may have one or more second control elements 145 on one side. The second control element 145 and the second heat radiating unit 60 may come into contact with each other, and the heat generated from the second control element 145 may be dissipated by the second heat radiating unit 60.

As shown in FIG. 7, the first current module 110 is electrically connected to the first power module 30 via the first module terminal 31, and is electrically connected to the first control board 130 via the first current terminal 116. May be connected to. The second current module 120 may be electrically connected to the second power module 40 via the second module terminal 41, and may be electrically connected to the second control board 140 via the second current terminal 126.

As shown in FIG. 10A, the first power module 30 may have a stack structure having electronic elements such as laminated semiconductor elements. That is, the first power module 30 may have a first heat sink side electronic element 36 and a first heat sink side electronic element 37 arranged on one side of the first heat sink side electronic element 36. As shown in FIG. 10B, the second power module 40 may also have a stack structure having electronic elements such as laminated semiconductor elements. That is, the second power module 40 may have a second heat sink side electronic element 46 and a second heat sink side electronic element 47 arranged on the other side of the second heat sink side electronic element 46. When such an aspect is adopted, the total heat generation amount by the first heat sink side electronic element 36 may be larger than the total heat generation amount by the first heat dissipation portion side electronic element 37. Further, the total heat generation amount by the second heat sink side electronic element 46 may be larger than the total heat generation amount by the second heat dissipation portion side electronic element 47.

The first power module 30 shown in FIG. 10A includes a first heat sink side substrate 32a, a first heat sink side conductor layer 33a provided on the first heat sink side substrate 32a, and a first heat sink side substrate 32b. The first heat-dissipating portion-side conductor layer 33b provided on the first heat-dissipating portion-side substrate 32b and the first connector 39 provided between the first heat-sink-side electronic element 36 and the first heat-dissipating portion-side electronic element 37 are formed. Have. The mode is not limited to that shown in FIG. 10 (a). For example, the first heat radiation portion side conductor layer 33b is provided on the upper side of FIG. 10 (a) of the first connector 39, and the first heat radiation portion side conductor layer is provided. An embodiment in which the first heat radiation portion side electronic element 37 is provided on the upper side of FIG. 10A of 33b may be adopted. The second power module 40 shown in FIG. 10B includes a second heat sink side substrate 42a, a second heat sink side conductor layer 43a provided on the second heat sink side substrate 42a, a second heat sink side substrate 42b, and the second heat sink side substrate 42b. The second heat-dissipating portion-side conductor layer 43b provided on the second heat-dissipating portion-side substrate 42b and the second connector 49 provided between the second heat-sink-side electronic element 46 and the second heat-dissipating portion-side electronic element 47 are formed. Have. The mode is not limited to that shown in FIG. 10 (b). For example, the second heat radiating portion side conductor layer 43b is provided on the lower side of FIG. 10 (b) of the second connecting body 49, and the second heat radiating portion side conductor is provided. An embodiment in which the second heat radiating portion side electronic element 47 is provided on the lower side of the layer 43b in FIG. 10B may be adopted.

The first power module 30 has a plurality of first electronic elements 38, and the total heat generation amount of the first electronic element 38 positioned in the high heat dissipation region corresponding to the first protrusion 11 is the third outside the high heat dissipation region. When an embodiment larger than the total heat generation amount of the one electronic element 38 is adopted, it is possible to improve the heat dissipation efficiency in the place where the heat generation is large in the first power module 30, and it is advantageous in that heat can be dissipated in a well-balanced manner. be. Similarly, the second power module 40 has a plurality of second electronic elements 48, and the total heat generation amount of the second electronic element 48 positioned in the high heat dissipation region corresponding to the second protrusion 21 is the high heat dissipation region. When an aspect that is larger than the total heat generation amount of the outer second electronic element 48 is adopted, the heat dissipation efficiency can be improved in the place where the heat generation is large in the second power module 40, and by extension, the heat can be radiated in a well-balanced manner. Is beneficial.

As shown in FIG. 7, according to the embodiment in which both the heat sinks 10 and 20 and the heat radiating parts 50 and 60 are used, the heat radiated by the heat sinks 10 and 20 is more dissipated than the heat radiated by the heat radiating parts (particularly the heat radiating plates) 50 and 60. It is done effectively. Therefore, when the first power module 30 has the first heat sink side electronic element 36 and the first heat sink side electronic element 37 as shown in FIG. 9A, the total of the first heat sink side electronic element 36 is used. It is conceivable to adopt a mode in which the amount of heat generated is larger than the total amount of heat generated by the electronic element 37 on the first heat dissipation portion side. In this case, it is advantageous in that the heat generated in the first power module 30 can be efficiently dissipated. Similarly, when the second power module 40 has the second heat sink side electronic element 46 and the second heat sink side electronic element 47 as shown in FIG. 9B, the total of the second heat sink side electronic element 46 is used. It is conceivable to adopt a mode in which the amount of heat generated is larger than the total amount of heat generated by the electronic element 47 on the second heat radiating portion side. In this case, it is advantageous in that the heat generated in the second power module 40 can be efficiently dissipated.

The description of each embodiment and the disclosure of the drawings described above are merely examples for explaining the invention described in the claims, and are described in the claims by the description of the above-described embodiments or disclosure of the drawings. The invention is not limited. Further, the description of the claims at the time of filing is only an example, and the description of the claims may be changed as appropriate based on the description of the description, drawings and the like.

10 First heat sink 11 First protrusion 16 First recess 20 Second heat sink 21 Second protrusion 26 Second recess 30 First power module 40 Second power module 110 First current module 120 Second current module 510 Heat sink 511 Projection Part 516 Recess 530 Power module 532a Heat sink side board (proximal board)
532b Heat dissipation part side substrate (distal substrate)
536 Heat sink side electronic element (proximal electronic element)
537 Heat dissipation part side electronic element (distal electronic element)
538 Electronic element 610 Current module

Claims (4)

With a heat sink
A power module arranged on one side of the heat sink and containing a plurality of electronic elements,
With
The heat sink has a protrusion protruding to the other side and has a protrusion.
A part of the power module is arranged in the area on one side of the protrusion.
The gross calorific value of the electronic element positioned on one side of the region of the projections, the size than the total heating value of the electronic element that is not located in the region of the one side no longer,
The power module is provided on the proximal substrate, the proximal electronic element provided on the proximal substrate, the distal substrate arranged on the side opposite to the heat sink from the proximal electronic element, and the distal substrate. With a distal electronic element,
A power supply device characterized in that the total calorific value of the proximal electronic element is larger than the total calorific value of the distal electronic element. With a heat sink
A power module arranged on one side of the heat sink and containing a plurality of electronic elements,
With
The heat sink has a protrusion protruding to the other side and has a protrusion.
A part of the power module is arranged in the area on one side of the protrusion.
The total calorific value of the electronic device located in the region on one side of the protrusion is larger than the total calorific value of the electronic device not located in the region on one side.
Further equipped with a current module electrically connected to the power module,
The heat sink has a recess adjacent to the protrusion.
A power supply device characterized in that at least a part of the current module is provided in the recess. The electronic element includes a switching element and includes a switching element.
The power supply device according to claim 1 or 2 , wherein the number of switching elements arranged in the one-sided region is larger than the number of switching elements not arranged in the one-sided region. The power supply device according to any one of claims 1 to 3 , further comprising a heat radiating unit arranged on one side of the power module.

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