JP6945948B2 - Electronics - Google Patents

Description

The present invention relates to an electronic device including an electronic component that requires temperature control.

Electronic components mounted on electronic devices generate heat due to power loss when energized. Most electronic components have a defined operating temperature range and require temperature control. Some electronic components may exceed the maximum junction temperature. Therefore, some electronic devices are provided with a heat sink for electronic components that require temperature control.

Due to the heat generated by electronic components, the temperature inside the electronic device rises. This temperature rise can cause electronic components to exceed the maximum junction temperature of the component. Therefore, in such a case, the heat sink is used to remove the amount of heat in the electronic device. On the other hand, in an electronic device used in a low temperature environment, the heat radiating plate is used to dissipate heat so that the inside of the electronic device is within the operating temperature range.

In both removal and heat dissipation, it is necessary to narrow the distance between the electronic component and the heat sink in order to transfer heat to the electronic component more efficiently. The efficiency of heat transfer is best when the electronic components are brought into direct contact with the heat sink. For this reason, conventionally, for each electronic component mounted on the substrate, a protruding portion that comes into contact with or approaches the electronic component is provided on the heat radiating plate (see, for example, Patent Document 1).

JP-A-2007-81047

The protrusion that comes into contact with the electronic component is used for positioning the heat sink (see, for example, paragraph 0053 of Patent Document 1). However, there are dimensional tolerances in the manufacture of parts, not limited to electronic parts and heat sinks. When an electronic component is mounted on a board, an error occurs in the positional relationship between the electronic component and the board according to the mounting accuracy. In electronic devices, errors also occur depending on the mounting accuracy. For this reason, the actual situation is that the protruding portion used for positioning by contact with the electronic component cannot always be brought into contact with the electronic component. Even if the protruding portion can be brought into contact with the electronic component, excessive pressure may be applied to the electronic component from the protruding portion.

If the protrusion cannot be brought into contact with the electronic component to be brought into contact, the temperature of the electronic component may not be properly controlled. When an excessive pressure is applied to an electronic component, the electronic component, a protrusion, a substrate on which the electronic component is mounted, or the like may be deformed or damaged. Therefore, in order to more appropriately control the temperature of the electronic component, it is also important to appropriately control the distance between the heat sink and the electronic component.

The present invention has been made to solve such a problem, and an object of the present invention is to provide an electronic device capable of more appropriately controlling the temperature of mounted electronic components.

The electronic device according to the present invention can move at least one of a substrate on which electronic components are mounted, a heat radiating member for causing heat transfer between the electronic components on the substrate, the substrate, and the heat radiating member. A guide member that supports the substrate, and a pressing mechanism that presses the substrate and one of the heat-dissipating members supported by the guide member in a direction that reduces the distance between the substrate and the heat-dissipating member. The pressing mechanism is a fixing rod provided at the end with an inclination that can be moved in the vertical direction by another guide member and whose length becomes shorter as it goes downward in the vertical direction, and a pressing target. It has a heat radiating member provided on a surface facing the end portion having an inclination in contact with the end portion provided with the inclination .

According to the present invention, it is possible to more appropriately control the temperature of the mounted electronic components.

It is a perspective view which shows the electronic device which concerns on Embodiment 1 of this invention. It is a top view which shows the electronic device which concerns on Embodiment 1 of this invention. It is a figure explaining the example of the attachment method to the rail of each substrate and each heat sink. It is sectional drawing which shows the state of a rail when a substrate is attached. It is a figure explaining the example of another attachment method to the rail of each substrate and each heat sink. It is a figure explaining the error on the outer shape existing in each component. It is sectional drawing which shows the state example before adjusting the position of each substrate and each heat sink of the electronic device which concerns on Embodiment 1 of this invention. FIG. 5 is a cross-sectional view showing a state after adjusting the positions of each substrate and each heat sink of the electronic device according to the first embodiment of the present invention. It is a figure which shows the example of the position adjuster which is a pressing mechanism. It is a figure which shows another example of the position adjuster which is a pressing mechanism. It is a figure which shows still another example of the position adjuster which is a pressing mechanism. It is a figure explaining the function required for the position adjuster of the type which applies pressure automatically. It is a top view which shows the electronic device which concerns on Embodiment 2 of this invention. It is a figure explaining the pressing mechanism adopted in the electronic device which concerns on Embodiment 3 of this invention. It is a figure which shows the example of another rail provided in the plate-shaped member which constitutes a housing.

Hereinafter, embodiments of the electronic device according to the present invention will be described with reference to the drawings.

Embodiment 1.
FIG. 1 is a perspective view showing an electronic device according to a first embodiment of the present invention.

The electronic device 1 is a device equipped with an electronic component that requires temperature control. As shown in FIG. 1, the electronic device 1 is mounted on the heat exchange device 2 because it is necessary to remove the amount of heat due to heat generation or to supply the required amount of heat.

As shown in FIG. 1, the electronic device 1 has four plate-shaped members 4a to 4d as a housing 4, and these plate-shaped members 4a to 4d are assembled in a rectangular shape. A plurality of substrates 5 and a plurality of heat sinks 6 are housed in the housing 4. In FIG. 1, two substrates 5a and 5b are shown as the substrate 5. Two heat radiating plates 6a and 6b are shown as the heat radiating plate 6 which is a heat radiating member. Two position adjusters 7 are arranged between the plate-shaped member 4b and the heat sink 6a. The position adjuster 7 corresponds to the pressing mechanism in the first embodiment.

The plate-shaped members 4a to 4d constituting the housing 4 are manufactured by using high thermal conductive members such as aluminum, iron, and copper. Similarly, the heat radiating plate 6 is manufactured by using a high heat conductive member. The substrate 5 and the heat radiating plate 6 are alternately arranged between the plate-shaped member 4b and the plate-shaped member 4d.

On the other hand, as shown in FIG. 1, the heat exchange device 2 includes a medium inlet 21, a medium outlet 22, and a flow path 23 between them, and the heat medium flowing in from the medium inlet 21 is passed through the flow path 23 to the medium outlet. It is a structure that flows out from 22. As a result, heat transfer to and from the electronic device 1 is performed via the upper surface 24 of the heat exchange device 2. The temperature of the heat medium supplied to the medium inlet 21 is controlled according to the usage environment of the electronic device 1. In FIG. 1, the vertical direction is indicated by an arrow.

When the electronic device 1 is used in an environment where the temperature is relatively low, that is, when the electronic device 1 is used in an environment where the inside of the electronic device 1 is lower than the operating temperature range, the heat exchanger 2 is transferred to the electronic device 1 as a heat medium. A medium that assumes the transfer of heat is used. As the temperature, a temperature capable of transmitting the required amount of heat is set. On the other hand, when the electronic device 1 is used in an environment where the temperature is relatively high, for example, when the electronic device 1 is used in an environment where the inside of the electronic device 1 is within the operating temperature range, the electronic device 1 is transferred to the heat exchange device 2 as a heat medium. A medium that assumes the transfer of heat is used. As the temperature, a temperature at which the required amount of heat can be removed is set. Here, for convenience of explanation, unless otherwise specified, it is assumed that the amount of heat is transferred from the electronic device 1 to the heat exchange device 2, that is, the case where the amount of heat generated in the electronic device 1 is removed.

FIG. 2 is a top view showing an electronic device according to a first embodiment of the present invention, that is, a view from a vertical direction indicated by an arrow in FIG. As shown in FIG. 2, electronic components 12a and 12b are mounted on the surface of the substrate 5a on the plate-shaped member 4b side as electronic components 12 that require temperature control, and electronic components 12c are mounted on the opposite surface. ing. In the substrate 5b, the electronic component 12d is mounted on the surface on the plate-shaped member 4b side, and the electronic component 12e is mounted on the opposite surface, that is, the surface on the plate-shaped member 4d side.

The electronic component 12 is, for example, an LSI (Large-Scale Integration), an IC (Integrated Circuit), a semiconductor element, a coil, or the like, and when energized, heat is generated by a resistance component or the like. Although FIG. 2 shows only a total of five electronic components 12a to 12e, the type and number of the electronic components 12 are not particularly limited. Semiconductor electronic components such as transistors, bus bars, capacitors, resistors, and the like are also mounted on the substrate 5.

As shown in FIG. 2, a housing 4 is formed at the bottom of the electronic device 1, and a plate-shaped member 4e in contact with the upper surface 24 of the heat exchange device 2 is assembled. On the upper surface of the plate-shaped member 4e, two rails 10 which are guide members for movably supporting the substrate 5 and the heat radiating plate 6 are provided. A claw member 11 formed according to the shape of the rail 10 is attached to each substrate 5 and each heat sink 6. As a result, each substrate 5 and each heat sink 6 can move the upper surface of the plate-shaped member 4e along the longitudinal direction of the rail 10.

As shown in FIG. 2, the two rails 10 are provided on the plate-shaped member 4e in the longitudinal direction or substantially parallel to the plate-shaped members 4a and 4c. The longitudinal direction is perpendicular to or substantially perpendicular to the surfaces of each substrate 5 and each heat sink 6. Therefore, the positional relationship between the two can be changed so that the heat sink 6a comes into contact with the electronic component 12 on the substrate 5a. This also applies to the positional relationship between the substrate 5a and the heat sink 6b and the positional relationship between the heat sink 6b and the substrate 5b.

FIG. 3 is a diagram illustrating an example of how to attach each substrate and each heat sink to the rail. As shown in FIG. 3, on each substrate 5 and each heat sink 6. Two mounting brackets 31 are attached, and the claw member 11 is attached to each mounting bracket 31.

The mounting bracket 31 has an L-shape, and a hole 313 is provided in the flat portion 311 on the side in contact with the substrate 5. The substrate 5 is also provided with a hole having the same size as the hole 313. As a result, the mounting bracket 31 is fixed to the substrate 5 by passing the screw 32 through the hole 313 and the hole provided in the substrate 5 and fitting the nut by the screw action. The claw member 11 is attached to the flat portion 312, which is the bottom of the mounting bracket 31, by, for example, welding or a screw (not shown).

FIG. 4 is a cross-sectional view showing the state of the rail when the substrate is attached. As shown in FIG. 4, the claw member 11 has an inverted T-shape, and is roughly divided into two parts, an upper portion 111 which is an upper portion and a lower portion 112 which is a lower portion. ..

As shown in FIGS. 2 and 3, the rail 10 provided on the plate-shaped member 4e has a narrow portion 10a and a wide portion 10b. In the narrow portion 10a of the rail 10, as shown in FIG. 4, a rectangular space having a wider cross section is formed adjacent to the lower portion of the narrow portion 10a. As a result, the overall cross-sectional shape is an inverted T-shape.

From such a cross-sectional shape, the wide portion 10b is a portion where only this rectangular space is exposed by excluding the narrow portion 10a. Therefore, the width of this rectangular space coincides with the width of the wide portion 10b. Due to such a relationship, in FIG. 4, "10b" is added as a code to the rectangular space. Hereinafter, the narrow portion 10a will be referred to as "narrowed width portion 10a", and the wide portion 10b will be referred to as "wide width portion 10b".

The upper side portion 111 of the claw member 11 is a portion whose width is narrower than the width of the sandwiched width portion 10a. The lower side portion 112 is a portion whose width is larger than the width of the sandwiched width portion 10a and smaller than the width of the wide portion 10b. Therefore, when the lower side portion 112 is inserted into the wide width portion 10b and the claw member 11 is moved to the narrowing width portion 10a, the lower side portion 112 interferes with the narrowing width portion 10a and the claw member 11 is moved from the rail 10. You will not be able to pull it out.

As shown in FIG. 4, the length of the upper portion 111 in the vertical direction is equal to or greater than the depth of the sandwich width portion 10a, but is substantially the same as the depth. The rail 10 is formed below the upper surface of the plate-shaped member 4e in the plate thickness direction. As shown in FIG. 2, the substrate 5 is attached to two rails 10. Therefore, the bottom surface of the substrate 5 can be stably brought into contact with the plate-shaped member 4e. This means that the amount of heat of the substrate 5 can be efficiently transferred to the upper surface of the heat exchange device 2 via the plate-shaped member 4e. Since the substrate 5 is attached to the two rails 10, the two rails 10 are hereinafter also referred to as "a set of rails 10".

The heat radiating plate 6 is also movably supported on the upper surface of the plate-shaped member 4e along a set of rails 10 in the same manner as the substrate 5. Therefore, the amount of heat of the heat radiating plate 6 can also be efficiently transferred to the upper surface of the heat exchange device 2 via the plate-shaped member 4e.

In the first embodiment, the claw member 11 is attached to each substrate 5 and each heat sink 6 by using the mounting bracket 31, but the mounting method is not limited to the method using the mounting bracket 31. For example, as shown in FIG. 5, the claw member 11 may be directly attached to the substrate 5 and the heat radiating plate 6 by using solder, an adhesive or the like.

As shown in FIG. 2, the wide portion 10b is provided in the vicinity of the plate-shaped member 4b. More specifically, the wide portion 10b is provided from the plate-shaped member 4b toward the plate-shaped member 4d within a range in which the position adjuster 7 exists. This pushes each substrate 5 movably supported by a set of rails 10 and each heat sink 6 toward the plate-shaped member 4d by the position adjuster 7 having one end abutted against the plate-shaped member 4b. Because I am doing it. For that purpose, it is preferable that the wide portion 10b is provided at a position where it is easy to support the substrate 5 and the heat radiating plate 6 to be mounted by the sandwiched width portion 10a.

As described above, in the first embodiment, each substrate 5 and each heat sink 6 are movably supported by a set of rails 10, so that the positional relationship between them can be adjusted, and the position adjuster. The actual adjustment is made according to 7. This is for the following reasons. A specific description will be given with reference to FIG.

FIG. 6 is a diagram illustrating an external error existing in each component. In FIG. 6, only three components, a substrate 5a, an electronic component 12a, and a heat sink 6a, are shown.

Even if the design value of the width of the heat sink 6a is A, individual differences occur depending on the manufacturing conditions, processing accuracy, and the like, and the actual width is usually different from A. Assuming that the range of individual differences is ± a, the actual width is A ± a. Similarly, in the substrate 5a, assuming that the design value is B and the range of individual differences is ± b, the actual width is B ± b. Further, in the electronic component 12a, assuming that the design value is C and the range of individual difference is ± b, the actual height is C ± c.

Assuming that the design value is D and the range of individual differences is ± d, the distance including each width between the substrate 5a and the heat sink 6a is D ± d. The individual differences here include mounting accuracy and the like. For this reason, "A" to "D" shown in FIG. 6 indicate design values, and "a" to "d" indicate individual differences.

When removing the amount of heat generated in the electronic component 12a, it is desired that the distance L between the heat sink 6a and the electronic component 12a be made smaller. When the distance L is 0, that is, when the heat radiating plate 6a and the electronic component 12a are brought into contact with each other, heat transfer from the electronic component 12a to the heat radiating plate 6a can be performed most efficiently. However, as described above, there are individual differences in the parts regardless of the type. In addition to individual differences in related parts, the distance L is also affected by individual differences due to mounting accuracy.

In FIG. 6, the distance L is the minimum when the distance D ± d is the minimum and the widths Aa ± a, B ± b, and the height C ± c are the maximum. At this time, the distance L is L = (D−d) − ((A + a) + (B + b) + (C + c)).
= (DABC)-(d + a + b + c)
Will be. On the other hand, the maximum distance L is L = (D + d)-((A-a) + (B-b) + (C-c)).
= (DABC) + (d + a + b + c)
Will be. Therefore, the distance L changes within the range of ± (d + a + b + c). In other words, the distance L has a difference of 2 (d + a + b + c) between the maximum and the minimum.

Due to the existence of individual differences at this distance L, it is very difficult to set the distance L to 0. By assuming the minimum distance L, the electronic component 12a can be brought into contact with the heat sink 6a. However, in that case, pressure is applied to the electronic component 12a, the substrate 5a, the heat sink 6a, and the like according to the difference from the actual distance L. When an excessive pressure is applied, problems such as deformation of the heat sink 6a and the substrate 5a and damage of the electronic component 12a are likely to occur.

On the other hand, in the first embodiment, as described above, one set of rails 10 is used to movably support each substrate 5 and each heat sink 6. By supporting it in this way, it is possible to avoid the need to apply pressure that causes a defect in each substrate 5, each heat sink 6, and the electronic components mounted on each substrate 5. This is because it is not necessary to apply excessive pressure to move each substrate 5 and each heat sink 6. Therefore, it is easy to appropriately manage the distance between the electronic component 12 and the housing 4 and the distance between the electronic component 12 and the heat sink 6 without causing a problem due to applying unnecessary pressure. Can be done. By appropriately controlling the interval, it is possible to appropriately remove the amount of heat from the electronic component 12 that requires temperature control. More efficient removal of heat can be easily realized.

FIG. 7 is a cross-sectional view showing an example of a state before adjusting the positions of each substrate of the electronic device according to the first embodiment of the present invention and each heat sink, and FIG. 8 is a cross-sectional view showing the first embodiment of the present invention. It is sectional drawing which shows the state after adjusting the position of each substrate of an electronic device, and each heat sink. The cross-sectional views shown in FIGS. 7 and 8 are both cross-sectional views taken along line xx shown in FIG. Next, with reference to FIGS. 7 and 8, a method of adjusting the position of each substrate 5 and each heat sink 6, that is, a method of assembling the electronic device 1 will be specifically described.

As shown in FIGS. 7 and 8, the substrate 5b, the heat radiating plate 6b, the substrate 5a, and the radiating plate 6a are arranged in this order from the plate-shaped member 4d side even before and after the position adjustment is performed. Each substrate 5 and each heat sink 6 are supported by a set of rails 10 by inserting the lower portion 112 of the claw member 11 into the wide portion 10b in this order. FIG. 7 shows an example of a state after each substrate 5 and a heat sink 6 are all supported by a set of rails 10 in this way.

After that, the operator leaves a space between the plate-shaped member 4b and the heat radiating plate 6a so that the position adjuster 7 can be inserted, and inserts the position adjuster 7 in the gap. The length of the position adjuster 7 can be changed. From this, the insertable interval can be secured by moving the heat radiating plate 6a to the plate-shaped member 4d side or by shortening the length of the position adjuster 7.

As shown in FIGS. 7 and 8, the plate-shaped member 4e provided with the rail 10 is in contact with the upper surface 24 of the heat exchange device 2, and the heat medium is in the flow path 23 formed under the upper surface 24. 25 is flowing. Therefore, the amount of heat of each substrate 5 and each heat sink 6 is efficiently removed by being transferred to the heat medium 25 via the plate-shaped member 4e and the upper surface 24.

As shown in FIG. 8, the position adjuster 7 has a structure in which planar support members 72 are attached to both ends of the adjusting rod 71. By using the planar support member 72, it is possible to avoid applying strong pressure to the plate-shaped member 4b and the heat radiating plate 6a in a narrow range.

FIG. 9 is a diagram showing an example of a position adjuster which is a pressing mechanism. Here, with reference to FIG. 9, the position adjuster 7 will be specifically described.

As shown in FIG. 9, the position adjuster 7 has a structure in which the distance between the two support members 72 is adjusted by the adjusting rod 71. The adjusting rod 71 includes two mandrel 711 and an adjusting screw 712. The two mandrel 711 have different shaft portions, one having a male screw and the other having a female screw. As a result, the amount of insertion of the male screw into the female screw can be changed according to the rotation direction of the adjusting screw 712. For example, when the adjusting screw 712 is turned clockwise as shown on the left side of FIG. 9, the insertion amount becomes large and the adjusting rod 71 becomes short, and when it is turned counterclockwise as shown on the right side of FIG. The insertion amount becomes smaller and the adjusting rod 71 becomes longer. Therefore, the distance between the two support members 72 can be adjusted by rotating the adjusting screw 712.

Returning to the description of FIG. When inserting the position adjuster 7, there is a margin for inserting the position adjuster 7. From this, after inserting the position adjuster 7, the operator rotates the adjusting screw 712 in the direction of lengthening the adjusting rod 71. Due to the rotation, between the plate-shaped member 4d and the electronic component 12e, between the electronic component 12d and the heat sink 6b, between the heat sink 6b and the electronic component 12c, and between the electronic component 12a and the heat sink 6a. The total amount of intervals gradually decreases. When the total amount is exhausted, the load for rotating the adjusting screw 712 increases sharply.

When the total amount of voids becomes 0, the contact between the plate-shaped member 4d constituting the housing 4 and the electronic component 12e, the contact between the electronic component 12d and the heat sink 6b, the contact between the heat sink 6b and the electronic component 12c, and This is a state in which all the contact between the electronic component 12a and the heat sink 6a is realized. By realizing this state, an environment in which the amount of heat generated in the electronic components 12e, 12d, 12c, and 12a can be efficiently removed is realized. This, and further, in order to avoid applying excessive pressure, the length adjustment of the position adjuster 7 by rotating the adjusting screw 712 is also completed. At the end of the length adjustment, the positions of the substrates 5 and the heat sinks 6 are also fixed, and the state at the end of the length adjustment is stably maintained.

In this way, when each substrate 5 and each heat sink 6 are movably supported by one set of rails 10 and their positioning is performed using the position adjuster 7, individual differences in each component, assembly accuracy, etc. Regardless, the optimum environment for removing the amount of heat can be surely realized. Even if some unexpected error occurs, it can be dealt with as long as the length of the position adjuster 7 can be adjusted. It is possible to surely avoid applying excessive pressure. From these facts, the temperature control of the electronic component 12 mounted on the electronic device 1 can be surely and appropriately performed.

In the first embodiment, as the position adjuster 7, a type in which an operator rotates an adjustment screw 712 to adjust the length is adopted, but the position adjuster 7 that can be adopted is this type. Not limited to. For example, as shown in FIG. 10, the position adjuster 7 is a type in which a spring 75, which is an elastic member, is provided in the mandrel 711, and pressure is applied in the direction in which the adjusting rod 71 becomes longer by the elastic force of the spring 75. You may. Alternatively, as shown in FIG. 11, the position adjuster 7 encloses the gas 76 as a fluid in the mandrel 711, and the pressure generated because the gas 76 becomes the same pressure as the outside air causes the adjusting rod 71 to become longer. It may be a type that applies pressure to the gas. In the case of this type, a packing 77 for sealing the gas 76 is attached between the two mandrel 711.

FIG. 12 is a diagram illustrating a function required for a position adjuster of a type that automatically applies pressure.

In the position adjuster 7 of the type shown in FIGS. 10 and 11, pressure corresponding to the length is automatically applied to each support member 72. However, as shown in FIG. 12, the pressure needs to be set to a level at which the substrate 5 and the heat sink 6 can be moved and the substrate 5, the electronic component 12, and the like are not defective. For this reason, the position adjuster 7 of the type that automatically applies pressure must satisfy the conditions shown in FIG. That is, the pressure to be applied is a level that does not cause a defect at the minimum length, and the position adjuster 7 maintains a level at which each substrate 5 and each heat sink 6 can be moved even at the maximum length. Need to be adopted. In the type using the pressure of the gas 76 as shown in FIG. 11, the pressure can be adjusted by injecting or removing the gas 76. The maximum length and the minimum length may be those of the position adjuster 7 itself, but may be those assumed at the time of use.

Embodiment 2.
The heights of the electronic components 12 that require temperature control are not all the same. Therefore, as shown in FIGS. 2 and 8, it is difficult to bring all the electronic components 12 that require temperature control into contact with the heat sink 6. Among the electronic components 12 mounted on one substrate 5, the one that can be brought into contact with the heat sink 6 is usually limited to the highest electronic component 12. Therefore, in the second embodiment, more electronic components 12 can be brought into contact with the heat sink 6. By bringing more electronic components 12 into contact with the heat sink 6, the temperature of the electronic components 12 mounted on the electronic device 1 can be controlled more appropriately. Here, the same or corresponding components as those in the first embodiment are designated by the same reference numerals, and the parts different from the first embodiment will be described in detail.

FIG. 13 is a top view showing an electronic device according to a second embodiment of the present invention. As shown in FIG. 13, in the second embodiment, two heat sinks 6a1 and 6a2 are adopted instead of the heat sink 6a. In order to movably support the two heat sinks 6a1 and 6a2 at two locations, one rail 10 is added between the set of rails 10. Each of the heat radiating plates 6a1 and 6a2 is adapted to apply pressure toward the plate-shaped member 4d by the position adjuster 7. As a result, the heat sink 6a1 is in contact with the electronic component 12a, and the heat sink 6a2 is in contact with the electronic component 12b. As a result, the amount of heat generated in the electronic component 12b can be removed more efficiently as compared with the first embodiment.

Embodiment 3.
In the first and second embodiments, the position adjuster 7 whose length is changed manually or automatically is adopted. On the other hand, the third embodiment uses a pressing mechanism that generates a pressure for moving the heat radiating plate 6 toward the plate-shaped member 4d without adopting a structure whose length changes. Here, too, the same or corresponding components as those in the first embodiment are designated by the same reference numerals, and the parts different from the first embodiment will be described in detail.

FIG. 14 is a diagram illustrating a pressing mechanism adopted in the electronic device according to the third embodiment of the present invention, and FIG. 15 shows an example of another rail provided on a plate-shaped member constituting the housing. It is a figure.

As shown in FIG. 14, in the third embodiment, the fixed rod is rod-shaped and has an inclination that shortens the length from the upper side to the lower side in the vertical direction at the end portion on the heat sink 6a side. It is equipped with 140. The surface 61 of the heat radiating plate 6a on the plate-shaped member 4b side is also provided with an inclination in which the entire end of the fixing rod 140 is in contact with the surface 61.

On the other hand, as shown in FIG. 15, the plate-shaped member 4b constituting the housing 4 is provided with two rails 141 similar to the rail 10. Each rail 141 is a guide member for movably supporting one fixing rod 140 in the vertical direction. As a result, in the third embodiment, there are two fixing rods 140. Like the rail 10, each rail 141 has a narrowing width portion 141a and a wide width portion 141b.

From this, the other end of the fixing rod 140, that is, the end on the plate-shaped member 4b side is, for example, a claw, and the claw can be inserted from the wide portion 141b. Due to the insertion, the fixing rod 140 is supported by the narrowing width portion 141a so as to be movable in the vertical direction.

In order to maintain the inclination of the end portion of the fixed rod 140 on the heat sink 6a side, the shape of the claw is such that the fixed rod 140 does not rotate around the axis, for example, a rectangular shape that matches the planar shape in the rail 141. ing. As a result, the fixing rod 140 pushes the heat radiating plate 6a away from the plate-shaped member 4b by a length corresponding to the amount of downward movement.

Therefore, in the narrow sense, the pressing mechanism in the third embodiment includes the fixing rod 140 and the rail 141. In a broad sense, it further includes a heat sink 6a. Since this pressing mechanism can move the heat radiating plate 6a away from the plate-shaped member 4b, it can be used as a substitute for the position adjuster 7 adopted in the first and second embodiments.

In the third embodiment, the weight of the fixed rod 140 is used as the pressure for pushing the heat radiating plate 6a, but a material other than the fixed rod 140 may be used to use the weight. That is, the pressing mechanism may be a mechanism that uses, for example, a pulley or the like to change the vertical force due to its own weight into a horizontal force to move each substrate 5 and each heat sink 6. Including this, various modifications are possible.

Further, in the first to third embodiments, as shown in FIGS. 2 and 13, the two substrates 5 and the two heat sinks 6 are the moving targets, but the moving target may be one. .. That is, the movement target may be one or more. This is because the substrate 5 or the electronic component 12 on the substrate 5 can be brought into contact with the housing 4 or the heat sink 6 even if there is only one moving target.

The rail 10 is intended to bring the electronic component 12 on the substrate 5 into contact with the housing 4 or the heat sink 6. However, the rail 10 may be for making the distance between the electronic component 12 and the housing 4 or less than a predetermined distance between the electronic component 12 and the heat sink 6. This is because, as a result, it suffices if the temperature of the electronic component 12 can be appropriately controlled. The rail 10 may be provided not as one component but as a part of the plate-shaped member 4e. This also applies to the rail 141.

In the first and second embodiments, only two position adjusters 7 are used, but three or more position adjusters 7 may be used. Taking the top view shown in FIG. 2 as an example, for example, the substrate 5a is fixed, the heat sink 6a is moved toward the substrate 5a by two position adjusters 7, and the heat sink 6b and the substrate 5b are movably supported. The heat sink 6b may be moved by the two position adjusters 7. When the numbers of the substrates 5 and the heat sinks 6 to be contacted are dispersed in this way, the amount of heat generated per unit area can be further suppressed, so that it can be expected that the temperature control of the electronic component 12 can be performed more appropriately. ..

Depending on the number of position adjusters 7, the number of pressing objects on which the position adjusters 7 actually apply pressure can be increased. As the number of objects to be pressed increases, more accurate temperature control becomes possible. However, the space in which the substrate 5 or the heat sink 6 cannot be installed becomes wider. The position adjuster 7 basically needs to fix one end, and may need to provide a mechanism for fixing the end. For this reason, in reality, the position adjuster takes into consideration the number of electronic components 12 that are highly required to control the temperature, the level of the necessity, the external restrictions required for the electronic device 1, and the like. It is necessary to determine the number of 7, that is, the number of objects to be pressed. For this reason, the number and arrangement of the position adjusters 7 need to be modified in various ways as necessary.

1 Electronic device, 2 Heat exchanger, 4 Housing, 4a-4e Plate-shaped member, 5, 5a, 5b board, 6, 6a, 6b, 6a1, 6a2 Heat sink (heat sink), 7 Position adjuster, 10 rails (Guide member), 10a narrowing part, 10b wide part, 11 claw member, 12, 12a to 12e electronic parts, 140 fixing rod, 141 rail (other guide member).

Claims (5)

A board on which electronic components are mounted and
A heat radiating member for transferring heat between the electronic components on the substrate and the heat radiating member.
A guide member that movably supports at least one of the substrate and the heat radiating member,
A pressing mechanism that targets one of the substrate and the heat radiating member supported by the guide member and presses the pressing object in a direction that reduces the distance between the substrate and the heat radiating member. With
The pressing mechanism
A fixing rod that can be moved in the vertical direction by another guide member and has an inclination at the end that becomes shorter as it goes downward in the vertical direction.
The heat-dissipating member, which is the object to be pressed and has an inclination in contact with the end portion provided with the inclination, is provided on a surface facing the end portion.
Electronic equipment with. The heat radiating member transfers heat to and from a heat exchange device used for at least one of supplying heat and removing heat via a housing.
The electronic device according to claim 1. The guide member movably supports one or more of the substrates and one or more of the heat radiating members.
The one or more pressing mechanisms bring the electronic components on the substrate into contact with one of the housing and the heat radiating member by moving the heat radiating member as the pressing target.
The electronic device according to claim 1 or 2. It has a plurality of the pressing mechanisms.
A different pressing target is moved for each pressing mechanism.
The electronic device according to any one of claims 1 to 3. Having a plurality of the guide members
The substrate and the heat radiating member are movably supported by two or more guide members.
The electronic device according to any one of claims 1 to 4.

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