JP6946235B2 - A method for determining the properties of a thermally conductive material during pressurization - Google Patents

Description

The present invention relates to a method for determining the properties of a thermally conductive material under pressure.

There is a heat conductive material as a material used for enhancing heat transfer from a heat generating member to a heat radiating member. For example, conventionally, when an electronic component such as a CPU, GPU, or power module that generates a large amount of heat is attached to a heat sink, it is used to eliminate a gap generated between the components and efficiently transfer the heat generated by the electronic component to the heat sink. As the heat conductive material, a material obtained by mixing a heat conductive powder with a silicone resin as shown in Patent Document 1 and forming a sheet is widely used.

The thermally conductive material is also called a thermal interface material (TIM). Examples of the heat conductive material include a material called a "heat dissipation pad" having a low hardness and a material called a "heat dissipation sheet" having a high hardness. However, the terms "pad" and "sheet" may be used in a mixed manner regardless of the hardness. For example, a heat-dissipating pad with low hardness is called a "soft pad", and a heat-dissipating sheet with high hardness is called a "hard pad". Sometimes.

Thermal resistance is one of the indicators of heat dissipation performance of thermally conductive materials, and the thermal resistance value is determined by the thickness and thermal conductivity of the thermally conductive material and the contact thermal resistance with the surface that the thermally conductive material contacts. come.

FIG. 6 is a cross-sectional view when the heat conductive material 51 is sandwiched between the heat generating member 52 and the heat radiating member (cooling member) 53. Heat is transferred from the heat generating member 52 to the heat radiating member (cooling member) 53 in the direction of the arrow 54. The heat conductive material 51 has a function of efficiently transferring the heat generated by the heat generating member 52 to the heat radiating member (cooling member) 53. Assuming that the thermal conductivity of the thermally conductive material is λ _TIM , the thickness is L, the thermal resistance of contact is _RC , and the cross-sectional area is A, the thermal resistance R ₀ of the thermally conductive material that does not include the thermal resistance of contact is mathematical formula (1). The thermal resistance R of the heat conductive material including the contact thermal resistance is expressed by the mathematical formula (2).

The equivalent thermal conductivity of the heat conductive material with the contact thermal resistance added can be obtained by combining the above formulas (1) and (2) and solving them. From the formula (3), the formula (4) ) Can be expressed as.

Generally, there are two methods for measuring thermal resistance: a stationary method for measuring thermal resistance under constant temperature conditions and an unsteady method for measuring thermal resistance while the temperature is rising or falling.

In the technique disclosed in Patent Document 2, a method for calculating the equivalent thermal conductivity is shown for a solder bump model for connecting an electronic component and a substrate having a wiring pattern, but the equivalent in a parallel model of solder and air. This is a method for calculating thermal conductivity, and this equivalent thermal conductivity calculation method cannot be applied to a model in which thermal resistance is arranged in series, such as a heat conductive material and air.

Japanese Unexamined Patent Publication No. 2005-54099 Japanese Unexamined Patent Publication No. 2008-275579

The above-mentioned thermally conductive materials have various hardness, thickness, and thermal conductivity, and it is difficult to select a material that meets the desired required characteristics from among many thermally conductive materials.

Since the thermal resistance of a thermally conductive material changes depending on the pressing force, the thermal resistance value at the pressure actually used is important. However, it has been difficult to easily obtain the thermal resistance value of the heat conductive material under various pressure conditions.

Similarly, the equivalent thermal conductivity of a thermally conductive material also changes in contact thermal resistance and thickness depending on the pressing force, so the equivalent thermal conductivity at the pressure actually used is important. However, it has been difficult to easily obtain the equivalent thermal conductivity of the thermally conductive material under various pressure conditions.

An object of the present invention is to provide a method capable of easily obtaining the relationship between pressure and thermal resistance of a heat conductive material, the relationship between pressure and thickness, and the relationship between pressure and equivalent thermal conductivity.

The present invention has been made to solve the above problems, and the present invention has the thermal conductivity when pressurizing a heat conductive material used for enhancing heat transfer from a heat generating member to a heat radiating member. It is a method of determining the characteristics of a material, and is a method for determining the relationship between the pressure at the time of pressurization and the thermal resistance of the thermally conductive material, the pressure at the time of pressurization and the thermal conductivity for each product name of the thermally conductive material. The process of incorporating into a computer a characteristic database in which the relationship between the thickness of the material and the relationship between the pressure at the time of pressurization and the equivalent thermal conductivity of the heat conductive material are stored, and the process of incorporating the heat conductive material in the computer. The process of selecting a product name, the relationship between the pressure at the time of pressurization and the thermal resistance of the heat conductive material, and the pressure at the time of pressurization by the computer for each product name of the selected heat conductive material. By the step of displaying the relationship between the thickness of the heat conductive material and the thickness of the heat conductive material, and the relationship between the pressure at the time of pressurization and the equivalent heat conductivity of the heat conductive material on the screen of the screen display means, the heat conduction at the time of pressurization Provided is a method for determining the properties of a sex material.

If it is a method to obtain the characteristics of the heat conductive material at the time of pressurization, the relationship between the pressure and the thermal resistance of the heat conductive material, the relationship between the pressure and the thickness, and the relationship between the pressure and the equivalent thermal conductivity can be easily obtained. can.

In this case, for each product name of the heat conductive material, the relationship between the pressure at the time of pressurization and the heat resistance of the heat conductive material and the relationship between the pressure at the time of pressurization and the thickness of the heat conductive material are as follows. It was obtained based on the thermal resistance and thickness measured for each product name of the thermally conductive material by a steady method of measuring the thermal resistance under constant temperature conditions, and for each product name of the thermally conductive material, The relationship between the pressure at the time of pressurization and the equivalent thermal conductivity of the thermally conductive material is determined based on the thermal resistance and thickness measured for each product name of the thermally conductive material by the stationary method. It is preferably obtained based on the relationship between the pressure at the time and the thermal resistance of the heat conductive material and the relationship between the pressure at the time of pressurization and the thickness of the heat conductive material.

As described above, the relationship between the pressure and the thermal resistance of the thermally conductive material used in the present invention, the relationship between the pressure and the thickness, and the relationship between the pressure and the equivalent thermal conductivity are determined by the constant method of measuring the thermal resistance under constant temperature conditions. The relationship obtained based on the actually measured thermal resistance for each product name of the conductive material can be preferably adopted. Thereby, the relationship between the pressure and each property of the heat conductive material can be obtained more in line with the actual usage conditions.

Further, before selecting the product name of the heat conductive material, a step of narrowing down the product name candidates of the heat conductive material to be selected from the product names of the heat conductive material stored in the property database. The process of narrowing down the candidates for the product name is the hardness classification, product thickness, catalog thermal conductivity, and insulation failure classified according to the product name and the hardness of the heat conductive material having the product name. A step of incorporating a product database in which each condition of voltage is associated into the computer, and a step of inputting at least one condition of the hardness classification, product thickness, catalog thermal conductivity, and insulation breakdown voltage into the computer. It is preferable that the computer enumerates the product names that meet the input conditions based on the product database, and narrows down the candidates for the product names that meet the input conditions.

In this way, by incorporating a product database in which the conditions of hardness classification, product thickness, catalog thermal conductivity, and breakdown voltage are associated with each other in the computer, it is possible to narrow down only the products that meet the conditions from the entire product list. It is possible to easily select a desired product name.

According to the present invention, it is possible to easily obtain information on the relationship between the pressure and the thermal resistance of the heat conductive material, the relationship between the pressure and the thickness, and the relationship between the pressure and the equivalent thermal conductivity.

It is a flow chart which shows the outline of an example of the method of determining the property of the heat conductive material at the time of pressurization of this invention. It is a figure explaining the method of narrowing down the product name of a heat conductive material in this invention. It is a figure explaining the method of displaying (drawing) the relationship between pressure and thermal resistance, the relationship between pressure and thickness, and the relationship between pressure and equivalent thermal conductivity on the screen of a screen display means from the product list used in the present invention. This is an input screen for narrowing down the product names of thermally conductive materials using the present invention. It is an operation screen of the calculation sheet for obtaining the thermal resistance, thickness, and equivalent thermal conductivity at the time of pressurization of the product name from the product name of the heat conductive material using the present invention. It is a figure explaining the relationship between the thermal resistance and the contact thermal resistance of the heat conductive material used between a heat generating member and a heat radiating member.

Hereinafter, embodiments of the present invention will be described, but the present invention is not limited thereto.

FIG. 1 shows an outline of an example of a method for determining the properties of a heat conductive material under pressure according to the present invention. The present invention is a method for obtaining the characteristics of a heat conductive material when pressurizing a heat conductive material used for enhancing heat transfer from a heat generating member to a heat radiating member. Here, the characteristics of the thermally conductive material are, specifically, the thermal resistance, the thickness, and the equivalent thermal conductivity of the thermally conductive material. In the present invention, first, for each product name of the heat conductive material, the relationship between the pressure at the time of pressurization and the heat resistance of the heat conductive material, the relationship between the pressure at the time of pressurization and the thickness of the heat conductive material, and the pressurization. A characteristic database in which the relationship between the pressure at the time and the equivalent thermal conductivity of the thermally conductive material is stored is incorporated into the computer (step a in FIG. 1). Next, the product name of the heat conductive material is selected in the computer (step b in FIG. 1). Next, for each product name of the heat conductive material selected by the computer, the relationship between the pressure when pressurizing and the thermal resistance of the heat conductive material, the relationship between the pressure when pressurizing and the thickness of the heat conductive material, The relationship between the pressure at the time of pressurization and the equivalent thermal conductivity of the thermally conductive material is displayed on the screen of the screen display means (step c in FIG. 1). In this way, in the method of the present invention, the characteristics of the heat conductive material at the time of pressurization can be determined.

If it is a method of obtaining the characteristics of a heat conductive material at the time of pressurization, the relationship between the pressure and the thermal resistance of a specific heat conductive material, the relationship between the pressure and the thickness, and the relationship between the pressure and the equivalent thermal conductivity can be easily obtained. Can be obtained.

Hereinafter, the present invention will be described step by step.

As described above, in the present invention, first, for each product name of the heat conductive material, the relationship between the pressure at the time of pressurization and the heat resistance of the heat conductive material, the pressure at the time of pressurization and the thickness of the heat conductive material A characteristic database in which the relationship and the relationship between the pressure at the time of pressurization and the equivalent thermal conductivity of the heat conductive material are stored is incorporated into the computer (step a).

The relationship between the pressure at the time of pressurization and the thermal resistance of the heat conductive material and the relationship between the pressure at the time of pressurization and the thickness of the heat conductive material for each product name of the heat conductive material here are under constant temperature conditions. It is preferable that it is obtained based on the thermal resistance and the thickness measured for each product name of the thermally conductive material by the steady method for measuring the thermal resistance. As described above, in the present invention, the relationship obtained based on the actually measured thermal resistance and thickness can be suitably adopted for each product name of the heat conductive material by the steady-state method. Thereby, the relationship between the pressure when pressurizing and the thermal resistance of the heat conductive material and the relationship between the pressure when pressurizing and the thickness of the heat conductive material can be obtained more according to the actual usage conditions.

In addition, the relationship between the pressure at the time of pressurization and the equivalent thermal conductivity of the thermally conductive material for each product name of the thermally conductive material is the thermal resistance and thickness measured for each product name of the thermally conductive material by the stationary method. It is preferable that the pressure is determined based on the relationship between the pressure at the time of pressurization and the thermal resistance of the heat conductive material and the relationship between the pressure at the time of pressurization and the thickness of the heat conductive material. This makes it possible to obtain the relationship between the pressure when pressurizing according to the actual usage conditions and the equivalent thermal conductivity of the thermally conductive material.

As described above, the thermal resistance of a thermally conductive material can be measured by a steady-state method. For example, it can be performed by the following method, but is not limited to this.

ここで、
Ｒ ： 熱抵抗（ｃｍ^２・Ｋ／Ｗ）
Ｔ_ｈ ： ヒーター側温度（℃）
Ｔ_ｃ ： 冷却プレート側温度（℃）
Ｑ ： 熱量（Ｗ）
Ｓ ： 面積（ｃｍ^２）
である。 (Measurement method of thermal resistance by steady-state method)
First, a sample of a heat conductive material having a diameter of 33 mm is sandwiched between a cooling plate and a heater, and the heater is heated under a predetermined pressure. Next, the thermal resistance value is calculated from the amount of heat in the steady state and the temperature difference between the top and bottom of the sample. The thermal resistance is expressed by the following mathematical formula (5).

here,
R: Thermal resistance (cm ²・ K / W)
_Th : Heater side temperature (° C)
T _c : Cooling plate side temperature (° C)
Q: Calorie (W)
S: Area (cm ² )
Is.

In this way, the thermal resistance of the thermally conductive material may be measured, and the correlation between the pressure and the thermal resistance and the pressure and the thickness may be measured. That is, the thermal resistance is measured by changing the pressure applied to the sample of the heat conductive material, and the relationship between the pressure applied to the heat conductive material and the thermal resistance can be obtained. Further, by changing the pressure applied to the sample of the heat conductive material, the thickness of the sample of the heat conductive material can be changed, and the relationship between the pressure applied to the heat conductive material and the thickness can be obtained. By measuring the thermal resistance for each product name of the heat conductive material, the relationship between the pressure and the heat resistance and the relationship between the pressure and the thickness can be obtained for each product name of the heat conductive material. Further, the equivalent thermal conductivity can be obtained from the following equation.

In step a, after incorporating the database of the relationship between the pressure and the thermal resistance of the thermally conductive material, the relationship between the pressure and the thickness, and the relationship between the pressure and the equivalent thermal conductivity into the computer, the product name of the thermally conductive material is selected in the computer. (Step b). If you save the product name of the heat conductive material in the property database, you can easily obtain the relationship between the pressure during pressurization and each property of the heat conductive material by selecting the product name of the heat conductive material. It can be carried out.

After selecting the product name of the heat conductive material in the computer in step b, the relationship between the pressure when the computer pressurizes and the heat resistance of the heat conductive material for each product name of the selected heat conductive material, The relationship between the pressure at the time of pressurization and the thickness of the heat conductive material and the relationship between the pressure at the time of pressurization and the equivalent thermal conductivity of the heat conductive material are displayed (drawn) on the screen of the screen display means (step c). In this way, in the method of the present invention, the characteristics of the heat conductive material at the time of pressurization can be determined.

ここで、
τ：

で定義される無次元パラメータ
ΔＴ_ａｖｅ（τ）： センサーの温度上昇（℃）
Ｄ（τ）： 無次元化されたτの関数
Ｐ_０： センサーに加えられる全出力（Ｗ）
π： 円周率
ｒ： センサーの半径（ｍ）
λ： サンプルの熱伝導率（Ｗ／ｍ−Ｋ）
α： サンプルの熱拡散率（ｍ^２／ｓ）
ｔ： 測定時間（ｓｅｃ）
である。 In addition, the present invention also selects from the product names of the thermally conductive material stored in the property database before selecting the product name of the thermally conductive material (that is, before step b). It is possible to have a step of narrowing down the product name candidates of the material (step d in FIG. 1). This step d may be performed at least before step b. Specifically, the step d for narrowing down the product name candidates can be performed in the following steps. First, the product name of the heat conductive material and the product in which the conditions of hardness classification, product thickness, catalog thermal conductivity, and breakdown voltage classified according to the hardness of the heat conductive material having the product name are related. Incorporate the database into the computer (step d-1). The "hardness classification" is a classification given based on the hardness of the product. For example, each product is classified into a classification such as "low hardness", "high hardness", and "composite product of low hardness and high hardness". Attached to. Further, the "catalog thermal conductivity" is the thermal conductivity of the thermally conductive material measured by the following measuring method.
(Catalog method for measuring thermal conductivity)
The sensor is sandwiched between two samples of 60 mm × 60 mm × 6 mm in thickness, a constant current is passed through the sensor, heat is constantly generated, and the thermal conductivity (catalog thermal conductivity) is calculated from the temperature rise of the sensor. The thermal conductivity (catalog thermal conductivity) can be obtained from the following mathematical formula (7).

here,
τ:

Dimensionless parameter ΔT _ave (τ) defined by: Sensor temperature rise (° C)
D (τ): Function of dimensionless τ P ₀ : Total output applied to the sensor (W)
π: Pi r: Sensor radius (m)
λ: Thermal conductivity of the sample (W / m-K)
α: Thermal diffusivity of the sample (m ² / s)
t: Measurement time (sec)
Is.

Next, at least one of the above-mentioned hardness classification, product thickness, catalog thermal conductivity, and breakdown voltage is input to the computer (step d-2). Next, the computer lists the product names that meet the entered conditions based on the product database (step d-3). Through the above steps d-1 to d3, product name candidates that meet the input conditions can be narrowed down. In this way, by incorporating a product database in which the conditions of hardness classification, product thickness, catalog thermal conductivity, and breakdown voltage are associated with each other in the computer, it is possible to narrow down only the products that meet the conditions from the entire product list. It is possible to easily select a desired product name.

In step d, the conditions of heat conductive material hardness classification, product thickness, catalog thermal conductivity, and insulation breakdown voltage were selected and input, and the heat conductive material that met the conditions was selected from the product list of the product database. After that, in step b, by inputting the selected product name, the relationship between the pressure at the time of pressurization of the product name and the thermal resistance / thickness / equivalent thermal conductivity is obtained from the product name of the heat conductive material. Can be done. A product list of a product database in which the conditions of hardness classification, product thickness, catalog thermal conductivity, and dielectric breakdown voltage of a thermally conductive material having a product name are associated with each other can be arbitrarily created. For example, it can be a product list of thermally conductive materials manufactured by Shin-Etsu Chemical Co., Ltd.

In the present invention, as described above, a characteristic database having a relationship between pressure and thermal resistance, a relationship between pressure and thickness, and a relationship between pressure and equivalent thermal conductivity is used for each product name of the heat conductive material. The relationship of each product name of this thermally conductive material can be added to the characteristic database at any time. That is, for example, the relationship between the pressure and the thermal resistance of the heat conductive material, the relationship between the pressure and the thickness, and the relationship between the pressure and the equivalent thermal conductivity set for each product name are newly added to the already constructed characteristic database. Can be added.

More specific embodiments will be described with reference to FIGS. 2-5. FIG. 2 is a diagram illustrating a method of selecting a product that meets the conditions of hardness classification, product thickness, catalog thermal conductivity, and dielectric breakdown voltage from the product list stored in the product database in the above step d. Is. As shown in FIG. 2, each product is given one of "low hardness", "low hardness + high hardness", and "high hardness" as a hardness classification. In addition, the lower and upper limits of the product thickness of each product, the lower and upper limits of the catalog thermal conductivity, and the lower and lower limits of the dielectric breakdown voltage are stored.

As shown in Fig. 2, for a computer with a built-in product database, select and enter the classification of thermal conductive material hardness, product thickness, catalog thermal conductivity, and breakdown voltage in the input section, and click the product number search button. click. Then, the product name that meets the conditions is output from the product list. It is also possible to display a list of all products, in which case the reset button may be clicked as shown in FIG.

As shown in FIG. 3, in the characteristic database built into the computer, "relationship between pressure and thermal resistance applied to the heat conductive material" and "heat conductivity" are associated with each product name of the heat conductive material. "Relationship between pressure applied to material and thickness" and "Relationship between pressure applied to thermally conductive material and equivalent thermal conductivity" are preserved.

FIG. 3 shows (draws) the relationship between pressure and thermal resistance, the relationship between pressure and thickness, and the relationship between pressure and equivalent thermal conductivity on the screen of the screen display means from the product list used in the present invention based on the characteristic database. It is a figure explaining the method of doing.

When the product name of the heat conductive material is selected as shown in Fig. 3, the characteristic database built into the computer is referred to, and the relationship between pressure and thermal resistance, the relationship between pressure and thickness, and pressure and equivalent heat conduction of the product name are referred to. The relationship between the rates is drawn as a graph on the screen of the screen display means.

A more specific embodiment of the present invention will be described with reference to FIGS. 4 and 5. FIG. 4 is a diagram showing an example of an input screen of a calculation sheet for selecting a product that meets the conditions of heat conductive material hardness classification, product thickness, catalog thermal conductivity, and dielectric breakdown voltage from the product list. This calculation sheet can be created using, for example, spreadsheet software such as Microsoft Excel®.

FIG. 5 is a calculation for drawing the relationship between pressure and thermal resistance, the relationship between pressure and thickness, and the relationship between pressure and equivalent thermal conductivity by selecting the product name of the thermally conductive material selected in FIG. It is a figure which shows an example of the input screen of a sheet. This calculation sheet can be created using, for example, spreadsheet software such as Microsoft Excel®.

In FIGS. 4 and 5, product names of a heat-dissipating pad (Soft Pad) having a low hardness, a heat-dissipating sheet (Hard Pad) having a high hardness, and a laminated product of the heat-dissipating pad and the heat-dissipating sheet are registered. Depending on the thickness (0.5 mm, 1.0 mm, etc.) in the non-pressurized state, it is registered as "50CAS-10", "100CAS-10", "50CAB-10", "100CAB-10", for example, a product. The name "50CAS-10" is an abbreviation for the product name "TC-50CAS-10". In Fig. 4, when the conditions of hardness classification, product thickness, catalog thermal conductivity, and breakdown voltage are selected and entered, the product name that meets the conditions is displayed. In Fig. 5, when the product name is selected, the pressure and heat of that product name are displayed. The relationship between resistance, pressure and thickness, and pressure and equivalent thermal conductivity are drawn.

The characteristics of the thermally conductive material were determined using the calculation sheets of FIGS. 4 and 5. First, select low hardness for the hardness classification on the calculation sheet of FIG. 4, and select 0 mm or more and 5 mm or less for the product thickness, 4 W / m-K or more and 5 W / m-K or less for the catalog thermal conductivity, and 10 kV or more for the dielectric breakdown voltage. When the conditions of 50CAT20, 100CAT20, 150CAT20, 200CAT20, and 300CAT20 were input, five products were selected. Next, in FIG. 5, the above-mentioned 5 products were selected, and the relationship between pressure and thermal resistance, the relationship between pressure and thickness, and the relationship between pressure and equivalent thermal conductivity were drawn for the 5 products. In this way, the relationship between the pressure and thermal resistance of the thermally conductive material, the relationship between the pressure and the thickness, and the relationship between the pressure and the equivalent thermal conductivity could be easily obtained.

The present invention is not limited to the above embodiment. The above-described embodiment is an example, and any object having substantially the same configuration as the technical idea described in the claims of the present invention and exhibiting the same effect and effect is the present invention. Is included in the technical scope of.

51 ... Thermal conductive material, 52 ... Heat generating member, 53 ... Heat dissipation member (cooling member),
54 ... Heat transfer.

Claims (3)

It is a method of obtaining the characteristics of the heat conductive material when pressurizing the heat conductive material used for enhancing the heat transfer from the heat generating member to the heat radiating member.
For each product name of the heat conductive material, the relationship between the pressure at the time of pressurization and the heat resistance of the heat conductive material, the relationship between the pressure at the time of pressurization and the thickness of the heat conductive material, and the pressurization. The process of incorporating a characteristic database that stores the relationship between the pressure at the time and the equivalent thermal conductivity of the thermally conductive material into a computer, and
The step of selecting the product name of the heat conductive material in the computer and
For each product name of the selected heat conductive material, the computer describes the relationship between the pressure at the time of pressurization and the thermal resistance of the heat conductive material, the pressure at the time of pressurization and the thickness of the heat conductive material. The method of obtaining the characteristics of the heat conductive material at the time of pressurization by the step of displaying the relationship between the above and the pressure at the time of pressurization and the equivalent thermal conductivity of the heat conductive material on the screen of the screen display means. For each product name of the heat conductive material, the relationship between the pressure at the time of pressurization and the heat resistance of the heat conductive material and the relationship between the pressure at the time of pressurization and the thickness of the heat conductive material are constant in temperature. It was obtained based on the thermal resistance and thickness measured for each product name of the thermally conductive material by the steady method of measuring the thermal resistance under the conditions.
The relationship between the pressure at the time of pressurization and the equivalent thermal conductivity of the thermally conductive material for each product name of the thermally conductive material is the thermal resistance measured for each product name of the thermally conductive material by the steady method. And the relationship between the pressure at the time of pressurization and the thermal resistance of the heat conductive material obtained based on the thickness and the relationship between the pressure at the time of pressurization and the thickness of the heat conductive material. The method for obtaining the characteristics of a heat conductive material at the time of pressurization according to claim 1, wherein the material is present. Before selecting the product name of the heat conductive material, there is a step of narrowing down the product name candidates of the heat conductive material to be selected from the product names of the heat conductive material stored in the property database. death,
The process of narrowing down the product name candidates
The computer is provided with a product database in which the product name and the conditions of hardness classification, product thickness, catalog thermal conductivity, and dielectric breakdown voltage classified according to the hardness of the heat conductive material having the product name are associated with each other. The stage of incorporation and
A step of inputting at least one condition of the hardness classification, product thickness, catalog thermal conductivity, and dielectric breakdown voltage into the computer.
The stage where the computer lists the product names that meet the entered conditions based on the product database, and
The method for obtaining the characteristics of a heat conductive material at the time of pressurization according to claim 1 or 2, wherein the product name candidates that meet the input conditions are narrowed down.

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