JP6948357B2 - Thermoplastic composition - Google Patents

Description

The present invention relates to thermoplastic compositions.

The thermoplastic composition can be melted by heating it above a predetermined temperature. From this, for example, a thermoplastic composition that can be melted at a molding processing temperature can be melted at the time of molding processing and molded by a well-known resin molding method, and can be used as a molding material. Further, the thermoplastic composition can also be used as an adhesive utilizing the property of melting at a predetermined temperature or higher, that is, a hot melt adhesive or the like. Examples of such a thermoplastic composition include the hot melt adhesive composition described in Patent Document 1.

Patent Document 1 describes a hot melt adhesive composition comprising an acrylic block copolymer, wherein the acrylic block copolymer is present in the composition in an amount less than about 50% by mass based on the mass of the adhesive composition. Have been described.

Japanese Unexamined Patent Publication No. 2004-204231

When the thermoplastic composition is used as an adhesive or the like, as described above, it is melted by heating and used, so that no solvent is particularly required. Since it is solvent-free as described above, the thermoplastic composition is preferably used even when the films are bonded to each other. For example, a thermoplastic composition is used when laminating films having different functions to produce a multifunctional film laminate. Further, examples of such a multifunctional film laminate include a device using an organic thin film and the like.

As devices using an organic thin film, for example, an organic electroluminescence element (organic EL element), an organic thin film solar cell, and the like are attracting attention. An organic thin-film solar cell is an organic device that utilizes the principle of generating electricity by irradiating an organic substance (organic thin film) laminated in a thin film on an electrode by vapor deposition or the like with light. By using an organic thin film, it becomes a thinner and more flexible solar cell than a silicon-based solar cell, and is expected to be applied in a wide range. Further, the organic EL element has a laminated structure in which an organic thin film which is an organic light emitting material layer is sandwiched between a pair of electrodes facing each other, and electrons are injected into the organic light emitting material layer from one electrode. When holes are injected from the other electrode, electrons and holes combine in the organic light emitting material layer to emit light. In this way, since the organic EL element emits light by itself, it has better visibility than a liquid crystal display element or the like that requires a backlight, can be made thinner, and can be driven by a low DC voltage. It has the advantage of being.

On the other hand, a device using an organic thin film has a problem that the organic thin film or the like is deteriorated due to moisture or the like, and the function performed by the device is deteriorated. Therefore, devices using organic thin films are required to prevent the intrusion of moisture and the like inside. Further, as an organic EL element, for example, a bendable element has been developed. In such an organic EL element, in order to prevent moisture or the like from entering the device, a flexible base material and a film having a gas barrier property are bonded together instead of using a glass base material. Laminates may be used. The thermoplastic composition is also used for such bonding. That is, the thermoplastic composition can be used for encapsulating devices using an organic thin film, such as an organic EL element and an organic thin film solar cell.

With conventional thermoplastic compositions, for example, the hot melt adhesive composition described in Patent Document 1, it may not be possible to sufficiently prevent moisture or the like from entering the device. Therefore, a conventional hot melt is used as a thermoplastic composition used for encapsulating a device using an organic thin film, specifically, as a thermoplastic composition used for bonding films to each other in a device using an organic thin film. The use of adhesives can cause the above problems. That is, there is a possibility that the organic thin film or the like is deteriorated by moisture or the like, and the function performed by the device is deteriorated. According to the studies by the present inventors, it has been found that the occurrence of the above-mentioned problems can be suppressed by using a thermoplastic composition which is excellent not only in adhesiveness but also in hygroscopicity.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a thermoplastic composition having excellent not only adhesiveness but also hygroscopicity.

As a result of various studies, the present inventor has found that the above object can be achieved by the following invention.

The thermoplastic composition according to one aspect of the present invention contains a thermoplastic polymer, a tackifier, and a hygroscopic filler, and the average particle size of the hygroscopic filler is 10 μm or less.

According to such a configuration, it is possible to provide a thermoplastic composition having excellent hygroscopicity and adhesiveness.

Further, in the thermoplastic composition, it is preferable that the hygroscopic filler is at least one selected from the group consisting of zeolite, molecular sieve, magnesium aluminometasilicate, and magnesium oxide.

According to such a configuration, it is possible to provide a thermoplastic composition having more excellent hygroscopicity and adhesiveness.

Further, in the thermoplastic composition, the content of the hygroscopic filler is preferably 0.5 to 40 parts by mass with respect to 100 parts by mass of the thermoplastic composition.

According to such a configuration, it is possible to provide a thermoplastic composition having more excellent hygroscopicity and adhesiveness.

Further, in the thermoplastic composition, the thermoplastic polymer is a polymer containing an acrylic acid alkyl ester unit in the molecule, a polymer containing a methacrylic acid alkyl ester unit in the molecule, and a conjugated diene compound and a vinyl aromatic fragrance. It is preferably at least one of the copolymers with the group hydrocarbons.

According to such a configuration, it is possible to provide a thermoplastic composition having more excellent hygroscopicity and adhesiveness.

According to the present invention, it is possible to provide a thermoplastic composition having excellent not only adhesiveness but also hygroscopicity.

It has been studied to contain a relatively large filler in a thermoplastic composition used for encapsulating a device using an organic thin film, etc., for the following reasons.

In a device using an organic thin film, in order to suppress the occurrence of the above-mentioned problem that the organic thin film or the like is altered by moisture or the like and the function performed by the device is deteriorated, the organic thin film or the like is covered or the members are covered with each other. It is conceivable to reduce the permeability of the thermoplastic composition used for bonding and sealing, such as moisture. From this, it is considered that the thermoplastic composition used for sealing the device using the organic thin film also reduces the permeability of water and the like. As a method for reducing the permeability of water and the like, for example, by adding a filler to the thermoplastic composition, the water can be permeated by bypassing the filler to reduce the permeation amount per unit time. Be done. In such a case, it is conceivable to use a relatively large filler in order to more preferably bypass the water and further reduce the permeability of the water or the like.

The present inventors have focused on using a hygroscopic filler as a filler in a thermoplastic composition, which not only lowers the permeability of water and the like, but also enhances the hygroscopicity. From the above, the present inventors have considered using a relatively large filler as the hygroscopic filler, but when a relatively large hygroscopic filler is used, not only the adhesiveness is lowered but also the hygroscopicity is lowered. I found out to do. According to the studies by the present inventors, it has been found that a thermoplastic composition having excellent not only adhesiveness but also hygroscopicity can be obtained by using a hygroscopic filler having an average particle size of 10 μm or less.

Hereinafter, embodiments according to the present invention will be described, but the present invention is not limited thereto.

The thermoplastic composition according to the embodiment of the present invention contains a thermoplastic polymer, a tackifier, and a hygroscopic filler. The hygroscopic filler has an average particle size of 10 μm or less.

Such a thermoplastic composition can exhibit tackiness by containing a thermoplastic polymer and further containing a tackifier. That is, the thermoplastic composition is melted by heating, applied to an adherend to be adhered, and the adherends are held in contact with each other via the melted thermoplastic composition. Thereby, the adherends can be adhered to each other. Further, the thermoplastic composition can exhibit hygroscopicity while suppressing a decrease in adhesiveness by containing a hygroscopic filler having an average particle size of 10 μm or less. That is, a thermoplastic composition having excellent hygroscopicity and adhesiveness can be obtained. The thermoplastic composition is solid (solid) at room temperature, has fluidity when heated, and can be applied to an adherend which is an object to be adhered. After application, it is cooled. It can be used as an adhesive capable of solidifying and adhering adherends to each other, that is, a so-called hot melt adhesive. Further, the thermoplastic composition can be used in a device using an organic thin film when covering the organic thin film or the like or adhering and sealing the members to each other. By sealing the organic thin film in the device using the organic thin film with the thermoplastic composition, it is possible to suppress the occurrence of deterioration of the function performed by the device due to the deterioration of the organic thin film or the like due to moisture or the like.

This is considered to be due to the following.

First, as described above, the thermoplastic composition can exhibit tackiness by containing a thermoplastic polymer and further containing a tackifier. Then, it is considered that the thermoplastic composition can enhance the hygroscopicity by containing the hygroscopic filler. On the other hand, according to the study by the present inventors, if an excessively large hygroscopic filler is contained, not only a suitable adhesive layer cannot be formed and the adhesiveness cannot be enhanced, but also the hygroscopicity is sufficiently enhanced. I couldn't. On the other hand, if a hygroscopic filler having an average particle diameter of 10 μm or less is used as the hygroscopic filler contained in the thermoplastic composition, it is considered that a suitable adhesive layer can be formed and a decrease in adhesiveness can be suppressed. .. Further, if the hygroscopic filler has an average particle size of 10 μm or less, it is considered that the contact area with the permeating moisture or the like is increased and the hygroscopicity can be improved. From these facts, it is considered that a thermoplastic composition having excellent hygroscopicity and adhesiveness can be obtained by containing a hygroscopic filler having an average particle size of 10 μm or less.

The thermoplastic polymer used in this embodiment is not particularly limited. Examples of the thermoplastic polymer include a thermoplastic polymer used as a component constituting a hot melt adhesive, and more specifically, a thermoplastic polymer used as a base polymer which is a main component of a hot melt adhesive. Be done. Specific examples of the thermoplastic polymer include elastomer-based, olefin-based, ethylene-vinyl acetate copolymer (EVA) -based, polyester-based, polyamide-based, and polyacrylic-based thermoplastic polymers. Among these, in the present embodiment, the elastomer-based thermoplastic polymer and the polyacrylic-based thermoplastic polymer are preferable.

The polyacrylic thermoplastic polymer is not particularly limited as long as it is used as the polyacrylic thermoplastic polymer in the hot melt adhesive. Examples of the polyacrylic thermoplastic polymer include polymers containing an acrylic acid alkyl ester unit, a methacrylic acid alkyl ester unit, and the like in the molecule, and specifically, the molecule contains an acrylic acid alkyl ester unit. Examples thereof include polymers, polymers containing methacrylic acid alkyl ester units in their molecules, and polymers containing acrylic acid alkyl ester units and methacrylic acid alkyl ester units in their molecules. Further, the polyacrylic thermoplastic polymer may be a polymer containing an acrylic acid unit or a methacrylic acid unit in addition to the acrylic acid alkyl ester unit and the methacrylate alkyl ester unit. More specific examples of the polyacrylic thermoplastic polymer include polyacrylic acid esters and polymethacrylic acid esters.

The elastomer-based thermoplastic polymer is not particularly limited as long as it is used as an elastomer-based thermoplastic polymer in a hot melt adhesive, and has, for example, a structural unit (conjugated diene unit) based on a conjugated diene compound. Examples thereof include a conjugated diene-based polymer which is a polymer. Specific examples of the elastomer-based thermoplastic polymer include a thermoplastic block copolymer which is a copolymer of a conjugated diene-based compound and a vinyl-based aromatic hydrocarbon. That is, such a thermoplastic block copolymer is preferably used as the thermoplastic polymer.

The conjugated diene compound is not particularly limited as long as it is a diolefin compound having at least a pair of conjugated double bonds. Specific examples of the conjugated diene compound include 1,3-butadiene, 2-methyl-1,3-butadiene (isoprene), 2,3-dimethyl-1,3-butadiene, 1,3-pentadiene, and the like. Examples thereof include 1,3-hexadiene.

The vinyl-based aromatic hydrocarbon is not particularly limited as long as it is an aromatic hydrocarbon having a vinyl group. Specific examples of vinyl-based aromatic hydrocarbons include styrene, o-methylstyrene, p-methylstyrene, p-tert-butylstyrene, 1,3-dimethylstyrene, α-methylstyrene, vinylnaphthalene, and vinyl. Anthracene and the like can be mentioned.

The conjugated diene-based polymer may be a hydrogenated hydrogenated conjugated diene-based polymer or a non-hydrogenated conjugated diene-based polymer that has not been hydrogenated. ..

As the thermoplastic polymer, the thermoplastic block copolymer is preferable, and specific examples thereof include, for example, a styrene-butadiene block copolymer, a styrene-isoprene block copolymer, a hydrogenated styrene-butadiene block copolymer, and hydrogenation. Examples thereof include the styrene-isoprene block copolymers obtained. In addition, these copolymers include ABA-type triblock copolymers. Examples of the styrene-butadiene block copolymer include styrene-butadiene-styrene block copolymer (SBS). Examples of the styrene-isoprene block copolymer include styrene-isoprene-styrene block copolymer (SIS). Examples of the hydrogenated styrene-butadiene block copolymer include styrene-ethylene-butylene-styrene block copolymer (SEBS). Examples of the hydrogenated styrene-isoprene block copolymer include styrene-ethylene-propylene-styrene block copolymer (SEPS).

The olefin-based thermoplastic polymer is not particularly limited as long as it is used as an olefin-based thermoplastic polymer in a hot melt adhesive. Examples of the olefin-based thermoplastic polymer include a Ziegler-Natta catalyst, a polyolefin-based compound polymerized with a single-site catalyst, and the like, which are solid at room temperature. Specific examples of the olefin-based thermoplastic polymer include polyethylene, polypropylene, poly-1-butene, polyisobutylene, and random copolymers or blocks in any ratio of propylene to ethylene and / or 1-butene. Polymers, ethylene-propylene-diene ternary copolymers containing diene components in all ratios of ethylene and propylene, random copolymers of ethylene or propylene and vinyl compounds, block copolymers, random polypropylene, block polypropylene , Homopolypropylene, ethylene / propylene copolymer, ethylene / 1-butene copolymer, ethylene / 1-hexene copolymer, ethylene / 1-octene copolymer, propylene / ethylene copolymer, propylene / ethylene / a -Buten copolymer, 1-butene homopolymer, 1-butene / ethylene copolymer, 1-butene / propylene copolymer, propylene / 1-butene copolymer, ethylene / vinyl acetate copolymer, ethylene / Examples thereof include a methacrylic acid copolymer and an ethylene / methyl methacrylate copolymer. As the olefin-based thermoplastic polymer, for example, among the compounds exemplified above, an olefin-based polymer polymerized using an olefin (alkene) such as α-olefin as a monomer is preferable. Specific examples of the olefin polymer include poly-α-olefin polymers. More specifically, the poly-α-olefin polymer is preferably an amorphous-poly-α-olefin polymer (APAO), a homopolymer of propylene (propylene homopolymer), or the like. More specifically, as the propylene homopolymer, a propylene homopolymer obtained by polymerizing propylene using a metallocene catalyst or the like is preferable.

The EVA-based thermoplastic polymer is not particularly limited as long as it is used as an EVA-based thermoplastic polymer in a hot melt adhesive, and examples thereof include a copolymer synthesized from ethylene and vinyl acetate. Be done.

The polyester-based thermoplastic polymer is not particularly limited as long as it is used as the polyester-based thermoplastic polymer in the hot melt adhesive. Examples of the polyester-based thermoplastic polymer include polyester polymerized using dimer acid as a monomer.

The polyamide-based thermoplastic polymer is not particularly limited as long as it is used as a polyamide-based thermoplastic polymer in a hot melt adhesive, and examples thereof include polyamide.

By containing the above-mentioned thermoplastic polymer, it becomes a thermoplastic composition which is solid (solid) at room temperature and has fluidity when heated. Such a thermoplastic composition can exhibit excellent adhesiveness and the like.

As the thermoplastic polymer, the above-exemplified thermoplastic polymer may be used alone or in combination of two or more.

The weight average molecular weight of the thermoplastic polymer varies depending on the type of the thermoplastic polymer and is not particularly limited, but is preferably 10,000 to 500,000, more preferably 50,000 to 300,000, for example. If the molecular weight of the thermoplastic polymer is too small, the cohesive force tends to decrease and the stability over time tends to decrease. Further, if the molecular weight of the thermoplastic polymer is too large, the melt viscosity tends to increase and the coatability tends to decrease. The weight average molecular weight here may be any weight average molecular weight measured by a general measuring method, and examples thereof include a weight average molecular weight measured by gel permeation chromatography (GPC).

The tackifier used in this embodiment is not particularly limited. Examples of the tackifier include tackifiers generally used for hot melt adhesives. More specific examples of the tackifier include rosin-based resins, terpene-based resins, petroleum-based resins, and α-methylstyrene resins.

Examples of the rosin-based resin include natural rosins such as gum rosin, tall rosin and wood rosin, asymmetric rosin, polymerized rosin, and rosin esters thereof (glycerin ester and pentaerythritol ester of rosin). Further, the rosin-based resin may be one in which each of the above-mentioned rosin-based resins is not hydrogenated, or a hydrogenated one, that is, a hydrogenated product (hydrogenated product) of the above-mentioned rosin-based resin. May be good.

Examples of the terpene resin include a terpene resin, a hydrocarbon-modified terpene resin, an aromatic-modified terpene resin, and a phenol-based modified terpene resin. Further, the terpene-based resin may be one in which each of the above terpenes is not hydrogenated, or one in which hydrogenation is applied, that is, a hydrogenated product (hydrogenated product) of the above-mentioned terpene-based resin. .. Further, as the terpene-based resin, an aromatic-modified terpene resin hydride, an aromatic-modified terpene resin, and a terpene resin hydride are preferable, and an aromatic-modified terpene resin hydride is more preferable.

Examples of the petroleum-based resin include aliphatic petroleum resins, alicyclic petroleum resins, aromatic petroleum resins, and hydrogenated products thereof (hydrogenates). Further, as the petroleum-based resin hydride, an aliphatic petroleum resin hydride, an alicyclic petroleum resin hydride, and an aromatic petroleum resin hydride are preferable. Examples of the alicyclic petroleum resin hydride include hydrogenated C9 petroleum resin and hydrogenated dicyclopentadiene petroleum resin.

As the tackifier, the above-exemplified tackifier may be used alone or in combination of two or more.

The hygroscopic filler used in the present embodiment is not particularly limited as long as it is a hygroscopic filler having an average particle size of 10 μm or less. Here, the hygroscopic filler is a filler having a performance of taking in moisture in the air (hygroscopicity). For example, the hygroscopic filler is left for 24 hours under the conditions of a temperature of 25 ° C. and a relative humidity of 60% RH. Examples of the hygroscopic filler take in moisture in the air and increase the amount by 5% by mass or more. The mass increase of the hygroscopic filler when the hygroscopic filler is left for 24 hours under the conditions of a temperature of 25 ° C. and a relative humidity of 60% RH is preferably 10% by mass or more, preferably 20% by mass. % Or more is more preferable.

Examples of the hygroscopic filler include zeolite, molecular sieve, magnesium aluminometasilicate, magnesium oxide and the like. Further, as the hygroscopic filler, the above-exemplified adsorptive filler may be used alone or in combination of two or more.

The hygroscopic filler has an average particle size of 10 μm or less, preferably 1 μm or less, and more preferably 0.5 μm or less. If the hygroscopic filler is too large, as described above, not only the adhesiveness of the thermoplastic composition is lowered, but also the hygroscopicity of the thermoplastic composition tends to be lowered. The hygroscopic filler is preferably small, but in reality, the limit is about 0.01 μm. For example, in the case of zeolite or molecular sieve, the limit is about 0.01 μm in order to maintain the structure. From this, the hygroscopic filler preferably has an average particle size of 0.01 to 10 μm, preferably 0.01 to 1 μm, and more preferably 0.01 to 0.5 μm. ..

Examples of the average particle size of the hygroscopic filler include volume average particle size and the like. Further, the average particle size can be measured by using, for example, a field emission scanning electron microscope (FE-SEM) or the like. Specific examples of the field emission scanning electron microscope (FE-SEM) include SU9000 manufactured by Hitachi High-Technologies Corporation.

The hygroscopic filler preferably has an aspect ratio of 1 to 100, and more preferably 1 to 10. It is considered that the lower the aspect ratio of the hygroscopic filler, the higher the dispersibility of the hygroscopic filler in the thermoplastic composition. For this reason, it is preferable that the aspect ratio of the hygroscopic filler is low to some extent.

The aspect ratio is calculated by observing a randomly collected hygroscopic filler with a scanning microscope, measuring the maximum major axis of the hygroscopic filler and the width orthogonal to the maximum major axis from the obtained image, and calculating from these. be able to.

In the thermoplastic composition, the contents of the thermoplastic polymer, the tackifier, and the hygroscopic filler are not particularly limited as long as they do not impair the desired properties desired by the present invention. Examples of each of the contents include the following ranges.

The content of the thermoplastic polymer is preferably 10 to 80 parts by mass, more preferably 20 to 70 parts by mass, and 20 to 60 parts by mass with respect to 100 parts by mass of the thermoplastic composition. It is more preferable to have. If the content of the thermoplastic polymer is too small, the cohesive force tends to be insufficient. On the other hand, if the content of the thermoplastic polymer is too large, the melt viscosity tends to increase and the coatability tends to decrease. This content is the content with respect to the total amount of the thermoplastic composition.

The content of the tackifier is preferably 10 to 80 parts by mass, more preferably 20 to 70 parts by mass, and 30 to 70 parts by mass with respect to 100 parts by mass of the thermoplastic composition. It is more preferable to have. If the content of the tackifier is too small, the adhesive strength tends to decrease and the adhesive strength tends to decrease. On the other hand, if the content of the tackifier is too large, the flexibility and flexibility are lost, the stress dispersibility is lowered, and the holding power tends to be lowered. This content is the content with respect to the total amount of the thermoplastic composition.

The content of the adsorptive filler is preferably 0.5 to 40 parts by mass, more preferably 1 to 30 parts by mass, and 1 to 20 parts by mass with respect to 100 parts by mass of the thermoplastic composition. It is more preferably a part. If the content of the adsorptive filler is too small, the effect of adding the adsorptive filler, that is, the hygroscopicity tends to decrease. Further, if the content of the adsorptive filler is too large, it tends to be difficult to obtain a thermoplastic composition having excellent adhesiveness, for example, the adhesiveness is lowered. This content is the content with respect to the total amount of the thermoplastic composition.

The thermoplastic composition according to the present embodiment may contain components other than the thermoplastic polymer, the tackifier, and the hygroscopic filler as long as the desired properties of the present invention are not impaired. good. Specifically, the thermoplastic composition includes a softener, an antioxidant, a heat stabilizer, a light stabilizer, an ultraviolet absorber, a filler, a surfactant, a coupling agent, a colorant, an antistatic agent, and the like. Additives such as flame retardants, waxes, and plasticizers may be included.

The softener is not particularly limited, and examples thereof include softeners generally used for hot melt adhesives. Examples of the softening agent include oils such as mineral oils, synthetic oils, vegetable oils, and fatty acid esters.

Specific examples of the mineral oils include process oils and liquid paraffins. The process oil is an oil generally used as a plasticizer such as rubber and a thermoplastic elastomer, and is an oil produced in so-called petroleum refining and the like. The process oil is generally a mixture containing an aromatic ring, a naphthenic ring, and a paraffin chain, and is roughly classified into a paraffinic process oil, a naphthenic process oil, and an aromatic process oil. Process oils are paraffin-based with paraffin chain carbons accounting for 50% or more of the total carbon number, naphthen-based with naphthen ring carbons of 30% or more, and aromatic carbons with aromatic carbons of 30% or more. Distinguished from aromatics. Examples of the paraffin-based process oil include paraffin-based compounds having 4 to 155 carbon atoms, and preferably paraffin-based compounds having 4 to 50 carbon atoms. Specific examples of the paraffin-based process oil include butane, pentane, hexane, heptane, octane, nonane, decane, undecane, dodecane, tetradecane, pentadecane, hexadecane, heptadecane, octadecane, nonadecan, eikosan, heneikosan, dokosan, and tricosan. , Tetracosan, Pentadecane, Hexakosan, Heptakosan, Octadecane, Nonakosan, Triacontane, Hentriacontan, Dotriacontane, Pentriacontan, Hexadecane, and Heptacontane n-paraffin, isobutane, isopentane, neopentane, isohexane, isoheptan, neo Hexane, 2,3-dimethylbutane, various methylhexane, 3-ethylpentane, various dimethylpentane, 2,2,3-trimethylbutane, 3-methylheptane, various dimethylhexane, various trimethylpentane, isononan, 2-methylnonane, Examples thereof include isoparaffins such as isodecane, isounedecane, isododecane, isotridecane, isotetradecane, isopentadecane, isooctadecane, isonanodecane, isoeicosane, and 4-ethyl-5-methyloctane, and derivatives of these saturated hydrocarbons. These paraffinic compounds of choice can be used in mixtures and are liquid at room temperature.

Specific examples of the synthetic oils include phosphate esters, chlorinated paraffins, ethylene-α-olefin oligomers, polybutenes, low molecular weight polybutadienes, polyisoprenes, and hydrogenated products thereof, which are liquid at room temperature. Be done.

Specific examples of the vegetable oils include olive oil, carnauba wax, rice germ oil, corn oil, southern ka oil, camellia oil, castor oil, jojoba seed oil, and eucalyptus leaf oil.

Specific examples of the fatty acid esters include isopropyl myristate, octyldodecyl myristate, glycerin triisooctanoate, diisopropyl adipate, diethyl sebacate, cetyl ethylhexanoate, cetyl palmitate, ethylhexyl palmitate, and isopropyl palmitate. , Medium chain fatty acid triglyceride, ethylene glycol salicylate, glycol distearate and the like.

Examples of the antioxidant include a phenol-based antioxidant, an organic sulfur-based antioxidant, and a phosphorus-based antioxidant. Examples of the phenolic antioxidant include 2,6-di-tert-butyl-4-methylphenol, n-octadecyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate, and 2 -Tert-Butyl-6- (3-tert-butyl-2-hydroxy-5-methylbenzyl) -4-methylphenylacrylate, tetrakis [methylene-3- (3,5-di-tert-butyl-4-hydroxy) Phenyl) propionate] methane and the like. Examples of the organic sulfur-based antioxidant include dilauryl-3,3'-thiodipropionate, dimyristyl-3,3'-thiodipropionate, disstearyl-3,3'-thiodipropionate, and pentaelis. Examples thereof include lithyltetrakis (3-laurylthiopropionate). Examples of the phosphorus-based antioxidant include tris (nonylphenyl) phosphite, tris (2,4-di-t-butylphenyl) phosphite and the like. As these antioxidants, the above-exemplified antioxidants may be used alone or in combination of two or more.

The wax is not particularly limited, and examples thereof include wax contained in a hot melt adhesive. Examples of the wax include synthetic wax, petroleum wax, natural wax and the like. Examples of synthetic waxes include polyolefin waxes such as Fischer-Tropsch wax, polyethylene wax and polypropylene wax. Examples of petroleum wax include paraffin wax, microcrystalline wax, petrolatum and the like. Examples of the natural wax include montan wax, wood wax, carbana wax, beeswax, and custard wax. As these waxes, the waxes exemplified above may be used alone, or two or more kinds may be used in combination.

The method for producing the thermoplastic composition according to the present embodiment is not particularly limited as long as it is a production method capable of producing the thermoplastic composition having the above constitution. Examples of the method for producing the thermoplastic composition include a method of heating and melting the components constituting the thermoplastic composition and stirring and kneading the components. By doing so, a thermoplastic composition having high dispersibility of the components constituting the thermoplastic composition can be obtained. Further, as an apparatus for realizing this method, for example, a stirring kneader, a roll, a Banbury mixer, a kneader, an extruder and the like equipped with a heating apparatus can be mentioned.

As described above, the thermoplastic composition can be used as a hot melt adhesive. The bonding method using the thermoplastic composition is not particularly limited as long as it can be used as a bonding method using a hot melt adhesive. As an bonding method using a hot melt adhesive, for example, the hot melt adhesive is melted by heating. Then, the melted hot melt adhesive is applied to the adherend to be adhered. By leaving the other adherend in contact with the applied hot melt adhesive, the hot melt adhesive is cooled and solidified. This solidified hot melt adhesive adheres the adherends to each other. The method of applying the hot melt adhesive is not particularly limited as long as the hot melt adhesive can be suitably applied to the adherend. This coating method is roughly classified into, for example, a contact coating method and a non-contact coating method. The contact coating method refers to a coating method in which a device used for coating, such as a coating machine, is in contact with an adherend when applying a hot melt adhesive. The non-contact coating method refers to a coating method in which a coating machine or the like is not in contact with an adherend when applying a hot melt adhesive. Examples of the contact coating method include slot coating (slot coat gun manufactured by Nordson Co., Ltd.) and roll coater coating. As non-contact coating methods, for example, spiral coating (spiral spray nozzle manufactured by Suntool Co., Ltd.) that can be applied in a spiral shape, spray coating that can be applied in a wavy shape (omega coat manufactured by ITW Dynatec Co., Ltd., etc.) , Spray coating that can be applied in a plane shape (curtain spray head manufactured by Suntool Co., Ltd., etc.), dot coating that can be applied in a dot shape, and the like. The hot melt adhesive according to this embodiment is suitable for spiral coating. Spiral coating is a method in which the adhesive is spirally applied in a non-contact manner with air by intermittent or continuous coating.

The thermoplastic composition can be used in a device using an organic thin film when covering the organic thin film or the like or adhering and sealing the members to each other. The sealing method is not particularly limited as long as it can seal a device using an organic thin film. As the sealing method, for example, in a device using an organic thin film, a method of covering the organic thin film or the like with the thermoplastic composition, and members constituting the device using the organic thin film are subjected to the thermoplastic composition. Examples thereof include a method of adhering with an object. Further, in this sealing method, the method of applying the thermoplastic composition can be the same as the bonding method using the hot melt adhesive.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the scope of the present invention is not limited thereto.

First, in this example, each component used when preparing a thermoplastic composition will be described.

[Thermoplastic polymer]
Thermoplastic Polymer 1: Polymer containing an acrylic acid alkyl ester unit and a methacrylic acid alkyl ester unit in the molecule (KURARITY LA3320 manufactured by Kuraray Co., Ltd., a copolymer of an acrylic acid alkyl ester and a methacrylic acid alkyl ester)
Thermoplastic Polymer 2: Polymer containing an acrylic acid alkyl ester unit and a methacrylic acid alkyl ester unit in the molecule (KURARITY LA1114 manufactured by Kuraray Co., Ltd., a copolymer of an acrylic acid alkyl ester and a methacrylic acid alkyl ester)
Thermoplastic Polymer 3: Copolymer of conjugated diene compound and vinyl aromatic hydrocarbon (Quintac3433N, styrene-isoprene-styrene block copolymer (SIS) manufactured by Nippon Zeon Co., Ltd.)
[Adhesive]
Adhesive imparting agent 1: Rosin ester (Silvalite RE10L manufactured by Clayton)
Adhesive imparting agent 2: α-methylstyrene resin (Silvales SA100 manufactured by Clayton)
Adhesive imparting agent 3: Rosin ester (Silvalite RE100L manufactured by Clayton)
[Hygroscopic filler]
Zeolite 1: Zeolite with a volume average particle size of 50 nm (Zeoal 4A manufactured by Nakamura Choukou Co., Ltd., aspect ratio 1-2)
Zeolite 2: Zeolite with a volume average particle size of 300 nm (Zeoal 4A manufactured by Nakamura Choukou Co., Ltd., aspect ratio 1-2)
Molecular sheave: Molecular sieve with a volume average particle size of 10 μm (Molecular sieve 13X powder manufactured by Union Showa Co., Ltd., aspect ratio 1-2)
Magnesium aluminometasilicate: Magnesium aluminometasilicate having a volume average particle diameter of 9 μm (Noisillin UFL2 manufactured by Fuji Chemical Industries, Ltd., aspect ratio 1-2)
Magnesium oxide: Magnesium oxide with a volume average particle diameter of 50 nm (Magnesia 500A manufactured by Ube Material Industries Ltd., aspect ratio 1-2)
Zeolite 3: Zeolite with a volume average particle size of 100 μm (Nitto Zeolite # 150 manufactured by Nitto Kako Kogyo Co., Ltd., aspect ratio 5-10)
Zeolite 4: Zeolite with a volume average particle size of 200 μm (Nitto Zeolite # 70 manufactured by Nitto Kako Kogyo Co., Ltd., aspect ratio 5-10)
[Softener]
Softener: Oil (Cosmo SP 52M manufactured by Cosmo Oil Lubricants Co., Ltd.)
[Antioxidant]
Antioxidant 1: BASF's Ilganox 1010
Antioxidant 2: BASF's Irgafos 168
[Manufacturing method of thermoplastic composition]
Each of the above components was kneaded in the following procedure so as to have the blending amount (composition: parts by mass) shown in Table 1 below to prepare a thermoplastic composition. Sufficiently, each of the above components is put into a stirring and kneading machine so as to have a blending amount (composition: parts by mass) shown in Table 1 below, and stirred while being heated to 150 to 190 ° C. It was melted. By doing so, a thermoplastic composition was produced.

[evaluation]
(Hygroscopic)
The hygroscopicity of the thermoplastic composition was evaluated as follows.

First, the mass of the produced thermoplastic composition (mass before standing) was measured with a balance. Then, the mass-measured thermoplastic composition was allowed to stand for 1000 hours in an environment of a temperature of 25 ° C. and a relative humidity of 60% RH. The mass of the thermoplastic composition after standing (mass after standing) was measured with a balance. Based on the measured mass, the hygroscopicity was calculated from the following formula.

Hygroscopicity (mass%) = (mass after standing-mass before standing) / mass before standing x 100
If the hygroscopicity was higher than 1.5% by mass, the hygroscopicity was evaluated as "⊚". When the hygroscopicity was 0.5% by mass or more and 1.5% by mass or less, the hygroscopicity was evaluated as “◯”. When the hygroscopicity was less than 0.5% by mass, the hygroscopicity was evaluated as "x".

(Adhesive)
The adhesiveness of the thermoplastic composition was evaluated as follows.

As the film base material, a composite film (Al-PET film manufactured by Toyo Aluminum Co., Ltd.) in which an aluminum foil and a polyethylene terephthalate film were laminated was used. The thermoplastic composition was melted on a rotating roll using a roll coater of Ebino Kosan Co., Ltd., and the melted thermoplastic composition was applied to the aluminum (Al) side of the film base material to a thickness of 20 μm. The thermoplastic composition of the film base material to which the thermoplastic composition was applied was superposed so that the aluminum (Al) side of the composite film prepared separately was in contact with the thermoplastic composition. Then, after making two reciprocations under the load of a roll weighing 2 kg, laminating was performed at a setting of 150 ° C. using a laminator manufactured by Hisago Co., Ltd. The force required for laminating and peeling the film substrate from the laminate in an environment of room temperature (23 ° C.) was measured by an autograph manufactured by Shimadzu Corporation. The measured average test force (N / 25 mm) was taken as the adhesive force.

If the adhesive strength was higher than 3.0 N / 25 mm, the adhesive strength was evaluated as “⊚”. Further, when the adhesive strength was 1.0 N / 25 mm or more and 3.0 N / 25 mm or less, the adhesive strength was evaluated as “◯”. Further, when the adhesive strength was less than 1.0 N / 25 mm, the adhesive strength was evaluated as “x”.

The evaluation results are shown in Table 1 together with the blending amount of the thermoplastic composition.

As can be seen from Table 1, in the case of the thermoplastic composition containing the hygroscopic filler having an average particle size of 10 μm or less (Examples 1 to 12), only when the hygroscopic filler is not contained (Comparative Example 1). However, it contains a hygroscopic filler, but its hygroscopicity and adhesiveness are higher than those in the case where the average particle size exceeds 10 μm (Comparative Examples 2 to 5).

Claims (3)

Contains a thermoplastic polymer, a tackifier, and a hygroscopic filler.
The hygroscopic filler is a thermoplastic composition characterized by being a zeolite having an average particle size of 50 nm or less. The content of the hygroscopic filler, relative to the thermoplastic composition 100 parts by weight of the thermoplastic composition according to claim 1 which is 0.5 to 40 parts by weight. The thermoplastic polymer is a polymer containing an acrylic acid alkyl ester unit in the molecule, a polymer containing a methacrylic acid alkyl ester unit in the molecule, and a copolymer of a conjugated diene compound and a vinyl aromatic hydrocarbon. The thermoplastic composition according to claim 1 or 2 , which is at least one of them.