JP6949258B2 - Manufacturing method of connecting body and connecting body - Google Patents

Description

The present technology relates to a method for manufacturing a connector for mounting a connector and a connector.

Conventionally, the connector is mounted by providing a solder paste on the substrate or by providing solder (BGA) on the lead wire portion of the connector and reflowing the solder mounting between the substrate and the connector (see, for example, Patent Document 1). In recent years, due to the demand for miniaturization of electronic devices, those having a connector pitch of 0.8 mm or less and further 0.3 mm or less are desired.

However, in the conventional mounting of the connector, since a resist is used for the terminal row on the substrate side, it is difficult to further narrow the pitch of the connector. Anisotropic connection can be mentioned as a technique for connecting narrow-pitch terminal rows. However, since the connector is generally a resin molded product, when anisotropic connection is performed, the tool is pressed during the main crimping. This causes the connector to be deformed, and there is a concern that the cable cannot be inserted, for example.

Japanese Unexamined Patent Publication No. 10-284199

This technology has been proposed in view of such conventional circumstances, and is a method for manufacturing a connector capable of suppressing deformation of a connector having a narrow pitch terminal row and obtaining excellent insulation and conductivity. And provide a connector.

In the method for manufacturing a connector according to the present technology, the minimum value of the distance between terminals is set on the first terminal row of the substrate via a heat-curable connecting material containing solder particles, and inside the joint surface with the substrate. Using a step of fixing a connector having a second terminal row having a value of 0.3 mm or less and a reflow furnace set to a temperature equal to or higher than the melting point of the solder particles, the first terminal row and the second terminal row possess a step of joining the door with no load, the ratio of the average particle size of the solder particles to the smallest value of the distance between the terminals in the first terminal row and the second terminal row is located at 0.1 or less The ratio of the average particle size of the solder particles to the thickness of the thermosetting connector is 0.83 or more and 1.2 or less .

The connector according to the present technology includes a substrate having a first terminal row, a connector having a second terminal row having a minimum value of the distance between terminals of 0.3 mm or less inside the joint surface with the substrate, and the like. The first terminal row and the second terminal row are joined by solder particles, and an adhesive layer for adhering the substrate and the connector is provided , and the first terminal row and the second terminal row are provided. The ratio of the average particle size of the solder particles to the minimum value of the distance between terminals in the above is 0.1 or less, and the ratio of the average particle size of the solder particles to the thickness of the thermosetting connector is 0.83 or more. It is 2 or less .

According to this technique, deformation of a connector having a narrow pitch terminal row can be suppressed, and excellent insulation and conductivity can be obtained. Further, as a secondary effect, it is possible to save space, reduce the weight, and reduce the cost of the connector provided with the connector.

FIG. 1 is a cross-sectional view schematically showing an example of a substrate. FIG. 2 is a cross-sectional view schematically showing a state in which a thermosetting connecting material is provided on the terminals of the substrate. FIG. 3 is a cross-sectional view schematically showing the alignment of the first terminal row of the substrate and the second terminal row of the connector. FIG. 4 is a cross-sectional view schematically showing a state of being pressed from the connector side by the tool. FIG. 5 is a cross-sectional view schematically showing a state in which the connector is fixed to the substrate. FIG. 6 is a cross-sectional view schematically showing a state in which the substrate and the connector are heated in a reflow oven. FIG. 7 is a cross-sectional view schematically showing the connecting body. FIG. 8 is a cross-sectional view showing an example of the connector in the lateral direction.

Hereinafter, embodiments of the present technology will be described in detail in the following order with reference to the drawings.
1. 1. Method of manufacturing the connector 2. Connection body 3. Thermosetting connection material 4. Example

<1. Manufacturing method of connector>
In the method for manufacturing a connector in the present embodiment, the minimum value of the distance between terminals is set on the first terminal row of the substrate via a heat-curable connecting material containing solder particles, and inside the joint surface with the substrate. The process of fixing the connector having the second terminal row having a value of 0.8 mm or less and the reflow furnace set to be equal to or higher than the melting point of the solder particles are used to eliminate the first terminal row and the second terminal row. It has a step of joining by a load. Here, the ratio of the average particle size of the solder particles to the minimum value of the distance between the terminals in the first terminal row and the second terminal row is preferably less than 0.15, and preferably 0.1 or less. More preferred.

In the present specification, the average particle size is, for example, N = 20 or more, preferably N = 50 or more, more preferably N = 50 or more in an observation image using an electron microscope such as a metallurgical microscope, an optical microscope, or an SEM (Scanning Electron Microscope). It is the average value of the major axis diameters of the particles measured at N = 200 or more, and when the particles are spherical, it is the average value of the diameters of the particles. In addition, the measured values and image-type grain size distribution of the observed images measured using known image analysis software ("WinROOF": Mitani Shoji Co., Ltd., "A image-kun (registered trademark)": Asahi Kasei Engineering Co., Ltd., etc.) It may be a measured value (N = 1000 or more) measured using a measuring device (for example, FPIA-3000 (Malburn)). The average particle size obtained from the observed image or the image-type particle size distribution measuring device can be the average value of the maximum lengths of the particles. When producing a thermocurable connection material, the particle size (D50) and the arithmetic mean diameter (volume basis) at which the cumulative frequency in the particle size distribution simply obtained by the laser diffraction / scattering method is 50%. The manufacturer value such as (preferably) can be used. Further, the connecting body is one in which two materials or members are electrically connected. Also, joining is the joining of two materials or members. No load means that there is no mechanical pressurization.

The board is not particularly limited as long as it is provided with wiring, and may be a rigid board as long as it can be broadly defined as a so-called printed wiring board (PWB) provided with electrodes on which a connector can be mounted. Alternatively, it may be a flexible printed circuit board (FPC). Examples of substrates depending on the type of substrate include glass substrates, ceramic substrates, plastic substrates, and the like.

The connector has a second terminal row in which the minimum value of the distance between terminals is 0.8 mm or less, the second terminal row is formed at least inside the joint surface with the substrate, and the connector main body portion is formed on the substrate. It is superimposed on the first terminal row. The minimum value of the distance between the terminals may be less than 0.35 mm. The first terminal row and the second terminal row (electrode arrangement, electrode group) provided on the board and the connector, respectively, are provided so as to face each other so that a plurality of connectors are mounted on one board. A terminal row may be provided on the board. That is, the substrate may be one in which a plurality of connectors are joined together.

Further, since the connector has a second terminal row inside the joint surface with the substrate, a sufficient load can be applied in the vertical direction in the process of aligning the connector and fixing the connector. , The solder particles are brought into contact with the terminals of the substrate and the terminals of the connector, and the oxide film on the surface of the solder particles can be easily removed. Alignment marks may be provided to correspond to the connector and the substrate.

Further, it is preferable that the surfaces of the terminals of the substrate and the terminals of the connector are gold-plated. It is desirable that the substrate and the connector have heat resistance in the reflow process.

The connecting body in the present embodiment is connected by solder particles widely used in BGA (Ball grid array) and the like, and has high connection reliability. Therefore, it is a sensor device, an in-vehicle device, and an IoT (Internet of Things). It can be applied to many applications such as equipment. However, it is smaller than the solder particles used in BGA.

The thermosetting connection material may be either a film-like thermosetting connection film or a paste-like thermosetting connection paste. Further, the thermosetting connection paste may be formed into a film at the time of connection, or may be formed into a form similar to a film by mounting a component.

In the case of a thermosetting connection paste, it suffices if a predetermined amount can be uniformly applied onto the substrate. For example, application methods such as dispensing, stamping, and screen printing can be used, and the paste may be dried if necessary. .. In this case, it can be expected that capital investment can be suppressed by diverting, modifying and applying the conventionally used solder paste equipment. In the case of a thermosetting connection film, not only the amount of the bonding material (for example, anisotropic conductive bonding material) can be made uniform depending on the film thickness, but also it can be laminated on the substrate all at once to shorten the tact. It is particularly preferable because it can be used. In addition, since it is easy to handle by forming it into a film in advance, it can be expected that the work efficiency will be improved. In this case, a film bonding device or a bonding device may be introduced or improved in some cases as described later in the conventional equipment, and the work efficiency can be improved with the minimum capital investment.

Hereinafter, with reference to FIGS. 1 to 7, a step of providing a thermocurable connector on the first terminal row of the substrate (A), a step of fixing the connector on the thermocurable connector (B), A step (C) of joining the first terminal row of the substrate and the second terminal row of the connector by using a reflow furnace set to a temperature equal to or higher than the melting point of the solder particles will be described.

[Step (A)]
FIG. 1 is a cross-sectional view schematically showing an example of a substrate, and FIG. 2 is a cross-sectional view schematically showing a state in which a thermosetting connecting material is provided on a terminal of the substrate. As shown in FIGS. 1 and 2, in the step (A), the thermosetting connection material 20 containing the solder particles 21 is provided on the first terminal row 11 of the substrate 10.

The step (A) may be a step of forming the thermosetting connection paste into a film on the substrate, and as used in the conventional conductive film or anisotropic conductive film, the thermosetting connection film is formed. It may be a temporary sticking step of sticking on the substrate at a low temperature and a low pressure, or it may be a laminating step of laminating a thermosetting connection film on the substrate.

When the step (A) is a temporary pasting step, a thermosetting connection film can be provided on the substrate under known usage conditions. In this case, only minimal changes such as installation and change of tools from the conventional device are required, which is economically advantageous.

When the step (A) is a laminating step, for example, a thermosetting connection film is laminated on the substrate using a pressure type laminator. The laminating step may be a vacuum pressurization type. In the case of temporary pasting using a conventional conductive film or anisotropic conductive film using a heating / pressing tool, the width of the film is restricted by the tool width, but in the laminating process, the heating / pressing tool is not used. It can be expected that a relatively wide width can be mounted all at once. Further, one thermosetting connection film may be laminated on one substrate. As a result, the vertical movement of the heat-bonding tool and the transfer of the thermosetting connection film are not performed a plurality of times, so that the time required for the step of providing the thermosetting connection material can be shortened.

In the step (A), since the bonding material is provided on the substrate, the thickness of the thermosetting connecting material is required to be within a predetermined range. The lower limit of the thickness of the thermosetting connection material is that if the thickness is too thin, the effect of easily sandwiching the solder particles between the electrodes can be expected, but there is a risk that the difficulty of forming the film will increase and the substrate The average particle size of the solder particles is 50% or more, preferably 80% or more, and more preferably 90% or more, because the technical difficulty of the solder particles is increased. The upper limit of the thickness of the thermosetting connecting material is 300% or less, preferably 200% or less, and more preferably 150% or less of the average particle size of the solder particles. If the thickness of the thermosetting connecting material is too thick, there is a risk that the joining will be hindered.

Further, when the pressing of the connector in the step (B) described later is taken into consideration, it is preferable to make it easy to remove the thermosetting connecting material before sandwiching the solder particles. Therefore, the solder particles with respect to the thickness of the thermosetting connecting material. The upper limit of the ratio of the average particle size of is preferably 1.4 or less, more preferably 1.2 or less, still more preferably 1.0 or less. If the ratio of the average particle size of the solder particles to the thickness of the thermosetting connecting material is large, a high pressure is required when pressing the connector in step (B), which may damage the connector, which is not preferable.

[Step (B)]
FIG. 3 is a cross-sectional view schematically showing the alignment of the terminal row of the substrate and the terminal row of the connector, and FIG. 4 is a cross-sectional view schematically showing a state of being pressed from the connector side by the tool. As shown in FIGS. 3 and 4, in the step (B), the terminal row 11 of the substrate 10 and the terminal row 31 of the connector 30 are aligned, and the connector 30 is fixed on the thermosetting connection material 20. Since self-alignment by solder cannot be expected in this technique, it is desirable to accurately align the substrate 10 and fix it with the thermosetting connecting material 20 in the step (B).

In step (B), the tool 40 is used to align the first terminal row 11 of the substrate 10 with the second terminal row 31 of the connector 30, and mount the connector 30 on the thermosetting connection material 20. .. The tool 40 is preferably a heating type pickup tool, and preferably has a suction mechanism for sucking the connector 30.

Further, in the step (B), temporary crimping is preferably performed by pressing from the connector 30 side with the tool 40. The pressure for pressing the connector 30 is larger than that in the step (A), and is applied to the electrode area where the first terminal row of the substrate 10 and the second terminal row of the connector 30 face each other, and the upper limit of the pressure is , There is no particular limitation as long as the connector body and the mounted parts are not deformed. Further, the lower limit of the pressure may be, for example, larger than 1.0 MPa, larger than 2.0 MPa, larger than 3.0 MPa, or larger than 5.0 MPa. In the temporary crimping, as shown in FIG. 4, the solder particles 21 are securely sandwiched between the electrodes of the first terminal row 11 of the substrate 10 and the second terminal row 31 of the connector 30, and heat is applied to the solder particles. The purpose of the 21 is to keep the solder joint 24 in the molten state or a state close to it, and to work advantageously for the joint between the electrodes due to the melting of the solder particles in the reflow process. Thereby, the oxide film on the surface of the solder particles can be removed. Further, in the temporary crimping, the first terminal row 11 of the substrate 10 and the second terminal row 31 of the connector 30 are brought into direct contact with each other, and the contribution of solder particles to the bonding is relatively reduced in the reflow process, resulting in continuity. May be stable and easy to obtain. By directly contacting the first terminal row of the substrate 10 with the second terminal row of the connector 30 and allowing the solder particles to exist in the vicinity thereof, the solder particles become unloaded and are only melted during the reflow process. Fine pitch connection is easily achieved because the amount of solder particles blended is such that it contributes to the bonding between the electrode of the connector and the electrode of the substrate and does not cause self-alignment. Such temporary crimping and solder joining by a reflow process are an example of the difference between this technology and a general solder paste or BGA connection method. From the viewpoint of facilitating the diversion of conventional knowledge, the conditions may be the same as those for temporary crimping of general anisotropic connections. The temporary crimping conditions used for general anisotropic connection are preferably 2.0 MPa or less, more preferably 1.5 MPa or less, and even more preferably 1.0 MPa or less. The lower limit of the pressure is preferably 0.2 MPa or more, more preferably 0.4 MPa or more. Even under these conditions, the purpose can be achieved by adjusting the conditions of the solder particles and the adhesive binder up to the no-load connection (reflow process). Since the upper limit and the lower limit may vary depending on the specifications of the device, the upper limit and the lower limit are limited to the above numerical range if the purpose of pushing the thermosetting connection material 20 to the contact with the opposing electrodes or to the solder particle size can be achieved. It's not a thing.

Further, in the step (B), it is preferable to press the connector at a temperature in the range of −30 ° C. to + 60 ° C., which is the temperature at which the minimum melt viscosity of the thermosetting connection material is reached, and the minimum melt viscosity of the thermosetting connection material is reached. It is more preferable to press the connector at a temperature in the range of −10 ° C. to + 40 ° C. As a result, the melt viscosity of the thermosetting connecting material is lowered, so that even if the pressure for pressing the connector is lowered, the space between the first terminal row 11 of the substrate 10 and the second terminal row 31 of the connector 30 is reduced. A state in which the solder particles 21 are sandwiched can be obtained. Further, in the step (B), the solder particles 21 are sandwiched between the first terminal row 11 of the substrate 10 and the second terminal row 31 of the connector 30, or each electrode is melted or partially melted. If a state of contact is obtained through the molten solder, the thermosetting resin layer 22 may have started curing, and the thermosetting connection material has not been completely cured. It may be in a semi-cured state called a so-called B stage, or may be completely cured. This is because the curing may be completely completed during the reflow process, or the resin may be melted after the curing to obtain a bond between the electrodes by solder particles under the weight of the connector (under no load). .. From the viewpoint of manufacturing control, it is preferable that these can be selectively performed.

Further, in the step (B), a cushioning material may be used between the tool 40 and the connector 30. As the cushioning material, polytetrafluoroethylene (PTFE: polytetrafluoroethylene), silicon rubber or the like can be used. As a result, damage to the connector 30 can be further suppressed.

[Step (C)]
FIG. 5 is a cross-sectional view schematically showing a state in which the connector is fixed to the substrate, FIG. 6 is a cross-sectional view schematically showing a state in which the substrate and the connector are heated in a reflow furnace, and FIG. 7 is a cross-sectional view. It is sectional drawing which shows typically the connector. As shown in FIGS. 5 to 7, in step (C), a reflow furnace set above the melting point of the solder particles 21 is used, and the first terminal row 11 of the substrate 10 and the second terminal 31 of the connector 30 are used. To join.

Since the reflow furnace can be heat-bonded without a load without mechanical pressurization, damage to the substrate 10 and the connector 30 can be suppressed. Further, as compared with the anisotropic conductive connection using a general heating and pressurizing tool, unnecessary resin flow is not generated, so that the entrainment of air bubbles can be suppressed. Further, since there is no load, the amount of movement of the solder particles is small, and it is expected that the capture efficiency of the solder particles is high. The electrodes may come into direct contact with each other and the adhesive may hold the electrodes. Further, the solder particles in the vicinity of the electrodes connected to each other may work to assist the solder particles. The solder particles may be sandwiched between the electrodes, and after the electrodes are directly connected, the solder particles existing around the electrodes may melt and contribute to bonding. Therefore, it is preferable that the content of the solder particles is such that self-alignment does not occur. This is one of the differences between this technology and general anisotropic conductive connections. That is, in the present technology, the conduction may be via the solder particles which are conductive particles (in the same or similar state as the anisotropic connection), the electrodes are in direct contact with each other, and the adhesive holds and conducts the conduction. It may be present (a state different from the anisotropic connection), and the solder particles existing in the vicinity of the electrodes may additionally contribute to the conduction and the bonding between the electrodes.

Examples of the reflow furnace include atmospheric pressure reflow, vacuum reflow, atmospheric pressure oven, and autoclave (pressurized oven). Among these, vacuum reflow and autoclave that can eliminate air bubbles contained in the joint are used. Is preferable.

The lower limit of the peak temperature (maximum temperature reached) in the reflow oven may be at least the temperature at which the solder particles melt and at least the temperature at which the thermosetting binder starts to cure, preferably 150 ° C. or higher, more preferably 180. ° C. or higher, more preferably 200 ° C. or higher. The upper limit of the peak temperature in the reflow furnace is 300 ° C. or lower, more preferably 290 ° C. or lower, and further preferably 280 ° C. or lower. As a result, the first terminal row 11 of the substrate 10 and the second terminal row 31 of the connector 30 are solder-bonded 24. Further, since the content of the solder particles 21 in the thermosetting connection material is such that self-alignment cannot be expected, a large number of solder particles 21 are not integrated, and there are a plurality of 24 solder joints in one terminal. do. When the thermosetting connection material is a thermosetting binder, it is bonded by the thermosetting binder except for a plurality of 24 solder joints in the terminal. Here, solder bonding means connecting the electrodes of opposing electronic components by melting the solder.

In the reflow furnace, the heat-curable resin is melted by heating, the solder particles 31 sandwiched between the electrodes are melted by the main heating, which is equal to or higher than the melting point of the solder, the solder is wetted and spread on the electrodes, and the first terminal of the substrate 10 is cooled by cooling. The row 11 and the second terminal row 31 of the connector 30 are joined. The reflow may include a step of maintaining a constant temperature (keeping step) in addition to a step of raising the temperature and a step of lowering the temperature. There may be a peak step at the highest temperature, and the step may be included in the middle of raising or lowering the temperature. The temperature raising step may be divided into two steps: a step of melting the binder (for example, up to 120 ° C.) and a step of melting and spreading the solder particles (for example, 120 to 175 ° C.). Therefore, the heating rate may be 10 to 120 ° C./min or 20 to 100 ° C./min as an example. The maintenance time of the keep step (for example, 175 to 180 ° C.) is also a step of curing the binder. This temperature is, for example, a temperature of 160 to 230 ° C., and may have a difference of about 5 to 10 ° C., and may be the same as the peak temperature. This time can be appropriately selected, for example, 0.5 min or more or 0.75 min or more, and if it is too long, the production efficiency deteriorates, so that it is, for example, 5 min or less or 3 min or less. The reflow may be performed only in the temperature raising step and the temperature lowering step. In this case, the cured resin is melted by both steps, and the solder particles 31 sandwiched between the electrodes are melted by the main heating which is equal to or higher than the melting point of the solder, and the solder is melted. It suffices that the first terminal row 11 of the substrate 10 and the second terminal row 31 of the connector 30 are joined by wetting and spreading on the electrodes and cooling. In terms of process control, it can be controlled in a time exceeding a predetermined temperature. The predetermined temperature is preferably 150 ° C., more preferably 180 ° C. or higher, still more preferably 200 ° C. or higher. The predetermined time is, for example, 0.5 min. By cooling through the temperature lowering step (below the melting point of the solder particles), the solder particles can be made into a solid phase and bonded between the electrodes. In order to increase productivity, the temperature lowering rate should be high because it can be taken out quickly, and it is desirable that the joint state is not rapidly cooled to improve the quality of the joint, so it is better to be low. As an example, the rate may be the same as that in the temperature raising step, and is preferably 10 to 30 ° C./min. The temperature lowering rate can be adjusted according to the combination of the objects to be joined and the conditions of the binder used. It also affects the take-out temperature and its environment.

According to the above-mentioned manufacturing method of the connector, the solder particles and the film thickness are approximated before the reflow process, and the solder particles and the terminals are brought into contact with each other, so that the bonding can be performed more easily. When the thermosetting connection material is a thermosetting binder, the temperature rise / maintenance / temperature decrease in the reflow process is combined with the thermosetting behavior of the thermosetting connection material to melt the resin in the reflow process and between the terminals. It is possible to optimize the sandwiching of solder particles, melting of solder, and curing of resin. The thermosetting behavior of the thermosetting connection material can be known by DSC measurement or viscosity measurement with a rheometer.

Further, the connector manufacturing apparatus includes a material installation portion for providing a thermosetting connection material containing solder particles on the first terminal row of the substrate, and a fixing portion for fixing the connector on the thermosetting connection material. A reflow furnace for joining the first terminal row of the substrate and the second terminal row of the connector is provided.

When the thermosetting connection material is a film, the material installation unit may be a temporary sticking device for sticking the film on the substrate at a low temperature and a low pressure, or may be a laminating device for laminating the film on the substrate. Further, the material setting portion may be a coating device that uniformly coats a predetermined amount on the substrate when the thermosetting connecting material is a paste. For the fixing part, for example, a flip-chip bonder having a heating mechanism and a pressurizing mechanism can be used, and the connector is attracted and aligned by the tool, and the connector is pushed down on the thermosetting connecting material. Fix it. The device conventionally used for connector connection may be diverted to perform alignment and fixing. In the reflow furnace, the maximum temperature is set to be equal to or higher than the melting point of the solder particles, and the connector is heated while being fixed to the substrate to join the terminals of the substrate and the terminals of the connector.

<2. Connection>
FIG. 7 is a cross-sectional view schematically showing the connecting body. As shown in FIG. 7, the connector according to the present embodiment includes a substrate 10 having a first terminal row 11, a connector 30 having a second terminal row 31, and a first terminal row 11 and a second. The terminal row 31 of the above is solder-bonded with solder particles 21, and an adhesive layer 23 for adhering the substrate 10 and the second connector 30 is provided.

Further, the upper limit of the minimum value of the distance between adjacent terminals (distance between spaces) in the first terminal row 11 and the second terminal row 31 is 0.8 mm or less, preferably 0.3 mm or less, more preferably 0. .2 mm or less. Further, the lower limit of the minimum value of the distance between the adjacent terminals in the first terminal row 11 and the second terminal row 31 is 50 μm or more, more preferably 60 μm or more, still more preferably 70 μm or more.

Further, the upper limit of the ratio of the average particle size of the solder particles 21 to the minimum value of the distance between adjacent terminals (distance between spaces) in the first terminal row 11 and the second terminal row 31 is less than 0.15, and more. It is preferably 0.1 or less.

Based on the relationship between the distance between adjacent terminals in the first terminal row 11 and the second terminal row 31 and the average particle size of the solder particles 21 as described above, the first terminal row of the substrate 10 is used by using a reflow furnace. 11 and the second terminal row 31 of the connector 30 can be joined.

The substrate 10 is the same as described above, and examples of the substrate depending on the type of substrate include a rigid substrate, a glass substrate, a ceramic substrate, a plastic substrate, and the like. Further, it is preferable from the economical viewpoint that the short-circuit prevention processing (wall, groove, etc.) used for the solder resist is not formed between the adjacent terminals of the first terminal row. That is, the height from the terminal between the adjacent terminals of the first terminal row 11 is preferably 100 μm or less, more preferably 35 μm or less, and further preferably 12 μm or less. Further, the lower limit of the height from the terminal between the adjacent terminals of the first terminal row 11 is the same as the terminal height (the terminals are horizontal and the same as the board surface, and the terminals are not raised, and the board is connected. The surface may be flat), or the terminals of the first terminal row provided on the substrate may protrude from the plane of the substrate. As a result, in the step (B), the solder particles 21 can be easily sandwiched between the first terminal row 11 of the substrate 10 and the second terminal row 31 of the connector 30 in contact with each other.

The adhesive layer 23 is formed by curing the thermosetting connection material of the thermosetting resin layer 22 into a film after the step (C), and is formed into a film by the first terminal row 11 of the substrate 10 and the second terminal of the connector 30. The row 31 is solder-bonded 34, and a thermosetting connecting material is filled between the substrate 10 and the connector 30. And, in one terminal, there are a plurality of solder bonding 24 points, and when the thermosetting connection material is a thermosetting binder, there are bonding points by the thermosetting binder except for the plurality of solder bonding 24 points. do.

In the present specification, the connector is mainly a resin molded product having a fitting portion. For example, the fitting portion fits the terminals and plugs of the FPC, and the pitch of the fitting terminals is preferably 0.8 mm or less, 0.3 mm or less, and more preferably 0.2 mm or less. It refers to a component that can be electrically connected and mechanically coupled to a component that is inserted into the fitting part and a component that has a connector mounted on it. For example, some resin molded products have electrodes protruding in a plurality of longitudinal directions (so-called centipede type connectors), and some do not (flip chip type connectors). Even with a narrow pitch connector, the connector can be fixed at a low pressure as described above and heat-bonded without a load using a reflow furnace.

FIG. 8 is a cross-sectional view showing an example of the connector in the lateral direction. This connector is a vertical fitting type, and has a receptacle in which the first terminal 52A and the second terminal 52B are fixed by the insulating resin 51, and the first terminal 54A and the second terminal 54B are fixed by the insulating resin 53. Consists of the plugs that have been made. Further, in the longitudinal direction of the connector, the first terminal 52A and the second terminal 52B, and the first terminal 54A and the second terminal 54B are formed at a predetermined pitch. In this connector, for example, the first terminal 52A or the second terminal 52B of the receptacle corresponds to the second terminal row 31 of the connector 30 having a longitudinal cross section shown in FIG.

The insulating resins 51 and 53 are made of, for example, polyamide or LCP, and the first terminal 52A and the second terminal 52B, and the first terminal 54A and the second terminal 54 are fixed by, for example, resin molding.

The first terminal 52A and the second terminal 52B, and the first terminal 54A and the second terminal 54 are made of metal so that the first terminals 52A and 54A and the second terminals 52B are vertically fitted to each other. Is bent. In addition, leads are formed at the ends of the receptacle and the plug in the lateral direction, respectively, and centipede-shaped terminals are formed.

In the present embodiment, the connector can be fixed at a low pressure and heat-bonded without a load using a reflow furnace without mechanical pressurization. Therefore, even if the connector is a narrow-pitch connector, it can be mounted. can do. Further, according to the present embodiment, since a lead is not required, a flip-chip type connector having a second terminal row inside the joint surface with the substrate can be mounted, and the mounting area can be reduced. can. The connector to which this technology is applied is thicker in the connection direction than the FPC or IC chip used for general anisotropic conductive connection (because the FPC or the like is inserted and used). For this reason, misalignment due to pressurization (pressing) at the time of connection (meaning that the first terminal arrangement and the second terminal arrangement are opposed to each other) is more likely to occur than a general anisotropic connection. I am concerned. However, such technical problems can be avoided by temporarily fixing after alignment as described above and heat-joining with no load using a reflow furnace without mechanical pressurization. For this reason, it can be said that this technology is required.

<3. Thermosetting connection material>
In the thermosetting connection material of the present embodiment, the solder particles are dispersed in the thermosetting binder, and the content of the solder particles is 50 wt% or less. As a result, the connector on the thermosetting connecting material can be fixed and reflowed, and the occurrence of self-alignment of solder particles can be suppressed. Therefore, a connector having a terminal row having a pitch of 0.8 mm or less is mounted. can do.

The lower limit of the mass ratio range of the blended amount of solder particles is preferably 20 wt% or more, more preferably 30 wt% or more, still more preferably 35 wt% or more, and the upper limit of the mass ratio range of the blended amount of solder particles is 50 wt% or more. Below, it is more preferably 45 wt% or less, still more preferably 40 wt% or less. The lower limit of the volume ratio range of the blended amount of the solder particles is preferably 5 vol% or more, more preferably 10 vol% or more, still more preferably 15 vol% or more, and the upper limit of the volume ratio range of the blended amount of the solder particles is. It is preferably 30 vol% or less, more preferably 25 vol% or less, still more preferably 20 vol% or less. When the blending amount of the solder particles satisfies the above-mentioned mass ratio range or volume ratio range, excellent conductivity, heat dissipation, and adhesiveness can be obtained. If the solder particles are present in the binder, the volume ratio may be used, and if the anisotropic conductive bonding material is produced (before the solder particles are present in the binder), the mass ratio may be used. .. The mass ratio can be converted into a volume ratio from the specific gravity of the compound, the compounding ratio, and the like. If the blending amount of the solder particles is too small, excellent conductivity, heat dissipation, and adhesiveness cannot be obtained, and if the blending amount is too large, the anisotropy is likely to be impaired, and it becomes difficult to obtain excellent conduction reliability. ..

Further, the thermosetting connection material preferably has a heat generation peak temperature higher than the melting point of the solder particles, and preferably has a melting temperature lower than the melting point of the solder particles. Here, the exothermic peak temperature is measured using a rotary leometer (manufactured by Thermo Fisher Scientific Co., Ltd.) under the conditions of a measurement pressure of 1 N temperature range of 30 to 200 ° C., a temperature rise rate of 10 ° C./min, a measurement frequency of 1 Hz, and a measurement plate diameter of 8 mm. Can be measured. As a result, the thermosetting binder is melted by heating, and the solder is melted in a state where the solder particles are sandwiched between the terminals, so that electronic components provided with fine pitch electrodes can be joined.

When the thermosetting connection material is in the form of a film as described above, the lower limit of the ratio of the average particle size of the solder particles to the thickness of the thermosetting connection material is preferably 0.6 or more, more preferably 0.8. Above, more preferably 0.9 or more. When the ratio of the average particle size of the solder particles to the thickness of the thermosetting connecting material is large, the solder particles can be easily sandwiched between the electrodes in the step (B), but the film is difficult to handle. May be high.

The upper limit of the ratio of the average particle size of the solder particles to the thickness of the thermosetting connecting material is preferably 1.5 or less, more preferably 1.2 or less, and further preferably 1.1 or less. When the ratio of the average particle size of the solder particles to the thickness of the thermosetting connecting material is large, a high pressure is required for pressing the connector in the step (B), which may damage the connector.

The film thickness can be measured using a known micrometer or digital thickness gauge (for example, Mitutoyo Co., Ltd .: MDE-25M, minimum display amount 0.0001 mm) capable of measuring 1 μm or less, preferably 0.1 μm or less. .. The film thickness may be obtained by measuring 10 or more points and averaging them. However, if the film thickness is thinner than the particle size, a contact-type thickness measuring instrument is not suitable, so it is preferable to use a laser displacement meter (for example, KEYENCE Co., Ltd., spectroscopic interference displacement type SI-T series, etc.). .. Here, the film thickness is the thickness of the resin layer only, and does not include the particle size.

[Thermosetting binder]
Examples of the thermocurable binder (insulating binder) include a thermal radical polymerization type resin composition containing a (meth) acrylate compound and a thermal radical polymerization initiator, and a thermal cationic polymerization type resin containing an epoxy compound and a thermal cationic polymerization initiator. Examples thereof include a composition, a thermal anionic polymerization type resin composition containing an epoxy compound and a thermal anionic polymerization initiator. Moreover, you may use a known pressure-sensitive adhesive composition. The (meth) acrylic monomer means to include both an acrylic monomer and a methacrylic monomer.

Hereinafter, as a specific example, a thermal anionic polymerization type resin composition containing a solid epoxy resin, a liquid epoxy resin, and an epoxy resin curing agent will be described as an example.

The solid epoxy resin is not particularly limited as long as it is an epoxy resin that is solid at room temperature and has one or more epoxy groups in the molecule, and is, for example, a bisphenol A type epoxy resin, a biphenyl type epoxy resin, or the like. There may be. Thereby, the film shape can be maintained. The normal temperature is in the range of 20 ° C. ± 15 ° C. (5 ° C. to 35 ° C.) defined by JIS Z 8703.

The liquid epoxy resin is not particularly limited as long as it is liquid at room temperature, and may be, for example, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, or a urethane-modified epoxy resin. No.

The blending amount of the liquid epoxy resin is preferably 160 parts by mass or less, more preferably 100 parts by mass or less, and further preferably 70 parts by mass or less with respect to 100 parts by mass of the solid epoxy resin. When the amount of the liquid epoxy resin blended is large, it becomes difficult to maintain the film shape.

The epoxy resin curing agent is not particularly limited as long as it is a thermosetting agent that starts curing by heat, and examples thereof include anionic curing agents such as amines and imidazoles, and cationic curing agents such as sulfonium salts. .. In addition, the curing agent may be microencapsulated so as to obtain resistance to the solvent used for film formation.

Further, it is preferable that the thermosetting binder does not contain a flux compound. As a result, the insulating property is improved, the cleaning step of the flux compound becomes unnecessary, and the time of the oxide film removing step in the reflow step can be shortened.

[Solder particles]
The solder particles are preferably dispersed in the thermosetting connecting material, and the solder particles may be arranged randomly or according to a certain rule. The average particle size can be confirmed by arbitrarily extracting 5 or more areas ^{of 1 mm 2} or more in a film plan view using a known metal microscope or optical microscope.

Further, the solder particles may be agglomerates in which a plurality of the solder particles are agglomerated. The average particle size of the individual solder particles of the agglomerate can be measured in the same manner as the above-mentioned average particle size.

The average particle size of the solder particles is preferably 0.2 times or less the minimum value of the inter-terminal distance (inter-space distance) in the first terminal row of the substrate which is the adherend and the second terminal row of the connector. .. When the average particle size of the solder particles is larger than 0.2 times the minimum value of the distance between terminals in the first terminal row of the substrate and the second terminal row of the connector, the possibility of short circuit increases.

The lower limit of the average particle size of the solder particles is preferably 0.5 μm or more, more preferably 3 μm or more, and more preferably 5 μm or more. As a result, the coating thickness of the film can be made constant. If the average particle size of the solder particles is smaller than 0.5 μm, a good solder bonding state with the electrode portion cannot be obtained, and the reliability tends to deteriorate. The upper limit of the average particle size of the solder particles may be 50 μm or less, 30 μm or less, preferably 20 μm or less, and more preferably 10 μm or less. Further, in the case of an agglomerate in which a plurality of solder particles are agglomerated, the size of the agglomerates may be equal to the average particle size of the above-mentioned solder particles. In the case of agglomerates, the average particle size of the solder particles may be smaller than the above value. The size of each solder particle can be determined by observing with an electron microscope as described above.

The maximum diameter of the solder particles can be 200% or less of the average particle size, preferably 150% or less of the average particle size, and more preferably 120% or less of the average particle size. When the maximum diameter of the solder particles is within the above range, the solder particles can be sandwiched between the electrodes, and the electrodes can be joined by melting the solder particles. Further, in the case of an agglomerate in which a plurality of solder particles are agglomerated, the size of the agglomerates may be equal to the maximum diameter of the above-mentioned solder particles. In the case of agglomerates, the maximum diameter of the solder particles may be smaller than the above value. The size of each solder particle can be determined by observing with an electron microscope as described above.

The solder particles are, for example, Sn-Pb-based, Pb-Sn-Sb-based, Sn-Sb-based, Sn-Pb-Bi-based, Bi-Sn-based, Sn-Cu-based, as defined in JIS Z 3282-1999. It can be appropriately selected from Sn-Pb-Cu system, Sn-In system, Sn-Ag system, Sn-Pb-Ag system, Pb-Ag system and the like according to the electrode material, connection conditions and the like. The lower limit of the melting point of the solder particles is preferably 110 ° C. or higher, more preferably 120 ° C. or higher, still more preferably 130 ° C. or higher. The upper limit of the melting point of the solder particles may be 200 ° C. or lower, preferably 180 ° C. or lower, more preferably 160 ° C. or lower, and further preferably 150 ° C. or lower. Further, the solder particles may have a flux compound directly bonded to the surface for the purpose of activating the surface. By activating the surface, metal bonding with the electrode portion can be promoted.

[Other additives]
In addition to the above-mentioned insulating binder and solder particles, the thermosetting connection material should contain various additives conventionally used in heat-curable adhesives as long as the effects of the present invention are not impaired. Can be done. The particle size of the additive is preferably smaller than the average particle size of the solder particles, but is not particularly limited as long as it does not hinder the bonding between the electrodes.

In the above-mentioned thermosetting connection material, for example, an insulating binder and solder particles are mixed in a solvent, the mixture is applied to a peeling film by a bar coater to a predetermined thickness, and then dried. It can be obtained by volatilizing the solvent. Further, the mixture may be applied on the peeling film by a bar coater and then pressed to a predetermined thickness. Further, in order to increase the dispersibility of the solder particles, it is preferable to apply a high share in a state containing a solvent. For example, a known batch type planetary stirrer can be used. The amount of residual solvent in the thermosetting connecting material is preferably 2% or less, more preferably 1% or less.

<4. Example>
In this embodiment, an adhesive film containing solder particles was prepared, and a flexible printed substrate was mounted on a rigid substrate as a substitute for a connector using the adhesive film. Then, the insulation evaluation of the mounted body and the connection resistance value evaluation were performed. The present embodiment is not limited to these.

[Insulation evaluation of mount]
The implementation body sample, measuring the resistance value between adjacent terminals, were counted following 10 ⁶ Omega as a short. The evaluation of the mount without shorts was evaluated as "OK", and the evaluation of the mount with one or more shorts was evaluated as "NG".

[Evaluation of connection resistance of the mount]
For the mount sample, the resistance value when a current of 1 mA was passed between each terminal between the flexible printed circuit board and the rigid substrate was measured, and the median value was calculated. A mounting body having a median resistance value of 0.1Ω or less was evaluated as “OK”, and other mounting bodies were evaluated as “NG”.

<Implementation example 1-1>
Flexible printed board (Dexerials Co., Ltd. evaluation FPC, terminal width 100 μm, distance between adjacent terminals (minimum value) 100 μm, line and space 1: 1, pitch 200 μm, number of terminals 30, Ni-Au plating,) and rigid A substrate (rigid substrate for dexrials evaluation, terminal width 100 μm, distance between adjacent terminals (minimum value) 100 μm, pitch 200 μm, number of terminals 30, 18 μm thick Cu pattern, Ni-Au plating) was prepared.

The flexible printed substrate was aligned and fixed on the rigid substrate via an adhesive film under the mounting condition of 90 ° C.-2s-1 MPa. The adhesive film is an acrylic thermosetting binder (manufactured by Dexerials Co., Ltd., minimum melt viscosity reaching temperature 80 ° C.) and solder particles (MP-L20, Senju Metal Industry Co., Ltd., Sn-58Bi alloy) with an average particle size of 10 μm. , A solid layer point temperature of 139 ° C.) was blended in an amount of 38 wt%, and a film having a film thickness of 12 μm was used.

After that, the flexible printed substrate was mounted on the rigid substrate by reflow. The reflow conditions were 150 ° C. to 260 ° C.-100 sec, and the peak top was 260 ° C.

Table 1 shows the results of insulation evaluation and connection resistance value evaluation of the mounting body.

<Implementation example 1-2>

As shown in Table 1, a mounting body was produced in the same manner as in Mounting Example 1-1 except that the mounting conditions were set to 100 ° C.-2s-1MPa, and the insulation evaluation and connection resistance value evaluation of the mounting body were performed.

<Implementation example 1-3>
As shown in Table 1, a mounting body was produced in the same manner as in Mounting Example 1-1 except that the mounting conditions were set to 130 ° C.-2s-1MPa, and the insulation evaluation and connection resistance value evaluation of the mounting body were performed.

<Implementation example 1-4>
As shown in Table 1, a mounting body was produced in the same manner as in Mounting Example 1-1 except that the mounting conditions were set to 150 ° C.-2s-1MPa, and the insulation evaluation and connection resistance value evaluation of the mounting body were performed.

<Implementation example 2-1>
Flexible printed board (Dexerials Co., Ltd. evaluation FPC, terminal width 300 μm, distance between adjacent terminals (minimum value) 300 μm, line and space 1: 1, pitch 300 μm, number of terminals 30, Ni-Au plating,) and rigid A substrate (rigid substrate for dexrials evaluation, terminal width 300 μm, distance between adjacent terminals (minimum value) 300 μm, pitch 300 μm, number of terminals 30, 18 μm thick Cu pattern, Ni-Au plating) was prepared.

The flexible printed substrate was aligned and fixed on the rigid substrate via an adhesive film under the mounting condition of 90 ° C.-2s-1 MPa. The adhesive film is an acrylic thermosetting binder (manufactured by Dexerials Co., Ltd., minimum melt viscosity reaching temperature 80 ° C.) and solder particles (MP-L20, Senju Metal Industry Co., Ltd., Sn-58Bi alloy) with an average particle size of 30 μm. , Solid phase temperature (139 ° C.) was mixed in 38 wt%, and a film having a thickness of 35 μm was used.

After that, the flexible printed substrate was mounted on the rigid substrate by reflow. The reflow conditions were 150 ° C. to 260 ° C.-100 sec, and the peak top was 260 ° C.

Table 1 shows the results of insulation evaluation and connection resistance value evaluation of the mounting body.

<Implementation example 2-2>
As shown in Table 1, a mounting body was produced in the same manner as in Mounting Example 2-1 except that the mounting conditions were set to 100 ° C.-2s-1MPa, and the insulation evaluation and connection resistance value evaluation of the mounting body were performed.

<Implementation example 2-3>
As shown in Table 1, a mounting body was produced in the same manner as in Mounting Example 2-1 except that the mounting conditions were set to 130 ° C.-2s-1MPa, and the insulation evaluation and connection resistance value evaluation of the mounting body were performed.

<Implementation example 2-4>
As shown in Table 1, a mounting body was produced in the same manner as in Mounting Example 2-1 except that the mounting conditions were set to 150 ° C.-2s-1MPa, and the insulation evaluation and connection resistance value evaluation of the mounting body were performed.

<Implementation example 3-1>
Flexible printed board (Dexerials Co., Ltd. evaluation FPC, terminal width 100 μm, distance between adjacent terminals (minimum value) 100 μm, line and space 1: 1, pitch 100 μm, number of terminals 30, Ni-Au plating,) and rigid A substrate (rigid substrate for dexrials evaluation, terminal width 100 μm, distance between adjacent terminals (minimum value) 100 μm, pitch 100 μm, number of terminals 30, 18 μm thick Cu pattern, Ni-Au plating) was prepared.

The flexible printed substrate was aligned and fixed on the rigid substrate via an adhesive film under the mounting condition of 90 ° C.-2s-1 MPa. The adhesive film is an acrylic thermosetting binder (manufactured by Dexerials Co., Ltd., minimum melt viscosity reaching temperature 80 ° C.) and solder particles (MP-L20, Senju Metal Industry Co., Ltd., Sn-58Bi alloy) with an average particle size of 30 μm. , Solid phase temperature (139 ° C.) was mixed in 38 wt%, and a film having a thickness of 28 μm was used.

After that, the flexible printed substrate was mounted on the rigid substrate by reflow. The reflow conditions were 150 ° C. to 260 ° C.-100 sec, and the peak top was 260 ° C.
Table 1 shows the results of insulation evaluation and connection resistance value evaluation of the mounting body.

<Implementation example 3-2>
As shown in Table 1, a mounting body was produced in the same manner as in Mounting Example 3-1 except that the mounting conditions were set to 100 ° C.-2s-1MPa, and the insulation evaluation and connection resistance value evaluation of the mounting body were performed.

<Implementation example 3-3>
As shown in Table 1, a mounting body was produced in the same manner as in Mounting Example 3-1 except that the mounting conditions were set to 130 ° C.-2s-1MPa, and the insulation evaluation and connection resistance value evaluation of the mounting body were performed.

<Implementation example 3-4>
As shown in Table 1, a mounting body was produced in the same manner as in Mounting Example 3-1 except that the mounting conditions were set to 150 ° C.-2s-1MPa, and the insulation evaluation and connection resistance value evaluation of the mounting body were performed.

<Implementation example 4-1>
Flexible printed board (Dexerials Co., Ltd. evaluation FPC, terminal width 100 μm, distance between adjacent terminals (minimum value) 100 μm, line and space 1: 1, pitch 100 μm, number of terminals 30, Ni-Au plating,) and rigid A substrate (rigid substrate for dexrials evaluation, terminal width 100 μm, distance between adjacent terminals (minimum value) 100 μm, pitch 100 μm, number of terminals 30, 18 μm thick Cu pattern, Ni-Au plating) was prepared.

The flexible printed substrate was aligned and fixed on the rigid substrate via an adhesive film under the mounting condition of 90 ° C.-2s-1 MPa. The adhesive film is an acrylic thermosetting binder (manufactured by Dexerials Co., Ltd., minimum melt viscosity reaching temperature 80 ° C.) and solder particles (MP-L20, Senju Metal Industry Co., Ltd., Sn-58Bi alloy) with an average particle size of 30 μm. , Solid phase temperature (139 ° C.) was mixed in 38 wt%, and a film having a thickness of 35 μm was used.

After that, the flexible printed substrate was mounted on the rigid substrate by reflow. The reflow conditions were 150 ° C. to 260 ° C.-100 sec, and the peak top was 260 ° C.

Table 2 shows the results of insulation evaluation and connection resistance value evaluation of the mounting body.

<Implementation example 4-2>
As shown in Table 2, a mounting body was produced in the same manner as in Mounting Example 4-1 except that the mounting conditions were set to 100 ° C.-2s-1MPa, and the insulation evaluation and connection resistance value evaluation of the mounting body were performed.

<Implementation example 4-3>
As shown in Table 2, a mounting body was produced in the same manner as in Mounting Example 4-1 except that the mounting conditions were set to 130 ° C.-2s-1MPa, and the insulation evaluation and connection resistance value evaluation of the mounting body were performed.
<Implementation example 4-4>
As shown in Table 2, a mounting body was produced in the same manner as in Mounting Example 4-1 except that the mounting conditions were set to 150 ° C.-2s-1MPa, and the insulation evaluation and connection resistance value evaluation of the mounting body were performed.

<Implementation example 5-1>
Flexible printed board (Dexerials Co., Ltd. evaluation FPC, terminal width 200 μm, distance between adjacent terminals (minimum value) 200 μm, line and space 1: 1, pitch 200 μm, number of terminals 30, Ni-Au plating,) and rigid A substrate (rigid substrate for dexrials evaluation, terminal width 200 μm, distance between adjacent terminals (minimum value) 200 μm, pitch 200 μm, number of terminals 30, 18 μm thick Cu pattern, Ni-Au plating) was prepared.

The flexible printed substrate was aligned and fixed on the rigid substrate via an adhesive film under the mounting condition of 90 ° C.-2s-1 MPa. The adhesive film is an acrylic thermosetting binder (manufactured by Dexerials Co., Ltd., minimum melt viscosity reaching temperature 80 ° C.) and solder particles (MP-L20, Senju Metal Industry Co., Ltd., Sn-58Bi alloy) with an average particle size of 30 μm. , Solid phase temperature (139 ° C.) was mixed in 38 wt%, and a film having a thickness of 35 μm was used.

After that, the flexible printed substrate was mounted on the rigid substrate by reflow. The reflow conditions were 150 ° C. to 260 ° C.-100 sec, and the peak top was 260 ° C.

Table 2 shows the results of insulation evaluation and connection resistance value evaluation of the mounting body.

<Implementation example 5-2>
As shown in Table 2, a mounting body was produced in the same manner as in Mounting Example 5-1 except that the mounting conditions were set to 100 ° C.-2s-1MPa, and the insulation evaluation and connection resistance value evaluation of the mounting body were performed.

<Implementation example 5-3>
As shown in Table 2, a mounting body was produced in the same manner as in Mounting Example 5-1 except that the mounting conditions were set to 130 ° C.-2s-1MPa, and the insulation evaluation and connection resistance value evaluation of the mounting body were performed.

<Implementation example 5-4>
As shown in Table 2, a mounting body was produced in the same manner as in Mounting Example 5-1 except that the mounting conditions were set to 150 ° C.-2s-1MPa, and the insulation evaluation and connection resistance value evaluation of the mounting body were performed.

From Mounting Example 1-2 to Mounting Example 1-4 and Mounting Example 2-2-Mounting Example 2-4, the minimum value of the distance between adjacent terminals is 0.3 mm or less, and the solder particles with respect to the minimum value of the distance between adjacent terminals. When the ratio of the average particle size of the particles was less than 0.15, a mounting body having excellent insulation and conductivity could be obtained. Further, by setting the temperature at the time of alignment to 100 ° C. to 150 ° C. with respect to the adhesive film having the minimum melt viscosity reaching temperature of 80 ° C., a mounting body having excellent insulation and conductivity could be obtained.

In this embodiment, the flexible printed board is mounted, but a connector can also be mounted. Further, the connector can be mounted not only as a centipede type but also as a flip chip type.

10 board, 11 first terminal row, 20 thermosetting connection material, 21 solder particles, 30 connectors, 31 second terminal row, 40 tools, 51 insulating resin, 52A first terminal, 52B second terminal, 53 Insulation resin, 54A first terminal, 54B second terminal

Claims (8)

A second terminal having a minimum distance between terminals of 0.3 mm or less on the inside of the joint surface with the substrate via a thermosetting connecting material containing solder particles on the first terminal row of the substrate. The process of fixing the connectors with rows and
Using a reflow oven set above the melting point of the solder particles, possess the step of bonding the first terminal row and the second terminal row with no load,
The ratio of the average particle size of the solder particles to the minimum value of the distance between the terminals in the first terminal row and the second terminal row is 0.1 or less.
A method for producing a connector in which the ratio of the average particle size of the solder particles to the thickness of the thermosetting connection material is 0.83 or more and 1.2 or less. The method for producing a connector according to claim 1, wherein the ratio of the average particle size of the solder particles to the thickness of the thermosetting connection material is 0.9 or more and 1.1 or less. The method for manufacturing a connector according to claim 1 or 2, wherein in the step of fixing the connector, the connector is crimped at a temperature in the range of −10 ° C. to + 40 ° C., which is the temperature at which the minimum melt viscosity of the thermosetting connection material is reached. .. The method for manufacturing a connector according to any one of claims 1 to 3, wherein in the step of fixing the connector, the connector is crimped at a pressure of 2.0 MPa or less. The method for manufacturing a connector according to any one of claims 1 to 4, wherein the connector is a resin molded product. The method for producing a connector according to any one of claims 1 to 5, wherein the content of the solder particles in the thermosetting connection material is 50 wt% or less. The method for producing a connector according to any one of claims 1 to 6, wherein the thermosetting connection material is in the form of a film. A substrate having a first terminal row and
A connector having a second terminal row having a minimum value of the distance between terminals of 0.3 mm or less inside the joint surface with the substrate, and a connector.
The first terminal row and the second terminal row are joined by solder particles, and an adhesive layer for adhering the substrate and the connector is provided .
The ratio of the average particle size of the solder particles to the minimum value of the distance between the terminals in the first terminal row and the second terminal row is 0.1 or less.
A connector in which the ratio of the average particle size of the solder particles to the thickness of the thermosetting connection material is 0.83 or more and 1.2 or less .

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