JP6950133B2 - Coil parts and their manufacturing methods - Google Patents

Description

The present invention relates to coil parts and methods for manufacturing the same.

With the miniaturization and thinning of electronic devices such as digital TVs, mobile phones, and notebooks, the coil components applied to such electronic devices are also required to be miniaturized and thinned. Further, in order to meet such needs, research and development of various forms of coil parts are being actively carried out.

Among the coil parts, the laminated coil parts can be manufactured by printing a coil pattern on an insulating sheet and laminating them. At this time, a conductive via is formed between the layers in order to electrically connect the coil patterns formed in different layers, whereby the coil patterns are electrically connected to form one coil. Come to configure.

However, since it is necessary to preferentially form via holes in order to form vias, there is a disadvantage that the process is relatively complicated and high matching accuracy is required.

One of the various purposes of the present invention is to solve such a problem, and to provide a coil component having a new structure capable of electrically connecting coil patterns without vias and a coil component having a new structure. It is to provide a method that can be manufactured efficiently.

One of the various solutions proposed throughout the present invention is to stack a plurality of coil patterns to form a coil, and via so that the end portions of the coil patterns formed in different layers are in contact with each other. It is to be electrically connected even if there is no.

One of the various effects of the present invention is that the process is simple, there is no major problem in matching, and a coil component having a new structure that can be further miniaturized and thinned and a coil component having a new structure can be efficiently manufactured. It is possible to provide a method that can be done.

It is a drawing which shows typically the example of the coil component applied to an electronic device. It is a schematic perspective view which shows an example of a coil component. It is a schematic exploded perspective view which shows an example of a coil. It is a schematic process diagram which shows an example of manufacturing of a coil part. It is a schematic process diagram which shows the other manufacturing example of a coil part. It is a schematic process diagram which shows still another manufacturing example of a coil part.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, embodiments of the present invention can be transformed into various other embodiments, and the scope of the invention is not limited to the embodiments described below. Also, embodiments of the present invention are provided to more fully explain the present invention to those having average knowledge in the art. Therefore, the shape and size of the elements in the drawings may be exaggerated for a clearer explanation.

Electronic Equipment FIG. 1 is a drawing schematically showing an example of a coil component applied to an electronic equipment.

With reference to the drawings, it can be seen that various types of electronic components are used in electronic devices. For example, focusing on an application processor, DC / DC, Comm. Processor, WLAN BT / WiFi FM GPS NFC, PMIC, battery (Battery), SMBC, LCD AMOLED, audio codec (Audio Codec), USB 2.0 / 3.0 HDMI (registered trademark), CAM, etc. may be used. can. At this time, various types of coil components can be appropriately applied between such electronic components for the purpose of removing noise and the like, and for example, a power inductor (Power Inductor) 1, Examples thereof include a high frequency inductor (HF Inductor) 2, a normal bead (General Bead) 3, a high frequency bead (GHz Bead) 4, a common mode filter (Common Mode Filter) 5, and the like.

Specifically, the power inductor 1 can be used for applications such as storing electricity in the form of a magnetic field, maintaining an output voltage, and stabilizing a power source. Further, the high frequency inductor (HF Inductor) 2 can be used for applications such as matching impedances to secure a required frequency and blocking noise and AC components. Further, the ordinary beads (General Bead) 3 can be used for applications such as removing noise in a power supply line and a signal line, and removing high-frequency ripple. Further, the high frequency beads (GHz Bead) 4 can be used for applications such as removing high frequency noise of a signal line and a power supply line related to audio. Further, the common mode filter (Comon Mode Filter) 5 can be used for applications such as passing a current in the differential mode and removing only the common mode noise.

The electronic device may be typically a smartphone (Smart Phone), and is not limited to this, for example, a personal information terminal (personal digital camera), a digital video camera (digital video camera), and a digital still. It may be a digital still camera, a network system, a computer, a monitor, a television, a video game, or a smart watch. Of course, in addition to these, various other electronic devices and the like that are well known to ordinary engineers may be used.

Coil components In the following, in describing the coil components of the present invention, the structure of the inductor will be described as an example for convenience, but the coil components of the present invention will also be used for coil components for other various purposes as described above. Of course, the parts can be applied. In this case, it goes without saying that the shape of the outer shape other than the coil pattern can be appropriately deformed according to the coil component to be applied, and the outer shape known in the art can be referred to.

FIG. 2 is a schematic perspective view showing an example of a coil component, and FIG. 3 is a schematic exploded perspective view showing an example of a coil.

With reference to the drawings, the coil component 10 according to the example has a structure in which the coil 200 is arranged inside the main body 100. Electrodes 301 and 302 electrically connected to the coil 200 are arranged outside the main body 100. The coil 200 includes a structure in which a plurality of coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, and 229 are laminated, and such coil patterns 220, 221, 222, 223, 224, and so on. Of the 225, 226, 227, 228, and 229, the coil patterns that are adjacent to each other in the stacking direction are electrically connected with their respective end portions in contact with each other. As a result, one coil 200 that rotates in the stacking direction is formed. Here, the stacking direction means the stacking direction of the coil patterns, that is, the third direction or the opposite direction.

The main body 100 has the appearance of the coil component 10, and has a first surface and a second surface facing the first direction, a third surface and a fourth surface facing the second direction, and a third surface facing the third direction. Includes 5th and 6th planes. The main body 100 may be hexahedral in this way, but is not limited thereto. The main body 100 can contain a magnetic substance exhibiting magnetic properties. For example, the main body 100 may be a resin filled with ferrite or metallic magnetic particles. The ferrite can be made of, for example, a substance such as Mn-Zn-based ferrite, Ni-Zn-based ferrite, Ni-Zn-Cu-based ferrite, Mn-Mg-based ferrite, Ba-based ferrite, or Li-based ferrite. The metallic magnetic particles can contain any one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), aluminum (Al) and nickel (Ni), for example, Fe. It may be a −Si—B—Cr based amorphous metal, but is not necessarily limited to this. The diameter of the metal magnetic particles may be about 0.1 μm to 30 μm. The main body 100 may be in a form in which such ferrite or metallic magnetic particles are dispersed in a thermosetting resin such as an epoxy resin or a polyimide resin.

The magnetic substance of the main body 100 can be made of a magnetic resin composite in which a metal magnetic powder and a resin mixture are mixed. The metallic magnetic material powder can contain iron (Fe), chromium (Cr), or silicon (Si) as a main component, for example, iron (Fe) -nickel (Ni), iron (Fe), iron (Fe). )-Chromium (Cr) -Silicon (Si) and the like can be included, but the present invention is not limited thereto. The resin mixture can include, but is not limited to, epoxy, polyimide, liquid crystal polymer (LCP), and the like. The metal magnetic material powder may be filled with the metal magnetic material powder having at least two or more average particle diameters. In this case, by crimping with bimodal metal magnetic powders having different sizes, the magnetic resin composite can be fully filled, so that the filling rate can be increased.

The main body 100 does not necessarily have to be made of a magnetic substance, and in some cases, it may be made of an insulating material, for example, a photoresist material. In this case, a magnetic substrate or the like can be further arranged on the upper part and the lower part of the main body 100. That is, the substance constituting the main body 100 may differ depending on the specific function or type of the coil component. It is also possible to add additional components not shown in the drawings.

The coil 200 allows the coil component 10 to perform various functions in an electronic device through the characteristics to be developed. For example, the coil component 10 may be a power inductor, in which case the coil can play a role of storing electricity in the form of a magnetic field, maintaining an output voltage, and stabilizing a power source. The coil 200 includes a structure in which a plurality of coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, and 229 are laminated, and such coil patterns 220, 221, 222, 223, 224, and so on. Of the 225, 226, 227, 228, and 229, the coil patterns that are adjacent to each other in the stacking direction are electrically connected with their respective end portions in contact with each other. That is, since the vias are electrically connected without a separate via, the via processing process becomes unnecessary and the process is simple. Further, since the end portion of each coil pattern, that is, the overlapping section is considerably wide, there is no great difficulty in matching. In addition, it is possible to reduce the size and thickness because there is no via. A plurality of coils 200 may exist inside the main body 100. These can be connected in series or in parallel depending on the function of the coil components. The core 105 of the coil 200 can be filled with a substance constituting the main body 100.

Each of the coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, 229 has a coil turn count of less than one. One coil turn number cannot be realized unless at least three of these coil patterns are connected. As a result, the coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, and 229 preferably have at least three coil patterns. The materials of the coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, and 229 include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), and gold (Au). , Nickel (Ni), lead (Pb), or conductive materials such as alloys thereof can be used, but the present invention is not limited thereto.

Each of the coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, 229 has an aspect ratio (AR) of less than 1. That is, the ratio of the thickness to the line width may be less than 1, for example, 0.5 or less. Therefore, it is possible to ensure the uniformity of the coil while the risk of defects such as short circuit is small. Further, since the line width is wide, the cross-sectional area increases and it is possible to secure _{a low direct current resistance (R dc).} Further, since it can be manufactured to be thinner by that amount, the magnetic regions of the upper part and the lower part can be made wider, and as a result, the inductance (L) can be improved.

As described above, the coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, and 229 may be simply surrounded by the magnetic material constituting the main body 100, and unlike this, the main body. A plurality of insulating layers 210, 211, 212, 213, 214, 215, 216, 217, 218, 219 that constitute 100 may be formed so as to penetrate each of them. In this case, the respective insulating layers 210, 211, 212, 213, 214, 215, 216, 217, 218, 219 constituting the main body 100 have coil patterns 220, 221, 222, 223, 224, 225, 226, 227. Depending on the method of forming 228 and 229, a photosensitive insulating layer (Photo Image Dielectric Layer) containing a photosensitive insulating substance may be used. Alternatively, each of the insulating layers 210, 211, 212, 213, 214, 215, 216, 217, 218, 219 constituting the main body 100 is formed by forming a magnetic substance, for example, the above-mentioned magnetic resin composite in the form of a sheet. It may be an electrically insulating magnetic layer that has been formed, and in this case, they may be integrated in the sintering process. That is, the boundary may be unclear depending on the material and the forming method.

The coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, 229 can have a larger number of stacks as shown in the drawings, or even a smaller number of stacks. You can also have. Similarly, the insulating layers 210, 211, 212, 213, 214, 215, 216, 217, 218, 219 that make up the body 100 can also have a larger number of stacks as shown in the drawings, or this. It is also possible to have a smaller number of stacks. In some cases, a plurality of coils 200 having such a structure, which are not one, may be arranged in the main body 100. That is, any modification is possible as long as the laminated form of the coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, and 229 is as described above.

The electrodes 301 and 302 serve to electrically connect the coil 200 in the coil component 10 to the electronic device when the coil component 10 is mounted on the electronic device. The electrodes 301 and 302 can include, for example, a conductive resin layer and a plating layer formed on the conductive resin layer. The conductive resin layer can contain any one or more conductive metals and thermosetting resins selected from the group consisting of copper (Cu), nickel (Ni) and silver (Ag). The plating layer can contain any one or more selected from the group consisting of nickel (Ni), copper (Cu) and tin (Sn), for example, a nickel (Ni) layer and a tin (Sn) layer. May be formed in order. The number of electrodes 301 and 302 may be larger than the number depending on the specific type of the coil component 10, and the arrangement form thereof can be variously modified. Of course, the materials can also be different.

FIG. 4 is a schematic process diagram showing an example of manufacturing a coil component.

With reference to the drawings, in an example of manufacturing a coil component, the coil is formed by laminating a plurality of coil patterns 1121, 1122, 1123. At this time, among the coil patterns 1121, 1122, and 1123, the different coil patterns adjacent to each other in the stacking direction are formed so that their end portions are in contact with each other and are electrically connected. As a result, one coil 200 that rotates in the stacking direction is formed. Hereinafter, the production of the coil by laminating a plurality of coil patterns 1121, 1122, and 1123 will be described in more detail, but the content that overlaps with the above content will be omitted.

With reference to step 1001, the first insulating layer 1101 is provided. The first insulating layer 1101 may be a photoresist, and in this case, any material containing a photosensitive insulating (PID) substance can be used without particular limitation. The photoresist may be a positive type or a negative type.

With reference to step 1002, the first opening pattern 1111 is formed on the first insulating layer 1101 by a photolithography method. The photolithography method uses known exposure and development methods. At this time, the first opening pattern 1111 can be formed so as to penetrate the first insulating layer 1101, but is not limited thereto. The first opening pattern 1111 is formed so as to have a part of the coil shape, and if necessary, a separate substrate or the like is arranged on the floor of the first insulating layer 1101 for forming the first opening pattern 1111. You can also do it.

Referring to step 1003, the first opening pattern 1111 is filled with a metal paste and then cured to form the first coil pattern 1121. As the metal paste, a known paste containing a metal can be used. Further, the method of filling the metal paste is not particularly limited, and for example, a metal mask printing method or the like can be used. When the metal paste is filled and cured, the first coil pattern 1121 is formed, and the above description for the coil pattern can be applied to the first coil pattern 1121 in the same manner.

With reference to step 1004, the second insulating layer 1102 is formed on the first insulating layer 1101. The second insulating layer 1102 can be formed by a known laminating method. The second insulating layer 1102 may be a photoresist, and in this case, any material containing a photosensitive insulating (PID) substance can be used without particular limitation. The photoresist may be a positive type or a negative type.

With reference to step 1005, the second opening pattern 1112 is formed on the second insulating layer 1102 by a photolithography method. The photolithography method uses known exposure and development methods. At this time, the second opening pattern 1112 can be formed so as to penetrate the second insulating layer 1102, but is not limited thereto. The second opening pattern 1112 is formed so as to have a part of the coil shape, and the end portion is formed so as to be in contact with the end portion of the first coil pattern 1121.

Referring to step 1006, the second opening pattern 1112 is filled with a metal paste and then cured to form the second coil pattern 1122. As the metal paste, a known paste containing a metal can be used. Further, the method of filling the metal paste is not particularly limited, and for example, a metal mask printing method or the like can be used. When the metal paste is filled and cured, the second coil pattern 1122 is formed, and the above description for the coil pattern can be applied to the second coil pattern 1122 in the same manner.

With reference to step 1007, the third insulating layer 1103 is formed on the second insulating layer 1102. The third insulating layer 1103 can be formed by a known laminating method. The third insulating layer 1103 may be a photoresist, and in this case, it can be used without particular limitation as long as it contains a photosensitive insulating (PID) substance. The photoresist may be a positive type or a negative type.

With reference to step 1008, the third opening pattern 1113 is formed on the third insulating layer 1103 by a photolithography method. The photolithography method uses known exposure and development methods. At this time, the third opening pattern 1113 can be formed so as to penetrate the third insulating layer 1103, but is not limited thereto. The third opening pattern 1113 is formed so as to have a part of the coil shape, and the end portion is formed so as to be in contact with the end portion of the second coil pattern 1122.

Referring to step 1009, the third opening pattern 1113 is filled with a metal paste and then cured to form the third coil pattern 1123. As the metal paste, a known paste containing a metal can be used. Further, the method of filling the metal paste is not particularly limited, and for example, a metal mask printing method or the like can be used. When the metal paste is filled and cured, the third coil pattern 1123 is formed, and the above description for the coil pattern can be applied to the third coil pattern 1123 in the same manner.

Through a series of processes, one coil having one or more coil turns and rotating in the stacking direction can be formed. The above process may be repeated in order to have a larger number of coil turns. The laminate produced through a series of processes can itself be the body. Alternatively, the main body can be completed by further laminating a magnetic cover layer or the like on the upper portion and the lower portion thereof, if necessary. A coil component can be manufactured by forming an electrode on the main body. A plurality of coils may be manufactured at the same time, and such a plurality of coils may be included in one main body. If a plurality of coils are manufactured at the same time, an additional cutting step can be provided. Further, if necessary, it is possible to further have a polishing step for rounding the corners of the main body before forming the electrodes.

FIG. 5 is a schematic process diagram showing another manufacturing example of the coil component.

With reference to the drawings, in another manufacturing example of the coil component, the coil is formed by stacking a plurality of coil patterns 2121, 2122, and 2123. At this time, among the coil patterns 2121, 2122, and 2123, the different coil patterns adjacent to each other in the stacking direction are formed so that their end portions are in contact with each other and are electrically connected. As a result, one coil that rotates in the stacking direction is formed. Hereinafter, the production of the coil by laminating a plurality of coil patterns 2121, 2122, and 2123 will be described in more detail, but the content that overlaps with the above content will be omitted.

With reference to step 2001, the first insulating layer 2101 on which the first opening pattern 2111 is formed is formed. For this, a known coating method, for example, a screen printing method or the like can be used. The first insulating layer 2101 may be, but is not limited to, an electrically insulating magnetic layer obtained by molding a magnetic resin composite containing the above-mentioned metal magnetic powder and resin mixture in the form of a sheet. .. The first opening pattern 2111 can be formed so as to penetrate the first insulating layer 2101, but is not limited thereto. The first opening pattern 2111 is formed so as to have a part of the coil shape. If necessary, a separate substrate or the like may be arranged on the floor of the first insulating layer 2101 for the formation of the first insulating layer 2101.

Referring to step 2002, the first opening pattern 2111 is filled with a metal paste and then cured to form the first coil pattern 2121. As the metal paste, a known paste containing a metal can be used. Further, the method of filling the metal paste is not particularly limited, and for example, a metal mask printing method or the like can be used. When the metal paste is filled and cured, the first coil pattern 2121 is formed, and the above description for the coil pattern can be applied to the first coil pattern 2121 in the same manner.

Referring to step 2003, the second insulating layer 2102 in which the second opening pattern 2112 is formed is formed on the first insulating layer 2101. For this, a known coating method, for example, a screen printing method or the like can be used. The second insulating layer 2102 may be, but is not limited to, an electrically insulating magnetic layer obtained by molding a magnetic resin composite containing the above-mentioned metal magnetic powder and resin mixture in the form of a sheet. .. The second opening pattern 2112 can be formed so as to penetrate the second insulating layer 2102, but is not limited thereto. The second opening pattern 2112 is formed so as to have a part of the coil shape, and the end portion is formed so as to be in contact with the end portion of the first coil pattern 2121.

Referring to step 2004, the second opening pattern 2112 is filled with a metal paste and then cured to form the second coil pattern 2122. As the metal paste, a known paste containing a metal can be used. Further, the method of filling the metal paste is not particularly limited, and for example, a metal mask printing method or the like can be used. When the metal paste is filled and cured, the second coil pattern 2122 is formed, and the above description for the coil pattern can be applied to the second coil pattern 2122 in the same manner.

With reference to step 2005, the third insulating layer 2103 in which the third opening pattern 2113 is formed is formed on the second insulating layer 2102. For this, a known coating method, for example, a screen printing method or the like can be used. The third insulating layer 2103 may be an electrically insulating magnetic layer in which a magnetic resin composite containing a metal magnetic powder and a resin mixture as described above is formed in the form of a sheet, but is limited thereto. is not it. The third opening pattern 2113 can be formed so as to penetrate the third insulating layer 2103, but is not limited thereto. The third opening pattern 2113 is formed so as to have a part of the coil shape, and the end portion is formed so as to be in contact with the end portion of the second coil pattern 2122.

Referring to step 2006, the third opening pattern 2113 is filled with a metal paste and then cured to form the third coil pattern 2123. As the metal paste, a known paste containing a metal can be used. Further, the method of filling the metal paste is not particularly limited, and for example, a metal mask printing method or the like can be used. When the metal paste is filled and cured, the third coil pattern 2123 is formed, and the above description for the coil pattern can be applied to the third coil pattern 2123 in the same manner.

With reference to step 2007, the steps of sintering the first to third insulating layers 2101, 2102 and 2103 can be further performed, if necessary. As a result of sintering, the boundaries between the first to third insulating layers 2101, 2102 and 2103 may be unclear. That is, the first to third insulating layers 2101, 2102, and 2103 can be integrated into the insulating layer 2104.

Through a series of processes, one coil having one or more coil turns and rotating in the stacking direction can be formed. In order to have a larger number of coil turns, the above-mentioned process before sintering may be repeated. The laminate produced through a series of processes can itself be the main body. Alternatively, the main body can be completed by further laminating a magnetic cover layer or the like on the upper portion and the lower portion thereof, if necessary. A coil component can be manufactured by forming an electrode on the main body. A plurality of coils may be manufactured at the same time, and such a plurality of coils may be included in one main body. If a plurality of coils are manufactured at the same time, an additional cutting step can be provided. Further, if necessary, it is possible to further have a polishing step for rounding the corners of the main body before forming the electrodes.

FIG. 6 is a schematic process diagram showing still another manufacturing example of the coil component.

With reference to the drawings, in yet another example of manufacturing the coil component, the coil is formed by stacking a plurality of coil patterns 3121, 3122, 3123. At this time, among the coil patterns 3121, 3122, and 3123, the different coil patterns adjacent to each other in the stacking direction are formed so that their end portions are in contact with each other and are electrically connected. As a result, one coil that rotates in the stacking direction is formed. Hereinafter, the production of the coil by laminating a plurality of coil patterns 3121, 3122, and 3123 will be described in more detail, but the content that overlaps with the above content will be omitted.

With reference to step 3001, the first seed layer 3131 is formed. The first seed layer 3131 can be formed on a known carrier substrate (not shown). The first seed layer 3131 can be formed by using electroless plating, sputtering, or the like. Alternatively, when the carrier substrate (not shown) is a copper foil laminate (CCL), the copper foil can also be used as the first seed layer 3131.

With reference to step 3002, the first insulating layer 3101 is formed on the first seed layer 3131. The first insulating layer 3101 can be formed by a known laminating method. The first insulating layer 3101 may be a photoresist, and in this case, any material containing a photosensitive insulating (PID) substance can be used without particular limitation. The photoresist may be a positive type or a negative type.

With reference to step 3003, the first opening pattern 3111 is formed on the first insulating layer 3101 by a photolithography method. The photolithography method uses known exposure and development methods. At this time, the first opening pattern 3111 can be formed so as to penetrate the first insulating layer 3101, but is not limited thereto. The first opening pattern 3111 is formed so as to have a part of the coil shape.

Referring to step 3004, the first opening pattern 3111 is filled with metal plating to form the first coil pattern 3121. As the metal plating, known electrolytic plating using a dry film or the like can be used. The above description for the coil pattern can be applied to the first coil pattern 3121 in the same manner.

Referring to step 3005, the second seed layer 3132 is formed on the first insulating layer 3101. The second seed layer 3132 can be formed by using electroless plating, sputtering, or the like.

Referring to step 3006, the second insulating layer 3102 is formed on the second seed layer 3132. The second insulating layer 3102 can be formed by a known laminating method. The second insulating layer 3102 may be a photoresist, and in this case, any material containing a photosensitive insulating (PID) substance can be used without particular limitation. The photoresist may be a positive type or a negative type.

Referring to step 3007, the second opening pattern 3112 is formed on the second insulating layer 3102 by a photolithography method. The photolithography method uses known exposure and development methods. At this time, the second opening pattern 3112 can be formed so as to penetrate the second insulating layer 3102, but is not limited thereto. The second opening pattern 3112 is formed so as to have a part of the coil shape.

Referring to step 3008, the second opening pattern 3112 is filled with metal plating to form the second coil pattern 3122. As the metal plating, known electrolytic plating using a dry film or the like can be used. The above description for the coil pattern can be applied to the second coil pattern 3122 in the same manner.

Referring to step 3009, a third seed layer 3133 is formed on the second insulating layer 3102. The third seed layer 3133 can be formed by using electroless plating, sputtering, or the like.

Referring to step 3010, the third insulating layer 3103 is formed on the third seed layer 3133. The third insulating layer 3103 can be formed by a known laminating method. The third insulating layer 3103 may be a photoresist, and in this case, it can be used without particular limitation as long as it contains a photosensitive insulating (PID) substance. The photoresist may be a positive type or a negative type.

With reference to step 3011, a third aperture pattern 3113 is formed on the third insulating layer 3103 by a photolithography method. The photolithography method uses known exposure and development methods. At this time, the third opening pattern 3113 can be formed so as to penetrate the third insulating layer 3103, but is not limited thereto. The third opening pattern 3113 is formed so as to have a part of the coil shape.

Referring to step 3012, the third opening pattern 3113 is filled with metal plating to form the third coil pattern 3123. As the metal plating, known electrolytic plating using a dry film or the like can be used. The above description for the coil pattern can be applied to the third coil pattern 3123 in the same manner.

With reference to step 3013, the first to third insulating layers 3101, 3102 and 3103 are stripped and removed, if necessary. The stripping method is not particularly limited, and a known stripping solution can be used, or a method of burning and removing the stripping liquid can also be used.

With reference to step 3014, if necessary, the first to third seed layers 3131, 3132, and 3133 are partially etched and removed. That is, the remaining portion except the first to third seed layers 3131, 3132, and 3133 formed in the lower part of the first to third coil patterns 3121, 3122, and 3123 can be removed.

With reference to step 3015, the first to third coil patterns 3121, 3122, 3123 are surrounded by the magnetic material 3104, if necessary. As described above, the magnetic substance 3104 may be a magnetic resin composite in which a metal magnetic powder and a resin mixture are mixed. This may be formed in a sheet mold and laminated and integrated on the upper part and the lower part, respectively. Of course, other magnetic substances can be used.

Through a series of processes, one coil having one or more coil turns and rotating in the stacking direction can be formed. In order to have a larger number of coil turns, the above process may be repeated before stripping. The laminate produced through a series of processes can itself be the body. Alternatively, the main body can be completed by further laminating a magnetic cover layer or the like on the upper portion and the lower portion thereof, if necessary. A coil component can be manufactured by forming an electrode on the main body. As the coil, a plurality of coils may be manufactured at the same time, and such a plurality of coils may be included in one main body. If a plurality of coils are manufactured at the same time, a cutting step can be further provided. Further, if necessary, it is possible to further have a polishing step for rounding the corners of the main body before forming the electrodes.

On the other hand, in the present invention, "electrically connected" is a concept including both a physically connected case and a non-connected case. Further, the first and second expressions are used to distinguish one component from another component, and do not limit the order and / or importance of the corresponding components. In some cases, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component.

In addition, the expression "one example" used in the present invention does not mean the same embodiment, but is provided to emphasize and explain unique features that are different from each other. However, the example presented above does not preclude being realized in combination with the features of the other example. For example, even if the matter explained in a particular example is not explained in another example, the explanation is related to the other example unless there is an explanation that is opposite to or inconsistent with the matter in the other example. Can be understood.

It should be noted that the terms used in the present invention are merely explained to explain an example, and are not intended to limit the present invention. At this time, the singular expression includes the plural unless they have distinctly different meanings in the context.

1 Power inductor 2 High frequency inductor 3 Normal beads 4 High frequency beads 5 Common mode filter 10 Coil parts 100 Main body 105 Core 200 Coil 210, 211, 212, 213, 214, 215, 216, 217, 218, 219 Insulation layer 220, 221 222, 223, 224, 225, 226, 227, 228, 229 Coil pattern 301, 302 Electron 1101, 1102, 1103, 2101, 2102, 2103, 2104, 3101, 3102, 3103 Insulation layer 1111, 1112, 1113, 2111, 2112, 2113, 3111, 3112, 3113 Opening pattern 1121, 1122, 1123, 2121, 2122, 2123, 3121, 3122, 3123 Coil pattern 3131, 3132, 3133 Seed layer 3104 Magnetic material

Claims (2)

In the method of manufacturing coil parts in which one or more coils are arranged inside the main body,
The coil is formed by laminating a plurality of coil patterns.
Of the plurality of coil patterns, different coil patterns adjacent to each other in the stacking direction are formed so that their end portions are in contact with each other and are electrically connected to each other.
To form the coil by stacking the plurality of coil patterns
The stage of forming the first seed layer and
The stage of forming the first insulating layer on the first seed layer and
The stage of forming the first opening pattern on the first insulating layer and
The step of filling the first opening pattern with metal plating to form the first coil pattern, and
The stage of forming the second seed layer on the first insulating layer and
The stage of forming the second insulating layer on the second seed layer and
A step of forming a second opening pattern in the second insulating layer in which the end portion is in contact with the end portion of the first coil pattern.
The step of filling the second opening pattern with metal plating to form the second coil pattern, and
The stage of forming the third seed layer on the second insulating layer and
The stage of forming the third insulating layer on the third seed layer and
A step of forming a third opening pattern in the third insulating layer in which the end portion is in contact with the end portion of the second coil pattern.
The step of filling the third opening pattern with metal plating to form the third coil pattern, and
The stage of stripping the first to third insulating layers and
The stage of partially etching the first to third seed layers and
It is done through the process including
Manufacturing method of coil parts. The method for manufacturing a coil component according to claim 1 , wherein the first to third aperture patterns are formed by a photolithography method.

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