JP6955202B2 - Manufacturing method of substrate with film - Google Patents

Description

The present invention relates to a method for manufacturing a substrate with a film.

Of both main surfaces of a substrate such as a glass substrate, a functional film may be formed only on one main surface of the substrate. In this case, by protecting the other main surface of the substrate with a protective tool for the substrate, it is possible to suppress the formation of a functional film on the other main surface of the substrate. For example, in Patent Document 1, the adhesion of the film-forming material to the peripheral edge of the other main surface of the substrate is suppressed by using a jig having an adhesive surface that adheres to the peripheral edge of the other main surface of the substrate. ..

Japanese Unexamined Patent Publication No. 2016-197623

A technique for suppressing adhesion of a film-forming material to the peripheral edge of the other main surface of a substrate due to wraparound of the film-forming material when a functional film is formed on only one main surface of the substrate as in the above-mentioned conventional technique. There is still room for improvement.

An object of the present invention is to provide a film-coated substrate manufacturing method of that can in fact be only suitably deposited a functional film on the one principal surface of the substrate.

Method for producing a film-coated substrate to solve the above problems, a first major surface, a substrate protection which protects the first major surface of the substrate and a second main surface on the opposite side of the first main surface A method for manufacturing a film-coated substrate using the film-coated substrate , wherein the protective device for the substrate is made of a flexible material and has a size capable of covering at least the peripheral edge of the substrate. The base sheet is provided with a base sheet, an adhesive layer for adhering the base sheet to the peripheral edge of the substrate, and a spacer arranged at a position opposite to the pressure-sensitive adhesive layer across the base sheet. may have a through hole at a position surrounded by the adhesive layer, the manufacturing method includes a preparation step of preparing a deposition substrate by the adhesive and the substrate and the substrate protection, the deposition substrate In the preparatory step, a film forming step of forming a functional film on the second main surface of the substrate is provided. A suction device having a portion is used, and the protective device for a substrate is placed on the front-described mounting surface of the suction device so that the spacer is arranged between the front-described mounting surface and the base material sheet. The suction portion sucks the substrate on the adhesive layer through the through hole of the base sheet of the protective device for the substrate.

According to this method , the substrate is sucked through the through hole of the base material sheet before film formation, and the peripheral edge portion of the substrate and the peripheral edge portion of the base material sheet can be adhered to each other by the adhesive layer, and the film forming material can be formed at the time of film formation. Can be prevented from wrapping around and adhering to the peripheral edge of the first main surface of the substrate. Further, when the substrate is as thin as 0.05 to 1.5 mm, even if the substrate bends during suction, the base sheet made of a flexible material also bends, so that the base sheet and the peripheral portion of the substrate are formed. The adhesive layer between the material sheet and the peripheral edge of the material sheet does not come off. Further, when the protective device for the substrate is attached to the substrate, it is not necessary to press the second main surface of the substrate with a jig or the like, so that the cleanliness of the second main surface of the substrate can be easily maintained. Further, since the protective tool for the substrate includes the spacer, it is possible to prevent the substrate and the base material sheet from coming into contact with the mounting surface of the suction device even if the substrate and the base material sheet are bent during suction.

In the method for manufacturing a substrate with a film, it is preferable that the adhesive layer of the protective device for the substrate is formed in an annular shape.
According to this method , it is possible to further prevent the film-forming material from wrapping around during film formation and adhering to the peripheral edge of the first main surface of the substrate.

According to the present invention, a functional film can be suitably formed on only one main surface of a substrate.

It is an exploded perspective view which shows the protective equipment for a substrate in an embodiment. It is a perspective view which shows the substrate for film formation. It is a perspective view which shows the protective equipment for a substrate and the substrate with a film. It is a perspective view explaining the preparation process of the substrate for film formation. It is an end view explaining the preparation process of the substrate for film formation. It is an end view explaining the preparation process of the substrate for film formation. It is an end view which shows the modification example of the film-forming substrate. It is an end view explaining the preparation process of the substrate for film formation.

Hereinafter, embodiments of the substrate protective tool of the present invention and the method for manufacturing a substrate with a film will be described with reference to the drawings. In the drawings, for convenience of explanation, a part (for example, thickness) of the configuration may be exaggerated. In addition, the dimensional ratio of each part may differ from the actual one.

As shown in FIG. 1, the substrate S protected by the substrate protective tool 11 has a first main surface S1 and a second main surface S2 on the opposite side of the first main surface S1. The substrate protective tool 11 protects the first main surface S1 of the substrate S. The second main surface S2 of the substrate S protected by the protective tool 11 for the substrate is the main surface on which the functional film is formed, and by forming the functional film on the second main surface S2, the film is formed. Attached substrate is obtained. In the present embodiment, a glass substrate is used as the substrate S, but for example, a resin substrate or a ceramic substrate can also be used.

The substrate protective tool 11 includes a base sheet 12 having a size capable of covering at least the peripheral edge of the substrate S, and an adhesive layer 13 for adhering the base sheet 12 and the peripheral edge of the substrate S. ing.

The base sheet 12 is made of a flexible material. Examples of the flexible material include polymer materials such as resin materials and rubber materials. The base sheet 12 is flexible (soft) and easily deformed. Examples of the resin material include polyolefin resin, polyester resin, polyamide resin, and polyimide resin. Examples of the rubber material include silicon rubber, urethane rubber, chloroprene rubber, styrene / butadiene rubber, and ethylene / propylene / diene rubber. For example, when forming a film with heating, a heat-resistant base sheet 12 that can withstand the heat during the film formation may be used. The thickness of the base sheet 12 is, for example, in the range of 10 μm or more and 500 μm or less.

The adhesive layer 13 is formed in an annular shape. The adhesive layer 13 is provided on the base sheet 12. The adhesive layer 13 can be made of a well-known adhesive material. Examples of the adhesive layer 13 include a silicone-based adhesive layer, an acrylic-based adhesive layer, and a urethane-based adhesive layer. For example, when forming a film with heating, a heat-resistant adhesive layer that can withstand the heat during the film formation may be used. The adhesive layer 13 can be composed of an adhesive layer forming one surface of the double-sided adhesive tape or an adhesive layer formed by applying the adhesive layer to the base sheet 12. In the present embodiment, the adhesive layer 13 is provided on the base sheet 12 by attaching the double-sided adhesive tape to the base sheet 12. In the drawings, the support of the double-sided adhesive tape and the adhesive layer forming the other surface of the double-sided adhesive tape (the adhesive layer that adheres the support to the base sheet 12) are omitted. The support of the double-sided adhesive tape is made of, for example, a resin film such as a polyimide film or a PET film.

The adhesive strength of the adhesive layer 13 to the substrate S is preferably 3.0 (N / 25 mm width) or less, for example, from the viewpoint of easily peeling the adhesive layer 13 from the substrate S after film formation. .. The lower limit of the adhesive force of the adhesive layer 13 to the substrate S is preferably 0.05 (N / 25 mm width) or more in order to facilitate the adhesion to the substrate S. The adhesive strength of the adhesive layer 13 is measured according to the 180 ° peeling test specified in JIS Z0237 (2009).

As shown in FIGS. 1 and 2, the base sheet 12 has a through hole 12a at a position surrounded by the adhesive layer 13. More specifically, the inside of the base sheet 12 surrounded by the adhesive layer 13 is configured as a non-adhesive portion, and this non-adhesive portion has a through hole 12a. The through hole 12a of the base sheet 12 is used as an air discharge hole for discharging air between the substrate S and the base sheet 12 when the substrate protective tool 11 is attached to the substrate S. The number of through holes 12a may be singular as in the present embodiment, or may be changed to a plurality. The shape of the through hole 12a may be a quadrangular shape as in the present embodiment, or may be changed to a circular shape, for example. The area of the through hole 12a is preferably in the range of, for example, 5% or more and 50% or less when the area of the base sheet 12 is 100%. The larger the area of the through hole 12a, the easier it is for the function as an air discharge hole to be exhibited. The smaller the area of the through hole 12a, the wider the first main surface S1 of the substrate S can be covered with the base sheet 12, so that the cleanliness of the first main surface S1 can be easily maintained. The through hole 12a is preferably formed at a position closer to the center than the peripheral edge of the non-adhesive portion of the base sheet 12. In this case, the entire air between the substrate S and the base sheet 12 can be discharged in a well-balanced manner.

The substrate protective tool 11 of the present embodiment further includes a spacer 14 arranged at a position opposite to the pressure-sensitive adhesive layer 13 with the base material sheet 12 interposed therebetween. The shape of the spacer 14 is similar to that of the adhesive layer 13, that is, an annular shape continuous along the peripheral edge portion of the first main surface S1 of the substrate S. Examples of the material constituting the spacer 14 include a woven fabric or a non-woven fabric, and a rubber material. Examples of the woven fabric or non-woven fabric include glass cloth. Examples of the rubber material include silicon rubber, urethane rubber, chloroprene rubber, styrene / butadiene rubber, and ethylene / propylene / diene rubber. The spacer 14 may have a single-layer structure or a multi-layer structure composed of the same or different materials. For example, when forming a film with heating, a spacer 14 that can withstand the heat during the film formation may be used. The spacer 14 can be fixed to the base sheet 12 with a well-known adhesive or adhesive. The spacer 14 may be arranged by using, for example, a single-sided adhesive tape (glass cloth tape or the like) configured with the spacer 14 as a support. The thickness of the spacer 14 is, for example, in the range of 150 μm to 5 mm.

Next, a method for manufacturing a substrate with a film will be described.
As shown in FIG. 2, the method for manufacturing a substrate with a film includes a preparatory step of attaching a substrate protective tool 11 to the substrate S to prepare a film-forming substrate SA having the substrate S and the substrate protective tool 11. The film forming step of forming the functional film F on the second main surface S2 of the substrate S of the film forming substrate SA is provided. In the preparatory step, a film-forming substrate is prepared by sucking through the through hole 12a of the base material sheet 12 of the substrate protective tool 11 and adhering the substrate protective tool 11 and the substrate S.

As shown in FIG. 3, the film-attached substrate SF obtained in the film forming step has a functional film F provided on the second main surface S2 of the substrate S.
As shown in FIGS. 4 and 5, in the preparation step of this embodiment, a suction device 15 that sucks the substrate S is used. The suction device 15 opens into the decompression chamber 16, the exhaust unit 17 for exhausting the air in the decompression chamber 16, the mounting surface 18 on which the substrate protective tool 11 is mounted, and the mounting surface 18, and the decompression chamber. It is provided with a suction unit 19 for sucking the outside air of 16. A well-known vacuum pump (not shown) is connected to the exhaust unit 17.

In order to obtain the film-forming substrate SA in the preparatory step, first, the substrate protective tool 11 is placed on the mounting surface 18 of the suction device 15 so that the adhesive layer 13 of the substrate protective tool 11 is on the upper surface. The substrate S is placed on the adhesive layer 13 of the substrate protective tool 11.

Next, as shown in FIG. 6, the air in the decompression chamber 16 of the suction device 15 is exhausted from the exhaust unit 17. As a result, the suction unit 19 of the suction device 15 sucks the air between the base sheet 12 of the substrate protective tool 11 and the substrate S through the through hole 12a in the base sheet 12 of the substrate protective tool 11. By pressing the substrate S against the adhesive layer 13 of the substrate protective tool 11 by such suction, the substrate protective tool 11 can be attached to the substrate S.

Here, when the air between the substrate sheet 12 and the substrate S of the substrate protective tool 11 is sucked by using the suction device 15, the flat plate-shaped substrate S is curved so as to be convex toward the suction device 15. May be done. For example, when a glass substrate having a thickness of 0.05 to 1.5 mm is used as the flat plate-shaped substrate S, it tends to be easily curved as described above. Even if the substrate S bends during the above suction, the base sheet 12 made of a flexible material also bends, so that the adhesive layer 13 between the peripheral edge of the substrate S and the peripheral edge of the base sheet 12 is formed. It will not come off.

In the film forming process in the manufacturing method of the substrate SF with a film, a well-known film forming method such as PVD (Physical Vapor Deposition) method such as sputtering method, CVD (Chemical Vapor Deposition) method, coating method such as spraying and spin coating is used. be able to. Examples of the functional film F include a film having a predetermined optical property (dielectric film, etc.), a film having a predetermined mechanical property, a film having a predetermined chemical property, and a film having a predetermined color. Can be mentioned. The film-forming material for forming the functional film F may be an inorganic material or an organic material.

The film forming step may be performed in any posture in which the second main surface S2 of the film forming substrate SA is a horizontal plane, a vertical plane, or an inclined plane. For example, when the second main surface S2 of the film-forming substrate SA is arranged so as to be a vertical surface, the shape of the substrate sheet 12 of the substrate protective tool 11 is changed so as to project outward from the substrate S. , The film-forming substrate SA can be suspended and arranged by utilizing the protruding portion.

The substrate protective tool 11 after the film forming step can be repeatedly used in the method for manufacturing a substrate SF with a film. At this time, since the thickness of the protective equipment 11 for the substrate is relatively thin, it is possible to store the plurality of protective equipment 11 for the substrate in a compact manner by stacking them in the thickness direction.

According to the embodiment described in detail above, the following effects are exhibited.
(1) The protective tool 11 for a substrate includes a base material sheet 12 made of a flexible material and having a size capable of covering at least the peripheral edge of the substrate S. The substrate protective tool 11 further includes an adhesive layer 13 for adhering the substrate sheet 12 and the peripheral edge portion of the substrate S. The base sheet 12 has a through hole 12a at a position surrounded by the adhesive layer 13.

According to this configuration, the substrate S can be sucked through the through hole 12a of the base sheet 12 before the film formation, and the peripheral edge portion of the substrate S and the peripheral edge portion of the base sheet 12 can be adhered to each other by the adhesive layer 13. It is possible to prevent the film-forming material from wrapping around during film-forming and adhering to the peripheral edge of the first main surface S1 of the substrate. Further, when the substrate S is as thin as 0.05 to 1.5 mm, even if the substrate S bends during suction, the base sheet 12 made of a flexible material also bends, so that the substrate S is bent. The adhesive layer 13 between the peripheral edge portion and the peripheral edge portion of the base material sheet 12 does not peel off. Further, when the protective tool 11 for the substrate is attached to the substrate S, the second main surface S2 of the substrate S does not have to be pressed by a jig or the like, so that the cleanliness of the second main surface S2 of the substrate S is maintained. easy.

Therefore, the functional film F can be suitably formed only on the second main surface S2 of the substrate S.
(2) The adhesive layer 13 of the protective tool 11 for a substrate is formed in an annular shape. In this case, it is possible to further prevent the film-forming material from wrapping around during film formation and adhering to the peripheral edge of the first main surface S1 of the substrate S. Therefore, the functional film F can be more preferably formed only on the second main surface S2 of the substrate S.

Further, by forming the adhesive layer 13 of the substrate protective tool 11 so as to adhere only to the peripheral edge portion of the substrate S instead of the entire surface of the substrate S, it is difficult for the substrate protective tool 11 to excessively adhere to the substrate S. Therefore, the substrate protective tool 11 can be easily peeled off from the substrate S after the film formation. Further, by forming the adhesive layer 13 so as to adhere only to the peripheral edge portion of the substrate S instead of the entire surface of the substrate S, the adhesive is transferred to a range affecting the performance of the substrate S on the first main surface S1. It can be avoided.

(3) The protective tool 11 for a substrate further includes a spacer 14 arranged at a position opposite to the adhesive layer 13 with the base material sheet 12 interposed therebetween.
In this case, even if the substrate S is bent during suction, the space between the substrate S and the mounting surface 18 of the suction device 15 can be secured by the spacer 14. Therefore, it is possible to avoid applying an unnecessary impact to the substrate S.

(4) As a method for manufacturing the substrate SF with a film, a film-forming substrate SA is prepared by sucking through the through hole 12a of the substrate sheet 12 of the substrate protective tool 11 and adhering the substrate protective tool 11 and the substrate S. A preparatory step for forming a functional film F on the second main surface S2 of the substrate S in the film forming substrate SA is provided.

According to this method, the same effect as that described in the above column (1) can be obtained.
(Change example)
The spacer 14 of the substrate protective tool 11 of the above embodiment is fixed to the base sheet 12 of the substrate protective tool 11, but is arranged so as to be overlapped with the base sheet 12 without being fixed to the base sheet 12. It may be fixed to the mounting surface 18 of the suction device 15, for example.

-The spacer 14 of the protective tool 11 for the substrate can be omitted.
The adhesive layer 13 of the protective tool 11 for a substrate may be formed in a shape other than an annular shape.
-As shown in FIG. 7, the shape of the substrate S may be a curved plate shape. According to the substrate protective tool 11, since the substrate sheet 12 is made of a flexible material, the adhesive layer 13 is made to follow the first main surface S1 of the curved substrate S as well. Can be brought into close contact.

As shown in FIG. 8, for example, when the substrate protective tool 11 is attached to the curved plate-shaped substrate S by using the suction device 15, the spacer 14 of the substrate protective tool 11 is placed on the mounting surface 18 of the suction device 15. It deforms along. As a result, the first main surface S1 of the substrate S is easily pressed against the entire upper surface of the adhesive layer 13 of the substrate protective tool 11, and as a result, the first main surface of the substrate S against the adhesive layer 13 of the substrate protective tool 11 is easily pressed. The adhesion of S1 can be improved.

In the substrate protective tool 11 provided with the spacer 14 in this way, even if the shape of the first main surface S1 of the substrate S and the shape of the mounting surface 18 of the suction device 15 are different, the spacer of the substrate protective tool 11 When the 14 follows the mounting surface 18 of the suction device 15, the substrate protective tool 11 can be attached to the substrate S. Therefore, in the suction device 15, a high-precision mounting surface 18 along the first main surface S1 of the curved plate-shaped substrate S becomes unnecessary, and even if the substrates have different curvatures, the common suction device 15 can be used. It can be used. Therefore, it is possible to reduce the cost of equipment.

11 ... Substrate protective equipment, 12 ... Base sheet, 12a ... Through hole, 13 ... Adhesive layer, 14 ... Spacer, F ... Functional film, S ... Substrate, S1 ... First main surface, S2 ... Second main surface , SA ... Substrate for film formation, SF ... Substrate with film.

Claims (2)

Manufacture of a film-coated substrate by using a substrate protector that protects the first main surface of a substrate having a first main surface and a second main surface opposite to the first main surface. It ’s a method,
The substrate protective device includes a substrate sheet made of a flexible material and having a size capable of covering at least the peripheral edge of the substrate.
An adhesive layer that adheres the base material sheet to the peripheral edge of the substrate,
A spacer that is arranged at a position opposite to the adhesive layer with the base material sheet sandwiched therein is provided.
The base material sheet has a through hole at a position surrounded by the adhesive layer, and has a through hole.
The manufacturing method includes a preparatory step of preparing a film-forming substrate on which the protective equipment for the substrate and the substrate are adhered to each other.
A film forming step of forming a functional film on the second main surface of the substrate in the film forming substrate is provided.
In the preparatory step, a suction device having a mounting surface on which the protective equipment for a substrate is placed and a suction portion that opens in the above-mentioned mounting surface is used.
The substrate protective device is placed on the previously described surface of the suction device so that the spacer is arranged between the previously described surface and the base sheet.
A method for manufacturing a substrate with a film, which comprises sucking the substrate on the adhesive layer through the through hole of the base material sheet of the protective tool for the substrate by the suction portion. The method for manufacturing a substrate with a film according to claim 1, wherein the adhesive layer of the protective device for a substrate is formed in an annular shape.

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