JP6957962B2 - RFID tag manufacturing method - Google Patents

Description

The present invention relates to a method for manufacturing an RFID (Radio Frequency IDentifier) tag.

Conventionally, as a method for manufacturing an RFID tag, a method for manufacturing an RFID tag using a carrier tape accommodating a plurality of RFIC elements with a sealing material is known (see, for example, Patent Document 1).

In the manufacturing method of Patent Document 1, the carrier tape is continuously pulled out from the supply reel, and the antenna base material on which the antenna element is formed is pulled out from another supply reel, and the carrier tape and the antenna base material are brought close to each other. As a result, the RFIC element housed in the carrier tape is attached to the tape-shaped antenna base material. According to the manufacturing method of Patent Document 1, by continuously performing this operation, a plurality of RFID tags can be manufactured at a higher speed, so that the productivity of the RFID tags can be improved.

Japanese Patent No. 5904316

However, in Patent Document 1, since the carrier tape and the antenna base material are pulled out from the supply reel, tension is applied to the carrier tape and the antenna base material in the longitudinal direction, and the carrier tape and the antenna base material may be stretched. In this case, due to the difference between the elongation of the carrier tape and the elongation of the antenna base material, the sticking position of the RFIC element may shift, resulting in poor sticking, or the surface of the RFID tag may warp. If the surface of the RFID tag is warped, it becomes difficult to print on the surface. In particular, the smaller the RFID tag, the more difficult it is to print on the surface of the RFID tag.

In order to suppress the elongation of the carrier tape and the antenna base material, it is considered that the speed at which the carrier tape and the antenna base material are pulled out from the supply reel is slowed down to reduce the tension applied to the carrier tape and the antenna base material. However, in this case, the productivity of the RFID tag will decrease.

An object of the present invention is to provide a method for manufacturing an RFID tag, which can suppress sticking defects of RFIC elements and suppress a decrease in productivity of RFID tags.

In order to achieve the above object, the method for manufacturing an RFID tag according to one aspect of the present invention is:
The process of preparing the first sheet in which multiple antenna patterns are arranged, and
A step of preparing a second sheet in which a plurality of RFIC elements are arranged at positions corresponding to the plurality of antenna patterns, and a step of preparing the second sheet.
A step of aligning the plurality of antenna patterns and the plurality of RFIC elements and bonding the first sheet and the second sheet in the thickness direction.
A step of cutting the first sheet and the second sheet after bonding in the thickness direction and individualizing them into individual RFID tags.
including.

According to the method for manufacturing an RFID tag according to the present invention, it is possible to suppress improper sticking of RFIC elements and suppress a decrease in productivity of the RFID tag.

It is an exploded perspective view of the RFID tag manufactured by the manufacturing method of the RFID tag which concerns on embodiment of this invention. It is an exploded perspective view which shows an example of an RFIC element. It is a flowchart which shows an example of the manufacturing method of the RFID tag which concerns on embodiment of this invention. It is a perspective view which shows an example of the manufacturing method of the RFID tag which concerns on embodiment of this invention. It is a perspective view which shows the process which follows FIG. It is a perspective view which shows the process following FIG. It is a perspective view which shows the process which follows FIG. It is sectional drawing which shows the process which follows FIG. It is a perspective view which shows the process which follows FIG. It is a top view which shows the state which the RFID tag shown in FIG. 1 is attached to the tape-shaped member. It is a perspective view which shows the modification of the method of arranging a plurality of RFIC elements on a 2nd sheet. It is a perspective view which shows the process which follows FIG. It is a perspective view which shows the process which follows FIG. It is a perspective view which shows the process which follows FIG. It is a perspective view which shows the example which the arrangement interval of the recess of the accommodating tool is narrower than the arrangement interval of the RFIC element arranged in the 2nd sheet. It is a perspective view which shows one step of the modification of the method of arranging a plurality of RFIC elements on a 2nd sheet.

The method for manufacturing an RFID tag according to one aspect of the present invention includes a step of preparing a first sheet in which a plurality of antenna patterns are arranged, and a step of preparing a first sheet.
A step of preparing a second sheet in which a plurality of RFIC elements are arranged at positions corresponding to the plurality of antenna patterns, and a step of preparing the second sheet.
A step of aligning the plurality of antenna patterns and the plurality of RFIC elements and bonding the first sheet and the second sheet in the thickness direction.
A step of cutting the first sheet and the second sheet after bonding in the thickness direction and individualizing them into individual RFID tags.
including.

According to this manufacturing method, since the first sheet and the second sheet are bonded in the thickness direction, tension is not applied to the surface direction of the first sheet or the second sheet. Can be done. As a result, it is possible to suppress improper attachment of the RFIC element to the antenna pattern and prevent warpage of the RFID tag. Further, since the plurality of antenna patterns and the plurality of RFIC elements are aligned, the first sheet and the second sheet are bonded together, and then individualized so as to be individual RFID tags. , Multiple RFID tags can be manufactured at the same time. Therefore, it is possible to suppress a decrease in the productivity of the RFID tag.

It is preferable that the second sheet has an adhesive layer, the plurality of RFIC elements are arranged on the adhesive layer, and the second sheet is attached to the first sheet by the adhesive force of the adhesive layer. .. According to this manufacturing method, it is possible to eliminate the need to bond the plurality of RFIC elements and the plurality of antenna patterns with an adhesive such as solder. Thereby, for example, even when the RFID tag is bent, the connection portion between the RFIC element and the antenna pattern is slidable, so that the risk of disconnection can be reduced.

Further, a release paper is attached to the main surface of the first sheet on the side opposite to the main surface on which the antenna pattern is arranged, and the first sheet after the attachment and the first sheet are described. When cutting the second sheet in the thickness direction, it is preferable to cut the first sheet and the second sheet so as not to cut the release paper. According to this manufacturing method, a plurality of individually separated RFID tags can be held by a release paper. As a result, for example, only the necessary RFID tag can be removed from the release paper and used, and the handleability can be improved.

Further, a plurality of laminates of the first sheet and the second sheet in which the plurality of antenna patterns and the plurality of RFIC elements are aligned are laminated in the thickness direction, and pressure is applied in the thickness direction. It is preferable to attach the first sheet and the second sheet in each laminated body by adding the above. According to this manufacturing method, the first sheet and the second sheet in the plurality of laminated bodies can be bonded at the same time, so that the decrease in the productivity of the RFID tag can be further suppressed.

Further, before the step of laminating the first sheet and the second sheet, a step of forming a conductive paste in which conductive particles are dispersed on the first sheet is further included. Is preferable. According to this manufacturing method, conductive particles can be interposed between the antenna pattern and the RFIC element to improve the stability of the connection between the antenna pattern and the RFIC element.

Further, before the plurality of RFIC elements are arranged on the second sheet, a pass / fail judgment is performed and identification information is stored, and the first sheet and the second sheet are combined. After the step of bonding, it is preferable to further include a step of collectively reading the identification information stored in each of the plurality of RFIC elements by a reader device. According to this manufacturing method, the quality of the plurality of RFIC elements is determined before they are arranged on the second sheet, so that it is possible to suppress the production of defective products. Further, in the step of bonding the first sheet and the second sheet, it is possible that the RFIC element may be poorly attached. In this case, the reader device cannot read the identification information of the RFIC element. On the other hand, according to the manufacturing method, since the identification information of a plurality of RFIC elements is collectively read after the bonding step, the identification information that cannot be read by the reader device is confirmed to cause a bonding failure. The RFIC element in which the above occurs can be quickly identified. As a result, it is possible to further suppress the production of defective products, and further suppress the decrease in the productivity of the RFID tag.

Further, it is preferable that the plurality of RFIC elements are held by the tape-shaped member, removed from the tape-shaped member by a mounter, and arranged on the second sheet at predetermined intervals. According to this manufacturing method, RFIC elements can be arranged on the second sheet more quickly and accurately.

Further, the plurality of RFIC elements are each housed in a plurality of recesses provided in the container by vibrating the container while being mounted on the container, and are housed in the plurality of recesses. It is preferable that the second sheet is arranged on the second sheet at predetermined intervals by being attached to the adhesive layer of the second sheet in this state. According to this manufacturing method, a plurality of RFIC elements can be arranged on the second sheet at the same time more quickly and accurately.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment)
FIG. 1 is an exploded perspective view of an RFID tag manufactured by the method for manufacturing an RFID tag according to the embodiment of the present invention.

As shown in FIG. 1, the RFID tag 1 includes an antenna base material 2 forming a part of the first single-wafer sheet and a holding base material 3 forming a part of the second single-leaf sheet. The RFID tag 1 is, for example, an RFID tag whose communication frequency is the 900 MHz band, that is, the UHF band.

The antenna base material 2 is made of a heat-resistant member such as polyethylene naphthalate (PEN). An antenna pattern 21 is formed on one main surface of the antenna base material 2. The antenna pattern 21 is made of a conductive material such as copper foil, aluminum foil, or silver paste.

The antenna pattern 21 includes, for example, antenna conductors 21a and 21b formed in a miander shape and functioning as a dipole-type antenna. The first input / output terminal 21aa, which is one end of the antenna conductor 21a, and the second input / output terminal 21ba, which is one end of the antenna conductor 21b, are arranged apart from each other.

The holding base material 3 has an adhesive layer 31, and an RFIC element 4 is provided on the adhesive layer 31. The holding base material 3 is made of, for example, a heat-resistant member in order to protect the RFIC element 4. The adhesive layer 31 is made of, for example, an acrylic material having strong adhesiveness so that it can be attached to the antenna base material 2. The RFIC element 4 is, for example, a package or strap in which an RFIC chip is sealed. The RFIC element 4 is, for example, an RFIC element corresponding to a communication frequency in the 900 MHz band, that is, the UHF band. The reason why the member having heat resistance is used as the antenna base material 2 and the holding base material 3 is that an RFID tag used at a high temperature of 100 ° C. or higher can be configured. If it is not an RFID tag that requires such high temperature heat resistance, a cheaper member such as PET may be used as the antenna base material 2 and the holding base material 3.

FIG. 2 is an exploded perspective view showing an example of the RFIC element 4. Note that FIG. 2 shows a state in which the RFIC element 4 shown in FIG. 1 is turned upside down and disassembled. Further, in the XYZ coordinate system in FIG. 2, the Z axis indicates the thickness direction. This XYZ coordinate system is for facilitating the understanding of the invention and does not limit the present invention.

As shown in FIG. 2, the RFIC element 4 is composed of a multilayer substrate composed of three layers. Specifically, the RFIC element 4 is configured by laminating insulating sheets 41A, 41B, 41C made of a resin material such as polyimide or a liquid crystal polymer and having flexibility. The number of laminated substrate layers in the multilayer substrate can be appropriately adjusted according to the required inductance value and the like.

Further, the RFIC element 4 has an RFIC chip 42, a plurality of inductance elements 43A, 43B, 43C, 43D, and external connection terminals 44A, 44B. In the present embodiment, the inductance elements 43A to 43D and the external connection terminals 44A and 44B are formed on the insulating sheets 41A to 41C and are made of a conductive material such as copper.

The RFIC chip 42 is mounted at the center of the insulating sheet 41C in the longitudinal direction (Y-axis direction). The RFIC chip 42 has a structure in which various elements are built in a semiconductor substrate made of a semiconductor such as silicon. Further, the RFIC chip 42 includes a first input / output terminal 42a and a second input / output terminal 42b.

The inductance element 43A is formed of a conductor pattern provided in a spiral coil shape on the insulating sheet 41C on one side in the longitudinal direction (Y-axis direction) of the insulating sheet 41C. A land 43Aa connected to the first input / output terminal 42a of the RFIC chip 42 is provided at one end of the inductance element 43A (the end on the outside of the coil). A land 43Ab is provided at the other end of the inductance element 43A (the end on the coil center side).

The inductance element 43B is formed of a conductor pattern provided in a spiral coil shape on the insulating sheet 41C on the other side of the insulating sheet 41C in the longitudinal direction (Y-axis direction). A land 43Ba connected to the second input / output terminal 42b of the RFIC chip 42 is provided at one end of the inductance element 43B (the end on the outside of the coil). A land 43Bb is provided at the other end of the inductance element 43B (the end on the coil center side).

The inductance element 43C is formed of a conductor pattern provided in a spiral coil shape on the insulating sheet 41B on one side in the longitudinal direction (Y-axis direction) of the insulating sheet 41B. Further, the inductance element 43C faces the inductance element 43A in the stacking direction (Z-axis direction). A land 43Ca is provided at one end of the inductance element 43C (the end on the coil center side). The land 43Ca is connected to the land 43Ab of the inductance element 43A on the insulating sheet 41C via an interlayer connecting conductor 45A such as a through-hole conductor penetrating the insulating sheet 41B.

The inductance element 43D is formed of a conductor pattern provided in a spiral coil shape on the insulating sheet 41B on the other side of the insulating sheet 41B in the longitudinal direction (Y-axis direction). Further, the inductance element 43D faces the inductance element 43B in the stacking direction (Z-axis direction). A land 43Da is provided at one end of the inductance element 43D (the end on the coil center side). The land 43Da is connected to the land 43Bb of the inductance element 43B on the insulating sheet 41C via an interlayer connecting conductor 45B such as a through-hole conductor penetrating the insulating sheet 41B.

The inductance elements 43C and 43D on the insulating sheet 41B are integrated as one conductor pattern. That is, the other ends (the ends on the outside of the coil) are connected to each other. Further, the insulating sheet 41B is formed with a through hole 41Ba in which the RFIC chip 42 mounted on the insulating sheet 41C is housed.

The external connection terminals 44A and 44B are composed of a conductor pattern provided on the insulating sheet 41A. Further, the external connection terminals 44A and 44B face each other in the longitudinal direction (Y-axis direction) of the insulating sheet 41A.

The external connection terminal 44A is connected to the land 43Ca of the inductance element 43C on the insulating sheet 41B via an interlayer connecting conductor 45C such as a through-hole conductor penetrating the insulating sheet 41A. The external connection terminal 44A is connected to the first input / output terminal 21aa of the antenna conductor 21a shown in FIG.

The external connection terminal 44B is connected to the land 43Da of the inductance element 43D on the insulating sheet 41B via an interlayer connecting conductor 45D such as a through-hole conductor penetrating the insulating sheet 41A. The external connection terminal 44B is connected to the second input / output terminal 21ba of the antenna conductor 21b shown in FIG.

The RFIC chip 42 exists between the inductance elements 43A and 43B and between the inductance elements 43C and 43D. When the RFIC chip 42 functions as a shield, magnetic field coupling and capacitive coupling between the spiral coil-shaped inductance elements 43A and 43B provided on the insulating sheet 41C are suppressed. Similarly, magnetic field coupling and capacitive coupling between the spiral coil-shaped inductance elements 43C and 43D provided on the insulating sheet 41B are suppressed. As a result, the narrowing of the pass band of the communication signal is suppressed.

Next, a method for manufacturing the RFID tag according to the embodiment of the present invention will be described. FIG. 3 is a flowchart showing an example of a method for manufacturing an RFID tag according to an embodiment of the present invention. 4 to 9 are perspective views or cross-sectional views showing an example of a method for manufacturing an RFID tag according to an embodiment of the present invention.

First, in step S1, as shown in FIG. 4, an antenna base material tape 2A in which a plurality of antenna patterns 21 are arranged is prepared. A release paper 23 is attached to the main surface of the antenna base material tape 2A opposite to the main surface on which the antenna pattern 21 is arranged via the adhesive layer 22. The adhesive layer 22 is, for example, a double-sided tape.

Next, in step S2, as shown in FIG. 5, the antenna base material tape 2A is cut at predetermined intervals to prepare a plurality of first sheet 2B sheets. As a result, the first sheet 2B in which a plurality of antenna patterns 21 are arranged is prepared. The size of the first sheet 2B is, for example, a rectangular shape of 200 mm × 200 m or less (typically 135 mm × 135 mm).

Next, in step S3, the quality of the plurality of RFIC elements 4 is determined by the characteristic sorter, and the identification information is stored. For example, the RFIC element 4 whose pass / fail determination result is “good” is stored with an identification number as identification information. In the present embodiment, the RFIC element 4 whose quality has been determined is held by a tape-shaped member (not shown).

Next, in step S4, as shown in FIG. 6, a plurality of RFIC elements 4 are arranged on a plurality of second sheet 3B sheets. In the present embodiment, the plurality of RFIC elements 4 are removed from the tape-shaped member by a mounter (automatic mounting machine), and the second sheet 3B is formed at predetermined intervals so as to correspond to the plurality of antenna patterns 21. Arrange on the adhesive layer 31. As a result, the second sheet 3B in which the plurality of RFIC elements 4 are arranged at the positions corresponding to the plurality of antenna patterns 21 is prepared. At this time, in the RFIC element 4, the insulating sheet 41C is attached to the adhesive layer 31 so that the external connection terminals 44A and 44B are exposed (see FIG. 2). The size of the second sheet 3B is the same as the size of the first sheet 2B, and is, for example, a rectangular shape of 200 mm × 200 m or less (typically 135 mm × 135 mm). Since the first sheet 2B and the second sheet 3B have the same plane size, they can be overlapped with high accuracy without applying stress such as tension to each sheet. Further, if a sheet made of the same material is used for each sheet, warpage and waviness due to differences in the coefficient of thermal expansion and the like can be reduced.

The order of steps S1 and S2 and steps S3 and S4 is not particularly limited. For example, steps S3 and S4 may be performed before steps S1 and S2.

Next, as shown in FIG. 7, the plurality of antenna patterns 21 and the plurality of RFIC elements 4 are aligned, and the first sheet leaf sheet 2B and the second sheet leaf sheet 2B are bonded together in the thickness direction. In this embodiment, the following steps S5 and S6 are performed.

In step S5, as shown in FIG. 8, the laminate 10 of the first sheet 2B and the second sheet 3B in which the plurality of antenna patterns 21 and the plurality of RFIC elements 4 are aligned is in the thickness direction. (For example, 5 to 10 pieces) are laminated. In the present embodiment, the plurality of laminated bodies 10 are laminated on the pedestal 50. Each single-wafer sheet 2B, 3B is provided with a margin area around the product area, and a reference hole for positioning is provided in this margin area. That is, through holes 10A serving as reference holes are provided at each edge of the plurality of laminated bodies 10. A plurality of pins 51 provided on the pedestal 50 are inserted into the through holes 10A, and the laminated bodies 10 are positioned so as not to be displaced. In FIG. 8, the dimensions and the like of each member are exaggerated for easy understanding. The paper pattern may be arranged between the laminated bodies 10 so as not to stick to each other.

Next, in step S6, as shown by an arrow in FIG. 8, pressure is applied to the plurality of laminated bodies 10 in the thickness direction, and the first sheet-fed sheet 2B and the second sheet-fed sheet in each laminated body 10 are applied. Paste with 3B. At this time, the first sheet 2B and the second sheet 3B are attached to each other by the adhesive force of the adhesive layer 31, while the antenna patterns 21 facing each other and the RFIC element 4 are in direct contact with each other without using an adhesive. do. At this time, if air is mixed between the first sheet 2B and the second sheet 3B, the air may be pushed out by applying further pressure. Further, the air may be sucked by vacuuming.

Next, in step S6, each laminated body 10 is removed from the pedestal 50, and as shown in FIG. 9, the bonded first sheet 2B and the second sheet 3B are cut in the thickness direction. , Individually separated into individual RFID tags 1. At this time, the first sheet 2B and the second sheet 3B are cut so as not to cut the release paper 23. As a result, the plurality of individually separated RFID tags 1 are held by the release paper 23. The adhesive layer 22 may or may not be cut.

When it is necessary to print a barcode or the like on the surface of the RFID tag 1, it may be performed after removing each of the laminated bodies 10 from the pedestal 50 and before separating them into individual pieces. In the present embodiment, the first sheet 2B and the second sheet 3B have the same size, and it is possible to suppress the occurrence of a step between them, so that the RFID tag 1 can be easily printed on the surface. can do.

Next, in step S7, the identification information stored in the RFIC elements 4 of the plurality of RFID tags 1 held by the release paper 23 is collectively read by a reader device (not shown). By confirming the identification information that could not be read by the reader device, the RFIC element 4 in which the sticking defect has occurred is identified. If there is an RFIC element 4 having a sticking defect, the RFIC element 4 is removed from the release paper 23.

According to the manufacturing method according to the present embodiment, since the first sheet 2B and the second sheet 3B are bonded together in the thickness direction, the first sheet 2B or the second sheet 2B or the second sheet is attached. Tension can be prevented from being applied in the surface direction of the sheet 3B. As a result, it is possible to prevent the RFIC element 4 from being poorly attached to the antenna pattern 21 and to prevent the RFID tag 1 from being warped. As a result, even if the RFID tag 1 is miniaturized, printing can be easily performed on the surface of the RFID tag 1. In addition, the thickness of the first sheet 2B and the second sheet 3B can be made thinner, and the material can be suppressed from being restricted to reduce the cost.

Further, according to the manufacturing method according to the present embodiment, the plurality of antenna patterns 21 and the plurality of RFID elements 4 are aligned with each other, and the first sheet leaf sheet 2B and the second sheet leaf sheet 3B are bonded together. Later, it is individualized so as to become an individual RFID tag 1. Thereby, a plurality of RFID tags 1 can be manufactured at the same time. Therefore, it is possible to suppress a decrease in the productivity of the RFID tag 1.

Further, according to the manufacturing method according to the present embodiment, the second sheet 3B has an adhesive layer 31, and a plurality of RFIC elements 4 are arranged on the adhesive layer 31, due to the adhesive force of the adhesive layer 31. It is designed so that it can be attached to the first sheet 2B. As a result, it is possible to eliminate the need to bond the plurality of RFIC elements 4 and the plurality of antenna patterns 21 with an adhesive such as solder. As a result, for example, even when the RFID tag is bent, the connection portion between the RFIC element 4 and the antenna pattern 21 is slidable, so that stress concentration is suppressed and there is a risk that the antenna pattern 21 will be disconnected. Can be reduced. Further, it is possible to improve the stability of connection by eliminating the need to accurately form an adhesive between the plurality of RFIC elements 4 and the plurality of antenna patterns 21.

Further, according to the manufacturing method according to the present embodiment, the release paper 23 is attached to the first sheet 2B, and the first sheet 2B and the second sheet are not cut so as not to cut the release paper 23. The sheet 3B is cut into individual RFIC elements 4. As a result, the plurality of individually separated RFID tags 1 can be held by the release paper 23. As a result, for example, only the necessary RFID tag 1 can be removed from the release paper 23 and used, and the handleability can be improved.

Further, according to the manufacturing method according to the present embodiment, a plurality of laminated bodies 10 are laminated in the thickness direction, and pressure is applied in the thickness direction to obtain the first sheet 2B in each laminated body 10. The second sheet 3B is attached to the sheet. As a result, the first sheet 2B and the second sheet 3B in the plurality of laminated bodies 10 can be bonded at the same time, so that the decrease in the productivity of the RFID tag 1 can be further suppressed.

Further, according to the manufacturing method according to the present embodiment, since the first single-leaf sheet 2B and the second single-leaf sheet 3B are bonded together in the thickness direction, a plurality of the second single-leaf sheet 3B is attached. More RFID tags 1 can be manufactured by narrowing the arrangement spacing of the RFIC elements 4. In addition, the number of unnecessary antenna base materials 2 can be significantly reduced as compared with the conventional manufacturing method (roll-to-roll). However, in this case, if the arrangement interval of the RFIC elements 4 is narrow, radio waves interfere with each other, and after arranging a plurality of RFIC elements 4 on the second sheet 3B, the quality of each RFIC element 4 cannot be determined by the characteristic sorter. Can occur.

On the other hand, according to the manufacturing method according to the present embodiment, the quality of the plurality of RFIC elements 4 is determined before they are arranged on the second sheet 3B, and the identification information is stored. There is. As a result, it is possible to suppress the production of defective products. Further, in the step of laminating the first sheet 2B and the second sheet 3B, improper attachment of the RFIC element 4 (disconnection of the antenna, misalignment, etc.) may occur. In this case, the reader device cannot read the identification information of the RFIC element 4.

On the other hand, according to the manufacturing method according to the present embodiment, the identification information stored in each of the plurality of RFIC elements 4 after the first sheet-fed sheet 2B and the second sheet-fed sheet 3B are bonded together. Are read in a batch. As a result, by confirming the identification information that could not be read by the reader device, the RFIC element 4 in which the sticking defect has occurred can be quickly identified on a sheet-by-sheet basis. As a result, it is possible to further suppress the production of defective products, and further suppress the decrease in productivity of the RFID tag 1.

Further, according to the manufacturing method according to the present embodiment, the plurality of RFIC elements 4 are held by the tape-shaped member, removed from the tape-shaped member by the mounter, and have a predetermined interval on the second sheet 3B. It is arranged by. Thereby, the RFIC element 4 can be arranged on the second sheet 3B more quickly and accurately.

When printing on the surface of the RFID tag 1 using a general RFID printer, it may be required that the RFID tag 1 be held by the tape-shaped member. In this case, for example, the RFID tag 1 may be removed from the release paper 23, and the RFID tag 1 may be attached to the tape-shaped member 60 as shown in FIG. Even in this case, since the antenna base material 2 and the holding base material 3 are attached to each other, the stability of the connection between the antenna pattern 21 and the RFIC element 4 can be ensured.

The present invention is not limited to the above-described embodiment, and can be implemented in various other embodiments. For example, in the above description, the antenna conductors 21a and 21b are formed in a miander shape, and the RFID tag 1 is a UHF band RFID tag having a UHF band as a communication frequency, but the present invention is not limited thereto. For example, the antenna conductors 21a and 21b may be formed in a rectangular band shape or in another shape, for example. Further, the antenna conductors 21a and 21b are supposed to function as a dipole type antenna, but the present invention is not limited to this. The antenna conductors 21a and 21b may function as a loop type antenna or may function as another type of antenna. Further, the RFID tag 1 may be configured as an HF band RFID tag having an HF band as a communication frequency.

Further, in the above description, the identification information stored in the plurality of RFIC elements 4 is collectively read by the reader device after being separated into individual RFID tags 1, but the present invention is not limited to this. After the first sheet 2B and the second sheet 3B are bonded together, the identification information stored in the plurality of RFIC elements 4 is collectively collected by the reader device before being separated into individual RFID tags 1. You may read it.

Further, in the above description, all the steps of steps S1 to S7 are performed, but the present invention is not limited to this. The process of aligning the plurality of antenna patterns 21 and the plurality of RFIC elements 4 and bonding the first sheet 2B and the second sheet 3B, and individualizing the RFID tags 1 into individual pieces. It suffices to carry out the other steps, and it is not always necessary to carry out the other steps.

Further, in the above description, the antenna patterns 21 facing each other and the RFIC element 4 are in direct contact with each other without using an adhesive, but the present invention is not limited to this. For example, before the first sheet 2B and the second sheet 3B are bonded together, a conductive paste in which conductive particles are dispersed is formed on the first sheet 2B, and the antenna pattern 21 and RFIC are formed. Conductive particles may be interposed between the element 4 and the element 4. Thereby, the stability of the connection between the antenna pattern 21 and the RFIC element 4 can be further improved. The conductive paste may be printed or applied on the antenna pattern 21, for example. As the conductive paste, for example, a silver paste in which silver particles are dispersed can be used. The conductive paste preferably does not have adhesiveness so that the connecting portion between the RFIC element 4 and the antenna pattern 21 can slide.

Further, in the above description, the plurality of RFIC elements 4 are removed from the tape-shaped member by a mounter and arranged on the second sheet 3B at predetermined intervals, but the present invention is not limited thereto. .. For example, the plurality of RFIC elements 4 may be arranged on the second sheet 3B as follows.

First, as shown in FIG. 11, an accommodating tool 100 in which a plurality of recesses 100a capable of accommodating a plurality of RFIC elements 4 are provided in a matrix at equal intervals is prepared. The arrangement spacing (also referred to as arrangement density) of the plurality of recesses 100a of the container 100 coincides with the arrangement spacing of the plurality of RFIC elements 4 arranged on the second single-wafer sheet 3B.

Next, as shown in FIG. 12, the accommodating device 100 is mounted on the vibrating device 110, and a plurality of RFIC elements 4 are mounted on the accommodating device 100.

Next, as shown in FIG. 13, with the plurality of RFIC elements 4 mounted on the accommodating device 100, the accommodating device 100 is vibrated by the vibrating device 110, and the RFIC element 4 is housed one by one in each recess 100a. .. The RFIC element 4 that is not accommodated in the recess 100a is dropped to the outside of the accommodating tool 100.

Next, as shown in FIG. 14, with the RFIC element 4 housed in each recess 100a, the adhesive layer 31 of the second sheet 3B is brought into contact with the main surface of the container 100 on the recess 100a side. As a result, the RFIC element 4 housed in each recess 100a is attached (transferred) to the adhesive layer 31 of the second sheet 3B.

Next, the second sheet 3B is separated from the container 100. As a result, as shown in FIG. 6, a plurality of RFIC elements 4 can be arranged on the second sheet 3B at predetermined intervals. According to this method, a plurality of RFIC elements 4 can be arranged on the second sheet 3B at the same time more quickly and accurately.

In the above description, it is assumed that the arrangement spacing of the plurality of recesses 100a of the accommodating tool 100 matches the arrangement spacing of the plurality of RFIC elements 4 arranged on the second sheet 3B, but the present invention is limited to this. Not done. For example, the arrangement interval of the recesses 100a of the accommodating tool 100 may be narrower than the arrangement interval of the RFIC elements 4 arranged on the second sheet 3B. For example, as shown in FIG. 15, the arrangement interval L1 of the recess 100a of the accommodating tool 100 in the X1 direction may be 1/3 of the arrangement interval L2 of the RFIC elements 4 arranged on the second single-wafer sheet 3B.

In this case, as shown in FIG. 16, the recesses 100a other than the first row and the fourth row of the container 100 are covered with the mask 120, and in this state, the adhesive layer 31 of the second sheet 3B is covered with the recesses of the container 100. It is brought into contact with the main surface on the 100a side. As a result, the RFIC elements 4 housed in the recesses 100a of the first row and the fourth row were attached to the adhesive layer 31 of the second sheet 3B, and the plurality of RFIC elements 4 were arranged at the arrangement interval L2. The second sheet 3B can be obtained. Further, the recesses 100a other than the second and fifth rows of the container 100 are covered with the mask 120, and in this state, the adhesive layer 31 of the second sheet 3B is applied to the main surface of the container 100 on the recess 100a side. The arrangement interval L1 minutes is shifted in the X1 direction and the contacts are brought into contact with each other. As a result, the RFIC elements 4 housed in the recesses 100a of the second and fifth rows were attached to the adhesive layer 31 of the second sheet 3B, and the plurality of RFIC elements 4 were arranged at the arrangement interval L2. The second sheet 3B can be obtained. Further, the recesses 100a other than the third and sixth rows of the container 100 are covered with the mask 120, and in this state, the adhesive layer 31 of the second sheet 3B is applied to the main surface of the container 100 on the recess 100a side. The cells are brought into contact with each other by further shifting the arrangement interval L1 minutes in the X1 direction. As a result, the RFIC elements 4 housed in the recesses 100a of the third and sixth rows were attached to the adhesive layer 31 of the second sheet 3B, and the plurality of RFIC elements 4 were arranged at the arrangement interval L2. The second sheet 3B can be obtained.

In other words, a plurality of RFIC elements 4 are arranged in the accommodating tool 100 at the first arrangement interval L1, and among the plurality of RFIC elements 4 arranged in the accommodating device 100, the intervals are narrower than the first arrangement interval. Then, the RFIC element group having the second arrangement interval L2 corresponding to the arrangement interval of the plurality of antenna patterns 21 arranged on the first sheet 2B was taken out, and the second sheet was maintained in a state where the second arrangement interval was maintained. It may be arranged in 3B. According to this method, a plurality of RFIC elements 4 housed in one container 100 can be arranged on a plurality of second sheet 3Bs.

Although the present invention has been fully described in connection with preferred embodiments with reference to the accompanying drawings, various modifications and modifications are obvious to those skilled in the art. It should be understood that such modifications and modifications are included therein, as long as they do not deviate from the scope of the invention according to the appended claims.

INDUSTRIAL APPLICABILITY The present invention is particularly useful in a method for manufacturing a small RFID tag because it can suppress improper sticking of RFIC elements and suppress a decrease in productivity of RFID tags.

1 RFID tag 2 Antenna base material 2A Antenna base material tape 2B 1st sheet 3 Holding material 3B 2nd sheet 4 RFIC element 10 Laminated body 10A Through hole 21 Antenna pattern 21a, 21b Antenna conductor 21aa 1st input / output Terminal 21ba 2nd input / output terminal 22 Adhesive layer 23 Release paper 31 Adhesive layer 41A, 41B, 41C Insulation sheet 41Ba Through hole 42 Chip 42a 1st input / output terminal 42b 2nd input / output terminal 43A, 43B, 43C, 43D Inverter element 43Aa , 43Ab, 43Ba, 43Bb, 43Ca, 43Da Land 44A, 44B External connection terminal 45A, 45B, 45C, 45D Interlayer connection conductor 50 Pedestal 51 pin 60 Tape-like member 100 Accommodator 100a Recess 110 Vibrating device 120 Mask

Claims (7)

The process of preparing the first sheet in which multiple antenna patterns are arranged, and
A step of preparing a second sheet in which a plurality of RFIC elements are arranged at positions corresponding to the plurality of antenna patterns, and a step of preparing the second sheet.
A step of aligning the plurality of antenna patterns and the plurality of RFIC elements and bonding the first sheet and the second sheet in the thickness direction.
A step of cutting the first sheet and the second sheet after bonding in the thickness direction and individualizing them into individual RFID tags.
Only including,
A method for manufacturing an RFID tag, wherein the plurality of RFIC elements are held by a tape-shaped member, removed from the tape-shaped member by a mounter, and arranged on the second sheet at predetermined intervals. The process of preparing the first sheet in which multiple antenna patterns are arranged, and
A step of preparing a second sheet in which a plurality of RFIC elements are arranged at positions corresponding to the plurality of antenna patterns, and a step of preparing the second sheet.
A step of aligning the plurality of antenna patterns and the plurality of RFIC elements and bonding the first sheet and the second sheet in the thickness direction.
A step of cutting the first sheet and the second sheet after bonding in the thickness direction and individualizing them into individual RFID tags.
Only including,
The plurality of RFIC elements are each housed in a plurality of recesses provided in the housing by vibrating the housing in a state of being mounted on the housing, and are housed in the plurality of recesses. A method for manufacturing an RFID tag, which is attached to the adhesive layer of the second sheet and is arranged on the second sheet at predetermined intervals. It said second leaf sheet has an adhesive layer, a plurality of RFIC elements arranged on the adhesive layer is affixed by the adhesive force of the adhesive layer on the first leaf sheet according to claim 1 or 2. The method for manufacturing an RFID tag according to 2. A release paper is attached to the main surface of the first sheet, which is opposite to the main surface on which the antenna pattern is arranged.
When the first sheet and the second sheet after bonding are cut in the thickness direction, the first sheet and the second sheet are not cut so as not to cut the release paper. The method for manufacturing an RFID tag according to any one of claims 1 to 3, which cuts off the RFID tag. A plurality of laminates of the first sheet and the second sheet in which the plurality of antenna patterns and the plurality of RFID elements are aligned are laminated in the thickness direction, and pressure is applied in the thickness direction. The method for manufacturing an RFID tag according to any one of claims 1 to 4 , wherein the first sheet and the second sheet in each laminated body are bonded to each other. The claim further comprises a step of forming a conductive paste in which conductive particles are dispersed on the first sheet, prior to the step of adhering the first sheet and the second sheet. The method for manufacturing an RFID tag according to any one of 1 to 5. Before the plurality of RFIC elements are arranged on the second single-wafer sheet, a pass / fail judgment is performed and identification information is stored.
After the step of laminating the first sheet and the second sheet, the step of collectively reading the identification information stored in each of the plurality of RFIC elements by a reader device is further included.
The method for manufacturing an RFID tag according to any one of claims 1 to 6.

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