JP6958681B2 - Liquid discharge device and wiring members - Google Patents

Description

The present invention relates to a liquid discharge device and a wiring member.

Patent Document 1 discloses an inkjet recording head that is mounted on a printer and ejects ink to a recording medium as a liquid ejection device. This recording head has a flow path forming substrate in which a plurality of pressure chambers are formed, a plurality of piezoelectric elements corresponding to the plurality of pressure chambers, and a nozzle plate in which a plurality of nozzles communicating with the plurality of pressure chambers are formed. ..

The plurality of pressure chambers of the flow path forming substrate form two pressure chamber rows arranged in the width direction of the flow path forming substrate. The plurality of piezoelectric elements are arranged on one surface of the flow path forming substrate corresponding to the plurality of pressure chambers. Further, the plurality of piezoelectric elements form two rows of piezoelectric elements arranged in the width direction of the flow path forming substrate according to the arrangement of the pressure chambers. The nozzle plate is laminated on the surface of the flow path forming substrate opposite to the piezoelectric element.

Wiring (lead electrodes) is connected to each of the plurality of piezoelectric elements forming the two piezoelectric element trains. The wiring of the plurality of piezoelectric elements is drawn out to the region between the two piezoelectric element rows. Two wiring members (COF boards) are connected to the above area. Two drive ICs (drive circuits) arranged in the longitudinal direction of the flow path forming substrate are mounted on each wiring member. When the drive signal output from the drive IC is supplied to each piezoelectric element via the wiring, the ink pressure in the pressure chamber increases due to the deformation of each piezoelectric element, and the ink is ejected from the nozzle.

Japanese Unexamined Patent Publication No. 2012-206283

In the recording head of Patent Document 1, two drive ICs are provided on one wiring member. In this configuration, when handling the wiring member at the time of manufacturing the head, the flexible substrate of the wiring member is easily bent between the two drive ICs. This makes it difficult to handle and align the wiring members, which causes a decrease in the yield of the head.

An object of the present invention is to suppress bending of a flexible substrate between two drive ICs in a configuration in which two drive ICs are mounted on one wiring member.

The liquid discharge device of the present invention is flexible with a first drive element, a second drive element, a head unit having a first contact connected to the first drive element, and a second contact connected to the second drive element. The substrate, the first drive IC provided in the first portion of the flexible substrate, the second drive IC provided in the second portion of the flexible substrate, and the first drive IC formed on the flexible substrate. A wiring member having a first wiring for connecting the first contact and a second wiring formed on the flexible substrate and connecting the second drive IC and the second contact, and the flexible substrate of the flexible substrate. It is characterized in that a conductive portion different from the first wiring and the second wiring is arranged in the third portion between the first portion and the second portion.

In the present invention, a conductive portion different from the first wiring and the second wiring for supplying a signal to the driving element is arranged on the third portion of the flexible substrate of the wiring member. Since this conductive portion increases the rigidity of the third portion of the flexible substrate located at the two drive ICs, the flexible substrate is less likely to bend at the third portion when the wiring member is handled.

It is a schematic plan view of the printer which concerns on this embodiment. It is a top view of one head unit of an inkjet head. It is an enlarged view of the part A of FIG. FIG. 3 is a sectional view taken along line IV-IV of FIG. It is a back view of COF. FIG. 5 is an enlarged view of part B in FIG. FIG. 6 is a cross-sectional view taken along the line VII-VII of FIG. It is a back view of the modified form of COF. It is a partially enlarged view of the COF of another modified form. It is a back view of another modified form of COF. It is a partially enlarged view of the COF of another modified form. It is a partially enlarged view of the COF of another modified form. It is a partially enlarged view of the COF of another modified form. It is a partially enlarged view of the COF of another modified form. It is a back view of another modified form of COF. It is a back view of another modified form of COF. It is a back view of another modified form of COF. It is a top view of the head unit of the form concerning the disclosed invention. It is a back view of the COF of FIG. It is the C part enlarged view of FIG.

Next, an embodiment of the present invention will be described. FIG. 1 is a schematic plan view of a printer according to the present embodiment. First, a schematic configuration of the inkjet printer 1 will be described with reference to FIG. The front, back, left, and right directions shown in FIG. 1 are defined as "front", "rear", "left", and "right" of the printer. In addition, the front side of the paper is defined as "upper" and the other side of the paper is defined as "lower". In the following, each direction word of front, back, left, right, up and down will be described as appropriate.

(Outline configuration of printer)
As shown in FIG. 1, the inkjet printer 1 includes a platen 2, a carriage 3, an inkjet head 4, a transport mechanism 5, a control device 6, and the like.

The recording paper 100, which is the recording medium, is placed on the upper surface of the platen 2. The carriage 3 is configured to be reciprocally movable in the left-right direction (hereinafter, also referred to as a scanning direction) along the two guide rails 10 and 11 in a region facing the platen 2. An endless belt 14 is connected to the carriage 3, and the carriage 3 is driven by the carriage drive motor 15 to move the carriage 3 in the scanning direction.

The inkjet head 4 is attached to the carriage 3 and moves in the scanning direction together with the carriage 3. The inkjet head 4 includes four head units 16 arranged in the scanning direction. The four head units 16 are connected to a cartridge holder 7 to which ink cartridges 17 of four colors (black, yellow, cyan, magenta) are mounted by a tube (not shown). Each head unit 16 has a plurality of nozzles 20 (see FIGS. 2 to 4) formed on the lower surface thereof (the surface on the opposite side of the paper surface of FIG. 1). The nozzle 20 of each head unit 16 ejects the ink supplied from the ink cartridge 17 toward the recording paper 100 mounted on the platen 2.

The transport mechanism 5 has two transport rollers 18 and 19 arranged so as to sandwich the platen 2 in the front-rear direction. The transport mechanism 5 transports the recording paper 100 mounted on the platen 2 forward (hereinafter, also referred to as a transport direction) by the two transport rollers 18 and 19.

The control device 6 includes a ROM (Read Only Memory), a RAM (Random Access Memory), an ASIC (Application Specific Integrated Circuit) including various control circuits, and the like. The control device 6 executes various processes such as printing on the recording paper 100 by the ASIC according to the program stored in the ROM. For example, in the printing process, the control device 6 controls the inkjet head 4, the carriage drive motor 15, and the like based on a printing command input from an external device such as a PC to print an image or the like on the recording paper 100. .. Specifically, the ink ejection operation of ejecting ink while moving the inkjet head 4 together with the carriage 3 in the scanning direction and the conveying operation of conveying a predetermined amount of the recording paper 100 in the conveying direction by the conveying rollers 18 and 19 are alternated. Let me do it.

(Details of inkjet head)
Next, the detailed configuration of the inkjet head 4 will be described. FIG. 2 is a top view of one head unit 16 of the inkjet head 4. Since all the four head units 16 of the inkjet head 4 have the same configuration, one of them will be described, and the other head units 16 will be omitted. FIG. 3 is an enlarged view of part A of FIG. FIG. 4 is a sectional view taken along line IV-IV of FIG.

As shown in FIGS. 2 to 4, the head unit 16 includes a first flow path substrate 21, a second flow path substrate 22, a nozzle plate 23, a piezoelectric actuator 24, and a reservoir forming member 25. Two COFs (Chip On Films) 50 are connected to the head unit 16. In FIG. 2, for simplification of the drawing, only the outer shape of the two COFs 50 and the reservoir forming member 25 located above the first flow path substrate 21 and the piezoelectric actuator 24 is shown by a two-dot chain line. .. Hereinafter, the head unit 16 and the COF 50 joined to the head unit 16 will be described.

(1st flow path substrate)
The first flow path substrate 21 is a silicon single crystal substrate. A plurality of pressure chambers 26 are formed in the first flow path substrate 21. The thickness of the first flow path substrate 21 is, for example, 100 μm. The plurality of pressure chambers 26 are arranged in the transport direction to form two rows of pressure chambers arranged in the scanning direction. In FIG. 2, for simplification of the figure, only 18 pressure chambers constituting one pressure chamber row are shown, but in reality, more pressure chambers are arranged at a very small pitch. ing. Further, a vibrating film 30 covering a plurality of pressure chambers 26 is formed on the first flow path substrate 21. _{The vibrating film 30 is an insulating material containing silicon dioxide (SiO 2} ) or silicon nitride (SiNx), which is formed by oxidizing or nitriding a part of the surface of the first flow path substrate 21 of silicon. It is a membrane.

(Second flow path substrate)
The second flow path substrate 22 is also a silicon single crystal substrate like the first flow path substrate 21. The thickness of the second flow path substrate 22 is, for example, 200 μm. The second flow path substrate 22 is formed with a plurality of flow path holes 27 communicating with each of the plurality of pressure chambers 26.

(Nozzle plate)
The nozzle plate 23 is arranged on the lower surface of the second flow path substrate 22. The nozzle plate 23 is made of a synthetic resin such as polyimide. The thickness of the nozzle plate 33 is, for example, 30 to 50 μm. The nozzle plate 23 is formed with a plurality of nozzles 20 that communicate with each of the plurality of flow path holes 27 of the second flow path substrate 22. As shown in FIG. 2, the plurality of nozzles 20 are arranged in the transport direction in the same manner as the plurality of pressure chambers 26 of the first flow path substrate 21, and form two nozzle rows arranged in the scanning direction. Between the two nozzle rows, the position of the nozzle 20 in the transport direction is deviated by half (P / 2) of the arrangement pitch P in each nozzle row.

(Piezoelectric actuator)
The piezoelectric actuator 24 includes the above-mentioned vibrating membrane 30 and a plurality of piezoelectric elements 39 arranged corresponding to a plurality of pressure chambers 26 arranged in two rows on the upper surface of the vibrating membrane 30. Further, the piezoelectric actuator 24 is also formed with a communication hole 24a for communicating the flow path in the reservoir forming member 25, which will be described later, with the plurality of pressure chambers 26, respectively.

Hereinafter, the configuration of the piezoelectric element 39 will be described. A lower electrode 31 is formed on the upper surface of the vibrating membrane 30 so as to straddle the plurality of pressure chambers 26. The lower electrode 31 is a common electrode for a plurality of piezoelectric elements 39. The material of the lower electrode 31 is not particularly limited, but is made of, for example, platinum (Pt).

Two piezoelectric bodies 32 are arranged on the lower electrode 31 corresponding to each of the two pressure chamber rows. One piezoelectric body 32 has a rectangular planar shape long in the transport direction, and is arranged so as to straddle a plurality of pressure chambers 26 constituting the corresponding pressure chamber rows. The piezoelectric body 32 is formed of, for example, a piezoelectric material containing lead zirconate titanate (PZT), which is a mixed crystal of lead titanate and lead zirconate, as a main component. Alternatively, the piezoelectric body 32 may be formed of a lead-free piezoelectric material.

A plurality of upper electrodes 33 corresponding to the plurality of pressure chambers 26 are formed on the upper surface of the piezoelectric body 32. The upper electrode 33 is made of, for example, platinum (Pt) or iridium (Ir).

In the above configuration, one piezoelectric element 39 is composed of one individual electrode 34, a portion of the lower electrode 31 facing one pressure chamber 26, and a portion of the piezoelectric body 32 facing one pressure chamber 26. Has been done.

A wiring 35 is connected to the upper electrode 33 of each piezoelectric element 39. The wiring 35 is made of aluminum (Al), gold (Au), or the like. The wiring 35 extends outward in the scanning direction from the upper electrode 33. Specifically, as shown in FIG. 2, the wiring 35 connected to the upper electrode 33 arranged on the left side extends from the corresponding upper electrode 33 to the left side and is connected to the upper electrode 33 arranged on the right side. The wiring 35 extends to the right from the corresponding upper electrode 33.

As shown in FIGS. 2 to 4, a plurality of drive contacts 40 are arranged side by side in the transport direction at both left and right ends of the first flow path substrate 21. As shown in FIG. 2, the wiring 35 drawn to the left from the upper electrode 33 is connected to the drive contact 40 at the left end of the first flow path substrate 21, and the wiring 35 drawn to the right is the first. It is connected to the drive contact 40 at the right end of the flow path substrate 21. Further, ground contacts 41 that conduct with the lower electrode 31, which is a common electrode, are also arranged at both left and right ends of the first flow path substrate 21.

(COF)
As shown in FIG. 2, two COF50s, which are wiring members, are joined to the upper surface of the left end portion and the upper surface of the right end portion of the first flow path substrate 21, respectively. The details of the configuration of the COF50 will be described later, and only a brief outline will be given here. Each COF 50 includes a flexible substrate 51, two drive ICs 52 (52a, 52b) mounted on the flexible substrate 51, input terminals 60, 61, 62 connected to a control device 6 (see FIG. 1), and a piezoelectric actuator 24. It has output terminals 63 and 64 connected to the above, and various wirings 65 to 68.

The drive IC 52 generates a drive signal for driving the piezoelectric actuator 24 based on the control signal sent from the control device 6. This drive signal is supplied to the upper electrode 33 via the output wiring 66 and the wiring 35 of the piezoelectric actuator 24. The potential of the upper electrode 33 to which the drive signal is supplied changes between a predetermined drive potential and the ground potential. Further, the ground wire 68 of the COF 50 is electrically connected to the ground contact 41 of the piezoelectric actuator 24. As a result, the potential of the lower electrode 31 connected to the ground contact 41 is always maintained at the ground potential.

The operation of the piezoelectric element 39 when a drive signal is supplied from the drive IC 52 will be described. In the state where the drive signal is not supplied, the potential of the upper electrode 33 is the ground potential, which is the same potential as the lower electrode 31. From this state, when a drive signal is supplied to a certain upper electrode 33 and a drive potential is applied to the upper electrode 33, the potential difference between the upper electrode 33 and the lower electrode 31 causes the piezoelectric body 32 between the two electrodes to receive a drive signal. An electric field parallel to the thickness direction acts. At this time, the piezoelectric body 32 expands in the thickness direction and contracts in the surface direction due to the inverse piezoelectric effect, and the vibrating film 30 bends so as to be convex toward the pressure chamber 26. As a result, the volume of the pressure chamber 26 is reduced and a pressure wave is generated in the pressure chamber 26, so that ink droplets are ejected from the nozzle 20 communicating with the pressure chamber 26.

(Reservoir forming member)
As shown in FIG. 4, the reservoir forming member 25 is arranged on the opposite side (upper side) of the first flow path substrate 21 with the piezoelectric actuator 24 interposed therebetween, and with the first flow path substrate 21 via the piezoelectric actuator 24. It is joined. The reservoir forming member 25 may be, for example, a silicon substrate like the first flow path substrate 21 and the second flow path substrate 22, but may be a member formed of a metal material or a synthetic resin material. ..

A reservoir 43 extending in the arrangement direction of the pressure chambers 26 (perpendicular to the paper surface in FIG. 4) is formed in the upper half of the reservoir forming member 25. The reservoir 43 is connected to a cartridge holder 7 (see FIG. 1) on which the ink cartridge 17 is mounted by a tube (not shown).

As shown in FIG. 4, a plurality of ink supply flow paths 44 extending downward from the reservoir 52 are formed in the lower half of the reservoir forming member 25. Each ink supply flow path 44 communicates with a plurality of pressure chambers 26 of the first flow path substrate 21 via a plurality of communication holes 24a of the piezoelectric actuator 24. As a result, ink is supplied from the reservoir 52 to the plurality of pressure chambers 26 via the plurality of ink supply flow paths 44. A cover portion 45 is formed in the lower half portion of the reservoir forming member 25. A space for accommodating a plurality of piezoelectric elements 39 of the piezoelectric actuator 24 is formed in the inner space of the cover portion 45.

(Detailed configuration of COF)
Next, the detailed configuration of the COF 50 will be described. For convenience of the following description, the front surface (upper surface in FIG. 4) of the COF 50 in FIG. 2 is defined as the “front surface”, and the other surface (lower surface in FIG. 4) in FIG. 2 is defined as the “back surface”. Further, since the two COF50s have the same configuration, the COF50 located on the right side of FIG. 2 will be described below. FIG. 5 is a back view of the COF 50. FIG. 6 is an enlarged view of part B of FIG. FIG. 7 is a cross-sectional view taken along the line VII-VII of FIG. As shown in FIGS. 5 to 7, the COF 50 includes a flexible substrate 51, two drive ICs 52, terminals 60 to 64, and wirings 65 to 68.

The flexible substrate 51 is made of, for example, a synthetic resin such as polyimide. It is a film-like member, and its planar shape is rectangular. Hereinafter, various elements provided on the substrate 51 will be described using the expressions of the longitudinal direction and the lateral direction of the flexible substrate 51.

Two drive ICs 52 (first drive IC 52a and second drive IC 52b) are installed side by side in the longitudinal direction of the substrate 51 at the center of the flexible substrate 51 in the lateral direction of the substrate. The installation position of the drive IC 52 can also be expressed as follows. The back surface of the flexible substrate 51 has a first portion 51a in which the first drive IC 52a is arranged, a second portion 51b in which the second drive IC 52b is arranged, a first portion 51a, and a second portion 51b in the lateral direction of the substrate. It is divided into a third portion 51c located between. The first portion 51a and the third portion 51c are separated by a straight line L1 including the inner edge of the drive IC 52. Further, the second portion 51b and the third portion 51c are separated by a straight line L2 including the inner edge of the drive IC 52.

On the back surface of the flexible substrate 51, terminals 60 to 64 and wirings 65 to 68 connected to the two drive ICs 52 are formed. The terminals 60 to 64 and the wirings 65 to 68 are formed by partially removing a metal film such as copper formed on the entire back surface of the substrate 51 by etching, and the terminals 60. ~ 64 and wirings 65-68 are all made of the same material. Further, as described above, in FIG. 2, the number of the pressure chamber 26, the piezoelectric element 39, and the drive contact 40 is reduced in order to simplify the drawing, but in reality, they are arranged in a row in FIG. The drive contact 40 and the signal output terminal 63 in FIG. 5 have a one-to-one correspondence, and the numbers of both are equal.

Further, although not shown in FIGS. 5 and 6, as shown in FIG. 7, the back surface of the flexible substrate 51 is a protective film 70 formed of an insulating material except for the formation region of the terminals 60 to 64. It is covered with. That is, the wirings 65 to 68 are covered with the protective film 70, while the terminals 60 to 64 are exposed from the protective film 70.

As shown in FIG. 5, input terminals 60, 61, 62 arranged in the lateral direction of the substrate are formed at one end (right end in FIG. 6) of the flexible substrate 51 in the longitudinal direction. On the other hand, output terminals 63 and 64 arranged in the lateral direction of the substrate are formed at the other end of the flexible substrate 51 in the longitudinal direction (the left end in FIG. 6).

The right end portion of the flexible substrate 51 in FIG. 5 is connected to the control device 6 (see FIG. 1) of the printer 1. At the end of the substrate 51, as input terminals, a signal input terminal 60 to which a control signal from the control device 6 is input, a power input terminal 61 to which a drive potential for driving the piezoelectric element 39 is supplied, and A ground input terminal 62 to which a ground potential is applied is formed. In FIG. 6, three power input terminals 61 are arranged at the center in the lateral direction of the board, and two ground input terminals 62 are separately arranged on both ends. Further, two terminal groups 71a and 71b of the signal input terminal 60 are arranged between the central power input terminal 61 and the two ground input terminals 62 at both ends. The signal input terminal 60 constituting one terminal group 71a is connected to the first drive IC 52a by the input wiring 65. The signal input terminal 60 constituting the other terminal group 71b is connected to the second drive IC 52b by the input wiring 65.

The three power input terminals 61 are connected to the drive IC 52 by a power supply line 67 arranged in the third portion 51c of the substrate 51. The power supply line 67 has three wiring portions 67a and a connection portion 67b. The three wiring portions 67a extend from the three power input terminals 61 in the lateral direction of the board and are arranged at intervals in the longitudinal direction of the board. The connection portion 67b extends in the longitudinal direction of the substrate between the two drive ICs 52 and is connected to the two drive ICs 52, respectively. Three wiring portions 67a are connected by the connection portion 67b. Further, the connection portion 67b extends continuously from the first portion 51a of the substrate 51 on which the first drive IC 52a is arranged to the second portion 51b of the substrate 51 on which the second drive IC 52b is arranged without interruption. .. Both ends of the connecting portion 67b are connected to two drive ICs 52.

In other words, the connecting portion 67b straddles the third portion 51c of the flexible substrate 51 from the first driving IC 52a to the second driving IC 52b along the direction intersecting the intermediate line Lc of the two driving ICs 52. Extends to. The "intermediate line Lc of the two drive ICs 52" is a line connecting points equidistant from the two drive ICs 52. Further, as shown in FIG. 7, the wiring portion 67a and the connection portion 67b constituting the power supply line 67 are thicker than the input wiring 65 and the output wiring 66.

The two ground input terminals 62 are connected to the two drive ICs 52 by two ground wires 68 arranged outside the two drive ICs 52.

The left end portion of the flexible substrate 51 in FIG. 6 is joined to the upper surface of the end portion of the first flow path substrate 21 of FIG. A plurality of signal output terminals 63 and two ground output terminals 64 are formed at the end of the substrate 51. In FIG. 6, two ground output terminals 64 are arranged on both ends in the lateral direction of the board. Further, two terminal groups 72a and 72b of the signal output terminal 63 are arranged between the two ground output terminals 64.

The two ground output terminals 64 are connected to the two drive ICs 52 by the two ground wires 68 described above. That is, the ground wire 68 not only has a role of supplying the ground potential to the drive IC 52, but also has a role of supplying the ground potential to the ground output terminal 64. Further, the signal output terminal 63 constituting one of the terminal groups 72a is connected to the first drive IC 52a by the output wiring 66. Similarly, the signal output terminal 63 constituting the other terminal group 72b is connected to the second drive IC 52b by the output wiring 66. The plurality of output wirings 66 are arranged so as to spread in a fan shape from the drive IC 52 toward the plurality of signal output terminals 63.

When the end of the flexible substrate 51 is joined to the first flow path substrate 51, the two ground output terminals 64 are connected to the two ground contacts 41 of FIG. 2, respectively. Further, the signal output terminal 63 of the terminal group 72a is connected to the drive contact 40 on the front side of FIG. 2, and the signal output terminal 63 of the terminal group 72b is connected to the drive contact 40 on the rear side of FIG. That is, the first drive IC 52a outputs a drive signal to the group of the piezoelectric elements 39 located on the front side of FIG. 2 via the terminal group 72a. Further, the second drive IC 52b outputs a drive signal to the group of the piezoelectric elements 39 located on the rear side of FIG. 2 via the terminal group 72b.

As shown in FIG. 5, in each of the two drive ICs 52, a sealing material 73 made of a curable resin is arranged on the outer circumference of the drive IC 52 over the entire circumference thereof. The sealing material 73 is generally called underfill, and is provided to seal the gap between the joint portion between the drive IC 52 and the flexible substrate 51 for the purpose of preventing the ingress of moisture. Further, as shown in FIGS. 6 and 7, the sealing material 73 is arranged not only around the two drive ICs 52 but also on the third portion 51c of the flexible substrate 51. The portion of the sealing material 73 arranged in the third portion 51c extends in the lateral direction of the substrate, which is the alignment direction of the two drive ICs 52, and is connected to the sealing portions of the two drive ICs 52. As shown in FIG. 7, the protective film 70 is arranged on the sealing material 73 that crosses over the wiring portion 67a. Further, in FIG. 5, if the sealing material 73 is injected in the direction of the arrow, the sealing material 73 can be arranged around the two drive ICs 52 and on the third portion 51c in a one-stroke manner. ..

By the way, since the flexible substrate 51 of the COF 50 is easily bent by itself, care must be taken in handling even under normal circumstances. Further, in the present embodiment, the flexible substrate 51 is mounted with two drive ICs 52. It has become. In this configuration, when handling the COF50, the substrate 51 is likely to bend in the third portion 51c, particularly between the first portion 51a in which the first drive IC 52a is installed and the second portion 51b in which the second drive IC 52b is installed. Become.

When joining to the head unit 16, the flexible substrate 51 is sucked and held by a suction device (not shown) for transportation and positioning. At that time, if the flexible substrate 51 is bent at the third portion 51c, the substrate 51 fails to be attracted, or the substrate 51 is bent, which makes it difficult to align the flexible substrate 51 at the time of joining. As a result, the manufacturing yield of the head unit 16 is reduced.

In this respect, in the present embodiment, the power supply line 67 is arranged in the third portion 51c of the flexible substrate 51. The power supply line 67 is a wiring different from the input wiring 65 and the output wiring 66 for signal transmission, and by being arranged in the third portion 51c, the third portion 51c located between the two drive ICs 52 is provided. It becomes the conductive portion 75 to be reinforced. Since the conductive portion 75 increases the rigidity of the third portion 51c, the flexible substrate 51 is less likely to bend in the third portion 51c when the COF 50 is handled.

In the present embodiment, the conductive portion 75 for reinforcing the substrate, which is arranged in the third portion 51c of the flexible substrate 51, is a power supply line 67 that supplies a power supply voltage to the drive IC 52. That is, by arranging the power supply line 67, which is indispensable for operating the drive IC 52, in the third portion 51c, the substrate 51 is also reinforced. Further, the power supply line 67 serving as the conductive portion 75 is a wiring formed of the same material as the other wiring of the COF 50, such as the input wiring 65 and the output wiring 66. That is, the conductive portion 75 for reinforcing the substrate can be formed at the same time in the same etching process as other wiring.

Further, the connection portion 67b of the power supply line 67 straddles the third portion 51c of the flexible substrate 51 from the first drive IC 52a to the second drive IC 52b along the direction intersecting the intermediate line Lc of the two drive ICs 52. It is extending. Further, the connecting portion 67b extends continuously from the first portion 51a to the second portion 51b without interruption. In this configuration, the reinforcing effect of the power supply line 67 is enhanced, and the third portion 51c is less likely to bend.

From the viewpoint of reinforcing the substrate 51, it is preferable that the power supply line 67 arranged in the third portion 51c is thick. However, if the power supply line 67 is too thick, the wiring width and pitch will be significantly different between the formation region of the power supply line 67 and the formation region of the adjacent wiring.

Further, as described above, in the present embodiment, a metal layer is formed on the back surface of the flexible substrate 51, and various wirings are simultaneously formed by etching the metal layer. At that time, when a fairly thick power supply line 67 is formed near the formation area of the input wiring 65 and the output wiring 66, which requires high-definition etching, the high-definition wiring formation area and the thick wiring There is a large difference in the flow velocity of the etching solution from the formed region. As a result, the etching accuracy is lowered in a part of the input wiring 65 and the output wiring 66 that is close to the power supply line 67. In this respect, in the present embodiment, the power supply line 67 is divided into a plurality of wiring portions 67a instead of one thick wiring between the two drive ICs 52. That is, since the difference in wiring width and wiring pitch between the formation region of the input wiring 65 and the output wiring 66 and the formation region of the power supply line 67 becomes small, the etching accuracy in the formation of the input wiring 65 and the output wiring 66 Can be prevented from decreasing.

In the present embodiment, the sealing material 73 that seals the joint portion between the drive IC 52 and the flexible substrate 51 is also arranged in the third portion 51c. That is, the sealing material 73 also reinforces the third portion 51c, further increasing the rigidity of the third portion 51c.

In the embodiment described above, the inkjet head 4 corresponds to the "liquid ejection device" of the present invention. The piezoelectric element 39 and the drive contact 40 connected to the first drive IC 52a correspond to the "first drive element" and the "first contact" of the present invention. The piezoelectric element 39 and the drive contact 40 connected to the second drive IC 52b correspond to the "second drive element" and the "second contact" of the present invention.

The COF 50 corresponds to the "wiring member" of the present invention. The output wiring 66 connected to the first drive IC 52a corresponds to the "first wiring" of the present invention, and the output wiring 66 connected to the second drive IC 52b corresponds to the "second wiring" of the present invention. The power input terminal 61 corresponds to the "first constant potential terminal" of the present invention, and the power supply line 67 corresponds to the "first constant potential wiring" of the present invention.

Next, a modified embodiment in which various modifications are made to the embodiment will be described. However, those having the same configuration as that of the above-described embodiment are designated by the same reference numerals and the description thereof will be omitted as appropriate.

1] In the above embodiment, the power supply line 67 is arranged in the third portion 51c of the flexible substrate 51, but the ground wire 68 is arranged in the third portion 51c to provide a conductive portion that reinforces the third portion 51c. It may be configured. In the COF 50A of FIG. 8, three ground input terminals 80 are arranged between the two terminal groups 71a and 71b of the signal input terminal 60. Three wiring portions 81a of the ground wire 80 are connected to the three ground input terminals 80, respectively. The three wiring portions 81a are connected to the connection portions 82b arranged so as to straddle the two drive ICs 52. In this embodiment, the two power input terminals 82 are arranged outside the terminal groups 71a and 71b of the signal input terminal 60, and the two power supply lines 83 are the first portion 51a and the second portion of the board 51. They are arranged in 51b, respectively.

2] The widths of the plurality of wiring portions constituting the conductive portion may be different. For example, in the COF 50B of FIG. 9, the width of the five wiring portions 84a of the power supply line 84 becomes narrower as it approaches the input wiring 65. In this configuration, since the difference in wiring width between the input wiring 65 and the wiring portion 84a adjacent thereto becomes small, it is possible to suppress a decrease in the etching accuracy of the input wiring 65.

3] The number of wirings constituting the conductive portion for reinforcing the substrate is not particularly limited. For example, as shown in COF50C of FIG. 10, the number of power supply lines 85 serving as a conductive portion may be one. In this case, in order to enhance the reinforcing effect of the third portion 51c, it is preferable that one power supply line 85 is thicker than the other wirings. In FIG. 10, the power supply line 85 is thicker than the ground wire 68, the input wiring 65, and the output wiring 66 arranged on the first portion 51a and the second portion 51b of the substrate 51. In the embodiment of FIG. 10, the ground input terminal 62 corresponds to the “second constant potential terminal” of the present invention, and the ground wire 68 corresponds to the “second constant potential wiring” of the present invention.

4] The conductive portion may intersect the intermediate line Lc of the two drive ICs 52 at an angle in the third portion 51c of the flexible substrate 51. For example, in the COF50D shown in FIG. 11, the wiring portion 86a of the power supply line 86 as a part of the conductive portion extends in a zigzag manner while intersecting with the intermediate line Lc of the two drive ICs 52.

5] It is not always necessary that the conductive portion for reinforcing the substrate arranged in the third portion 51c is connected to both of the two drive ICs 52. For example, in the COF50E of FIG. 12, two independent wiring portions 87a and 87b may be connected to the two drive ICs 52a and 52b, respectively. Alternatively, only the wiring portion 87a (87b) connected to one of the two drive ICs 52 may be arranged in the third portion 51c.

6] Both the power supply line and the ground line may be arranged as the conductive portion on the third portion 51c of the flexible substrate 51. For example, in the COF50Fa of FIG. 13A, the power supply line 88 connected to the first drive IC 52a and the ground line 89 connected to the second drive IC 52b are connected to the third portion 51c of the flexible substrate 51 in the third portion 51c. It is arranged in the portion 51c. Further, in the COF50Fb of FIG. 13B, the power supply line 90 connected to both of the two drive ICs 52 and the two ground lines 91a and 91b connected to the two drive ICs 52 are connected to the third portion 51c, respectively. Have been placed.

7] Circuit components may be arranged on the third portion 51c of the flexible substrate 51. For example, in COF50Ga and 50Gb of FIG. 14, a circuit component 92 (for example, a capacitor) is arranged so as to straddle between the power supply line 90 and the ground lines 91a and 91b. By arranging the circuit component 92 in the third portion 51c, the bending of the third portion 51c is further suppressed.

When the circuit component 92 has a long shape in one direction, the circuit component is parallel to the direction in which the two drive ICs 52 are lined up and the longitudinal direction of the circuit component 92, as in COF50Ga in FIG. 14 (a). 92 may be arranged. In this case, the effect of suppressing the bending of the substrate 51 between the two drive ICs 52 by the circuit component 92 is improved. Alternatively, as in COF50Gb of FIG. 14B, the circuit component 92 may be arranged so that the direction in which the two drive ICs 52 are lined up and the lateral direction of the circuit component 92 are parallel to each other. In this case, as compared with (a), the effect of suppressing bending of the substrate 51 between the two drive ICs 52 is lower, but an excessively large force is less likely to be applied to the circuit component 92, and the circuit component 92 is less likely to be damaged. Become.

8] The conductive portion may be a so-called dummy conductive pattern in which neither of the two drive ICs 52 is connected. For example, in the COF 50H of FIG. 15, a conductive portion 93 formed in a grid pattern is arranged on the third portion 51c of the flexible substrate 51. The conductive portion 93 is a dummy pattern that is not connected to the two drive ICs 52 and is also separated from the other wirings and terminals of the flexible substrate 51. As shown in FIG. 15, the conductive portion 93 is only a portion of the third portion 51c between the two drive ICs 52 and a portion on the signal input side of the drive IC 52 (the right portion in FIG. 15). Instead, it may be arranged in a portion on the signal output side (left portion in FIG. 15) of the two drive ICs 52.

Further, the dummy conductive portion is not limited to the continuously connected pattern as shown in FIG. That is, in the third portion 51c of the flexible substrate 51, a plurality of dummy conductive portions may be discretely arranged in an independent island shape.

9] As shown in COF50I of FIG. 16, a plurality of input terminals including a signal input terminal 60, a power input terminal 61, and a ground input terminal 62 are located on the center side of the two drive ICs 52 in a direction in which the two drive ICs 52 are lined up. It may be arranged close to. More specifically, since the input wiring 65 extends at an angle with respect to the short side direction of the board, the plurality of signal input terminals 61 are located on the center side as compared with the case where the input wiring 65 is parallel to the short side direction of the board. I'm close. As a result, in FIG. 16, not only the power supply line 94 but also a part of the signal input terminal 60 and the input wiring 65 are arranged on the third portion 51c of the flexible substrate 51. In this configuration, the effect of suppressing the bending of the third portion 51c is enhanced.

10] As shown in COF50J of FIG. 17, a plurality of output wirings 66 may extend in a direction parallel to the lateral direction of the flexible substrate 51, that is, in a direction orthogonal to the alignment direction of the two drive ICs 52. In this case, since the output wiring 66 is not arranged in the third portion, the third portion 51c is more easily bent as compared with FIG. 5 of the embodiment. Therefore, in the case of such a configuration, it is particularly preferable that the reinforcing conductive portion such as the power supply line 67 is arranged in the third portion 51c.

11] In the above embodiment, the flexible substrate 51 is provided with two drive ICs 52, but three or more drive ICs 52 may be arranged side by side.

12] In the above embodiment, the piezoelectric element is driven by the drive signal input from the COF 50, but the drive target to which the drive signal is sent is not limited to the piezoelectric element. For example, it may be a heating element element that generates heat when a drive signal is input to give energy to the ink.

The embodiment described above is an application of the present invention to an inkjet head that ejects ink onto recording paper to print an image or the like, but is a liquid ejection device used for various purposes other than printing an image or the like. The present invention can also be applied in the above. For example, the present invention can be applied to a liquid discharge device that discharges a conductive liquid onto a substrate to form a conductive pattern on the surface of the substrate.

Next, disclosed inventions other than the inventions according to claims 1 to 16 described in the claims at the time of filing will be described.
According to the present invention, a first drive element and a second drive element arranged in a predetermined direction are connected to the first drive element, and the first drive element is arranged outside the first drive element in the predetermined direction. A head unit including a contact and a second contact connected to the second driving element and arranged outside the second driving element in the predetermined direction.
It is provided with a first portion connected to the first contact, a second portion connected to the second contact, and a wiring member having a connecting portion connecting the first portion and the second portion. It is an invention relating to a liquid discharge device as a feature.

Embodiments of the disclosed invention will be described with reference to FIGS. 18-20. FIG. 18 is a plan view of the head unit. FIG. 19 is a back view of the COF. FIG. 20 is an enlarged view of part D of FIG. The configurations of the flow path substrate, the piezoelectric element, and the like are almost the same as those in FIGS. 2 to 4 described above. Therefore, in the following description, the same components as those in FIGS. 2 to 4 are designated by the same reference numerals, and the description thereof will be omitted as appropriate.

As shown in FIGS. 18 and 19, the COF 150 of the present embodiment has a flexible substrate 151 and four drive ICs 152 mounted on the flexible substrate 151. The flexible substrate 151 has a first portion 151a, a second portion 151b, and a connecting portion 151c that connects the first portion 151a and the second portion 151b.

The first portion 151a is a portion joined to the drive contact 40 arranged at the left end portion of the head unit 116 of FIG. Two drive ICs 152 arranged in the first direction of FIG. 19 are arranged in the first portion 151a. Further, a signal input terminal 160, a power input terminal 161 and a ground input terminal 162 are arranged at the outer end of the first portion 151a in the second direction. On the other hand, the signal output terminal 163 is arranged at the inner end of the first portion 151a in the second direction. Further, an input wiring 165, an output wiring 166, and a power supply line 167 are also arranged in the first portion 151a.

The second portion 151b is a portion joined to the drive contact 40 arranged at the right end portion of the head unit 116 of FIG. Similarly to the first portion 151a described above, two drive ICs 152 arranged in the first direction are also arranged in the second portion 151b. Further, a signal input terminal 160, a power input terminal 161 and a ground input terminal 162 are arranged at the outer end of the second portion 151b in the second direction. On the other hand, a signal output terminal 163 is arranged at the inner end of the second portion 151b in the second direction. Further, an input wiring 165, an output wiring 166, and a power supply line 167 are also arranged in the second portion 151b.

An opening 151d is formed between the first portion 151a and the second portion 151b of the COF 150. The first portion 151a and the second portion 151b are connected by two elongated connecting portions 151c arranged on both sides in the first direction with respect to the opening 151d. Further, from the outer end of the first portion 151a in the second direction, through the connecting portion 151c, and over the outer end of the second portion 151b in the second direction, the ground input terminal 162 and the second portion 151b of the first portion 151a A ground wire 168 is formed so as to connect to the ground input terminal 162. Further, notches 151e extending in the second direction are formed at the four corners of the opening 151d, respectively.

In the configuration in which the plurality of drive contacts 40 of the piezoelectric actuator 24 are arranged separately on the left and right, in FIG. 2 described above, two COFs 50 are separately joined to the group of the left and right drive contacts 40. There is. In this configuration, the COF50 joining step including the heating / pressing step is performed twice separately, and it is preferable to consider that the piezoelectric actuator 24 is easily damaged, especially when the thickness of the piezoelectric actuator 24 is very thin. No. In this respect, in this embodiment, the first portion 151a and the second portion 151b, which are joined to the groups of the left and right drive contacts 40, are connected by two connecting portions 151c. Therefore, it is possible to join the first portion 151a and the second portion 151b of the COF 150 at the same time by one joining step.

However, if the first portion 151a and the second portion 151b are connected, the joint portion between the COF 150 and the drive contact 40 of the piezoelectric actuator 24 when a tensile force is applied to the COF 150 during assembly of the head unit 116. The COF150 is easily peeled off due to the force applied to it. In this respect, in the present embodiment, the notch 151e is formed at the four corners of the opening 151d of the COF 150, that is, at the connection positions between the first portion 151a and the second portion 151b and the connecting portion 151c. In this configuration, even if an external force acts on the COF 150, the force is less likely to be applied to the joint portion of the piezoelectric actuator 24 with the drive contact 40.

However, if the first portion 151a and the second portion 151b are connected by an elongated connecting portion 151c and a notch portion 151e is formed at a corner of the opening 151d, the flexible substrate 150 is bent at the connecting portion 151c. Cheap. Therefore, in order to suppress the bending of the substrate 150, it is preferable that the connecting portion 151c is devised to increase the rigidity. In this respect, in this embodiment, the ground wire 168, which is a wiring different from the input wiring 165 and the output wiring 166, is arranged in the connecting portion 151c. That is, the ground wire 168 functions as a conductive portion that reinforces the connecting portion 151c. Since the ground wire 168 is arranged at the connecting portion 151c, the rigidity of the connecting portion 151c is increased and it becomes difficult to bend.

In order to enhance the reinforcing effect, the ground wire 168 is preferably thicker than the input wiring 165 and the output wiring 166. However, if the thickness and pitch of the wiring differ greatly between the ground wire 168 and the output wiring 166 adjacent thereto, the etching situation may occur between the formation region of the ground wire 168 and the formation region of the output wiring 166. A difference occurs, and the etching accuracy of a part of the output wiring 166 adjacent to the ground wire 168 is lowered. Therefore, as shown in FIG. 20, it is preferable that the ground wire 168 arranged in the connecting portion 151c is divided into a plurality of wiring portions 168a. Further, it is preferable that the plurality of wiring portions 168a are arranged on the output wiring 166 side, the wiring width is smaller, or the wiring pitch is finer.

As a prior art document related to the above-mentioned disclosed invention, there is Japanese Patent Application Laid-Open No. 2007-175882. The liquid discharge head of this document includes a plurality of piezoelectric elements provided on a flow path substrate having a plurality of pressure chambers, and a wiring member connected to the contacts of the plurality of piezoelectric elements. The plurality of piezoelectric elements constitute two rows of piezoelectric elements. A plurality of contacts drawn from the plurality of piezoelectric elements are arranged between the two piezoelectric element rows to form two contact rows.

The wiring member is provided with two drive ICs corresponding to the two contact rows. Further, an opening is formed between the two drive ICs of the wiring member, and a notch is also formed at the end position of the opening. Due to the presence of this notch, the two portions located between the opening and the two drive ICs can be bent inward. Connection terminals are provided in each of the above two portions, and are joined to the flow path substrate in a state of being bent inward.

However, in the configuration disclosed in the above document, a plurality of contacts drawn from the plurality of piezoelectric elements are gathered and arranged in a region between the two piezoelectric elements of the flow path substrate. Therefore, in order to join the two portions of the wiring member to the flow path substrate while bending each of them, it is necessary to increase the region width between the two piezoelectric element rows to a certain level or more. As a result, it is necessary to increase the distance between the two pressure chamber rows corresponding to the two piezoelectric element rows, and the distance between the two adjacent nozzle rows increases accordingly.

In this respect, in this embodiment, the drive contacts of the two piezoelectric element trains are drawn out from the piezoelectric element 39 on both the left and right sides, respectively. That is, the first portion 151a and the second portion 151b of the COF 150 are joined to the regions outside the two piezoelectric element trains, respectively. Therefore, it is not necessary to increase the distance between the two pressure chamber rows corresponding to the two piezoelectric element rows, and the distance between the two adjacent nozzle rows can be reduced.

4 Inkjet head 16 Head unit 39 Piezoelectric element 40 Drive contact 41 Ground contact 50 COF
51 Flexible board 51a 1st part 51b 2nd part 51c 3rd part 61 Power input terminal 62 Ground input terminal 66 Output wiring 67 Power line 67a Wiring part 67b Connection part 68 Ground wire 73 Encapsulant 75 Conductive part 80 Ground wire 80 ground Input terminal 84 Power supply line 84a Wiring unit 85 Power supply line 86 Power supply line 86a Wiring unit 87a, 87b Wiring unit 88 Power supply line 89 Ground line 90 Power supply line 91a, 91b Ground line 92 Circuit parts 93 Conductive unit 94 Power supply line 52a First drive IC
52b 2nd drive IC

Claims (12)

A head unit having a first drive element and a second drive element, a first contact connected to the first drive element, and a second contact connected to the second drive element.
The flexible substrate, the first drive IC provided on the flexible substrate, the second drive IC provided on the flexible substrate, and the first drive IC formed on the flexible substrate and the first contact are connected to each other. The first wiring, the second wiring formed on the flexible substrate and connecting the second drive IC and the second contact, the first constant potential terminal to which a constant potential is applied, the first constant potential terminal, and the above. A wiring member having a first constant potential wiring for connecting the first drive IC and at least one of the second drive ICs is provided.
The first constant potential wiring, which is different from the first wiring and the second wiring, is arranged between the first drive IC and the second drive IC on the flexible substrate.
The liquid discharge device is characterized in that the first constant potential terminal is a terminal to which a drive potential for driving the first drive element and the second drive element is supplied. A head unit having a first drive element and a second drive element, a first contact connected to the first drive element, and a second contact connected to the second drive element.
The flexible substrate, the first drive IC provided on the flexible substrate, the second drive IC provided on the flexible substrate, and the first drive IC formed on the flexible substrate and the first contact are connected to each other. The first wiring, the second wiring formed on the flexible substrate and connecting the second drive IC and the second contact, the first constant potential terminal to which a constant potential is applied, the first constant potential terminal, and the above. A wiring member having a first constant potential wiring for connecting the first drive IC and at least one of the second drive ICs is provided.
The first constant potential wiring, which is different from the first wiring and the second wiring, is arranged between the first drive IC and the second drive IC on the flexible substrate.
The liquid characterized in that the first constant potential wiring is connected to both the first drive IC and the second drive IC, and is formed so as to straddle the first drive IC to the second drive IC. Discharge device. The liquid discharge device according to claim 1 or 2, wherein the first wiring, the second wiring, and the first constant potential wiring are made of the same material. The liquid discharge device according to any one of claims 1 to 3, wherein the first constant potential terminal is a terminal to which a ground potential is supplied. A head unit having a first drive element and a second drive element, a first contact connected to the first drive element, and a second contact connected to the second drive element.
The flexible substrate, the first drive IC provided on the flexible substrate, the second drive IC provided on the flexible substrate, and the first drive IC formed on the flexible substrate and the first contact are connected to each other. The first wiring, the second wiring formed on the flexible substrate and connecting the second drive IC and the second contact, the first constant potential terminal to which a constant potential is applied, the first constant potential terminal, and the above. The first constant potential wiring that connects the first drive IC and at least one of the second drive ICs, the second constant potential terminal to which a constant potential is applied, the second constant potential terminal, and the first drive IC. A wiring member having a second constant potential wiring for connecting to at least one of the second drive ICs is provided.
The first constant potential wiring, which is different from the first wiring and the second wiring, is arranged between the first drive IC and the second drive IC on the flexible substrate.
A liquid discharge device characterized in that the first constant potential wiring between the first drive IC and the second drive IC is thicker than the second constant potential wiring. Claims 1 to 1, wherein, between the first drive IC and the second drive IC, the first constant potential wiring extends in a direction intersecting an intermediate line between the two drive ICs. 5. The liquid discharge device according to any one of 5. A head unit having a first drive element and a second drive element, a first contact connected to the first drive element, and a second contact connected to the second drive element.
The flexible substrate, the first drive IC provided on the flexible substrate, the second drive IC provided on the flexible substrate, and the first drive IC formed on the flexible substrate and the first contact are connected to each other. The first wiring, the second wiring formed on the flexible substrate and connecting the second drive IC and the second contact, the first constant potential terminal to which a constant potential is applied, the first constant potential terminal, and the above. A wiring member having a first constant potential wiring for connecting the first drive IC and at least one of the second drive ICs is provided.
The first constant potential wiring, which is different from the first wiring and the second wiring, is arranged between the first drive IC and the second drive IC on the flexible substrate.
Between the first drive IC and the second drive IC, the first constant potential wiring is characterized by having a plurality of wiring portions arranged at intervals in the arrangement direction of the two drive ICs. Liquid discharge device. A head unit having a first drive element and a second drive element, a first contact connected to the first drive element, and a second contact connected to the second drive element.
The flexible substrate, the first drive IC provided on the flexible substrate, the second drive IC provided on the flexible substrate, and the first drive IC formed on the flexible substrate and the first contact are connected to each other. A wiring member having a first wiring and a second wiring formed on the flexible substrate and connecting the second drive IC and the second contact is provided.
A conductive portion different from the first wiring and the second wiring is arranged between the first drive IC and the second drive IC of the flexible substrate.
A liquid discharge device characterized in that the conductive portion is not connected to either of the two drive ICs. A head unit having a first drive element and a second drive element, a first contact connected to the first drive element, and a second contact connected to the second drive element.
The flexible substrate, the first drive IC provided on the flexible substrate, the second drive IC provided on the flexible substrate, and the first drive IC formed on the flexible substrate and the first contact are connected to each other. A wiring member having a first wiring and a second wiring formed on the flexible substrate and connecting the second drive IC and the second contact is provided.
A conductive portion different from the first wiring and the second wiring is arranged between the first drive IC and the second drive IC of the flexible substrate.
The joint portion of the drive IC with the flexible substrate is sealed with a sealing material.
A liquid discharge device, wherein the sealing material is also arranged between the first drive IC and the second drive IC. A head unit having a first drive element and a second drive element, a first contact connected to the first drive element, and a second contact connected to the second drive element.
The flexible substrate, the first drive IC provided on the flexible substrate, the second drive IC provided on the flexible substrate, and the first drive IC formed on the flexible substrate and the first contact are connected to each other. A wiring member having a first wiring and a second wiring formed on the flexible substrate and connecting the second drive IC and the second contact is provided.
A conductive portion different from the first wiring and the second wiring is arranged between the first drive IC and the second drive IC of the flexible substrate.
A liquid discharge device characterized in that a circuit component is arranged between the first drive IC and the second drive IC. A head unit having a first drive element and a second drive element, a first contact connected to the first drive element, and a second contact connected to the second drive element.
The flexible substrate, the first drive IC provided on the flexible substrate, the second drive IC provided on the flexible substrate, and the first drive IC formed on the flexible substrate and the first contact are connected to each other. The first wiring, the second wiring formed on the flexible board and connecting the second drive IC and the second contact, and a plurality of input terminals provided on the flexible board and arranged in the arrangement direction of the two drive ICs. Equipped with wiring members
A conductive portion different from the first wiring and the second wiring is arranged between the first drive IC and the second drive IC of the flexible substrate.
A liquid discharge device characterized in that the plurality of input terminals are arranged closer to the center side of the two drive ICs in the arrangement direction of the two drive ICs. A wiring member connected to a head unit having a first contact and a second contact.
Flexible board and
A first drive IC provided on the flexible substrate and a second drive IC provided on the flexible substrate.
A first wiring formed on the flexible substrate and connecting the first drive IC and the first contact,
A second wiring formed on the flexible substrate and connecting the second drive IC and the second contact,
It has a plurality of input terminals provided on the flexible substrate and arranged in the arrangement direction of the two drive ICs.
A conductive portion different from the first wiring and the second wiring is arranged between the first drive IC and the second drive IC of the flexible substrate.
A wiring member characterized in that the plurality of input terminals are arranged closer to the center side of the two drive ICs in the arrangement direction of the two drive ICs.

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