JP6959536B2 - Light emitting device - Google Patents

Description

The present disclosure relates to a light emitting device.

A light emitting device in which a phosphor plate is fixed on a light emitting element with an adhesive has been proposed. The area on the lower surface side of this phosphor plate is smaller than the area of the main light emitting surface of the light emitting element, and the outer peripheral end surface of the phosphor plate is inclined. (See, for example, Patent Document 1)

JP 2015-079805

In the light emitting device disclosed in Patent Document 1, the lower surface of the phosphor plate is smaller than the upper surface of the light emitting element. Further, the side surface of the phosphor plate is inclined. When such a phosphor plate is used, color unevenness is likely to occur.

The light emitting device according to the embodiment of the present disclosure is a light emitting element having a main light emitting surface and a wavelength conversion member arranged on the main light emitting surface of the light emitting element, and is a first lower surface facing the main light emitting surface of the light emitting element. An upper surface that is opposite to the first lower surface and has a larger area than the first lower surface, a first side surface that is continuous with the first lower surface, and a second side surface that is continuous with the upper surface and is located outside the first side surface. , A wavelength conversion member having a second lower surface continuous with the first side surface and the second side surface, a main light emitting surface of the light emitting element, at least a part of the side surface of the light emitting element, a first side surface of the wavelength conversion member, and a second lower surface. A light guide member that covers at least a part thereof, a part of the light emitting element, a second side surface of the wavelength conversion member, and a reflection member that covers the light guide member are provided, and the light guide member includes a first light guide member. The first light guide member includes a second light guide member in contact with the first light guide member, the first light guide member covers the first side surface of the wavelength conversion member and the second lower surface of the wavelength conversion member, and the second light guide member is a light emitting element. A light emitting device that covers the main light emitting surface and the side surface of the light emitting element.

From the above, it is possible to obtain a light emitting device having less color unevenness.

It is a schematic top view which shows an example of the light emitting device which concerns on Embodiment 1. FIG. It is sectional drawing in the IB-IB line of FIG. 1A. It is a partially enlarged view of FIG. 1B. It is a partially enlarged view of FIG. 1B. It is a schematic plan view which shows the manufacturing method of the light emitting device which concerns on Embodiment 1. FIG. FIG. 2 is a schematic cross-sectional view taken along the line IIB-IIB of FIG. 2A. It is a schematic plan view which shows the manufacturing method of the light emitting device which concerns on Embodiment 1. FIG. FIG. 3A is a schematic cross-sectional view taken along the line IIIB-IIIB of FIG. 3A. It is a schematic plan view which shows the manufacturing method of the light emitting device which concerns on Embodiment 1. FIG. FIG. 6 is a schematic cross-sectional view taken along the line IVB-IVB of FIG. 4A. It is a schematic plan view which shows the manufacturing method of the light emitting device which concerns on Embodiment 1. FIG. It is a schematic cross-sectional view in the VB-VB line of FIG. 5A. It is a schematic plan view which shows the manufacturing method of the light emitting device which concerns on Embodiment 1. FIG. 6 is a schematic cross-sectional view taken along the line VIB-VIB of FIG. 6A. It is a schematic plan view which shows the manufacturing method of the light emitting device which concerns on Embodiment 1. FIG. FIG. 6 is a schematic cross-sectional view taken along the line VIIB-VIIB of FIG. 7A. It is a schematic plan view which shows the manufacturing method of the light emitting device which concerns on Embodiment 1. FIG. FIG. 5 is a schematic cross-sectional view taken along the line VIIIB-VIIIB of FIG. 10A. It is a schematic plan view which shows the manufacturing method of the light emitting device which concerns on Embodiment 1. FIG. 11A is a schematic cross-sectional view taken along the line IXB-IXB of FIG. 11A. It is sectional drawing which shows an example of a light emitting device. It is a partially enlarged view of FIG. 10A. It is schematic cross-sectional view which shows the manufacturing method of the light emitting device which concerns on Embodiment 2. FIG. It is schematic cross-sectional view which shows the manufacturing method of the light emitting device which concerns on Embodiment 2. FIG. It is schematic cross-sectional view which shows the manufacturing method of the light emitting device which concerns on Embodiment 2. FIG. It is schematic cross-sectional view which shows the manufacturing method of the light emitting device which concerns on Embodiment 2. FIG. It is sectional drawing which shows the modification of the light emitting device which concerns on Embodiment 2. FIG. It is schematic cross-sectional view which shows the manufacturing method of the modification of the light emitting device which concerns on Embodiment 2. It is schematic cross-sectional view which shows the manufacturing method of the modification of the light emitting device which concerns on Embodiment 2. It is schematic cross-sectional view which shows the manufacturing method of the modification of the light emitting device which concerns on Embodiment 2.

Hereinafter, a light emitting device as an example of the embodiment according to the present invention will be described with reference to the drawings. Since the drawings referred to in the following description schematically show the present invention, there are cases where the scale, spacing, positional relationship, etc. of each member are exaggerated, or some of the members are not shown. be. Further, in the following description, members having the same or the same quality are shown in principle for the same name and reference numeral, and detailed description thereof will be omitted as appropriate.

Further, the resin members such as the wavelength conversion member and the reflection member will be described using the same names regardless of before and after molding, solidification, curing, and individualization. That is, the same name applies to a member whose state changes depending on the stage of the process, such as when it is liquid before molding, becomes solid after molding, and further divides the solid after molding into a solid of small pieces whose shape has been changed. It will be explained in.

<Embodiment 1>
FIG. 1A is a schematic top view showing an example of the light emitting device 100 according to the embodiment of the present disclosure. FIG. 1B is a schematic cross-sectional view taken along the line IB-IB of FIG. 1A. 1C and 1D are partially enlarged cross-sectional views of a part of FIG. 1B.

(Light emitting device)
The light emitting device 100 includes a light emitting element 10 and a wavelength conversion member 20 arranged on the main light emitting surface 10a of the light emitting element 10. Further, a light guide member 30 is provided between the light emitting element 10 and the wavelength conversion member 20. The light guide member 30 is in contact with the main light emitting surface 10a of the light emitting element 10, the side surface 10b of the light emitting element 10, and the lower surface of the wavelength conversion member 20. Further, a reflection member 40 that covers the side surface of the light emitting element 10, the side surface of the wavelength conversion member 20, and the side surface of the light guide member 30 is provided.

The wavelength conversion member 20 includes an upper surface 20a, a lower surface, and a side surface. Specifically, the wavelength conversion member 20 includes one upper surface, two lower surfaces, and two side surfaces in cross-sectional view.

The lower surface of the wavelength conversion member 20 is arranged in the center in a plan view, and includes a first lower surface 20b facing the main light emitting surface 10a of the light emitting element 10 and a second lower surface 20d located outside the first lower surface 20b. The first lower surface 20b of the wavelength conversion member 20 is located below the second lower surface 20d in cross-sectional view.

The side surface of the wavelength conversion member 20 includes a first side surface 20c continuous with the outer circumference of the first lower surface 20b and a second side surface 20e continuous with the outer circumference of the second lower surface 20d. The first side surface 20c of the wavelength conversion member 20 is located below the second side surface 20e in a cross-sectional view. The first side surface 20c is a surface continuous with the outer circumference of the first lower surface 20b and the inner circumference of the second lower surface 20d. The second side surface 20e is a surface continuous with the outer circumference of the second lower surface 20d and the outer circumference of the upper surface 20a.

In the present embodiment, in the top view, the outer edge of the first lower surface 20b of the wavelength conversion member 20 is located at the same position as the outer edge of the main light emitting surface 10a of the light emitting element 10 or is located outside the outer edge. Here, in a plan view, the region including the first lower surface 20b of the wavelength conversion member 20 is referred to as the central region 21, and the region including the second lower surface 20d is referred to as the outer peripheral region 22. In the wavelength conversion member 20, the thickness of the central region 21 is thick, and the thickness of the outer peripheral region 22 is thinner than the thickness of the central region 21. In other words, the wavelength conversion member 20 has a convex shape.

Immediately above the light emitting element 10, the thickness of the wavelength conversion member 20 is the same. Therefore, it is possible to reduce the color unevenness of the light emitted from the central region 21 to the outside. Further, the thickness of the outer peripheral region 22 of the wavelength conversion member 20 is thinner than the thickness of the central region 21. Therefore, the optical path length of the light passing through the outer peripheral region 22 can be shortened as compared with the case where the thickness is thick. That is, the difference in the optical path length between the central region 21 and the outer peripheral region 22 can be reduced. As a result, the difference in chromaticity between the light emitted from the central region 21 to the outside and the light emitted from the outer peripheral region 22 to the outside can be reduced, so that the light emitting device with less color unevenness can be obtained.
Hereinafter, each configuration of the light emitting device according to the embodiment will be described in detail.

(Light emitting element 10)
The light emitting element 10 preferably uses a light emitting diode having a semiconductor laminate 11 including an n-type semiconductor layer, a p-type semiconductor layer, and a light emitting layer, and has a wavelength capable of exciting a phosphor contained in a wavelength conversion member. Use. The light emitting element 10 has a main light emitting surface 10a on one side of the semiconductor laminate. For example, the blue (wavelength 430 nm to 490 nm light) and green (wavelength 490 nm to 570 nm light) light emitting elements 10 include ZnSe and nitride semiconductors (In _X Al _Y Ga _1-XY N, 0 ≦ X). , 0 ≦ Y, X + Y ≦ 1). The composition, emission wavelength, size, etc. of the light emitting element 10 can be appropriately selected according to the purpose, application, and the like.

The light emitting element 10 includes a pair of electrodes 12 connected to the semiconductor laminate. The pair of electrodes 12 may be arranged on different surfaces of the semiconductor layer, but it is preferable that the pair of electrodes 12 are arranged on the same surface side of the semiconductor laminate.

The shape of the light emitting element 10 can be various planar shapes such as a polygon such as a circle, an ellipse, a square, a rectangle, or a hexagon in the top view. The shape of the light emitting element 10 is preferably a rectangle such as a square or a rectangle, or a regular hexagon. The size of the light emitting element 10 can be appropriately set depending on the intended use, the performance to be obtained, and the like.

(Wavelength conversion member)
The wavelength conversion member 20 is arranged on the main light emitting surface 10a of the light emitting element 10 via the light guide member 30. The wavelength conversion member 20 absorbs at least a part of the light emitted from the light emitting element 10 and emits light having a wavelength different from the wavelength of the light emitted from the light emitting element 10.

The wavelength conversion member 20 has an upper surface 20a, a first lower surface 20b, a first side surface 20c, a second lower surface 20d, and a second side surface 20e. Specifically, the wavelength conversion member 20 includes a first lower surface 20b that includes a main light emitting surface 10a of the light emitting element 10 in a plan view. The wavelength conversion member 20 includes an upper surface 20a which is a surface opposite to the first lower surface 20b and has an area larger than that of the first lower surface 20b. Further, the wavelength conversion member 20 has a first side surface 20c continuous with the first lower surface 20b, a second side surface 20e continuous with the upper surface 20a and located outside the first side surface 20c, and a first side surface 20c and a second. It has a second lower surface 20d continuous with the side surface 20e.

Further, the outer edge of the first lower surface 20b of the wavelength conversion member 20 is located at the same position as or outside the outer edge of the main light emitting surface 10a of the light emitting element 10 in the top view. It is preferable that a part or all of the outer edge of the first lower surface 20b is arranged outside the outer edge of the main light emitting surface 10a of the light emitting element 10, and all of the outer edge thereof is arranged outside. More preferred.

For example, the distance between the outer edge of the first lower surface 20b and the outer edge of the main light emitting surface 10a of the light emitting element 10 is 10 μm to 50 μm, preferably 10 μm to 40 μm, and more preferably 15 μm to 30 μm.

It is preferable that the center of the first lower surface 20b is arranged so as to substantially coincide with the center of the main light emitting surface 10a of the light emitting element 10 in the top view. Further, the first lower surface 20b can have various planar shapes. For example, the first lower surface 20b is preferably a rectangle or hexagon such as a square or a rectangle, and more preferably the same or similar to the shape of the main light emitting surface 10a of the light emitting element 10. By making the shape of the first lower surface 20b similar to the shape of the main light emitting surface 10a of the light emitting element 10, the light emitted from the main light emitting surface 10a of the light emitting element 10 and the side surface of the light emitting element 10 is efficiently wavelength-converted. The light can be guided to the member 20.

The height T of the wavelength conversion member 20 may be a height at which the mechanical strength in the manufacturing process does not easily decrease, and is preferably 50 μm or more, for example. Further, considering the ease of processing, it is preferably set to 300 μm or less, for example. The height T of the wavelength conversion member 20 in consideration of these is, for example, 50 μm to 300 μm, preferably 70 μm to 300 μm, and more preferably 100 μm to 200 μm.

The second side surface 20e of the wavelength conversion member 20 may be a surface that expands, narrows, or has both outside the light emitting device toward the second lower surface 20d, and more preferably, the upper surface 20a and the second side surface. The angle formed by 20e is almost vertical (90 degrees). The term "vertical" includes within 90 ± 10 degrees.

Further, the connecting portion between the upper surface 20a and the second side surface 20e may be rounded, and the second side surface 20e may be a curved surface or a surface including a curved surface. The surface of the second side surface 20e may be smooth or may have fine irregularities.

As shown in FIG. 1D, the height T1 (height of the outer peripheral region) of the first side surface includes 500 to 8/10 of the height T (height of the central region) of the wavelength conversion member 20. 10 to 7/10 is preferable, 3/10 to 6/10 is more preferable, and 3/10 to 5/10 is even more preferable. With such a height, when the second side surface 20e is covered with the reflection member 40 described later, the contrast between the light emitting region and the non-light emitting region at the time of light emission can be increased. The height T2 of the second side surface and the height T1 of the first side surface can be appropriately set. Further, the width W1 of the second lower surface 20d is preferably larger than the height of the side surface of the light emitting element 10, for example. Further, the width W1 of the second lower surface 20d is preferably smaller than half the distance between the first side surface 20c and the side surface of the light emitting device 100.

The wavelength conversion member 20 can be formed of, for example, a resin molded body or an inorganic substance such as ceramics or glass. The wavelength conversion member 20 may transmit 60% or more of the light emitted from the light emitting element 10, preferably 70% or more, and more preferably 80% or more.

The wavelength conversion member 20 preferably contains a wavelength conversion substance. Examples of the wavelength conversion substance include a sintered body of a phosphor, and a resin, glass, ceramics, and other inorganic materials containing the phosphor. The phosphor, yttrium-aluminum-garnet fluorescent material (YAG phosphor), nitride phosphor, oxynitride _phosphor, K 2 _SiF 6: Mn phosphor (KSF phosphor) sulfide Those known in the art such as phosphors can be appropriately used. Nitride-based phosphors are represented by, for example, CaAlSiN ₃ : Eu, (Sr, Ca) AlSiN ₃ : Eu, (Sr, Ca) ₂ Si ₅ N ₈ : Eu, (Sr, Ca) Si ₇ N10: Eu and the like. Will be done. As the wavelength conversion member 20, a luminescent substance called a so-called nanocrystal or quantum dot may be used.

Color rendering and color reproducibility can be adjusted by using these phosphors in a combination and / or a compounding ratio suitable for a desired color tone. Since the wavelength conversion member 20 contains a phosphor, the light emitted to the outside from the upper surface 20a of the wavelength conversion member 20 is a mixed color light with the light emitted from the light emitting element 10 and the light wavelength-converted by the phosphor. Become. Therefore, for example, it is possible to obtain a light emitting device that emits white light by mixing blue light emitted from the light emitting element 10 and yellow light in which a part of the blue light is wavelength-converted by a phosphor. can.

The wavelength conversion member 20 may contain one wavelength conversion substance, or may contain two or more wavelength conversion substances. Further, the wavelength conversion member 20 may be formed by a single layer or may be formed by laminating two or more layers.

Further, the wavelength conversion member 20 may contain a diffusing material, if necessary. By including the diffusing material in the wavelength conversion member 20, color unevenness and further brightness unevenness can be suppressed. Examples of the diffusing material include titanium oxide, barium titanate, aluminum oxide, silicon oxide and the like.

(Light guide member)
The light guide member 30 can guide the light from the light emitting element and make it incident on the wavelength conversion member 20. The light guide member 30 is in contact with the entire surface of the main light emitting surface 10a and is in contact with the entire surface of the first lower surface 20b of the wavelength conversion member 20. As a result, the light emitted from the main light emitting surface 10a of the light emitting element 10 can be efficiently guided to the wavelength conversion member 20.

The light guide member 30 further covers at least a part of the main light emitting surface 10a of the light emitting element 10 and the side surface 10b of the light emitting element 10. Further, the light guide member 30 covers at least a part of the first side surface 20c and the second lower surface 20d of the wavelength conversion member 20. That is, the light emitted from the main light emitting surface 10a of the light emitting element 10 is mainly incident from the first lower surface 20b of the wavelength conversion member 20, and a part of the light guides the inside of the light guide member 30 to the first side surface. It is incident on the wavelength conversion member 20 from 20c or the second lower surface 20d. Therefore, the light emitted from the main light emitting surface 10a of the light emitting element 10 and the side surface 10b of the light emitting element 10 is emitted as compared with the case where the main light emitting surface 10a of the light emitting element 10 and the wavelength conversion member 20 are directly bonded. It can be emitted to the wavelength conversion member 20 more uniformly. Further, the light incident on the wavelength conversion member 20 from the first lower surface 20b, the first side surface 20c, and the second lower surface 20d of the wavelength conversion member 20 can be more uniformly incident. Therefore, it is possible to reduce the color unevenness of the light emitted from the upper surface 20a of the wavelength conversion member 20.

The light guide member 30 is preferably in contact with all of the side surfaces 10b of the light emitting element 10. As a result, the light emitted from the side surface 10b of the light emitting element 10 can be efficiently incident on the wavelength conversion member 20.

The light guide member 30 is preferably arranged so as not to cover the second side surface 20e of the wavelength conversion member 20. That is, by separating the light guide member 30 from the main light emitting surface 10a of the light emitting device, it is possible to suppress the light leaking from the light guide member 30 to the outside.

The light guide member 30 is continuously arranged from the side surface 10b of the light emitting element 10 to the second lower surface 20d of the wavelength conversion member 20. Further, the outer surface of the light guide member 30 is preferably a continuous inclined surface extending from the side surface 10b of the light emitting element 10 toward the outer edge of the second lower surface 20d of the wavelength conversion member 20. Specifically, the thickness of the light guide member 30 covering the side surface 10b of the light emitting element 10 (that is, the width of the light guide member 30 in the plane direction) becomes thicker as it approaches the wavelength conversion member 20 (that is, the upper surface side of the light emitting device). .. Then, it is preferable that the light emitting element 10 is formed in a substantially triangular cross-sectional view in which the thickness thereof decreases toward the lower surface. The outer surface of the light guide member 30 (the surface in contact with the reflective member 40) may be a flat surface, a concave curved surface, or a convex curved surface.

Further, the light guide member 30 preferably covers more than half of the second lower surface 20d of the wavelength conversion member 20, and more preferably covers the entire surface of the second lower surface 20d. As a result, the light emitted from the light emitting element 10 can be efficiently incident on the second lower surface 20d of the wavelength conversion member 20. As a result, the light emitted from the light emitting element 10 can be easily guided to the second lower surface 20d of the wavelength conversion member 20, and the color unevenness of the light emitted from the upper surface 20a of the wavelength conversion member 20 can be reduced.

The lower end of the light guide member 30 in contact with the side surface 10b of the light emitting element 10 is located above the lower end of the side surface 10b of the light emitting element 10 or coincides with the lower end of the side surface 10b of the light emitting element 10. The light guide member 30 is preferably in contact with, for example, all of the side surfaces 10b of the light emitting element 10 and the entire surface of the first side surface 20c of the wavelength conversion member 20 and the entire surface of the second lower surface 20d. As a result, the light emitted from the side surface 10b of the light emitting element 10 can be efficiently incident on the wavelength conversion member 20. As a result, the light extraction efficiency from the upper surface 20a of the wavelength conversion member 20 can be improved.

As the light guide member 30, it is preferable to use a translucent material capable of guiding the light emitted from the light emitting element 10 to the wavelength conversion member 20. Examples of such a material include organic resins such as epoxy resin, silicone resin, phenol resin, and polyimide resin. Of these, silicone resin is preferable. The light guide member 30 may contain the above-mentioned diffusing material.

(Reflective member 40)
The reflection member 40 covers the second side surface 20e of the wavelength conversion member 20 and the outer surface of the light guide member 30. When a part of the side surface 10b of the light emitting element 10 is exposed from the light guide member 30, the reflection member 40 covers the side surface 10b of the light emitting element 10 exposed from the light guide member 30. As a result, substantially all of the light emitted from the light emitting element 10 can be incident on the wavelength conversion member 20.

As the reflective member 40, it is preferable to use an insulating material, and for example, a resin material can be used. Examples of the resin material include silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, acrylic resin, phenol resin, resin containing one or more of BT resin and PPA, or hybrid resin. Of these, a silicone resin having excellent heat resistance and electrical insulation and being flexible is preferable. The reflective member 40 can be formed by including a light reflecting substance in the base material made of the above-mentioned insulating material. Examples of light-reflecting substances include titanium oxide, silicon oxide, zirconium oxide, magnesium oxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, barium titanate, potassium titanate, alumina, aluminum nitride, boron nitride, murite, etc. Can be mentioned. Of these, titanium oxide is preferable because it is relatively stable against moisture and has a high refractive index. Further, as the reflective member 40, ceramics may be used as an insulating material having excellent light reflectivity and heat dissipation. Examples of ceramics include aluminum oxide, aluminum nitride, and boron nitride.

(Manufacturing method of light emitting device)
Next, a method of manufacturing the light emitting device 100 according to the embodiment of the present disclosure will be described. In the method for manufacturing the light emitting device according to the embodiment of the present disclosure, the order of some steps is not limited, and the order may be changed.
The method for manufacturing the light emitting device of the present disclosure includes a step of preparing a wavelength conversion member 20 having a groove 60 formed therein, a step of separating the wavelength conversion member 20 in the groove portion 60 to form a wavelength conversion member 20, and a light guide member. A step of placing the light emitting element 10 on the convex portion of the wavelength conversion member 20 via 30 and a step of covering with the reflection member 40 are included.

(Step of preparing a wavelength conversion member having a groove)
First, as shown in FIGS. 2A and 2B, a sheet-shaped wavelength conversion member 20 having a groove 60 is prepared. Next, as shown in FIGS. 3A and 3B, a grid-like groove portion 60 surrounding a region in which the light emitting element 10 described later is placed is formed on the wavelength conversion member 20. The wavelength conversion member 20 having the groove portion 60 may be prepared in advance by purchasing or the like. In that case, the step of forming the groove portion 60 can be omitted.

As a method of preparing the wavelength conversion member 20, for example, the uncured wavelength conversion member 20 can be formed on the support 50 by spraying, printing, coating, injection molding, pasting or the like.

As a method of forming the groove portion 60 on the wavelength conversion member 20, a method of mechanically forming a groove portion on the surface of the groove portion 60 by using a flat plate-shaped wavelength conversion member, or an optically forming groove portion using laser light. Examples include methods, photolithography and methods of chemical formation utilizing by etching. Alternatively, a mold or the like may be pressed against one main surface of the wavelength conversion member 20 in a semi-cured state and formed by pressing. In that case, the wavelength conversion member 20 may be cured while pressing the mold or after separating from the mold.

The depth of the groove portion 60 corresponds to the height of the first side surface 20c of the wavelength conversion member 20, and is preferably 3/10 to 7/10 of the total thickness of the wavelength conversion member 20.

(The process of cutting at the position of the groove of the wavelength conversion member and separating it into individual pieces)
Next, as shown in FIGS. 4A and 4B, the wavelength conversion member 20 is cut and fragmented at the position of the groove portion 60. As a result, the wavelength conversion member 20 can be provided with a thick central region 21 and a thin outer peripheral region 22. Specifically, in top view, it is preferable to cut at a position passing through the center of the groove. As a result, the wavelength conversion member 20 having substantially the same shape and size can be formed.

Further, the wavelength conversion member 20 can be separated into individual pieces by cutting using, for example, laser dicing, cutter scribe, or the like. When cutting the wavelength conversion member 20 using a blade, the width of the blade is selected to be smaller than the width of the groove portion 60.

(Step of placing the light emitting element on the wavelength conversion member via the light guide member)
Next, as shown in FIGS. 5A and 5B, the light emitting element 10 is placed on the central region 21 of the wavelength conversion member 20 (on the surface to be the first lower surface 20b) via the light guide member 30.
Specifically, the light guide member 30 is arranged on the central region 21 of the wavelength conversion member 20 and / or on the main light emitting surface 10a of the light emitting element 10. Then, the light emitting element 10 is placed so that the central region 21 of the wavelength conversion member 20 and the main light emitting surface 10a of the light emitting element 10 face each other. At this time, it is preferable that the wavelength conversion member 20 is placed so that the center of the central region 21 and the center of the main light emitting surface 10a of the light emitting element 10 coincide with each other in the top view.

The light guide member 30 can be formed of the above-mentioned material by, for example, potting, printing, or the like. When formed by potting, the shape of the outer surface of the light guide member 30 can be appropriately controlled by adjusting the amount and / or viscosity of the material used. For example, the resin material forming the light guide member is dropped on the central region 21 of the wavelength conversion member 20 and / or on the main light emitting surface 10a of the light emitting element 10, and then the light emitting element 10 is placed. As a result, as shown in FIG. 6B, the light guide member 30 crawls up to the side surface 10b of the light emitting element 10 due to surface tension.

(Step of forming a reflective member)
Next, as shown in FIGS. 7A and 7B, the side surface 10b of the light emitting element 10, the outer surface of the light guide member 30, the second lower surface 20d and the second side surface 20e of the wavelength conversion member 20 described above are covered with the reflection member 40. .. The reflective member 40 can be formed by transfer molding, compression molding, screen printing, potting, spraying, or the like. In particular, a molding method using a mold such as compression molding or transfer molding is preferable in order to cover the plurality of light emitting elements 10 and the side surface of the wavelength conversion member 20 and the outer surface of the light guide member 30. The reflective member 40 may be formed by molding once, or may be formed by molding a plurality of times.

The reflective member 40 may be formed so as to cover the upper surface of the electrode 12 of the light emitting element 10. In this case, as shown in FIGS. 8A and 8B, a step of removing a part of the reflecting member 40 so as to expose the upper surface of the electrode 12 of the light emitting element 10 coated with the reflecting member 40 from the surface of the reflecting member 40 is further added. conduct. As a result, the electrode 12 that supplies electricity to the light emitting element 10 can be formed. For the exposure of the electrode 12 of the light emitting element 10, a method such as grinding, cutting, or etching can be used.

Next, as shown in FIGS. 9A and 9B, the individualized light emitting device can be obtained by cutting the reflecting member 40 of the wavelength conversion member 20 between the light emitting elements 10. This cutting can be performed by blade dicing using a blade, laser dicing, cutter scribe, or the like.

(Embodiment 2)
The light emitting device 200 according to the second embodiment is shown in FIGS. 10A and 10B. The light emitting device 200 is different from the light emitting device 100 according to the first embodiment in that the light guide member 30 is composed of two members, a first light guide member 31 and a second light guide member 32. It should be noted that duplicate description will be omitted for the parts common to the first embodiment.

The first light guide member 31 covers the first side surface 20c and the second lower surface 20d of the wavelength conversion member 20. The second light guide member 32 covers the main light emitting surface 10a and the side surface 10b of the light emitting element 10, and further covers the first lower surface 20b of the wavelength conversion member 20. It is preferable that at least a part of the first light guide member 31 and the second light guide member 32 are in contact with each other. As a result, the light emitted from the light emitting element 10 is incident on the first light guide member 31 or the wavelength conversion member 20 after being incident on the second light guide member 32.

The lower surface of the first light guide member 31 is located on the same plane as the first lower surface 20b of the wavelength conversion member 20. That is, the first light guide member 31 does not cover the first lower surface 20b of the wavelength conversion member 20.

The upper surface of the second light guide member 32 is in contact with the lower surface of the first light guide member 31. The lower surface of the first light guide member 31 and the upper surface of the second light guide member 32 can have the same size.

The angle formed by the outer surface of the first light guide member 31 and the second lower surface 20d of the wavelength conversion member 20 and the angle formed by the outer surface of the second light guide member 32 and the side surface 10b of the light emitting element 10 are substantially the same. Is preferable. Further, it is preferable that the outer surface of the first light guide member 31 and the outer surface of the second light guide member 32 are continuously connected.

Further, the refractive index of the first light guide member 31 is preferably lower than the refractive index of the second light guide member 32. As a result, the light emitted from the side surface 10b of the light emitting element and incident on the second light guide member 32 can be easily incident on the first light guide member 31.

The first light guide member 31 may contain a wavelength conversion substance, in which case the concentration of the wavelength conversion substance in the first light guide member 31 is lower than the concentration of the wavelength conversion substance of the wavelength conversion member 20. Is preferable.

The composition of the wavelength conversion substance in the first light guide member 31 may be the same as or different from the composition of the wavelength conversion substance in the wavelength conversion member 20. More preferably, it is a wavelength conversion substance having a different composition. When wavelength conversion substances having different compositions are used, the wavelength conversion substance is appropriately selected in consideration of color unevenness on the light emitting surface of the light emitting device. As a result, color unevenness can be reduced on the light emitting surface of the light emitting device.

The first light guide member 31 may include a diffusing material. Examples of the diffusing material include titanium oxide, barium titanate, aluminum oxide, silicon oxide and the like. By including a diffusing material, color unevenness on the light emitting surface of the light emitting device can be reduced.

(Manufacturing method of light emitting device)
The method of manufacturing the light emitting device 200 according to the second embodiment will be mainly described with respect to the differences from the first embodiment. As described above, the light emitting device 200 is different in that the light guide member 30 has a first light guide member 31 and a second light guide member 32 in contact with the first light guide member 31. Details of the same points as in the first embodiment will be omitted.

(Step of arranging the first light guide member)
As shown in FIG. 4B, the steps up to the preparation of the wavelength conversion member 20 including the thick central region 21 and the thin outer peripheral region 22 can be performed in the same manner as in the first embodiment. Next, as shown in FIG. 11A, the light guide member 30 is arranged on the central region 21 of the wavelength conversion member 20 (the surface that becomes the first lower surface 20b). At this time, the first light guide member 31 is arranged so as to cover the first side surface 20c and the second lower surface 20d of the wavelength conversion member 20. The arrangement of the first light guide member 31 can be performed by, for example, potting.

Next, as shown in FIG. 11B, the first light guide member 31 on the central region 21 of the wavelength conversion member 20 is removed by grinding or the like. As a result, it is possible to form the first light guide member 31 that covers the side surface (first side surface 20c) of the central region 21 of the wavelength conversion member 20 and the upper surface (the surface serving as the second lower surface 20d) of the outer peripheral region 22. .. The upper surface of the central region 21 of the wavelength conversion member 20 (the surface serving as the first lower surface 20b) and the upper surface of the first light guide member 31 (shown as the lower surface in FIG. 10B) may be formed so as to be substantially flush with each other. preferable.

Next, as shown in FIG. 11C, the second light guide member 32 is placed on the central region 21 of the wavelength conversion member 20 (on the surface that becomes the first lower surface 20b) and on the first light guide member 31. Deploy. The second light guide member 32 can be formed by, for example, potting, printing, or the like. When formed by potting, the planar shape of the outer surface of the second light guide member 32 can be appropriately controlled by adjusting the amount and / or viscosity of the material used.

Next, as shown in FIG. 11D, the light emitting element 10 is placed on the second light guide member 32. After that, the step of forming the reflective member 40 and the like can be performed in the same manner as in the first embodiment.

(Modification example)
The light emitting device 300 according to the modified example of the second embodiment is shown in FIG. In the light emitting device 300, the light guide member 30 is composed of two members, a first light guide member 31 and a second light guide member 32, and the second light guide member 32 is a side surface of the first light guide member 31. It is arranged so as to cover. The second light guide member 32 may be in contact with the second lower surface 20d of the wavelength conversion member 20. With such a configuration, the light from the light emitting element 10 can be efficiently guided to the wavelength conversion member 20.

In such a light emitting device 300, the step of forming the first light guide member 31 is different in the manufacturing method of the light emitting device 200 according to the second embodiment, and this point will be mainly described. Since other steps can be performed in the same manner as in the first and second embodiments, the description thereof will be omitted.

As shown in FIG. 13A, the steps up to the preparation of the wavelength conversion member 20 having the groove portion 60 can be performed in the same manner as in the first embodiment. Next, as shown in FIG. 13B, the first light guide member 31 is arranged in the groove portion 60. Next, as shown in FIG. 13C, a recess is formed in the first light guide member 31. The recess can be formed by removing a part of the first light guide member 31 with a blade, for example. When the outer surface of the first light guide member 31 is an inclined surface, it is preferable to use a blade having a V-shaped cross section. Further, when the outer surface of the first light guide member 31 is a curved surface having a protrusion on the wavelength conversion member 20 side, it is preferable to use a blade having a U-shape in cross section. The depth of the recess of the first light guide member 31 is preferably substantially the same as or lower than the height of the first side surface 20c of the wavelength conversion member 20.

Next, the first light guide member 31 and the wavelength conversion member 20 are cut and separated into individual pieces. As the cutting position, it is preferable to cut so as to pass through the center of the bottom surface of the recess in the cross-sectional view. The step of placing the light emitting element on the individualized wavelength conversion member 20 can be performed in the same manner as in the first embodiment.

Although the above has been described in detail in terms of the mode for carrying out the invention, the gist of the present invention is not limited to these descriptions, and must be broadly interpreted based on the description of the scope of claims. Needless to say, various changes and modifications based on these descriptions are also included in the gist of the present invention.

The light emitting device according to the embodiment of the present disclosure is used as, for example, a general lighting light source or an in-vehicle light source.

100, 200, 300 ... Light emitting device 10 ... Light emitting element 11 ... Semiconductor laminate 10a ... Main light emitting surface 10b ... Side surface 12 ... Electrode 20 ... Wavelength conversion member 20a ... Top surface 20b ... First lower surface 20c ... First side surface 20d ... Second Lower surface 20e ... Second side surface 21 ... Central region 22 ... Outer peripheral region 30 ... Light guide member 31 ... First light guide member 32 ... Second light guide member 40 ... Reflective member 50 ... Support 60 ... Groove

Claims (5)

A light emitting element having a main light emitting surface and
A wavelength conversion member arranged on the main light emitting surface of the light emitting element, which is a first lower surface facing the main light emitting surface of the light emitting element and a side opposite to the first lower surface and larger than the first lower surface. An upper surface having an area, a first side surface continuous with the first lower surface, a second side surface continuous with the upper surface and located outside the first side surface, and continuous with the first side surface and the second side surface. A wavelength conversion member having a second lower surface and
A light guide member that covers at least a part of the main light emitting surface of the light emitting element, a side surface of the light emitting element, the first side surface of the wavelength conversion member, and at least a part of the second lower surface.
A part of the light emitting element, a second side surface of the wavelength conversion member, and a reflection member covering the light guide member are provided.
The light guide member includes a first light guide member and a second light guide member in contact with the first light guide member.
The first light guide member covers the first side surface of the wavelength conversion member and the second lower surface of the wavelength conversion member.
The second light guide member covers the main light emitting surface of the light emitting element and the side surface of the light emitting element .
A light emitting device in which the refractive index of the first light guide member is lower than the refractive index of the second light guide member. The light emitting device according to claim 1, wherein the outer edge of the first lower surface is located at the same position as or outside the outer edge of the main light emitting surface of the light emitting element in a top view. The light emitting device according to claim 1 or 2, wherein the lower surface of the first light guide member is located on the same plane as the first lower surface of the wavelength conversion member. The light emitting device according to any one of claims 1 to 3, wherein the second light guide member is in contact with the wavelength conversion member. The light emitting device according to any one of claims 1 to 4, wherein the second light guide member covers a side surface of the first light guide member.

Images