JP6970869B2 - Tape application device and tape application method - Google Patents

Description

The present invention relates to a tape sticking device and a tape sticking method for sticking a tape section for joining parts to an end region of a substrate made of a film-like member.

In the liquid crystal panel manufacturing line, before mounting parts such as drive circuits on the electrodes provided in the end region of the substrate, a tape piece of ACF (Anisotropic Conducive Film) for joining parts is attached to the electrodes. Perform the arrival work. The tape sticking device that executes the tape sticking work supports the lower surface of the end region of the substrate by the backup stage, presses and sticks the tape section together with the separator stuck on the upper surface, and sticks the tape section from the tape section. The structure is such that the operation of pulling up the separator and peeling it off is repeated (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2014-107524

However, in the prior art including Patent Document 1, the backup stage merely supports the lower surface of the end region of the substrate. Therefore, when the substrate is not a glass substrate but is made of a film-like member having low rigidity such as a flexible substrate, pulling up the separator from the tape section attached to the substrate pulls up the end region of the substrate. There is a problem that the portion (edge region of the substrate) may be deformed or the like.

Therefore, the present invention is a tape attaching device capable of preventing a situation in which the end region of the substrate is pulled up and the portion is deformed or the like when the separator is pulled up from the tape section attached to the substrate made of a film-like member. And to provide a tape application method.

In the tape attaching device of the present invention, a plurality of suction ports are formed on the upper surface at predetermined intervals, and a communication space extending in the longitudinal direction and one end opening from the side surface to the outside is formed, and the plurality of suction ports are formed. A backup stage that penetrates the communication space from the upper surface and supports an end region of a substrate made of a film-like member on the upper surface, and a shaft member inserted from an opening of the communication space communicate with the communication space. Then, a suction mechanism that sucks the lower surface of the end region of the substrate through the suction port and a tape section for joining parts are pressed and attached to the end region of the substrate together with a separator attached to the upper surface thereof. A tape attaching means for pulling up and peeling off the separator from the tape section to be attached and attached is provided, and the insertion amount for inserting the shaft member into the communication space is changed so that the backup stage is attached to the substrate. change the length of the adsorption area for adsorbing the end region, corresponding to the insertion amount, further Ru comprising a suction area length display means for displaying the length of the suction area set.

The tape sticking method of the present invention is a tape sticking method for sticking a tape section for joining parts to an end region of a substrate made of a film-like member, and is a suction area for adsorbing a substrate placed on an upper surface. In a backup stage having a variable length, the suction area setting step of setting the length of the suction area according to the length of the end region of the substrate placed on the upper surface, and the set suction area. A substrate mounting step of mounting the substrate on the backup stage, a substrate suction step of adsorbing the mounted substrate, and a tape section for joining parts are placed on the upper surface thereof so that the end region of the substrate is placed. a tape applying step with pasted separator to adhere by pressing the end region of the substrate, a separator peeling step of peeling by pulling the separator from the tape sections, only contains the backup stage , A plurality of suction ports are formed on the upper surface at predetermined intervals, a communication space extending in the longitudinal direction and one end opening from the side surface to the outside is formed, and the plurality of suction ports penetrate the communication space from the upper surface. The length of the suction area can be changed by changing the insertion amount of the shaft member inserted from the opening into the communication space, and the insertion amount can be changed in the suction area setting step. The length of the suction area is set by changing the method, and the set length of the suction area is displayed corresponding to the insertion amount .

According to the present invention, it is possible to prevent a situation in which the end region of the substrate is pulled up and the portion is deformed or the like when the separator is pulled up from the tape section attached to the substrate made of a film-like member.

(A) (b) Perspective view of the tape attaching device according to the embodiment of the present invention. (A) (b) Structural explanatory view of the backup stage included in the tape attaching device according to the embodiment of the present invention. (A) (b) Structural explanatory view of the backup stage included in the tape attaching device according to the embodiment of the present invention. (A) (b) (c) Process explanatory view of tape sticking work by the tape sticking apparatus of one Embodiment of this invention The figure which shows the flow of the tape sticking method of one Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The configuration, shape, etc. described below are examples for explanation, and can be appropriately changed according to the specifications of the tape attaching device. In the following, the corresponding elements are designated by the same reference numerals in all the drawings, and duplicate description will be omitted. In FIG. 1 and a part described later, the X direction (horizontal direction in FIG. 2A) and the Y direction orthogonal to the X direction (front-back direction in FIG. 2A) are biaxial directions orthogonal to each other in the horizontal plane. Is shown. In FIG. 1 and a part described later, the Z direction is shown as a height direction orthogonal to the horizontal plane.

Next, the configuration of the tape attaching device 1 will be described with reference to FIG. The tape attaching device 1 has a function of attaching a tape section 2b1 obtained by cutting an ACF tape 2b (see FIG. 4) to a predetermined length to a substrate 3 made of a thin and easily deformable film-like member. In the tape sticking device 1, a substrate positioning mechanism 4 and a sticking mechanism 5 are provided in parallel on the base 1a in the Y direction. The substrate positioning mechanism 4 is configured by stacking an X-axis table 6X and a Y-axis table 6Y, and further providing a moving stage 7 on the Y-axis table 6Y. The Y-axis table 6Y moves in the X direction by driving the X-axis table 6X. The moving stage 7 moves in the Y direction by driving the Y-axis table 6Y.

A plurality of (here, two) board holding tables 8 are provided in parallel in the X direction on the moving stage 7 to hold the boards 3 carried in from outside the apparatus (see FIG. 1A). Each board holding table 8 moves up and down individually with respect to the moving stage 7 by driving the table raising and lowering mechanism. Each drive unit of the substrate positioning mechanism 4 is controlled by a control unit C included in the tape attaching device 1. The control unit C moves the substrate 3 held by the substrate holding table 8 in the XYZ direction by controlling the X-axis table 6X, the Y-axis table 6Y, and the table elevating mechanism, and positions the substrate 3 at a predetermined position (FIG. 1). See (b)).

The sticking mechanism 5 has a plurality of (here, two) base plates 9 provided in parallel in the X direction. A plate moving mechanism 10 extending in the X direction is attached to the rear surface of each base plate 9. The plate moving mechanism 10 is controlled by the control unit C, and by driving the plate moving mechanism 10, each base plate 9 moves individually in the X direction.

A tape supply reel 11 is detachably attached to a position above the front surface of each base plate 9. As shown in FIG. 4, the tape supply reel 11 winds and houses a tape member 2 having a structure in which an ACF tape 2b is laminated on a separator 2a, and is rotationally driven by a reel drive mechanism controlled by a control unit C.

In FIG. 1, a first guide roller 12 and a second guide roller 13 are installed in horizontal positions on both sides of the lower end portion of the base plate 9. The tape member 2 is guided horizontally from upstream to downstream in a posture in which the ACF tape 2b is turned downward by rotating around the first guide roller 12.

A crimping tool 14 that is moved up and down by the tool raising and lowering mechanism 14a controlled by the control unit C is provided between the two guide rollers 12 and 13 and above the horizontal feeding path of the tape member 2. .. At a position upstream of the crimping tool 14, a cutter portion controlled by a control unit C that cuts the ACF tape 2b according to the length dimension of the electrode portion 3a formed on the upper surface of the substrate 3 (not shown). ) Is provided. Below the crimping tool 14, a tape piece 2b1 cut to a predetermined length by the cutter portion is fed. The tape member 2 to which the tape section 2b1 is attached to the substrate 3 and becomes only the separator 2a is circulated around the second guide roller 13 and guided upward, and is collected by the tape collection unit.

In FIG. 1, a backup stage 15 having a horizontal plane (upper surface) extending in the X direction is provided below the crimping tool 14. The backup stage 15 supports the end region including the electrode portion 3a formed on the substrate 3 from below.

Next, the configuration of the backup stage 15 will be described with reference to FIGS. 2 and 3. In FIG. 2, a plurality of suction ports 16 are formed on the upper surface 15a of the backup stage 15 at predetermined intervals in the X direction. Inside the backup stage 15, a columnar connected space 17 extending in the X direction is formed. Each of the plurality of suction ports 16 penetrates from the upper surface 15a of the backup stage 15 to the communication space 17.

On one side surface 15b of the backup stage 15, an opening 17a of a communication space is formed in which the communication space 17 opens to the outside. A cylindrical shaft member 18 is inserted into the communication space 17 from the opening 17a of the communication space (see FIG. 3). An O-ring 18a is attached to the shaft member 18 near the end inserted into the communication space 17, and a grip portion 18b is attached to the opposite end. The O-ring 18a is a sealing means that abuts on the inner wall 17b of the communication space and seals the communication space 17. A shaft support portion 19 is installed on the side of one side surface 15b of the backup stage 15. The shaft support portion 19 includes a bearing 19a that supports the side surface of the shaft member 18, and supports the shaft member 18 that is inserted into the opening 17a of the communication space.

FIG. 3 shows a state in which the shaft member 18 is inserted into the communication space 17, and the display of the bearing 19a is omitted for convenience. In FIG. 3, a suction connecting portion 17c for vacuum suctioning the communication space 17 is formed on the other side surface 15c of the backup stage 15. A vacuum pump 20 controlled by the control unit C is connected to the suction connection unit 17c via a pipe 21.

When the vacuum pump 20 is operated with the end region of the substrate 3 placed on the upper surface 15a of the backup stage 15 (see FIG. 4), the substrate is communicated from the suction port 16 communicating with the communication space 17 sealed by the O-ring 18a. The lower surface of 3 is sucked. That is, the vacuum pump 20 is a suction mechanism that communicates with the communication space 17 and sucks the lower surface of the end region of the substrate 3 through the suction port 16.

In FIG. 3, the backup stage 15 can change the number of suction ports 16 to be sucked by changing the insertion amount Li for inserting the shaft member 18 into the communication space 17 and changing the position of the O-ring 18a. .. Thereby, the length Lv of the suction area where the backup stage 15 sucks the end region of the substrate 3 can be changed. A scale plate 22 is installed on the upper part of the base 1a. An instruction mark 23 is formed on the grip portion 18b. When the shaft member 18 is inserted into the communication space 17, the position of the scale plate 22 pointed to by the instruction mark 23 indicates the length Lv of the suction area. That is, the scale plate 22 and the instruction mark 23 are suction area length display means for displaying the set suction area length Lv corresponding to the insertion amount Li.

As described above, in the backup stage 15 that supports the end region of the substrate 3 made of the film-like member by the upper surface 15a, a plurality of suction ports 16 are formed on the upper surface 15a at predetermined intervals, and the inside is in the longitudinal direction (X direction). A communication space 17 is formed in which one end extends from the side surface (one side surface 15b) to the outside, and the plurality of suction ports 16 penetrate the communication space 17 from the upper surface 15a.

Next, with reference to FIG. 4, the tape sticking operation by the sticking mechanism 5 will be described. In the tape pasting work, first, as shown in FIG. 3, the insertion amount Li of the shaft member 18 is adjusted, and the length Lv of the suction area of the backup stage 15 is set to the length Lb of the end region of the substrate 3 (FIG. 1 (a). ) Refer to). Next, as shown in FIG. 1 (b), the substrate positioning mechanism 4 is driven to move the moving stage 7 in a predetermined direction, and the end region of the substrate 3 held by the plurality of substrate holding tables 8 is used as a backup stage. Position on 15. Next, the vacuum pump 20 is operated to attract the lower surface of the end region of the substrate 3 to the upper surface 15a of the backup stage 15.

Next, as shown in FIGS. 4A and 4B, the crimping tool 14 is lowered with the tape section 2b1 aligned above the electrode portion 3a of the substrate 3 (arrow a), and the tape section is placed on the electrode portion 3a. 2b1 is pressed and attached together with the separator 2a. After the tape section 2b1 is attached, as shown in FIG. 4C, the crimping tool 14 is raised (arrow b) and the reel drive mechanism is rotationally driven to collect the separator 2a in the tape collection section. As a result, the separator 2a is pulled up and peeled from the tape section 2b1.

In this way, the sticking mechanism 5 presses the tape section 2b1 for joining parts together with the separator 2a attached to the upper surface thereof against the end region of the substrate 3 and attaches the tape section 2b1 to the attached tape section 2b1 to the separator 2a. It is a tape sticking means that pulls up and peels off. The substrate 3 is adsorbed on the upper surface 15a of the backup stage 15 when the separator 2a is peeled off. As a result, even the substrate 3 made of a thin film-like member is not pulled upward together with the separator 2a.

Next, along the flow of FIG. 5, a tape for attaching the tape section 2b1 for joining parts to the end region of the substrate 3 made of the film-like member by the tape attaching device 1 with reference to FIGS. 1 and 4. The pasting method will be explained. In FIG. 5, first, the insertion amount Li of the shaft member 18 is changed according to the length Lb of the end region of the substrate 3 to which the tape section 2b1 is attached, and the length Lv of the suction area is set (ST1: Adsorption area setting step) (see FIG. 4A). That is, in the backup stage 15 in which the length Lv of the suction area for sucking the substrate 3 mounted on the upper surface 15a is variable, the suction area is corresponding to the length Lb of the end region of the substrate 3 mounted on the upper surface 15a. Set the length Lv of.

In FIG. 5, the substrate 3 to be worked is then carried into the board holding table 8 and held (ST2: substrate carrying step) (see FIG. 1A). Next, the substrate positioning mechanism 4 is driven to position and mount the end region of the substrate 3 on the backup stage 15 (ST3: substrate mounting step) (see FIG. 1 (b)). That is, the substrate 3 is placed on the backup stage 15 so that the end region of the substrate 3 is placed on the set suction area. Next, the vacuum pump 20 (suction mechanism) is operated to suck the mounted substrate 3 (ST4: substrate suction step) (see FIG. 4A).

Next, the tape section 2b1 for joining parts is pressed and attached to the end region of the substrate 3 together with the separator 2a attached to the upper surface thereof (ST5: tape attaching step) (see FIG. 4B). Next, the separator 2a is pulled up from the tape section 2b1 and peeled off (ST6: separator peeling step) (see FIG. 4C). Next, the operation of the vacuum pump 20 is stopped to release the substrate 3 (ST7: substrate release step). Next, the board positioning mechanism 4 is driven to move the board 3 to the carry-out position and carry it out (ST8: board carry-out step).

In FIG. 5, when the work of the predetermined number of substrates 3 is not completed (No in ST9), the process returns to the substrate loading step (ST2) and the next substrate 3 to be worked is loaded. When the work of the predetermined number of substrates 3 is completed (Yes in ST9), the tape sticking work is completed.

As described above, in the tape attaching device 1 of the present embodiment, a plurality of suction ports 16 are formed on the upper surface 15a at predetermined intervals, extend in the longitudinal direction, and one end thereof opens to the outside from the side surface 15b. A communication space 17 is formed, and the suction port 16 penetrates from the upper surface 15a to the communication space 17, and the backup stage 15 that supports the end region of the substrate 3 made of a film-like member by the upper surface 15a, and the opening 17a of the communication space. A suction mechanism (vacuum pump 20) that communicates with the shaft member 18 inserted from the above, communicates with the communication space 17, and sucks the lower surface of the end region of the substrate 3 through the suction port 16, and a tape section 2b1 for joining parts on the upper surface thereof. A tape sticking means (sticking mechanism 5) is provided which presses and sticks to the end region of the substrate 3 together with the separator 2a stuck to the substrate 3 and pulls up the separator 2a from the stuck tape section 2b1 to peel it off. There is.

In the tape sticking device 1, the insertion amount Li for inserting the shaft member 18 into the communication space 17 is changed, and the length Lv of the suction area where the backup stage 15 sucks the end region of the substrate 3 is changed. This makes it possible to prevent a situation in which the end region of the substrate 3 is pulled up and the portion is deformed or the like when the separator 2a is pulled up from the tape section 2b1 attached to the substrate 3 made of a film-like member.

The tape attaching device 1 is not limited to a structure including two sets of the crimping tool 14 and the backup stage 15, and may have a structure including one set of the crimping tool 14 and the backup stage 15 or three or more sets. good. Further, the tape attaching device 1 is not limited to an independent device, and as a part of the device constituting the component mounting device, a component mounting device for mounting the component on the substrate 3 and a component for crimping the component to the substrate 3. It may be configured to be installed inside the component mounting device in parallel with the crimping device.

In the tape attaching device and the tape attaching method of the present invention, when the separator is pulled up from the tape section attached to the substrate made of a film-like member, the end region of the substrate is pulled up and the portion is deformed or the like. It has the effect of preventing such a situation, and is useful in the field of mounting components on a substrate.

1 Tape sticking device 2a Separator 2b1 Tape section 3 Substrate 5 Sticking mechanism (tape sticking means)
15a Top surface 16 Suction port 17 Connected space 17a Opening of connected space 17b Inner wall of connected space 18 Shaft member 20 Vacuum pump (suction mechanism)
22 Scale plate (Suction area length display means)
23 Instruction mark (suction area length display means)
Lb End area length Li insertion amount Lv Adsorption area length

Claims (4)

A plurality of suction ports are formed on the upper surface at predetermined intervals, a communication space extending in the longitudinal direction and one end opening from the side surface to the outside is formed, and the plurality of suction ports penetrate the communication space from the upper surface. A backup stage that supports the end region of the substrate made of a film-like member on the upper surface.
With the shaft member inserted from the opening of the communication space,
A suction mechanism that communicates with the communication space and sucks the lower surface of the end region of the substrate through the suction port.
A tape attaching means for pressing and attaching a tape section for joining parts to the end region of the substrate together with a separator attached to the upper surface thereof, and pulling up the separator from the attached tape section to peel it off. , Equipped with
By changing the insertion amount for inserting the shaft member into the communication space, the length of the suction area where the backup stage sucks the end region of the substrate is changed .
The response to insertion amount, further Ru comprising a suction area length display means for displaying the length of the suction area is set, the tape sticking device. The tape sticking device according to claim 1, wherein the shaft member has a sealing means that abuts on the inner wall of the communication space and seals the communication space. It is a tape attachment method in which a tape section for joining parts is attached to an end region of a substrate made of a film-like member.
In a backup stage where the length of the suction area for sucking the substrate mounted on the upper surface is variable, the length of the suction area is set according to the length of the end region of the substrate mounted on the upper surface. Area setting process and
A substrate mounting step of mounting the substrate on the backup stage so that the edge region of the substrate is placed on the set suction area.
A substrate adsorption process for adsorbing the mounted substrate and
A tape attaching step of pressing and attaching a tape section for joining parts to the end region of the substrate together with a separator attached to the upper surface thereof.
See containing and a separator peeling step of peeling by pulling the separator from the tape sections,
In the backup stage, a plurality of suction ports are formed on the upper surface at predetermined intervals, a communication space extending in the longitudinal direction and one end opening from the side surface to the outside is formed, and the plurality of suction ports are formed from the upper surface to the outside. The length of the suction area can be changed by changing the insertion amount of the shaft member that penetrates the communication space and is inserted from the opening into the communication space.
In the suction area setting step, the length of the suction area is set by changing the insertion amount, and the length of the suction area corresponding to the insertion amount is displayed. .. The tape attaching method according to claim 3 , wherein the shaft member has a sealing means that abuts on the inner wall of the communication space and seals the communication space.

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