JP6973313B2 - Power converter - Google Patents

Description

The present invention relates to a power conversion device.

Patent Document 1 below discloses a power control unit as a power conversion device mounted on a vehicle such as an electric vehicle or a hybrid vehicle. This power control unit is a device for supplying AC power to a traveling motor, and is equipped with a cooler for cooling an inverter circuit and a bus bar for electrical connection with other connecting devices. There is. The bus bar is arranged so as to be in contact with the outer surface of the outer wall portion of the housing of the power control unit corresponding to the cooler.

Japanese Unexamined Patent Publication No. 2014-54065

By the way, in this type of power conversion device, the heat generated in the bus bar during energization is transferred to the connected device connected to the bus bar, so that the connected device is easily affected by the heat. In particular, the influence on connected devices with low heat resistance becomes large. Therefore, a cooling structure is required to prevent the connected equipment from being affected by the heat generated by the bus bar.

Regarding this cooling structure, in the power control unit disclosed in Patent Document 1, the cooler is in contact with the inner surface of the outer wall, while the bus bar is in contact with the outer surface of the outer wall, so that the bus bar is cooled by the cooler from the inside of the outer wall. It is configured.

In the case of this configuration, by arranging the bus bar on the outside of the housing, the bus bar becomes long and the resistance increases, so that heat generation increases. Further, since the outer wall is interposed between the heating element bass bar and the cooler, it is difficult for the heat generated by the bus bar to move to the cooler side via the outer wall. Therefore, it is difficult to obtain a high cooling effect for the connected equipment connected to the bus bar.
In particular, if the heat generated by the bus bar increases as the current in the power converter increases, there may be a problem that the connected device cannot be cooled to a desired level. However, if a dedicated cooler is provided for the connected equipment, the entire unit will become large and the vehicle mountability will decrease.

The present invention has been made in view of the above problems, and can improve the cooling performance of a connected device electrically connected to a semiconductor module via a bus bar without increasing the size of the device. Is intended to provide.

One aspect of the present invention is
A semiconductor module (10) provided in the energization path between the power supply (3) and the motor (4), and
A cooler (20) for cooling the semiconductor module and
Connecting devices (5, 6, 9) electrically connected to the semiconductor module via a bus bar (16, 17, 18), and
A cooling module (30, 130) that connects the connected device to the cooler so that heat can be conducted, and
Power converter (1,101),
It is in.

In the above power conversion device, the cooler has a function of cooling the semiconductor module provided in the energization path between the power supply and the motor. Further, the cooling module connects a connecting device electrically connected to the semiconductor module via a bus bar to the cooler so as to be thermally conductive. At this time, the connected equipment is indirectly cooled by using the cooling module cooled by the cooler which is the cooling source. That is, the heat of the connected device is transferred from the cooling module to the cooler and dissipated. Therefore, even when the bus bar generates heat during energization, it is possible to prevent the connected device electrically connected to the bus bar from becoming hot. In particular, when the heat resistance of the connected device is low, the influence of heat on the connected device can be reduced by using the cooling module.

Further, the cooling function by the cooler is used not only for cooling the semiconductor module but also for cooling the connected equipment via the cooling module. That is, the cooler is also used for cooling for the connected device. Therefore, it is not necessary to provide a dedicated cooler for the connected device, and it is possible to prevent the entire device from becoming large and the vehicle mountability from deteriorating.

As described above, according to the above aspect, it is possible to provide a power conversion device capable of improving the cooling performance of the connected device electrically connected to the semiconductor module via the bus bar without increasing the size of the device.

The reference numerals in parentheses described in the scope of claims and the means for solving the problem indicate the correspondence with the specific means described in the embodiments described later, and limit the technical scope of the present invention. It's not a thing.

The figure which shows the whole structure of the power conversion apparatus of Embodiment 1. FIG. FIG. 1 is a cross-sectional view taken along the line II-II. FIG. 1 is a cross-sectional view taken along the line III-III. FIG. 3 is a cross-sectional view taken along the line IV-IV in FIG. FIG. 1 is a cross-sectional view taken along the line V-V of FIG. The inverter circuit diagram of the power conversion apparatus of Embodiment 1. FIG. The figure which shows the whole structure of the power conversion apparatus of Embodiment 2. FIG. 7 is a cross-sectional view taken along the line VIII-VIII of FIG.

Hereinafter, embodiments relating to the power conversion device will be described with reference to the drawings.

In the drawings of the present specification, unless otherwise specified, the first direction, which is the stacking direction of the plurality of semiconductor modules constituting the power conversion device and the plurality of cooling pipes, is indicated by an arrow X and is orthogonal to the first direction X. The second direction is indicated by an arrow Y, and the third direction orthogonal to both the first direction X and the second direction Y is indicated by an arrow Z.

(Embodiment 1)
As shown in FIGS. 1 and 2, the power conversion device 1 of the first embodiment includes a plurality of (three in FIG. 1) semiconductor modules 10 and a plurality of coolers 20 housed in the case 2. It is provided with cooling modules 30 (two in FIG. 1). Case 2 is made of a material having good heat conduction, that is, a metal material having good so-called "heat drawing".

The power conversion device 1 is mounted on, for example, an electric vehicle, a hybrid vehicle, or the like, and is used as an inverter that converts DC power supply power into AC power required for driving a drive motor. Therefore, this power conversion device 1 is also referred to as an "inverter 1" or an "inverter device 1".

The semiconductor module 10 is provided in an energization path between a power source 3 which is a DC power source and a motor 4 which is an AC motor. In addition to the semiconductor module 10, the current-carrying path includes a capacitor 5 with a built-in capacitor element, a PN connector 6 electrically connected to the power supply 3, and a three-phase connector electrically connected to the motor 4. 7, a current sensor 9, and a control circuit board 19 (see FIG. 2) are provided.

The semiconductor module 10 includes a main body 11 having a built-in switching element 14 (see FIG. 2), three power terminals 12, and a plurality of control terminals 13 (see FIG. 2) electrically connected to a control circuit board 19. , And a heat dissipation unit 15 (see FIG. 2). The three power terminals 12 project parallel to each other in one direction of the third direction Z from the main body 11, and the plurality of control terminals 13 project parallel to each other from the main body 11 in the direction opposite to the power terminal 12. There is.

The three power terminals 12 of the semiconductor module 10 are classified into a positive electrode terminal 12P, a negative electrode terminal 12N, and an output terminal 12A. The positive electrode terminal 12P and the negative electrode terminal 12N are electrically connected to a capacitor element (not shown) of a capacitor 5 which is a connecting device via a metal bus bar 16. The bus bar 16 is classified into a positive electrode bus bar 16P and a negative electrode bus bar 16N. Therefore, the capacitor 5 is electrically connected to the semiconductor module 10 via the bus bar 16, and is connected to the positive electrode terminal 12P via the positive electrode bus bar 16P and the negative electrode via the negative electrode bus bar 16N. It is connected to the terminal 12N. Welding is used for both the connection between the positive electrode bus bar 16P and the positive electrode terminal 12P and the connection between the negative electrode bus bar 16N and the negative electrode terminal 12N.

Note that FIG. 1 describes a structure in which three positive electrode bus bars 16P and three negative electrode bus bars 16N protrude from the capacitor 5, but the three positive electrode bus bars 16P have the same potential, and the three negative electrode bus bars 16N also have the same potential. It is the same potential. Therefore, the three positive electrode bus bars 16P may be configured as one integrated bus bar, or the three negative electrode bus bars 16N may be configured as one integrated bus bar.

Each of the three output terminals 12A of the three semiconductor modules 10 is electrically connected to the three-phase connector 7 via a metal bus bar 18. Welding is used for the connection between the output terminal 12A and the bus bar 18.

The current flowing through each of the three bus bars 18 is detected by each of the three current sensors 9 held by the wiring holder 8. In this case, the current sensor 9 is configured as a connecting device electrically connected to the semiconductor module 10 via the bus bar 18. As shown in FIG. 2, the current sensor 9 is connected to the control circuit board 19, and the detection information thereof is transmitted to the control circuit board 19.

The control circuit board 19 controls the switching operation (on / off operation) of the switching element 14 built in the main body 11 of the semiconductor module 10 in order to convert the DC power supplied to the semiconductor module 10 into AC power. It is configured as follows. As the switching element 14, any switching element such as an IGBT (that is, an insulated gate bipolar transistor) or a MOSFET (that is, a MOS type field effect transistor) is typically used.

The capacitor 5 is electrically connected to the PN connector 6 via a metal bus bar 17. The bus bar 17 is classified into a positive electrode bus bar 17P and a negative electrode bus bar 17N. Therefore, the capacitor 5 is electrically connected to the positive electrode terminal (not shown) via the positive electrode bus bar 17P and is electrically connected to the negative electrode terminal (not shown) via the negative electrode bus bar 17N for connection with the PN connector 6. Is connected. Further, the PN connector 6 is configured as a connecting device electrically connected to the semiconductor module 10 via two buses 16 and 17 and a capacitor 5.

Each of the coolers 20 has a plurality of (six in FIG. 1) cooling pipes 23 through which the refrigerant w flows, and the plurality of cooling pipes 23 are the first direction X (also referred to as “stacking direction X”) in which the plurality of cooling pipes 23 are stacked. It is configured as a laminated cooler arranged in a laminated manner. Two cooling pipes 23 adjacent to each other among the plurality of cooling pipes 23 are arranged with the facing space S interposed therebetween. In the cooler 20, the refrigerant w that has flowed in through the inflow pipe 21 flows through the plurality of cooling pipes 23 in parallel in the second direction Y, then merges and flows out through the outflow pipe 22.

The cooling module 30 has a function of connecting each of the condenser 5 and the PN connector 6 to the cooler 20 so as to be thermally conductive. In the present embodiment, the condenser 5 which is the first connection device and the PN connector 6 which is the second connection device are arranged on both sides of the cooler 20 with the cooler 20 interposed therebetween. Further, the cooling module 30 is arranged between the condenser 5 and the PN connector 6.

As shown in FIGS. 3 and 4, the cooling module 30 includes a metal cooling bus bar 35 capable of conducting heat between the main body 31 and each of the condenser 5 and the PN connector 6, and a cooler 20. It has a heat radiating unit 32 for radiating heat, an electric insulator 33, and a connection terminal 34 for connecting the cooling bus bar 35 and the heat radiating unit 32.

The main body portion 31 is configured as a resin mold portion in which a part of the heat radiating portion 32 and the connection terminal 34 is embedded by the resin material 31a. Both sides of the heat radiating portion 32 in the first direction X are exposed from the main body portion 31, and the exposed surfaces are covered with the electric insulator 33. Therefore, the heat radiating unit 32 is configured to be in contact with the cooling pipe 23 of the cooler 20 via the electrical insulator 33.

As shown in FIGS. 1 and 3, the cooling bus bar 35 is classified into a first cooling bus bar 35P and a second cooling bus bar 35N. On the other hand, the connection terminal 34 projects from the main body 31 in the same direction as the two power terminals 12 of the semiconductor module 10. The connection terminal 34 is arranged near the capacitor 5 and connected to one end of the first cooling bus bar 35P, and the connection terminal 34 is arranged near the PN connector 6 and connected to one end of the second cooling bus bar 35N. It is classified into the second connection terminal 34N.

As the connection structure between the connection terminal 34 and the cooling bus bar 35, welding which is the same as the connection structure between the power terminal 12 of the semiconductor module 10 and the bus bars 16 and 18 is used. Therefore, the first connection terminal 34P is connected to one end of the first cooling bus bar 35P by welding, and the second connection terminal 34N is connected to one end of the second cooling bus bar 35N by welding.

The first connection terminal 34P is connected to the capacitor 5 via the first cooling bus bar 35P, and the second connection terminal 34N is connected to the PN connector 6 via the second cooling bus bar 35N. In this case, the first cooling bus bar 35P and the second cooling bus bar 35N form a heat conduction path and also form a direct current energization path between the capacitor 5 and the PN connector 6.

The cooling module 30 has a main body portion 31 having the same dimensions as the main body portion 11 of the semiconductor module 10. In this case, the cooling module 30 has the same thickness as the main body 11 of the semiconductor module 10 (also referred to as “stacking direction X”) in the first direction X (also referred to as “stacking direction X”), which is the stacking direction of the plurality of cooling pipes 23 (in the facing space S). It has a main body portion 31 (thickness corresponding to the dimension of the first direction X). Therefore, the facing space S of the two cooling pipes 23 adjacent to each other can be used as a space for sandwiching the cooling module 30 from both sides.

As shown in FIG. 5, a semiconductor laminated unit is formed by a semiconductor module 10, a cooling module 30, and a cooler 20. In this semiconductor laminated unit, three semiconductor modules 10 and a plurality of cooling pipes 23 are alternately laminated and arranged in the first direction X. Further, although not particularly shown, the semiconductor module 10 is configured such that the heat radiating portion 15 (see FIG. 2) of the main body portion 11 is in contact with the cooling pipe 23 via an electric insulator similar to the electric insulator 33 in FIG. Has been done. Similarly, the two cooling modules 30 and the plurality of cooling pipes 23 are alternately stacked and arranged in the first direction X.

Therefore, each semiconductor module 10 is arranged in the corresponding facing space S and is sandwiched by two cooling pipes 23 from both side surfaces in the first direction X. In this case, each of the three semiconductor modules 10 is arranged in each of the three opposed spaces S continuously arranged in the first direction X among the five opposed spaces S. Further, like the semiconductor module 10, each cooling module 30 is also arranged in the corresponding facing space S and is sandwiched from both side surfaces in the first direction X by two cooling pipes 23. In this case, of the five facing spaces S, two cooling modules 30 are placed in each of the two facing spaces S continuously arranged in the first direction X separately from the facing space S in which the semiconductor module 10 is arranged. Is placed. As a result, the cooling pipe 23 of the cooler 20 has a function of cooling the cooling module 30 in addition to the original function of cooling the semiconductor module 10.

As shown in FIG. 6, the inverter circuit of the power converter 1 includes a three-phase leg. That is, the three-phase legs are connected in parallel to each other on the positive electrode side and the negative electrode side of the power supply 3.

Each leg is formed by an upper arm switching element 14u and a lower arm switching element 14d connected in series with each other. These upper arm switching elements 14u and lower arm switching elements 14d are built in the main body 11 of one semiconductor module 10.

The connection points between the upper arm switching element 14u and the lower arm switching element 14d in each leg are connected to the three electrodes of the motor 4 via the bus bar 18 and the three-phase connector 7 (see FIG. 1). Further, a flywheel diode is connected in antiparallel to each switching element 14.

Further, the two heat radiating portions 32 of the two cooling modules 30 are connected in parallel to each other on the positive electrode side and the negative electrode side of the power supply 3.

Next, the operation and effect of the above-mentioned first embodiment will be described.

In the power conversion device 1 described above, the cooler 20 has a function of cooling the semiconductor module 10 provided in the energization path between the power supply 3 and the motor 4. Further, the cooling module 30 connects each of the condenser 5 and the PN connector 6 electrically connected to the semiconductor module 10 via the buses 16 and 17 to the cooler 20 so as to be thermally conductive. At this time, both the condenser 5 and the PN connector 6 are indirectly cooled by using the cooling module 30 cooled by the cooler 20 which is a cooling source. That is, the heat of the condenser 5 and the PN connector 6 is transmitted from the heat radiating unit 32 of the cooling module 30 to the cooler 20 and radiated. Therefore, even when the bus bars 16 and 17 generate heat during energization, it is possible to prevent each of the capacitor 5 and the PN connector 6 electrically connected to the bus bars 16 and 17 from becoming hot. In particular, when the heat resistance of the capacitor 5 and the PN connector 6 which are connected devices is low, the influence of heat on these connected devices can be reduced by using the cooling module 30.

Further, the cooling function by the cooler 20 is used not only for cooling the semiconductor module 10 but also for cooling the condenser 5 and the PN connector 6 via the cooling module 30. That is, the cooler 20 is also used for cooling for the condenser 5 and the PN connector 6. Therefore, it is not necessary to provide a dedicated cooler for the condenser 5 and the PN connector 6, and it is possible to prevent the entire device from becoming large and the vehicle mountability from deteriorating.

Therefore, according to the first embodiment, the cooling performance of the capacitor 5 and the PN connector 6 electrically connected to the semiconductor module 10 via the bus bars 16 and 17 can be improved without increasing the size of the apparatus. The conversion device 1 can be provided.

In the above power conversion device 1, heat is dissipated by transferring heat from the heat radiating unit 32 of the cooling module 30 to the cooling pipe 23 of the cooler 20. As a result, both the condenser 5 connected to the first cooling bus bar 35P of the cooling module 30 and the PN connector 6 connected to the second cooling bus bar 35N are cooled. According to such a power conversion device 1, the structure of the cooling module 30 for cooling the capacitor 5 and the PN connector 6 can be simplified.

According to the power conversion device 1 described above, a cooling module for cooling the capacitor 5 and the PN connector 6 by using a bus bar for forming a direct current energization path between the PN connector 6 and the capacitor 5. 30 first cooling bus bars 35P and second cooling bus bars 35N can be constructed.

According to the power conversion device 1 described above, the cooling module 30 for cooling the condenser 5 and the PN connector 6 by using the cooler 20 for the semiconductor module 10 is arranged between the condenser 5 and the PN connector 6. Thereby, the bus bar length of the first cooling bus bar 35P extending between the first connection terminal 34P and the capacitor 5, and the second cooling bus bar 35N extending between the second connection terminal 34N and the PN connector 6. It is possible to keep the length of the capacitor short.

According to the power conversion device 1 described above, by matching the connection structure between the connection terminal 34 of the cooling module 30 and the cooling bus bar 35 with the same connection structure between the power terminal 12 of the semiconductor module 10 and the bus bars 16 and 18. , It is possible to prevent the cost from increasing due to the increase in manufacturing equipment related to connection. By using welding as this connection structure, the number of parts required for connection can be reduced.

According to the power conversion device 1 described above, by adopting a structure in which the cooling module 30 is sandwiched between two cooling pipes 23 of the cooler 20 which is a laminated cooler, the cooler is installed for the installation of the cooling module 30. This can be dealt with by increasing the number of laminated cooling pipes 23 of 20. In this case, it is possible to secure the space required for installing the cooling module 30 without significantly increasing the dimensions of the cooler 20.

According to the power conversion device 1 described above, by setting the main body 31 of the cooling module 30 to have the same thickness as the main body 11 of the semiconductor module 10, the dimensions of the facing spaces S of the plurality of cooling pipes 23 of the cooler 20 are set. Can be made constant. This can prevent the structure of the cooler 20 from becoming complicated.

Hereinafter, other embodiments related to the above-described first embodiment will be described with reference to the drawings. In other embodiments, the same elements as those in the first embodiment are designated by the same reference numerals, and the description of the same elements will be omitted.

(Embodiment 2)
As shown in FIGS. 7 and 8, the power conversion device 101 of the second embodiment has a different structure of the cooling module 130 from the cooling module 30 of the power conversion device 1 of the first embodiment.
Other configurations are the same as those in the first embodiment.

Compared with the cooling module 30, the cooling module 130 has the same structure in that it has a first connection terminal 34P and a second connection terminal 34N and a heat radiating portion 32 (see FIG. 8). 1 The structure is different in that it does not have a bus bar corresponding to the cooling bus bar 35P.

The second connection terminal 34N, which is one of the connection terminals 34 of the cooling module 130, is connected to one end of the cooling bus bar 35 by welding. Further, the cooling bus bar 35 is connected to three bus bars 18 which are bus bars on the output side of the semiconductor module 10 by a metal bus bar 18A. In this case, in the cooling module 130, the cooling bus bar 35 is thermally conductively connected to the bus bars 18 and 18A, and therefore is thermally conductively connected to the current sensor 9 as a connecting device via these bus bars 18 and 18A. It is configured to be. In the case of this configuration, the cooling bus bar 35 does not form an energization path, but forms only a heat conduction path.

Since only the second connection terminal 34N is substantially used in this cooling module 130, the first connection terminal 34P can be omitted. On the other hand, when it is necessary to consider the versatility of the connection between the cooling module 130 and various connecting devices, the cooling module 130 having the first connection terminal 34P and the second connection terminal 34N is used. Is preferable.

In the power conversion device 101 of the second embodiment, the cooling module 130 can conduct heat to and from the current sensor 9 via the cooling bus bar 35 and the bus bars 18 and 18A. This makes it possible to provide a power conversion device 101 capable of improving the cooling performance of the current sensor 9 electrically connected to the semiconductor module 10 via the bus bar 18 without increasing the size of the device.
Other than that, it has the same effect as that of the first embodiment.

As a modification particularly related to the second embodiment, a structure in which the bus bar 18A is connected to at least one of the three bus bars 18 and a cooling bus bar 35 are replaced with or added to the bus bar 18 and the bus bar 16 and the bus bar 17 are added. It is also possible to adopt a structure that connects to at least one of the above.

The present invention is not limited to the above-mentioned typical embodiments, and various applications and modifications can be considered as long as the object of the present invention is not deviated. For example, the following embodiments to which the above-described embodiments are applied can also be implemented.

In the above-described embodiment, the power conversion devices 1, 101 having three semiconductor modules 10 and two cooling modules 30 have been exemplified, but the numbers of the semiconductor modules 10 and the cooling modules 30 are exemplary. Yes, it can be changed as needed. In this case, the number of cooling pipes 23 of the cooler 20 can be determined according to the number of semiconductor modules 10 and cooling modules 30.

In the above-described embodiment, the case where the connection terminal 34 of the cooling module 30 and the cooling bus bar 35 are connected by welding has been illustrated, but instead, the connection terminal 34 and the cooling bus bar 35 are connected by bolting. Can also be adopted. In this case, in order to match the connection structure, it is preferable to adopt a structure in which the power terminal 12 of the semiconductor module 10 and the bus bars 16 and 18 are connected by bolting.

In the above-described embodiment, the structure in which the cooling module 30 is sandwiched between the two cooling pipes 23 of the cooler 20 has been exemplified, but instead, a structure in which the cooling module 30 is arranged outside the cooler 20 is adopted. You can also do it.

In the case of a structure in which the cooling module 30 is sandwiched between the two cooling pipes 23 of the cooler 20, if the main body 31 of the cooling module 30 has the same thickness as the main body 11 of the semiconductor module 10 in the first direction X, the main body The dimension of the second direction Y and the dimension of the third direction Z of 31 may be different from those of the main body portion 11. Alternatively, it is possible to adopt a structure in which the thickness of the main body portion 31 of the cooling module 30 in the first direction X is different from the thickness of the main body portion 11 in the first direction X.

In the above-described embodiment, the capacitor 5, the PN connector 6, and the current sensor 9 are exemplified as the connecting devices electrically connected to the semiconductor module 10 via the buses 16, 17, and 18, but the connecting devices include a reactor and the like. It is also possible to adopt the equipment of.

In the above-described embodiment, the laminated cooler 20 in which both side surfaces of the semiconductor module 10 are sandwiched between the two cooling pipes 23 for cooling has been exemplified, but the cooler is not limited to this cooler 20. For example, instead of the cooler 20, a cooler having a structure for cooling one side of the semiconductor module 10 can be adopted.

In the above-described embodiment, the semiconductor module 10 is arranged in each of the three continuous facing spaces S out of the five facing spaces S of the cooler 20, and the cooling module 30 is arranged in each of the two continuous facing spaces S. Although the case where the semiconductor module 10 and the cooling module 30 are arranged is illustrated, the facing space S in which the semiconductor module 10 and the cooling module 30 are arranged is not limited to this, and can be appropriately selected as needed.

For example, the semiconductor module 10 and the cooling module 30 may be arranged alternately in the five facing spaces S, or may be randomly arranged in the five facing spaces S. Further, the semiconductor module 10 and the cooling module 30 can be arranged side by side in one facing space S. Further, an empty facing space S in which neither the semiconductor module 10 nor the cooling module 30 is arranged may be provided.

In the above-described embodiment, the case where the cooler 20 and the cooling module 30 are arranged between the condenser 5 and the PN connector 6 which are the connecting devices has been illustrated, but the cooling device 20 and the cooling module for these connecting devices have been illustrated. The arrangement of each of the 30 is not limited to this, and can be changed as needed.

1,101 Power converter 3 Power supply 4 Motor 5 Capacitor (Connected equipment, 1st connected equipment)
6 PN connector (connected device, second connected device)
9 Current sensor (connected device)
10 Semiconductor module 11 Main body 12 Power terminal 14 Switching element 16, 17, 18 Bus bar 20 Cooler 23 Cooling tube 30, 130 Cooling module 32 Heat dissipation part 31 Main body 34 Connection terminal 34P 1st connection terminal 34N 2nd connection terminal 35 Cooling bus bar 35P 1st cooling bus bar 35N 2nd cooling bus bar S Opposing space X 1st direction (stacking direction)

Claims (8)

A semiconductor module (10) provided in the energization path between the power supply (3) and the motor (4), and
A cooler (20) for cooling the semiconductor module and
Connecting devices (5, 6, 9) electrically connected to the semiconductor module via a bus bar (16, 17, 18), and
A cooling module (30, 130) that connects the connected device to the cooler so that heat can be conducted, and
A power conversion device (1,101). The cooling module connects a cooling bus bar (35) capable of conducting heat with the connected device, a heat radiating section (32) for radiating heat to the cooler, and the cooling bus bar and the radiating section. The power conversion device according to claim 1, further comprising a connection terminal (34). Each of the first connection device (5) and the second connection device (6) as the connection devices is arranged on both sides of the cooler.
The cooling module is arranged between the first connection device and the second connection device, and has a first connection terminal (34P) and a second connection terminal (34N) as the connection terminals. The first connection terminal is connected to the first connection device via the first cooling bus bar (35P) as the cooling bus bar, and the second connection terminal is connected to the second cooling bus bar (35N) as the cooling bus bar. The power conversion device according to claim 2, which is configured to be connected to the second connection device. The second connection device is a PN connector (6) electrically connected to the power supply.
According to claim 3, the cooling module is configured such that the first cooling bus bar and the second cooling bus bar form an energization path for direct current between the first connection device and the PN connector. The power converter described. The power conversion device according to any one of claims 2 to 4, wherein the cooling module is configured so that the cooling bus bar is thermally conductively connected to the bus bar. The cooling module has the same connection structure between the connection terminal and the cooling bus bar as the connection structure between the power terminal (12) of the semiconductor module and the bus bar, according to any one of claims 2 to 5. The power converter described. Each of the above coolers has a plurality of cooling pipes (23) through which the refrigerant flows, and two cooling pipes (23) adjacent to each other of the plurality of cooling pipes are laminated and arranged with the facing space (S) interposed therebetween. It is a laminated cooler,
The power conversion device according to any one of claims 1 to 6, wherein the semiconductor module and the cooling module are arranged in the facing space and sandwiched between the two cooling pipes. The semiconductor module has a main body portion (11) having a built-in switching element (14).
The power conversion device according to claim 7, wherein the cooling module has a main body portion (31) having the same thickness as the main body portion of the semiconductor module in the stacking direction (X) of the plurality of cooling pipes.

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