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JP6975344B2 - パターニングプロセスについての情報を決定する方法、測定データにおける誤差を低減する方法、メトロロジプロセスを較正する方法、メトロロジターゲットを選択する方法 - Google Patents
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JP6975344B2 - パターニングプロセスについての情報を決定する方法、測定データにおける誤差を低減する方法、メトロロジプロセスを較正する方法、メトロロジターゲットを選択する方法 - Google Patents

パターニングプロセスについての情報を決定する方法、測定データにおける誤差を低減する方法、メトロロジプロセスを較正する方法、メトロロジターゲットを選択する方法 Download PDF

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JP6975344B2
JP6975344B2 JP2020547286A JP2020547286A JP6975344B2 JP 6975344 B2 JP6975344 B2 JP 6975344B2 JP 2020547286 A JP2020547286 A JP 2020547286A JP 2020547286 A JP2020547286 A JP 2020547286A JP 6975344 B2 JP6975344 B2 JP 6975344B2
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Prior art keywords
metrology
target
overlay
pupil
radiation
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JP2020547286A
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Japanese (ja)
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JP2021505973A (ja
Inventor
フェンセラール、ヨアネス、ジッセ
ツィアトマス、アナグノスティス
レーマン、サミー、ウル
ハイネン、ポール、クリスティアン
バッセン、ジャン−ピエール、アグネス、ヘンリクス、マリー
ヴァイス、ニコラス、マウリシオ
サングイネッティ、ゴンサロ、ロベルト
ツァハロプーロ、トマイ
ザール、マルティユン、マリア
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ASML Netherlands BV
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ASML Netherlands BV
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G03F7/706837—Data analysis, e.g. filtering, weighting, flyer removal, fingerprints or root cause analysis
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10—Complex mathematical operations
    • G06F17/11—Complex mathematical operations for solving equations, e.g. nonlinear equations, general mathematical optimization problems
    • G06F17/12—Simultaneous equations, e.g. systems of linear equations

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Computational Mathematics (AREA)
  • Mathematical Analysis (AREA)
  • Mathematical Optimization (AREA)
  • Pure & Applied Mathematics (AREA)
  • Data Mining & Analysis (AREA)
  • Theoretical Computer Science (AREA)
  • Operations Research (AREA)
  • Databases & Information Systems (AREA)
  • Software Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Algebra (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2020547286A 2017-12-04 2018-11-14 パターニングプロセスについての情報を決定する方法、測定データにおける誤差を低減する方法、メトロロジプロセスを較正する方法、メトロロジターゲットを選択する方法 Active JP6975344B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP17205158.3A EP3492985A1 (en) 2017-12-04 2017-12-04 Method of determining information about a patterning process, method of reducing error in measurement data, method of calibrating a metrology process, method of selecting metrology targets
EP17205158.3 2017-12-04
PCT/EP2018/081224 WO2019110254A1 (en) 2017-12-04 2018-11-14 Method of determining information about a patterning process, method of reducing error in measurement data, method of calibrating a metrology process, method of selecting metrology targets

Publications (2)

Publication Number Publication Date
JP2021505973A JP2021505973A (ja) 2021-02-18
JP6975344B2 true JP6975344B2 (ja) 2021-12-01

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JP2020547286A Active JP6975344B2 (ja) 2017-12-04 2018-11-14 パターニングプロセスについての情報を決定する方法、測定データにおける誤差を低減する方法、メトロロジプロセスを較正する方法、メトロロジターゲットを選択する方法

Country Status (8)

Country Link
US (2) US11022897B2 (he)
EP (1) EP3492985A1 (he)
JP (1) JP6975344B2 (he)
KR (1) KR102483364B1 (he)
CN (1) CN111433679B (he)
IL (1) IL274834B2 (he)
TW (1) TWI711891B (he)
WO (1) WO2019110254A1 (he)

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IL279727B2 (he) * 2019-12-24 2025-03-01 Asml Netherlands Bv שיטת קביעת מידע אודות הליך דפוסים, שיטת הפחתת שגיאה בנתוני מדידה, שיטת כיול תהליך מטרולוגיה, שיטת בחירת יעדי מטרולוגיה
US11355165B2 (en) 2020-04-27 2022-06-07 Micron Technology, Inc. Adjusting parameters of channel drivers based on temperature
EP3961304A1 (en) * 2020-08-31 2022-03-02 ASML Netherlands B.V. Mapping metrics between manufacturing systems
EP4040233A1 (en) * 2021-02-03 2022-08-10 ASML Netherlands B.V. A method of determining a measurement recipe and associated metrology methods and appratuses
EP4113210A1 (en) * 2021-07-01 2023-01-04 ASML Netherlands B.V. A method of monitoring a measurement recipe and associated metrology methods and apparatuses
WO2023025506A1 (en) * 2021-08-26 2023-03-02 Asml Netherlands B.V. Method for determing a measurement recipe and associated apparatuses
US12020970B2 (en) * 2021-09-22 2024-06-25 International Business Machines Corporation Metrology data correction
EP4191338A1 (en) 2021-12-03 2023-06-07 ASML Netherlands B.V. Metrology calibration method
CN114278281B (zh) * 2021-12-24 2023-11-21 北京西华益昌技术开发有限责任公司 测量装置的测量分辨率优化方法、装置、设备及存储介质
US12455509B2 (en) 2022-02-24 2025-10-28 Nanya Technology Corporation Semiconductor structure and system for manufacturing the same
TWI799296B (zh) * 2022-02-24 2023-04-11 南亞科技股份有限公司 半導體結構的製備方法
CN115035056B (zh) * 2022-05-31 2024-04-30 华南理工大学 基于微分几何的柔性ic基板线路刻蚀缺陷检测方法及系统
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CN115932530B (zh) * 2023-01-09 2023-06-02 东莞市兆恒机械有限公司 一种半导体检测设备标定的方法
CN115983738B (zh) * 2023-03-21 2023-06-27 广东仁懋电子有限公司 一种用于提升氮化镓制备效率的方法和装置
CN119828425B (zh) * 2025-03-20 2025-07-08 晶芯成(北京)科技有限公司 误差补偿的确定方法、半导体结构及其制造方法

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NL1036098A1 (nl) * 2007-11-08 2009-05-11 Asml Netherlands Bv Inspection method and apparatus, lithographic apparatus lithographic, processing cell and device manufacturing method.
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Also Published As

Publication number Publication date
KR20200077590A (ko) 2020-06-30
TW201937297A (zh) 2019-09-16
KR102483364B1 (ko) 2022-12-29
IL274834B1 (he) 2023-05-01
US11022897B2 (en) 2021-06-01
JP2021505973A (ja) 2021-02-18
CN111433679A (zh) 2020-07-17
EP3492985A1 (en) 2019-06-05
IL274834A (he) 2020-07-30
IL274834B2 (he) 2023-09-01
WO2019110254A1 (en) 2019-06-13
US11604419B2 (en) 2023-03-14
US20210255552A1 (en) 2021-08-19
TWI711891B (zh) 2020-12-01
US20190171115A1 (en) 2019-06-06
CN111433679B (zh) 2023-04-07

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