JP6975663B2

JP6975663B2 - Switch module

Info

Publication number: JP6975663B2
Application number: JP2018036781A
Authority: JP
Inventors: 貴之佐藤
Original assignee: Alps Electric Co Ltd; Alps Alpine Co Ltd
Current assignee: Alps Alpine Co Ltd
Priority date: 2018-03-01
Filing date: 2018-03-01
Publication date: 2021-12-01
Anticipated expiration: 2038-03-01
Also published as: CN110223871B; JP2019153429A; CN110223871A

Description

本発明は、スイッチモジュールに関する。 The present invention relates to a switch module.

近年、スマートフォンやタブレット端末などのサイドキーや、薄型フレームレスＴＶの操作スイッチとして、狭幅かつ薄型のスイッチモジュールがもとめられている。また、スマートフォンなどでは、防塵及び防水のために、スイッチモジュールに高い密閉性が要求されることもある。 In recent years, narrow and thin switch modules have been sought as side keys for smartphones and tablet terminals and operation switches for thin frameless TVs. Further, in smartphones and the like, the switch module may be required to have a high degree of airtightness in order to be dustproof and waterproof.

従来、狭幅かつ薄型のスイッチモジュールとして、固定接点を有するＦＰＣ（Flexible Printed Circuits）と、ＦＰＣの表面に設けられたドーム状の可動接点と、粘着テープによりＦＰＣの表面に貼付されたシート部材と、を備えたものが知られている。このスイッチモジュールでは、粘着テープの貼り代を広くすることにより、高い密閉性を得ることができる。 Conventionally, as a narrow and thin switch module, FPCs (Flexible Printed Circuits) having fixed contacts, dome-shaped movable contacts provided on the surface of the FPC, and sheet members attached to the surface of the FPC with adhesive tape. , Are known. In this switch module, high airtightness can be obtained by widening the adhesive tape sticking allowance.

特開２０１７−１１７５９３号公報Japanese Unexamined Patent Publication No. 2017-117593

しかしながら、上記従来のスイッチモジュールは、粘着テープの貼り代を確保する必要があるため、狭幅化に限界があった。 However, in the above-mentioned conventional switch module, there is a limit in narrowing the width because it is necessary to secure a margin for sticking the adhesive tape.

本発明は、上記の課題に鑑みてなされたものであり、高い密閉性を有する狭幅かつ薄型のスイッチモジュールを提供することを目的とする。 The present invention has been made in view of the above problems, and an object of the present invention is to provide a narrow and thin switch module having high airtightness.

一実施形態に係るスイッチモジュールは、第１面に固定接点を有する配線基板と、前記配線基板の前記第１面に、前記固定接点と接触可能に配置された可動接点と、前記配線基板の前記第１面を覆う第１部分と、前記第１部分から延び、前記配線基板の第１側面を覆う第２部分と、前記第２部分から延び、前記配線基板の第２面の一部を覆う第３部分と、前記第１部分から延び、前記配線基板の前記第１側面と対向する第２側面を覆う第４部分と、前記第４部分から延び、前記配線基板の前記第２面の一部を覆う第５部分と、を有するシート部材と、前記配線基板と前記シート部材との間に設けられた粘着剤層と、を備える。 The switch module according to the embodiment includes a wiring board having a fixed contact on the first surface, a movable contact arranged so as to be in contact with the fixed contact on the first surface of the wiring board, and the wiring board. A first portion that covers the first surface, a second portion that extends from the first portion and covers the first side surface of the wiring board, and a second portion that extends from the second portion and covers a part of the second surface of the wiring board. A third portion, a fourth portion extending from the first portion and covering a second side surface facing the first side surface of the wiring board, and one of the second surfaces extending from the fourth portion and covering the second side surface of the wiring board. A sheet member having a fifth portion covering the portion, and an adhesive layer provided between the wiring board and the sheet member are provided.

本発明の各実施形態によれば、高い密閉性を有する狭幅かつ薄型のスイッチモジュールを実現できる。 According to each embodiment of the present invention, a narrow and thin switch module having high airtightness can be realized.

スイッチモジュールの一例を示す平面図。The plan view which shows an example of a switch module. 図１のスイッチモジュールのＡ−Ａ線断面図。FIG. 1 is a sectional view taken along line AA of the switch module of FIG. 図１のスイッチモジュールの分解斜視図。An exploded perspective view of the switch module of FIG. 図２の変形例を示す図。The figure which shows the modification of FIG.

以下、本発明の各実施形態について、添付の図面を参照しながら説明する。なお、各実施形態に係る明細書及び図面の記載に関して、実質的に同一の機能構成を有する構成要素については、同一の符号を付することにより重畳した説明を省略する。 Hereinafter, each embodiment of the present invention will be described with reference to the accompanying drawings. Regarding the description of the specification and the drawings according to each embodiment, the components having substantially the same functional configuration are designated by the same reference numerals, and the superimposed description will be omitted.

一実施形態に係るスイッチモジュール１００について、図１〜図４を参照して説明する。図１は、スイッチモジュール１００の一例を示す平面図である。図２は、図１のスイッチモジュール１００のＡ−Ａ線断面図である。図３は、図１のスイッチモジュール１００の分解斜視図である。図４は、図２の変形例を示す図である。 The switch module 100 according to the embodiment will be described with reference to FIGS. 1 to 4. FIG. 1 is a plan view showing an example of the switch module 100. FIG. 2 is a sectional view taken along line AA of the switch module 100 of FIG. FIG. 3 is an exploded perspective view of the switch module 100 of FIG. FIG. 4 is a diagram showing a modification of FIG. 2.

図１〜図３に示すように、スイッチモジュール１００は、配線基板１と、可動接点２と、シート部材３と、粘着剤層４と、を備える。以下、便宜的に、配線基板１の第１面（図２における上側の面）を表面、第２面（図２における下側の面）を裏面と称して説明するが、表面及び裏面は、逆であってもよい。 As shown in FIGS. 1 to 3, the switch module 100 includes a wiring board 1, a movable contact 2, a sheet member 3, and an adhesive layer 4. Hereinafter, for convenience, the first surface (upper surface in FIG. 2) of the wiring board 1 will be referred to as a front surface, and the second surface (lower surface in FIG. 2) will be referred to as a back surface. The reverse may be true.

配線基板１は、表面１１に配線パターン（図示省略）を形成された薄型の基板である。配線パターンは、配線基板１の裏面１２や内部にも形成され得る。配線基板１は、例えば、ＦＰＣであるが、これに限られない。図１の例では、配線基板１の平面視形状は、長辺及び短辺を有する矩形である。配線基板１の短辺の長さが、配線基板１の幅Ｗに相当する。幅Ｗは、例えば、５ｍｍ以下である。また、配線基板１の長辺に対応する２つの側面のうち、一方の側面（図２における左側面）を第１側面１３、第１側面１３と対向する他方の側面（図２における右側面）を第２側面１４と称する。第１側面１３及び第２側面１４の高さＨ（配線基板１の厚さ）は、例えば、１ｍｍ以下である。なお、配線基板１の平面視形状は、矩形に限られず、幅Ｗが５ｍｍ以下の狭幅部分を有する任意の形状とすることができる。配線基板１は、固定接点１５を有する。 The wiring board 1 is a thin board having a wiring pattern (not shown) formed on the surface 11. The wiring pattern can also be formed on the back surface 12 of the wiring board 1 or inside. The wiring board 1 is, for example, an FPC, but the wiring board 1 is not limited to this. In the example of FIG. 1, the plan view shape of the wiring board 1 is a rectangle having a long side and a short side. The length of the short side of the wiring board 1 corresponds to the width W of the wiring board 1. The width W is, for example, 5 mm or less. Further, of the two side surfaces corresponding to the long sides of the wiring board 1, one side surface (left side surface in FIG. 2) is the first side surface 13 and the other side surface facing the first side surface 13 (right side surface in FIG. 2). Is referred to as a second side surface 14. The height H (thickness of the wiring board 1) of the first side surface 13 and the second side surface 14 is, for example, 1 mm or less. The plan view shape of the wiring board 1 is not limited to a rectangle, and may be any shape having a narrow portion having a width W of 5 mm or less. The wiring board 1 has a fixed contact 15.

固定接点１５は、配線基板１の表面１１に、金属やカーボンなどの導電体で形成された接点であり、配線パターンに接続される。固定接点１５は、可動接点２と接離可能な位置に配置された中央接点１５ａと、可動接点２と常時接触している外側接点１５ｂと、を含み（図３参照）、中央接点１５ａと外側接点１５ｂとは電気的に接続されていない。スイッチモジュール１００は、中央接点１５ａと外側接点１５ｂとの電気的な接続状態が、中央接点１５ａと可動接点２との接触状態により切り替わり、ＯＮ信号とＯＦＦ信号を出力する。スイッチモジュール１００は、中央接点１５ａが可動接点２から離間している場合、配線パターンを介してＯＦＦ信号を出力し、中央接点１５ａに可動接点２が接触している場合、配線パターンを介してＯＮ信号を出力する。 The fixed contact 15 is a contact formed of a conductor such as metal or carbon on the surface 11 of the wiring board 1, and is connected to the wiring pattern. The fixed contact 15 includes a central contact 15a arranged at a position where it can be contacted and separated from the movable contact 2 and an outer contact 15b that is in constant contact with the movable contact 2 (see FIG. 3), and the central contact 15a and the outside. It is not electrically connected to the contact 15b. The switch module 100 switches the electrical connection state between the central contact 15a and the outer contact 15b depending on the contact state between the central contact 15a and the movable contact 2, and outputs an ON signal and an OFF signal. The switch module 100 outputs an OFF signal via the wiring pattern when the central contact 15a is separated from the movable contact 2, and turns on via the wiring pattern when the movable contact 2 is in contact with the central contact 15a. Output a signal.

可動接点２は、金属やカーボンなどの導電体で形成されたドーム状の接点であり、配線基板１の表面１１に配置される。可動接点２は、外縁部が外側接点１５ｂに常時接触するように配置される。また、可動接点２は、ユーザにより押下された際に中央接点１５ａと接触可能なように、中央接点１５ａの上方を覆うように配置される。可動接点２は、ユーザにより押下されると反転動作し、ドーム状部の頂部の裏面が中央接点１５ａの表面と接触する。また、可動接点２が中央接点１５ａに接触した状態で、ユーザが可動接点２の押下をやめると、可動接点２は復元動作し、中央接点１５ａから離間する。 The movable contact 2 is a dome-shaped contact formed of a conductor such as metal or carbon, and is arranged on the surface 11 of the wiring board 1. The movable contact 2 is arranged so that the outer edge portion is in constant contact with the outer contact 15b. Further, the movable contact 2 is arranged so as to cover the upper part of the central contact 15a so that the movable contact 2 can come into contact with the central contact 15a when pressed by the user. When the movable contact 2 is pressed by the user, the movable contact 2 reverses and the back surface of the top of the dome-shaped portion comes into contact with the front surface of the central contact 15a. Further, when the user stops pressing the movable contact 2 while the movable contact 2 is in contact with the central contact 15a, the movable contact 2 is restored and separated from the central contact 15a.

可動接点２は、平面視形状が大きい方が好ましい。言い換えると、可動接点２と配線基板１の長辺（第１側面１３及び第２側面１４）との間の距離は、小さい方が好ましい。可動接点２と配線基板１の長辺との間の部分は、シート部材３の貼り代に相当する。可動接点２と配線基板１の一方の長辺（第１側面１３）との間の最小距離Ｌ１は、例えば、１ｍｍ以下である。また、可動接点２と配線基板１の他方の長辺（第２側面１４）との間の最小距離Ｌ２は、例えば、１ｍｍ以下である。このように、可動接点２の平面視形状を大きくすることにより、ユーザが押下した際の可動接点２の上下方向の移動量を大きくし、可動接点２の操作感を向上させることができる。また、操作耐久性を向上させることもできる。 The movable contact 2 preferably has a large plan view shape. In other words, the distance between the movable contact 2 and the long side (first side surface 13 and second side surface 14) of the wiring board 1 is preferably small. The portion between the movable contact 2 and the long side of the wiring board 1 corresponds to the sticking allowance of the sheet member 3. The minimum distance L1 between the movable contact 2 and one long side (first side surface 13) of the wiring board 1 is, for example, 1 mm or less. Further, the minimum distance L2 between the movable contact 2 and the other long side (second side surface 14) of the wiring board 1 is, for example, 1 mm or less. By increasing the plan view shape of the movable contact 2 in this way, it is possible to increase the amount of movement of the movable contact 2 in the vertical direction when the user presses the movable contact 2, and improve the operational feeling of the movable contact 2. In addition, the operation durability can be improved.

図１の例では、可動接点２の平面視形状は、サイドカット形状である。ここでいうサイドカット形状は、図１に示すように、円形から、対向する端部（図１の例では、上下の端部）を直線的に除去した形状であり、対向する２つの円弧部分と、対向する２つの直線部分と、を有する。サイドカット形状を有する可動接点２は、直線部分が配線基板１の長辺（第１側面１３及び第２側面１４）と平行になるように配置される。この場合、第１側面１３と、可動接点２の第１側面１３に近い側の直線部分と、の間の距離が距離Ｌ１に相当する。また、第２側面１４と、可動接点２の第２側面１４に近い側の直線部分と、の間の距離が距離Ｌ２に相当する。 In the example of FIG. 1, the plan view shape of the movable contact 2 is a side cut shape. As shown in FIG. 1, the side cut shape referred to here is a shape in which opposite end portions (upper and lower ends in the example of FIG. 1) are linearly removed from a circle, and two opposing arc portions are formed. And two opposing linear portions. The movable contact 2 having a side cut shape is arranged so that the straight line portion is parallel to the long side (first side surface 13 and second side surface 14) of the wiring board 1. In this case, the distance between the first side surface 13 and the straight line portion on the side of the movable contact 2 near the first side surface 13 corresponds to the distance L1. Further, the distance between the second side surface 14 and the straight line portion on the side of the movable contact 2 near the second side surface 14 corresponds to the distance L2.

このような構成により、可動接点２の平面視形状を円形にする場合と比べて、可動接点２の平面視形状をより大きくすることができる。すなわち、半径寸法が配線基板１の幅寸法（短辺の寸法）より大きい円形の可動接点を配置したのと同様の効果を得ることができる。この結果、ユーザが押下した際の可動接点２の上下方向の移動量を大きくし、可動接点２の操作感を向上させることができる。なお、可動接点２の平面視形状は、サイドカット形状に限られず、円形や楕円形などの任意の形状で有り得る。 With such a configuration, the plan view shape of the movable contact 2 can be made larger than that in the case where the plan view shape of the movable contact 2 is made circular. That is, it is possible to obtain the same effect as arranging circular movable contacts whose radial dimension is larger than the width dimension (short side dimension) of the wiring board 1. As a result, the amount of movement of the movable contact 2 in the vertical direction when pressed by the user can be increased, and the operational feeling of the movable contact 2 can be improved. The plan view shape of the movable contact 2 is not limited to the side cut shape, and may be any shape such as a circular shape or an elliptical shape.

シート部材３は、配線基板１及び可動接点２を覆い、スイッチモジュール１００の内側を密閉する部材である。シート部材３は、配線基板１の表面に配置された絶縁性シートの両側を、配線基板１の裏面に向かって折り返すことにより形成される。シート部材３は、例えば、ＰＥＴ（Polyethylene Terephthalate）シートであるが、これに限られない。シート部材３は、図２に示すように、第１部分３１と、第２部分３２と、第３部分３３と、第４部分３４と、第５部分３５と、を有する。 The seat member 3 is a member that covers the wiring board 1 and the movable contact 2 and seals the inside of the switch module 100. The sheet member 3 is formed by folding both sides of an insulating sheet arranged on the front surface of the wiring board 1 toward the back surface of the wiring board 1. The sheet member 3 is, for example, a PET (Polyethylene Terephthalate) sheet, but is not limited thereto. As shown in FIG. 2, the sheet member 3 has a first portion 31, a second portion 32, a third portion 33, a fourth portion 34, and a fifth portion 35.

第１部分３１は、配線基板１の表面１１を覆う部分である。可動接点２は、第１部分３１により覆われることにより、配線基板１の表面１１上で固定される。第１部分３１は、配線基板１の表面１１の貼り代（可動接点２と配線基板１の長辺との間の部分）に設けられた粘着剤層４により、配線基板１の表面１１に貼付される。 The first portion 31 is a portion that covers the surface 11 of the wiring board 1. The movable contact 2 is fixed on the surface 11 of the wiring board 1 by being covered with the first portion 31. The first portion 31 is attached to the surface 11 of the wiring board 1 by the adhesive layer 4 provided on the attachment allowance (the portion between the movable contact 2 and the long side of the wiring board 1) of the surface 11 of the wiring board 1. Will be done.

第２部分３２は、配線基板１の第１側面１３を覆う部分であり、第１部分３１の一端（図２の例では、第１部分３１の左端）から延びる。第２部分３２は、配線基板１の第１側面１３に設けられた粘着剤層４により、第１側面１３に貼付される。 The second portion 32 is a portion that covers the first side surface 13 of the wiring board 1 and extends from one end of the first portion 31 (in the example of FIG. 2, the left end of the first portion 31). The second portion 32 is attached to the first side surface 13 by the pressure-sensitive adhesive layer 4 provided on the first side surface 13 of the wiring board 1.

第３部分３３は、配線基板１の裏面１２の一部を覆う部分であり、第２部分３２（図２の例では、第２部分３２の下端）から延びる。第３部分３３は、配線基板１の裏面１２に設けられた粘着剤層４により、配線基板１の裏面１２に貼付される。 The third portion 33 is a portion that covers a part of the back surface 12 of the wiring board 1 and extends from the second portion 32 (in the example of FIG. 2, the lower end of the second portion 32). The third portion 33 is attached to the back surface 12 of the wiring board 1 by the adhesive layer 4 provided on the back surface 12 of the wiring board 1.

第４部分３４は、配線基板１の第２側面１４を覆う部分であり、第１部分３１の他端（図２の例では、第１部分３１の右端）から延びる。第４部分３４は、配線基板１の第２側面１４に設けられた粘着剤層４により、第２側面１４に貼付される。 The fourth portion 34 is a portion that covers the second side surface 14 of the wiring board 1 and extends from the other end of the first portion 31 (in the example of FIG. 2, the right end of the first portion 31). The fourth portion 34 is attached to the second side surface 14 by the pressure-sensitive adhesive layer 4 provided on the second side surface 14 of the wiring board 1.

第５部分３５は、配線基板１の裏面１２の一部を覆う部分であり、第４部分３４（図２の例では、第４部分３４の下端）から延びる。第５部分３５は、配線基板１の裏面１２に設けられた粘着剤層４により、配線基板１の裏面１２に貼付される。 The fifth portion 35 is a portion that covers a part of the back surface 12 of the wiring board 1 and extends from the fourth portion 34 (in the example of FIG. 2, the lower end of the fourth portion 34). The fifth portion 35 is attached to the back surface 12 of the wiring board 1 by the adhesive layer 4 provided on the back surface 12 of the wiring board 1.

図２からわかるように、第２部分３２は、第１部分３１及び第３部分３３に対して屈曲している。同様に、第４部分３４は、第１部分３１及び第５部分３５に対して屈曲している。また、配線基板１が狭幅であるため、第２部分３２〜第５部分３５と、粘着剤層４と、の接触面積は小さい。このため、シート部材３は、第２部分３２及び第４部分３４で生じる反発力（平らに戻ろうとする力）により、配線基板１からはがれやすくなっている。 As can be seen from FIG. 2, the second portion 32 is bent with respect to the first portion 31 and the third portion 33. Similarly, the fourth portion 34 is bent with respect to the first portion 31 and the fifth portion 35. Further, since the wiring board 1 has a narrow width, the contact area between the second portion 32 to the fifth portion 35 and the adhesive layer 4 is small. Therefore, the sheet member 3 is easily peeled off from the wiring board 1 due to the repulsive force (force to return to flatness) generated in the second portion 32 and the fourth portion 34.

そこで、本実施形態では、第２部分３２で生じる反発力を抑制するために、第２部分３２は、第１部分３１及び第３部分３３より薄く形成されるのが好ましい。同様に、第４部分３４で生じる反発力を抑制するために、第４部分３４は、第１部分３１及び第５部分３５より薄く形成されるのが好ましい。 Therefore, in the present embodiment, in order to suppress the repulsive force generated in the second portion 32, the second portion 32 is preferably formed thinner than the first portion 31 and the third portion 33. Similarly, in order to suppress the repulsive force generated in the fourth portion 34, the fourth portion 34 is preferably formed thinner than the first portion 31 and the fifth portion 35.

また、本実施形態では、第２部分３２で生じる反発力を抑制するために、第２部分３２は、表面に第１側面１３（配線基板１の長辺）と平行な複数の凹部３６を形成されるのが好ましい。同様に、第４部分３４で生じる反発力を抑制するために、第４部分３４は、表面に第２側面１４（配線基板１の長辺）と平行な複数の凹部３７を形成されるのが好ましい。 Further, in the present embodiment, in order to suppress the repulsive force generated in the second portion 32, the second portion 32 forms a plurality of recesses 36 parallel to the first side surface 13 (long side of the wiring board 1) on the surface. It is preferable to be done. Similarly, in order to suppress the repulsive force generated in the fourth portion 34, the fourth portion 34 is formed with a plurality of recesses 37 parallel to the second side surface 14 (the long side of the wiring board 1) on the surface thereof. preferable.

第２部分３２及び第４部分３４の薄化や凹部３６，３７の形成は、レーザ加工やブラスト加工により、第２部分３２及び第４部分３４の表面を削ることによって実現できる。第２部分３２及び第４部分３４の薄化や凹部３６，３７の形成は、シート部材３を配線基板１に貼付した後に行われてもよいし、シート部材３を配線基板１に貼付する前に予め行われてもよい。 The thinning of the second portion 32 and the fourth portion 34 and the formation of the recesses 36 and 37 can be realized by scraping the surfaces of the second portion 32 and the fourth portion 34 by laser processing or blast processing. The thinning of the second portion 32 and the fourth portion 34 and the formation of the recesses 36 and 37 may be performed after the sheet member 3 is attached to the wiring board 1, or before the sheet member 3 is attached to the wiring board 1. It may be done in advance.

第２部分３２及び第４部分３４は、シート部材３を配線基板１に貼付することにより形成されるため、シート部材３の貼付前には、まだ形成されていない。したがって、シート部材３を貼付する前に薄化を行う場合には、シート部材３における第２部分３２及び第４部分３４に対応する部分を薄化すればよい。この際、シート部材３における第２部分３２及び第４部分３４に対応する部分より広い範囲を薄化するのが好ましい。これにより、シート部材３を配線基板１に貼付した際に位置ずれが発生した場合であっても、薄化された部分を第２部分３２及び第４部分３４とすることができる。 Since the second portion 32 and the fourth portion 34 are formed by attaching the sheet member 3 to the wiring board 1, they have not yet been formed before the sheet member 3 is attached. Therefore, when the sheet member 3 is thinned before being attached, the portions of the sheet member 3 corresponding to the second portion 32 and the fourth portion 34 may be thinned. At this time, it is preferable to thin a wider range than the portion corresponding to the second portion 32 and the fourth portion 34 in the seat member 3. As a result, even if the position shift occurs when the sheet member 3 is attached to the wiring board 1, the thinned portions can be designated as the second portion 32 and the fourth portion 34.

同様に、シート部材３を貼付する前に凹部３６，３７を形成する場合には、シート部材３における第２部分３２及び第４部分３４に対応する部分に凹部３６，３７を形成すればよい。この際、シート部材３における第２部分３２及び第４部分３４に対応する部分より広い範囲に凹部３６，３７を形成するのが好ましい。これにより、シート部材３を配線基板１に貼付した際に位置ずれが発生した場合であっても、凹部３６，３７が形成された部分を第２部分３２及び第４部分３４とすることができる。 Similarly, when the recesses 36 and 37 are formed before the sheet member 3 is attached, the recesses 36 and 37 may be formed in the portions of the seat member 3 corresponding to the second portion 32 and the fourth portion 34. At this time, it is preferable to form the recesses 36 and 37 in a wider range than the portions corresponding to the second portion 32 and the fourth portion 34 in the seat member 3. As a result, even if the position shift occurs when the sheet member 3 is attached to the wiring board 1, the portions where the recesses 36 and 37 are formed can be the second portion 32 and the fourth portion 34. ..

また、昨今は幅狭化の要求が高いため、図４の例のように、配線基板１の短辺方向における貼り代がほとんど無いこともありえる。そのため、可動接点２がサイドカット形状であり、且つ、可動接点２と配線基板１の一方の長辺（第１側面１３）との間の最小距離Ｌ１及び可動接点２と配線基板１の他方の長辺（第２側面１４）との間の最小距離Ｌ２が、１ｍｍ以下（ほぼ０ｍｍ）の場合には、可動接点２のドーム状部の上面の一部に対応する範囲まで薄化しておくことが好ましい。 Further, since the demand for narrowing the width is high these days, it is possible that there is almost no sticking allowance in the short side direction of the wiring board 1 as shown in the example of FIG. Therefore, the movable contact 2 has a side-cut shape, and the minimum distance L1 between the movable contact 2 and one long side (first side surface 13) of the wiring board 1 and the other of the movable contact 2 and the wiring board 1 When the minimum distance L2 between the long side (second side surface 14) is 1 mm or less (almost 0 mm), it should be thinned to a range corresponding to a part of the upper surface of the dome-shaped portion of the movable contact 2. Is preferable.

図３からわかるように、可動接点２の直線部分は、中央部が高く、端部が低くなっている。このため、可動接点２にシート部材３を貼付すると、直線部分にしわがより、可動接点２の操作感触を悪化させるおそれがある。上記のように、シート部材３を、可動接点２のドーム状部の上面の一部に対応する範囲まで薄化することにより、可動接点２の直線部でしわができにくくし、可動接点２の操作感触の悪化を抑制することができる。 As can be seen from FIG. 3, the linear portion of the movable contact 2 has a high central portion and a low end portion. Therefore, if the sheet member 3 is attached to the movable contact 2, the linear portion may be wrinkled and the operational feel of the movable contact 2 may be deteriorated. As described above, by thinning the seat member 3 to a range corresponding to a part of the upper surface of the dome-shaped portion of the movable contact 2, it is difficult for the straight portion of the movable contact 2 to wrinkle, and the movable contact 2 has a movable contact 2. It is possible to suppress the deterioration of the operation feel.

また、第３部分３３と第５部分３５との間には、隙間Ｃが形成されるのが好ましい。言い換えると、第３部分３３と第５部分３５とは重複しないのが好ましい。これにより、第３部分３３と第５部分３５との重複により、スイッチモジュール１００が厚くなることを防ぐことができる。 Further, it is preferable that a gap C is formed between the third portion 33 and the fifth portion 35. In other words, it is preferable that the third portion 33 and the fifth portion 35 do not overlap. This makes it possible to prevent the switch module 100 from becoming thick due to the overlap between the third portion 33 and the fifth portion 35.

粘着剤層４は、配線基板１と、シート部材３と、の間に設けられた粘着剤の層である。具体的には、粘着剤層４は、表面１１の貼り代と第１部分３１との間、第１側面１３と第２部分３２との間、裏面１２の一部と第３部分３３との間、及び第２側面１４と第４部分３４との間、裏面１２の一部と第５部分３５との間に設けられる。 The pressure-sensitive adhesive layer 4 is a layer of a pressure-sensitive adhesive provided between the wiring board 1 and the sheet member 3. Specifically, the pressure-sensitive adhesive layer 4 is formed between the bonding margin of the front surface 11 and the first portion 31, between the first side surface 13 and the second portion 32, and between a part of the back surface 12 and the third portion 33. It is provided between the second side surface 14 and the fourth portion 34, and between a part of the back surface 12 and the fifth portion 35.

粘着剤層４は、配線基板１やシート部材３に粘着剤を塗布することにより形成されてもよいし、基材を含まない両面粘着テープを配線基板１やシート部材３に貼付することにより形成されてもよい。いずれの場合、粘着剤層４には、ＰＥＴなどの基材が含まれない。これにより、基材により生じる反発力がなくなるため、粘着剤層４と配線基板１との密着性を高めることができる。この結果、シート部材３をはがれにくくすると共に、スイッチモジュール１００の密閉性を高めることができる。 The adhesive layer 4 may be formed by applying an adhesive to the wiring board 1 or the sheet member 3, or may be formed by attaching a double-sided adhesive tape containing no base material to the wiring board 1 or the sheet member 3. May be done. In any case, the pressure-sensitive adhesive layer 4 does not contain a base material such as PET. As a result, the repulsive force generated by the base material is eliminated, so that the adhesion between the pressure-sensitive adhesive layer 4 and the wiring board 1 can be improved. As a result, the seat member 3 can be made difficult to peel off, and the airtightness of the switch module 100 can be improved.

また、粘着剤層４は、図２に示すように、可動接点２を挿通させる開口部４１が設けられる。すなわち、可動接点２の表面には、粘着剤層４が設けられない。これにより、粘着剤層４による、可動接点２の動作への干渉や操作感の悪化を抑制できる。 Further, as shown in FIG. 2, the pressure-sensitive adhesive layer 4 is provided with an opening 41 through which the movable contact 2 is inserted. That is, the pressure-sensitive adhesive layer 4 is not provided on the surface of the movable contact 2. As a result, it is possible to suppress interference with the operation of the movable contact 2 and deterioration of the operational feeling due to the pressure-sensitive adhesive layer 4.

以上のような構成により、本実施形態によれば、高い密閉性を有する狭幅かつ薄型のスイッチモジュール１００を実現できる。理由は以下の通りである。 With the above configuration, according to the present embodiment, it is possible to realize a narrow and thin switch module 100 having high airtightness. The reason is as follows.

従来のスイッチモジュールでは、シート部材は、配線基板の表面にのみ貼付された。このため、配線基板が狭くなり、可動接点と配線基板との間の最小距離が小さくなると、可動接点の周囲における、シート部材と粘着剤層との接触面積が小さくなった。この結果、可動接点の周囲に貼付されたシート部材が剥がれやすくなり、スイッチモジュールの密閉性が低下した。特に、可動接点と配線基板との間の最小距離が１ｍｍ以下の場合、可動接点と配線基板との間の貼り代部分に貼付されたシート部材の粘着力が十分に得られず、スイッチモジュールを密閉することが困難であった。 In the conventional switch module, the sheet member is attached only to the surface of the wiring board. Therefore, when the wiring board becomes narrow and the minimum distance between the movable contact and the wiring board becomes small, the contact area between the sheet member and the adhesive layer around the movable contact becomes small. As a result, the sheet member attached around the movable contact is easily peeled off, and the airtightness of the switch module is lowered. In particular, when the minimum distance between the movable contact and the wiring board is 1 mm or less, the adhesive strength of the sheet member attached to the attachment margin between the movable contact and the wiring board cannot be sufficiently obtained, and the switch module is used. It was difficult to seal.

これに対して、本実施形態によれば、シート部材３は配線基板１に対して折り返して貼付される。具体的には、第１部分３１が表面１１に貼付され、第２部分３２が第１側面１３に貼付され、第３部分３３が裏面１２に貼付され、第４部分３４が第２側面１４に貼付され、第５部分３５が裏面１２に貼付される。これにより、配線基板１が狭くなり、可動接点２と配線基板１との間の最小距離Ｌ１，Ｌ２が小さくなった場合であっても、可動接点２の周囲における、シート部材３と粘着剤層４との接触面積を十分に確保できる。これにより、配線基板１が狭い場合であっても、可動接点２の周囲に貼付されたシート部材３が剥がれにくくなるため、スイッチモジュール１００の密閉性を高めることができる。 On the other hand, according to the present embodiment, the sheet member 3 is folded back and attached to the wiring board 1. Specifically, the first part 31 is attached to the front surface 11, the second part 32 is attached to the first side surface 13, the third part 33 is attached to the back surface 12, and the fourth part 34 is attached to the second side surface 14. It is attached, and the fifth portion 35 is attached to the back surface 12. As a result, even when the wiring board 1 becomes narrower and the minimum distances L1 and L2 between the movable contact 2 and the wiring board 1 become smaller, the sheet member 3 and the adhesive layer around the movable contact 2 become smaller. A sufficient contact area with 4 can be secured. As a result, even when the wiring board 1 is narrow, the sheet member 3 attached around the movable contact 2 is less likely to come off, so that the airtightness of the switch module 100 can be improved.

また、本実施形態によれば、シート部材３の第２部分３２及び第４部分３４は、シート部材３の他の部分より薄くされ、凹部３６，３７を設けられる。これにより、シート部材３を折り曲げたことにより生じる反発力が抑制され、シート部材３が粘着剤層４から剥がれることを抑制できる。 Further, according to the present embodiment, the second portion 32 and the fourth portion 34 of the seat member 3 are made thinner than the other portions of the seat member 3, and the recesses 36 and 37 are provided. As a result, the repulsive force generated by bending the sheet member 3 can be suppressed, and the sheet member 3 can be prevented from peeling off from the adhesive layer 4.

また、本実施形態によれば、粘着剤層４は、基材を含まないため、配線基板１に対して折り曲げて貼付しても反発力が生じない。これにより、粘着剤層４が配線基板１から剥がれることを抑制できると共に、配線基板１と粘着剤層４との密着性を向上させ、スイッチモジュール１００の密閉性を高めることができる。 Further, according to the present embodiment, since the pressure-sensitive adhesive layer 4 does not contain a base material, no repulsive force is generated even if the pressure-sensitive adhesive layer 4 is bent and attached to the wiring board 1. As a result, it is possible to prevent the pressure-sensitive adhesive layer 4 from peeling off from the wiring board 1, improve the adhesion between the wiring board 1 and the pressure-sensitive adhesive layer 4, and improve the airtightness of the switch module 100.

また、本実施形態によれば、図１〜図４の例のように、サイドカット形状を有する可動接点２を採用した場合であっても、スイッチモジュール１００の密閉性を維持することができる。一般に、サイドカット形状を有する可動接点２は、直線部分が配線基板１の表面１１に対して高くなるため、当該直線部分の周囲では、シート部材３が配線基板１の表面１１から浮きやすい。すなわち、可動接点２の周囲におけるシート部材３と粘着剤層４との接触面積が小さくなりやすい。このため、従来のスイッチモジュールでサイドカット形状を有する可動接点を採用した場合、スイッチモジュールの密閉性が一層低下することになる。これに対して、本実施形態によれば、シート部材３と粘着剤層４との接触面積は、配線基板１の第１側面１３、第２側面１４、及び裏面１２により担保されているため、配線基板１の表面１１に対するシート部材３の接触面積が小さくなった場合であっても、シート部材３と粘着剤層４との接触面積を確保し、スイッチモジュール１００の密閉性を維持できる。サイドカット形状を有する可動接点２を採用することにより、ユーザが押下した際の可動接点２の上下方向の移動量を大きくし、可動接点２の操作感を向上させることができる。 Further, according to the present embodiment, the airtightness of the switch module 100 can be maintained even when the movable contact 2 having the side cut shape is adopted as in the examples of FIGS. 1 to 4. In general, since the straight line portion of the movable contact 2 having the side cut shape is higher than the surface 11 of the wiring board 1, the sheet member 3 tends to float from the surface 11 of the wiring board 1 around the straight line portion. That is, the contact area between the sheet member 3 and the adhesive layer 4 around the movable contact 2 tends to be small. Therefore, when a movable contact having a side cut shape is adopted in the conventional switch module, the airtightness of the switch module is further lowered. On the other hand, according to the present embodiment, the contact area between the sheet member 3 and the pressure-sensitive adhesive layer 4 is secured by the first side surface 13, the second side surface 14, and the back surface 12 of the wiring board 1. Even when the contact area of the sheet member 3 with respect to the surface 11 of the wiring board 1 becomes small, the contact area between the sheet member 3 and the adhesive layer 4 can be secured, and the airtightness of the switch module 100 can be maintained. By adopting the movable contact 2 having a side cut shape, the amount of movement of the movable contact 2 in the vertical direction when pressed by the user can be increased, and the operability of the movable contact 2 can be improved.

このように、本実施形態に係るスイッチモジュール１００は、密閉性が高く、狭幅かつ薄型であるため、スマートフォンやタブレット端末などのサイドキーや、薄型フレームレスＴＶの操作スイッチとして、好適に利用できる。 As described above, since the switch module 100 according to the present embodiment is highly airtight, narrow and thin, it can be suitably used as a side key for smartphones and tablet terminals, and as an operation switch for thin frameless TVs. ..

なお、上記実施形態に挙げた構成等に、その他の要素との組み合わせなど、ここで示した構成に本発明が限定されるものではない。これらの点に関しては、本発明の趣旨を逸脱しない範囲で変更可能であり、その応用形態に応じて適切に定めることができる。 The present invention is not limited to the configurations shown here, such as combinations with other elements in the configurations and the like described in the above embodiments. These points can be changed without departing from the spirit of the present invention, and can be appropriately determined according to the application form thereof.

１：配線基板
２：可動接点
３：シート部材
４：粘着剤層
１１：表面
１２：裏面
１３：第１側面
１４：第２側面
１５：固定接点
３１：第１部分
３２：第２部分
３３：第３部分
３４：第４部分
３５：第５部分
３６：凹部
３７：凹部
４１：開口部 1: Wiring board 2: Movable contact 3: Sheet member 4: Adhesive layer 11: Front surface 12: Back surface 13: First side surface 14: Second side surface 15: Fixed contact 31: First part 32: Second part 33: First 3 parts 34: 4th part 35: 5th part 36: recess 37: recess 41: opening

Claims

A wiring board with fixed contacts on the first surface,
Movable contacts arranged so as to be in contact with the fixed contacts on the first surface of the wiring board.
A first portion covering the first surface of the wiring board, a second portion extending from the first portion and covering the first side surface of the wiring board, and a second portion extending from the second portion and extending from the second surface of the wiring board. A third portion that covers a part of the wiring board, a fourth portion that extends from the first portion and covers a second side surface facing the first side surface of the wiring board, and a fourth portion that extends from the fourth portion and extends from the fourth portion of the wiring board. A sheet member having a fifth portion covering a part of the second surface, and
An adhesive layer provided between the wiring board and the sheet member,
Equipped with
The second part and the fourth part are thinner than the first part .

A wiring board with fixed contacts on the first surface,
Movable contacts arranged so as to be in contact with the fixed contacts on the first surface of the wiring board.
A first portion covering the first surface of the wiring board, a second portion extending from the first portion and covering the first side surface of the wiring board, and a second portion extending from the second portion and extending from the second surface of the wiring board. A third portion that covers a part of the wiring board, a fourth portion that extends from the first portion and covers a second side surface facing the first side surface of the wiring board, and a fourth portion that extends from the fourth portion and extends from the fourth portion of the wiring board. A sheet member having a fifth portion covering a part of the second surface, and
An adhesive layer provided between the wiring board and the sheet member,
Equipped with
The second portion has a recess parallel to the first side surface.
The fourth portion has a recess parallel to the second side surface.
Switch module.

The movable contact, switch module according to claim 1 or claim 2 having said first side and said second side surface parallel to the linear portion.

A wiring board with fixed contacts on the first surface,
Movable contacts arranged so as to be in contact with the fixed contacts on the first surface of the wiring board.
A first portion covering the first surface of the wiring board, a second portion extending from the first portion and covering the first side surface of the wiring board, and a second portion extending from the second portion and extending from the second surface of the wiring board. A third portion that covers a part of the wiring board, a fourth portion that extends from the first portion and covers a second side surface facing the first side surface of the wiring board, and a fourth portion that extends from the fourth portion and extends from the fourth portion of the wiring board. A sheet member having a fifth portion covering a part of the second surface, and
An adhesive layer provided between the wiring board and the sheet member,
Equipped with
The minimum distance between the movable contact and the first side surface is 1 mm or less.
The minimum distance between the movable contact and the second side surface is 1 mm or less.
Switch module.

The switch module according to any one of claims 1 to 4 , wherein a gap is formed between the third portion and the fifth portion.