JP6978304B2 - Pachinko machine - Google Patents

Description

The present invention relates to a gaming machine capable of playing a game.

Some slot machines and pachinko gaming machines typified by gaming machines are provided with a board case capable of accommodating a circuit board on which electronic components are mounted, for example.

In this type of substrate case, a plurality of heat dissipation holes for discharging the hot air in the substrate case to the outside are formed (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2008-173340

In the substrate case provided in the gaming machine described in Patent Document 1, there is room for improvement in the structure related to the heat dissipation holes.

The present invention has been made focusing on such a problem, and an object of the present invention is to provide a gaming machine provided with a suitable substrate case.

Of the gaming machine hand stage 1,
A gaming machine capable of playing games (for example, slot machine 1A, pachinko gaming machine 1B, etc.).
A board case (for example, board cases 200 and 210) capable of accommodating a circuit board (for example, effect control boards 2011 and 211) on which electronic components (for example, a production control CPU 120 and ROM 121) are mounted is provided.
The substrate cases is,
A heat dissipation hole leading from the inner surface to the outer surface of the substrate case,
Ejector pin marks (for example, ejector pin marks 240A and 240B) generated when the resin molded product is released from the mold , and
Have ,
The ejector pin marks are provided on the inner surface side of the substrate case.
Has a specific area that is formed in a state in which the heat radiation holes of several are aligned two-dimensionally in a predetermined surface of the board case,
The area of the specific region on the predetermined surface is smaller than the area of the non-specific region on which the heat radiation hole is not provided on the predetermined surface.
The number of the ejector pin traces of the specific region, the greater than the number of the ejector pin traces a non-specific region (e.g., a plurality of ejector pins marks 240A, the ejector pin marks 240A of 240B, in the cover member 213 Eight heat radiation holes 220 are provided in the specific area Z1 formed in a state of being aligned in the left-right and vertical directions, and three are provided in the non-specific area Z2. That is, the specific area Z1 is provided with a non-specific area. A larger number of ejector pin marks 240A than Z2 are provided. See FIG. 4.) ,
It is characterized by that.
According to this feature, it becomes easy to apply an even force to a specific region that is vulnerable due to a plurality of heat dissipation holes, so that damage when the resin molded product is removed from the mold can be suppressed.

The gaming machine of the means 2 of the present invention is the gaming machine according to the means 1.
The substrate case is formed of a transparent synthetic resin material, and gate marks generated by injection molding are provided on the inner surface side (for example, the gate marks 230A and 230B are injected with the synthetic resin material melted at the time of molding. It is a trace formed in the portion, and as shown in FIG. 5, it projects inward to the recess 231A formed on the outer surface 213S on the side where the synthetic resin material is injected and the portion corresponding to the recess 231A on the inner surface 213N. It is composed of a convex portion 231B formed as described above.)
It is characterized by that.
According to this feature, it is possible to prevent dust and the like from adhering to the gate marks and impairing visibility.

The gaming machine of the means 3 of the present invention is the gaming machine according to the means 1 or 2.
The substrate case is made of a transparent synthetic resin material and is made of a transparent synthetic resin material.
The ejector pin mark is provided on the inner surface side (for example, the inner surface 213 of the cover member 213).
A plurality of ejector pin marks 240A and 240B formed by abutting ejector pins (see FIG. 6) for separating the resin molded product from the mold during molding are formed in N. )
It is characterized by that.
According to this feature, heat can be suitably dissipated.

The gaming machine of the means 4 of the present invention is the gaming machine according to any one of the means 1 to 3.
The ejector pin marks are provided at positions separated from each of the heat dissipation holes arranged around the plurality of heat dissipation holes by a predetermined distance (for example, the diameter is R11 (for example, about 10 mm)).
The ejector pin mark 240A formed of the recesses of the above is formed at a position separated from each of the four heat radiating holes 220 arranged around the plurality of heat radiating holes 220 by the same distance, for example, in a region surrounded by the four heat radiating holes 220. Has been done. (See Fig. 4)
It is characterized by that.
According to this feature, it becomes easy to apply the force evenly, so that damage when the resin molded product is removed from the mold can be suppressed.

The gaming machine of the means 5 of the present invention is the gaming machine according to any one of the means 1 to 4.
A plurality of ejector pin marks are provided, and the ejector pin marks are provided.
At least one ejector pin mark is different in size from the other ejector pin marks (for example, in the specific region Z1, the ejector pin having a small protruding surface diameter is placed in a plurality of places where the heat radiation hole 220 does not exist (for example, four heat dissipation points). An ejector pin mark 240A consisting of recesses having a diameter of R11 (for example, about 10 mm) is formed in order to set the area surrounded by the holes 220, and for the non-specific area Z2, the diameter of the protruding surface is R12 (for example, for example). , Approximately 15 mm), ejector pin marks 240B formed of recesses having a diameter of R12 (for example, approximately 15 mm) are formed at a plurality of locations in the non-specific region Z2 (see FIG. 4).
It is characterized by that.
According to this feature, the resin molded product can be extruded with an appropriate force according to the site.
Damage when removing the resin molded product from the mold can be suppressed.

The gaming machine of the means 6 of the present invention is the gaming machine according to any one of the means 1 to 5.
The substrate case is formed with heat dissipation holes (for example, heat dissipation holes 220) that lead from the inner surface (for example, inner surface 213N) of the substrate case to the outer surface (for example, outer surface 213S).
The opening on the inner surface side of the substrate case (for example, the first opening 220A) in the heat dissipation hole is larger than the opening on the outer surface side (for example, the second opening 220B) (R1> R2, see FIG. 5).
It is characterized by that.
According to this feature, since the opening on the inner surface side of the heat radiating hole is larger than the opening on the outer surface side, the volume inside the substrate case increases and hot air easily flows in the substrate case, so that the heat radiating effect is enhanced.

The present invention may have only the invention-specific matters described in the claims of the present invention, or may have a configuration other than the invention-specific matters together with the invention-specific matters described in the claims of the present invention. It may have.

(A) is a schematic perspective view showing a slot machine provided with a substrate case as an embodiment of the present invention, and (B) is a schematic perspective view showing a pachinko gaming machine provided with a substrate case as an embodiment of the present invention. FIG. 1A is an exploded perspective view showing a state in which the configuration of the effect control board case of FIG. 1A is viewed from diagonally behind. FIG. 1B is an exploded perspective view showing a state in which the configuration of the effect control board case of FIG. 1B is viewed from diagonally behind. It is a back view which shows the cover member. FIG. 4 is a cross-sectional view taken along the line AA of FIG. (A) to (C) are schematic explanatory views which show the molding process of a cover member.

A mode for carrying out the gaming machine according to the present invention will be described below based on examples.

Examples of the gaming machine to which the present invention is applied will be described with reference to the drawings. FIG. 1 is a schematic perspective view showing (A) a slot machine provided with a substrate case as an embodiment of the present invention, and (B) is a schematic perspective view showing a pachinko gaming machine provided with a substrate case as an embodiment of the present invention. be. still,
In the following, the diagonally lower left side of FIGS. 1A and 1B is the front (front, front) side of the gaming machine, and the diagonally upper right side is the back (rear) side, and the upper and lower sides of the gaming machine when viewed from the front side. The explanation will be given with reference to the left-right direction. The front surface of the gaming machine in this embodiment is a facing surface facing the player playing the game on the gaming machine.

As shown in FIG. 1A, the slot machine 1A, which is an example of a gaming machine, has a housing 2 having a front opening and an opening / closing door 3 capable of opening and closing the front opening of the housing 2. Further, the slot machine 1A is provided with a locking device (not shown) so that the opening / closing door 3 cannot be opened unless the unlocking operation is performed by a key owned by a clerk of the amusement park or the like.

In the space surrounded by the housing 2 and the opening / closing door 3, a game control means for controlling the game (for example, a game control CPU) and a storage means for storing data used by the game control means (for example). , ROM, RAM, etc.) and a game control board case (not shown) containing a game control board (not shown), and an effect control means (for example, for effect control) that controls effects related to the game. A storage means (for example, a storage means) that can store data used by a CPU or the like and an effect control means.
An effect control board case 200 (abbreviated as a board case 200) in which an effect control board 201 on which a ROM, RAM, etc.) is mounted is provided.

That is, these game control board cases (not shown) and the board case 200 can be touched or removed unless the opening / closing door 3 is opened in a state where the slot machine 1A is installed on the game island (not shown) of the game field. It is prepared so that it cannot be done.

Further, the slot machine 1A has a plurality of types of identification information (for example, a symbol) that can be identified by each.
Is provided with a variable display unit capable of variable display, and after the variable display unit is variablely displayed, a display result is derived by stopping the variable display of the variable display unit, and a prize is awarded according to the display result (for example, a big bonus). Winning or small winning combination) can occur.

As shown in FIG. 1B, the pachinko gaming machine 1B, which is another example of the gaming machine, has an outer frame 12 formed in a square frame shape and a gaming machine frame capable of opening and closing the front opening of the outer frame 12. 13 and the gaming machine frame 13
It has an opening / closing door 14 that can open / close the front surface of the door. Further, the pachinko gaming machine 1B is provided with a locking device (not shown), and the gaming machine frame 13 and the opening / closing door 14 cannot be opened unless the unlocking operation is performed by a key owned by a clerk of the game hall or the like.

On the back side of the gaming machine frame 13, a gaming control means for controlling the game (for example, a gaming control CP)
A storage means (for example, ROM or RA) that can store data used by a game control means (such as U) or a game control means.
A game control board case (not shown) containing a game control board (not shown) on which (M, etc.) is mounted, and an effect control means (for example, an effect control CPU, etc.) that controls effects related to the game. Further, an effect control board case 210 (abbreviated as a board case 210) is provided in which an effect control board 211 equipped with a storage means (for example, ROM, RAM, etc.) capable of storing data used by the effect control means is housed. Has been done.

That is, these game control board cases (not shown) and the board case 210 are the game machine frame 13 and the opening / closing door 1 in a state where the pachinko game machine 1B is installed on the game island (not shown) of the game field.
It is provided so that it cannot be touched or removed unless 4 is opened.

Further, the pachinko gaming machine 1B is a gaming machine capable of launching a gaming ball into the gaming area and adding value based on the winning of the gaming ball in the winning area provided in the gaming area. For example, the gaming ball. Performs variable display by passing through the starting area, and is advantageous to the player based on the display result of the variable display being a specific display result (for example, a jackpot gaming state).
Is controllable.

In addition, a "variable display device" that displays a variable pattern such as a "reel" or a "liquid crystal display device" in the slot machine 1A, and a "game area" in which a game ball can flow down in the pachinko gaming machine 1B.
The "variable display device" that performs variable display of special symbols and effect symbols is said to be a game unit in which a game is performed.

(Board case)
Next, the structure of the substrate case 200 will be described with reference to FIG. FIG. 2 is shown in FIG. 1 (A).
) Is an exploded perspective view showing a state in which the configuration of the effect control board case is viewed from diagonally behind.

As shown in FIG. 2, the substrate case 200 is composed of a base member 202 (first member) and a cover member 203 (second member), and the base member 202 and the cover member 203 are injection-molded (molded). ) Is a transparent thermoplastic synthetic resin molded product. The base member 202 can cover the front side of the effect control board 201, and the cover member 203 can cover the back side of the effect control board 201, and is assembled so as to sandwich the effect control board 201 from the front and back. ..

The effect control board 201 is composed of a first board 201A, a second board 201B connected to the first board 201A, and a third board 201C. A plurality of electronic components including the effect control CPU 120 are mounted on the back surface of the first board 201A, and R is mounted on the back surface of the second board 201B.
A plurality of electronic components including the OM 121 are mounted, and a plurality of electronic components including a connector connectable to the effect display device are mounted on the back surface of the third substrate 201C.

The first substrate 201A, the second substrate 201B, the third substrate 201C, and the effect control substrate 20
The fan 204 for air-cooling 1 is attached to the back surface of the cover member 203 via screws, and the cover member 203 to which these are attached is attached to the base member 202 via screws to form the inside of the board case 200. It is stored in.

Next, the structure of the substrate case 210 will be described with reference to FIG. FIG. 3 shows FIG. 1 (B).
) Is an exploded perspective view showing a state in which the configuration of the effect control board case is viewed from diagonally behind.

As shown in FIG. 3, the substrate case 210 is composed of a base member 212 (first member) and a cover member 213 (second member), and the base member 212 and the cover member 213 are injection-molded (molded). ) Is a transparent thermoplastic synthetic resin molded product. The base member 212 can cover the front side of the effect control board 211, and the cover member 213 can cover the back side of the effect control board 201, and is assembled so as to sandwich the effect control board 211 from the front and back. ..

The effect control board 211 is composed of a first board 211A and a second board 211B connected to the first board 211A. A plurality of electronic components including the effect control CPU 120 are mounted on the back surface of the first substrate 211A, and a plurality of electronic components including the ROM 121 are mounted on the back surface of the second substrate 211B.

The first substrate 211A and the second substrate 211B are attached to the back surface of the cover member 213 via screws, and the cover member 213 to which these are attached is assembled to the base member 212 via screws to form a substrate case 210. It is stored inside.

In the board cases 200 and 210 configured in this way, the base members 202 and 212 and the cover members 203 and 213 are assembled with one-way screws or locking members in a state where the effect control boards 2011 and 211 are housed, or the base is used. Members 202, 212 and cover members 203, 21
By attaching a sealing sticker so as to straddle the base members 202, 212 and the cover members 203, 213 in the state where the 3 is assembled, the sealing state in which the trace remains when the seal is opened. This makes it possible to control the production of the CPU 120 and ROM 12.
It is possible to prevent fraudulent acts on electronic components related to control related to games such as 1.

Next, the details of the cover member 213 of the substrate case 210 provided in the pachinko gaming machine 1B will be described with reference to FIGS. 4 and 5. FIG. 4 is a rear view showing the cover member. FIG. 5 is a cross-sectional view taken along the line AA of FIG. The board case 20 provided in the slot machine 1A
The cover member 203 of 0 has a different shape from the cover member 213 of the substrate case 210 provided in the pachinko gaming machine 1B, but the molding method and the basic configuration are almost the same as the cover member 213. The explanation will be omitted. Further, the board case 200 provided in the slot machine 1A may be provided in the pachinko gaming machine 1B, or the pachinko gaming machine 1 may be provided.
The board case 210 provided in B may be provided in the slot machine 1A.

As shown in FIG. 4, the specific region Z1 of the cover member 213 (the region surrounded by the two-dot chain line in the figure).
Is formed in a state in which a plurality of heat radiating holes 220 for exhausting hot air emitted from electronic components such as the effect control CPU 120 are aligned in the left-right and up-down directions. Specifically, the heat dissipation hole 2
20 is formed in 12 rows at predetermined intervals (for example, about every 10 mm) in the left-right direction, and 12 rows of these 12 heat dissipation holes are formed at predetermined intervals (for example, about 10 mm) in the vertical direction. In total, 84 pieces (12 × 7 = 84) are formed. The number of heat dissipation holes 220 formed is arbitrary and can be changed in various ways. Since the specific area Z1 is an area including a portion corresponding to the effect control CPU 120 in the first substrate 211A, at least a part of the plurality of heat dissipation holes 220 formed in the specific area Z1 corresponds to the effect control CPU 120. It is formed in the part to be used.

As shown in FIG. 5, each heat radiating hole 220 has an effect control board 211 in the cover member 213.
In detail, it is formed so as to pass through the back wall portion 213A provided substantially in parallel with the cover member 213 so as to lead from the inner surface 213N to the outer surface 213S of the cover member 213. Further, the first opening 220A on the inner surface 213N side and the second opening 220B on the outer surface 213S side of the heat radiation hole 220 are each formed in a circular shape, and the diameter R1 (for example, R1 = about 4 mm) of the first opening 220A is the first. 2
The diameter of the opening 220B is larger than the diameter R2 (for example, R2 = about 2 mm) (R1> R).
2).

More specifically, the inner peripheral surface of the heat dissipation hole 220 is provided on the outer surface 213S side of the first tapered surface 221A and the first tapered surface 221A whose diameter gradually decreases from the inner surface 213N side to the outer surface 213S side, and the outer surface 213S. It has a second tapered surface 221B whose diameter gradually decreases toward the side.
The first tapered surface 221A is formed so as to form a substantially R shape in the vertical cross-sectional view of the heat radiating hole 220, and the second tapered surface 221B is formed so as to form a substantially linear shape in the vertical cross-sectional view of the heat radiating hole 220. Has been done. As described above, the inner peripheral surface of the heat radiating hole 220 is formed in a tapered shape whose diameter gradually decreases from the inner surface 213N side to the outer surface 213S side.

Further, the second tapered surface 221 with respect to the perpendicular line T perpendicular to the inner surface 213N and the outer surface 213S.
The inclination angle θ2 of B is, for example, an angle (for example, 1 to 2 degrees) larger than an angle generally provided as a draft required for separating the resin molded product from the mold at the time of molding described later (for example, 1 to 2 degrees). , Tilt angle θ2 = about 10 degrees). The inner surface 213N and the outer surface 213S
The inclination angle θ1 of the tangent line passing through the substantially central position in the thickness direction on the first tapered surface 221A with respect to the perpendicular line T with respect to the vertical line T is set to be an angle larger than the inclination angle θ2 (for example, θ1 = about 33 degrees) (θ1). > Θ2). As described above, the inner peripheral surface of the heat radiating hole 220 is composed of a first tapered surface 221A and a second tapered surface 221B having different inclination angles with respect to the perpendicular line T.

Further, the back wall portion 213A and the side wall portion 213 in the non-specific region Z2 different from the specific region Z1.
A plurality of slit-shaped heat dissipation ports 250 that open from the back wall portion 213A to the side wall portion 213B are formed at predetermined positions of the corners with B. The opening area of these heat dissipation ports 250 is the heat dissipation hole 22.
It is larger than the opening area of 0.

As described above, the first opening 2 on the inner surface 213N side of each heat radiating hole 220 formed in the specific region Z1.
Since 20A has a larger diameter than the second opening 220B on the outer surface 213S side, the substrate case 210
Since the internal volume increases and hot air easily flows in the substrate case 210, the heat dissipation effect is enhanced. Further, since the first tapered surface 221A adjacent to the first opening 220A is formed of a curved surface having a substantially R-shaped cross section, the hot air accumulated in the substrate case 210 is smoothly distributed in each heat radiation hole 220. Since it becomes easier to enter the area, the heat dissipation effect is enhanced.

Further, a gate mark 230A is formed in a position above and near the specific area Z1 in the non-specific area Z2 different from the specific area Z1, and a gate mark 230B is formed in a position below the specific area Z1 in the non-specific area Z2. Has been done. The linear distance L2 from the specific region Z1 to the gate mark 230B is longer than the linear distance L1 from the specific region Z1 to the gate mark 230A (L1 <L2). That is, the gate mark 230A and the gate mark 230B are provided apart from each other at the upper part and the lower part of the cover member 213, and one of the gate marks 2
30A is provided in the vicinity of the specific region Z1 with respect to the gate mark 230B.

These gate marks 230A and 230B are traces formed in the portion where the synthetic resin material melted during molding, which will be described later, is injected, and as shown in FIG. 5, the outer surface 213S on the side on which the synthetic resin material is injected is to be injected. The concave portion 231A formed in the inner surface 213N and the convex portion 231B formed so as to project inward in the portion corresponding to the concave portion 231A on the inner surface 213N. The concave portion 231A and the convex portion 231B are formed in advance by the mold. The recess 231
As will be described later, a protrusion 232 may be formed in A at the time of mold opening. Therefore, by forming a recess 231A deeper than the protrusion length of the protrusion 232 in advance, the protrusion 232 is formed on the outer surface 21.
It is prevented from protruding outward from 3S.

Further, the ejector pin mark 2 formed on the inner surface 213N of the cover member 213 by being pressed by an ejector pin (see FIG. 6) in order to release the resin molded product from the mold.
A plurality of 40A and 240B are formed. The ejector pin is set in the part where the mold release resistance (resistance when the product is peeled off from the mold) is large when the resin molded product is released from the mold, but the fragile part is not damaged due to the load. As described above, it is preferable to arrange a large number of ejector pins having a large protruding surface diameter as much as possible so that the load is distributed.

However, since there is a limit to increasing the diameter of the protruding surface in the specific region Z1 where the plurality of heat dissipation holes 220 are formed or the portion where the wall portion is narrow, for example, in the specific region Z1, the ejector having a small diameter of the protruding surface. Since the pins are set at a plurality of locations where the heat dissipation holes 220 do not exist (for example, the area surrounded by the four heat dissipation holes 220), the diameter is R11 (for example, about 10 mm).
) Is formed as an ejector pin mark 240A. Ejector pin mark 2
The 40A is arranged at a position separated by the same distance from each of the four surrounding heat dissipation holes 220.

On the other hand, in the non-specific region Z2, which has no heat dissipation hole 220 and has high strength, such as the specific region Z1,
The diameter of the protruding surface is R11 (for example, about 10 mm), which is larger than the ejector pin.
A plurality of 12 (for example, about 15 mm) ejector pins (R11 <R12) are arranged at wide intervals. Therefore, for the specific region Z1 in which the plurality of heat dissipation holes 220 are formed and the non-specific region Z2 having a relatively high strength as compared with the region where the wall portion is narrow, the diameter of the protruding surface is R12 (for example, about 1).
In order to set the ejector pin (5 mm), the diameter is R at multiple points in the non-specific area Z2.
An ejector pin mark 240B composed of 12 (for example, about 15 mm) recesses is formed.

Further, of the plurality of ejector pin marks 240A and 240B, eight ejector pin marks 240A are provided in the specific region Z1 formed in the cover member 213 in a state where the plurality of heat dissipation holes 220 are aligned in the left-right and vertical directions. Three are provided in the non-specific area Z2.
That is, the specific region Z1 has a larger number of ejector pin marks 240A than the non-specific region Z2.
Is provided.

(Molding method of cover member)
Next, the molding process of the cover member 213 will be described with reference to FIG. FIG. 6 shows (A).
)-(C) are schematic explanatory views showing a molding process of the cover member. In addition, in FIG. 6, the molding part 3
03 is shown in a schematic shape.

As shown in FIG. 6A, the cover member 213 is formed by filling and cooling the molded portion 303 formed when the first mold 301 and the second mold 302 are combined, thereby filling and cooling the synthetic resin material. It is molded. Specifically, the molded portion 303 is formed between the convex portion 301A of the first mold 301 and the concave portion 302A of the second mold 302, and the convex portion 301A forms the inner surface of the cover member 213 to form the concave portion 3.
01B forms the outer surface of the cover member 213.

Further, as shown in the enlarged view in FIG. 6A, the gate 305 in the first mold 301
A recess 306B is formed in the portion corresponding to. Since the vicinity of the nozzle at the tip of the injection part tends to cool, when the resin material is injected from the nozzle at the tip of the injection part, the temperature of the resin material near the nozzle is low and it is difficult for the resin material to flow into the molding part 303. By retaining the resin material flowing in the stage in the recess 306B, the resin material having a high temperature can be widely spread in the molded portion 303. The cover member 2 which is a resin molded product is formed by the recess 306B.
13 convex portions 231B are formed. Further, the convex portion 301A of the first mold 301 is provided with a plurality of convex portions 307 formed in a columnar shape that gradually tapers toward the tip end. This convex part 30
7 forms a heat dissipation hole 220 of the cover member 213 which is a resin molded product. Further, although not particularly shown, a plurality of convex portions different from the convex portions 307 are also provided, and the convex portions form a heat radiation port 250 of the cover member 213 which is a resin molded product.

Further, in the first mold 301, the diameter of the protruding surface is R11 (for example, about 10 mm) and R.
An ejector mechanism having two types of columnar ejector pins 308 (difference in diameter is not shown) of 12 (for example, about 15 mm) is provided. The plurality of ejector pins 308 are provided so that the base end thereof protrudes on the ejector plate 309, the protruding surface of the tip penetrates the convex portion 301A, faces the molded portion 303, and forms a part of the inner surface. By pushing the ejector plate 309 toward the second mold 302 by the ejector rod 310, all the ejector pins 308 can be moved so as to enter the molding portion 303. Further, the convex portion 306 is formed in the portion of the concave portion 302A of the second mold 302 corresponding to the gate 305.
A is formed, and the convex portion 306A forms the concave portion 231A of the cover member 213 which is a resin molded product.

When the cover member 213 is molded by using the first mold 301 and the second mold 302 configured in this way, first, the molding formed between the first mold 301 and the second mold 302 is performed. Part 303
The melted synthetic resin material is injected into the inside by an injection portion (not shown) and filled. The resin material injected from the nozzle of the injection section passes through the pipe line 304 (spool) in the second mold 302, further branches, and flows into the molding section 303 from the two gates 305 (injection section).

Then, after injecting the resin material, the resin material is cooled, and after cooling, the gate 305 is opened by opening the first mold 301 and the second mold 302 as shown in FIG. 6 (B). Molding part 30
Separated from 3. Along with this separation, the resin material cured in the pipeline 304 and the molded portion 30
Since the resin material cured in 3 is torn off, a protrusion 232 (so-called burr) may be formed in the recess 231A. However, when the protrusion 232 is housed in the recess 231A, the protrusion 2 may be formed.
It is prevented that 32 protrudes outward from the outer surface 213S.

Since the resin molded product shrinks when it is cured by cooling, it is relatively easily released from the second mold 302 when the mold is opened, but due to the force of shrinkage, the convex portion 301A of the first mold 301 The ejector plate 309 is pushed out toward the second mold 302 by the ejector rod 310, and the resin molded product is ejected by the plurality of ejector pins 308 to be released from the first mold 301. Here, ejector pin marks 240A and 240B are formed on the inner surface 213N of the cover member 213, which is a resin molded product, on the portion corresponding to each ejector pin 308, that is, the portion pressed by the ejector pin 308. After that, the spool or the like is cut as a finishing process, and one molding process is completed by taking out the resin molded product.

As described above, in the gaming machine as the embodiment of the present invention, the board case 210 (200) capable of accommodating the effect control boards 2011 and 211 on which the effect control CPU 120 and ROM 121 as electronic components are mounted. ) Is provided, and the substrate case 210 is provided with the substrate case 21.
A heat radiating hole 220 leading from the inner surface 213N of 0 to the outer surface 213S is formed, and the first opening 220A on the inner surface side of the substrate case in the heat radiating hole 220 is larger than the second opening 220B on the outer surface side (
R1> R2, see FIG. 5).

By doing so, the first opening 220A on the inner surface side of the heat dissipation hole 220 is larger than the second opening 220B on the outer surface side, so that the volume inside the substrate case 210 increases and hot air flows in the substrate case 210. Since it is easy to do, the heat dissipation effect is enhanced. Further, the heat dissipation hole 220 has a tapered portion (first tapered surface 221A, second tapered surface 221B, etc.) whose opening gradually becomes smaller from the inner surface 213N side to the outer surface 213S side of the substrate case 210, so that the inside of the substrate case Since the hot air of the above can easily enter the heat radiating hole 220 smoothly, heat can be satisfactorily dissipated.

Further, the diameters R1 and R2 of the first opening 220A on the inner surface side of the heat radiation hole 220 and the second opening 220B on the outer surface side are substantially the same (R1 = R2), or the diameter R1 of the first opening 220A on the inner surface side is on the outer surface side. Compared with the case where the diameter of the second opening 220B is smaller than the diameter R2 (R1 <R2), it is difficult for foreign matter such as a wire to enter from the outside of the substrate case 210, so that fraudulent acts on electronic components can be suitably suppressed.

Further, the first opening 220A on the inner surface 213N side and the second opening 220B on the outer surface 213S side of the substrate case 210 in the heat radiation hole 220 are circular. By doing so, the heat dissipation hole 22
Since hot air enters from around 0 almost evenly, heat can be dissipated suitably.

Further, since a plurality of heat dissipation holes 220 are provided in an aligned state, heat can be suitably radiated and the strength of the entire specific region Z1 can be made uniform, so that a local decrease in strength can be suppressed. ..

Further, the heat dissipation hole 220 is an effect control C that performs control related to the game in the specific area Z1.
Since it is provided in the portion corresponding to the PU 120, the hot air discharged from the effect control CPU 120 can be efficiently dissipated at a close position.

Further, in the present embodiment, the embodiment in which the heat radiating hole 220 is provided in the portion corresponding to the effect control CPU 120 in the specific area Z1 is exemplified, but the present invention is not limited to this, and is related to the game. It may be provided in a portion different from the portion corresponding to the effect control CPU 120 as the effect control means for controlling and the ROM 121 as the effect storage means that can store the data used by the effect control CPU 120. By doing so, the heat dissipation hole 220 to the effect control C
Since the PU 120 and ROM 121 can be kept away, foreign matter such as a wire can enter through the heat dissipation hole 220 without opening the board case 210, and the effect control CPU 120 or ROM 1 can be moved away.
It is possible to suppress fraudulent acts such as illegally modifying 21.

Further, ejector pin marks 240A and 240B provided at a portion where the protruding surface of the ejector pin 308 abuts when the resin molded product is released from the mold are provided on the inner surface 213N of the substrate case 210. By doing so, it is possible to suppress damage when the resin molded product is removed from the mold.

Further, the cover member 213 is provided with ejector pin marks 240A and 240B at a portion where the protruding surface of the ejector pin 308 abuts when the resin molded product is released from the mold.
The specific region Z1 is provided with a plurality of heat dissipation holes 220 arranged in an aligned state, and is provided with a larger number of ejector pin marks 240A than the non-specific region Z2 different from the specific region Z1. By doing so, it becomes easy to apply an even force to the fragile specific region Z1 due to the plurality of heat dissipation holes 220, so that damage when the resin molded product is removed from the mold can be suppressed.

Further, in the gaming machine as the embodiment of the present invention, the effect control CPU 12 as an electronic component is used.
A board case 210 (200) capable of accommodating the effect control boards 2011 and 211 on which 0 and ROM 121 are mounted is provided, and a plurality of heat radiation holes 220 are provided in a state of being aligned in a specific area Z1 of the board case 210. At the same time, a gate mark 230A generated by injection molding is formed in the vicinity of the specific region Z1. By doing so, since the resin material is injected from the vicinity of the heat radiating hole 220, the inflow of the resin material is resisted by the plurality of convex portions 307 forming the heat radiating hole 220 protruding at the time of molding. Since the resin material can be widely spread even in the specific region Z1, it is possible to prevent the resin material from spreading well around each heat radiating hole 220 at the time of molding and reducing the plate thickness and the like.

Further, in the present embodiment, the embodiment in which the gate mark 230A is provided in the vicinity of the specific region Z1 is exemplified, but the present invention is not limited to this, and the gate mark 230A is provided in the specific region Z1. May be good. Even in this case, since the resin material is injected from near the heat dissipation hole 220,
Since the resin material can be widely spread even in the specific region Z1 where the inflow of the resin material is resisted by the protrusions of the plurality of convex portions 307 forming the heat dissipation holes 220 during molding, the resin material can be widely distributed. However, it is possible to prevent the strength from being lowered due to the fact that the heat dissipation holes 220 do not spread well and the plate thickness becomes thin.

Further, when the gate mark 230A is provided in the specific area Z1, the heat radiation hole 2 is provided in the specific area Z1.
It is preferable that 20 is provided in a portion where it does not exist. By doing so, the gate 305 can be secured in the vicinity of the heat radiating hole 220, so that the resin material can be widely distributed. Further, when the gate mark 230A is provided in the specific area Z1, for example, one heat radiation hole 220 surrounded by any four heat radiation holes 220 among the plurality of heat radiation holes 220 arranged in an aligned manner is closed to form a wall portion (predetermined). A region) may be formed, and a gate mark 230A may be provided on the wall portion. By doing so, it is possible to suitably suppress damage or the like at the time of mold release due to a decrease in strength.

Further, in the cover member 213, the recesses 231A of the gate marks 230A and 230B have the outer surface 213.
By being provided on the S side, even if the protrusion 232 is formed at the time of mold opening, it may come into contact with an electronic component in the case and be damaged, or the wiring pattern of the effect control board 211 may be damaged and broken. Can be suppressed.

Further, in this embodiment, the cover member 213 has the recesses 231 of the gate marks 230A and 230B.
A is an example of a form provided on the outer surface 213S side, but the present invention is not limited to this, and the cover member 213 is formed of a transparent synthetic resin material, and the gate marks 230A and 230B are used.
The recess 231A may be provided on the inner surface 213N side. That is, at the time of molding, the pipe line 304 may be formed from the first mold 301 side toward the molding portion 303, and the resin material may be injected from the inner surface 213N side. By doing so, it is possible to prevent dust and the like from adhering to the recesses 231A of the gate marks 230A and 230B, which hinders visibility when checking the board and electronic components provided inside from the outside of the board case 210. Therefore, it is possible to avoid difficulty in confirming whether or not there is a possibility of fraudulent activity against electronic components.

Further, the cover member 213 is formed of a transparent synthetic resin material, and the ejector pin marks 240A and 240B generated when the resin molded product is released from the mold are provided on the inner surface 213N side. By doing so, it is possible to prevent dust and the like from adhering to the recesses of the ejector pin marks 240A and 240B, which hinders visibility when checking the substrate and electronic components provided inside from the outside of the substrate case 210. Therefore, it is possible to avoid difficulty in confirming whether or not there is a possibility that the electronic component has been cheated.

Further, in the gaming machine as the embodiment of the present invention, the effect control CPU 12 as an electronic component is used.
A board case 210 (200) capable of accommodating the effect control boards 2011 and 211 on which 0 and ROM 121 are mounted is provided, and among a plurality of ejector pin marks 240A and 240B, a plurality of ejector pin marks 240A are included in the cover member 213. A larger number of ejector pin marks 240A are provided in the specific region Z1 formed in a state where the heat radiation holes 220 are aligned in the left-right and vertical directions. By doing so, a plurality of heat dissipation holes 22
Since it becomes vulnerable to 0 and it becomes easy to apply an even force to the specific area Z1 set in the portion corresponding to the effect control CPU 120, it is possible to suppress damage when the resin molded product is removed from the mold.

Further, the ejector pin mark 240A made of a recess having a diameter of R11 (for example, about 10 mm) is formed.
Is formed at a position separated from each of the four heat radiating holes 220 arranged around the plurality of heat radiating holes 220 by the same distance, for example, in a region surrounded by the four heat radiating holes 220. By doing so, it is possible to prevent damage due to a load concentrated on any one of the heat dissipation holes 220. Further, since the portion where the ejector pin abuts can be set in a wider space as compared with the case where the ejector pin mark 240A is provided between the two adjacent heat radiation holes 220 and 220, the protruding surface of the ejector pin can be made as large as possible.

Further, in the present embodiment, the embodiment in which the ejector pin marks 240A are formed in the region surrounded by the four heat dissipation holes 220 is exemplified, but the present invention is not limited to this, and the present invention is not limited to this, for example.
Of the plurality of heat dissipation holes 220 arranged in an aligned manner, any one of the heat dissipation holes 220 surrounded by the other four heat dissipation holes 220 is closed to form a wall portion, and the ejector pin mark 240A is provided on the wall portion. It may be. By doing so, it is possible to suitably suppress damage or the like at the time of mold release due to a decrease in strength.

Further, a plurality of ejector pin marks 240A and 240B are provided, and at least one ejector pin mark 240A is different in size from the other ejector pin marks 240B. By doing so, the resin molded product can be extruded with an appropriate force according to the portion, so that damage when the resin molded product is removed from the mold can be suppressed.

Further, in this embodiment, the cover member 213 on which the plurality of heat dissipation holes 220, the gate marks 230A and 230B, and the ejector pin marks 240A and 240B are formed is made of a transparent synthetic resin material, whereby the substrate case is formed. The gate marks 230A and 230B and the ejector pin marks 240A and 240B can be visually recognized from the outside of the substrate case without opening. That is, since the gate marks 230A and 230B and the ejector pin marks 240A and 240B function as marker portions, for example, the arrangement pattern of the heat dissipation holes 220 and the arrangement patterns of the gate marks 230A and 230B and the ejector pin marks 240A and 240B are registered in advance. By doing so, if the board case is illegally replaced with a forged board case, the arrangement pattern of heat dissipation holes, gate marks, and ejector pin marks can be checked by comparing it with the registered pattern. It is possible to identify whether or not the forged board case has been squeezed.

Although the embodiments of the present invention have been described above with reference to the drawings, the present invention is not limited to the present invention and is included in the present invention even if there are changes or additions within the range not deviating from the gist of the present invention. Needless to say.

For example, in the above embodiment, as an example of the substrate case, the embodiment in which the substrate cases 200 and 210 capable of accommodating the effect control boards 2011 and 211 are applied is exemplified, but the present invention is not limited to this, and the game is not limited to this. The present invention can also be applied to a board case capable of accommodating other circuit boards such as a control board and a payout control board.

Further, in the above embodiment, the heat radiating hole 220 is exemplified in a form having a substantially circular cross-sectional view, but the present invention is not limited to this, and the first opening on the inner surface side and the first opening on the outer surface side of the heat radiating hole are not limited to this. The shape of the two openings is not limited to a circular shape and can be arbitrarily changed. Further, the shapes of the first opening on the inner surface side and the second opening on the outer surface side do not necessarily have to be similar figures.

Further, in the above embodiment, in the substrate case 210, the first opening 220A on the inner surface side has a heat dissipation hole 220 larger than the second opening 220B on the outer surface side, the gate marks 230A and 230B, and the ejector pin marks 240A and 240B. However, the present invention is not limited to this, as long as the first opening 220A on the inner surface side is provided with a heat dissipation hole 220 larger than the second opening 220B on the outer surface side. The gate marks 230A and 230B and the ejector pin marks 240A and 240B may not be provided. Further, the specific area Z1 or the specific area Z
If the gate marks 230A and 230B are provided in the vicinity of 1, the first opening 220A on the inner surface side of the heat dissipation hole 220 does not have to be larger than the second opening 220B on the outer surface side, and the ejector pin marks 240A and 240B. May not be provided. Further, if the specific area Z1 is provided with a larger number of ejector pin marks 240A than the non-specific area Z2, the heat radiation hole 22 is provided.
The first opening 220A on the inner surface side of 0 may not be larger than the second opening 220B on the outer surface side, and the gate marks 230A and 230B may not be provided.

Further, in the above embodiment, a plurality of heat dissipation holes 220, gate marks 230A, 230B, and ejector pin marks 240A, 240B are exemplified on the cover members 203, 213 of the substrate cases 200, 210, but the present invention illustrates the present invention. The plurality of heat dissipation holes 220, gate marks 230A, 230B, and ejector pin marks 240A, 240B of the present invention are not limited to this.
It may be applied to the base members 202, 212 of the board cases 200, 210, or may be applied.
For example, it may be applied to a covering cover (not shown) that covers various substrate cases, devices, and the like provided on the back side of the pachinko gaming machine 1B.

Further, the gaming machine of the present invention may be an enclosed pachinko gaming machine or a slot machine in which a gaming medium is enclosed and a score is given based on the occurrence of a prize.

1A Slot machine 1B Pachinko game machine 120 Production control CPU
121 ROM
200, 210 Production control board case 201 Production control board 220 Heat dissipation holes 230A, 230B Gate marks 240A, 240B Ejector pin marks 305 Gate 308 Ejector pins

Claims (1)

It is a gaming machine that can play games,
It can store circuit boards on which electronic components are mounted, and is equipped with a board case made of resin molded products formed by injection molding.
The substrate cases is,
A heat dissipation hole leading from the inner surface to the outer surface of the substrate case,
Ejector pin marks generated when the resin molded product is released from the mold ,
Have ,
The ejector pin marks are provided on the inner surface side of the substrate case.
Has a specific area that is formed in a state in which the heat radiation holes of several are aligned two-dimensionally in a predetermined surface of the board case,
The area of the specific region on the predetermined surface is smaller than the area of the non-specific region on which the heat radiation hole is not provided on the predetermined surface.
The number of the ejector pin traces of the specific region is greater than the number of said ejector pin marks of the non-specific region,
A gaming machine characterized by that.

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