JP6978853B2 - Imprint device and article manufacturing method - Google Patents

Description

The present invention relates to an imprint device and a method for manufacturing an article.

Imprint technology is being put to practical use as one of the lithography technologies for manufacturing articles such as semiconductor devices. In the imprint process, air bubbles are likely to be trapped between the mold and the imprint material when the mold is brought into contact with the imprint material on the substrate. Curing the imprint material with air bubbles remaining can result in unfilled defects in the formed pattern. In order to suppress unfilled defects, it is conceivable to set a long filling time by waiting for the trapped air to diffuse out of the shot or to dissolve in the imprint material. However, the throughput decreases. As described above, the decrease in throughput due to the long filling time is one of the major problems of the imprint technology.

As a solution for reducing unfilled defects and shortening the filling time, Patent Document 1 proposes introducing easily soluble carbon dioxide into helium having a high molecular diffusion rate or an imprint material. .. Patent Document 2 proposes a configuration in which a space including the entire substrate and an area to be imprinted are exposed with a condensable gas. By condensing the gas trapped between the mold and the imprint material, it is possible to shorten the filling time and suppress unfilled defects. In Non-Patent Document 1, a mold is formed from a cured imprint material by using 1,1,1,3,3-pentafluoropropane (hereinafter referred to as "pentafluoropropane"), which is a kind of condensable gas. It has been reported that the pulling force (hereinafter referred to as "release force") can be reduced. By reducing the mold release force, it is possible to suppress the adhesion of the imprint material to the mold and reduce transfer defects. Further, Non-Patent Document 2 reports a phenomenon that the viscosity of the imprint material is lowered by pentafluoropropane. The lower the viscosity of the imprint material, the easier it is for the imprint material to spread on the substrate, so that the filling time can be shortened. Further, in Patent Document 3, a mixed gas of condensable gas and helium is supplied to the imprint device to shorten the filling time of the imprint material, reduce pattern defects, and reduce the surface roughness of the imprint material. Configurations to reduce have been proposed.

Japanese Patent Publication No. 2011-514658 Japanese Patent No. 3700001 Japanese Unexamined Patent Publication No. 2013-168645

Hiroshima, Journal of Vacuum Science and Technology, B 27 (6) 2009, 2862-2865 Hiroshima, Journal of Photopolymer Science and Technology, Volume23, Number1, 2010, 45-50

Pentafluoropropane having a low vapor pressure is usually filled in a container in a liquid state, and the pentafluoropropane vaporized in the container is transferred to an imprint device. The energy for transporting the condensed gas vaporized in the container to the imprint device is only the extremely low pressure energy of the vapor pressure of pentafluoropropane, and external energy such as a pump is not normally used.

A configuration that is usually considered for mixing pentafluoropropane and helium is a configuration in which a pentafluoropropane supply pipe and a helium supply pipe are joined by a T-shaped joint or the like to form a mixed gas of pentafluoropropane and helium in advance. Is. This mixed gas is supplied to the imprint device. However, while the supply pressure of helium is usually about 500 kPa, the supply pressure of pentafluoropropane at room temperature is about 50 kPa. Therefore, in the method of simply merging and mixing with a T-shaped joint or the like, pentafluoropropane does not easily flow due to the difference in supply pressure with helium. The supply pressure of pentafluoropropane can be increased by increasing the temperature of pentafluoropropane. Specifically, if pentafluoropropane can be heated to about 70 ° C., the supply pressure of pentafluoropropane can be increased to 500 kPa. However, in order to realize this, it is necessary to heat the container, piping, etc. of pentafluoropropane to about 70 ° C., which complicates the device configuration. Further, when a gas heated to about 70 ° C. is supplied between the mold and the substrate, it is necessary to deal with thermal deformation of the mold and the substrate.

It is an exemplary object of the present invention to provide an imprinting apparatus that is advantageous in achieving both throughput and accurate pattern formation.

According to one aspect of the present invention, it is an imprint device that forms a pattern on the substrate by bringing a mold into contact with an imprint material on the substrate, including a first supply port, and the imprint on the substrate. The space between the material and the mold includes a first supply unit for supplying the first gas from the first supply port and a second supply port, and the space is filled with the first gas from the second supply port. different from the second second supply unit for supplying via a path different from the gas to the first supply unit, so mixing with the second gas and the first gas in the space is made, the first An imprint device comprising a supply unit and a control unit that controls the second supply unit is provided.

According to the present invention, for example, it is possible to provide an imprint device that is advantageous in achieving both throughput and accurate pattern formation.

The figure which shows the structure of the imprint apparatus in embodiment. The figure which illustrates the structure of the gas supply part in an embodiment. The figure explaining the example of the operation of the gas supply part in an embodiment. The figure explaining another example of the operation of the gas supply part in an embodiment. The figure which shows the structure of the imprint apparatus in embodiment. The figure which shows the structure of the imprint apparatus in embodiment. The figure explaining the article manufacturing method in an embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that the following embodiments merely show specific examples of the embodiment of the present invention, and the present invention is not limited to the following embodiments. In addition, not all combinations of features described in the following embodiments are essential for solving the problems of the present invention.

<First Embodiment>
First, an outline of the imprint device according to the embodiment will be described. The imprint device is a device that forms a pattern of a cured product to which the uneven pattern of the mold is transferred by bringing the imprint material supplied on the substrate into contact with the mold and applying energy for curing to the imprint material. be.

As the imprint material, a curable composition (sometimes referred to as an uncured resin) that cures when energy for curing is applied is used. As the energy for curing, electromagnetic waves, heat and the like can be used. The electromagnetic wave may be, for example, light selected from a wavelength range of 10 nm or more and 1 mm or less, for example, infrared rays, visible rays, ultraviolet rays, and the like. The curable composition can be a composition that cures by irradiation with light or by heating. Of these, the photocurable composition that is cured by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent, if necessary. The non-polymerizable compound is at least one selected from the group of sensitizers, hydrogen donors, internal release mold release agents, surfactants, antioxidants, polymer components and the like. The imprint material is a substrate in the form of droplets or islands or films formed by connecting a plurality of droplets by an imprint material supply device (corresponding to the imprint material supply unit 33 in FIG. 1 to be described later). Can be placed on top. The viscosity of the imprint material (viscosity at 25 ° C.) can be, for example, 1 mPa · s or more and 100 mPa · s or less. As the material of the substrate, for example, glass, ceramics, metal, semiconductor, resin and the like can be used. If necessary, a member made of a material different from the substrate may be provided on the surface of the substrate. The substrate is, for example, a silicon substrate, a compound semiconductor substrate, or quartz glass.

FIG. 1 is a schematic view showing the configuration of the imprint device 10 according to the present embodiment. The imprint device 10 is used in the manufacture of devices such as semiconductor devices, and the imprint material 31 supplied on the substrate 21 (wafer) is molded by a mold 41 to form a pattern of the imprint material on the substrate 21. do. Although an imprint device that employs a photocuring method is illustrated here, a thermosetting method may be adopted. Further, in the following figure, the Z axis in the XYZ coordinate system is taken parallel to the optical axis of the ultraviolet ray 53 irradiated to the imprint material 31 on the substrate 21, and is orthogonal to each other in a plane perpendicular to the Z axis. Take the X and Y axes in the direction.

The light irradiation unit 50 irradiates the mold 41 with ultraviolet rays 53 during the imprint processing, particularly when the imprint material 31 on the substrate 21 is cured. The light irradiation unit 50 may include a light source 51 and an illumination optical system 52 that adjusts the ultraviolet rays 53 emitted from the light source 51 to light suitable for imprinting and irradiates the mold 41. As the light source 51, lamps such as halogen lamps can be adopted, but the light source is particularly limited as long as it is a light source that transmits light through the mold 41 and emits light having a wavelength at which the imprint material 31 is cured by irradiation with ultraviolet rays 53. is not it. Illumination optical system 52, which is not shown, may include a lens, a mirror, an aperture, or a shutter for switching between irradiation and shading. In the present embodiment, the light irradiation unit 50 is installed in order to adopt the photocuring method. For example, when the heat curing method is adopted, the thermosetting resin is used instead of the light irradiation unit 50. A heat source unit will be installed to cure the light.

The mold 41 has a rectangular outer peripheral shape, and the surface facing the substrate 21 includes a pattern portion 41a on which a pattern to be transferred such as a circuit pattern is formed. The material of the mold 41 is a material (for example, quartz) capable of transmitting ultraviolet rays 53. Further, the mold 41 may have a cavity 44 (recess) having a circular planar shape and a certain depth on the surface irradiated with the ultraviolet ray 53.

The mold holding portion 40 includes a mold chuck 42 for holding the mold 41, a mold driving mechanism 43 for movably holding the mold chuck 42, and a magnification correction mechanism 46 for correcting the shape of the mold 41 (pattern portion 41a). sell. The mold chuck 42 can hold the mold 41 by attracting the outer peripheral region of the irradiation surface of the ultraviolet ray 53 in the mold 41 by a vacuum suction force or an electrostatic force. For example, when the mold 41 is held by the vacuum suction force, the mold chuck 42 is connected to a vacuum pump (not shown) installed outside, and the suction pressure due to the exhaust of the vacuum pump is appropriately adjusted with respect to the mold 41. The suction force (holding force) can be adjusted. The mold drive mechanism 43 moves the mold 41 so as to selectively contact or separate the mold 41 from the imprint material 31 on the substrate 21. Examples of the power source that can be adopted in this type drive mechanism 43 include a linear motor and an air cylinder. Further, the mold drive mechanism 43 may have a plurality of drive systems such as a coarse movement drive system and a fine movement drive system in order to cope with the highly accurate positioning of the mold 41. Further, the mold drive mechanism 43 has a position adjustment function in the θ direction which is not only the Z-axis direction but also the X-axis direction, the Y-axis direction, or the rotation direction around the Z-axis, and the tilt for correcting the inclination of the mold 41. There may be a configuration having a function or the like. The contact and separation operations in the imprint device 10 may be realized by moving the mold 41 in the Z-axis direction, or may be realized by moving the substrate holding portion 20 in the Z-axis direction. Well, or both may be moved relative to each other. The magnification correction mechanism 46 is installed on the holding side of the mold 41 in the mold chuck 42, and corrects the shape of the mold 41 (pattern portion 41a) by mechanically applying an external force or a displacement to the side surface of the mold 41.

The substrate 21 is, for example, a single crystal silicon substrate or an SOI (Silicon on Insulator) substrate. A pattern (layer containing the pattern) of the imprint material 31 is formed by the pattern portion 41a in the plurality of shot regions (pattern forming regions) on the substrate 21. In general, before the substrate 21 is carried into the imprint device 10, a pattern (hereinafter referred to as “board-side pattern”) is formed on the plurality of shot regions in advance in the previous process.

The imprint material supply unit 33 is installed in the vicinity of the mold holding unit 40, and supplies (arranges or coats) the imprint material 31 on the shot region (board side pattern) on the substrate 21. The imprint material 31 is, for example, an ultraviolet curable resin having a property of being cured by receiving ultraviolet rays 53, and is appropriately selected depending on various conditions such as a semiconductor device manufacturing process. The imprint material supply unit 33 adopts an inkjet method as an imprint material supply method, and includes a container 32 for accommodating the uncured imprint material 31. The imprint material supply unit 33 has, for example, a piezo type ejection mechanism (inkjet head). The supply amount (discharge amount) of the imprint material 31 can be adjusted in the range of 0.1 to 10 pL / drop, and is usually used at about 2 pL / drop. The total supply amount of the imprint material 31 is determined by the density of the pattern portion 41a and the design residual film thickness. The imprint material supply unit 33 controls the supply position, the supply amount, and the like based on the operation command from the control unit 15.

The substrate holding portion 20 holds the substrate 21 and is a movable holding portion. For example, when the mold 41 comes into contact with the imprint material 31 on the substrate 21, the substrate 21 is moved by the substrate holding portion 20, so that the pattern portion 41a and the substrate-side pattern in the shot region are aligned. The substrate holding portion 20 has a substrate chuck 22 that holds the substrate 21 by an suction force, and a substrate stage 23 that mechanically holds the substrate chuck 22 and makes it movable in each axial direction. The board stage 23 includes a moving mechanism 23a that moves the board by moving on the surface plate 11. The moving mechanism 23a can move the substrate along the path between the imprint material supply position (first position) and the imprint position (second position). Here, the imprint material supply position (first position) is a position where the imprint material supply unit 33 supplies the imprint material, and is a supply port for the imprint material such as a nozzle for discharging the imprint material. The position facing with. The imprint position (second position) is a position where the mold 41 and the imprint material 31 on the substrate 21 are brought into contact with each other. When the moving mechanism 23a executes imprinting, the substrate 21 (shot region) is moved to the imprinting material supply position, and the imprinting material 31 is supplied by the imprinting material supply unit 33. Examples of the power source that can be adopted in the moving mechanism 23a include a linear motor and a flat motor. A plurality of drive systems such as a coarse movement drive system and a fine movement drive system may be included in each direction of the moving mechanism 23a, the X-axis and the Y-axis. Further, there may be a configuration having a drive system for adjusting the position in the Z-axis direction, a position adjusting function in the θ direction of the substrate 21, a tilt function for correcting the inclination of the substrate 21, and the like.

The substrate holding portion 20 is provided with a plurality of reference mirrors 71 (reflecting portions) corresponding to each of the directions of X, Y, Z, ωx, ωy, and ωz on its side surface. Here, ωx, ωy, and ωz represent the rotation directions around the X-axis, Y-axis, and Z-axis, respectively. On the other hand, the imprint device 10 includes a plurality of laser interferometers 73 (length measuring instruments) that measure the position of the substrate stage 23 by irradiating each of these reference mirrors 71 with a beam 72. Note that FIG. 1 shows only one set of the reference mirror 71 and the laser interferometer 73. The laser interferometer 73 measures the position of the substrate 21 in real time, and the control unit 15 described later executes positioning control of the substrate 21 (board stage 23) based on the measured value at this time. As such a position measuring mechanism, an encoder or the like using a semiconductor laser may be adopted instead of the laser interferometer 73 described above.

The control unit 15 can control the operation and adjustment of each component of the imprint device 10. The control unit 15 is configured by, for example, a computer, is connected to each component of the imprint device 10 via a line, and can execute control of each component according to a program or the like. The control unit 15 may be configured integrally with other parts of the imprint device 10 (in a common housing), or may be configured separately from the other parts of the imprint device 10 (in a different housing). It may be configured.

The surface plate 11 supports the entire imprint device 10 and forms a reference plane for movement of the substrate stage 23. The vibration isolator 12 is provided between the surface plate 11 and the frame 13 and has a function of removing vibration from the floor. The frame 13 supports the light source 51 to the mold 41 of the constituent portion located above the substrate 21. The alignment scope 14 captures an alignment mark on the substrate 21. The control unit 15 measures the position of the alignment mark based on the image obtained by the alignment scope 14, and positions the substrate stage 23 based on the result.

The mold chuck 42 and the mold drive mechanism 43 have an opening region 47 in the central portion (inside) in the plane direction so that the ultraviolet rays 53 irradiated from the light irradiation unit 50 can pass toward the substrate 21. Here, the mold chuck 42 (or the mold drive mechanism 43) may include a light transmitting member (for example, a glass plate) 45 having a cavity 44 surrounded by a part of the opening region 47 and the mold 41 as a closed space. In this case, the pressure in the cavity 44 is adjusted by a pressure adjusting device (not shown) including a vacuum pump and the like. In this pressure adjusting device, for example, when the mold 41 and the imprint material 31 come into contact with each other, the pressure inside the cavity 44 is set higher than the outside, thereby bending the pattern portion 41a toward the substrate 21 in a convex shape. As a result, the imprint material 31 can be brought into contact with the imprint material 31 from the central portion of the pattern portion 41a, and the uneven pattern of the pattern portion 41a can be filled with the imprint material 31 to every corner.

However, this alone is not sufficient to reliably fill the inside of the uneven pattern with the imprint material 31 without trapping air bubbles. When air bubbles (atmosphere) were present between the mold 41 and the imprint material 31 on the substrate 21 at the time of contact between the mold 41 and the imprint material 31 on the substrate 21, the imprint material 31 was formed after the imprint material 31 was cured. Unfilled defects can occur in the pattern. In order to prevent the occurrence of such unfilled defects, the gas between the mold 41 and the imprint material 31 on the substrate 21 is either highly soluble or highly diffusible with respect to at least the imprint material 31. It is preferable to replace it with a gas having one of the properties. Examples of the gas having such properties include helium and the like.

As a gas replacement method, a method of ejecting a gas such as helium from a gas supply unit 60 arranged at least in the vicinity of the mold 41 to increase the gas concentration around the mold 41 can be considered. By continuing to eject the gas for a certain period of time, the space between the mold 41 and the imprint material 31 on the substrate 21 can be replaced by the gas due to the diffusion effect of the gas itself. However, in such a replacement method, a certain waiting time is required until the gas concentration in the gap between the mold 41 and the imprint material 31 on the substrate 21 is sufficiently increased. In a general imprint device, a waiting time of several tens of seconds or more is expected. Since such waiting time adversely affects productivity, it is necessary to reduce this waiting time as much as possible. As a measure for reducing the waiting time, for example, a gas flow using the drive of the substrate stage 23, that is, a replacement method using the Coanda effect is effective.

Next, a method of replacing the gas between the mold 41 and the imprint material 31 on the substrate 21 with a mixed gas of the first gas and the second gas in the present embodiment will be described. 2 (a) and 2 (b) are views showing the gas supply unit 60 seen from the upper surface. The gas supply unit 60 is arranged so as to surround the mold 41 and has a plurality of supply ports for supplying gas.

In the example of FIG. 2A, the gas supply unit 60 is arranged so as to surround the four sides of the mold 41 and includes a first supply unit 61 that supplies the first gas from the first supply port 61a. The gas supply unit 60 further provides a second supply unit 62 that supplies a second gas, which is a gas different from the first gas, from the second supply port 62a arranged outside the first supply port 61a with respect to the mold 41. include. The first supply unit 61 may include a first supply port 61a, a first tank (not shown) for storing the first gas, and a pipe (not shown) connecting the first tank and the first supply port 61a. Similarly, the second supply unit 62 has a second supply port 62a, a second tank (not shown) for storing the second gas, and a pipe (not shown) connecting the second tank and the second supply port 62a. Can include.
Here, the first gas contains a condensable gas that is liquefied by contact between the mold 41 and the imprint material 31 on the substrate 21, and the second gas is among the imprint material 31, the mold 41, and the substrate 21. It may contain a permeable gas that permeates at least one. The condensable gas is liquefied by an increase in pressure when the imprint material 31 enters the recess of the pattern portion 41a and the gas trapped in the recess is compressed when the mold 41 is brought into contact with the imprint material 31. It refers to the gas that forms. As such a condensable gas, for example, pentafluoropropane is used. Further, as the permeable gas contained in the second gas, for example, helium, nitrogen, carbon dioxide, hydrogen, xenon and the like can be adopted. In the following description, it is assumed that pentafluoropropane is used as the first gas and helium is used as the second gas.

In the example of FIG. 2B, the gas supply unit 60 includes a plurality of supply ports arranged along the side surface of the mold 41, and a first supply port 63 for supplying pentafluoropropane and a second supply port for supplying helium. The supply ports 64 are arranged alternately. The pentafluoropropane is stored in a first tank (not shown) and is supplied to the first supply port 63 via the pipe 65. In this way, the first supply unit that supplies the first gas into the space between the mold 41 and the imprint material 31 on the substrate 21 is provided by the first tank, the pipe 65, and the first supply port 63. It is configured. Helium is stored in a second tank (not shown) and is supplied to the second supply port 64 via the pipe 66. In this way, the second supply unit that supplies the second gas into the space between the mold 41 and the imprint material 31 on the substrate 21 is provided by the second tank, the pipe 66, and the second supply port 64. It is configured. The supply of the first gas by the first supply unit and the supply of the second gas by the second supply unit are controlled by the control unit 15.

The pentafluoropropane supplied from the first supply port 63 and the helium supplied from the second supply port 64 are efficiently mixed with the first supply port 63 in the space between the mold 41 and the substrate 21. The second supply port 64 may be oriented. For example, in the pair of the first supply port 63 and the second supply port 64 adjacent to each other, the pentafluoropropane supplied from the first supply port 63 and the helium supplied from the second supply port 64 are oriented so as to intersect with each other. Will be done.

If the pentafluoropropane is continuously supplied, the temperature of the supply pipe or the like drops due to the heat of vaporization, which may make it difficult to supply the pentafluoropropane. Therefore, a temperature control mechanism may be provided in the supply pipe of pentafluoropropane or the like.

Since the boiling point of pentafluoropropane is approximately -10 to 23 ° C. and the saturated vapor pressure is 0.1 to 0.4 MPa, there is a possibility that pentafluoropropane will be liquefied due to pressure loss in piping or the like. Therefore, it is preferable to make the pipe diameter of pentafluoropropane and the diameter of the first supply port 63 larger than the pipe diameter of helium and the diameter of the second supply port 64.

The control unit 15 controls the first supply unit and the second supply unit so that the first gas and the second gas are mixed in the space between the imprint material 31 and the mold 41 on the substrate. .. For example, the control unit 15 supplies the first gas by the first supply unit and the second gas by the second supply unit according to the position of the substrate 21 in the movement path between the imprint material supply position and the imprint position. Control the supply of. Hereinafter, with reference to FIG. 3, a method of replacing the gas between the mold 41 and the imprint material 31 on the substrate 21 with a mixed gas of pentafluoropropane and helium under the control of the control unit 15 will be described. .. FIG. 3A shows the position of the substrate stage 23 with respect to the mold 41 and the gas supply unit 60 in the imprint process, and the gas supply timing from the gas supply unit 60. The gas supply unit 60 adopts the configuration shown in FIG. 2 (a). FIG. 3B is a flowchart corresponding to FIG. 3A.

In S11, the control unit 15 controls the imprint material supply unit 33 to supply the imprint material 31 to the shot region where imprinting is performed (F11).
In S12, the control unit 15 controls the gas supply unit 60 to supply pentafluoropropane from the first supply unit 61. At this point, helium is not supplied from the second supply unit 62 (F12).
In S13, the control unit 15 controls the movement mechanism 23a to start the movement of the substrate stage 23 so that the shot region in which the imprint material 31 is arranged is below the mold 41. At the same time, in S14, the control unit 15 starts supplying helium from the second supply unit 62 (F13). Regarding the substrate stage 23, in the example of FIG. 3, it is driven in one direction, but it may be driven in a plurality of directions such as a rectangle or a zigzag. By driving in multiple directions, pentafluoropropane and helium can be mixed more effectively. Further, the control unit 15 promotes mixing by alternately supplying pentafluoropropane and helium in time while the substrate 21 is being moved from the imprint material supply position to the imprint position by the moving mechanism 23a. You may let me.

When the shot region comes directly under the mold 41, the control unit 15 stops the movement of the substrate stage 23 at S15 and stops the supply of pentafluoropropane and helium at S16 (F14). After that, in S17, the control unit 15 executes the contact / separation operation. The series of processes S11 to S17 described above are repeated for each shot area.

The pentafluoropropane supplied in S12 is mixed with the helium supplied in S14 as the substrate stage 23 moves in S13. In S15, the gap between the mold 41 and the imprint material 31 on the substrate 21 is filled with a mixed gas of pentafluoropropane and helium. Further, by changing the supply amounts of pentafluoropropane and helium, the concentration of pentafluoropropane in the gap between the mold 41 and the imprint material 31 on the substrate 21 can be arbitrarily changed.

As described above, in the present embodiment, pentafluoropropane and helium are not mixed in advance and then supplied, but are separately supplied and then mixed. Therefore, it is not necessary to heat the pentafluoropropane to have the same vapor pressure as helium.

In the present embodiment, the second supply port 62a is arranged outside the first supply port 61a with respect to the mold 41 (FIG. 2A), but the first supply port 61a and the second supply port 62a The positional relationship may be reversed.

When the gas supply unit 60 has the configuration shown in FIG. 2B, the processing is as follows.
The control unit 15 controls the imprint material supply unit 33 in S11 to supply the imprint material 31, and in S12, supplies pentafluoropropane from the first supply port 63 of the gas supply unit 60. At this point, helium is not supplied from the second supply port 64 of the gas supply unit 60.
In S13, the control unit 15 starts moving the substrate stage 23 so that the shot region in which the imprint material 31 is arranged is below the mold 41. At the same time, in S14, the control unit 15 starts supplying helium from the second supply port 64 of the gas supply unit 60.

When the shot region comes directly under the mold 41, the control unit 15 stops the movement of the substrate stage 23 in S15 and stops the supply of pentafluoropropane and helium in S16. After that, in S17, the control unit 15 executes the contact / separation operation. The series of processes S11 to S17 described above are repeated for each shot area.

The pentafluoropropane supplied in S12 is mixed with the helium supplied in S14 as the substrate stage 23 moves in S13. In S15, the gap between the mold 41 and the imprint material 31 on the substrate 21 is filled with a mixed gas of pentafluoropropane and helium. As described above, for example, in the pair of the first supply port 63 and the second supply port 64 adjacent to each other, the first supply port 63 and the second supply port 64 have the injection direction of pentafluoropropane and the injection direction of helium, respectively. Are oriented so that they intersect with each other. Therefore, pentafluoropropane and helium are efficiently mixed. Further, the control unit 15 mixes pentafluoropropane and helium by alternately supplying them in time during the movement between the imprint material supply position and the imprint position in the shot region of the substrate 21. May be promoted.

The processes shown in FIG. 3 can be summarized as follows. The control unit 15 starts the supply of the first gas by the first supply unit before the shot region along the path between the imprint material supply position and the imprint position starts. After that, the control unit 15 starts supplying the second gas by the second supply unit as the shot region moves along the path. Then, the control unit 15 stops the supply of the first gas by the first supply unit and the supply of the second gas by the second supply unit when the movement of the substrate 21 to the imprint position is completed.

According to the above embodiment, a mixed gas of pentafluoropropane and helium having different vapor pressures at the same temperature can be efficiently supplied to the gap between the mold 41 and the imprint material 31 on the substrate 21.

<Second Embodiment>
In the second embodiment below, pentafluoropropane is supplied after replacing the gas between the mold 41 and the imprint material 31 on the substrate 21 with helium. Hereinafter, a method of replacing the gas between the mold 41 and the imprint material 31 on the substrate 21 with a mixed gas of pentafluoropropane and helium will be described with reference to FIG. FIG. 4A shows the position of the substrate stage 23 with respect to the mold 41 and the gas supply unit 60 in the imprint process, and the gas supply timing from the gas supply unit 60. FIG. 4B is a flowchart corresponding to FIG. 4A.

In S21, the control unit 15 controls the imprint material supply unit 33 to supply the imprint material 31 to the shot region where imprinting is performed (F21).
In S22, the control unit 15 controls the gas supply unit 60 to supply helium from the second supply unit 62. At this point, pentafluoropropane is not supplied from the first supply unit 61 (F22).
In S23, the control unit 15 controls the movement mechanism 23a to start the movement of the substrate stage 23 so that the shot region in which the imprint material 31 is arranged is below the mold 41. At this time, the gas between the mold 41 and the imprint material 31 on the substrate 21 is once replaced with helium.

After that, in S24, the control unit 15 stops the supply of helium from the second supply unit 62 and starts the supply of pentafluoropropane from the first supply unit 61 (F23). When the shot region comes directly under the mold 41, the control unit 15 stops the movement of the substrate stage 23 in S25 and stops the supply of pentafluoropropane in S26 (F24). After that, in S27, the control unit 15 executes the contact / separation operation. The series of processes of S21 to S27 described above are repeated for each shot area.

The amount of helium supplied in S22 is such that the gap between the mold 41 and the imprint material 31 on the substrate 21 is filled with high-concentration helium. By changing the supply amount of pentafluoropropane in S24, the concentration of pentafluoropropane in the gap between the mold 41 and the imprint material 31 on the substrate 21 can be arbitrarily changed.

As described above, in the present embodiment, pentafluoropropane and helium are not mixed in advance and then supplied, but are separately supplied and then mixed. Therefore, it is not necessary to heat the pentafluoropropane to have the same vapor pressure as helium.

The processing shown in FIG. 4 can be summarized as follows. The control unit 15 starts supplying the second gas by the second supply unit before moving the substrate 21 to which the imprint material 31 is supplied to the shot region by the imprint material supply unit 33 to the imprint position by the moving mechanism 23a. do. After that, the control unit 15 starts supplying the first gas by the first supply unit as the substrate 21 starts moving to the imprint position. At this time, the supply of the second gas by the second supply unit may be stopped. Then, the control unit 15 stops the supply of the first gas by the first supply unit and the supply of the second gas by the second supply unit when the movement of the substrate 21 to the imprint position is completed.

According to the above embodiment, a mixed gas of pentafluoropropane and helium having different vapor pressures at the same temperature can be efficiently supplied to the gap between the mold 41 and the imprint material 31 on the substrate 21.

<Third Embodiment>
Since the condensable gas has a low boiling point (low vapor pressure), there is a problem that when it is supplied as a gas, it liquefies when pressurized. For example, in the case of hydrofluorocarbon (1,1,1,3,3-pentafluoropropane), the supply pressure is 50 kPa at room temperature.

If the piping route is long or the flow rate is large and the pressure loss is large, the piping will be liquefied when pressurized, which may cause clogging of the piping, which may hinder the supply in the gaseous state. Therefore, for example, it is necessary to take measures such as winding a heater around the pipe to heat the pipe and raising the temperature of the condensable gas inside the pipe to raise the vapor pressure.

Since the condensable gas in the pipe is always kept in a pressurized state, it is necessary to constantly heat the pipe, which causes a problem of increased power consumption. Furthermore, when the power of the device is turned off, the power supply to the device is cut off, or the heater wound around the pipe fails, the temperature of the pipe drops, and at the same time, the temperature of the condensable gas also drops and is pressurized. There is a problem that the condensed gas in the state is liquefied and the piping is clogged.

In view of these problems, a technique for preventing the liquefaction of the condensable gas in the pipe and enabling the supply of the condensable gas will be described below even if the pipe is not constantly heated.

FIG. 5 is a diagram showing the configuration of the imprint device 100 of the present embodiment. The imprint device 100 is a lithography device used in a manufacturing process of a semiconductor device or the like, and transfers a pattern of a mold onto a substrate. In the present embodiment, the imprint device 100 employs a photocuring method for curing the imprint material by irradiating the imprint material with ultraviolet rays.

The imprint device 100 includes a mold head 104 that holds the mold 103, a stage 107 that holds the substrate 106, and an imprint material supply unit 33. The imprint device 100 further includes a gas supply unit 120 that supplies a gas (condensable gas) that is condensed by pressure, an exhaust path 130 that exhausts the space between the mold 103 and the substrate 106, and a control unit 140. ..

The mold 103 has a pattern portion 103a on which a pattern to be transferred to the substrate 106 (resin supplied to the substrate 106) is formed on a surface facing the substrate 106. The mold 103 has, for example, a rectangular outer shape and is made of a material that transmits ultraviolet rays such as quartz.

The mold head 104 holds (fixes) the mold 103 by vacuum suction force or electrostatic force. The mold head 104 includes a drive mechanism for driving the mold 103 in the z-axis direction, and the mold 103 is brought into contact with the imprint material (uncured resin) on the substrate 106 with an appropriate force to imprint on the substrate 106. It has a function of peeling the mold 103 from the material (cured resin).

The substrate 106 is a substrate on which the pattern of the mold 103 is transferred, and includes, for example, a single crystal silicon substrate, an SOI (Silicon on Insulator) substrate, and the like.

The stage 107 includes a substrate chuck that holds the substrate 106, and a drive mechanism for aligning the mold 103 and the substrate 106. Such a drive mechanism is composed of, for example, a coarse movement drive system and a fine movement drive system, and drives the substrate 106 in the x-axis direction and the y-axis direction. Further, such a drive mechanism has a function of driving the substrate 106 not only in the x-axis direction and the y-axis direction but also in the z-axis direction and the θ (rotation around the z-axis) direction and a tilt function for correcting the inclination of the substrate 106. May be provided.

The imprint material supply unit 33 supplies (coats) a liquid photocurable imprint material onto the substrate 106 to form a resin layer RL on the substrate 106. The gas supply unit 120 is a gas (condensable gas) that condenses in the space between the mold 103 and the substrate 106 (resin layer RL) by the pressure when the mold 103 is brought into contact with the imprint material on the substrate 106. Supply. In other words, the gas supply unit 120 replaces the gas in the space between the mold 103 and the substrate 106 with a condensable gas. Under the control of the control unit 140, the gas supply unit 120 is sufficiently condensed by the pressure when the mold 103 is brought into contact with the imprint material on the substrate 106 (that is, the occurrence of unfilled defects is sufficiently prevented). ), Supplying a condensable gas. In the present embodiment, the gas supply unit 120 supplies the condensable gas through the supply port 125 arranged in the vicinity of the space between the mold 103 and the substrate 106. However, as the method for supplying the condensable gas, any method well known in the art can be applied, and for example, a supply port for supplying the condensable gas may be formed in the mold 103. Further, the gas supply unit 120 replaces not only the space between the mold 103 and the substrate 106 but also the gas in the atmosphere of the entire device (that is, in the chamber accommodating each part of the imprint device 100) with the condensable gas. You may. Further, the gas supplied from the gas supply unit 120 may be a gas obtained by mixing a highly permeable gas (for example, helium) and a condensable gas. This permeable gas has the property of dissolving or diffusing into at least one of the mold 103, the substrate 106 or the imprint material. The specific configuration and function of the gas supply unit 120 will be described in detail later.

The exhaust path 130 exhausts the condensable gas supplied from the gas supply unit 120 into the space between the mold 103 and the substrate 106. For example, the condensable gas 1,1,1,3,3-pentafluoropropane has a high global warming potential of 950 (CO ₂ = 1), and it is necessary to prevent the supplied condensable gas from leaking into the atmosphere. .. The exhaust path is connected to a purification device (not shown) provided separately from the imprint device 100, and the condensable gas is taken out by the purification device and reused.

The control unit 140 includes a CPU, a memory, and the like, and controls the entire imprint device 100 (operation). In the present embodiment, the control unit 140 functions as a processing unit that controls each unit of the imprint device 100 to perform imprint processing. The imprint process is to cure the imprint material in a state where the mold 103 is in contact with the imprint material supplied to the substrate 106, and peel the mold 103 from the cured imprint material to form a mold on the substrate 106. A process of transferring a pattern of 103.

Here, a specific configuration and function of the imprint material supply unit 33 will be described. The imprint material supply unit 33 includes an imprint material container 111 for storing the imprint material and a dispenser 113 for supplying the imprint material. By moving the stage 107 (scan movement or step movement) while supplying the imprint material from the imprint material supply unit 33, the imprint material can be supplied on the substrate 106 (shot region). ..

The imprint material container 111 supplies the imprint material to the dispenser 113 via the pipe 112. The dispenser 113 includes, for example, a line nozzle in which the nozzles are arranged in a line, and a droplet of about 1 picolitre is uniformly dropped onto the substrate 106 by a piezojet method, a microsolenoid method, or the like.

In the present embodiment, the condensable gas exists as a gas under normal conditions (temperature and pressure) in the internal environment (temperature and pressure) of the imprint device 100, and the mold 103 is brought into contact with the imprint material during the imprint process (that is, the mold 103 is brought into contact with the imprint material). It has the property of condensing (depending on the pressure of the moment).

When the vapor pressure of the condensable gas at room temperature (23 ° C.) is lower than 0.05 MPa, for example, the condensable gas is condensed by a small pressure difference generated in the piping, and the supply amount of the condensable gas is controlled. Will be difficult. On the other hand, when the vapor pressure of the condensable gas at room temperature (23 ° C.) is higher than 1 MPa, the pressure required to condense the condensable gas becomes large when the imprint process is performed at room temperature, so that it can withstand. A device with pressure is required, and the device becomes large-scale. Therefore, the vapor pressure of the condensable gas is preferably higher than 0.05 MPa and lower than 1 MPa at the temperature at which the imprint treatment is performed. Further, the vapor pressure of the condensable gas is more preferably around atmospheric pressure (0.1 MPa), and therefore higher than 0.1 MPa and lower than 1 MPa.

Further, the condensable gas may be condensed at room temperature (23 ° C.) at atmospheric pressure (0.1 MPa). Therefore, the boiling point of the condensable gas is preferably 15 ° C. or higher and 30 ° C. or lower. When the boiling point of the condensable gas is lower than 15 ° C., the temperature control mechanism for controlling the temperature inside the imprint device 100 becomes large. On the other hand, when the boiling point of the condensable gas is higher than 30 ° C., the pressure inside the imprint device 100 is reduced from the atmospheric pressure or the temperature inside the imprint device 100 is lowered in order to condense the condensable gas. It is necessary to raise it, and the device becomes large-scale.

Examples of such a condensable gas include the following.
-Trichlorofluoromethane (boiling point 24 ° C.) having a vapor pressure of 0.1056 MPa at room temperature (23 ° C.).
1,1,1,3,3-pentafluoropropane (boiling point 15 ° C.) having a vapor pressure of 0.14 MPa at room temperature (23 ° C.)

Further, the photocurable imprint material in the present embodiment needs to be an imprint material in which a condensable gas is dissolved. For example, 1,1,1,3,3-pentafluoropropane, which is an example of a condensable gas, is dissolved in a general imprint material for imprint based on an acrylic resin.

For example, 1,1,1,3,3-pentafluoropropane has a vapor pressure of 0.14 MPa at room temperature (23 ° C.), but in order to allow a specified flow rate to flow in the gas supply unit 120, It is necessary to pressurize. However, due to the pressure loss of equipment such as pipes and valves, when the vapor pressure is exceeded, it liquefies and the inside of the pipe is clogged, which causes a problem that it cannot flow. A method of flowing a predetermined flow rate without liquefying the condensable gas will be described together with a specific configuration and function of the gas supply unit 120.

In the condensable gas container 121, the condensable gas is pressurized and stored in a liquid state. In the present embodiment, the condensable gas container 121 is configured in the imprint device 100, but the condensable gas may be supplied in a gaseous state from the factory equipment. Further, the condensable gas container 121 may be installed outside the imprint device 100 and supplied.

The condensed gas vaporized from the condensable gas container 121 is supplied to the mass flow controller (mass flow meter) 123 through the valve VL1 and the pipe 122. The mass flow controller 123 is controlled by the control unit 140, and controls the flow rate so that a specified flow rate flows. The condensable gas is supplied from the mass flow controller 123 through the pipe 122 to the space between the mold 103 and the substrate 106 from the supply port 125.

The pipe 122 is covered by the temperature adjusting unit 124, and the pipe 122 can be kept at a predetermined temperature. By keeping the pipe 122 at a predetermined temperature, the temperature of the condensable gas can also be kept at a predetermined temperature. By making 1,1,1,3,3-pentafluoropropane higher than room temperature (23 ° C.), the vapor pressure can be made higher than 0.14 MPa, and a predetermined flow rate can be flowed in a gaseous state. Will be.

The temperature adjusting unit 124 may cover the entire pipe 122 or a part of the pipe 122. Further, each device of the mass flow controller 123, the valve VL1, and the supply port 125 may be covered. The temperature adjusting unit 124 can select and cover the place where the condensable gas liquefies.

In the state where the imprint process is not performed, the condensable gas stays in the pipe 122 while being pressurized. As described above, the temperature adjusting unit 124 must always continue to heat the pipe 122 even when the imprint processing is not performed, and there is a problem that the power consumption increases. Further, when the power of the device is turned off, the power supply to the device is interrupted, or the temperature control unit 124 fails, the temperature of the pipe 122 drops, and at the same time, the temperature of the condensable gas also drops and is pressurized. There is a problem that the condensed gas in the state of being liquefied.

During the imprint process, the valve VL1 is open, the valve VL2 and the valve VL3 are closed, and the condensable gas is supplied from the condensable gas container 121 to the mass flow controller 123 through the pipe 122. When the imprint process is not performed, the valve in the mass flow controller 123 is closed and the inside of the pipe 122 is in a pressurized state. At this time, by closing the valve VL1 and opening the valve VL3, the condensable gas in the pipe 122 is discharged to the exhaust path 130 through the pressure regulator 127 and the pipe 128.

For example, when the temperature inside the device is the same as room temperature (23 ° C.), if the set pressure of the pressure regulator 127 is set between 0.10 MPa and 0.14 MPa at atmospheric pressure, the pressure inside the pipe 122 will be 1,1. , 1,3,3-Pentafluoropropane is lower than the vapor pressure (0.14 MPa). Therefore, the condensable gas in the pipe 122 does not liquefy even if the temperature adjusting unit 124 does not heat the pipe 122. Since the temperature adjusting unit 124 is not heated, the power consumption of the device 100 can be suppressed.

Although it was stated that the set pressure of the pressure regulator 127 is set between the atmospheric pressure of 0.10 MPa and 0.14 MPa, the set pressure of the pressure regulator 127 is set from the viewpoint of preventing the air from entering the pipe 122 and being polluted by the atmosphere. It is desirable that the atmospheric pressure is slightly higher than 0.10 MPa.

When the power of the device is turned off, when the power supply to the device is cut off, or when the valve VL3 is opened when the valve is not energized, the pressure in the pipe 122 becomes the set pressure of the pressure regulator 127, and the pressure in the pipe 122 becomes the set pressure in the pipe 122. It is possible to prevent the liquefaction of the condensable gas. The pressure regulator 127 may have a constant set pressure or may have a mechanism that can be arbitrarily changed. Further, the control unit 140 may change the set pressure from the temperature in the device 100 or the pressure in the pipe 122. The pressure regulator 127 can be applied by any method well known in the art, and a typical example thereof is a relief valve that adjusts the pressure for opening and closing the valve by the force of a spring.

As another method, a method of purging the pipe 122 with an inert gas such as nitrogen will be described. When the imprint process is not performed or when the power of the device is turned off, the valve VL1 and the valve VL3 are closed and the valve VL2 is opened. Thereby, the inert gas such as nitrogen can be supplied from the purge gas supply unit 126, and the inside of the pipe 122 can be replaced with the inert gas from the condensable gas. The purge gas supplied from the purge gas supply unit 126 is supplied to the mass flow controller 123 through the pipe 122. The mass flow controller 123 is controlled by the control unit 140, and controls the flow rate so that the specified flow rate flows. The purge gas is discharged from the mass flow controller 123 through the pipe 122 to the supply port 125. Here, the purge gas may be discharged to the exhaust path 130 through the pressure regulator 127 by opening the valve VL3 with the flow rate of the mass flow controller 123 set to zero.

The purge gas may be an inert gas such as nitrogen or CDA (clean dry air).

The method of depressurizing the inside of the pipe 122 and the method of purging the above-mentioned pipe 122 can be arbitrarily selected depending on the operating state of the apparatus by switching with the flow path switching unit (valve VL1, valve VL2, valve VL3). Further, the temperature in the apparatus 100, the pressure in the pipe 122, and the operating state of the apparatus may be automatically switched under the control unit 140.

In the method of depressurizing the inside of the pipe 122 and the method of purging, the cleanliness can be maintained because the pipe 122 does not come into contact with the atmosphere. Further, the mass flow controller 123 has a function of controlling the flow rate and closing the internal valve when the power is not supplied. Since the mass flow controller 123 closes the internal valve even when there is no power supply, the cleanliness of the pipe 122 is maintained in order to prevent the inflow of air from the supply port 125 and maintain the airtightness of the pipe 122. Can be done.

The operation of the imprint device 100 will be described. The imprint material is supplied from the imprint material container 111 to the dispenser 113 through the pipe 112. The stage 107 is moved so that the target shot region on the substrate 106 (the shot region from which the pattern of the mold 103 is transferred) is located below the dispenser 113, and the imprint material is supplied to the target shot region on the substrate 106. As a result, the resin layer RL made of the imprint material is formed on the substrate 106.

Next, the stage 107 is moved so that the target shot region on the substrate 106 is located below the mold 103, and the mold 103 is brought into contact with the imprint material supplied to the target shot region. At this time, the condensable gas is supplied from the gas supply unit 120 to the space between the mold 103 and the substrate 106 (imprint material). Therefore, in an environment where the space between the mold 103 and the substrate 106 is replaced with the condensable gas, the mold 103 comes into contact with the imprint material supplied to the target shot region.

Next, in a state where the imprint material on the substrate 106 and the mold 103 are in contact with each other, the imprint material on the substrate 106 is irradiated with ultraviolet rays via the mold 103 to cure the imprint material. Next, the mold 103 is peeled off from the cured imprint material on the substrate 106. As a result, the pattern of the mold 103 is transferred to the target shot region on the substrate 106.

As described above, according to the imprint device 100 of the present embodiment, it is possible to prevent the condensable gas from liquefying in the pipe 122 and suppress the power consumption of the device. Moreover, the cleanliness in the pipe 122 can be maintained.

<Fourth Embodiment>
Next, the imprint device according to the fourth embodiment of the present invention will be described. FIG. 6 is a diagram showing the configuration of the imprint device 101 of the present embodiment.

The features of this embodiment are that a heater 129 is provided in the supply path from the purge gas supply unit 126, and the purge gas supply unit 126, the heater 129, the valve VL2, and the valve VL3 are connected to the UPS (uninterruptible power supply). Is. Since the configuration of the imprint device 101 of the present embodiment is the same as that of the imprint device 100 (FIG. 5) according to the third embodiment, the reference numerals of the components are the same as those of the imprint device 100. Is omitted.

The operation of the imprint device 101 according to the present embodiment will be described. When the power of the device is turned off, the power supply to the device is interrupted, or the temperature control unit 124 fails, the pipe 122 is not heated, so that the condensable gas in the pipe 122 may be liquefied. By opening the valve VL3 connected to the UPS (uninterruptible power supply), the condensable gas in the pipe 122 can be discharged through the pressure regulator 127 to reduce the pressure in the pipe 122 to the set pressure of the pressure regulator. can.

Alternatively, the purge gas can be supplied from the purge gas supply unit 126 connected to the UPS (uninterruptible power supply), the purge gas can be heated by the heater 129, and the purge gas can be supplied to the pipe 122 by opening the valve VL2. can. By heating the purge gas with the heater 129, even when the condensable gas is liquefied in the pipe 122, the liquefied condensable gas can be vaporized and the clogging in the pipe 122 can be removed.

Even if the power of the device is turned off, the power supply to the device is interrupted, or the temperature control unit 124 fails, the condensable gas in the pipe 122 can prevent liquefaction or remove the liquefied condensable gas. can. Further, since the condensable gas can be supplied in a short time after the device is restored, the operating rate of the device can be increased.

In the present embodiment, the case where the power of the device is turned off, the power supply to the device is interrupted, or the temperature control unit 124 fails is described, but the method for removing the condensable gas in the pipe 122 is liquefied. It can also be used as.

The purge gas from the purge gas supply unit 126 can be heated by the heater 129 and supplied into the pipe 122 both when the imprint process is performed and when the imprint process is not performed. The purge gas heated by the heater 129 can pass through the pipe 122 and the mass flow controller 123 and be discharged from the supply port 125. Further, it can be discharged to the exhaust path 130 through the valve VL3, the pressure regulator 127, and the pipe 128.

This promotes the vaporization of the liquefied condensable gas in each part, and the liquefied condensable gas can be removed in a short time.

<Embodiment of article manufacturing method>
The pattern of the cured product formed by using the imprint device is used permanently for at least a part of various articles or temporarily when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, a mold, or the like. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include a mold for imprinting.

The pattern of the cured product is used as it is as a constituent member of at least a part of the above-mentioned article, or is temporarily used as a resist mask. After etching or ion implantation in the substrate processing step, the resist mask is removed.

Next, the article manufacturing method will be described. As shown in FIG. 7 (a), a substrate 1z such as a silicon substrate on which a workpiece 2z such as an insulator is formed on the surface is prepared, and subsequently, the substrate 1z is injected into the surface of the workpiece 2z by an inkjet method or the like. The printing material 3z is applied. Here, a state in which a plurality of droplet-shaped imprint materials 3z are applied onto the substrate is shown.

As shown in FIG. 7B, the imprint mold 4z is opposed to the imprint material 3z on the substrate with the side on which the uneven pattern is formed facing. As shown in FIG. 7 (c), the substrate 1z to which the imprint material 3z is applied is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the work material 2z. When light is irradiated through the mold 4z as energy for curing in this state, the imprint material 3z is cured.

As shown in FIG. 7D, when the imprint material 3z is cured and then the mold 4z and the substrate 1z are separated from each other, a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. This pattern of cured product, the convex portion of the concave portion is a cured product of the mold, and a shape in which the convex portion of the mold is corresponding to the concave portion of the cured product, i.e., the uneven pattern of the mold 4z to imprint material 3z It has been transcribed.

As shown in FIG. 7 (e), when etching is performed using the pattern of the cured product as an etching resistant type, the portion of the surface of the work material 2z where the cured product is absent or remains thin is removed, and the groove 5z is formed. Become. As shown in FIG. 7 (f), by removing the pattern of the cured product, it is possible to obtain an article in which the groove 5z is formed on the surface of the work material 2z. Here, the pattern of the cured product is removed, but it may not be removed even after processing, and may be used, for example, as a film for interlayer insulation contained in a semiconductor element or the like, that is, as a constituent member of an article.

10: Imprint device, 20: Board holding part, 21: Board, 23: Board stage, 33: Imprint material supply part 33, 40: Mold holding part, 41: Mold, 50: Light irradiation part, 52: Illumination optics system

Claims (11)

An imprint device that forms a pattern on the substrate by bringing a mold into contact with the imprint material on the substrate.
A first supply unit that includes a first supply port and supplies a first gas from the first supply port to the space between the imprint material and the mold on the substrate.
A second supply unit that includes a second supply port and supplies a second gas different from the first gas to the space from the second supply port via a path different from the first supply unit .
A control unit that controls the first supply unit and the second supply unit so that the first gas and the second gas are mixed in the space.
An imprint device characterized by having. An imprint material supply unit that supplies the imprint material to the shot region of the substrate,
The shot region is moved along the path between the first position where the imprint material is supplied by the imprint material supply unit and the second position where the contact is performed while holding the substrate. Movable holding part and
Including
The control unit supplies the first gas by the first supply unit and the second gas by the second supply unit according to the position of the holding unit when the shot region moves along the path. Control the supply of
The imprint device according to claim 1. The first gas contains a condensable gas that is liquefied by the contact, and the second gas contains a permeable gas that permeates at least one of the imprint material, the mold, and the substrate.
The control unit starts supplying the first gas by the first supply unit before the movement of the shot region along the path starts, and the shot region moves along the path. The supply of the second gas by the second supply unit is started.
The imprint device according to claim 2. The first gas contains a condensable gas that is liquefied by the contact, and the second gas contains a permeable gas that permeates at least one of the imprint material, the mold, and the substrate.
The control unit starts supplying the second gas by the second supply unit before the movement of the shot region along the path starts, and the shot region moves along the path. The supply of the first gas by the first supply unit is started.
The imprint device according to claim 2. The first gas contains a condensable gas that is liquefied by the contact, and the second gas contains a permeable gas that permeates at least one of the imprint material, the mold, and the substrate.
The control unit alternately supplies the first gas by the first supply unit and the second gas by the second supply unit during the movement of the shot region along the path.
The imprint device according to claim 2. The imprint device according to any one of claims 3 to 5, wherein the condensable gas contains pentafluoropropane. The inn according to any one of claims 3 to 5, wherein the permeable gas contains a gas selected from a plurality of gases including helium, nitrogen, carbon dioxide, hydrogen, and xenon. Printing device. The imprint device according to any one of claims 1 to 7, wherein the second supply port is arranged outside the first supply port with respect to the mold. The imprint device according to any one of claims 1 to 7, wherein the first supply port and the second supply port are alternately arranged along the side surface of the mold. The first supply port and the second supply port are oriented so that the first gas supplied from the first supply port and the second gas supplied from the second supply port intersect with each other. The imprint device according to claim 9, wherein the imprint device is provided. A step of forming a pattern on a substrate by using the imprint device according to any one of claims 1 to 10.
A step of processing the substrate on which the pattern is formed in the step and a step of processing the substrate.
A method for manufacturing an article, characterized by having.

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