JP6980059B2 - Power converter - Google Patents

Description

The present application relates to a power conversion device.

As a conventional power conversion device, power is supplied to a plurality of drive circuits for driving a plurality of semiconductor switching elements on and off by a control power supply circuit using an isolated transformer, and the input / output voltage and current are set to desired values. A technique is disclosed in which a control power supply circuit common to the drive circuit is used to supply power for a sensor circuit that measures the voltage and current of a power converter for control (see, for example, Patent Document 1).

Japanese Patent Application No. 2019-38113

However, when the power conversion device shown in Patent Document 1 is to be mounted at a high density, the element parts are arranged on the substrate so as not to generate an empty space, and the power conversion device is arranged for a plurality of drive circuits and sensor circuits. Wiring needs to be routed from one control power circuit. Therefore, the wirings intersect with each other and a malfunction occurs due to noise. In particular, when the wiring of the drive circuit and the wiring of the sensor circuit intersect, noise generated by the on / off operation of the semiconductor switching element is superimposed on the sensor circuit side due to capacitive coupling, and a malfunction occurs. As a countermeasure, there is a method of wiring by bypassing element parts (power conversion circuit, control circuit, etc.) so that the wiring does not intersect with each other. There is a problem that the equipment becomes large and the cost increases.

The present application discloses a technique for solving the above-mentioned problems, and an object thereof is to provide a compact and inexpensive power conversion device with improved noise immunity.

The power conversion device disclosed in the present application has a power supply circuit having a first power supply output and a second power supply output, and a board on which the power supply circuit is mounted, and the first power supply output paired on the board. At the place where the wiring of the first power supply output and the wiring of the second power supply output intersect in the same layer, only one of the wiring of the first power supply output and the wiring of the second power supply output straddles the other wiring. It is composed of connecting wiring formed by forming a conductor.

Since the power conversion device disclosed in the present application adopts the above-mentioned configuration, it is a small and inexpensive device with improved noise immunity.

It is a figure which shows the power conversion apparatus by Embodiment 1. FIG. FIG. 1 is a cross-sectional view taken along the line AA of FIG. 1 according to the first embodiment. It is a figure which shows the power conversion apparatus by Embodiment 2. FIG. 3 is a sectional view taken along the line AA of FIG. 3 according to the second embodiment. FIG. 3 is a sectional view taken along the line BB of FIG. 3 according to the second embodiment. It is a figure which shows the power conversion apparatus of the comparative example.

Embodiment 1.
The first embodiment will be described with reference to the drawings. FIG. 1 is a plan view showing an outline of the power conversion device 100, and FIG. 2 is a sectional view taken along the line AA of FIG. In the first embodiment, the drive circuit 1 and the sensor circuit 2 will be described, but the present invention is not limited to this, and "drive circuit and drive circuit" and "sensor circuit and sensor circuit" can also be applied. .. In FIG. 1, the power conversion device 100 includes the main component components described below. On the substrate 5, a drive circuit 1 that drives the semiconductor switching element 9 on and off, a sensor circuit 2 that measures the voltage and current of the power conversion device 100, and a power supply circuit that supplies power to the drive circuit 1 and the sensor circuit 2 3 and a control circuit 4 for controlling the power conversion circuit 8 are mounted. Each of the above component components includes a first power supply potential wiring 6A, a first reference potential wiring 6B, a second power supply potential wiring 7A, a second reference potential wiring 7B, and a first connecting wiring 20A, second, which are mounted on the substrate 5. Each is connected so as to function by a connecting wire 20B. Here, the substrate 5 may be a one-layer or two-layer or more multilayer substrate. Note that FIG. 1 shows an enlarged view of the wiring structure between the power supply circuit 3, the drive circuit 1, and the sensor circuit 2, which is a feature of the first embodiment.

As shown in FIGS. 1 and 2, the power supply circuit 3 and the drive circuit 1 are created by the first power supply potential wiring 6A created by the printed wiring on the first surface 5A of the board and the printed wiring on the second surface 5B of the board. It is connected by the first reference potential wiring 6B. The first power supply potential wiring 6A and the first reference potential wiring 6B are arranged so as to overlap each other in a plan view when the substrate 5 shown in FIG. 1 is viewed from above. As a result, the area of the current loop formed by the power supply circuit 3, the drive circuit 1, the first power supply potential wiring 6A, and the first reference potential wiring 6B is reduced, and the generation of electromagnetic induction due to noise generated in the peripheral circuit is suppressed. However, the noise immunity is improved. Further, the power supply circuit 3 and the sensor circuit 2 are similarly connected by a second power supply potential wiring 7A provided on the first surface 5A of the substrate and a second reference potential wiring 7B provided on the second surface 5B of the substrate. In addition, they are arranged so as to overlap the second power supply potential wiring 7A in a plan view.

As shown in FIG. 1, at the intersection of the first power supply potential wiring 6A mounted on the first surface 5A of the substrate and the second power supply potential wiring 7A, the first connection provided in the second power supply potential wiring 7A. The wiring 20A is provided so as to straddle the first power supply potential wiring 6A. Similarly, at the intersection of the first reference potential wiring 6B mounted on the second surface 5B of the substrate and the second reference potential wiring 7B, the second connecting wiring 20B provided on the second reference potential wiring 7B is the second. It is provided so as to straddle one reference potential wiring 6B. The first connecting wiring 20A and the second connecting wiring 20B are molded using an aluminum material or a copper material, and a part thereof is covered with an insulating member such as resin, so that the insulating performance with adjacent parts is achieved. Is improved, close placement is possible, and further miniaturization is possible. As shown in FIG. 1, the width W1 of the first power supply potential wiring 6A, the second power supply potential wiring 7A, the first reference potential wiring 6B, and the second reference potential wiring 7B> the first connecting wiring 20A, the second connecting wiring. The width W2 is 20B.

Further, of the first power supply potential wiring 6A and the first reference potential wiring 6B, the second power supply potential wiring 7A, and the second reference potential wiring 7B, the one having the larger rated current value (current amount flowing) is connected to the first connecting wiring 20A. By configuring the second connecting wiring 20B, the size of the device can be further reduced. As an example, when the amount of current flowing through the second power supply potential wiring 7A and the second reference potential wiring 7B is large, the second power supply potential wiring 7A and the second reference potential are higher than the first power supply potential wiring 6A and the first reference potential wiring 6B. It is necessary to widen the wiring width of the wiring 7B. Here, the thickness of the wiring printed on the board 5 is on the order of μm, whereas the thickness of the first connecting wiring 20A and the second connecting wiring 20B is on the order of mm, so that a wide wiring width like the printed wiring is not required. .. Therefore, by applying the first connecting wiring 20A and the second connecting wiring 20B to the second power supply potential wiring 7A and the second reference potential wiring 7B, the first power supply potential wiring 6A, the first reference potential wiring 6B, and the second At the intersection of the power supply potential wiring 7A and the second reference potential wiring 7B, the wiring cross-sectional area of the second power supply potential wiring 7A and the second reference potential wiring 7B can be reduced, and the device can be miniaturized.

Unlike the power conversion device of FIG. 6 shown as a comparative example, the power conversion device 100 having the above configuration does not adopt a wiring structure that bypasses the component components on the substrate, so that the device is compact. It has the effect of improving noise immunity at low cost.

Although the first power supply potential wiring 6A and the first reference potential wiring 6B described above are the wirings that connect the power supply circuit 3 and the drive circuit 1, they may be the wirings that connect the power supply circuit 3 and the sensor circuit 2. Further, although the second power supply potential wiring 7A and the second reference potential wiring 7B are used as wirings for connecting the power supply circuit 3 and the sensor circuit 2, they may be used as wirings for connecting the power supply circuit 3 and the drive circuit 1, and the specified main components may be used. There is no need to connect between the components.

Embodiment 2.
Next, the second embodiment will be described with reference to the drawings. 3 is a plan view of the power conversion device 100 according to the second embodiment, FIG. 4 is a diagram showing a cross section taken along the line AA of FIG. 3, and FIG. 5 is a diagram showing a cross section taken along the line BB of FIG. The second embodiment has a configuration in which the second connecting wiring 20B connected to the second reference potential wiring 7B in the first embodiment described above is provided on the second surface 5B of the substrate. As shown in FIG. 5, a through hole 10 penetrating the substrate 5 is provided, the second reference potential wiring 7B is connected to the through hole 10, and the third connecting wiring 20C is the first on the first surface 5A of the substrate. It is provided in parallel with the connecting wiring 20A and straddling the first power supply potential wiring 6A, and is the same as that of the first embodiment except for this. By adopting such a configuration, in addition to the effect of the first embodiment, there is an effect that a space is created on the second surface 5B side of the substrate and additional main parts can be installed.

Here, the first connecting wiring 20A and the third connecting wiring 20C can be further miniaturized by arranging the first connecting wiring 20A and the third connecting wiring 20C on a surface far away from the component adjacent to the substrate 5 in the thickness direction of the substrate 5. I can plan. An example of a component that requires insulation is a metal housing that covers the periphery of the power conversion device 100, and when the housing is present on one surface side of the substrate 5, the first connection is made on the other surface side of the substrate 5. By arranging the wiring 20A and the third connecting wiring 20C, it is possible to shorten the distance between the substrate 5 and the housing and prevent a short circuit.

Although the present application describes various exemplary embodiments and examples, the various features, embodiments, and functions described in one or more embodiments are applications of a particular embodiment. It is not limited to, but can be applied to embodiments alone or in various combinations.
Therefore, innumerable variations not exemplified are envisioned within the scope of the techniques disclosed in the present application. For example, it is assumed that at least one component is modified, added or omitted, and further, at least one component is extracted and combined with the components of other embodiments.

1 drive circuit, 2 sensor circuit, 3 power supply circuit, 4 control circuit, 5 board,
5A board first surface, 5B board second surface, 6A first power supply potential wiring,
6B 1st reference potential wiring, 7A 2nd power supply potential wiring, 7B 2nd reference potential wiring,
10 Through hole, 20A 1st connection wiring, 20B 2nd connection wiring,
20C third connecting wiring, 100 power converter.

Claims (8)

It has a power supply circuit having a first power supply output and a second power supply output, and a board on which the power supply circuit is mounted, and the wiring of the first power supply output and the wiring of the second power supply output paired on the board. in places where bets intersect in the same layer, only one of the wiring of the wiring of the second power supply output and the first power supply output wiring is so as to straddle the other wiring, is composed of a connecting wire molded conductor Power converter. The first power supply output is connected to a drive circuit of a semiconductor switching element mounted on the board, and the second power supply output is connected to a sensor circuit for measuring voltage or current mounted on the board. Item 1. The power conversion device according to Item 1. The power conversion device according to claim 1, wherein the first power supply output and the second power supply output are connected to a drive circuit of a semiconductor switching element mounted on the substrate. The power conversion device according to claim 1, wherein the first power supply output and the second power supply output are connected to a sensor circuit for measuring voltage or current mounted on the substrate. The power conversion device according to any one of claims 1 to 4, wherein the larger rated current value of the first power supply output and the second power supply output is configured by the connecting wiring. The power conversion device according to any one of claims 1 to 5, wherein the connecting wiring is arranged on a surface having a distance from a component adjacent to the board in the thickness direction of the board. The power conversion device according to any one of claims 1 to 5, wherein the power output wiring composed of the connecting wiring comprises a power potential and a reference potential, and faces each other with the substrate interposed therebetween. .. The power conversion device according to any one of claims 1 to 7, wherein a part of the connecting wiring is covered with an insulating member.

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