JP6983091B2 - Imprint device and manufacturing method of goods - Google Patents

Description

The present invention relates to an imprint device and a method for manufacturing an article.

An imprint device that forms a pattern on a substrate by curing the imprint material in a state where the imprint material on the substrate and the pattern portion of the mold (mold) are in contact with each other is attracting attention. Patent Document 1 describes that the mold is deformed by applying a force to the side surface of the mold, thereby deforming the pattern portion of the mold. Such a technique is advantageous for reducing the overlay error between the pattern of the substrate and the pattern of the mold (the pattern transferred onto the substrate). In Patent Document 2, when the imprint material on the substrate is brought into contact with the pattern of the mold, the mold is formed by increasing the pressure in the space on the back surface side of the mold (opposite the surface on which the pattern is provided). It is described that it is bent in a convex shape toward the substrate. Such a technique is advantageous for quickly filling the recesses constituting the pattern of the mold with the imprint material.

Japanese Unexamined Patent Publication No. 2017-147414 Japanese Unexamined Patent Publication No. 2012-94818

In the technique of deforming the pattern portion of the mold by applying a force to the side surface of the mold, there is a demand for increasing the deformable amount of the pattern portion. The large deformable amount of the pattern portion means that the allowable amount for the shape difference between the shot region of the substrate and the pattern portion of the mold is large, and it becomes easier to cope with mass production. However, if the force applied to the side wall of the mold is increased in order to increase the deformable amount of the pattern portion, the mold may bend. When the mold bends, the target compressive force cannot be applied to the pattern portion, so that it becomes difficult to deform the shape of the pattern portion to the target shape.

The present invention has been made in the wake of the above-mentioned problem recognition, and provides a technique advantageous for reducing an overlay error in an imprint device that deforms a pattern portion of a mold by applying a force to a side surface of the mold. With the goal.

One aspect of the present invention relates to an imprint device that forms a pattern on the member by curing the imprint material in a state where the imprint material on the member and the pattern portion of the mold are in contact with each other. The imprint device has a deformation mechanism that deforms the pattern portion by applying a force to the side surface of the mold, and a back surface of the mold surface that is opposite to the surface on which the pattern portion is provided. It is provided with an adjusting portion for adjusting the bending of the pattern portion by adjusting the force applied to the pattern portion, and the force applied to the back surface by the adjusting portion is adjusted according to the force applied to the side surface by the deformation mechanism. To.

INDUSTRIAL APPLICABILITY According to the present invention, there is provided a technique advantageous for reducing an overlay error in an imprint device that deforms a pattern portion of a mold by applying a force to a side surface of the mold.

The figure which shows typically the structure of the imprint apparatus of 1st Embodiment of this invention. The figure which shows the mold holding part and the mold driving mechanism, and the component around them schematically. Schematic is one example of mold deflection when a force is applied to the side surface of the mold by the deformation mechanism while the pressure in the pressure adjustment space is adjusted by the pressure adjustment unit so that the pattern portion becomes flat in the alignment operation. The figure shown in. The figure schematically showing one example of the method of reducing the bending of a mold which may occur by the deformation of a mold by the deformation mechanism in the alignment operation of 1st Embodiment of this invention. Schematic of another example of mold deflection when a force is applied to the side surface of the mold by the deformation mechanism while the pressure in the pressure adjustment space is adjusted by the pressure adjustment unit so that the pattern portion is flat in the alignment operation. The figure shown in. The figure which shows the other example of the method of reducing the bending of a mold which may occur by the deformation of a mold by a deformation mechanism in the alignment operation of 1st Embodiment of this invention schematically. The figure which shows typically the structure of the imprint apparatus of 2nd Embodiment of this invention. The figure which shows typically the master mold, the master mold holding part and the deformation mechanism, the blank mold and the blank mold holding part, and the component around them. Schematic is one example of mold deflection when a force is applied to the side surface of the mold by the deformation mechanism while the pressure in the pressure adjustment space is adjusted by the pressure adjustment unit so that the pattern portion becomes flat in the alignment operation. The figure shown in. Schematic of another example of mold deflection when a force is applied to the side surface of the mold by the deformation mechanism while the pressure in the pressure adjustment space is adjusted by the pressure adjustment unit so that the pattern portion is flat in the alignment operation. The figure shown in. The figure which illustrates the manufacturing method of an article.

Hereinafter, the present invention will be described through an exemplary embodiment with reference to the accompanying drawings.

FIG. 1 schematically shows the configuration of the imprint device 100 according to the first embodiment of the present invention. The imprint device 100 forms a pattern on the member S by curing the imprint material IM in a state where the imprint material IM on the member S and the pattern portion P of the mold M are in contact with each other. The member S can be a substrate. As the material of the substrate, for example, glass, ceramics, metal, semiconductor, resin and the like can be used. If desired, the substrate may have one or more layers on top of the underlying substrate. The substrate may include, for example, a silicon wafer, a compound semiconductor wafer, and quartz glass. In the manufacture of a semiconductor device, a substrate containing a semiconductor material can be used as the member S. The member S may be a blank mold for producing a replica mold.

As the imprint material, a curable composition (sometimes referred to as an uncured resin) that cures when energy for curing is applied is used. As the energy for curing, electromagnetic waves, heat and the like can be used. The electromagnetic wave may be, for example, light selected from a wavelength range of 10 nm or more and 1 mm or less, for example, infrared rays, visible rays, ultraviolet rays, and the like. The curable composition can be a composition that cures by irradiation with light or by heating. Of these, the photocurable composition that is cured by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent, if necessary. The non-polymerizable compound is at least one selected from the group of sensitizers, hydrogen donors, internal release mold release agents, surfactants, antioxidants, polymer components and the like. The imprint material can be arranged on the substrate in the form of droplets or islands or films formed by connecting a plurality of droplets. The viscosity of the imprint material (viscosity at 25 ° C.) can be, for example, 1 mPa · s or more and 100 mPa · s or less.

In the present specification and the accompanying drawings, the direction is shown in the XYZ coordinate system in which the direction parallel to the surface of the member S is the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the X-direction, Y-direction, and Z-direction, and the rotation around the X-axis, the rotation around the Y-axis, and the rotation around the Z-axis are θX and θY, respectively. , ΘZ. Control or drive with respect to the X-axis, Y-axis and Z-axis means control or drive with respect to the direction parallel to the X-axis, the direction parallel to the Y-axis and the direction parallel to the Z-axis, respectively. Further, the control or drive regarding the θX axis, the θY axis, and the θZ axis is related to the rotation around the axis parallel to the X axis, the rotation around the axis parallel to the Y axis, and the rotation around the axis parallel to the Z axis, respectively. Means control or drive. Further, the position is information that can be specified based on the coordinates of the X-axis, the Y-axis, and the Z-axis, and the posture is the information that can be specified by the values of the θX-axis, the θY-axis, and the θZ-axis. Positioning means controlling position and / or posture. Alignment may include control of the position and / or orientation of at least one of the substrate and the mold.

The imprint device 100 may include a member holding portion 16 having a chuck for holding the member S, and a member driving mechanism 42 for driving the member S by driving the member holding portion 16 on the base 41. The member holding portion 16 may be configured to hold the member S by, for example, vacuum suction or electrostatic suction. In the member drive mechanism 42, for example, the member S (member holding portion 16) has a plurality of axes (for example, three axes of X-axis, Y-axis, and θZ-axis, preferably X-axis, Y-axis, Z-axis, and θX-axis. It can be configured to drive about (6 axes of θY axis and θZ axis). The member drive mechanism 42 may include, for example, an actuator such as a plurality of linear motors. The member drive mechanism 42 may include a fine movement mechanism that finely drives the member holding portion 16 and a coarse movement mechanism that roughly drives the fine movement mechanism.

The imprint device 100 may include a mold holding portion 11 having a chuck for holding the mold M, and a mold driving mechanism 12 for driving the mold M by driving the mold holding portion 11. The mold holding portion 11 may be configured to hold the mold M by, for example, vacuum suction or electrostatic suction. The mold drive mechanism 12 has a mold M (mold holding portion 11) on a plurality of axes (for example, three axes of Z-axis, θX-axis, and θY-axis, preferably X-axis, Y-axis, Z-axis, θX-axis, and θY-axis. , ΘZ axis 6) can be configured to drive. The mold drive mechanism 12 may include, for example, at least one of a piezoelectric element, a linear motor, an air cylinder, and a VCM (voice coil motor).

The member drive mechanism 42 and / or the mold drive mechanism 12 constitutes a relative drive mechanism that modifies at least one of the relative positions and relative rotations of the member S and the mold M. The contact operation between the imprint material IM on the member S and the pattern portion P of the mold M and the separation operation between the cured imprint material IM and the pattern portion P can be performed by a relative drive mechanism. In one example, the contact and separation operations can be performed by the mold drive mechanism 12. In another example, the contact and separation operations can be performed by the member drive mechanism 42. In yet another example, the contact and separation operations can be performed by the mold drive mechanism 12 and the member drive mechanism 42.

FIG. 2 schematically shows the mold holding portion 11, the mold driving mechanism 12, and the components around them. The mold M has a surface (main surface) FS provided with a pattern portion P having a pattern to be transferred to the member S (on the imprint material IM) and a side opposite to the surface FS provided with the pattern portion P. The back surface BS, which is the surface of the surface, and the side surface SS may be included. The side surface SS is a surface connecting the outer peripheral end of the front surface FS and the outer peripheral end of the back surface BS. The back surface BS may include a peripheral BSp and a central BSc inside the peripheral BSp. In this example, the thickness dimension of the peripheral portion BSp is larger than the thickness dimension of the central portion BSc, and the mold M has a shape in which the central portion BSc is recessed from the peripheral portion BSp. The boundary between the peripheral portion BSp and the central portion BSc may form, for example, a pillar surface such as a cylindrical surface. The space partially defined by the central BSc and the pillar surface can be called a cavity space. The cavity space can be used to apply pressure or force to the back surface BS of the mold M, more specifically to the central BSc of the back surface BS.

The chuck MCH of the mold holding portion 11 may be configured to hold the mold M by sucking the peripheral portion BSp of the back surface BS of the mold M. For example, the chuck MCH of the mold holding portion 11 may be configured to hold the mold M by vacuum-sucking the peripheral portion BSp of the back surface BS of the mold M. The mold holding portion 11 may include a suction force adjusting portion 21 for adjusting the suction force (holding force) for sucking the peripheral portion BSp of the back surface BS of the mold M.

The imprint device 100 may include a deformation mechanism 9 that deforms the pattern portion P by applying a force to the side surface SS of the surface of the mold M. The deformation mechanism 9 may include a plurality of actuators (pressurizing mechanisms) that apply forces to different positions on the side surface SS of the mold M. The plurality of actuators may include, for example, at least one of a piezoelectric element, a VCM (voice coil motor), a linear motor, and an air cylinder. The outputs of the plurality of actuators can be controlled individually.

By holding the mold M by the mold holding portion 11, a pressure adjusting space SP facing the central portion BSc of the back surface BS of the mold M is formed. The cavity space may constitute part or all of the pressure adjustment space SP. At least a part of the pressure adjusting space SP can be determined by, for example, a transmissive member 23 that transmits energy (for example, light energy) for curing the imprint material IM. The mold holding portion 11 or the mold driving mechanism 12 may have an opening for passing energy for curing the imprint material IM. The transmission member 23 can be held, for example, by the mold holding portion 11 or the mold driving mechanism 12.

The imprint device 100 may include a pressure adjusting unit 22 for adjusting the pressure in the pressure adjusting space SP. Adjusting the pressure in the pressure adjusting space SP means adjusting the force or pressure applied to the central portion BSc of the back surface BS of the mold M. By adjusting the pressure in the pressure adjustment space SP, the deflection of the mold M (pattern portion P) can be adjusted. For example, by adjusting the pressure of the pressure adjusting space SP to a pressure higher than the pressure of the external space (the space of the surface of the mold M facing the surface FS), the mold M (pattern portion P) is moved to the side of the member S. It can be bent in a convex shape toward it.

The mold M can also bend in a convex shape toward the side of the member S or a concave shape toward the side of the member S by applying a force to the side surface SS by the deformation mechanism 9. Such bending can also be adjusted or corrected by adjusting the suction force applied by the chuck MCH of the mold holding portion 11 to the peripheral portion BSp of the back surface BS of the mold M. Therefore, at least one or both of the pressure adjusting unit 22 and the suction force adjusting unit 21 functions as an adjusting unit 20 for adjusting the bending of the pattern portion P of the mold M by adjusting the force applied to the back surface BS of the mold M. Can be done.

The imprint device 100 may also include a curing unit 2, a dispenser 5, a measuring instrument 31, and a control unit 51. In the cured portion 2, the imprint material IM on the member S and the pattern portion P of the mold M are in contact with each other, and the imprint material IM is cured in a state where the concave portion of the pattern portion P is sufficiently filled with the imprint material IM. Irradiate the energy for. As a result, the imprint material IM is cured, and a pattern made of the cured product of the imprint material IM (a pattern to which the pattern of the pattern portion P of the mold M is transferred) is formed. After the pattern made of the cured product of the imprint material IM is formed, the pattern made of the cured product and the pattern portion P of the mold M are separated by the above-mentioned relative drive mechanism.

The dispenser 5 supplies or arranges the imprint material IM in the shot region (pattern formation region) of the member S. The imprint device 100 does not have to include the dispenser 5, in which case the member S in which the imprint material IM is arranged in the external device can be supplied to the imprint device 100. The measuring instrument 31 (alignment scope) detects the relative position between the alignment mark of the shot region of the member S and the alignment mark of the pattern portion P of the mold M. Thereby, the superposition error (relative position and rotation and relative shape difference) between the shot region of the member S and the pattern portion P of the mold M can be detected.

The control unit 51 can control the member drive mechanism 42, the mold drive mechanism 12, the deformation mechanism 9, the suction force adjusting unit 21, the pressure adjusting unit 22, the curing unit 2, the dispenser 5, and the measuring instrument 31. The control unit 51 is, for example, a PLD (abbreviation for Programmable Logic Device) such as FPGA (abbreviation for Field Programmable Gate Array), or an ASIC (application specific integrated circuit) or a general-purpose program, or an abbreviation for ASIC. It may consist of a computer or a combination of all or part of these.

Here, the pattern forming process by the imprint device 100 will be exemplified. This pattern formation process is controlled by the control unit 51. First, the imprint material IM may be arranged in the shot region of the member S by the dispenser 5. Next, the member S can be positioned by the member drive mechanism 42 so that the shot region is located directly below the pattern portion P. Next, the pressure in the pressure adjusting space SP can be adjusted by the pressure adjusting unit 22 so that the mold M has a convex shape toward the member S. Then, the imprint material IM on the member S and the pattern portion P can be brought into contact with each other by the mold drive mechanism 12 and / or the member drive mechanism 42. In this state, the mold M (pattern portion P) is gradually returned to a flat surface while the pressure adjusting portion 22 gradually lowers the pressure in the pressure adjusting space SP. As a result, the contact area between the imprint material IM and the pattern portion P above the shot region of the member M is gradually expanded, and the recess of the pattern portion P is filled with the imprint material IM.

After that, or in parallel with the expansion of the contact area, the measuring instrument 31 is used to detect a superposition error between the shot area of the member S and the pattern portion of the mold M. Then, the member S and the mold M are relatively driven by the member drive mechanism 42 and the mold drive mechanism 12 so that the overlay error is reduced based on the overlay error. Further, the pattern portion P of the mold M is deformed by the deformation mechanism 9 so that the overlay error is reduced. The deformation of the pattern portion P of the mold M by the deformation mechanism 9 may be started, for example, before the contact between the imprint material IM and the pattern portion P. Alternatively, the deformation of the pattern portion P of the mold M by the deformation mechanism 9 is performed, for example, after the imprint material IM and the pattern portion P come into contact with each other and before the imprint material IM and the pattern portion P come into contact with each other in the entire shot region. It may be started. In the following, the relative drive between the member S and the mold M by the member drive mechanism 42 and the mold drive mechanism 12 and the deformation of the pattern P by the deformation mechanism 9 to reduce the overlay error will be referred to as an alignment operation.

In the alignment operation, when a force is applied to the side surface S of the mold M by the deformation mechanism 9 in a state where the pressure of the pressure adjustment space SP is adjusted by the pressure adjustment unit 22 so that the pattern portion P becomes flat, the mold M bends. sell. Therefore, in the present embodiment, the force applied to the back surface BS of the mold M can be adjusted by the adjusting unit 20 according to the force applied to the side surface S of the mold M by the deformation mechanism 9. The force applied to the back surface BS of the mold M by the adjusting unit 20 may be adjusted so that the bending of the pattern portion P due to the force applied to the side surface SS of the mold M by the deformation mechanism 9 is reduced.

After the overlay error is within the permissible range through the above steps, the imprint material IM is irradiated with energy for curing by the curing unit 2, and the imprint material IM is cured. After that, the hardened imprint material IM on the member S and the pattern portion P are separated by the mold drive mechanism 12 and / or the member drive mechanism 42.

FIG. 3 shows when a force is applied to the side surface S of the mold M by the deformation mechanism 9 in a state where the pressure of the pressure adjusting space SP is adjusted by the pressure adjusting unit 22 so that the pattern portion P becomes flat in the alignment operation. An example of the deflection of the mold M of the above is schematically shown. When the deformation mechanism 9 applies a force to the side surface SS of the mold M to give a displacement Δd to the side surface SS, bending Δp may occur in the mold M (pattern portion P). The deflection Δp is the position of the surface of the pattern portion P (position in the Z direction) when the deformation mechanism 9 applies a force to the side surface SS of the mold M, and the state where the deformation mechanism 9 does not apply a force to the side surface SS of the mold M. It can be evaluated as a difference from the position of the surface of the pattern portion P (position in the Z direction). When the deflection Δp occurs, the intended deformation (distortion) cannot be given to the pattern portion P.

FIG. 4 schematically shows one example of a method for reducing the bending of the mold M that may occur due to the deformation of the mold M by the deformation mechanism 9 in the alignment operation of the first embodiment of the present invention. When a force is applied to the side surface S of the mold M by the deformation mechanism 9 in a state where the pressure of the pressure adjustment space SP is adjusted by the pressure adjustment unit 22 so that the pattern portion P becomes flat, the deflection Δp becomes as described above. It can occur. Therefore, in the example shown in FIG. 4, the control unit 51 is subjected to the pressure adjusting unit 22 of the adjusting unit 20 according to the force applied to the side surface S of the mold M by the deformation mechanism 9, and the back surface BS (central portion of the mold M) is used. It can be configured to adjust the force (pressure) applied to BSc). The force (pressure) applied to the back surface BS of the mold M by the pressure adjusting unit 22 can be adjusted so that the bending Δp of the pattern portion P due to the force applied to the side surface SS of the mold M by the deformation mechanism 9 is reduced. The force applied to the side surface SS of the mold M by the deformation mechanism 9 causes the mold M to bend so as to form a convex shape toward the side of the member S, which is applied to the central portion BSc by the pressure adjusting portion 22 of the adjusting portion 20. It can be reduced by reducing the force.

For example, the control unit 51 reduces the deflection Δp of the pattern portion P based on the information indicating the relationship between the force F applied to the side surface SS of the mold M by the deformation mechanism 9 and the deflection Δp of the pattern portion P due to the force F. The pressure adjusting unit 22 of the adjusting unit 20 can be controlled so as to be performed. This information can be given, for example, by the function Δp = f1 (F). More specifically, if the deformation mechanism 9 has n actuators and the force applied by the n actuators to the side surface SS of the mold M is F1 to Fn, Δp is Δp = f2 (F1, F2, 2). ..., Fn) can be given by the function. This function can be determined experimentally or by simulation.

Further, when the force applied to the back surface BS of the mold M by the pressure adjusting unit 22 in order to reduce the deflection Δp is controlled by the pressure Psp of the pressure adjusting space SP, the pressure Psp is given by the function Psp = f3 (Δp). Can be done. This function can be determined experimentally or by simulation.

The control unit 51 uses the pressure adjustment unit 22 of the adjustment unit 20 to reduce the deflection of the pattern unit P based on the measurement result (alignment error) of the measuring instrument 31 so that the back surface BS (central portion BSc) of the mold M is reduced. The force (pressure) applied to may be adjusted. Here, the measuring instrument 31 sets the distortion of the pattern portion P in the direction (X direction, Y direction) orthogonal to the thickness direction (Z direction) of the pattern portion P, for example, the target of the alignment mark provided on the mold M. It can be measured as the amount of shift from the position (Δx, Δy). Alternatively, the measuring instrument 31 measures the distortion of the pattern portion P in the X and Y directions as, for example, relative positions (Δx, Δy) between the alignment mark provided on the mold M and the alignment mark provided on the member S. Can be done.

FIG. 5 shows when a force is applied to the side surface S of the mold M by the deformation mechanism 9 in a state where the pressure of the pressure adjusting space SP is adjusted by the pressure adjusting unit 22 so that the pattern portion P becomes flat in the alignment operation. Other examples of bending of the mold M of the above are schematically shown. When the deformation mechanism 9 applies a force to the side surface SS of the mold M to give a displacement Δd to the side surface SS, bending Δp may occur in the mold M (pattern portion P). In the example shown in FIG. 5, the deflection ΔP is sucked from the holding surface (the surface in contact with the mold M) of the mold holding portion 11 by the peripheral portion BSp of the back surface BS of the mold M (the mold chuck MCH of the mold holding portion 11). It occurs with the floating of the surface). The deflection Δp is the position of the surface of the pattern portion P (position in the Z direction) when the deformation mechanism 9 applies a force to the side surface SS of the mold M, and the state where the deformation mechanism 9 does not apply a force to the side surface SS of the mold M. It can be evaluated as a difference from the position of the surface of the pattern portion P (position in the Z direction). In the example shown in FIG. 5, a larger deflection Δp than in the example shown in FIG. 3 can occur. When the deflection Δp occurs, the intended deformation (distortion) cannot be given to the pattern portion P.

FIG. 6 schematically shows another example of a method for reducing the bending of the mold M that may occur due to the deformation of the mold M by the deformation mechanism 9 in the alignment operation of the first embodiment of the present invention. When a force is applied to the side surface S of the mold M by the deformation mechanism 9 in a state where the pressure of the pressure adjustment space SP is adjusted by the pressure adjustment unit 22 so that the pattern portion P becomes flat, the deflection Δp becomes as described above. It can occur. Therefore, in the example shown in FIG. 6, the control unit 51 is subjected to the suction force adjusting unit 21 of the adjusting unit 20 according to the force applied to the side surface S of the mold M by the deformation mechanism 9 (around the back surface BS of the mold M). It may be configured to adjust the force applied to the part BSp). The force applied to the back surface BS of the mold M by the suction force adjusting unit 21 may be adjusted so that the bending Δp of the pattern portion P due to the force applied to the side surface SS of the mold M by the deformation mechanism 9 is reduced. The force applied to the side surface SS of the mold M by the deformation mechanism 9 causes the mold M to bend so as to form a convex shape toward the member S, so that the peripheral portion BSp is sucked by the suction force adjusting portion 21 of the adjusting portion 20. It can be reduced by increasing the force applied.

For example, the control unit 51 reduces the deflection Δp of the pattern portion P based on the information indicating the relationship between the force F applied to the side surface SS of the mold M by the deformation mechanism 9 and the deflection Δp of the pattern portion P due to the force F. The suction force adjusting unit 21 of the adjusting unit 20 can be controlled so as to be performed. This information can be given, for example, by the function Δp = f1 (F), as described above. More specifically, if the deformation mechanism 9 has n actuators and the force applied by the n actuators to the side surface SS of the mold M is F1 to Fn, Δp is Δp = f2 (F1, F2, 2). ..., Fn) can be given by the function. This function can be determined experimentally or by simulation.

Further, when the force applied to the back surface BS of the mold M by the suction force adjusting unit 21 in order to reduce the deflection Δp is controlled by the pressure Pch for generating the suction force, the pressure Pch is called Pch = f4 (Δp). Can be given by a function. This function can be determined experimentally or by simulation.

The control unit 51 uses the suction force adjusting unit 21 of the adjusting unit 20 to reduce the deflection Δp of the pattern unit based on the measurement result (alignment error) of the measuring instrument 31 on the back surface BS (peripheral portion BSp) of the mold M. ) May be adjusted. As described above, the measuring instrument 31 distorts the pattern portion P in the direction (X direction, Y direction) orthogonal to the thickness direction (Z direction) of the pattern portion P, for example, the alignment mark provided on the mold M. It can be measured as the amount of shift (Δx, Δy) from the target position of. Alternatively, the measuring instrument 31 measures the distortion of the pattern portion P in the X and Y directions as, for example, relative positions (Δx, Δy) between the alignment mark provided on the mold M and the alignment mark provided on the member S. Can be done.

Further, even if the control unit 51 controls both the pressure adjusting unit 22 and the suction force adjusting unit 21, the bending Δp of the pattern unit P due to the force applied to the side surface SS of the mold M by the deformation mechanism 9 can be reduced. good.

Hereinafter, a second embodiment of the present invention will be described. Matters not mentioned as the second embodiment may follow the first embodiment. FIG. 7 schematically shows the configuration of the imprint device 101 according to the second embodiment of the present invention. The imprint device 101 of the second embodiment is configured to manufacture a replica mold which is a replica of the master mold by using the mold M as a master mold. In the imprint device 101 of the second embodiment, the member holding portion 16 of the imprint device 100 of the first embodiment is embodied as a blank mold holding portion 16'that holds a blank mold BM for manufacturing a replica mold. Can be understood as an example. The pattern of the mold M is transferred onto the blank mold BM by curing the imprint material IM in a state where the imprint material IM on the blank mold BM and the pattern portion P of the mold (master mold) M are in contact with each other. Pattern is formed. This gives a replica mold.

As illustrated in FIG. 8, the blank mold BM has a front surface (main surface) FS2 having a pattern portion P2 on which the master mold pattern is transferred, a back surface BS2 which is a surface opposite to the front surface FS2, and side surfaces. It may include SS2. The side surface SS2 is a surface connecting the outer peripheral end of the front surface FS2 and the outer peripheral end of the back surface BS2. The back surface BS2 may include a peripheral portion BS2p and a central portion BS2c inside the peripheral portion BS2p. In this example, the thickness dimension of the peripheral portion BS2p is larger than the thickness dimension of the central portion BS2c, and the blank mold BM has a shape in which the central portion BS2c is recessed from the peripheral portion BS2p. The boundary between the peripheral portion BS2p and the central portion BS2c can form, for example, a pillar surface such as a cylindrical surface. The space partially defined by the central portion BS2c and the pillar surface can be skipped from the cavity space. The cavity space can be used to apply pressure or force to the back surface BS2 of the blank mold BM, more specifically to the central portion BS2c. Further, when used as a replica mold, the cavity space can be used as the cavity space in the mold M described in the first embodiment.

The chuck MCH2 of the blank mold holding portion 16'can be configured to hold the blank mold BM by sucking the peripheral portion BS2p of the back surface BS2 of the blank mold BM. For example, the chuck MCH2 of the blank mold holding portion 16'can be configured to hold the blank mold BM by vacuum sucking the peripheral portion BS2p of the back surface BS2 of the blank mold BM. The blank mold holding portion 16'may include a suction force adjusting portion 25 for adjusting the suction force (holding force) for sucking the peripheral portion BSp2 of the back surface BS2 of the blank mold BM.

By holding the blank mold BM by the blank mold holding portion 16', the pressure adjusting space SP2 is formed so that the central portion BS2c of the back surface BS2 of the blank mold BM faces. The imprint device 101 may include a pressure adjusting unit 26 for adjusting the pressure in the pressure adjusting space SP2. Adjusting the pressure in the pressure adjusting space SP2 means adjusting the force or pressure applied to the central portion BS2c of the back surface BS2 of the blank mold BM. By adjusting the pressure in the pressure adjustment space SP2, the deflection of the blank mold BM can be adjusted. For example, by adjusting the pressure of the pressure adjusting space SP2 to a pressure higher than the pressure of the external space (the space of the surface of the blank mold BM facing the surface FS2), the blank mold BM has a convex shape toward the mold M side. Can be bent to. Utilizing such a function, the pressure adjusting unit 26 can adjust or correct the bending of the mold M through the adjustment of the bending of the blank mold BM.

Further, the bending of the mold M can be adjusted or corrected by adjusting the suction force applied to the peripheral portion BS2p of the back surface BS2 of the blank mold BM by the chuck MCH2 of the blank mold holding portion 16'. For example, when the mold M has a convex shape toward the blank mold BM and the blank mold BM has a concave shape toward the mold M, the peripheral portion BS2p of the back surface BS2 of the blank mold BM holds the blank mold holding portion 16'. Can rise from the surface. In this case, by increasing the force with which the chuck MCH2 sucks the peripheral portion BS2p of the back surface BS2 of the blank mold BM, the bending of the blank mold BM can be reduced, whereby the bending of the mold M can be reduced. Therefore, at least one or both of the pressure adjusting unit 26 and the suction force adjusting unit 25 adjust the bending of the pattern portion P of the mold M by adjusting the force applied to the back surface BS2 of the blank mold BM. Can function as 29.

The force applied to the first back surface BS of the mold M by the first adjusting unit 20 and the back surface of the blank molding BM by the second adjusting unit 29 according to the force applied to the side surface SS of the mold M by the deformation mechanism 9. At least one of the forces applied to the back surface BS2 is adjusted. At least one of the force applied to the first back surface BS by the first adjusting unit 20 and the force applied to the second back surface BS 2 by the second adjusting unit 29 is such that the distortion of the pattern formed on the blank mold BM is reduced. Can be done. Here, the distortion of the pattern formed on the blank mold BM may include distortion due to the pattern portion P not being deformed as a target due to the bending of the pattern portion P due to the force applied to the side surface SS by the deformation mechanism 9.

FIG. 9 shows when a force is applied to the side surface S of the mold M by the deformation mechanism 9 in a state where the pressure of the pressure adjusting space SP is adjusted by the pressure adjusting unit 22 so that the pattern portion P becomes flat in the alignment operation. An example of the deflection of the mold M of the above is schematically shown. When the deformation mechanism 9 applies a force to the side surface SS of the mold M to give a displacement to the side surface SS, the mold M may be bent. This bending is caused by the position of the surface of the pattern portion P (position in the Z direction) when the deformation mechanism 9 applies a force to the side surface SS of the mold M and the state where the deformation mechanism 9 does not apply a force to the side surface SS of the mold M. It can be evaluated as a difference from the position of the surface of the pattern portion P (position in the Z direction). When bending occurs, it is not possible to give the intended deformation (distortion) to the pattern portion P.

FIG. 10 schematically shows one example of a method for reducing the bending of the mold M that may occur due to the deformation of the mold M by the deformation mechanism 9 in the alignment operation of the present embodiment. When a force is applied to the side surface S of the mold M by the deformation mechanism 9 in a state where the pressure of the pressure adjusting space SP is adjusted by the pressure adjusting portion 22 so that the pattern portion P becomes flat, the pattern portion P is as described above. Can bend. Therefore, in the example shown in FIG. 10, the control unit 51 uses at least one of the first adjustment unit 20 and the second adjustment unit 29 according to the force applied to the side surface S of the mold M by the deformation mechanism 9. The bending of the mold M (pattern portion P) is adjusted.

The pattern of the cured product formed by using the imprint device is used permanently for at least a part of various articles or temporarily when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, a mold, or the like. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include a mold for imprinting.

The pattern of the cured product is used as it is as a constituent member of at least a part of the above-mentioned article, or is temporarily used as a resist mask. After etching or ion implantation in the substrate processing step, the resist mask is removed.

Next, an article manufacturing method in which a pattern is formed on a substrate by an imprint device, the substrate on which the pattern is formed is processed, and an article is manufactured from the processed substrate will be described. As shown in FIG. 11A, a substrate 1z such as a silicon wafer on which a work material 2z such as an insulator is formed on the surface is prepared, and subsequently, the substrate 1z such as a silicon wafer is inserted into the surface of the work material 2z by an inkjet method or the like. The printing material 3z is applied. Here, a state in which a plurality of droplet-shaped imprint materials 3z are applied onto the substrate is shown.

As shown in FIG. 11B, the imprint mold 4z is opposed to the imprint material 3z on the substrate with the side on which the uneven pattern is formed facing. As shown in FIG. 11 (c), the substrate 1 to which the imprint material 3z is applied is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the work material 2z. When light is irradiated through the mold 4z as energy for curing in this state, the imprint material 3z is cured.

As shown in FIG. 11D, when the imprint material 3z is cured and then the mold 4z and the substrate 1z are separated from each other, a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. The pattern of the cured product has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product and the convex portion of the mold corresponds to the concave portion of the cured product, that is, the uneven pattern of the mold 4z is transferred to the imprint material 3z. It will be done.

As shown in FIG. 11 (e), when etching is performed using the pattern of the cured product as an etching resistant mask, the portion of the surface of the work material 2z where the cured product is absent or remains thin is removed, and the groove 5z is formed. Become. As shown in FIG. 11 (f), by removing the pattern of the cured product, it is possible to obtain an article in which the groove 5z is formed on the surface of the workpiece 2z. Here, the pattern of the cured product is removed, but it may not be removed even after processing, and may be used, for example, as a film for interlayer insulation contained in a semiconductor element or the like, that is, as a constituent member of an article.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and modifications can be made within the scope of the gist thereof.

100: Imprint device, 101: Imprint device, S: Member, M: Mold, P: Pattern part, 9: Deformation mechanism, 20: Adjustment part, 21: Suction force adjustment part, 22: Pressure adjustment part, 51: Control unit, BS: back side, SP: pressure adjustment space, IM: imprint material

Claims (14)

An imprint device that forms a pattern on the member by curing the imprint material in a state where the imprint material on the member and the pattern portion of the mold are in contact with each other.
A deformation mechanism that deforms the pattern portion by applying a force to the side surface of the mold,
It is provided with an adjusting portion for adjusting the bending of the pattern portion by adjusting the force applied to the back surface of the surface of the mold, which is the surface opposite to the surface on which the pattern portion is provided.
The force applied to the back surface by the adjusting unit is adjusted according to the force applied to the side surface by the deformation mechanism.
An imprint device characterized by that. The force applied to the back surface by the adjusting portion is adjusted so that the bending of the pattern portion due to the force applied to the side surface by the deformation mechanism is reduced.
The imprint device according to claim 1. A control unit for controlling the adjustment unit is further provided.
The control unit controls the adjustment unit so that the deflection of the pattern portion is reduced based on the information indicating the relationship between the force applied to the side surface by the deformation mechanism and the deflection of the pattern portion due to the force. do,
The imprint device according to claim 2. Further equipped with a measuring instrument for measuring the distortion of the pattern portion in the direction orthogonal to the thickness direction of the pattern portion.
The force applied to the back surface by the adjusting portion is adjusted so that the bending of the pattern portion is reduced based on the measurement result by the measuring instrument.
The imprint device according to claim 2. The back surface of the mold has a peripheral portion and a central portion inside the peripheral portion.
The adjusting portion adjusts the bending of the pattern portion by controlling at least one of a force for holding the mold by sucking the peripheral portion and a force applied to the central portion.
The imprint device according to any one of claims 1 to 4. The back surface of the mold has a peripheral portion and a central portion inside the peripheral portion.
The adjusting portion adjusts the bending of the pattern portion by controlling the force applied to the central portion.
The bending of the mold so as to be convex toward the side of the member due to the force applied to the side surface by the deformation mechanism is reduced by reducing the force applied to the central portion by the adjusting portion. Ru,
The imprint device according to any one of claims 1 to 4. The back surface of the mold has a peripheral portion and a central portion inside the peripheral portion.
The adjusting portion adjusts the bending of the pattern portion by controlling the force at which the peripheral portion is attracted in order to hold the mold.
The bending of the mold so as to be convex toward the side of the member due to the force applied to the side surface by the deformation mechanism is reduced by increasing the force at which the peripheral portion is attracted by the adjusting portion. Be done,
The imprint device according to any one of claims 1 to 4. The member is a substrate and
The imprint device further includes a holding portion for holding the substrate.
The imprint device according to any one of claims 1 to 7. The member is a blank mold for producing a replica mold, and is a blank mold.
The imprint device further includes a holding portion for holding the blank mold.
The imprint device according to any one of claims 1 to 7. Further provided with a second adjusting portion for adjusting the bending of the blank mold by adjusting the force applied to the second back surface of the surface of the blank mold, which is the surface opposite to the surface on which the pattern is formed.
The force applied to the second back surface by the second adjusting unit is adjusted according to the force applied to the side surface by the deformation mechanism.
The imprint device according to claim 9. The adjustment of the force applied to the second back surface by the second adjusting portion reduces the distortion of the pattern formed in the blank mold due to the bending of the pattern portion due to the force applied to the side surface by the deformation mechanism. Will be done,
The imprint device according to claim 10. An imprint device that forms a pattern on the blank mold by curing the imprint material in a state where the imprint material on the blank mold and the pattern portion of the master mold are in contact with each other.
A deformation mechanism that deforms the pattern portion by applying force to the side surface of the master mold,
A first adjusting portion that adjusts the deflection of the pattern portion by adjusting a force applied to the first back surface of the surface of the master mold that is opposite to the surface on which the pattern portion is provided.
A second adjusting portion for adjusting the bending of the blank mold by adjusting a force applied to a second back surface, which is a surface of the blank mold surface opposite to the surface on which the pattern is formed, is provided. ,
At least one of the force applied to the first back surface by the first adjusting unit and the force applied to the second back surface by the second adjusting unit is adjusted according to the force applied to the side surface by the deformation mechanism.
An imprint device characterized by that. At least one of the force applied to the first back surface by the first adjusting portion and the force applied to the second back surface by the second adjusting portion is due to the bending of the pattern portion due to the force applied to the side surface by the deformation mechanism. , The distortion of the pattern formed on the blank mold is reduced.
The imprint device according to claim 12. A step of forming a pattern on a member using the imprint device according to any one of claims 1 to 11.
In the step of processing the member on which the pattern is formed, and
A method for manufacturing an article, which comprises the above and manufactures an article from the member which has been subjected to the treatment.

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