JP6983658B2 - Component mounting related equipment - Google Patents

Description

The present invention relates to a component mounting related device and an installation method thereof.

Conventionally, the parts supplied from the parts supply device are attracted to a nozzle provided in a moving body (for example, an XY robot), and by moving the moving body, the parts sucked by the nozzles are carried to a predetermined position on the substrate. A component mounting device for mounting a component at a predetermined position is known. Such a component mounting device has a leveling bolt, and the lower end of the leveling bolt is placed on a steel leveling sheet laid on the floor on which the component mounting device is installed. In the component mounting device, the component mounting device vibrates due to the movement of the moving body when the component mounting work is performed. At this time, since the component mounting device is integrally connected via the leveling bolt and the leveling sheet, the vibration of the device is transmitted to the floor. Patent Document 1 describes that if a rubber sheet is laid between the leveling sheet and the floor, the vibration energy transmitted to the floor due to the elastic deformation of the rubber sheet can be reduced.

Japanese Unexamined Patent Publication No. 11-214887 (paragraphs 0002 and 0003)

However, although the configuration of laying a rubber sheet between the leveling sheet and the floor can be easily and inexpensively realized, as pointed out in Patent Document 1, the natural frequency may be close to the excitation frequency in some cases. A resonance state may occur and the amplitude may increase.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to suppress vibration of a component mounting-related device itself easily and inexpensively.

The component mounting related device of the present invention is
The device body, which performs positioning control of the moving body in connection with mounting the component on the board,
A leveling bolt provided on the main body of the device and having a convex curved surface on the lower surface,
A leveling sheet having a concave curved surface on the upper surface and receiving the convex curved surface of the leveling bolt on the concave curved surface.
Equipped with
The leveling sheet has a rubber magnet sheet in which magnetic powder is dispersed in a rubber matrix at at least one position between the upper surface, the lower surface, and the upper and lower surfaces of the leveling sheet.
It is a thing.

This component mounting related device has a rubber magnet sheet (also referred to as a magnet sheet) in which magnetic powder is dispersed in a rubber matrix at at least one place between the upper surface, the lower surface, and the upper and lower surfaces of the leveling sheet. Due to the presence of this rubber magnet sheet, the intensity of the vibration frequency of the main body of the apparatus becomes very small, and the vibration can be suppressed extremely effectively. In particular, it is epoch-making in that it can suppress not only the vibration transmitted from the main body of the device to the floor but also the vibration of the main body of the device itself. This point is an effect obtained by combining a rubber magnet sheet with a configuration of a leveling bolt having a convex curved surface on the lower surface and a leveling sheet having a concave curved surface that receives the convex curved surface of the leveling bolt. As described above, according to the component mounting related device of the present invention, the vibration of the component mounting related device itself can be suppressed easily and inexpensively.

When a rubber sheet is used instead of the rubber magnet sheet, the vibration frequency of the device body generated by the movement of the moving body is low, but the strength is high, and the vibration of the device body itself cannot be suppressed. ..

Here, examples of the device main body that executes the positioning control of the moving body in relation to mounting the component on the substrate include a component mounting device, an adhesive coating device, a flux coating device, and the like.

In the component mounting related device of the present invention, the device main body may be capable of executing positioning control without executing machine base vibration compensation. As described above, according to the present invention, since the vibration of the apparatus main body itself can be suppressed, it is possible to mount the component with high accuracy even if the positioning control is executed without executing the machine base vibration compensation. can. Moreover, the time required to reach the target deviation can be shortened as compared with the time when the machine base vibration compensation is executed.

In the component mounting-related device of the present invention, the apparatus main body collects a component from a component supply unit onto the moving body, and by moving the moving body, the component is carried to a predetermined position on the substrate, and the component is delivered. It may be mounted at the predetermined position. Since this type of component mounting device requires high accuracy in the positioning control of the moving body, it is highly significant to apply the present invention.

The method of installing the component mounting related device of the present invention is as follows.
A device main body that executes positioning control of a moving body in connection with mounting a component on a substrate, a leveling bolt provided on the device main body and having a convex curved surface on the lower surface, and a leveling bolt having a concave curved surface on the upper surface. It is a method of installing a component mounting related device for installing a component mounting related device provided with a leveling sheet that receives the convex curved surface on the concave curved surface.
After arranging the rubber magnet sheet at at least one place between the upper surface, the lower surface and the upper and lower surfaces of the leveling sheet, the leveling bolt of the apparatus main body is placed on the leveling sheet.
It is a thing.

In this component mounting-related device installation method, a rubber magnet sheet is placed at least one place between the upper surface, the lower surface, and the upper and lower surfaces of the leveling sheet, and then the leveling bolt of the device body is placed on the leveling sheet. Due to the presence of this rubber magnet sheet, the intensity of the vibration frequency of the main body of the apparatus becomes very small, and the vibration can be suppressed extremely effectively. In particular, it is epoch-making in that it can suppress not only the vibration transmitted from the main body of the device to the floor but also the vibration of the main body of the device itself. As described above, according to the method of installing the component mounting related device of the present invention, the vibration of the component mounting related device itself can be suppressed easily and inexpensively.

In the method of installing the component mounting related device of the present invention, the device main body may be capable of executing positioning control without executing machine base vibration compensation. As described above, according to the present invention, since the vibration of the apparatus main body itself can be suppressed, it is possible to mount the component with high accuracy even if the positioning control is executed without executing the machine base vibration compensation. can. Moreover, the time required to reach the target deviation can be shortened as compared with the time when the machine base vibration compensation is executed.

In the setting method of the component mounting related device of the present invention, the device main body collects a component from the component supply unit onto the moving body, and by moving the moving body, the component is carried to a predetermined position on the substrate. It may be a component mounting device that mounts the component at the predetermined position. Since this type of component mounting device requires high accuracy in the positioning control of the moving body, it is highly significant to apply the present invention.

The block diagram of the component mounting apparatus 1. Partial sectional view of the support leg 60. A graph showing modal test results. A graph showing the positioning waveform. Partial sectional view of the support leg of another embodiment. Partial sectional view of the support leg of another embodiment.

Preferred embodiments of the present invention will be described below with reference to the drawings. 1 is a block diagram of a component mounting device 1, FIG. 2 is a partial cross-sectional view of a support leg 60, FIG. 3 is a graph showing modal test results, and FIG. 4 is a graph showing a positioning waveform. The left-right direction in FIG. 1 is the X-axis direction, the front (front) rear (back) direction is the Y-axis direction, and the vertical direction is the Z-axis direction.

The component mounting device 1 includes a device main body 10 and support legs 60.

As shown in FIG. 1, the apparatus main body 10 is composed of a machine base 11 and a frame 12 supported by the machine base 11. A support base 14 is provided at the lower portion of the frame 12. Further, the device main body 10 includes a component supply device 20, a substrate transfer device 30, a head 40, an XY robot 50, and a control device 58 that controls the entire device.

A plurality of component supply devices 20 are arranged and arranged on the support base 14 so as to be arranged in the left-right direction (X-axis direction). The component supply device 20 is a tape feeder that sends a carrier tape containing components at a predetermined pitch to a component supply position where the head 40 (nozzle 42) can pick up. The carrier tape consists of a bottom tape in which cavities (recesses) are formed at a predetermined pitch in the longitudinal direction, and a top film attached to the upper surface of the bottom tape with parts housed in each cavity. Become.

As shown in FIG. 1, the board transfer device 30 is configured as a dual lane type transfer device provided with two board transfer paths in the present embodiment, and is configured in the front-rear direction (Y-axis direction) of the support base 14. It is installed in the center. The board transfer device 30 includes a belt conveyor device 32, and transports the board S from the left to the right (board transfer direction) in FIG. 1 by driving the belt conveyor device 32. Further, a backup plate 34 that can be raised and lowered by a lifting device (not shown) is provided at the center of the board transport device 30 in the board transport direction (X-axis direction). A plurality of pins 36 are provided on the upper surface of the backup plate 34. When the substrate S is transported above the backup plate 34 by the substrate transport device 30, the backup plate 34 is raised to back up the substrate S from the back surface side by the pin 36.

The head 40 is a moving body that can be moved to an arbitrary position on the XY plane by the XY robot 50. The head 40 attracts the components supplied by the component supply device 20 to the nozzle 42 and mounts them on the substrate S conveyed by the substrate transfer device 30.

As shown in FIG. 1, the XY robot 50 has a pair of left and right Y-axis guide rails 51 provided on the upper part of the frame 12 along the front-rear direction (Y-axis direction) and a pair of left and right Y-axis guide rails 51. A long Y-axis slider 52 that can move along the Y-axis guide rail 51 in a state of being bridged, and an X-axis provided on the lower surface of the Y-axis slider 52 along the left-right direction (X-axis direction). It includes a guide rail 53 and an X-axis slider 54 that can move along the X-axis guide rail 53. A head 40 is attached to the X-axis slider 54. The XY robot 50 can move the head 40 to an arbitrary position on the XY plane by being driven and controlled by the control device 58.

The control device 58 is configured as a microprocessor including a CPU, ROM, RAM, and the like, and executes positioning control of the XY robot 50 in connection with mounting the components supplied from the component supply device 20 on the substrate S. ..

The support legs 60 are for installing the apparatus main body 10 on the floor surface F in which the surface of the concrete floor is coated with a resin. The support leg 60 includes a leveling bolt 62, a leveling sheet 64, and a rubber magnet sheet 66.

The leveling bolt 62 is made of metal (for example, made of stainless steel), and is provided so as to project downward from the four corners of the lower surface of the machine base 11 of the apparatus main body 10. As shown in FIG. 2, the leveling bolt 62 is a bolt with a step, and the lower step is formed thicker than the upper step, and the lower surface of the lower step is a convex curved surface 62a. The leveling bolt 62 is screwed into the bottom plate of the machine base 11, and by adjusting the screwing amount (screw amount), the height of the device body 10 from the floor surface can be adjusted or the device body 10 can be supported horizontally. Can be done.

The leveling sheet 64 is a disk-shaped member made of metal (for example, made of stainless steel), and its upper surface is a concave curved surface 64a, and the concave curved surface 64a receives the convex curved surface 62a of the leveling bolt 62. Therefore, the convex curved surface 62a of the leveling bolt 62 can be displaced while being in contact with the concave curved surface 64a of the leveling sheet 64.

The rubber magnet sheet 66 is a disk-shaped sheet in which magnetic powder is dispersed in a rubber matrix, and is arranged on the lower surface of the leveling sheet 64, that is, between the leveling sheet 64 and the floor surface F. In this embodiment, the "A4 MAGNET SHEET magnet sheet" sold by DAISO JAPAN (Daiso Sangyo Co., Ltd.) is used as the rubber magnet sheet 66. The thickness of the rubber magnet sheet 66 is about 1 to 2 mm.

Next, a method of installing the component mounting device 1 on the floor surface F will be described. First, the leveling sheet 64 having the rubber magnet sheet 66 attached to the lower surface is arranged at four predetermined locations on the floor surface F. Alternatively, the rubber magnet sheet 66 is arranged at four predetermined locations, and the leveling sheet 64 is placed on the rubber magnet sheet 66. After that, the convex curved surface 62a of the leveling bolt 62 of the apparatus main body 10 is placed on the concave curved surface 64a of the leveling sheet 64. As a result, the installation of the component mounting device 1 on the floor surface F is completed.

Next, an operation in which the control device 58 of the device main body 10 mounts a component on the substrate S based on a production job provided by a management computer (not shown) will be described. First, the control device 58 causes the nozzle 42 of the head 40 to collect the parts supplied from the parts supply device 20. Specifically, the control device 58 controls the XY robot 50 to move the nozzle 42 directly above the component supply position of the desired component. Next, the control device 58 controls a Z-axis motor (not shown) and a pressure adjusting device for the nozzle 42 so that the nozzle 42 is lowered and a negative pressure is supplied to the nozzle 42. As a result, the desired component is attracted to the tip of the nozzle 42. After that, the control device 58 raises the nozzle 42 and controls the XY robot 50 to carry the component attracted to the tip of the nozzle 42 above the predetermined position of the substrate S (positioning control). Then, at the predetermined position, the control device 58 lowers the nozzle 42 and controls the nozzle 42 so that the atmospheric pressure is supplied to the nozzle 42. As a result, the parts attracted to the nozzle 42 are separated from each other and mounted at a predetermined position on the substrate S. Other components to be mounted on the board S are also mounted on the board S in the same manner. Further, the control device 58 can switch between valid and invalid of the machine base compensation control by operating a switch by the operator. In the present embodiment, the machine base compensation control is a control using the filter K (s) of the first embodiment of Japanese Patent No. 4840987, and realizes reduction of residual vibration and shortening of movement time when performing positioning control. Can be done.

Next, a modal test, which is a test for investigating the natural vibration of the device, will be described. As test targets, the component mounting device 1 of the present embodiment, the one in which the rubber magnet sheet 66 of the support leg 60 of the component mounting device 1 is omitted (comparative embodiment 1), and the rubber magnet sheet of the support leg 60 of the component mounting device 1 are omitted. Instead of 66, a high-damping rubber sheet containing no magnetic powder (anti-vibration rubber sheet manufactured by Modal Test Kurashiki Machining Co., Ltd.) was used (Comparative Form 2). The results of the modal test are shown in FIG. In FIG. 3, the black circle is a point representing the machine base vibration. Machine base vibration is a phenomenon in which the device itself vibrates from the feet due to the drive reaction force of this type of component mounting device, and is the vibration in the lowest frequency range of the natural vibration of the device, which hinders high-speed performance. It occupies a large proportion as a factor to do. As can be seen from FIG. 3, in the comparative form 2 using the high damping rubber sheet, the frequency of the machine base vibration is lower than that in the comparative form 1 in which the rubber magnet sheet and the high damping rubber sheet are not used, but the vibration intensity is increased. Has increased (decay has decreased). On the other hand, in the present embodiment using the rubber magnet sheet 66, the attenuation is so high that the frequency of the machine base vibration cannot be clearly specified.

Next, the measurement of the positioning waveform will be described. As measurement targets, a component mounting device 1 of the present embodiment and a device in which the rubber magnet sheet 66 of the support leg 60 of the component mounting device 1 is omitted (comparative embodiment 1) are prepared. In this embodiment, the positioning control was executed with the machine base compensation control disabled, and the positioning waveform was measured. For comparison mode 1, the positioning waveform was measured by executing the positioning control with the machine base compensation control disabled (comparative form 1-1), and the positioning waveform was measured even with the machine base compensation control enabled. (Comparative form 1-2). The results are shown in FIG. FIG. 4 shows a waveform at the positioning end (zero deviation). As can be seen from FIG. 4, in the comparative mode 1-1 in which the machine base compensation control was disabled without the rubber magnet sheet, the vibration occurred at the positioning end, but the machine base compensation control was enabled without the rubber magnet sheet. In Comparative Form 1-2, vibration damping was observed at the positioning end. On the other hand, in the present embodiment in which the machine base compensation control is disabled with the rubber magnet sheet, the same degree of vibration damping as in Comparative Form 1-2 was observed. Further, it was found that when the target deviation is 20 [pulses], the time to reach the target can be shortened by about 50 [sample count] in the present embodiment as compared with the comparative embodiment 1-2. Therefore, according to the present embodiment, it can be said that the tact of the device can be improved without sacrificing the mounting accuracy of the parts as compared with the comparative embodiment 1-2.

According to the component mounting device 1 described above, the strength of the vibration frequency of the device main body 10 becomes very small due to the presence of the rubber magnet sheet 66, and the vibration can be suppressed extremely effectively. In particular, it is possible not only to suppress the vibration transmitted from the device main body 10 to the floor, but also to suppress the vibration of the device main body 10 itself. This point is an effect obtained by combining the rubber magnet sheet 66 with the configuration of the leveling bolt 62 having the convex curved surface 62a on the lower surface and the leveling sheet 64 having the concave curved surface 64a receiving the convex curved surface 62a. As described above, according to the component mounting device 1 of the present embodiment, the vibration of the device main body 10 itself can be suppressed easily and inexpensively.

Conventionally, there are many products and technologies that aim not to transmit external vibration to the structure on the vibration isolation table or to prevent the vibration of the vibration source on the vibration isolation table from being transmitted to the outside, such as the vibration isolation table. (For example, Japanese Patent Application Laid-Open No. 2006-199814). On the other hand, the present embodiment is epoch-making in that the vibration of the apparatus main body 10 (vibration source) itself can be suppressed.

Further, according to the present embodiment, since the vibration of the apparatus main body 10 itself can be suppressed, the components can be mounted with high accuracy even if the positioning control is executed without executing the machine base vibration compensation. .. Moreover, the time required to reach the target deviation can be shortened as compared with the time when the machine base vibration compensation is executed.

Further, since this type of component mounting device 1 requires high accuracy in the positioning control of the head 40 on which the nozzle 42 is mounted, it is highly significant to apply the present invention.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be carried out in various embodiments as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the rubber magnet sheet 66 is arranged on the lower surface of the leveling sheet 64, but the rubber magnet sheet 166 may be arranged on the concave curved surface 64a of the leveling sheet 64 as shown in FIG. In this case, the rubber magnet sheet 166 is sandwiched between the leveling bolt 62 and the leveling sheet 64. Further, as shown in FIG. 6, a rubber magnet sheet 266 may be arranged between the upper and lower surfaces of the leveling sheet 264. In the case of FIGS. 5 and 6, the same effect as that of the above-described embodiment can be obtained.

In the above-described embodiment, the A4 magnet sheet sold by Daiso Japan is exemplified as the rubber magnet sheet 66, but other than that may be used. For example, a rubber magnet sheet disclosed in Japanese Patent Application Laid-Open No. 2006-199814, specifically, a rubber magnet sheet obtained by dispersing ferrite magnetic powder or rare earth magnetic powder in a matrix composed of rubber components is used. May be good.

In the above-described embodiment, the apparatus main body 10 collects parts from the parts supply device 20 onto a head 40 which is a moving body, and by moving the head 40, the parts are carried to a predetermined position on the substrate S, and the parts are predetermined. Although it is assumed to be mounted at a position, any device may be used as long as it executes positioning control of the moving body in connection with mounting the component on the substrate S. For example, an adhesive (or flux) for fixing a component mounted on a moving body may be applied to a predetermined position on the substrate S.

In the above-described embodiment, the control device 58 that can execute the machine base compensation control is used, but a control device that cannot execute the machine base compensation control may be used. This is because the vibration of the apparatus main body 10 itself can be suppressed without executing the machine base compensation control.

In the above-described embodiment, the convex curved surface 62a of the leveling bolt 62 is brought into contact with the concave curved surface 64a of the leveling sheet 64, but a universal joint or a ball joint may be configured based on this structure.

In the above-described embodiment, the leveling bolt 62 and the leveling sheet 64 are not integrated, but the convex curved surface 62a of the leveling bolt 62 can be displaced while being in contact with the concave curved surface 64a of the leveling sheet 64. If it can be maintained, the two may be integrated.

In the above-described embodiment, only one layer of the rubber magnet sheet 66 is provided, but two or more layers may be provided. Further, the rubber magnet sheet 66 may be used in combination with the non-slip sheet.

The present invention can be used, for example, in a component mounting device, an adhesive coating device, a flux coating device, and the like.

1 component mounting device, 10 device body, 11 machine stand, 12 frame, 14 support stand, 20 parts supply device, 30 board transfer device, 32 belt conveyor device, 34 backup plate, 36 pins, 40 heads, 42 nozzles, 50 XY Robot, 51 Y-axis guide rail, 52 Y-axis slider, 53 X-axis guide rail, 54 X-axis slider, 58 control device, 60 support legs, 62 leveling bolt, 62a convex curved surface, 64,264 leveling sheet, 64a concave curved surface, 66,166,266 rubber magnet sheet.

Claims (1)

The device body, which performs positioning control of the moving body in connection with mounting the component on the board,
A leveling bolt provided on the main body of the device and having a convex curved surface on the lower surface,
A leveling sheet having a concave curved surface on the upper surface and receiving the convex curved surface of the leveling bolt on the concave curved surface.
Equipped with
The leveling sheet has a flat plate-shaped rubber magnet sheet in which magnetic powder is dispersed in a rubber matrix between the upper and lower surfaces of the leveling sheet instead of the upper surface and the lower surface.
The rubber magnet sheet does not have a through hole in which the leveling bolt penetrates,
The leveling bolt and the lower surface of the leveling sheet are not in contact with each other.
Component mounting related equipment.

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