JP6984688B2 - Composite electronic components - Google Patents

Description

The present invention relates to a composite electronic component including a plurality of electronic elements.

Conventionally, with respect to a composite electronic component provided with a plurality of electronic elements, several inventions have been proposed from the viewpoint of highly integrating the electronic component on a wiring board.

For example, Japanese Patent Application Laid-Open No. 2001-338838 (Patent Document 1) discloses a composite electronic component including a capacitor and a resistor. In this composite electronic component, a resistor is provided on the surface of the capacitor body of the chip type capacitor, and the resistor and a pair of external electrodes provided on the surface of the capacitor body are connected to each other.

Further, in Japanese Patent Application Laid-Open No. 6-283301 (Patent Document 2), two or more types of rectangular shapes having the same shape and the same dimensions selected from the group of chip type resistors, chip type thermistors, chip type capacitors, chip type varistor and the like are described. The chip-type elements of the above are superposed on each other along the thickness direction thereof, and the terminal electrodes provided therein are collectively covered with a lead frame, whereby an integrated composite electronic component is disclosed. ..

Japanese Unexamined Patent Publication No. 2001-338838 Japanese Unexamined Patent Publication No. 6-283301

The present inventors have proposed in Japanese Patent Application No. 2015-049457 a composite electronic component capable of increasing the degree of freedom in circuit design as compared with those disclosed in the above-mentioned Patent Documents 1 and 2. This composite electronic component is a composite electronic component having a novel configuration in which another electronic element is bonded to one substrate-type electronic element in which the function of a passive element is added to an insulating base.

In the composite electronic component having the novel configuration, the upper surface of the insulating base of the substrate-type electronic device is a surface facing the other electronic device. An upper surface conductor to which another electronic element is connected via a bonding material is provided on the upper surface. Further, in one aspect of the composite electronic component having this novel configuration, on the upper surface of the insulating base of the substrate-type electronic device, in addition to the above-mentioned upper surface conductor, an electrical component contained in the substrate-type electronic element is further provided. Other top conductors connected to the functional part are also provided.

These top conductors are generally configured to include a conductive layer made of Ag or Cu in order to obtain sufficient conductivity. However, Ag and Cu are conductive materials that tend to cause the problem of so-called "ion migration", in which a part of Ag and Cu are ionized by the action of an electric field and moved to another place, and after the movement, they are reduced and precipitated again. be.

Therefore, while top conductors such as the composite electronic components with the above new configuration are adopted, if no measures are taken against the problem of ion migration, the insulation resistance between the top conductors will decrease. There is a risk.

Therefore, the present invention has been made to solve the above-mentioned problems, and is a composite capable of suppressing a decrease in insulation resistance between top conductors in a substrate-type electronic component among a plurality of bonded electronic components. The purpose is to provide electronic components.

The composite electronic component based on the first aspect of the present invention is composed of a total of two electronic elements in which one electronic element is bonded to one substrate type electronic element, and the above-mentioned one substrate type electron. a first electronic device is a device, mounted in the height direction to the first component, a second component is the one electronic device, bonding the first component and the second component It is equipped with a bonding material. The first electronic device has an insulating base having an upper surface intersecting in the height direction, a resistor provided on the upper surface of the base, and an upper surface conductor provided on the upper surface of the base. is doing. The second electronic device has a lower surface facing the upper surface of the base in the height direction, and includes an element body including a plurality of dielectric layers and a plurality of conductor layers laminated, and the lower surface of the element body. It has a terminal conductor provided in at least a part of the above. The joining material joins at least a part of the upper surface conductor and at least a part of the terminal conductor. The upper surface conductor contains a conductive layer containing Ag or Cu as the metal component having the largest weight ratio, and at least a part of the side surface of the conductive layer is covered with a protective metal film. The metal component having the largest weight ratio contained in the protective metal film is a metal other than Ag and Cu. The size of the upper surface conductor is smaller than the size of the terminal conductor in any direction orthogonal to the height direction. The protective metal film is a coated conductive layer that covers the upper surface and the side surface of the conductive layer included in the upper surface conductor, and the protective metal film of the portion that covers the side surface of the conductive layer is one of the bonding materials. It is further covered by the part.

In the composite electronic component based on the first aspect of the present invention, the protective metal film may be a plating layer.

The composite electronic component based on the second aspect of the present invention is composed of a total of two electronic elements in which one electronic element is bonded to one substrate type electronic element, and is composed of the above-mentioned one substrate type electron. a first electronic device is a device, mounted in the height direction to the first component, a second component is the one electronic device, bonding the first component and the second component It is equipped with a bonding material. The first electronic device has an insulating base having an upper surface intersecting in the height direction, a resistor provided on the upper surface of the base, and an upper surface conductor provided on the upper surface of the base. is doing. The second electronic device has a lower surface facing the upper surface of the base in the height direction, and includes an element body including a plurality of dielectric layers and a plurality of conductor layers laminated, and the lower surface of the element body. It has a terminal conductor provided in at least a part of the above. The joining material joins at least a part of the upper surface conductor and at least a part of the terminal conductor. The upper surface conductor contains a conductive layer containing Ag or Cu as the metal component having the largest weight ratio, and at least a part of the side surface of the conductive layer is covered with a protective metal film made of a part of the bonding material. It has been. The metal component having the largest weight ratio contained in the protective metal film is a metal other than Ag and Cu. The size of the upper surface conductor is smaller than the size of the terminal conductor in any direction orthogonal to the height direction.

In the composite electronic component based on the first and second aspects of the present invention, the metal component having the largest weight ratio contained in the protective metal film is any one of Sn, Ni, Au and Pb. Is preferable.

In the composite electronic component based on the first and second aspects of the present invention, the thickness of the upper surface conductor is preferably 5 [μm] or more.

In the composite electronic component based on the first and second aspects of the present invention, the upper surface conductors are the first upper surface conductor and the second upper surface conductor separated from each other in the length direction orthogonal to the height direction. The first terminal conductor and the second terminal, which include the third upper surface conductor located between the first upper surface conductor and the second upper surface conductor, and the terminal conductors are separated from each other in the length direction. It may include a conductor. In that case, the first terminal conductor may be joined to the first upper surface conductor by the joining material, and the second terminal conductor may be joined to the second upper surface conductor by the joining material. ..

In the composite electronic component based on the first and second aspects of the present invention, both ends of the first terminal conductor in the width direction in which the first upper surface conductor is orthogonal to the height direction and the length direction. The second upper surface conductor may be located between both ends of the second terminal conductor in the width direction. In that case, of the side surfaces of the first upper surface conductor, the side surfaces orthogonal to the width direction are covered with the protective metal film, and of the side surfaces of the second upper surface conductor, the width direction. It is preferable that the side surface orthogonal to the above is covered with the protective metal film.

In the composite electronic component based on the first and second aspects of the present invention, the dimension of the base in the width direction may be larger than the dimension of the second electronic element in the width direction.

In the composite electronic component based on the first and second aspects of the present invention, the first upper surface conductor is the outer end of the first terminal conductor and the outer end of the second terminal conductor in the length direction. The second upper surface conductor may be located between the outer end of the first terminal conductor and the outer end of the second terminal conductor in the length direction. In that case, of the side surfaces of the first upper surface conductor, the side surface orthogonal to the length direction is covered with the protective metal film, and the length of the side surface of the second upper surface conductor. It is preferable that the side surface orthogonal to the radial direction is covered with the protective metal film.

In the composite electronic component based on the first and second aspects of the present invention, the dimension of the base in the length direction may be larger than the dimension of the second electronic element in the length direction. ..

In the composite electronic component based on the first and second aspects of the present invention, the resistor may be connected to the third upper surface conductor.

In the composite electronic component based on the first and second aspects of the present invention, the upper surface conductor includes a fourth upper surface conductor located between the first upper surface conductor and the second upper surface conductor. In that case, the resistor may be connected to the fourth upper surface conductor.

According to the present invention, it is possible to provide a composite electronic component capable of suppressing a decrease in insulation resistance between top conductors in a substrate-type electronic component among a plurality of bonded electronic components.

It is a schematic perspective view of the composite electronic component which concerns on Embodiment 1 of this invention. It is a schematic cross-sectional view of the composite electronic component shown in FIG. It is a schematic top view and bottom view of the resistance element shown in FIG. 1. It is a schematic perspective view which disassembled the composite electronic component shown in FIG. FIG. 1 is a schematic cross-sectional view of the composite electronic component shown in FIG. 1 and a schematic cross-sectional view of an enlarged main part. It is a flowchart for demonstrating the manufacturing process of the composite electronic component shown in FIG. It is a schematic plan view for demonstrating the drilling process shown in FIG. It is a schematic plan view for demonstrating the printing process of the conductive paste shown in FIG. It is a schematic plan view for demonstrating the printing process of the resistor paste shown in FIG. It is a schematic plan view for demonstrating the coating process of the protective film shown in FIG. It is a schematic plan view for demonstrating the cutting process of the mother substrate shown in FIG. It is a schematic plan view for demonstrating the printing process of the bonding material and the mounting process of a capacitor element shown in FIG. It is a schematic side view for demonstrating the printing process of the bonding material and the mounting process of a capacitor element shown in FIG. It is a schematic cross-sectional view which expanded the main part of the composite electronic component which concerns on Embodiment 2 of this invention. FIG. 14 is a schematic cross-sectional view for explaining a predetermined process in the manufacturing flow of the resistance element shown in FIG. It is a schematic cross-sectional view which expanded the main part of the composite electronic component which concerns on Embodiment 3 of this invention. 16 is a schematic cross-sectional view for explaining a predetermined process in the manufacturing flow of the resistance element shown in FIG. 16. It is a schematic cross-sectional view which expanded the main part of the composite electronic component which concerns on Embodiment 4 of this invention. It is a schematic cross-sectional view which expanded the main part of the composite electronic component which concerns on Embodiment 5 of this invention. It is a schematic cross-sectional view which expanded the main part of the composite electronic component which concerns on Embodiment 6 of this invention. It is a schematic sectional view of the composite electronic component which concerns on Embodiment 7 of this invention. 21 is a schematic top view, cross-sectional view, and bottom view of the inductor element shown in FIG. 21.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the description of the embodiments shown below, the same or common parts are designated by the same reference numerals in the present specification and in the drawings, and the description thereof is not repeated in principle.

It should be noted that the contents of Japanese Patent Application No. 2015-049457 by the present inventors are incorporated herein by reference as a part of the present specification.

(Embodiment 1)
FIG. 1 is a schematic perspective view of a composite electronic component 1A according to the first embodiment of the present invention. 2 (A) and 2 (B) are schematic when the composite electronic component 1A according to the present embodiment is cut along the IIA-IIA line and the IIB-IIB line shown in FIG. It is a cross-sectional view. 3A and 3B are schematic top and bottom views of the resistance element 20A shown in FIG. FIG. 4 is a schematic perspective view of the composite electronic component 1A according to the present embodiment shown in FIG. 1 in which the composite electronic component 1A is disassembled. Further, FIG. 5A is a schematic cross-sectional view when the composite electronic component 1A according to the present embodiment is cut along the VA-VA line shown in FIG. 2. 5 (B) is an enlarged schematic cross-sectional view of the region VB shown in FIG. 5 (A). First, the configuration of the composite electronic component 1A according to the present embodiment will be described with reference to FIGS. 1 to 5.

As shown in FIGS. 1, 2, 4, and 5, the composite electronic component 1A according to the present embodiment includes two electronic elements. That is, the composite electronic component 1A includes a resistance element 20A as a first electronic element and a capacitor element 10 as a second electronic element.

The condenser element 10 has a substantially rectangular parallelepiped shape, and the dimensions of the four sides along the length direction L described later are larger than the dimensions of the four sides along the width direction W described later. The substantially rectangular parallelepiped shape referred to here includes those having rounded corners and ridges of the capacitor element 10, those having steps and irregularities on the surface of the capacitor element 10, and the like.

The resistance element 20A has a substantially flat plate shape having a predetermined thickness, and the dimensions of the four sides along the length direction L described later are larger than the dimensions of the four sides along the width direction W described later. The substantially flat plate shape referred to here includes those having rounded corners and ridges of the resistance element 20A, those having steps and irregularities on the surface of the resistance element 20A, and the like.

As shown in FIGS. 1, 2 and 5, the capacitor element 10 is arranged on the resistance element 20A. That is, each electronic element is arranged so that the lower surface 11a of the capacitor element 10 and the upper surface 21a of the resistance element 20 face each other. Then, the capacitor element 10 is bonded to the resistance element 20A via the first and second bonding materials 31 and 32.

Here, in order to specifically explain the configuration of the composite electronic component 1A, the direction in which the capacitor element 10 and the resistance element 20A are arranged is referred to as the height direction H. Of the directions orthogonal to the height direction H, the direction in which the first and second external electrodes 14A and 14B of the capacitor element 10, which will be described later, are lined up is called the length direction L. Further, the direction orthogonal to both the height direction H and the length direction L is referred to as a width direction W.

As shown in FIGS. 1, 2, 4 and 5, the capacitor element 10 is, for example, a monolithic ceramic capacitor, the capacitor body 11 as the element body, and the first and second external electrodes 14A as terminal conductors. , 14B and. In the present specification, these first and second external electrodes 14A and 14B may be referred to as first and second terminal conductors. The capacitor body 11 has a substantially rectangular parallelepiped shape, and the first and second external electrodes 14A and 14B provided in a predetermined region on the surface thereof have a distance of, for example, 300 [μm] in the length direction L. They are separated from each other.

As shown in FIGS. 2 and 5, the capacitor main body 11 is composed of a plurality of dielectric layers 12 and a plurality of internal electrode layers 13, and each dielectric layer 12 and each internal electrode layer 13 are alternately laminated. It is configured. In the composite electronic component 1A according to the present embodiment, the stacking direction of the plurality of dielectric layers 12 and the plurality of internal electrode layers 13 coincides with the height direction H. However, this is only an example, and the stacking direction of the plurality of dielectric layers 12 and the plurality of internal electrode layers 13 may coincide with the width direction W.

The dielectric layer 12 is a material containing, for example, a ceramic material containing _{barium titanate (BaTIO 3} ), calcium titanate (CaTIO ₃ ), strontium titanate (SrTiO ₃ ), calcium _{titanate (CaZrO 3) or the like as a main component.} Consists of. Further, the dielectric layer 12 may contain Mn, Mg, Si, Co, Ni, rare earths and the like as subcomponents having a content smaller than that of the main component. On the other hand, the internal electrode layer 13 is made of a material containing a metal material such as Ni, Cu, Ag, Pd, Ag—Pd alloy, or Au.

As shown in FIG. 5B, the first and second external electrodes 14A and 14B each include a plurality of coated conductive layers 14a different from the underlying conductive layer 14a, the coated conductive layer 14b and the coated conductive layer 14b. It is composed of a conductive layer. In FIG. 5B, only the first external electrode 14A is shown. The base conductive layer 14a is composed of a sintered metal layer formed by baking a paste such as Cu, Ni, Ag, Pd, Ag—Pd alloy, or Au. For example, the coated conductive layer 14b is a Ni layer as a plating layer, and the coated conductive layer 14c is a Sn layer as a plating layer covering the coated conductive layer 14b. The coated conductive layers 14b and 14c may be Cu layers or Au layers as plating layers instead.

In the present embodiment, the underlying conductive layer 14a is composed of a Cu layer as a sintered metal layer, the coated conductive layer 14b is composed of a Ni layer as a plating layer, and the coated conductive layer 14c is formed. It is composed of a Sn layer as a plating layer. The coated conductive layer 14b, which is a Ni layer as a plating layer, is covered with a coated conductive layer 14c, which is a Sn layer as a plating layer.

The first and second external electrodes 14A and 14B may be composed of only the plating layer, omitting the underlying conductive layer 14a. Further, the base conductive layer 14a may be composed of a conductive resin layer obtained by curing a conductive resin paste containing a metal component and a resin component.

As shown in FIGS. 1, 2 and 5, the capacitor main body 11 has a pair of end faces facing each other in the length direction L, a pair of side surfaces facing each other in the width direction W, and a pair facing each other in the height direction H. Has the main surface of. Of these, the lower surface 11a, which is one of the pair of main surfaces facing each other in the height direction H, faces the resistance element 20A.

Further, the first external electrode 14A is provided so as to be connected to one end surface of the capacitor main body 11 and a part of each of the pair of side surfaces and the pair of main surfaces, and the second external electrode 14B is a capacitor. The other end surface of the main body 11 is connected to a part of each of the pair of side surfaces and the pair of main surfaces. As a result, a predetermined region of the lower surface 11a of the capacitor body 11 is covered with the first and second external electrodes 14A and 14B which are separated from each other in the length direction L, and these first and second external electrodes 14A and 14B are covered. A part of the lower surface 11a of the capacitor body 11 is exposed between the two.

As shown in FIG. 2, one of the pair of internal electrode layers 13 adjacent to each other with one dielectric layer 12 interposed therebetween along the height direction H is attached to one of the pair of end faces of the capacitor body 11. It is drawn out and electrically connected to one of the first and second external electrodes 14A and 14B. The other internal electrode layer 13 is drawn out to the other of the pair of end faces of the capacitor body 11 and electrically connected to the other of the first and second external electrodes 14A and 14B. As a result, a plurality of capacitors are electrically connected in parallel between the first and second external electrodes 14A and 14B.

The above-mentioned capacitor element 10 is manufactured, for example, by the following procedure. First, a laminated chip is obtained by alternately laminating and crimping a material sheet formed by printing a conductive paste to be an internal electrode layer 13 on the surface of a ceramic green sheet to be a dielectric layer 12. Here, a laminated block in which a plurality of laminated chips are integrated may be prepared in advance, and the laminated block may be separated to obtain a laminated chip. Next, the capacitor body 11 is obtained by firing the laminated chips. After that, the first and second external electrodes 14A and 14B are formed on the surface of the capacitor body 11, and the above-mentioned capacitor element 10 is manufactured.

The size of the capacitor element 10 is not particularly limited, but as an example, the dimension of the length direction L is 0.62 [mm] and the dimension of the width direction W is 0.32. It is [mm], and the dimension of the height direction H is 0.32 [mm].

As shown in FIGS. 1 to 5, the resistance element 20A includes an insulating base 21, a resistor 22, a protective film 23, first to fourth upper surface conductors 24A to 24D, and first to fourth. It has lower surface conductors 25A to 25D and first to fourth connecting conductors 26A to 26D. When the first to fourth connecting conductors 26A to 26D are provided inside the base 21 as via conductors, these may be referred to as first to fourth via conductors 26A to 26D.

The base 21 has a substantially flat plate shape having a predetermined thickness, and for example, a resin material such as epoxy resin, a ceramic material such as alumina, or a filler or woven fabric made of an inorganic material or an organic material is added thereto. It is composed of plastics and the like. More preferably, an alumina substrate or a ceramic substrate including a low temperature co-fired ceramic (LTCC) substrate is used as the base 21. In this embodiment, an LTCC substrate is used as the base 21.

The base 21 faces the first and second side surfaces, which are a pair of side surfaces facing each other in the length direction L, and the third and fourth side surfaces, which are a pair of side surfaces facing each other in the width direction W, in the height direction H. It has a pair of main surfaces. As shown in FIGS. 2, 4 and 5, one of the pair of main surfaces, the upper surface 21a, faces the capacitor element 10, and the lower surface 21b, which is the other of the pair of main surfaces, faces the capacitor element 10. , A surface facing the wiring board (not shown) on which the composite electronic component 1A is mounted. In order to prevent the second electronic element from coming into contact with another electronic component mounted next to it on the wiring board, the dimension of the base 21 in the length direction L is set to the length direction L of the second electronic element. It is preferable that the dimension is larger than the dimension, and it is also preferable that the dimension W in the width direction of the base 21 is larger than the dimension L in the width direction of the second electronic element.

As shown in FIGS. 2 and 3, the resistor 22 is provided at a predetermined position on the upper surface 21a of the base 21, and is, for example, a rectangular or circular film when viewed in a plan view along the height direction H. It has a shape. As the resistor 22, for example, a metal film, a metal oxide film, or a metal glaze film which is a mixture of a metal oxide film and glass can be used.

The protective film 23 covers at least a part of the resistor 22 on the upper surface 21a of the base 21, and is made of an insulating film made of, for example, a glass material or a resin material. Here, it is preferable that the protective film 23 completely covers the resistor 22 so that the resistor 22 is not exposed.

The first and second upper surface conductors 24A and 24B are provided on the upper surface 21a of the base 21, and are composed of a rectangular conductive layer. The dimensions of the first and second upper surface conductors 24A and 24B in the length direction L are, for example, 0.125 [mm]. The first and second upper surface conductors 24A and 24B are separated from each other at a distance of, for example, 0.36 [mm] in the length direction L, and are arranged near both ends of the upper surface 21a of the base 21 in the length direction L. Has been done. The first upper surface conductor 24A is separated from the first side surface, the third side surface, and the fourth side surface at a predetermined distance, for example, 0.025 [mm]. Further, the second upper surface conductor 24B is separated from the second side surface, the third side surface, and the fourth side surface at a predetermined distance, for example, 0.025 [mm]. The first and second upper surface conductors 24A and 24B of the base 21 have an Ag layer in which the metal component having the largest weight ratio among the contained metal components is Ag, or the metal component having the largest metal component in the weight ratio among the contained metal components. It contains a Cu layer that is Cu.

The third and fourth upper surface conductors 24C and 24D are provided on the upper surface 21a of the base 21, and are composed of a rectangular conductive layer. The third and fourth upper surface conductors 24C and 24D are located between the region where the first upper surface conductor 24A is provided and the region where the second upper surface conductor 24B is provided in the length direction L. Further, the third and fourth upper surface conductors 24C and 24D are separated from each other in the width direction W, and are arranged near both ends of the upper surface 21a of the base portion 21 in the width direction W. Here, the third and fourth upper surface conductors 24C and 24D may be arranged apart from each other in the length direction L.

In the third and fourth upper surface conductors 24C and 24D, the Ag layer in which the metal component having the largest weight ratio among the contained metal components is Ag, or the metal component having the largest weight ratio among the contained metal components is Cu. Contains a Cu layer.

The first and second lower surface conductors 25A and 25B are provided on the lower surface 21b of the base 21, and are composed of a rectangular conductive layer. The first and second lower surface conductors 25A and 25B are separated from each other in the length direction L, and are arranged near both ends of the lower surface 21b of the base portion 21 in the length direction L. The first lower surface conductor 25A faces the first upper surface conductor 24A with the base portion 21 interposed therebetween, and is separated from the first side surface, the third side surface, and the fourth side surface at predetermined intervals. Further, the second lower surface conductor 25B faces the second upper surface conductor 24B with the base portion 21 interposed therebetween, and is separated from the second side surface, the third side surface, and the fourth side surface at predetermined intervals.

The third and fourth lower surface conductors 25C and 25D are provided on the lower surface 21b of the base 21, and are composed of a rectangular conductive layer. The third and fourth lower surface conductors 25C and 25D are located between the region where the first lower surface conductor 25A is provided and the region where the second lower surface conductor 25B is provided in the length direction L. Further, the third and fourth lower surface conductors 25C and 25D are separated from each other in the width direction W, and are arranged near both ends of the lower surface 21b of the base portion 21 in the width direction W.

The first and second connecting conductors 26A and 26B are first and second via conductors 26A and 26B penetrating the base 21 along the height direction H, and are viewed in a plan view along the height direction H. , Has a substantially circular shape. The first via conductor 26A overlaps the first upper surface conductor 24A and the first lower surface conductor 25A when viewed in a plane along the height direction H, and the first upper surface conductor 24A and the first lower surface conductor 25A are combined with each other. You are connected. The second via conductor 26B overlaps the second upper surface conductor 24B and the second lower surface conductor 25B when viewed in a plane along the height direction H, and the second upper surface conductor 24B and the second lower surface conductor 25B are combined with each other. You are connected.

The third and fourth connecting conductors 26C and 26D are the third and fourth via conductors 26C and 26D penetrating the base 21 along the height direction H, and are viewed in a plane along the height direction H. , Has a substantially circular shape. The third via conductor 26C overlaps the third upper surface conductor 24C and the third lower surface conductor 25C when viewed in a plane along the height direction H, and the third upper surface conductor 24C and the third lower surface conductor 25C are combined with each other. You are connected. The fourth via conductor 26D overlaps the fourth upper surface conductor 24D and the fourth lower surface conductor 25D when viewed in a plane along the height direction H, and the fourth upper surface conductor 24D and the fourth lower surface conductor 25D are combined with each other. You are connected.

The first to fourth connecting conductors 26A to 26D may be provided on the side surface of the base 21.

The resistor 22 described above is located between the region where the first upper surface conductor 24A is provided and the region where the second upper surface conductor 24B is provided in the length direction L, and is viewed in a plan view from the height direction H. In this case, one end of the resistor 22 in the width direction W overlaps a part of the third upper surface conductor 24C, and the other end overlaps a part of the fourth upper surface conductor 24D. As a result, the third and fourth upper surface conductors 24C and 24D are connected to the resistor 22.

In order to prevent the resistance element 20A and the capacitor element 10 from physically interfering with each other, the dimensions of the resistor 22 in the length direction L are set to the first external electrode 14A and the second external electrode 14B of the capacitor element 10. It is preferable that the interval is smaller than the interval between.

Further, in order to prevent contact with other conductive members, as shown in the figure, the protective film 23 described above may cover not only the resistor 22 but also the third and fourth upper surface conductors 24C and 24D. preferable.

The size of the resistance element 20A is not particularly limited, but as an example, the dimension L in the length direction is 0.66 [mm] and the dimension W in the width direction is 0.36. It is [mm], and the dimension of the height direction H is 0.14 [mm].

The resistance element 20A may not include the fourth upper surface conductor 24D and may have only the first to third upper surface conductors 24A to 24C on the upper surface of the base. In this case, the resistor 22 is connected to the first upper surface conductor 24A or the second upper surface conductor 24B instead of the fourth upper surface conductor 24D. Further, in this case, the resistance element 20A may not include the fourth lower surface conductor 25D and the fourth via conductor 26D.

As shown in FIG. 5B, the first and second upper surface conductors 24A and 24B are each composed of a plurality of conductive layers including the underlying conductive layer 24a, the coated conductive layer 24b, and the coated conductive layer 24c. There is. In FIG. 5B, only the first upper surface conductor 24A is shown. Here, the base conductive layer 24a is composed of an Ag layer as a sintered metal layer formed by baking an Ag paste, and the coated conductive layers 24b and 24c are a Ni layer as a plating layer and a Ni layer thereof, respectively. It is composed of an Au layer as a plating layer covering the above.

On the other hand, the third and fourth upper surface conductors 24C and 24D are preferably formed at the same time as the underlying conductive layers 24a of the first and second upper surface conductors 24A and 24B from the viewpoint of facilitating manufacturing. In that case, the third and fourth upper surface conductors 24C and 24D are preferably composed of an Ag layer as a sintered metal layer formed by baking the Ag paste.

Further, the first to fourth lower surface conductors 25A to 25D are preferably formed by the same method as the first and second upper surface conductors 24A and 24B from the viewpoint of facilitation of production. In that case, as shown in FIG. 5B, the first to fourth lower surface conductors 25A to 25D are the underlying conductive layer which is an Ag layer as a sintered metal layer formed by baking the Ag paste. It is composed of a plurality of conductive layers including 25a, a coated conductive layer 25b which is a Ni layer as a plating layer, and a coated conductive layer 25c which is an Au layer as a plating layer covering the coating conductive layer 25b. In FIG. 5B, only the first lower surface conductor 25A is shown.

Further, the first to fourth via conductors 26A to 26D are the base conductive layers 24a of the first and second upper surface conductors 24A and 24B, and the third and fourth upper surface conductors 24C and 24D, from the viewpoint of facilitation of manufacturing. Alternatively, it is preferable to form the first to fourth lower surface conductors 25A to 25D by the same method as the underlying conductive layer 25a. That is, it is preferable that the first to fourth via conductors 26A to 26D are composed of a sintered metal layer formed by baking Ag paste.

Here, the reason why the first to fourth upper surface conductors 24A to 24D and the first to fourth lower surface conductors 25A to 25D both include the Ag layer as the sintered metal layer is in the upper surface conductor and the lower surface conductor. This is to obtain sufficient conductivity. Further, the reason why the outermost outermost portions of the first and second upper surface conductors 24A and 24B and the first to fourth lower surface conductors 25A to 25D are all formed of the Au layer as the coated conductive layer is that the upper surface conductor and the lower surface are formed. This is to obtain sufficient electrical and mechanical connection reliability between the conductor and the joining material to be joined to the conductor.

As shown in FIGS. 1, 2 and 5, the capacitor element 10 and the resistance element 20A are bonded via the above-mentioned first and second bonding materials 31 and 32. Specifically, the capacitor element 10 is arranged and mounted on the upper surface 21a side of the resistance element 20A in the height direction H, so that the lower surface 11a of the capacitor body 11 and the upper surface 21a of the base 21 are arranged in the height direction. They are facing each other in H. Then, the first external electrode 14A of the capacitor element 10 and the first upper surface conductor 24A of the resistance element 20A are bonded via the first bonding material 31, and the second external electrode 14B and the second upper surface conductor 24B are connected to each other. It is joined via a joining material 32.

As the first and second bonding materials 31 and 32, for example, solder or a conductive adhesive can be used, but it is particularly preferable that solder is used. As a general solder, a solder (Sn-3Ag-) containing Sn in a metal weight ratio of 96.5 [%], Ag in a metal weight ratio of 3 [%], and Cu in a metal weight ratio of 0.5 [%]. 0.5 Cu ternary solder) is used. Further, in order to prevent the solder that bonds the capacitor element 10 and the resistance element 20A from being remelted when the composite electronic component 1A is mounted on the wiring board, the first and second bonding materials 31 and 32 are used. It is preferable that so-called high temperature solder is used. Examples of the high-temperature solder include solders containing Sn as a main component of a metal and added with Bi, Au, Zn, Al or Sb.

As a result, the first external electrode 14A is electrically connected to the first lower surface electrode 25A through the first upper surface conductor 24A and the first via conductor 26A. The second external electrode 14B is electrically connected to the second lower surface conductor 25B through the second upper surface conductor 24B and the second via conductor 26B. Therefore, the first and second upper surface conductors 24A and 25B and the first and second via conductors 26A and 26B function as relay conductors of the capacitor element 10. The first and second lower surface conductors 25A and 25B function as connection terminals for the capacitor element 10 to the wiring board.

On the other hand, the resistor 22 provided on the resistance element 20A is electrically connected to the third and fourth upper surface conductors 24C and 24D of the resistance element 20A as described above. The third upper surface conductor 24C is electrically connected to the third lower surface conductor 25C through the third via conductor 26C. The fourth upper surface conductor 24D is electrically connected to the fourth lower surface conductor 25D through the fourth via conductor 26D. Therefore, the third and fourth upper surface conductors 24C and 24D and the third and fourth via conductors 26C and 26D function as relay conductors of the resistor 22. The third and fourth lower surface conductors 25C and 25D function as connection terminals for the resistance element 20A to the wiring board.

Here, as shown in FIG. 5B, in the composite electronic component 1A according to the present embodiment, as described above, the first and second upper surface conductors 24A and 24B respectively serve as the base conductive layer 24a. It is composed of a plurality of layers of an Ag layer, a Ni layer as a coated conductive layer 24b, and an Au layer as a coated conductive layer 24c. Further, in addition to the upper surface of the Ag layer as the underlying conductive layer 24a being covered with the coated conductive layers 24b and 24c, the side surfaces thereof (these side surfaces are a pair of side surfaces and widths intersecting in the length direction L). A pair of side surfaces intersecting the direction W) are also covered by the coated conductive layers 24b, 24c. In FIG. 5B, one side surface 24a1 of the pair of side surfaces intersecting in the width direction W of the base conductive layer 24a of the first upper surface conductor 24A is covered with the coated conductive layers 24b and 24c. It is shown that it is.

In the composite electronic component 1A according to the present embodiment, the side surface of the base conductive layer 24a made of the Ag layer is covered with the coated conductive layers 24b and 24c as protective metal films containing no Ag and Cu, so that the Ag is covered. The underlying conductive layer 24a composed of layers is not exposed to the outside. Therefore, it is possible to reduce the occurrence of the problem of ion migration caused by the Ag layer contained in the first and second upper surface conductors 24A and 24B, and the decrease in the insulation resistance between the upper surface conductors is suppressed. Therefore, the composite electronic component 1A according to the present embodiment has high reliability.

In the composite electronic component 1A according to the present embodiment, the third and fourth upper surface conductors 24C and 24D are different from the above-mentioned configurations of the first and second upper surface conductors 24A and 24B, and the base conductor is composed of an Ag layer. It is composed of only the layer 24a. This is because the third and fourth upper surface conductors 24C and 24D are covered with the protective film 23 that covers the resistor 22 instead of the coated conductive layer, and the ion migration is caused by being covered by the protective film 23. This is because the occurrence of However, when the protective film 23 does not cover all or a part of each of the third and fourth upper surface conductors 24C and 24D, the third and second upper surface conductors 24A and 24B are similarly described above. 4 It is preferable that the Ag layer of the upper surface conductors 24C and 24D is covered with the coated conductive layers 24b and 24c.

Further, in the composite electronic component 1A according to the present embodiment, the coated conductive layers 24b and 24c covering the side surface of the base conductive layer 24a made of the Ag layer in each of the first and second upper surface conductors 24A and 24B are Further, it is covered with the first and second bonding materials 31, 32. Here, since the first and second bonding materials 31 and 32 are composed of a ternary solder of Sn-3Ag-0.5Cu as described above, they are conductive materials that easily generate ion migration. Contains certain Ag and Cu. However, since Ag and Cu contained in the first and second bonding materials 31 and 32 are both in a very small amount, they are generated as compared with the case where the underlying conductive layer 24a made of the Ag layer is exposed. The degree of ion migration obtained is significantly low. Therefore, even in such a configuration, high reliability can be ensured.

Here, the coated conductive layers 24b and 24c covering the side surfaces of the base conductive layer 24a made of the Ag layer in each of the first and second upper surface conductors 24A and 24B are further covered with the first and second bonding materials 31 and 32. If this is the case, a so-called self-alignment effect can be easily obtained when the capacitor element 10 is mounted on the resistance element 20A. The details will be described later.

Further, in the composite electronic component 1A according to the present embodiment, the first to fourth lower surface conductors 25A to 25D also adopt the same configurations as the first and second upper surface conductors 24A and 24B described above. With such a configuration, it is possible to suppress a decrease in the insulation resistance between these lower surface conductors.

6 is a flowchart for explaining the manufacturing process of the composite electronic component 1A shown in FIG. 1, and FIGS. 7 to 13 are schematic for explaining each predetermined process in the flowchart shown in FIG. It is a plan view and a schematic side view. Hereinafter, the manufacturing process of the composite electronic component 1A according to the present embodiment will be described with reference to FIGS. 6 to 13. 7 to 10 are schematic views of the work-in-process in the manufacturing process viewed from the upper surface 121a side of the ceramic green sheet 121, and FIGS. 11 and 12 show the work-in-process in the manufacturing process as a resistance element. It is a schematic view seen from the upper surface 21a side of the base part 21 of 20A. Further, FIG. 13 (A) is a schematic view of the work-in-process in the manufacturing process along the width direction W, and FIG. 13 (B) shows the work-in-process in the manufacturing process along the length direction L. It is a schematic diagram as seen.

Of the manufacturing steps described below, in the manufacturing process of the resistance element 20A, an aggregate in which a plurality of resistance elements 20A are integrated is prepared in advance, and the aggregates are separated to collectively combine the plurality of resistance elements 20A. It is a case of manufacturing. Naturally, the manufacturing flow of the resistance element 20A is not limited to this. The aggregate corresponds to the mother substrate 121'shown in FIG. 10 and the like.

As shown in FIG. 6, first, a ceramic green sheet is manufactured (process ST1). Specifically, a ceramic slurry is prepared by mixing a ceramic powder, a binder resin, a solvent and the like in a predetermined blending ratio. A ceramic green sheet is formed by applying this ceramic slurry on a carrier film in the form of a sheet by die coating, gravure coating, microgravure coating, screen printing, spray coating, or the like. The formed ceramic green sheet serves as a mother substrate 121'which is an aggregate of the resistance element 20A, and also serves as a base 21 of the resistance element 20A.

Next, drilling is performed (process ST2). Specifically, as shown in FIG. 7, a plurality of through holes 128 are formed in the ceramic green sheet 121. Here, the formation of the through hole 128 is a pretreatment for forming the first to fourth via conductors 26A to 26D.

Returning to FIG. 6, the conductive paste is then printed (step ST3). Specifically, as shown in FIG. 8, Ag paste is printed as a conductive paste on the upper surface 121a and the lower surface of the ceramic green sheet 121 by a screen printing method, a gravure printing method, or the like. As a result, the through hole 128 provided in the ceramic green sheet 121 is embedded by the conductive pattern 126 made of Ag paste which becomes the first to fourth via conductors 26A to 26D, and the first is formed in the upper surface 121a of the ceramic green sheet 121. A conductive pattern 124a having a predetermined shape made of Ag pastes to be the fourth upper surface conductors 24A to 24D is formed, and further, a predetermined shape made of Ag pastes to be the first to fourth lower surface conductors 25A to 25D is formed on the lower surface of the ceramic green sheet 121. A conductive pattern of the shape will be formed.

Returning to FIG. 6, firing is then performed (step ST4). Specifically, the work-in-process up to this point is heated to a predetermined temperature, whereby the ceramic green sheet 121 and the conductive patterns 124a and 126 made of Ag paste printed on the ceramic green sheet 121 are sintered. It will be done. As a result, the ceramic green sheet 121 changes to a hard mother substrate 121', and the conductive patterns 124a and 126 and the like change to a sintered metal layer. As a result, as shown in FIG. 9 and the like, the mother substrate 121'has a base conductive layer 24a, which is a part of the first and second upper surface conductors 24A and 24B and the first to fourth lower surface conductors 25A to 25D. The 25a, the third and fourth upper surface conductors 24C and 24D, and the first to fourth via conductors 26A to 26D will be formed.

Returning to FIG. 6, the resistor paste is then printed (step ST5). Specifically, as shown in FIG. 9, the resistor paste is printed on the upper surface 121a'of the mother substrate 121'using a screen printing method, a gravure printing method, or the like. As a result, the resistor pattern 122 made of the resistor paste is formed on the upper surface 121a'of the mother substrate 121'. At that time, printing is performed so that the resistor pattern 122 overlaps a part of the third and fourth upper surface conductors 24C and 24D.

Returning to FIG. 6, the resistor paste is then baked (step ST6). Specifically, the work-in-process up to this point is heated to a predetermined temperature, whereby, as shown in FIG. 10, the resistor paste printed on the mother substrate 121'is sintered. As a result, the resistor pattern 122 is baked onto the mother substrate 121', whereby the resistor 22 is formed on the mother substrate 121'.

Returning to FIG. 6, next, trimming of the resistor is performed (step ST7). Specifically, the resistance value of the resistor 22 is adjusted by irradiating the resistor 22 with a laser beam and removing a part thereof.

Next, the protective film is applied (step ST8), and then the protective film is cured (step ST9). Specifically, as shown in FIG. 10, the protective film 23 is applied so as to cover the resistor 22 and the third and fourth upper surface conductors 24C and 24D connected to the resistor 22. After that, when the work-in-process up to this point is heated to a predetermined temperature, the protective film 23 is cured in a state of being attached to the mother substrate 121'.

Returning to FIG. 6, the plating process is then performed (step ST10). Specifically, by sequentially immersing the work-in-process so far in the Ni plating bath and the Au plating bath, the plating treatment of the underlying conductive layers 24a and 25a exposed on the mother substrate 121'is performed. As a result, the underlying conductive layers 24a and 25a are covered with the coated conductive layers 24b and 25b which are Ni layers, and the coated conductive layers 24b and 25b are covered with the coated conductive layers 24c and 25c which are Au layers. As a result, the first and second upper surface conductors 24A and 24B and the first to fourth lower surface conductors 25A to 25D are formed. At that time, the side surface of the underlying conductive layer 24a is also covered with the coated conductive layers 24b and 24c, which are the Ni layer and the Au layer.

Next, the mother substrate 121'is cut (step ST11). Specifically, as shown in FIG. 11, the mother substrate 121'is cut along a predetermined cutting line by push-cutting or dicing, so that each resistance element 20A is cut out. With the above, the production of the resistance element 20A is completed.

Then, returning to FIG. 6, the bonding material is printed (process ST12), and then the capacitor element is placed (process ST13). Specifically, as shown in FIGS. 12 and 13, the first and second bonding materials 31 and 32 made of solder paste so as to cover the first and second upper surface conductors 24A and 24B are screen-printed, respectively. The capacitor element 10 is placed so that the first and second external electrodes 14A and 14B are arranged on the first and second bonding materials 31 and 32, respectively.

Here, as shown in FIG. 13A, the dimensions of the first and second external electrodes 14A and 14B in the length direction L are Le, respectively, and the first and second upper surface conductors 24A in the length direction L, respectively. When the dimensions of 24B are Ll, it is preferable that these Le and Ll satisfy the condition of Ll <Le. That is, in the length direction L, the first and second upper surface conductors 24A and 24B are preferably located between the outer end of the first external electrode 14A and the outer end of the second external electrode 14B. That is, the distance between the outer end of the first upper surface conductor 24A and the outer end of the second external electrode 14B is larger than the distance between the outer end of the first external electrode 14A and the outer end of the second external electrode 14B. It is preferably small, and the distance between the outer end of the second upper surface conductor 24B and the outer end of the first external electrode 14A is the distance between the outer end of the second external electrode 14B and the outer end of the first external electrode 14A. It is preferably smaller than the distance between them. Further, it is preferable that the outer end of the first upper surface conductor 24A in the length direction L overlaps with the first external electrode 14A when viewed in a plan view from the height direction H, and the length of the second upper surface conductor 24B. It is preferable that the outer end in the direction L overlaps with the second external electrode 14B.

The outer end of the first external electrode 14A in the length direction L means the end of both ends of the first external electrode 14A in the length direction L, whichever is farther from the second external electrode 14B. The outer end of the second external electrode 14B in the length direction L means the end of both ends of the second external electrode 14B in the length direction L, whichever is farther from the first external electrode 14A. The outer end of the first upper surface conductor 24A in the length direction L means the end of both ends of the first upper surface conductor 24A in the length direction L, whichever is farther from the second upper surface conductor 24B. The outer end of the second upper surface conductor 24B in the length direction L means the end of both ends of the second upper surface conductor 24B in the length direction L, whichever is farther from the first upper surface conductor 24B.

Further, as shown in FIG. 13B, the dimensions of the first and second external electrodes 14A and 14B in the width direction W are We, respectively, and the dimensions of the first and second upper surface conductors 24A and 24B in the width direction W. When each is Wl, it is preferable that these We and Wl satisfy the condition of Wl <We. That is, in the width direction W, the first upper surface conductor 24A is preferably located between both ends of the first external electrode 14A, and the second upper surface conductor 24B is located between both ends of the second external electrode 14B. It is preferable to do so. That is, in the width direction, the distance Wl between one end of the first upper surface conductor 24A and the other end is smaller than the distance between one end of the first external electrode 14A and the other end of the first upper surface conductor 24A. It is preferable that the distance Wl between one end of the second upper surface conductor 24B and the other end is smaller than the distance between one end of the second external electrode 14B and the other end of the second upper surface conductor 24B. preferable. Further, it is preferable that both ends of the width direction W of the first upper surface conductor 24A overlap with the first external electrode 14A in a plan view from the height direction H, and the width direction W of the second upper surface conductor 24B. It is preferable that both ends of the above overlap with the second external electrode 14B, respectively.

That is, it is preferable that the sizes of the first and second upper surface conductors 24A and 24B are smaller than the sizes of the first and second external electrodes 14A and 14B in any of the directions orthogonal to the height direction H. (Hereinafter, this preferable condition is referred to as "first condition"). In the present embodiment, when viewed in a plan view from the height direction H, all of the first upper surface conductor 24A overlaps with the first external electrode 14A, and all of the second upper surface conductor 24B is the second external electrode 14B. It overlaps with.

On the other hand, as shown in FIG. 13A, when the lengths of the coated regions of the first and second bonding materials 31 and 32 in the length direction L are Ls, the Ls and the Ll are different. , Ll <Ls are preferably satisfied. Further, as shown in FIG. 13B, when the lengths of the coated regions of the first and second bonding materials 31 and 32 in the width direction W are Ws, the Ws and the Wl are different from each other. It is preferable that the condition of Wl <Ws is satisfied. That is, it is preferable that the first and second bonding materials 31 and 32 are applied so as to protrude from the first and second upper surface conductors 24A and 24B, respectively (hereinafter, this preferable condition is referred to as "second condition"). ..

By satisfying the conditions 1 and / or the condition 2, the so-called self-alignment effect can be easily obtained at the time of reflow described later, that is, at the time of mounting the capacitor element 10 on the resistance element 20A. Here, the self-alignment effect means that a force (that is, surface tension) that reduces the surface area of the molten solder during soldering acts on the electronic element to be mounted, which is supported by the molten solder. It is the effect that the positioning is performed by moving, and by obtaining this self-alignment effect, it is possible to prevent the positional deviation at the time of mounting.

Here, by satisfying the first condition, the side surfaces of the first and second upper surface conductors 24A and 24B are located inside the capacitor element 10 in a plan view. Then, when the solder as the first and second bonding materials 31 and 32 is melted, the surface tension of the solder located near the side surfaces of the first and second upper surface conductors 24A and 24B is the capacitor element 10 located above the first and second upper surface conductors 24A and 24B. Will act in the direction of pulling inward. The force that pulls the capacitor element 10 inward is much larger than that in the case where there is no solder near the side surfaces of the first and second upper surface conductors 24A and 24B. Therefore, by further satisfying the second condition, the solder is located near the side surfaces of the first and second upper surface conductors 24A and 24B, so that the force for pulling the capacitor element 10 inward is stronger. As a result, the self-alignment effect can be obtained more reliably.

The self-alignment effect described above is the thickness of the first and second upper surface conductors 24A and 24B, that is, the height of the first and second upper surface conductors 24A and 24B with reference to the upper surface 21a of the base 21 of the resistance element 20A. The thickness of the first and second upper surface conductors 24A and 24B is preferably 5 [μm] or more, because it can be obtained more reliably when is 5 [μm] or more.

Returning to FIG. 6, reflow is performed next (step ST14). Specifically, the work-in-process products up to this point are soldered by being put into a reflow furnace or the like, and the first and second upper surface conductors 24A and 24B and the first and second external electrodes 14A and 14B are respectively. It is joined by the first and second joining materials 31, 32. As a result, the capacitor element 10 is mounted on the resistance element 20A, and the production of the composite electronic component 1A according to the above-described embodiment is completed.

The manufacturing flow of the composite electronic component described above is only an example, and it is naturally possible to manufacture the composite electronic component 1A according to the present embodiment based on another manufacturing flow.

(Embodiment 2)
14 is a schematic cross-sectional view of an enlarged main part of the composite electronic component 1B according to the second embodiment of the present invention, and FIGS. 15 (A) to 15 (D) are resistors shown in FIG. It is a schematic sectional drawing for demonstrating each predetermined process in the manufacturing flow of the element 20B. Hereinafter, with reference to FIGS. 14 and 15, the configuration of the composite electronic component 1B according to the present embodiment and the manufacturing flow of the resistance element 20B provided in the composite electronic component 1B will be described.

As shown in FIG. 14, the composite electronic component 1B includes a resistance element 20B having a configuration different from that of the resistance element 20A of the composite electronic component 1A according to the first embodiment. The bonding positions of the first and second bonding materials 31 and 32 with respect to the first and second upper surface conductors 24A and 24B provided on the resistance element 20B are different from those of the composite electronic component 1A.

Specifically, the first and second upper surface conductors 24A and 24B are composed of an underlying conductive layer 24a which is an Ag layer, a coated conductive layer 24b which is a Ni layer, and a coated conductive layer 24c which is an Au layer covering the coated conductive layer 24b. It is composed of a plurality of conductive layers. The upper surface of the underlying conductive layer 24a, which is an Ag layer, is not only covered with the coated conductive layers 24b and 24c, but the side surfaces 24a1 thereof are also covered with the coated conductive layers 24b and 24c. In FIG. 14, only the first upper surface conductor 24A is shown.

On the other hand, in each of the first and second upper surface conductors 24A and 24B, the coated conductive layers 24b and 24c covering the side surfaces 24a1 of the base conductive layer 24a which is the Ag layer are covered with the first and second bonding materials 31 and 32. Only the coated conductive layers 24b and 24c that cover the upper surface of the underlying conductive layer 24a are covered with the first and second bonding materials 31 and 32. FIG. 14 shows that the side surface 24a1 of the base conductive layer 24a of the first upper surface conductor 24A is covered only by the coated conductive layers 24b and 24c.

Even in this configuration, the side surface 24a1 of the underlying conductive layer 24a, which is an Ag layer, is covered with the coated conductive layers 24b and 24c as protective metal films containing no Ag and Cu. As in the case of 1, the decrease in the insulation resistance between the upper surface conductors can be suppressed.

Further, in the composite electronic component 1B according to the present embodiment, unlike the case of the above-described first embodiment, the sizes of the first and second upper surface conductors 24A and 24B are orthogonal to the height direction H. It is configured to be larger than the first and second external electrodes 14A and 14B in the direction of In the case of such a configuration, although the degree to which the above-mentioned self-alignment effect can be obtained is slightly reduced, the above-mentioned implementation can effectively suppress the decrease in the insulation resistance between the top conductors. An effect comparable to that of Form 1 can be obtained.

The resistance element 20B having the above configuration can be easily manufactured by, for example, the following manufacturing flow. The description of the manufacturing flow of the resistance element 20B is basically the same as the description of the manufacturing flow of the resistance element 20A described above, and in the following, the description will be given with particular attention to the differences.

As shown in FIG. 15A, first, conductive patterns 124a and 125a having a predetermined shape made of Ag paste are printed on the upper surface 121a and the lower surface 121b of the ceramic green sheet 121, respectively, and then the work-in-process is fired. .. After that, printing and printing of the resistor paste, trimming, application of a protective film, and curing treatment are sequentially performed.

Next, as shown in FIG. 15B, from the upper surface 121a'side and the lower surface 121b' side toward the predetermined position of the mother substrate 121'on which the base conductive layers 24a and 25a are formed, the mother substrate 121' Each laser beam is irradiated so as to reach it. As a result, a groove portion 129a having a substantially V-shaped cross section is formed on each of the upper surface 121a'side and the lower surface 121b' side of the mother substrate 121', and the underlying conductive layers 24a and 25a are separated by the groove portion 129a. It will be.

Next, as shown in FIG. 15 (C), a force is applied to the mother substrate 121'in which the groove portion 129a is formed along the arrow AR direction shown in the drawing, thereby cutting the mother substrate 121'. Is done. As a result, the mother substrate 121'is separated into individual pieces.

Next, as shown in FIG. 15 (D), the cut-out individual in-process products are plated, and the coated conductive layer 24b, which is a Ni layer as a plating layer so as to cover the underlying conductive layer 24a. The coated conductive layer 24c, which is an Au layer as a plating layer, is formed, and the coated conductive layer 25b, which is a Ni layer as a plating layer, and the coated conductive layer 25c, which is an Au layer as a plating layer, are formed so as to cover the underlying conductive layer 25a. Is formed. As a result, the first and second upper surface conductors 24A and 24B are formed in which the side surfaces 24a1 of the base conductive layer 24a are covered with the coated conductive layers 24b and 24c. With the above, the production of the resistance element 20B is completed.

Even if the plating layers are formed on the underlying conductive layers 24a and 24b after the groove portion 129a is formed on the mother substrate 121'and before the mother substrate 121' is cut and separated into individual pieces, the same configuration is obtained. The resistance element 20B is obtained.

(Embodiment 3)
16 is a schematic cross-sectional view of an enlarged main part of the composite electronic component 1C according to the third embodiment of the present invention, and FIGS. 17 (A) to 17 (D) are resistors shown in FIG. It is a schematic sectional drawing for demonstrating each predetermined process in the manufacturing flow of the element 20C. Hereinafter, with reference to FIGS. 16 and 17, the configuration of the composite electronic component 1C according to the present embodiment and the manufacturing flow of the resistance element 20C provided in the composite electronic component 1C will be described.

As shown in FIG. 16, in the composite electronic component 1C, the resistance element 20CA of the composite electronic component 1A according to the first embodiment includes a resistance element 20C having a different configuration.

Specifically, the first and second upper surface conductors 24A and 24B are composed of an underlying conductive layer 24a which is an Ag layer, a coated conductive layer 24b which is a Ni layer, and a coated conductive layer 24c which is an Au layer covering the coated conductive layer 24b. It is composed of a plurality of conductive layers. Only the upper surface of the underlying conductive layer 24a, which is an Ag layer, is covered with the coated conductive layers 24b and 24c, and the side surface 24a1 thereof is not covered with the coated conductive layers 24b and 24c. In FIG. 16, only the first upper surface conductor 24A is shown.

On the other hand, in each of the first and second upper surface conductors 24A and 24B, the side surface 24a1 of the base conductive layer 24a which is the Ag layer is covered with the first and second bonding materials 31 and 32. In FIG. 16, it is shown that the side surface 24a1 of the base conductive layer 24a of the first upper surface conductor 24A is covered with the first bonding material 31. The side surface 24a1 of the base conductive layer 24a overlaps with the first external electrode 14A when viewed from the height direction H, and is inclined with respect to the height direction H. Therefore, the side surfaces 24a1 of the base conductor layers 24a of the first and second upper surface conductors 24A and 24B are easily covered by the first and second bonding materials 31, 32, respectively.

The size of the resistance element 20A is not particularly limited, but as an example, the dimension L in the length direction is 0.60 [mm] and the dimension W in the width direction is 0.30. It is [mm], and the dimension of the height direction H is 0.14 [mm].

Even in this configuration, the first and second bonding materials 31 as protective metal films in which the side surfaces 24a1 of the base conductive layers 24a of the first and second upper surface conductors 24A and 24B contain almost no Ag and Cu, respectively. Since it is covered with the above-mentioned 32, it is possible to suppress a decrease in the insulation resistance between the upper surface conductors as in the case of the first embodiment described above.

The resistance element 20C having the above configuration can be easily manufactured by, for example, the following manufacturing flow. The description of the manufacturing flow of the resistance element 20C is basically the same as the description of the manufacturing flow of the resistance element 20A described above, and in the following, the description will be given with particular attention to the differences.

As shown in FIG. 17A, first, conductive patterns 124a and 125a having a predetermined shape made of Ag paste are printed on the upper surface 121a and the lower surface 121b of the ceramic green sheet 121, respectively, and then the work-in-process is fired. .. After that, printing and printing of the resistor paste, trimming, application of a protective film, and curing treatment are sequentially performed.

Next, as shown in FIG. 17B, the work-in-process products up to this point are plated, and the coated conductive layer 24b, which is a Ni layer as a plating layer, is plated so as to cover the underlying conductive layer 24a. The coated conductive layer 24c, which is an Au layer as a layer, is formed, and the coated conductive layer 25b, which is a Ni layer as a plating layer, and the coated conductive layer 25c, which is an Au layer as a plating layer, are formed so as to cover the underlying conductive layer 25a. Will be done.

Next, as shown in FIG. 17C, the upper surface 121a'sides toward a predetermined position of the mother substrate 121'in which the underlying conductive layers 24a and 25a and the coated conductive layers 24b, 24c, 25b and 25c are formed. Laser light is irradiated so as to reach the mother substrate 121'from the lower surface 121b'side. As a result, a groove portion 129b having a substantially V-shaped cross section is formed on each of the upper surface 121a'side and the lower surface 121b' side of the mother substrate 121', and the underlying conductive layers 24a and 25a and the coated conductive layers 24b and 24c are formed. , 25b, 25c will be separated by the groove portion 129b.

Next, as shown in FIG. 17 (D), a force is applied to the mother substrate 121'in which the groove portion 129b is formed along the arrow AR direction shown in the drawing, thereby cutting the mother substrate 121'. Is done. As a result, the mother substrate 121'is separated into pieces, and the side surfaces 24a1 of the base conductive layer 24a are exposed without being covered by the coated conductive layers 24b and 24c. 24B will be formed. With the above, the production of the resistance element 20C is completed.

(Embodiment 4)
FIG. 18 is a schematic cross-sectional view of an enlarged main part of the composite electronic component 1D according to the fourth embodiment of the present invention. Hereinafter, the composite electronic component 1D according to the present embodiment will be described with reference to FIG. 18.

As shown in FIG. 18, the composite electronic component 1D has a structure of the first and second upper surface conductors 24A and 24B different from the resistance element 20A of the composite electronic component 1A according to the first embodiment described above. It is equipped with. The material of the conductive layer constituting the first and second upper surface conductors 24A and 24B of the resistance element 20D is different from that of the composite electronic component 1A.

Specifically, the first and second upper surface conductors 24A and 24B are composed of a plurality of conductive layers including a base conductive layer 24a which is a Cu layer and a coated conductive layer 24b which is a Sn layer. In FIG. 18, only the first upper surface conductor 24A is shown. The base conductive layer 24a, which is a Cu layer, is composed of, for example, a sintered metal layer formed by baking Cu paste, and the coated conductive layer 24b, which is a Sn layer, is composed of, for example, a plating layer. The coated conductive layer 24b, which is a Sn layer, is integrated with the first and second bonding materials 31 and 32 by diffusing into the first and second bonding materials 31 and 32 when solder is used. do.

As a result, after the capacitor element 10 is mounted on the resistance element 20D, the upper surfaces of the base conductive layer 24a, which is the Cu layer of the first and second upper surface conductors 24A and 24B, are the first and second bonding materials, respectively. Not only is it covered by 31 and 32, but its side surfaces 24a1 are also covered by the first and second bonding materials 31, 32. In FIG. 18, it is shown that the side surface 24a1 of the base conductive layer 24a of the first upper surface conductor 24A is covered with the first bonding material 31.

Even in this configuration, the side surface 24a1 of the base conductive layer 24a, which is a Cu layer, is covered with the first and second bonding materials 31 and 32 as protective metal films containing almost no Ag and Cu. As in the case of the first embodiment described above, it is possible to suppress a decrease in the insulation resistance between the upper surface conductors.

(Embodiment 5)
FIG. 19 is a schematic cross-sectional view of an enlarged main part of the composite electronic component 1E according to the fifth embodiment of the present invention. Hereinafter, the composite electronic component 1E according to the present embodiment will be described with reference to FIG. 19.

As shown in FIG. 19, the composite electronic component 1E has a structure of the first and second upper surface conductors 24A and 24B different from the resistance element 20B of the composite electronic component 1B according to the second embodiment described above. It is equipped with. The material of the conductive layer constituting the first and second upper surface conductors 24A and 24B of the resistance element 20E is different from that of the composite electronic component 1B and is the same as that of the composite electronic component 1D according to the above-described fourth embodiment.

Specifically, the first and second upper surface conductors 24A and 24B are composed of a plurality of conductive layers including a base conductive layer 24a which is a Cu layer and a coated conductive layer 24b which is a Sn layer. In FIG. 19, only the first upper surface conductor 24A is shown. A part of the coated conductive layer 24b, which is a Sn layer, diffuses into the first and second bonding materials 31 and 32 when solder is used as the first and second bonding materials 31 and 32. Integrate with.

As a result, after the capacitor element 10 is mounted on the resistance element 20E, the upper surface of the base conductive layer 24a, which is the Cu layer of the first and second upper surface conductors 24A and 24B, is the first and second bonding materials 31. Not only is it covered by 32, but its side surfaces 24a1 are also covered by the coated conductive layer 24b. In FIG. 19, it is shown that the side surface 24a1 of the base conductive layer 24a of the first upper surface conductor 24A is covered with the coated conductive layer 24b.

Even in this configuration, the side surface 24a1 of the underlying conductive layer 24a, which is a Cu layer, is covered with the coated conductive layer 24b as a protective metal film containing no Ag and Cu. As in the case, it is possible to suppress a decrease in insulation resistance between the upper surface conductors.

(Embodiment 6)
FIG. 20 is a schematic cross-sectional view of an enlarged main part of the composite electronic component 1F according to the sixth embodiment of the present invention. Hereinafter, the composite electronic component 1F according to the present embodiment will be described with reference to FIG. 20.

As shown in FIG. 20, the composite electronic component 1F has a structure of the first and second upper surface conductors 24A and 24B different from the resistance element 20C of the composite electronic component 1C according to the third embodiment described above. It is equipped with. The material of the conductive layer constituting the first and second upper surface conductors 24A and 24B of the resistance element 20F is different from that of the composite electronic component 1C and is the same as that of the composite electronic component 1D according to the above-described fourth embodiment.

Specifically, the first and second upper surface conductors 24A and 24B are composed of a plurality of conductive layers including a base conductive layer 24a which is a Cu layer and a coated conductive layer 24b which is a Sn layer. In FIG. 20, only the first upper surface conductor 24A is shown. The coated conductive layer 24b, which is a Sn layer, is integrated with the first and second bonding materials 31 and 32 by diffusing into the first and second bonding materials 31 and 32 when solder is used. do.

As a result, after the capacitor element 10 is mounted on the resistance element 20F, the upper surfaces of the base conductive layer 24a, which is the Cu layer of the first and second upper surface conductors 24A and 24B, are the first and second bonding materials, respectively. Not only is it covered by 31 and 32, but its side surfaces 24a1 are also covered by the first and second bonding materials 31, 32. In FIG. 20, it is shown that the side surface 24a1 of the base conductive layer 24a of the first upper surface conductor 24A is covered with the first bonding material 31.

Further, as in the third embodiment, the side surface 24a1 of the base conductive layer 24a overlaps with the first external electrode 14A when viewed from the height direction H, and is inclined with respect to the height direction H. Therefore, the side surfaces 24a1 of the base conductor layers 24a of the first and second upper surface conductors 24A and 24B are easily covered by the first and second bonding materials 31, 32, respectively.

Even in this configuration, the side surface 24a1 of the base conductive layer 24a, which is a Cu layer, is covered with the first and second bonding materials 31 and 32 as protective metal films containing almost no Ag and Cu. As in the case of the third embodiment described above, it is possible to suppress a decrease in the insulation resistance between the upper surface conductors.

(Embodiment 7)
21 (A) and 21 (B) are schematic cross-sectional views of the composite electronic component 1G according to the seventh embodiment of the present invention, and FIGS. 22 (A) to 22 (C) are FIGS. 21. It is a schematic top view, sectional view and bottom view of the inductor element shown in. 21 (B) is a schematic cross-sectional view when the composite electronic component 1G according to the present embodiment is cut along the XXIB-XXIB line shown in FIG. 21 (A). 22 (B) is a schematic cross-sectional view when the composite electronic component 1G according to the present embodiment is cut along the line XXIIB-XXIIB shown in FIG. 21 (A). Hereinafter, the composite electronic component 1G according to the present embodiment will be described with reference to FIGS. 21 and 22.

As shown in FIG. 21, in the composite electronic component 1A, when compared with the composite electronic component 1A according to the first embodiment described above, the first electronic element, which is a substrate-type electronic element, is not a resistance element but an inductor. The difference is that the element is 20G.

As shown in FIGS. 21 and 22, the inductor element 20G includes an insulating base 21, an inductor wiring 28, first and second upper surface conductors 24A and 24B, and first to fourth lower surface conductors 25A to 25D. And the first to fourth via conductors 26A to 26D.

The inductor wiring 28 is formed as an embedded wiring inside the base 21, and has a spiral shape when viewed in a plan view from the height direction H. The outer peripheral end of the inductor wiring 28 is connected to the third via conductor 26C, and the inner peripheral end is connected to the fourth via conductor 26D. Further, the third and fourth via conductors 26C and 26D both extend from the inductor wiring 28 toward the lower surface 21b side of the base portion 21, and the third and fourth lower surface conductors 25C provided on the lower surface 21b of the base portion 21. , 25D, respectively. The inductor wiring 28 may include a plurality of inductor wiring layers laminated in the height direction H.

The configurations of the first and second upper surface conductors 24A and 24B, the first and second lower surface conductors 25A and 25B, and the first and second via conductors 26A and 26B are the same as those of the above-described first embodiment, and in particular, , The material of the conductive layer constituting the first and second upper surface conductors 24A and 24B, and the bonding structure of the first and second upper surface conductors 24A and 24B and the first and second bonding materials 31 and 32 are also carried out as described above. It is the same as the first form.

Therefore, even in such a configuration, it is possible to effectively suppress the occurrence of an electrical short circuit between the upper surface conductors, as in the case of the first embodiment described above.

In the above-described embodiments 1 to 7 of the present invention, the case where the underlying conductive layer is covered with the protective metal film over the entire side surface of the first and second upper surface conductors has been described as an example. The entire periphery of the side surface does not necessarily have to be covered with the protective metal film, and only a part thereof may be covered with the protective metal film. Even with this configuration, it is possible to suppress a decrease in insulation resistance between the top conductors.

Further, in the first to seventh embodiments of the present invention, the case where the LTCC substrate is used as the base of the first electronic element, which is a substrate type electronic element, has been illustrated and described. As described above, are the first and second upper surface conductors composed of a plurality of conductive layers composed of an Ag layer which is a base conductive layer, a Ni layer which is a coated conductive layer, and an Au layer which is a coated conductive layer? Alternatively, it is preferably composed of a plurality of conductive layers including a Cu layer which is a base conductive layer and a Sn layer which is a coated conductive layer. However, of course, the present invention is not limited to this, and the first and second upper surface conductors are composed of an Ag layer which is a base conductive layer, a Ni layer which is a coated conductive layer, and a Sn layer which is a coated conductive layer. It may be composed of a conductive layer or the like.

Further, when a glass epoxy substrate is used as the base of the first electronic element which is a substrate type electronic element, when an alumina substrate is used, when a silicon substrate is used, etc., the first and second upper surface conductors are used as the base conductor. It is preferably composed of a plurality of conductive layers including a Cu layer which is a layer and a Sn layer which is a coated conductive layer.

Further, these conductive layers are not limited to the above-mentioned sintered metal layer and plating layer, and may be a metal vapor deposition layer formed by a vapor deposition method, a sputter layer formed by a sputtering method, or the like.

In any case, when the Ag layer or Cu layer is used in consideration of sufficient conductivity as the base conductive layer, the electrical and mechanical connection reliability with the bonding material is taken into consideration. It is preferable that the material of the coated conductive layer and the material of the bonding material are selected. In that case, the side surface of the underlying conductive layer is covered with the protective conductive layer (coated conductive layer or bonding material), and the protection thereof is performed. The metal component having the maximum weight ratio contained in the metal film may be other than Ag and Cu. In this case, it is preferable that the metal component having the largest weight ratio contained in the protective metal film is any one of Sn, Ni, Au and Pb.

A known analysis method can be used to identify the metal component having the largest weight ratio contained in the protective metal film or the conductive layer. For example, wavelength dispersive X-rays attached to a scanning electron microscope (SEM) can be used. Elemental analysis using an analyzer (WDX) or the like can be used.

Further, in the above-described first to seventh embodiments of the present invention, when the stacking direction of the dielectric layer and the internal electrode layer constituting the capacitor body of the capacitor element is configured to match the height direction of the composite electronic component. Although the above description has been given as an example, it is naturally possible to configure the stacking direction so as to match the width direction of the composite electronic component.

Further, in the above-described embodiments 1 to 7 of the present invention, the case where a monolithic ceramic capacitor is used as the capacitor element to be incorporated in the composite electronic component has been described as an example. A type of capacitor element may be incorporated into a composite electronic component.

Further, in the above-described first to seventh embodiments of the present invention, the resistance element or the inductor element has been exemplified as the substrate type first electronic element, but the substrate type first electronic element is the thermistor element. , It may be another electronic element such as a piezoelectric element. Further, the second electronic element mounted on the first electronic element of the substrate type may be an electronic element other than the above-mentioned capacitor element.

Furthermore, the characteristic configurations shown in the above-described embodiments 1 to 7 of the present invention can naturally be combined with each other as long as they do not deviate from the gist of the present invention.

As described above, the above-described embodiment disclosed this time is an example in all respects and is not limiting. The technical scope of the present invention is defined by the scope of claims and includes all modifications within the meaning and scope equivalent to the description of the scope of claims.

1A to 1G composite electronic parts, 10 condenser elements, 11 condenser body, 11a bottom surface, 12 dielectric layer, 13 internal electrode layer, 14A first external electrode, 14B second external electrode, 14a base conductive layer, 14b, 14c coated conductive Layer, 20A to 20F resistance element, 20G inductor element, 21 base, 21a upper surface, 21b lower surface, 22 resistor, 23 protective film, 24A first upper surface conductor, 24B second upper surface conductor, 24C third upper surface conductor, 24D fourth Top conductor, 24a Underground conductive layer, 24a1 side surface, 24b, 24c Coated conductive layer, 25A 1st lower surface conductor, 25B 2nd lower surface conductor, 25C 3rd lower surface conductor, 25D 4th lower surface conductor, 25a Underground conductive layer, 25b, 25c Coated conductive layer, 26A 1st connecting conductor (1st via conductor), 26B 2nd connecting conductor (2nd via conductor), 26C 3rd connecting conductor (3rd via conductor), 26D 4th connecting conductor (4th via conductor) ), 28 inductor wiring, 31 1st joint material, 32 2nd joint material, 121 ceramic green sheet, 121a upper surface, 121b lower surface, 121'mother substrate, 121a'upper surface, 121b' lower surface, 122 conductor pattern, 124a, 125a , 126 Conductive pattern, 128 through holes, 129a, 129b Grooves.

Claims (12)

It is a composite electronic component consisting of a total of two electronic elements in which one electronic element is bonded to one substrate-type electronic element.
The first electronic element, which is the one substrate type electronic element, and
The second electronic element, which is the one electronic element, mounted on the first electronic element in the height direction, and the second electronic element.
A bonding material for joining the first electronic element and the second electronic element is provided.
The first electronic device has an insulating base having an upper surface intersecting in the height direction, a resistor provided on the upper surface of the base, and a top conductor provided on the upper surface of the base. death,
The second electronic device has a lower surface facing the upper surface of the base in the height direction, and includes an element body including a plurality of dielectric layers and a plurality of conductor layers laminated, and the lower surface of the element body. With terminal conductors provided at least in part of
The joining material joins at least a part of the upper surface conductor and at least a part of the terminal conductor.
The upper surface conductor contains a conductive layer containing Ag or Cu as the metal component having the largest weight ratio.
At least a part of the side surface of the conductive layer is covered with a protective metal film, and the surface is covered with a protective metal film.
The metal component having the largest weight ratio contained in the protective metal film is a metal other than Ag and Cu.
The size of the top conductor is smaller than the size of the terminal conductor in any direction orthogonal to the height direction.
The protective metal film is a coated conductive layer that covers the upper surface and the side surface of the conductive layer, which is included in the upper surface conductor.
A composite electronic component in which the protective metal film of a portion covering the side surface of the conductive layer is further covered by a part of the bonding material. The composite electronic component according to claim 1, wherein the protective metal film is a plating layer. It is a composite electronic component consisting of a total of two electronic elements in which one electronic element is bonded to one substrate-type electronic element.
The first electronic element, which is the one substrate type electronic element, and
The second electronic element, which is the one electronic element, mounted on the first electronic element in the height direction, and the second electronic element.
A bonding material for joining the first electronic element and the second electronic element is provided.
The first electronic device has an insulating base having an upper surface intersecting in the height direction, a resistor provided on the upper surface of the base, and an upper surface conductor provided on the upper surface of the base. death,
The second electronic device has a lower surface facing the upper surface of the base in the height direction, and includes an element body including a plurality of dielectric layers and a plurality of conductor layers laminated, and the lower surface of the element body. With terminal conductors provided at least in part of
The joining material joins at least a part of the upper surface conductor and at least a part of the terminal conductor.
The upper surface conductor contains a conductive layer containing Ag or Cu as the metal component having the largest weight ratio.
At least a part of the side surface of the conductive layer is covered with a protective metal film made of a part of the bonding material.
The metal component having the largest weight ratio contained in the protective metal film is a metal other than Ag and Cu.
A composite electronic component in which the size of the top conductor is smaller than the size of the terminal conductor in any direction orthogonal to the height direction. The composite electronic component according to any one of claims 1 to 3, wherein the metal component having the largest weight ratio contained in the protective metal film is any one of Sn, Ni, Au and Pb. The composite electronic component according to any one of claims 1 to 4, wherein the top conductor has a thickness of 5 [μm] or more. The third upper surface conductor is located between the first upper surface conductor and the second upper surface conductor separated from each other in the length direction orthogonal to the height direction, and the first upper surface conductor and the second upper surface conductor. Including conductors
The terminal conductor comprises a first terminal conductor and a second terminal conductor separated from each other in the length direction.
The first terminal conductor is joined to the first upper surface conductor by the joining material, and the first terminal conductor is joined to the first upper surface conductor.
The composite electronic component according to any one of claims 1 to 5, wherein the second terminal conductor is joined to the second upper surface conductor by the joining material. The first upper surface conductor is located between both ends of the first terminal conductor in the width direction orthogonal to the height direction and the length direction.
The second upper surface conductor is located between both ends of the second terminal conductor in the width direction.
Of the side surfaces of the first upper surface conductor, the side surfaces orthogonal to the width direction are covered with the protective metal film.
The composite electronic component according to claim 6, wherein of the side surfaces of the second upper surface conductor, the side surfaces orthogonal to the width direction are covered with the protective metal film. The composite electronic component according to claim 7, wherein the dimension of the base in the width direction is larger than the dimension of the second electronic element in the width direction. The first upper surface conductor is located between the outer end of the first terminal conductor and the outer end of the second terminal conductor in the length direction.
The second upper surface conductor is located between the outer end of the first terminal conductor and the outer end of the second terminal conductor in the length direction.
Of the side surfaces of the first upper surface conductor, the side surfaces orthogonal to the length direction are covered with the protective metal film.
The composite electronic component according to any one of claims 6 to 8, wherein the side surface of the second upper surface conductor orthogonal to the length direction is covered with the protective metal film. The composite electronic component according to claim 9, wherein the dimension of the base in the length direction is larger than the dimension of the second electronic element in the length direction. The composite electronic component according to any one of claims 6 to 10 , wherein the resistor is connected to the third upper surface conductor. The top surface conductor comprises a fourth top surface conductor located between the first top surface conductor and the second top surface conductor.
The composite electronic component according to claim 11, wherein the resistor is connected to the fourth upper surface conductor.

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