JP6988302B2 - Packing structure, semiconductor wafer packing method and transportation method - Google Patents

Description

The present invention relates to a packing structure, a packing method for a semiconductor wafer, and a transportation method.

When shipping and transporting semiconductor wafers such as silicon wafers manufactured by a wafer manufacturer, a plurality of semiconductor wafers are housed in a wafer storage container in parallel with each other, and this wafer storage container is used as a cushioning material to cushion the impact during transportation. It is housed inside the shipping container via the silicon wafer and transported to the shipping destination. Currently, in terms of environmental load and cost, used wafer storage containers and transportation containers are collected from the shipping destination and reused.

FIG. 1 is a diagram showing a conventional packaging structure used when transporting a semiconductor wafer. The packaging structure 100 shown in FIG. 1 includes a plurality of cushioning materials 21 to 23 arranged so as to sandwich a wafer accommodating container 30 accommodating a plurality of semiconductor wafers, and a container accommodating the plurality of cushioning materials 21 to 23. A transportation container 10 having a main body 11 and a lid 12 that is detachably fitted to the opening of the container main body 11 is provided. In each wafer accommodating container 30, a plurality of (for example, 25) semiconductor wafers are parallel to each other and the in-plane direction of the wafer is parallel to the vertical direction (that is, the semiconductor wafer is erected). Have been placed.

During the transportation of the semiconductor wafer, the transport container 10 is subjected to impacts from various external directions, and the semiconductor wafer housed in the wafer storage container 30 vibrates. In particular, the vibration component in the vertical direction is large, which causes the semiconductor wafer to rotate. Since the vertical vibration of the semiconductor wafer cannot be sufficiently suppressed by the cushioning materials 21 to 23, the cushioning material 23 and the bottom surface portion 11b of the container body 11 are provided so as to reduce the impact from the outside of the transportation container 10. A shock absorbing material 40 is arranged between them (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2011-16549

By the way, recently, in a device forming process of forming a semiconductor device on a manufactured semiconductor wafer, a minute resin (hereinafter, also referred to as “resin deposit”) adheres to the outer peripheral portion of the wafer, and is placed on a polishing cloth during the polishing process. It has been found that resin deposits may fall on the surface of the semiconductor wafer and cause scratches on the surface of the semiconductor wafer.

A possible cause for the resin deposits to adhere to the semiconductor wafer is the rubbing between the resin wafer holding portion for holding the semiconductor wafer and the semiconductor wafer, which is provided in the wafer accommodating container 30. That is, in the wafer accommodating container 30, each semiconductor wafer is inserted and held in a groove provided in the wafer holding portion. Therefore, when the semiconductor wafer is vibrated due to an external impact during transportation of the semiconductor wafer, the semiconductor wafer and the resin wafer holding portion are rubbed to generate resin deposits, which are adhered to the outer peripheral portion of the wafer. it is conceivable that.

Therefore, an object of the present invention is to provide a packing structure capable of preventing resin deposits from adhering to the outer peripheral portion of the semiconductor wafer when transporting the manufactured semiconductor wafer, and a packing method and transport method for the semiconductor wafer. To make a suggestion.

The gist structure of the present invention for solving the above problems is as follows.
(1) A plurality of cushioning materials arranged so as to sandwich a wafer accommodating container accommodating a plurality of semiconductor wafers, and a container body accommodating the plurality of cushioning materials and the opening of the container body are detachably fitted. In a packaging structure comprising a shipping container with a lid.
A packaging structure characterized in that a first shock absorbing material is arranged between the cushioning material and a side surface portion of the container body of the transportation container.

(2) The above-mentioned (1), wherein no gap is provided between the cushioning material and the first impact absorbing material, and between the first impact absorbing material and the side surface portion of the container body. Packing structure.

The packaging structure according to (1) or (2) above, wherein the cushioning material and the first impact absorbing material are fixed via a resin plate.

(4) The packaging structure according to any one of (1) to (3) above, wherein the resin panel is arranged on the surface of the first impact absorbing material on the side surface side of the container body.

(5) The packaging structure according to any one of (1) to (4) above, wherein the second shock absorbing material is arranged between the cushioning material and the bottom surface portion of the transportation container.

(6) The packaging structure according to any one of (1) to (5) above, wherein a third shock absorbing material is arranged between the cushioning material and the lid of the transportation container.

(7) In the above (6), there is no gap between the cushioning material and the third impact absorbing material, and between the third impact absorbing material and the lid of the transportation container. The packing structure described.

(8) The packaging structure according to any one of (1) to (7) above, wherein at least one of the side surface portions of the container body has a structure that opens outward.

(9) The packaging structure according to any one of (1) to (8) above, wherein the semiconductor wafer is a silicon wafer.

(10) A plurality of cushioning materials in a wafer accommodating step of accommodating a plurality of semiconductor wafers in a wafer accommodating container in parallel with each other and a state in which the in-plane direction of the semiconductor wafer is parallel to the vertical direction of the wafer accommodating container. In a method of packing a semiconductor wafer, which comprises a container accommodating process of sandwiching and accommodating the inside of a transport container.
A method for packing a semiconductor wafer, which comprises arranging a first shock absorbing material between the cushioning material and a side surface portion of a container main body of the transportation container in the container accommodating step.

(11) In the container accommodating step, no gap is provided between the cushioning material and the first impact absorbing material, and between the first impact absorbing material and the side surface portion of the container body. 10) The method for packing a semiconductor wafer according to 10).

(12) The method for packing a semiconductor wafer according to (10) or (11), wherein the cushioning material and the first impact absorbing material are fixed via a resin plate in the container accommodating step.

(13) The semiconductor according to any one of (10) to (12) above, wherein in the container accommodating step, a resin panel is arranged on the surface of the first impact absorbing material on the side surface side of the container body. Wafer packing method.

(14) The item according to any one of (10) to (13) above, wherein in the container accommodating step, a second shock absorbing material is arranged between the cushioning material and the bottom surface portion of the transportation container. How to pack semiconductor wafers.

(15) The item according to any one of (10) to (14) above, wherein in the container accommodating step, a third impact absorbing material is arranged between the cushioning material and the lid of the transportation container. How to pack semiconductor wafers.

(16) In the container accommodating step, no gap is provided between the cushioning material and the third impact absorbing material, and between the third impact absorbing material and the lid of the transport container. The method for packing a semiconductor wafer according to (15).

(17) The method for packing a semiconductor wafer according to any one of (10) to (16) above, wherein the semiconductor wafer is a silicon wafer.

(18) A packing step of packing a plurality of semiconductor wafers by the semiconductor wafer packing method according to any one of (10) to (17) above, and a packing step of packing a plurality of semiconductor wafers.
A transportation process for transporting the plurality of packed semiconductor wafers to a predetermined location,
A method for transporting a semiconductor wafer, which comprises.

According to the present invention, it is possible to prevent resin deposits from adhering to the outer peripheral portion of the semiconductor wafer when the manufactured semiconductor wafer is transported.

It is a figure which shows the conventional packing structure. It is a figure which shows the packing structure by this invention. It is a figure which shows the state that the resin deposit adheres to the outer peripheral part of a wafer by the vibration in the inward direction of the wafer surface of a semiconductor wafer. It is a figure which shows the side surface part of the container body which has the structure which opens to the outside. It is a figure which shows that the 1st shock absorbing material is arranged so that there is no void between the cushioning material and the side surface portion of a container body. It is a figure which shows that the cushioning material and the first impact absorbing material are fixed with a resin plate, and the resin panel is arranged on the surface of the 1st impact absorbing material on the side surface side of the container body. .. It is a figure which shows that the 2nd shock absorbing material is arranged between the cushioning material and the bottom surface part of a transport container. It is a figure which shows that the 3rd shock absorbing material is arranged between the cushioning material and the lid body of a transport container. It is a figure which shows that the 3rd shock absorbing material is provided between the cushioning material and the lid of a transport container so that there is no void. It is a flowchart of the packing method of the semiconductor wafer by this invention. It is a flowchart of the transport method of the semiconductor wafer by this invention. It is a figure which shows the component of the measured vibration acceleration in the wafer thickness direction. It is a figure which shows the vertical component of the measured vibration acceleration.

(Packing structure)
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 2 shows a packaging structure according to the present invention. In FIG. 2, the same components as those in FIG. 1 are designated by the same reference numerals. The packing structure 1 shown in FIG. 2 has a plurality of cushioning materials 21 to 23 arranged so as to sandwich a wafer accommodating container 30 accommodating a plurality of semiconductor wafers, and a container accommodating the plurality of cushioning materials 21 to 23. A transportation container 10 having a main body 11 and a lid 12 that is detachably fitted to the opening of the container main body 11 is provided. Here, the shock absorbing material 50 (first shock absorbing material) is arranged between the cushioning materials 21 to 23 and the side surface portion 11a of the container main body 11 in the transportation container 10.

The present inventor has diligently studied how to prevent resin deposits from adhering to the outer peripheral portion of the semiconductor wafer when the semiconductor wafer manufactured by the wafer manufacturer is transported to the shipping destination. As described above, the adhesion of the resin deposits to the semiconductor wafer in the device forming process causes the semiconductor wafer in the wafer accommodating container 30 to be impacted and vibrated during the transportation of the semiconductor wafer, resulting in the semiconductor wafer and the resin wafer. It is probable that the rubbing with the holding portion occurred.

In the conventional packaging structure 100 shown in FIG. 1, a shock absorbing material 40 is arranged between the cushioning material 23 and the bottom surface portion 11b of the container body 11 to suppress vertical vibration of the semiconductor wafer. Has already been taken. However, as a result of detailed investigation by the present inventor, the vibration involved in the generation of the resin deposits is not the vertical vibration of the semiconductor wafer, but is perpendicular to the in-plane direction of the wafer as schematically shown in FIG. It turned out that the vibration was in the correct direction, that is, in the wafer thickness direction.

That is, as shown in FIG. 3, when the semiconductor wafer W held in the groove 31a of the wafer holding portion 31 provided in the wafer accommodating container 30 vibrates in the wafer thickness direction, the semiconductor wafer W and the wafer holding portion 31 Sliding occurs between the wafers, and the resin deposit R adheres to the outer peripheral portion of the semiconductor wafer.

In the transportation container 10 in the packing structure 100 shown in FIG. 1, the cushioning materials 21 to 23 and the container main body are used from the viewpoint of workability in the work of accommodating the semiconductor wafer W at the wafer manufacturer and the work of taking out the wafer at the shipping destination. A gap (clearance) is provided between the side surface portion 11a and the side surface portion 11a.

However, in order to prevent the adhesion of the resin deposit R, the present inventor increases the size of the cushioning materials 21 to 23 and between the cushioning materials 21 to 23 and the side surface portion 11a of the container main body portion 11. I tried to configure it to eliminate the gap (clearance). However, the resin deposit R still adhered to the outer peripheral portion of the wafer.

Based on this result, the present inventor has diligently studied a method of suppressing the vibration in the wafer thickness direction to prevent the adhesion of the resin deposit R. As a result, it was found that it is extremely effective to arrange the shock absorbing material (first shock absorbing material) 50 between the cushioning materials 21 to 23 and the side surface portion 11a of the container main body 11, and the present invention has been made. It was completed.

As is clear from the above description, the present invention is characterized in that the first shock absorbing material 50 is arranged between the cushioning materials 21 to 23 and the side surface portion 11a of the container main body 11. Therefore, other configurations are not particularly limited, and conventionally known configurations can be used.

The container body 11 of the transportation container 10 can be configured by, for example, enclosing four plate materials made of polypropylene by sandwiching a columnar molded sheet made of polypropylene from above and below with sheets of the same material on a transportation pallet. Further, the lid 12 of the transportation container 10 can be configured by providing a groove for fitting a plate material made of polypropylene, for example, into the container body 11.

As shown in FIG. 4, it is preferable that at least one of the side surface portions 11a of the container body 11 has a structure that opens outward. As a result, it is possible to facilitate the work of accommodating the cushioning materials 21 to 23 in the container main body 11 at the wafer manufacturer and the work of taking out the cushioning materials 21 to 23 at the shipping destination. The configuration in which the side surface portion 11a opens outward is not particularly limited, and can be configured to open outward using, for example, a hinge.

The cushioning materials 21 to 23 are members for alleviating the impact on the wafer accommodating container 30, and thus the semiconductor wafer W. In the present specification, the "cushioning material" refers to a member having a property (elasticity) of accumulating an external force and repelling when compressed and having a function of a spring, and the first shock absorbing material 50 described later is. Clearly distinguished. As the cushioning materials 21 to 23, a member molded from a foam material having polyethylene, polystyrene or the like as a main raw material can be used. Since the cushioning material has a characteristic of dispersing the force when repelling, it is suitable for preventing damage to the object to be protected from local external input, but is not suitable for suppressing continuous vibration.

The first impact absorbing material 50 is a member that absorbs an impact in the thickness direction of the semiconductor wafer W. In the present specification, the "shock absorbing material" is a member having a property (viscosity) of low speed of returning to the bottom after being compressed and high vibration and shock absorbing performance, and having a function of a damper, which is described above. It is clearly distinguished from the cushioning materials 21-23. As the first impact absorbing material 50, a low-repulsion viscous body made of a resin such as polyurethane can be used.

Further, the thickness of the first impact absorbing material 50 is preferably 5 mm or more. Further, the volume of the first shock absorbing material 50, the area of the surface in contact with the side surface portion 11a, and the number of the first shock absorbing materials 50 are not particularly limited, and the size is appropriate so as to suppress the vibration of the semiconductor wafer. You only have to arrange an appropriate number of.

Further, the shape of the first shock absorbing material 50 is not particularly limited, and an appropriate shape such as a triangular prism shape, a quadrangular prism shape, or a cylinder shape can be used. Of these, a cylindrical shape is preferable because it deforms evenly when pressurized.

In such a packing structure 1, as shown in FIG. 5, between the cushioning materials 21 to 23 and the first impact absorbing material 50, and between the first impact absorbing material 50 and the side surface portion 11a of the container main body 11. It is preferable that no void (clearance) is provided. As a result, vibration of the semiconductor wafer W in the wafer thickness direction can be further suppressed.

Further, as shown in FIG. 6, it is preferable that the cushioning materials 21 to 23 (cushioning material 22 in the figure) and the first impact absorbing material 50 are fixed via the resin plate 60. As a result, vibration of the semiconductor wafer W in the wafer thickness direction can be further suppressed. It is preferable that the cushioning materials 21 to 23 and the first impact absorbing material 50 are fixed with an adhesive, and it is more preferable to fix them with bolts B as shown in FIG. This makes it possible to increase the durability against an impact from the outside.

As the resin plate 60, one made of fluororesin / peak, which is a super engineering resin, polycarbonate, which is an engineering resin, polypropylene, which is a general-purpose resin, or the like can be used. Above all, it is preferable to use one made of polycarbonate because of its high mechanical strength.

Further, as shown in FIG. 6, it is preferable that the resin panel 70 is arranged on the surface of the shock absorbing material 50 on the side surface portion 11a side of the container main body 11. Generally, since the friction coefficient of the surface of the resin panel 70 made of resin is small, the friction between the cushioning materials 21 to 23 and the side surface portion 11a of the container body 11 is reduced to reduce the friction between the cushioning materials 21 to 23 at the wafer manufacturer. Can be easily stored in the container body 11 and the cushioning materials 21 to 23 can be easily taken out at the shipping destination. Also in this resin panel, it is preferable that the cushioning materials 21 to 23 and the first shock absorbing material 50 are fixed with an adhesive. This makes it possible to increase the durability against an impact from the outside.

As the resin panel 70, one composed of fluororesin / peak, which is a super engineering resin, polycarbonate, which is an engineering resin, polypropylene, which is a general-purpose resin, or the like can be used. Above all, since the friction coefficient of the surface is small and the wear resistance is high, it is preferable to use one composed of peak.

Further, as shown in FIG. 7, it is preferable that the shock absorbing material (second shock absorbing material) 80 is arranged between the cushioning material 23 and the bottom surface portion 11b of the transportation container 10. As a result, vibration in the vertical direction can be suppressed as in the conventional packaging structure 100. The second impact absorbing material 80 can be made of the same material and shape as the first impact absorbing material 50.

Further, as shown in FIG. 8, it is preferable that the shock absorbing material (third shock absorbing material) 90 is arranged between the cushioning materials 21 to 23 and the lid 12 of the transportation container 10. This makes it possible to further suppress vertical vibration of the semiconductor wafer. The third impact absorbing material 90 can also be made of the same material and shape as the first impact absorbing material 50.

When arranging the third impact absorbing material 90, as shown in FIG. 9, between the cushioning material 21 and the third impact absorbing material 90, and between the third impact absorbing material 90 and the transportation container 10. It is preferable that no gap (clearance) is provided between the lid body 12 and the lid body 12. Thereby, the vibration in the vertical direction of the semiconductor wafer W can be further suppressed.

Further, the semiconductor wafer W to be packed in the packing structure according to the present invention is not particularly limited, and may be, for example, a silicon wafer. Further, the diameter of the semiconductor wafer W is not particularly limited, and may be 200 mm, 300 mm, 450 mm, or the like.

As the wafer accommodating container 30 for accommodating the semiconductor wafer W, a known appropriate container capable of holding a plurality of semiconductor wafers W so as not to come into contact with each other can be used. As such a container, for example, FOSB (Front Opening Shipping Box) is known (see, for example, Japanese Patent Application Laid-Open No. 2005-335888, Japanese Patent Application Laid-Open No. 2005-518318, and Japanese Patent Application Laid-Open No. 2014-527721). FOSB is standardized by SEMI standard M31.

A resin wafer holding portion 31 for holding the semiconductor wafer W is provided inside the wafer accommodating container 30, and the semiconductor wafer W is inserted into the groove 31a formed in the wafer holding portion 31 to insert the semiconductor wafer W. It is configured to hold W.

When the manufactured semiconductor wafer W is transported by the packaging structure 1 according to the present invention, the vibration of the semiconductor wafer W in the wafer thickness direction is suppressed, and the resin deposit R adheres to the outer peripheral portion of the semiconductor wafer W. Can be prevented from doing so.

(Packaging method for semiconductor wafers)
Next, a method for packing a semiconductor wafer according to the present invention will be described. FIG. 10 shows a flowchart of a method for packing a semiconductor wafer according to the present invention. The method for packing a semiconductor wafer according to the present invention includes a wafer accommodating step (step S1) in which a plurality of semiconductor wafers W are accommodated in parallel to each other in the wafer accommodating container 30, and the in-plane direction of the semiconductor wafer W in the wafer accommodating container 30. It is provided with a container accommodating step (step S2) of sandwiching the cushioning materials 21 to 23 in a state of being parallel to each other in the vertical direction and accommodating the inside of the transport container 10. Here, in the container accommodating step, the shock absorbing material (first shock absorbing material) 50 is arranged between the cushioning materials 21 to 23 and the side surface portion 11a of the container main body 11 of the transportation container 10. It is a feature.

First, in step S1, a plurality of semiconductor wafers W are accommodated in the wafer accommodating container 30 in parallel with each other (wafer accommodating step). In this wafer accommodating step, a plurality of (for example, 25) semiconductor wafers W manufactured by the wafer manufacturer are accommodated in the wafer accommodating container 30.

As described above, the semiconductor wafer W is not particularly limited, and can be, for example, a silicon wafer, and the diameter of the semiconductor wafer W is not particularly limited, and can be 200 mm, 300 mm, 450 mm, or the like.

Further, as the wafer accommodating container 30, a known appropriate container capable of holding a plurality of semiconductor wafers W so as not to come into contact with each other can be used, and for example, FOSB can be used as described above. The semiconductor wafer W is inserted into the groove 31a formed in the wafer holding portion 31 provided in the wafer accommodating container 30 and accommodated in the wafer accommodating container 30.

Next, in step S2, the wafer accommodating container 30 is accommodated inside the transport container 10 via the cushioning materials 21 to 23 in a state where the in-plane direction of the semiconductor wafer W is parallel to the vertical direction (container accommodating step). ). At that time, it is important to arrange the first shock absorbing material 50 between the cushioning materials 21 to 23 and the side surface portion 11a parallel to the in-plane direction of the semiconductor wafer W of the transportation container 10. Thereby, when the manufactured semiconductor wafer W is transported, the vibration of the semiconductor wafer W in the wafer thickness direction can be suppressed. As a result, it is possible to suppress the rubbing between the semiconductor wafer W and the wafer holding portion 31 in the wafer accommodating container 30 and prevent the resin deposit R from adhering to the outer peripheral portion of the semiconductor wafer W.

In this container accommodating step, no gap (clearance) is provided between the cushioning materials 21 to 23 and the first impact absorbing material 50, and between the first impact absorbing material 50 and the side surface portion 11a of the container main body 11. As described above, this is preferable.

Further, in the present container accommodating step, it is preferable that the cushioning materials 21 to 23 and the first shock absorbing material 50 are fixed via the resin plate 60, and the container in the transport container 10 of the cushioning materials 21 to 23. As described above, it is preferable to arrange the resin panel 70 on the surface of the main body 11 on the side surface portion 11a side.

Further, as described above, in the present container accommodating step, it is preferable to dispose the shock absorbing material (second shock absorbing material) 80 between the cushioning material 23 and the bottom surface portion 11b of the transportation container 10. be.

Furthermore, in the present container accommodating step, it is preferable to dispose the shock absorbing material (third shock absorbing material) 90 between the cushioning materials 21 to 23 and the lid 12 of the transport container 10, and the cushioning material 21. As described above, it is preferable not to provide a gap between the third shock absorbing material 90 and the third shock absorbing material 90 and the lid body 12.

By the semiconductor wafer packing method according to the present invention, when the manufactured semiconductor wafer W is transported, the vibration of the semiconductor wafer W in the wafer thickness direction is suppressed, and the resin deposit R is formed on the outer peripheral portion of the semiconductor wafer W. It can be prevented from adhering.

(Transportation method of semiconductor wafer)
Subsequently, a method for transporting a semiconductor wafer according to the present invention will be described. FIG. 11 shows a flowchart of a method for packing a semiconductor wafer according to the present invention. The method for transporting a semiconductor wafer according to the present invention includes a packing step (step S11) for packing a plurality of semiconductor wafers W by the above-described method for packing a semiconductor wafer according to the present invention, and a predetermined location for packing the plurality of semiconductor wafers W. It is characterized by comprising a transportation step (step S12) for transporting to.

The method for transporting semiconductor wafers according to the present invention is characterized in that, in the packing step of step S11, a plurality of semiconductor wafers W are packed by the above-described method for packing semiconductor wafers according to the present invention. As a result, it is possible to suppress vibration of the semiconductor wafer W in the wafer thickness direction and prevent resin deposits from adhering to the outer peripheral portion of the semiconductor wafer W. The packing step in step S11 includes a wafer accommodating step S1 in step S1 in FIG. 10 and a container accommodating step in step S2, and the description thereof will be omitted.

In step S12, the plurality of semiconductor wafers W packed in step S11 are transported to a predetermined place. This can be done, for example, by car.

In this way, when the manufactured semiconductor wafer W is transported by the semiconductor wafer transport method according to the present invention, the vibration of the semiconductor wafer W in the wafer thickness direction is suppressed, and the resin deposit R adheres to the outer peripheral portion of the semiconductor wafer W. Can be prevented from doing so.

Hereinafter, examples of the present invention will be described, but the present invention is not limited to the examples.

(Invention Example 1)
The manufactured semiconductor wafer W was packed according to the flowchart shown in FIG. Specifically, 300 silicon wafers having a diameter of 300 mm were prepared and housed in one FOSB every 25 wafers. Twelve FOSBs containing silicon wafers were packed as shown in FIG. Here, the cushioning materials 21 to 23 are made of foamed polyethylene, the main body of the transport container is made of polypropylene, and the lid 12 is also made of polypropylene. Further, the first impact absorbers 50 and 80 are made of polyurethane, and the size thereof is such that the diameter of the first impact absorber 50 is 65 mm and the thickness is 20 mm, and the diameter of the second impact absorber 80 is set. The thickness was 65 mm and the thickness was 30 mm. Then, four first shock absorbing materials 50 are arranged in each cushioning material between the side surface portions 11a of the container main body 11 and the cushioning materials 21 to 23 (FIG. 6) on the cushioning materials 21 to 23. A gap (clearance) of 1 cm was provided between the container body 11 and the side surface portion 11a of the container body 11. In addition, a total of 6 second shock absorbing materials 80 were arranged, one directly under the wafer accommodating container 30.

(Invention Example 2)
The manufactured semiconductor wafer W was packed in the same manner as in Invention Example 1. However, as shown in FIG. 5, no gap (clearance) was provided between the side surface portion 11a of the container body 11 and the first impact absorbing material 50. All other conditions are the same as in Invention Example 1.

(Invention Example 3)
The manufactured semiconductor wafer W was packed in the same manner as in Invention Example 2. However, a total of six third shock absorbing materials 90 were arranged between the lid 12 of the transport container 10 and the cushioning material 21, one on each directly above the wafer accommodating container 30. The diameter of the third shock absorber 90 was 65 mm, and the thickness was 20 mm. Further, no gap (clearance) was provided between the lid 12 and the third impact absorbing material 90, and between the third impact absorbing material 90 and the cushioning material 21. Other conditions are all the same as in Invention Example 2.

(Comparative Example 1)
The manufactured semiconductor wafer W was packed in the same manner as in Invention Example 1. However, the first impact absorbing material 50 and the second impact absorbing material 80 were not provided. Further, a gap (clearance) of 1 cm is provided between the side surface portion 11a of the container main body 11 and the cushioning materials 21 to 23. All other conditions are the same as in Invention Example 1.

(Comparative Example 2)
The manufactured semiconductor wafer W was packed in the same manner as in Comparative Example 1. However, no gap (clearance) was provided between the side surface portions 11a of the container body 11 and the cushioning materials 21 to 23. All other conditions are the same as in Comparative Example 1.

(Comparative Example 3)
The manufactured semiconductor wafer W was packed in the same manner as in Comparative Example 2. However, six second shock absorbing materials 80, which are the same as those in the first invention, are arranged between the bottom surface portion 11b of the container body 11 and the cushioning material 23. All other conditions are the same as in Comparative Example 2. Table 1 shows the packing conditions of Invention Examples 1 to 3 and Comparative Examples 1 to 3.

<Evaluation of vibration acceleration>
The vibration generated in the semiconductor wafer accommodated during the transportation of the wafer was evaluated with respect to Invention Examples 1 to 3 and Comparative Examples 1 to 3 prepared as described above. Specifically, the packaging structures of the examples of the invention and the comparative example were vibrated by a vibration tester, a vibration data logger was attached to one FOSB in the upper stage, and the vibration acceleration (G) was measured. Table 2 shows the vibration conditions. Further, FIG. 12 shows the components of the measured vibration acceleration in the wafer thickness direction. Further, with respect to Invention Example 3, Comparative Examples 1 and 3, the vertical component of the vibration acceleration is shown in FIG.

From the comparison between Comparative Example 1 and Comparative Example 2 in FIG. 12, vibration in the wafer thickness direction is suppressed by eliminating the gap (clearance) between the cushioning materials 21 to 23 and the side surface portion 11a of the container body 11. You can see that. Further, from the comparison between Comparative Example 2 and Comparative Example 3, it can be seen that the vibration suppression effect in the wafer thickness direction in both is about the same. Further, from the comparison between Comparative Example 3 and Invention Example 1, by arranging the first impact absorbing material 50 between the cushioning materials 21 to 23 and the side surface portion 11a of the container main body 11, the vibration in the wafer surface inward direction is obtained. Can be seen to be greatly reduced. Then, from the comparison between Invention Example 1 and Invention Example 2, by eliminating the gap (clearance) between the cushioning materials 21 to 23 and the side surface portion 11a of the container body 11, vibration in the wafer thickness direction is further suppressed. You can see that. Further, from the comparison between Invention Example 2 and Invention Example 3, a third shock absorbing material 90 is further arranged between the lid 12 of the transport container 10 and the cushioning material 21, thereby vibrating in the thickness direction of the wafer. Can be seen to be further suppressed.

From the comparison between Comparative Example 1 and Comparative Example 3 in FIG. 13, by arranging the second shock absorbing material 80 between the bottom surface portion 11b of the container main body 11 and the cushioning material 23, the silicon wafer is arranged in the vertical direction. It can be seen that the vibration is suppressed. Further, from the comparison between Comparative Example 3 and Invention Example 3, by further arranging the third impact absorbing material 90 between the lid 12 of the transport container 10 and the cushioning material 21, the vertical direction of the silicon wafer is obtained. It can be seen that the vibration of is further suppressed.

<Evaluation of the presence or absence of resin deposits>
With respect to Invention Examples 1 to 3 and Comparative Examples 1 to 3, it was evaluated whether or not the resin deposit R adhered after the vibration test. The results obtained are shown in Table 1. As is clear from Table 1, in the invention examples 1 to 3, the resin deposit R did not adhere to the outer peripheral portion of the silicon wafer, whereas in the comparative examples 1 to 3, it was attached to the outer peripheral portion of the silicon wafer. The resin deposit R adhered.

According to the present invention, when transporting a manufactured semiconductor wafer, vibration in the wafer thickness direction of the semiconductor wafer can be suppressed, and resin deposits can be suppressed from adhering to the outer peripheral portion of the semiconductor wafer. It is useful in the semiconductor wafer manufacturing industry.

1,100 Packing structure 10 Transport container 11 Container body 11a Side surface 11b Bottom surface 12 Lid 21 / 22,23 Cushioning material 30 Wafer storage container 31 Wafer holding unit 31a Groove 40, 50, 80, 90 Shock absorber 60 Resin plate 70 Resin panel B Bolt R Resin deposit W Semiconductor wafer

Claims (16)

A plurality of cushioning materials arranged so as to sandwich a wafer accommodating container accommodating a plurality of semiconductor wafers, a container body accommodating the plurality of cushioning materials, and a lid detachably fitted in an opening of the container body. In a packaging structure with a shipping container and
A first shock absorbing material is arranged between the cushioning material and the side surface portion of the container body in the shipping container.
A plurality of the first impact absorbing materials are arranged for each of the side surface portions of the container body.
Each of the plurality of first impact absorbers is fixed via the cushioning material and a separate resin plate.
An individual resin panel is fixed to the surface of each of the plurality of first impact absorbers on the side surface side of the container body.
The packaging structure is characterized in that the resin panel is directly fixed only to the first shock absorbing material. The packaging structure according to claim 1, wherein no gap is provided between the cushioning material and the first impact absorbing material, and between the first impact absorbing material and the side surface portion of the container body. .. The packaging structure according to claim 1 or 2, wherein the cushioning material has a vertically extending portion and a horizontally extending portion integrally molded. The packaging structure according to any one of claims 1 to 3, wherein a second shock absorbing material is arranged between the cushioning material and the bottom surface portion of the transportation container. The packaging structure according to any one of claims 1 to 4, wherein a third shock absorbing material is arranged between the cushioning material and the lid of the transportation container. The packaging structure according to claim 5, wherein no gap is provided between the cushioning material and the third impact absorbing material, and between the third impact absorbing material and the lid of the transportation container. body. The packaging structure according to any one of claims 1 to 6, wherein at least one of the side surface portions of the container body has a structure that opens outward. The packaging structure according to any one of claims 1 to 7, wherein the semiconductor wafer is a silicon wafer. A wafer accommodating process in which a plurality of semiconductor wafers are accommodated in parallel to each other in a wafer accommodating container, and the wafer accommodating container is sandwiched between a plurality of cushioning materials in a state where the in-plane direction of the semiconductor wafer is parallel to the vertical direction. In a method of packing a semiconductor wafer, which comprises a container accommodating step of accommodating the inside of a transport container.
In the container accommodating step, a first impact absorbing material is arranged between the cushioning material and the side surface portion of the container body of the transportation container.
In the container accommodating step, a plurality of the first impact absorbing materials are arranged for each of the side surface portions of the container body.
In the container accommodating step, the cushioning material and the first impact absorbing material are fixed via individual resin plates.
In the container accommodating step, an individual resin panel is fixed to the surface of the first impact absorber on the side surface side of the container body.
A method for packing a semiconductor wafer, which comprises directly fixing the resin panel only to the first impact absorbing material in the container accommodating step. The ninth aspect of the present invention, wherein in the container accommodating step, no gap is provided between the cushioning material and the first impact absorbing material, and between the first impact absorbing material and the side surface portion of the container body. How to pack semiconductor wafers. The method for packing a semiconductor wafer according to claim 9 or 10, wherein the cushioning material has a vertically extending portion and a horizontally extending portion integrally molded. The method for packing a semiconductor wafer according to any one of claims 9 to 11, wherein a second shock absorbing material is arranged between the cushioning material and the bottom surface portion of the transportation container in the container accommodating step. The method for packing a semiconductor wafer according to any one of claims 9 to 12, wherein a third shock absorbing material is arranged between the cushioning material and the lid of the transportation container in the container accommodating step. 13. The semiconductor wafer according to claim 13, wherein in the container accommodating step, no gap is provided between the cushioning material and the third shock absorbing material, and between the cushioning material and the lid of the transportation container. Packing method. The method for packing a semiconductor wafer according to any one of claims 9 to 14, wherein the semiconductor wafer is a silicon wafer. A packing step of packing a plurality of semiconductor wafers by the semiconductor wafer packing method according to any one of claims 9 to 15.
A transportation process for transporting the plurality of packed semiconductor wafers to a predetermined location,
A method for transporting a semiconductor wafer, which comprises.

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