JP6988428B2 - Manufacturing method of 3D model - Google Patents

Description

The present invention relates to a method for manufacturing a three-dimensional model.

Conventionally, various methods for manufacturing three-dimensional objects have been used. Among these, there is a method of manufacturing a three-dimensional model by forming a plurality of layers with the constituent materials of the three-dimensional model.
For example, Patent Document 1 describes a method of forming a plurality of layers using powder, which is a constituent material of a three-dimensional model, to produce a three-dimensional model, in which a layer of a high-density model is formed and a layer of a high-density model is formed. A method for manufacturing a three-dimensional model to form a three-dimensional model having a high-density portion and a low-density portion by solidifying the layer and then forming a layer of a low-density modeling portion and solidifying the layer. Is disclosed.

Japanese Unexamined Patent Publication No. 2010-65259

In the method for manufacturing a three-dimensional model disclosed in Patent Document 1, when a three-dimensional model having a high-density portion and a low-density portion is manufactured, solidification of the high-density portion and solidification of the low-density portion are performed. The manufacturing efficiency was not good because it was done separately. Therefore, it is preferable to solidify the high-density portion and the low-density portion together. However, when sintering is performed as solidification, when a three-dimensional model having a high-density portion and a low-density portion is collectively sintered using a conventional three-dimensional model manufacturing device, the high-density portion and the low-density portion are obtained. Due to the difference in shrinkage rate due to sintering, the three-dimensional model may be deformed due to batch sintering.

Therefore, an object of the present invention is to construct a three-dimensional model having a high-density portion and a low-density portion by batch sintering.

The method for manufacturing a three-dimensional model according to the first aspect of the present invention for solving the above problems is a method for manufacturing a three-dimensional model by laminating layers, and is the first method for manufacturing a three-dimensional model. A first layer forming step of forming the first layer of the layers using the first composition containing the powder and the binder, and the layer using the second composition containing the second powder and the binder. The second layer forming step of forming the second layer and the baking including the first layer and the second layer are heated to sintered the first powder and the second powder. It has a blotting step, and the filling rate of the first powder in the first composition is made larger than the filling rate of the second powder in the second composition, and the average of the first powder is increased. By making the particle size smaller than the average particle size of the second powder, the difference in shrinkage between the first layer and the second layer in the sintering step is reduced.

According to this aspect, the filling rate of the first powder in the first composition is made larger than the filling rate of the second powder in the second composition, and the average particle size of the first powder is set to the second powder. By making the particle size smaller than the average particle size of, the difference in shrinkage between the first layer and the second layer in the sintering step is reduced. In this way, by reducing the difference in shrinkage between the first layer and the second layer in the sintering process, a three-dimensional model having a high-density portion (first layer) and a low-density portion (second layer). Can be sintered all at once.

In the method for manufacturing a three-dimensional model according to the second aspect of the present invention, in the first aspect, the laminated body is formed with a cell structure portion composed of the second layer, and the inside of the cell structure portion is formed. It is characterized in that a pipe portion composed of the first layer is formed on the surface.

According to this aspect, in the laminated body, a cell structure portion composed of the second layer is formed, and a pipe portion composed of the first layer is formed inside the cell structure portion. That is, the cell structure portion is formed at a low density, so that the thermal conductivity is low, and the corresponding portion of the first layer on which the pipe portion is formed is formed at a high density, so that the thermal conductivity is high. Therefore, for example, by contacting the heat source with the corresponding portion of the first layer and allowing cooling water to flow through the pipe portion to cool the pipe portion, the laminated body can be formed into the cell structure portion (second layer). It can be used for high-performance heat sinks that can effectively suppress the transfer of heat from the corresponding part) to the surroundings.

In the method for producing a three-dimensional model according to a third aspect of the present invention, in the first aspect, the laminate has a base portion and a columnar portion extending from the base portion formed by the second layer, and the base portion thereof. The first layer is characterized in that a shape in which a part of the columnar portion is inserted from the opposite side into the inside of the columnar portion is formed.

According to this aspect, in the laminated body, a base portion and a columnar portion extending from the base portion are formed in the second layer, and a shape in which a part is inserted inside the columnar portion from the opposite side of the base portion is formed in the first layer. Will be done. That is, the base is formed at a low density to have a low thermal conductivity, and the opposite side of the base (the corresponding portion of the first layer) is formed at a high density to have a high thermal conductivity. A spatial portion is formed around the columnar portion of the region between the opposite side of the base. Therefore, for example, by contacting the heat source with the opposite side of the base (corresponding part of the first layer) and cooling the base with cooling water or the like, it is effective to transfer heat to the base side of the laminated body. High-performance loop by infiltrating the cooling water from the base, which is the corresponding part of the second layer, to the columnar part side, and evaporating the cooling water in the space around the columnar part to absorb the latent heat. -Can be used for heat pipes (LHP), etc.

In the method for manufacturing a three-dimensional model according to a fourth aspect of the present invention, in any one of the first to third aspects, the laminated body crosses the stacking direction of the layers and the stacking direction. It is characterized in that it is formed by changing the abundance ratio of the first layer and the second layer in at least one of the directions.

According to this aspect, the laminated body is formed by changing the abundance ratios of the first layer and the second layer in at least one of the laminating direction and the crossing direction. A gradient of thermal conductivity can be formed on the body.

The schematic block diagram which shows the structure of the manufacturing apparatus of the 3D model which concerns on one Embodiment of this invention. An enlarged view of part C shown in FIG. The schematic block diagram which shows the structure of the manufacturing apparatus of the 3D model which concerns on one Embodiment of this invention. An enlarged view of the C'part shown in FIG. The schematic perspective view of the head base which concerns on one Embodiment of this invention. The plan view which conceptually explains the relationship between the arrangement of the head unit which concerns on one Embodiment of this invention, and the formation form of a three-dimensional shaped object. The plan view which conceptually explains the relationship between the arrangement of the head unit which concerns on one Embodiment of this invention, and the formation form of a three-dimensional shaped object. The plan view which conceptually explains the relationship between the arrangement of the head unit which concerns on one Embodiment of this invention, and the formation form of a three-dimensional shaped object. Schematic diagram conceptually explaining the formation form of a three-dimensional model. Schematic diagram conceptually explaining the formation form of a three-dimensional model. The schematic diagram which shows the example of the other arrangement of the head unit arranged in the head base. The schematic diagram which shows the example of the other arrangement of the head unit arranged in the head base. The flowchart of the manufacturing method of the 3D model which concerns on one Example of this invention. FIG. 6 is a schematic cross-sectional view showing a heat sink formed by using the three-dimensional model manufacturing apparatus according to the embodiment of the present invention. FIG. 6 is a schematic cross-sectional view showing a loop heat pipe formed by using a three-dimensional model manufacturing apparatus according to an embodiment of the present invention.

Hereinafter, embodiments according to the present invention will be described with reference to the drawings.
1 to 4 are schematic configuration diagrams showing a configuration of a three-dimensional model manufacturing apparatus according to an embodiment of the present invention.
Here, the three-dimensional model manufacturing apparatus of the present embodiment includes two types of material supply units (head bases). Of these, FIGS. 1 and 2 are views showing only one material supply unit (material supply unit that supplies the first composition containing the first powder and the binder). 3 and 4 are views showing only another material supply unit (a material supply unit that supplies a second composition containing a second powder and a binder).
In addition, "three-dimensional modeling" in the present specification indicates that a so-called three-dimensional model is formed, and for example, a flat plate shape, that is, a shape having a thickness even if it is a so-called two-dimensional shape. It also includes forming. Further, "supporting" means not only the case of supporting from the lower side, but also the case of supporting from the side side and, in some cases, the case of supporting from the upper side.
In addition, both the first composition and the second composition of this example are three-dimensional modeling pastes (fluidity) containing powder particles constituting the three-dimensional model, a solvent, and a binder soluble in the solvent. Material). The first composition corresponds to the constituent material forming the high-density portion of the laminated body of the three-dimensional model, and the second composition corresponds to the constituent material forming the low-density portion of the laminated body of the three-dimensional model. do. However, the present invention is not limited to the constituent materials of such a three-dimensional model, and the first composition and the second composition are solids such as filaments and pellets at room temperature, and become in a fluid state when heated. A compound or the like may be used.

The three-dimensional model manufacturing apparatus 2000 (hereinafter referred to as the forming apparatus 2000) shown in FIGS. 1 and 3 has X, Y, illustrated by the base 110 and the drive device 111 as a drive means provided in the base 110. It is equipped with a stage 120 that can be moved in the Z direction or driven in the rotation direction about the Z axis.
Then, as shown in FIGS. 1 and 2, one end is fixed to the base 110, and the head unit 1400 provided with the first composition discharge portion 1230 for discharging the first composition to the other end. It is provided with a head base support portion 130 to which a head base 1100 for holding a plurality of head bases 1100 is held and fixed.
Further, as shown in FIGS. 3 and 4, a head unit 1900 is provided with a second composition discharging portion 1730 in which one end is fixed to the base 110 and the second composition is discharged to the other end. A head base support portion 730 and a head base support portion 730 for holding and fixing a head base 1600 for holding a plurality of head bases 1600 are provided.
Here, the head base 1100 and the head base 1600 are provided in parallel on the XY plane.
The first composition discharge unit 1230 and the second composition discharge unit 1730 have the same configuration. However, it is not limited to such a configuration.

Layers 501, 502, and 503 are formed on the stage 120 in the process of forming the three-dimensional model 500 (stacked body of the three-dimensional model). In order to form the three-dimensional model 500, heat energy may be irradiated by an electromagnetic wave irradiation unit or the like. In such a configuration, in order to protect the stage 120 from the heat, the three-dimensional model 500 may be formed on the sample plate 121 by using the sample plate 121 having heat resistance. The sample plate 121 of the present embodiment is made of metal, which is sturdy and easy to manufacture. However, by using, for example, a ceramic plate as the sample plate 121, high heat resistance can be obtained, and the constituent materials (first composition and second composition) of the three-dimensional model 500 to be degreased and sintered. The reactivity with the composition) is also low, and deterioration of the three-dimensional model 500 can be prevented. Although the three layers 501, 502, and 503 are exemplified in FIGS. 1 and 3 for convenience of explanation, they are laminated up to the desired shape of the three-dimensional model 500 (up to the layer 50n in FIGS. 1 and 3). Will be done.
Here, the layers 501, 502, 503, ... 50n are the first layer 310 formed of the first composition discharged from the first composition discharge unit 1230 and the second composition discharge unit 1730, respectively. It is composed of a second layer 300 formed of the second composition discharged from.

Further, FIG. 2 is an enlarged conceptual diagram of part C showing the head base 1100 shown in FIG. As shown in FIG. 2, the head base 1100 holds a plurality of head units 1400. Although the details will be described later, one head unit 1400 is configured by holding the first composition discharge unit 1230 provided in the first composition supply device 1200 by the holding jig 1400a. The first composition discharge unit 1230 includes a discharge nozzle 1230a and a discharge drive unit 1230b for discharging the first composition from the discharge nozzle 1230a by the material supply controller 1500.

FIG. 4 is an enlarged conceptual diagram of a C'section showing the head base 1600 shown in FIG. As shown in FIG. 4, the head base 1600 holds a plurality of head units 1900. The head unit 1900 is configured by holding the second composition discharge unit 1730 provided in the second composition supply device 1700 by the holding jig 1900a. The second composition discharge unit 1730 includes a discharge nozzle 1730a and a discharge drive unit 1730b for discharging the second composition from the discharge nozzle 1730a by the material supply controller 1500.

As shown in FIGS. 1 and 2, the first composition discharge unit 1230 contains the first composition corresponding to each of the head units 1400 held in the head base 1100, and is housed in the first composition supply unit 1210. Is connected by a supply tube 1220. Then, the predetermined first composition is supplied from the first composition supply unit 1210 to the first composition discharge unit 1230. In the first composition supply unit 1210, the first composition, which is a constituent material of the high-density portion of the three-dimensional model 500 formed by the forming apparatus 2000 according to the present embodiment, is housed in the first composition accommodating portion 1210a. The individual first composition accommodating section 1210a is connected to the individual first composition discharging section 1230 by the supply tube 1220. As described above, by providing the individual first composition accommodating portions 1210a, a plurality of different types of first compositions can be supplied from the head base 1100.

As shown in FIGS. 3 and 4, the second composition discharge unit 1730 is a second composition supply unit 1710 containing the second composition corresponding to each of the head units 1900 held in the head base 1600. Is connected by a supply tube 1720. Then, the predetermined second composition is supplied from the second composition supply unit 1710 to the second composition discharge unit 1730. In the second composition supply unit 1710, the second composition, which is a constituent material of the low-density portion of the three-dimensional model 500 formed by the forming apparatus 2000 according to the present embodiment, is housed in the second composition accommodating portion 1710a. The individual second composition accommodating section 1710a is connected to the individual second composition ejection section 1730 by the supply tube 1720. As described above, by providing the individual second composition accommodating portions 1710a, a plurality of different types of second compositions can be supplied from the head base 1600.
The details of the three-dimensional modeling paste as the constituent materials (first composition and second composition) used in the forming apparatus 2000 of this embodiment will be described later.

The forming apparatus 2000 includes the first stage 120 and the first composition supplying apparatus 1200 described above based on the modeling data of the three-dimensional modeled object 500 output from a data output device such as a personal computer (not shown). It includes a composition discharge unit 1230 and a control unit 400 as a control means for controlling the second composition discharge unit 1730 provided in the second composition supply device 1700. Then, the control unit 400 controls the stage 120 and the first composition discharge unit 1230 to be driven and operated in cooperation with each other, and controls the stage 120 and the second composition discharge unit 1730 to be driven and operated in cooperation with each other. It also serves as a control unit.

The stage 120 movably provided on the base 110 is a signal that controls the movement start and stop, the movement direction, the movement amount, the movement speed, etc. of the stage 120 in the stage controller 410 based on the control signal from the control unit 400. Is generated and sent to the drive device 111 provided in the base 110, and the stage 120 moves in the X, Y, and Z directions shown in the figure. In the first composition discharge unit 1230 provided in the head unit 1400, the material is discharged from the discharge nozzle 1230a in the discharge drive unit 1230b provided in the first composition discharge unit 1230 in the material supply controller 1500 based on the control signal from the control unit 400. A signal for controlling the amount and the like is generated, and a predetermined amount of the first composition is discharged from the discharge nozzle 1230a by the generated signal.
Similarly, in the second composition discharge unit 1730 provided in the head unit 1900, based on the control signal from the control unit 400, from the discharge nozzle 1730a in the discharge drive unit 1730b provided in the second composition discharge unit 1730 in the material supply controller 1500. A signal for controlling the material discharge amount and the like is generated, and a predetermined amount of the second composition is discharged from the discharge nozzle 1730a by the generated signal.

Next, the head unit 1400 will be described in more detail. The head unit 1900 has the same configuration as the head unit 1400. Therefore, a detailed description of the configuration of the head unit 1900 will be omitted.
5 and 6 to 8 show an example of a holding form of the head unit 1400 and the first composition discharging unit 1230 held in a plurality of head bases 1100, of which FIGS. 6 to 8 are shown in FIG. It is an external view of the head base 1100 from the direction of arrow D shown by.

As shown in FIG. 5, a plurality of head units 1400 are held on the head base 1100 by fixing means (not shown). Further, as shown in FIGS. 6 to 8, in the head base 1100 of the forming apparatus 2000 according to the present embodiment, the head unit 1401 in the first row, the head unit 1402 in the second row, and the second row from the lower part of the figure. The head unit 1403 in the third row and the head unit 1404 in the fourth row are provided with head units 1400 in which four units are arranged in a staggered manner (alternately). Then, as shown in FIG. 6, the constituent material (first composition) is discharged from each head unit 1400 while the stage 120 is moved in the X direction with respect to the head base 1100, and the constituent layer constituent unit 50 (configuration). Layer constituents 50a, 50b, 50c and 50d) are formed. The procedure for forming the constituent layer constituent portion 50 will be described later. Here, the layer of the constituent layer component 50 formed by being discharged from the first composition discharge unit 1230 corresponds to the first layer 310 (see FIG. 1) and is formed by being discharged from the second composition discharge unit 1730. The layer of the constituent layer component 50 is corresponding to the second layer 300 (see FIG. 3).
Although not shown, the first composition discharge unit 1230 provided in each of the head units 1401 to 1404 is configured to be connected to the first composition supply unit 1210 via a discharge drive unit 1230b by a supply tube 1220. ..

As shown in FIG. 5, the first composition discharge unit 1230 is directed from the discharge nozzle 1230a onto the sample plate 121 placed on the stage 120, and is a constituent material (paste-like fluid material) of the three-dimensional model 500. ) Is discharged. The head unit 1401 exemplifies a discharge form in which the material M is discharged in the form of droplets, and the head unit 1402 exemplifies a discharge form in which the material M is supplied in the form of a continuous body. The ejection form of the material M may be either a droplet form or a continuous form, but in the present embodiment, the material M will be described by the form of being ejected in the form of droplets.

The material M discharged in the form of droplets from the discharge nozzle 1230a flies in the substantially gravitational direction and lands on the sample plate 121. The stage 120 moves, and the constituent layer constituent portion 50 is formed by the landed material M. The aggregate of the constituent layers 50 is formed as the first layer 310 (see FIG. 1) of the three-dimensional model 500 formed on the sample plate 121.

Next, the procedure for forming the constituent layer constituent portion 50 will be described with reference to FIGS. 6 to 8 and FIGS. 9 and 10.
6 to 8 are plan views conceptually explaining the relationship between the arrangement of the head unit 1400 of the present embodiment and the formation form of the constituent layer constituent unit 50. 9 and 10 are side views conceptually showing the formation form of the constituent layer constituent portion 50.

First, when the stage 120 moves in the + X direction, the material M is ejected in the form of droplets from the plurality of ejection nozzles 1230a, the material M is arranged at a predetermined position on the sample plate 121, and the constituent layer constituent portion 50 is formed. ..
More specifically, first, as shown in FIG. 9, the material M is arranged at a predetermined position of the sample plate 121 from the plurality of ejection nozzles 1230a while moving the stage 120 in the + X direction. ..

Next, as shown in FIG. 10, while moving the stage 120 in the −X direction, the material M is newly arranged so as to fill the space between the materials M arranged at regular intervals.
However, while moving the stage 120 in the + X direction, the material M is arranged so as to overlap the predetermined positions of the sample plate 121 from the plurality of ejection nozzles 1230a (so as not to leave a gap) (in the X direction of the stage 120). Instead of forming the constituent layer constituent portion 50 by reciprocating movement, the constituent layer constituent portion 50 may be formed only by moving one side of the stage 120 in the X direction).

By forming the constituent layer constituent portion 50 as described above, one line of each head unit 1401, 1402, 1403 and 1404 in the X direction (the first line in the Y direction) as shown in FIG. The constituent layer constituent portions 50 (constituent layer constituent portions 50a, 50b, 50c and 50d) are formed.

Next, in order to form the second line constituent layer constituents 50'(constituent layer constituents 50a', 50b', 50c' and 50d') in the Y direction of each head unit 1401, 1402, 1403 and 1404,- The head base 1100 is moved in the Y direction. Assuming that the pitch between the nozzles is P, the movement amount is moved in the −Y direction by the P / n (n is a natural number) pitch. In this embodiment, n will be described as 3.
By performing the same operation as described above as shown in FIGS. 9 and 10, the second line constituent layer constituent unit 50'(constituent layer constituent portion 50a) in the Y direction as shown in FIG. 7 is performed. ', 50b', 50c' and 50d') are formed.

Next, the constituent layer constituent unit 50'' of the third line in the Y direction of each head unit 1401, 1402, 1403 and 1404.
The head base 1100 is moved in the −Y direction in order to form (constituent layer constituent portions 50a ″, 50b ″, 50c ″ and 50d ″). The movement amount is moved in the −Y direction by P / 3 pitch.
Then, by performing the same operation as described above as shown in FIGS. 9 and 10, the third line constituent layer constituent portion 50 in the Y direction as shown in FIG. 8''.
(Constructive layer constituent parts 50a'', 50b'', 50c'' and 50d'') are formed, and the first layer 310 can be obtained.

Further, the material M discharged from the first composition discharge unit 1230 is discharged from any one unit of the head units 1401, 1402, 1403 and 1404, or two or more units to supply a first composition different from the other head units. You can also do it. Therefore, by using the forming apparatus 2000 according to the present embodiment, it is possible to obtain a three-dimensional model formed from different materials.

In the first layer 501, before or after forming the first layer 310 as described above, the second composition is discharged from the second composition discharge unit 1730, and the second composition is discharged in the same manner. The layer 300 can be formed. Then, when the layers 502, 503, ... 50n are laminated on the layer 501, the first layer 310 and the second layer 300 can be formed in the same manner. However, at least one of layers 501, 502, 503, ... 50n may be formed by only one of the first layer 310 and the second layer 300.

The number and arrangement of the head units 1400 and 1900 included in the forming apparatus 2000 according to the above-described embodiment is not limited to the above-mentioned number and arrangement. 11 and 12 schematically show an example of another arrangement of the head unit 1400 arranged on the head base 1100 as an example.

FIG. 11 shows a form in which a plurality of head units 1400 are arranged in parallel on the head base 1100 in the X-axis direction. FIG. 12 shows a form in which the head units 1400 are arranged in a grid pattern on the head base 1100. The number of head units arranged in each case is not limited to the illustrated example.

Next, each of the first composition and the second composition of this example for three-dimensional modeling will be described in detail.
Examples of the first composition and the second composition include magnesium (Mg), iron (Fe), cobalt (Co), chromium (Cr), aluminum (Al), titanium (Ti), copper (Cu), and nickel (C). A single powder of Ni) or a mixed powder such as an alloy containing one or more of these metals (malaging steel, stainless steel, cobalt-chromium molybdenum, titanium alloy, nickel alloy, aluminum alloy, cobalt alloy, cobalt-chromium alloy), etc. It is contained as the powder of No. 1 and the powder of the second, and can be used as a paste-like mixed material containing a solvent and a binder.
As described above, the first composition and the second composition are not particularly limited, and as the first powder and the second powder, metals other than the above metals, ceramics, and the like can also be used. Further, silicon dioxide, titanium dioxide, aluminum oxide, zirconium oxide and the like can be preferably used.

Examples of the solvent include water; (poly) alkylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, and propylene glycol monoethyl ether; ethyl acetate, n-propyl acetate, and acetate. Acetate esters such as iso-propyl, n-butyl acetate, iso-butyl acetate; aromatic hydrocarbons such as benzene, toluene and xylene; methyl ethyl ketone, acetone, methyl isobutyl ketone, ethyl-n-butyl ketone, diisopropyl ketone, acetyl acetone Ketones such as; alcohols such as ethanol, propanol and butanol; tetraalkylammonium acetates; sulfoxide solvents such as dimethyl sulfoxide and diethyl sulfoxide; pyridine solvents such as pyridine, γ-picolin and 2,6-lutidine; tetra Examples thereof include ionic liquids such as alkylammonium acetate (for example, tetrabutylammonium acetate), and one or a combination of two or more selected from these can be used.
As the binder, for example, acrylic resin, epoxy resin, silicone resin, cellulose resin or other synthetic resin or PLA (polylactic acid), PA (polyamide), PPS (polyphenylene sulfide) or other thermoplastic resin may be used. can.

Next, an example of a method for manufacturing a three-dimensional model using the forming apparatus 2000 will be described with reference to a flowchart.
Here, FIG. 13 is a flowchart of a method for manufacturing a three-dimensional model according to the present embodiment.

As shown in FIG. 13, in the method for manufacturing a three-dimensional model of the present embodiment, first, in step S110, the data of the three-dimensional model 500 is acquired. Specifically, for example, data representing the shape of the three-dimensional model 500 is acquired from an application program executed on a personal computer or the like.

Next, in step S120, data for each layer is created (generated) under the control of the control unit 400. Specifically, in the data representing the shape of the three-dimensional model 500, slices are made according to the modeling resolution in the Z direction, and bitmap data (cross-section data) is generated for each section.

Next, in the first layer forming step of step S130, the first composition is discharged from the first composition discharge unit 1230 based on the cross-sectional data generated in step S120 under the control of the control unit 400, and the cross-sectional data is obtained. The constituent layer constituent unit 50 (first layer 310) based on the above is formed.

Next, in the second layer forming step of step S140, the second composition is discharged from the second composition discharge unit 1730 based on the cross-sectional data generated in step S120 under the control of the control unit 400, and the cross-sectional data is obtained. The constituent layer constituent unit 50 (second layer 300) based on the above is formed.
The order of the first layer forming step of step S130 and the second layer forming step of step S140 may be reversed.

Then, in step S150, from step S130 to step S150 until the modeling of the laminated body of the three-dimensional model 500 based on the bitmap data corresponding to each layer generated in step S120 is completed under the control of the control unit 400. Repeated.

Then, by the sintering step of step S160, for example, in a constant temperature bath (not shown), the laminated body of the three-dimensional model 500 formed in the above step is heated, and the first powder and the second composition in the first composition are heated. Sintering of the second powder in the object is performed. Before the sintering step of this step, a degreasing step of degreasing the laminated body of the three-dimensional model 500 formed in the above step may be provided.
Then, with the end of step S160, the method for manufacturing the three-dimensional model of the present embodiment is completed.

As described above, the method for manufacturing the three-dimensional model of the present embodiment is a method for manufacturing the three-dimensional model 500 by laminating layers 501, 502, 503, ... 50n. The first layer forming step (step S130) of forming the first layer 310 of the layers 501, 502, 503, ... 50n by using the first composition containing the first powder and the binder. The second layer forming step (step S140) of forming the second layer 300 of the layers 501, 502, 503, ... 50n using the second composition containing the second powder and the binder, and the first step. It has a sintering step (step S150) of heating a laminate including the first layer 310 and the second layer 300 to sinter the first powder and the second powder.
Further, in the method for producing the three-dimensional model of the present embodiment, the filling rate of the first powder in the first composition is made larger than the filling rate of the second powder in the second composition, and the first By making the average particle size of the powder of No. 1 smaller than the average particle size of the second powder, the difference in shrinkage between the first layer 310 and the second layer 300 in the sintering step of step S150 is reduced. .. Specifically, the user selects the first powder and the second powder so that the average particle size of the first powder is smaller than the average particle size of the second powder, and the first in the first composition. The compositions of the first composition and the second composition are adjusted so that the filling rate of the powder of 1 is larger than the filling rate of the second powder in the second composition.
The filling rate of the first powder in the first composition is larger than the filling rate of the second powder in the second composition, and the average particle size of the first powder is larger than the average particle size of the second powder. By making it smaller, it is possible to reduce the difference in shrinkage between the first layer 310 and the second layer 300 in the sintering process. This is because the smaller the packing rate of the particles of the constituent material of the three-dimensional model 500, the more the other components tend to shrink due to the elimination of other components due to sintering, but by using particles with a large particle size, the particles tend to shrink significantly. This is because the degree of shrinkage can be reduced (the number of pores increases accordingly). Then, by reducing the difference in shrinkage between the first layer 310 and the second layer 300 in the sintering step, a three-dimensional structure having a high-density portion (first layer 310) and a low-density portion (second layer 300) is provided. It is possible to batch-sinter the modeled object 500. Here, the "filling rate" means the volume of the powder with respect to the total volume. For example, the filling factor of the first powder in the first composition is the volume of the powder (first powder) with respect to the volume of the entire first composition (binder, solvent, first powder, etc.).

Next, a specific example of the three-dimensional model 500 formed by the forming device 2000 (the method for manufacturing the three-dimensional model) will be described.
Here, FIG. 14 is a schematic cross-sectional view showing a heat sink formed by the forming apparatus 2000 (the method for manufacturing the three-dimensional model). Further, FIG. 15 is a schematic cross-sectional view showing a loop heat pipe formed by the forming apparatus 2000 (the method for manufacturing the three-dimensional model).

[Example 1]
As the first composition, a paste containing a binder and a solvent, _{the average particle size (d50) of Al 2} O ₃ which is the first powder is 0.3 μm, and the filling rate of the first powder is 50%. I prepared it. _{The filling factor of the first powder is the volume of the powder (Al 2} O ₃ which is the first powder) with respect to the volume of the entire first composition (binder, solvent, Al ₂ O ₃ which is the first powder). It is a volume. Further, as the second composition, _{a paste having an average particle size (d50) of Al 2} O ₃ as the second powder of 3 μm and a filling factor of the second powder of 39% was prepared. _{The filling factor of the second powder is the volume of the powder (Al 2} O ₃ which is the second powder) with respect to the volume of the entire second composition (binder, solvent, Al ₂ O ₃ which is the second powder). It is a volume. Then, using the first composition and the second composition, the three-dimensional model 500 (heat sink) shown in FIG. 14 was formed by the forming apparatus 2000 (the method for manufacturing the three-dimensional model). .. Specifically, using the above-mentioned first composition and second composition, the first layer forming step and the second layer forming step were carried out, respectively, and then the sintering step was carried out at 1550 ° C. Then, the shrinkage ratios of the high-density portion 1310, which is the corresponding region of the first layer 310, and the low-density portion 1300, which is the corresponding region of the second layer 300, become the same, and deformation or the like occurs as shown in FIG. It was possible to form a three-dimensional model 500 (heat sink) that was not used.

Here, the relative density of the corresponding region (high density portion 1310) of the first layer 310 after the sintering step is 98%, and the thermal conductivity is 28 W / m · K, so that the second layer 300 after the sintering step The relative density of the corresponding region (low density portion 1300) was 76%, and the thermal conductivity was 8 W / m · K.

In the heat sink (layered body of the three-dimensional model 500) represented by FIG. 14, a cell structure portion 1340 composed of a second layer 300 (low density portion 1300) is formed, and a first cell structure portion 1340 is formed inside the cell structure portion 1340. The pipe portion 1320 composed of the layer 310 (high-density portion 1310) is formed. The heat sink has such a configuration, and the heat source 1360 such as a semiconductor chip can be brought into contact with the contact portion 1350 composed of the high-density portion 1310, and the cooling water 1370 can flow through the pipe portion 1320. It has become. As described above, the cell structure portion 1340 is formed at a low density, so that the thermal conductivity is low (8 W / m · K), and the corresponding portion (high density portion) of the first layer 310 on which the pipe portion 1320 is formed. Since 1310) is formed at a high density, the thermal conductivity becomes high (28 W / m · K). Therefore, the above-mentioned method for manufacturing a three-dimensional model is executed, and as in the heat sink shown in FIG. 14, for example, the heat source 1360 is brought into contact with the corresponding portion of the first layer 310 and cooling water is flowed through the pipe portion 1320. By making the pipe portion 1320 cool, it is possible to manufacture a high-performance heat sink that can effectively suppress the transfer of heat from the cell structure portion 1340 (corresponding portion of the second layer 300) to the surroundings. can.

[Example 2]
Using the first composition and the second composition of the first embodiment, the three-dimensional model 500 (loop heat) represented by FIG. 15 by the forming apparatus 2000 (the method for manufacturing the three-dimensional model). -Pipe: LHP) was formed. Specifically, the first layer forming step and the second layer forming step are each executed using the above-mentioned first composition and second composition, and then the sintering step is performed at 1550 ° C. as in Example 1. Was executed. Then, the shrinkage ratios of the high-density portion 1310, which is the corresponding region of the first layer 310, and the low-density portion 1300, which is the corresponding region of the second layer 300, become the same, and deformation or the like occurs as shown in FIG. It was possible to form an unfinished three-dimensional model 500 (LHP). The relative densities of the high-density portion 1310 and the low-density portion 1300 after the sintering step were all the same as in Example 1.

In the LHP (laminated body of the three-dimensional model 500) represented by FIG. 15, the base portion 1341 and the columnar portion 1342 extending from the base portion 1341 are formed by the second layer 300 (low density portion 1300), which is the opposite of the base portion 1341. The shape in which a part is inserted into the columnar portion 1342 from the side is formed by the first layer 310 (high-density portion 1310). That is, the base 1341 is formed at a low density to have a low thermal conductivity, and the opposite side of the base 1341 (corresponding portion of the first layer 310) is formed at a high density (high density portion 1310) to generate heat. The conductivity is increased and a space portion 1330 is formed around the columnar portion 1342 in the region between the base 1341 and the opposite side of the base 1341. The LHP has such a configuration, and the heat source 1360 such as a semiconductor chip is brought into contact with the contact portion 1351 composed of the high-density portion 1310, and the pipe 1390 on the side opposite to the space portion 1330 in the base 1341 ( The structure is such that the cooling water 1370 can flow through a loop-shaped pipe (such as a loop-shaped pipe connected to a cooling unit (not shown)). As described above, the base portion 1341 and the columnar portion 1342 are formed at a low density, so that the thermal conductivity is low (8 W / m · K), and a part of the base portion 1341 is inserted into the columnar portion 1342 from the opposite side. The corresponding portion (high density portion 1310) of the first layer 310 is formed at a high density, so that the thermal conductivity is increased (28 W / m · K). Therefore, the above-mentioned method for manufacturing a three-dimensional model is executed, and for example, the heat source 1360 is brought into contact with the contact portion 1351 (corresponding portion of the first layer 310) on the opposite side of the base 1341 as in the LHP shown in FIG. By making the base 1341 cool with cooling water 1370 or the like, the LHP is columnar from the base 1341 which is the corresponding portion of the second layer 300 while effectively suppressing the heat transfer to the base 1341 side. The cooling water 1370 can be infiltrated into the portion 1342 side, and the cooling water can be evaporated to the steam 1380 in the space portion 1330 around the columnar portion 1342 to absorb latent heat (the heat source 1360 is cooled by the heat of vaporization). High-performance LHP can be manufactured. In the LHP represented by FIG. 15, the space portion 1330 has a pipe shape through which steam 1380 is passed by combining the columnar portion 1342 and the heat source 1360. The direction in which the space portion 1330 extends and the direction in which the pipe 1390 extends are both vertical to the paper surface in FIG.

[Other Examples]
Instead of using the first composition and the second composition of Example 1 above, powders other than _{Al 2} O _{3 can be used as the first powder and the second powder.} For example, when the three-dimensional model 500 is used for a semiconductor cooling device or the like, AlN or the like having a thermal expansion coefficient close to that of a silicon wafer can be preferably used. Further, when it is used for radiating a large amount of heat such as a laser diode light source, for example, Cu as the first powder and Cu-Ni (55% -45%) alloy as the second powder are preferably used. be able to.

Further, instead of using the first composition of Example 1 above, one having a plurality of peaks of the particle size of the first powder (for example, 2 peaks or 3 peaks) can be preferably used. This is because having a plurality of particle size peaks makes it easy for small particle size particles to enter into the gaps between large particle size particles and increase the density. In order to facilitate high density, the peak particle size ratio is preferably 1/4 or less, and more preferably 1/7 or less.

In addition, the first layer 310 and the second layer in at least one of the stacking direction (Z direction) of the layers 501, 502, 503, ... 50n and the crossing direction intersecting the stacking direction of the laminated body of the three-dimensional model 500. The layer 300 may be formed by changing the abundance ratio. Since the first layer 310 and the second layer 300 are formed by changing the abundance ratios of the first layer 310 and the second layer 300 in at least one of the stacking direction and the crossing direction, the heat conductivity of the laminated body is increased according to the usage mode of the three-dimensional model 500 and the like. This is because a gradient can be formed.

The present invention is not limited to the above-described embodiment, and can be realized with various configurations within a range not deviating from the gist thereof. For example, the technical features in the examples corresponding to the technical features in each form described in the column of the outline of the invention are for solving a part or all of the above-mentioned problems, or one of the above-mentioned effects. It is possible to replace or combine as appropriate to achieve the part or all. Further, if the technical feature is not described as essential in the present specification, it can be appropriately deleted.

50, 50a, 50b, 50c, 50d ... constituent layer constituent part, 110 ... base,
111 ... drive device, 120 ... stage, 121 ... sample plate,
130 ... head base support, 300 ... second layer, 310 ... first layer,
400 ... Control unit (control unit), 410 ... Stage controller,
500 ... 3D model (layer of 3D model),
501, 502, 503, ... 50n ... layer, 730 ... head base support,
1100 ... head base, 1200 ... first composition supply device,
1210 ... 1st composition supply unit, 1210a ... 1st composition accommodating unit,
1220 ... Supply tube, 1230 ... First composition discharge unit, 1230a ... Discharge nozzle,
1230b ... Discharge drive unit, 1300 ... Low density part, 1310 ... High density part,
1320 ... pipe part, 1330 ... space part, 1340 ... cell structure part, 1341 ... base,
1342 ... Columnar part, 1350 ... Contact part, 1351 ... Contact part, 1360 ... Heat source,
1370 ... cooling water, 1380 ... steam, 1390 ... pipe, 1400 ... head unit,
1400a ... Holding jig,
1401, 1402, 1403 and 1404 ... Head unit,
1500 ... Material supply controller, 1600 ... Head base,
1700 ... Second composition supply device, 1710 ... Second composition supply unit,
1710a ... Second composition housing, 1720 ... Supply tube,
1730 ... Second composition discharge unit, 1730a ... Discharge nozzle, 1730b ... Discharge drive unit,
1900 ... Head unit, 1900a ... Holding jig,
2000 ... Forming device (manufacturing device for three-dimensional model), M ... Material (first composition, second composition)

Claims (4)

It is a manufacturing method of a three-dimensional model that manufactures a three-dimensional model by laminating layers.
A first layer forming step of forming a first layer using a first composition containing a first powder and a binder,
A second layer forming step of forming a second layer with a second composition comprising a second powder and a binder,
It has a sintering step of heating a laminate containing the first layer and the second layer to sinter the first powder and the second powder.
Each of the layers may be formed only by the first layer, may be formed only by the second layer, or may be formed by both the first layer and the second layer. ,
The filling rate of the first powder in the first composition is made larger than the filling rate of the second powder in the second composition, and the average particle size of the first powder is set to the second powder. A method for producing a three-dimensional molded product, which comprises reducing the difference in shrinkage between the first layer and the second layer in the sintering step by making the particle size smaller than the average particle size of the above. In the method for manufacturing a three-dimensional model according to claim 1,
The laminated body is a three-dimensional model characterized in that a cell structure portion composed of the second layer is formed, and a pipe portion composed of the first layer is formed inside the cell structure portion. Manufacturing method. In the method for manufacturing a three-dimensional model according to claim 1,
In the laminated body, a base portion and a columnar portion extending from the base portion are formed by the second layer, and a shape in which a part is inserted into the inside of the columnar portion from the opposite side of the base portion is formed by the first layer. A method for manufacturing a three-dimensional model, which is characterized by the fact that. In the method for manufacturing a three-dimensional model according to any one of claims 1 to 3.
The laminated body is three-dimensionally formed by changing the abundance ratios of the first layer and the second layer in at least one of the stacking direction of the layers and the crossing direction intersecting the stacking direction. How to make things.

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