JP6988901B2 - Cooling system - Google Patents

Description

The present invention relates to a cooling device, for example, a cooling device for cooling a heating element.

In recent years, while electronic devices have become smaller due to advances in process technology, the amount of information that electronic devices must process continues to increase. For this reason, the amount of heat generated by the heating element mounted on the electronic device is increasing, and the density of parts in the electronic device is increasing.

For example, an electronic device installed outdoors, such as a base station of a mobile phone, needs to have a closed structure in order to prevent rain and wind from entering the device. For this reason, in an electronic device installed outdoors, heat tends to be trapped inside the device, and it is an issue to efficiently cool the heating element.

As a heating element cooling technique, a technique for cooling a heating element by using a refrigerant whose phase changes between a liquid phase refrigerant (liquid phase refrigerant) and a gas phase refrigerant (gas phase refrigerant) is known. (For example, Patent Documents 1 and 2).

In the techniques described in Patent Documents 1 and 2, the heating element is cooled by using the phase change of the refrigerant enclosed in the closed container. Specifically, when the heating element generates heat, the liquid phase refrigerant in the container boils on the surface of the heating element due to the heat of the heating element, and the phase changes to the gas phase refrigerant. The heat generated by the heating element is dissipated by the heat of vaporization (latent heat) generated by this phase change. This cools the heating element. The gas-phase refrigerant rises upward in the vertical direction in the container, and then is cooled by coming into contact with the inner wall surface of the container, and then undergoes a phase change to the liquid-phase refrigerant again. This liquid-phase refrigerant descends downward in the vertical direction in the container, collects in the lower part of the container, and is used again for cooling the heating element. As described above, in the techniques described in Patent Documents 1 and 2, the phase-changed liquid-phase refrigerant and gas-phase refrigerant are circulated in the container to cool the heating element.

Here, in the technique described in Patent Document 1, a pair of straightening vanes (leading walls) extending in the vertical direction are fixed to the container so as to be arranged on both sides of the heating element. This makes it possible to form a flow path for circulating the refrigerant in the container along the periphery of the pair of straightening vanes.

Further, in the technique described in Patent Document 2, a pair of arcuate straightening vanes is fixed to the container so as to be arranged around two heating elements attached to the central portion of the container. This makes it possible to form a flow path for circulating the refrigerant in the container along the periphery of the heating element.

The technique related to the present invention is also described in Patent Document 3-4.

International Publication No. 2013/51587 Special Publication No. 63-29829 Japanese Unexamined Patent Publication No. 10-171360 Japanese Unexamined Patent Publication No. 2016-181547

However, in the techniques described in Patent Documents 1 and 2, since the straightening vane forming the flow path of the refrigerant is fixed to the container side, the container is remade according to the change of the mounting position of the heating element on the circuit board. There must be.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a cooling device capable of forming a flow path of a liquid phase refrigerant regardless of the position of a heating element on a circuit board. To provide.

In the cooling device of the present invention, a container for enclosing a refrigerant that undergoes a phase change between the liquid phase refrigerant and the gas phase refrigerant and a heating element are attached so that at least the heating element is immersed in the liquid phase refrigerant. It is provided with a circuit board provided in the container and a plurality of rectifying members provided in the circuit board and forming a flow path of the liquid phase refrigerant.

According to the cooling device according to the present invention, it is possible to form a flow path of the liquid phase refrigerant regardless of the position of the heating element on the circuit board.

It is a transmission front view which shows the structure of the cooling apparatus in 1st Embodiment of this invention through transmission. It is a transmission side view which shows the structure of the cooling apparatus in 1st Embodiment of this invention through transmission. It is sectional drawing which shows the state which attached the rectifying member to a heating element. It is sectional drawing which shows the state which attached the rectifying member to a circuit board. It is sectional drawing which shows the structure of the rectifying member. It is a top view which shows the structure of the rectifying member. It is a side view which shows the structure of the rectifying member. It is a side view which shows the structure of the rectifying member. It is a bottom view which shows the structure of a rectifying member. It is a transmission front view which shows through the structure of the cooling apparatus in 2nd Embodiment of this invention. It is a transmission side view which shows the structure of the cooling apparatus in 2nd Embodiment of this invention through transmission. It is a transmission front view which shows the structure of the modification of the cooling apparatus in 2nd Embodiment of this invention through transmission. It is a transmission side view which shows the structure of the modification of the cooling apparatus in 2nd Embodiment of this invention through transmission. It is a transmission front view which shows through the structure of the cooling apparatus in 3rd Embodiment of this invention. It is a transmission side view which shows the structure of the cooling apparatus in 3rd Embodiment of this invention through transmission. It is sectional drawing which shows the state which attached the 1st modification of a rectifying member to a circuit board. It is a top view which shows the state which the 1st modification of the rectifying member attached to a circuit board. It is a side view which shows the state which the 1st modification of the rectifying member attached to a circuit board. It is sectional drawing which shows the structure of the 1st modification of a rectifying member. It is a top view which shows the structure of the 1st modification of a rectifying member. It is a side view which shows the structure of the 1st modification of a rectifying member. It is a side view which shows the structure of the 1st modification of a rectifying member. It is a bottom view which shows the structure of the 1st modification of a rectifying member. It is sectional drawing which shows the structure of the base part of the 1st modification of a rectifying member. It is a top view which shows the structure of the base part of the 1st modification of a rectifying member. It is a side view which shows the structure of the base part of the 1st modification of a rectifying member. It is a bottom view which shows the structure of the base part of the 1st modification of a rectifying member. It is sectional drawing which shows the structure of the rotating part of the 1st modification of a rectifying member, and the rectifying plate. It is a top view which shows the structure of the rotating part of the 1st modification of a rectifying member, and the rectifying plate. It is a side view which shows the structure of the rotating part of the 1st modification of a rectifying member, and the rectifying plate. It is a side view which shows the structure of the rotating part of the 1st modification of a rectifying member, and the rectifying plate. It is a bottom view which shows the structure of the rotating part of the 1st modification of a rectifying member, and the rectifying plate. It is sectional drawing which shows the structure of the holding member. It is a top view which shows the structure of the holding member. It is a side view which shows the structure of the holding member. It is a bottom view which shows the structure of the holding member. It is sectional drawing which shows the state which attached the 1st modification of a rectifying member to a heating element. It is sectional drawing which shows the state which the 2nd modification of the rectifying member attached to the circuit board. It is a top view which shows the state which the 2nd modification of the rectifying member is attached to the circuit board. It is a side view which shows the state which the 2nd modification of the rectifying member is attached to the circuit board. It is sectional drawing which shows the structure of the 2nd modification of a rectifying member. It is a top view which shows the structure of the 2nd modification of a rectifying member. It is a side view which shows the structure of the 2nd modification of a rectifying member. It is a side view which shows the structure of the 2nd modification of a rectifying member. It is a bottom view which shows the structure of the 2nd modification of a rectifying member. It is sectional drawing which shows the structure of the base part of the 2nd modification of the rectifying member. It is a top view which shows the structure of the base part of the 2nd modification of a rectifying member. It is a side view which shows the structure of the base part of the 2nd modification of a rectifying member. It is a bottom view which shows the structure of the base part of the 2nd modification of a rectifying member. It is sectional drawing which shows the structure of the rotating part of the 2nd modification of the rectifying member, and the rectifying plate. It is a top view which shows the structure of the rotating part of the 2nd modification of a rectifying member, and the rectifying plate. It is a side view which shows the structure of the rotating part of the 2nd modification of a rectifying member, and the rectifying plate. It is a side view which shows the structure of the rotating part of the 2nd modification of a rectifying member, and the rectifying plate. It is a bottom view which shows the structure of the rotating part of the 2nd modification of a rectifying member, and the rectifying plate.

<First Embodiment>
The configuration of the cooling device 1000 according to the first embodiment of the present invention will be described. FIG. 1A is a transmission front view showing the configuration of the cooling device 1000 through transmission. FIG. 1B is a transmission side view showing the configuration of the cooling device 1000 through transmission. In addition, in FIG. 1A and FIG. 1B, the vertical direction G is shown for convenience of explanation. The cooling device 1000 can be used, for example, in a communication device or an electronic device such as a server.

As shown in FIGS. 1A and 1B, the cooling device 1000 includes a container 100, a circuit board 200, and a plurality of rectifying members 300a to 300g. In the following description, when it is not necessary to distinguish between the rectifying members 300a to 300g, the rectifying members 300a to 300g are collectively referred to as the rectifying member 300.

As shown in FIGS. 1A and 1B, the container 100 is formed in a box shape. The inside of the container 100 is hollow. The container 100 is prepared for enclosing a refrigerant (Coolant: hereinafter referred to as COO) described in detail later. A heat conductive member (for example, aluminum or an aluminum alloy) is used as the material of the container 100. A plurality of heat radiation fins 101 are provided on the outer surface of the container 100. The plurality of heat radiation fins 101 are not indispensable and may be omitted. The container 100 is provided with a lid. This lid is a plate constituting one surface of the container 100 (for example, the surface on the upper side in the vertical direction G) and is removable. Here, it is assumed that the container 100 is completed by combining the lid and the main body of the container 100. The lid is fixed to the main body of the container 100 by, for example, screwing. At this time, a rubber-like packing or the like is interposed between the lid and the main body of the container 100. As a result, it is possible to prevent the refrigerant COO from leaking from between the lid and the main body of the container 100.

The container 100 is filled with the refrigerant COO. This refrigerant COO is a material that undergoes a phase change between a liquid-phase refrigerant (Liquid-Phase Coolant: hereinafter referred to as LP-COO) and a gas-phase refrigerant (Gas-Phase Coolant: hereinafter referred to as GP-COO). Is used. The refrigerant COO is enclosed in the container 100 in a sealed state. More specifically, by injecting the liquid phase refrigerant LP-COO into the container 100 and then evacuating the container 100, the inside of the container 100 is always maintained at the saturated vapor pressure of the refrigerant. 1A and 1B show the gas phase refrigerant GP-COO and the liquid phase refrigerant LP-COO enclosed in the container 100. The gas phase refrigerant GP-COO is located in the gas phase space formed above the liquid surface of the liquid phase refrigerant LP-COO. Further, the bubble gas phase refrigerant GP-COO is generated in the vicinity of the heating element 201 when the liquid phase refrigerant LP-COO undergoes a phase change to the gas phase refrigerant GP-COO due to the heat of the heating element 201 described later. The refrigerant COO includes all the liquid phase refrigerant LP-COO and all the gas phase refrigerant GP-COO in the container 100.

As the refrigerant COO, for example, hydrofluorocarbon (HFC: Hydro Fluorocarbon), hydrofluoroether (HFE: Hydro Fluoroether), or the like can be used as a low boiling point refrigerant.

As shown in FIGS. 1A and 1B, the circuit board 200 is formed in a plate shape. The circuit board 200 is provided in the container 100 along the vertical direction G. The circuit board 200 is fixed in the container 100 by a holding member (not shown). For the holding member, for example, screws, bolts, nuts, or the like can be used. A heating element 201 is mounted on the circuit board 200. The circuit board 200 is provided in the container 100 so that at least the heating element 201 is immersed in the liquid phase refrigerant LP-COO. As a result, the heating element 201 can be cooled by the liquid phase refrigerant LP-COO. More preferably, the circuit board 200 may be provided in the container 100 so that substantially the entire circuit board 200 is immersed in the liquid phase refrigerant LP-COO. As a result, the entire circuit board 200 can be cooled by the liquid phase refrigerant LP-COO.

The circuit board 200 is, for example, a printed wiring board. The printed wiring board is configured by laminating a plurality of insulator boards and conductor wiring. Further, conductive pads for mounting electronic components are formed on the front surface and the back surface of the printed wiring board. The electronic components are fixed to the pad by soldering. For example, a glass epoxy resin is used as the material of the substrate of the insulator. Conductor wiring and pads are made of, for example, copper foil.

The heating element 201 is an electronic component that generates heat when operated, and is, for example, a central processing unit (CPU), an integrated circuit (Multi-chip Module: MCM), or the like. The heating element 201 is a cooling target of the cooling device 1000. The heating element 201 is fixed to the circuit board 200 by soldering or the like.

As shown in FIGS. 1A and 1B, the plurality of rectifying members 300a to 300f are provided on the circuit board 200. Each of the plurality of rectifying members 300a to 300f forms a flow path of the liquid phase refrigerant LP-COO. That is, as shown in FIG. 1A, by providing the plurality of rectifying members 300a to 300f on the circuit board 200, the flow paths α1 and the flow paths α2 of the liquid phase refrigerant LP-COO are formed.

Here, as shown in FIGS. 1A and 1B, the rectifying member 300a is mounted on a heating element 201 mounted on the circuit board 200. Further, the rectifying members 300b to 300g are mounted on the circuit board 200.

FIG. 2 is a cross-sectional view showing a state in which the rectifying member 300a is attached to the heating element 201, and is a cross-sectional view taken along the line AA of FIG. 1A. As shown in FIG. 2, the rectifying member 300a is mounted on a heating element 201 mounted on the circuit board 200. The lower surface of the rectifying member 300a (lower surface in FIG. 2 paper surface) and the upper surface of the heating element 201 (upper surface in FIG. 2 paper surface) are bonded to each other by, for example, a silicone-based adhesive. .. As a result, the rectifying member 300a is fixed to the heating element 201. Further, the rectifying member 300a does not come off from the heating element 201 even in the liquid phase refrigerant LP-COO. Note that FIG. 2 shows the distance D1 from the main surface of the circuit board 200 to the tip of the straightening vane 320.

In the above description, it has been explained that the rectifying member 300a is adhered to the heating element 201 by the adhesive. However, the rectifying member 300a may be fixed to the heating element 201, and this fixing method is not limited to bonding with an adhesive.

That is, for example, a plurality of holes are provided in advance in the circuit board 200, and pins fitted in the plurality of holes are formed in the rectifying member 300a. Then, by fitting the pin of the rectifying member 300a into the hole of the circuit board 200, the rectifying member 300a is attached to the circuit board 200 so as to sandwich the heating element 201 between the rectifying member 300a and the circuit board 200. As a result, the rectifying member 300a is fixed to the heating element 201.

Alternatively, the rectifying member 300a may be screwed to the circuit board 200. In this case, the rectifying member 300 is screwed to the circuit board 200 so as to sandwich the heating element 201 between the rectifying member 300a and the circuit board 200. As a result, the rectifying member 300a is fixed to the heating element 201.

Further, a claw formed in advance in the rectifying member 300a may be hooked in a hole formed in advance in the circuit board 200. In this case, the claw of the rectifying member 300a is hooked on the hole of the circuit board 200 so as to sandwich the heating element 201 between the rectifying member 300a and the circuit board 200. As a result, the rectifying member 300a is fixed to the heating element 201.

FIG. 3 is a cross-sectional view showing a state in which the rectifying member 300e is attached to the circuit board 200, and is a cross-sectional view taken along the line BB of FIG. 1A. As shown in FIG. 3, the rectifying member 300e is mounted on the circuit board 200. The lower surface of the rectifying member 300e (lower surface in FIG. 3 paper surface) and the upper main surface of the circuit board 200 (upper surface in FIG. 3 paper surface) are bonded with, for example, a silicone-based adhesive. Has been done. As a result, the rectifying member 300e is fixed to the circuit board 200. Further, the rectifying member 300e does not come off from the circuit board 200 even in the liquid phase refrigerant LP-COO. Note that FIG. 3 shows the distance D2 from the main surface of the circuit board 200 to the tip of the straightening vane 320.

In the above description, it has been explained that the rectifying member 300e is adhered to the upper main surface of the circuit board 200 by an adhesive. However, the rectifying member 300a may be fixed to the circuit board 200, and this fixing method is not limited to bonding with an adhesive.

That is, for example, a plurality of holes are provided in advance in the circuit board 200, and pins fitted in the plurality of holes are formed in the rectifying member 300e. Then, the rectifying member 300e is attached to the circuit board 200 by fitting the pin of the rectifying member 300e into the hole of the circuit board 200. As a result, the rectifying member 300e is fixed to the heating element 201.

Alternatively, the rectifying member 300e may be screwed to the circuit board 200. As a result, the rectifying member 300a is fixed to the heating element 201.

Further, a claw formed in advance in the rectifying member 300e may be hooked in a hole formed in advance in the circuit board 200. As a result, the rectifying member 300a is fixed to the heating element 201.

Next, the configuration of the rectifying member 300 will be described. 4A to 4E are views showing the configuration of the rectifying member 300. FIG. 4A is a cross-sectional view showing the configuration of the rectifying member 300, and is a cross-sectional view of the KA-KA cut surface of FIG. 4B. FIG. 4B is a top view showing the configuration of the rectifying member 300. FIG. 4C is a side view showing the configuration of the rectifying member 300, and is a view showing the appearance of the arrowhead KB of FIG. 4B. FIG. 4D is a side view showing the configuration of the rectifying member 300, and is a view showing the appearance of the arrowhead KC of FIG. 4B. FIG. 4E is a bottom view showing the configuration of the rectifying member 300, and is a diagram showing the appearance of the arrowhead KD of FIG. 4C.

The straightening vane 300 includes a base portion 310 and a straightening vane 320. As shown in FIGS. 4A to 4E, the base portion 310 is formed in a disk shape. As shown in FIGS. 4A to 4D, the straightening vane 320 is provided on the upper surface of the base portion 310 so as to extend from the upper surface of the base portion 310. At least one straightening vane 320 may be provided. Preferably, a plurality of straightening vanes 320 are provided on the base portion 310. The straightening vane 320 is provided to set the flow direction of the liquid phase refrigerant LP-COO. That is, for example, the flow of the liquid phase refrigerant LP-COO can be changed by adjusting the angle formed by one side of the circuit board 200 and the straightening vane 320. The straightening vane 320 is formed in a flat plate shape. However, the straightening vane 320 may be formed in a curved surface or a wavy shape. The base portion 310 and the straightening vane 320 are integrally formed. However, the base portion 310 and the straightening vane 320 may be formed separately. In this case, the straightening vane 320 is fixed on the circular surface of the base portion 310. The material of the base portion 310 and the rectifying plate 320 may be, for example, a resin material (for example, Acrylonitrile butadiene styrene (Acrylonitrile Butadiene Styrene) copolymer synthetic resin (referred to as ABS resin)) or a metal material (for example, aluminum or aluminum). (Aluminum alloy) is used.

Next, a method of manufacturing the cooling device 1000 will be described.

First, the circuit board 200 to which the heating element 201 is attached is prepared. Then, the plurality of rectifying members 300 are attached on the circuit board 200 by the above-mentioned adhesive. Specifically, the rectifying member 300a is mounted on the heating element 201. Further, the rectifying members 300b to g are mounted on the main surface of the circuit board 200. As described above, the method of fixing the rectifying member 300 to the circuit board 200 or the heating element 201 is not limited to bonding with an adhesive, but may be pinning, screwing, or hooking with a claw. At this time, the plurality of rectifying members 300 are arranged while adjusting the arrangement locations of the plurality of rectifying members 300 and the orientation of the rectifying plates 320 so that the flow paths α1 and the flow paths α2 of the liquid phase refrigerant LP-COO are formed. It is mounted on the circuit board 200. That is, the rectifying member 300 is arranged on the flow paths α1 and α2 so that the extending direction of the rectifying plate 320 of the rectifying member 300 is along the tangent to the flow paths α1 and α2. It is also possible to adjust the arrangement location and arrangement direction of the rectifying member 300 after confirming the flow of the liquid phase refrigerant LP-COO when the cooling device 1000 is operated. In this case, it is necessary to replace the rectifying member 300 after taking out the circuit board 200 from the container 100.

Next, the circuit board 200 is fixed in the container 100 by a holding member (not shown). The circuit board 200 is fixed in the container 100 so as to be parallel to the vertical direction G. At this time, it is preferable that a predetermined gap (for example, several mm or more) is provided between the rectifying member 300 and the inner wall of the container 100. Then, the container 100 is filled with the refrigerant COO.

The method of filling the container 100 of the cooling device 1000 with the refrigerant COO is as follows. First, with the lid of the container 100 open, the refrigerant COO is injected into the container 100. The lid is fixed to the main body of the container 100. An opening hole is formed in the lid. Air is removed from the inside of the container 100 through this opening hole by using a vacuum pump (not shown) or the like. Then, the opening hole is closed. In this way, the refrigerant COO is sealed in the container 100. As a result, the pressure in the container 100 becomes equal to the saturated vapor pressure of the refrigerant COO, and the boiling point of the refrigerant COO sealed in the container 100 becomes close to room temperature.

As described above, the manufacturing method of the cooling device 1000 has been described.

Next, the operation of the cooling device 1000 will be described.

When the cooling device 1000 is started, the heating element 201 starts operating. As a result, the heating element 201 generates heat. When the heating element 201 generates heat, the liquid phase refrigerant LP-COO in the container 100 boils on the surface of the heating element 201 due to the heat of the heating element 201, and the phase changes to the gas phase refrigerant GP-COO. As a result, bubbles of the gas phase refrigerant GP-COO are generated as shown in FIG. 1A. The heat generated by the heating element 201 is dissipated by the heat of vaporization (latent heat) generated by this phase change. This cools the heating element 201. A part of the heat of the heating element 201 is received by the rectifying member 300a. In this case, the liquid phase refrigerant LP-COO in the container 100 boils on the surface of the rectifying member 300a due to the heat of the heating element 201, and undergoes a phase change to the gas phase refrigerant GP-COO. As a result, bubbles of the gas phase refrigerant GP-COO are generated as shown in FIG. 1A.

The gas phase refrigerant GP-COO rises in the liquid phase refrigerant LP-COO upward in the vertical direction G, passes over the liquid surface of the liquid phase refrigerant LP-COO, and further rises upward in the vertical direction G. Then, when the gas phase refrigerant GP-COO boiled by the heat of the heating element 201 is cooled by coming into contact with the inner wall surface of the container 100, the phase changes to the liquid phase refrigerant LP-COO again. This liquid phase refrigerant LP-COO descends in the container 100 below the vertical direction G, accumulates on the lower side of the container 100 in the vertical direction G, and is used again for cooling the heating element 201.

Further, the liquid phase refrigerant LP-COO circulates along the flow path α1 and the flow path α2. More specifically, the circulation path (flow path α1 and flow path α2) of the liquid phase refrigerant LP-COO is formed as follows.

As described above, in the vicinity of the heating element 201, bubbles of the gas phase refrigerant GP-COO are generated by the heat generated by the heating element 201. Bubbles of the gas phase refrigerant GP-COO rise in the liquid phase refrigerant LP-COO upward in the vertical direction G. Due to the rise of bubbles in the gas phase refrigerant GP-COO, the liquid phase refrigerant LP-COO flows upward in the vertical direction G in the vicinity of the heating element 201.

The rectifying member 300a is provided on the heating element 201. Further, as shown in FIG. 1A, the straightening vane 320 of the straightening vane 300a is arranged along the upper side in the vertical direction G. Therefore, in the vicinity of the heating element 201, the liquid phase refrigerant LP-COO is rectified upward in the vertical direction G.

This liquid phase refrigerant LP-COO rises from the vicinity of the heating element 201 to the upper side in the vertical direction G, and then is rectified by the rectifying plate 320 of the rectifying member 300b toward the upper side of the vertical direction G and toward the side surface side of the container 100. Will be done. Further, the liquid phase refrigerant LP-COO is rectified so as to descend along the side surface of the container 100 by the rectifying plate 320 of the rectifying member 300c and 300d. Then, the liquid phase refrigerant LP-COO rectified by the rectifying members 300a, 300b, 300c, and 300d is supplied to the rectifying member 300a again. As a result, the flow path α1 is formed.

Further, the liquid phase refrigerant LP-COO rises from the vicinity of the heating element 201 to the upper side in the vertical direction G, and then is directed toward the upper side of the vertical direction G and the side surface side of the container 100 by the rectifying plate 320 of the rectifying member 300e. Be rectified. Further, the liquid phase refrigerant LP-COO is rectified so as to descend along the side surface of the container 100 by the rectifying plate 320 of the rectifying member 300f and 300 g. Then, the liquid phase refrigerant LP-COO rectified by the rectifying members 300a, 300e, 300f, and 300g is supplied to the rectifying member 300a again. As a result, the flow path α2 is formed.

As described above, the liquid phase refrigerant LP-COO circulates along the circulation path (flow path α1 and flow path α2) of the liquid phase refrigerant LP-COO.

The operation of the cooling device 1000 has been described above.

As described above, the cooling device 1000 according to the first embodiment of the present invention includes a container 100, a circuit board 200, and a plurality of rectifying members 300. The container 100 is filled with a refrigerant COO that undergoes a phase change between the liquid phase refrigerant LP-COO and the gas phase refrigerant GP-COO. A heating element 201 is attached to the circuit board 200. The circuit board 200 is provided in the container 100 so that the heating element 201 is immersed in the liquid phase refrigerant LP-COO. The plurality of rectifying members 300 are provided on the circuit board 200 and form a flow path of the liquid phase refrigerant LP-COO.

As described above, the circuit board 200 to which the heating element 201 is attached is provided in the container 100 so that the heating element 201 is immersed in the liquid phase refrigerant LP-COO. As a result, the heating element 201 on the circuit board 200 is cooled by the liquid phase refrigerant LP-COO. Further, the plurality of rectifying members 300 are provided on the circuit board 200 and form a flow path of the liquid phase refrigerant LP-COO. With this configuration, a plurality of rectifying members 300 can be provided on the circuit board 200 according to the position of the heating element 201 on the circuit board 200 so as to form a flow path of the liquid phase refrigerant LP-COO. More specifically, a plurality of rectifications are performed while adjusting the arrangement location of each of the plurality of rectifying members 300 and the orientation of the rectifying plate 320 so that the flow paths α1 and the flow paths α2 of the liquid phase refrigerant LP-COO are formed. The member 300 can be mounted on the circuit board 200.

Therefore, according to the cooling device 1000 according to the first embodiment of the present invention, the flow path of the liquid phase refrigerant LP-COO can be formed regardless of the position of the heating element 201 on the circuit board 200.

In the techniques described in Patent Documents 1 and 2, the straightening vane is fixed to the container. Therefore, when the heating element is provided on the circuit board, the container must be remade according to the change in the mounting position of the heating element on the circuit board. On the other hand, in the cooling device 1000 according to the first embodiment of the present invention, the plurality of rectifying members 300 are provided on the circuit board 200 side. Therefore, when the heating element 201 is provided on the circuit board 200, it is not necessary to remake the container 100 in accordance with the change in the mounting position of the heating element 201 on the circuit board 200. Therefore, in the cooling device 1000 according to the first embodiment of the present invention, the flow path of the liquid phase refrigerant LP-COO is formed regardless of the position of the heating element 201 on the circuit board 200 without remaking the container 100. be able to.

Further, in the cooling device 1000 according to the first embodiment of the present invention, at least one of the plurality of rectifying members 300 is attached to the heating element 201. Around the heating element 201, the gas phase refrigerant GP-COO is generated by the phase change of the liquid phase refrigerant LP-COO due to the heat of the heating element 201. The upward movement of the gas phase refrigerant GP-COO causes the flow of the liquid phase refrigerant LP-COO. That is, the heating element 201 becomes a source of flow of the liquid phase refrigerant LP-COO. Therefore, by attaching the rectifying member 300 to the heating element 201, the flow path of the liquid phase refrigerant LP-COO can be oriented at the source of the flow of the liquid phase refrigerant LP-COO. As a result, the liquid phase refrigerant LP-COO can be guided to a desired flow path at the source of the flow of the liquid phase refrigerant LP-COO.

In the cooling device 1000 according to the first embodiment of the present invention, among the plurality of rectifying members 300, the rectifying members 300b to 300g not attached to the heating element 201 are attached on the circuit board 200. That is, at least one of the plurality of rectifying members 300 can be attached to the heating element 201, and the rectifying member not attached to the heating element 201 can be attached to the circuit board 200. As a result, the rectifying member 300 attached to the heating element 201 directs the flow path of the liquid phase refrigerant LP-COO at the source of the flow of the liquid phase refrigerant LP-COO. After that, the rectifying member 300 mounted on the circuit board 200 can change the flow of the liquid phase refrigerant LP-COO directed by the rectifying member 300 mounted on the heating element 201 in a desired direction. can.

In the cooling device 1000 according to the first embodiment of the present invention, the rectifying member attached to the heating element 201 may be composed of a heat conductive member. As a result, the rectifying member 300 can directly absorb the heat of the heating element 201 and dissipate the absorbed heat into the liquid phase refrigerant LP-COO.

In the cooling device 1000 according to the first embodiment of the present invention, the rectifying member 300 includes a base portion 310 and a rectifying plate 320 that sets the flow direction of the liquid phase refrigerant LP-COO. In this way, since the rectifying plate 320 sets the flow direction of the liquid phase refrigerant LP-COO, the flow direction of the liquid phase refrigerant LP-COO can be easily set by setting the direction of the rectifying plate 320.

In the cooling device 1000 according to the first embodiment of the present invention, the distance from the tip end portion of the straightening vane 320 to the main surface of the circuit board 200 may be the same among the plurality of straightening vanes 300. More specifically, D1 shown in FIG. 2 and D2 shown in FIG. 3 may be the same. As a result, in all the straightening vanes 300 attached to the circuit board 200, the distance from the tip of each straightening vane 320 to the main surface of the circuit board 200 becomes the same (D1 = D2). As a result, it is possible to prevent the flow of the liquid phase refrigerant LP-COO from deviating from the desired flow path in the direction perpendicular to the main surface of the circuit board 200. More preferably, the distance between the tip of each straightening vane 320 and the inner wall of the container 100 should be smaller as long as it does not interfere with the flow of the liquid phase refrigerant LP-COO.

<Second embodiment>
The configuration of the cooling device 1000A according to the second embodiment of the present invention will be described. FIG. 5A is a transmission front view showing the configuration of the cooling device 1000A. FIG. 5B is a transmission side view showing the configuration of the cooling device 1000A through. Note that FIGS. 5A and 5B show the vertical direction G for convenience of explanation. Further, in FIGS. 5A and 5B, the components equivalent to the components shown in FIGS. 1 to 4 are designated by the same reference numerals as those shown in FIGS. 1 to 4. The cooling device 1000A can be used, for example, in a communication device or an electronic device such as a server.

As shown in FIGS. 5A and 5B, the cooling device 1000A includes a container 100, a circuit board 200A, and three rectifying members 300h to 300j. In the following description, when it is not necessary to distinguish the rectifying members 300a to 300j, the rectifying members 300a to 300j are collectively referred to as the rectifying member 300.

Here, the cooling device 1000A shown in FIGS. 5A and 5B is compared with the cooling device 1000 shown in FIGS. 1A and 1B.

The location of the heating element 201, the number and location of the rectifying members 300, and the flow path of the liquid phase refrigerant LP-COO are different between the cooling device 1000A and the cooling device 1000. That is, in the cooling device 1000, the heating element 201 is provided in the central portion of the circuit board 200. Further, in the cooling device 1000, seven rectifying members 300 are provided on the circuit board 200. Further, in the cooling device 1000, the flow paths α1 and α2 of the liquid phase refrigerant LP-COO are set so as to circulate on both side portions of the circuit board 200 with the central portion of the circuit board 200 as a base point. On the other hand, in the cooling device 1000A, the heating element 201 is provided above the right side surface of the circuit board 200. Further, in the cooling device 1000A, three rectifying members 300 are provided on the circuit board 200A. Further, in the cooling device 1000A, the flow path α3 of the liquid phase refrigerant LP-COO is set so as to circulate in the left side portion of the circuit board 200A with the upper side of the right side portion of the circuit board 200A as a base point.

As described above, in the cooling device 1000A according to the second embodiment of the present invention, the flow path α3 is formed by using the circuit board 200A, the three rectifying members 300, and the container 100 in which the refrigerant COO is sealed. is doing. Even with such a configuration, as in the first embodiment, the flow path of the liquid phase refrigerant LP-COO is adjusted to the position of the heating element 201 on the circuit board 200 without remaking the container 100. Can be formed. Further, even if the heating element 201 is arranged on the end side of the circuit board 200A, the rectifying member 300 can be attached to the circuit board 200A so that a predetermined flow path α3 is formed.

<Modified example of the second embodiment>
The configuration of the cooling device 1000B, which is a modification of the cooling device 1000A according to the second embodiment of the present invention, will be described. FIG. 6A is a transmission front view showing the configuration of the cooling device 1000B through. FIG. 6B is a transmission side view showing the configuration of the cooling device 1000B through. Note that FIGS. 6A and 6B show the vertical direction G for convenience of explanation. Further, in FIGS. 6A and 6B, the components equivalent to the components shown in FIGS. 1 to 5 are designated by the same reference numerals as those shown in FIGS. 1 to 5. The cooling device 1000B can be used for, for example, a communication device or an electronic device such as a server.

As shown in FIGS. 6A and 6B, the cooling device 1000B includes a container 100, a circuit board 200B, and five rectifying members 300h to 300l. In the following description, when it is not necessary to distinguish between the rectifying members 300a to 300l, the rectifying members 300a to 300l are collectively referred to as the rectifying member 300.

Here, the cooling device 1000B shown in FIGS. 6A and 6B is compared with the cooling device 1000A shown in FIGS. 5A and 5B.

The number and location of heating elements 201, the number and location of rectifying members 300, and the flow path of the liquid phase refrigerant LP-COO are different between the cooling device 1000B and the cooling device 1000A. That is, in the cooling device 1000A, the heating element 201 is provided above the right side surface of the circuit board 200. Further, in the cooling device 1000A, three rectifying members 300 are provided on the circuit board 200A. The rectifying member 300h is provided on the heating element 201, and the rectifying members 300i and 300j are provided on the circuit board 200. Further, in the cooling device 1000A, the flow path α3 of the liquid phase refrigerant LP-COO is set so as to circulate in the left side portion of the circuit board 200A with the upper side of the right side portion of the circuit board 200A as a base point. On the other hand, in the cooling device 1000B, the two heating elements 201 are provided above the right side surface of the circuit board 200. Further, in the cooling device 1000B, five rectifying members 300 are provided on the circuit board 200A. The rectifying members 300h and 300l are provided on the heating element 201, and the rectifying members 300i to 300k are provided on the circuit board 200. Further, in the cooling device 1000B, the flow path α4 of the liquid phase refrigerant LP-COO is set so as to circulate in the left side portion of the circuit board 200B with the upper side of the right side portion of the circuit board 200B as a base point.

As described above, in the cooling device 1000B which is a modification of the cooling device 1000A according to the second embodiment of the present invention, the circuit board 200B, the five rectifying members 300, and the container 100 in which the refrigerant COO is sealed are provided. It is used to form the flow path α4. Even with such a configuration, the same effects as those of the first and second embodiments can be obtained. Further, even if the two heating elements 201 are arranged on the end side of the circuit board 200B, the rectifying member 300 can be attached to the circuit board 200B so that a predetermined flow path α4 is formed.

<Third embodiment>
The configuration of the cooling device 1000C according to the third embodiment of the present invention will be described. FIG. 7A is a transmission front view showing the configuration of the cooling device 1000C through. FIG. 7B is a transmission side view showing the configuration of the cooling device 1000C through. Note that FIGS. 7A and 7B show the vertical direction G for convenience of explanation. Further, in FIGS. 7A and 7B, the components equivalent to the components shown in FIGS. 1 to 6 are designated by the same reference numerals as those shown in FIGS. 1 to 6. The cooling device 1000C can be used, for example, in a communication device or an electronic device such as a server.

As shown in FIGS. 7A and 7B, the cooling device 1000C includes a container 100, a circuit board 200, and a rectifying member 300 m to 300 s. When it is not necessary to distinguish between the rectifying members 300m to 300s, the rectifying members 300m to 300s are collectively referred to as the rectifying member 300.

Here, the cooling device 1000C shown in FIGS. 7A and 7B is compared with the cooling device 1000 shown in FIGS. 1A and 1B.

The location of the heating element 201, the number and location of the rectifying members 300, and the flow path of the liquid phase refrigerant LP-COO are different between the cooling device 1000C and the cooling device 1000. That is, in the cooling device 1000, the heating element 201 is provided in the central portion of the circuit board 200. Further, in the cooling device 1000, seven rectifying members 300 are provided on the circuit board 200. Further, in the cooling device 1000, the flow paths α1 and α2 of the liquid phase refrigerant LP-COO are set so as to circulate on both side portions of the circuit board 200 with the central portion of the circuit board 200 as a base point. On the other hand, in the cooling device 1000C, two heating elements 201 are provided at both end portions of the circuit board 200C. Further, in the cooling device 1000C, six rectifying members 300 are provided on the circuit board 200C. The rectifying members 300m and 300r are provided on the heating element 201, and the rectifying members 300n, 300p, 300q and 300s are provided on the circuit board 200. Further, in the cooling device 1000C, the flow paths α5 and α6 of the liquid phase refrigerant LP-COO are set so as to circulate in the central portion of the circuit board 200C with both side portions of the circuit board 200A as base points.

As described above, in the cooling device 1000C according to the second embodiment of the present invention, the circuit board 200C, the six rectifying members 300, and the container 100 in which the refrigerant COO is sealed are used, and the flow paths α5 and α6 are used. Is forming. Even with such a configuration, the same effect as that of the first embodiment can be obtained. Further, even if the heating element 201 is arranged on the end side of the circuit board 200C, the rectifying member 300 can be attached to the circuit board 200A so that the predetermined flow paths α5 and α6 are formed.

<First modification of the rectifying member>
Next, a first modification of the rectifying member 300 will be described. FIG. 8 is a cross-sectional view showing a state in which the rectifying member 300A, which is a first modification of the rectifying member 300, is attached to the circuit board 200, and is a view showing a cross section of the CC cut surface of FIG. FIG. 9 is a top view showing a state in which the rectifying member 300A is attached to the circuit board 200. FIG. 10 is a side view showing a state in which the rectifying member 300A is attached to the circuit board 200. The holding member 400 is also shown in FIGS. 8 to 10.

FIG. 11A is a cross-sectional view showing the configuration of the rectifying member 300A, and is a view showing a cross section of the LA-LA cut surface of FIG. 11B. FIG. 11B is a top view showing the configuration of the rectifying member 300A. 11C is a side view showing the configuration of the rectifying member 300A, and is a view showing the arrow-viewing LB of FIG. 11B. 11D is a side view showing the configuration of the rectifying member 300A, and is a view showing the arrow-view LC of FIG. 11B. FIG. 11E is a bottom view showing the configuration of the rectifying member 300A, and is a view showing the arrow-view LD of FIG. 11A.

As shown in FIG. 8, the rectifying member 300A is attached to the circuit board 200. Further, the straightening vane member 300A includes a base portion 310A, a rotating portion 330, and a straightening vane 320.

First, the configuration of the base portion 310A will be described. FIG. 12A is a cross-sectional view showing the configuration of the base portion 310A of the rectifying member 300A, and is a view showing a cross section of the NA-NA cut surface of FIG. 12B. FIG. 12B is a top view showing the configuration of the base portion 310A of the rectifying member 300A. FIG. 12C is a side view showing the configuration of the base portion 310A of the rectifying member 300A, and is a view showing the arrow-viewing NB of FIG. 12B. FIG. 12D is a bottom view showing the configuration of the base portion 310A of the rectifying member 300A, and is a diagram showing the arrow-viewing ND of FIG. 12A.

The base portion 310A includes a flat plate portion 311 and a protrusion portion 312. The flat plate portion 311 is a plate member formed in a disk shape. The protrusion 312 is a columnar protrusion member. The protrusion 312 is provided on the flat plate portion 311 so as to extend from the flat plate portion 311. The flat plate portion 311 and the protrusion portion 312 may be formed integrally or may be formed separately. As the material of the flat plate portion 311 and the protrusion 312, for example, a resin material (for example, ABS resin) or a metal material (for example, aluminum or an aluminum alloy) is used.

Next, the configuration of the rotating portion 330 and the straightening vane 320 will be described. FIG. 13A is a cross-sectional view showing the configuration of the rotating portion 330 and the straightening vane 320 of the rectifying member 300A, and is a view showing a cross section of the MA-MA cut surface of FIG. 13B. FIG. 13B is a top view showing the configuration of the rotating portion 330 and the straightening vane 320 of the straightening vane member 300A. 13C is a side view showing the configuration of the rotating portion 330 and the straightening vane 320 of the straightening member 300A, and is a view showing the arrowhead MB of FIG. 13B. 13D is a side view showing the configuration of the rotating portion 330 and the straightening vane 320 of the straightening member 300A, and is a view showing the arrowhead MC of FIG. 13B. FIG. 13E is a bottom view showing the configuration of the rotating portion 330 and the straightening vane 320 of the straightening member 300A, and is a view showing the arrowhead MD of FIG. 13A.

The straightening vane 320 is formed in a flat plate shape. However, the straightening vane 320 may be formed in a curved surface or a wavy shape. The straightening vane 320 is provided on the rotating portion 330 so as to extend from the rotating portion 330. It is sufficient that at least one straightening vane 320 is provided. As the material of the rectifying plate 320, for example, a resin material (for example, ABS resin) or a metal material (for example, aluminum or an aluminum alloy) is used.

The rotating portion 330 is a plate member formed in a disk shape. The rotating portion 330 includes a hole portion 331. The hole portion 331 is formed on the lower surface of the rotating portion 330. The protrusion 312 of the base 310A is inserted into the hole 331. The hole portion 331 is formed according to the shape of the protrusion portion 312. That is, the inner diameter of the hole portion 331 and the outer diameter of the protrusion portion 312 are adjusted to have substantially the same dimensions. Therefore, when the protrusion 312 is inserted into the hole 331, the rotating portion 330 is set so as not to come off from the base portion 310A. Further, the rotating portion 330 can be rotated around the protrusion 312 while the rotating portion 330 is attached to the base portion 310A.

The rotating portion 330 is provided with one or more straightening vanes 320. As the material of the rotating portion 330, for example, a resin material (for example, ABS resin) or a metal material (for example, aluminum or an aluminum alloy) is used. The rotating portion 330 and the straightening vane 320 may be integrally formed or may be formed separately.

Next, the configuration of the holding member 400 will be described. FIG. 14A is a cross-sectional view showing the configuration of the holding member 400, and is a view showing a cross section of the PA-PA cut surface of FIG. 14B. FIG. 14B is a top view showing the configuration of the holding member 400. 14C is a side view showing the configuration of the holding member 400, and is a view showing the arrow PB of FIG. 14B. 14D is a bottom view showing the configuration of the holding member 400, and is a view showing the arrowhead PD of FIG. 14A. The holding member 400 is still an example of the holding portion.

As shown in FIGS. 14A to 14D, the holding member 400 is formed in a cylindrical shape. The holding member 400 is provided with a first opening 401 and a second opening 402 at both ends of the cylinder. As shown in FIG. 14A, the holding member 400 is fixed to the circuit board 200 so as to cover the outer peripheral portions of the rotating portion 330 and the base portion 310A. At this time, the end portion on the side of the second opening 402 is fixed to the main surface of the circuit board 200 with, for example, a silicone-based adhesive.

The distance D3 from the inner wall of the upper surface (the upper surface of the paper surface in FIG. 8) of the holding member 400 on the first opening 401 side to the main surface of the circuit board 200 is the upper surface of the rotating portion 330 (the upper surface of the paper surface in FIG. 8). ) To the main surface of the circuit board 200 is set to be substantially the same as or slightly smaller than the distance D4. As a result, the inner wall of the upper surface of the holding member 400 can press the upper surface of the rotating portion, and the rotating portion 330 can be prevented from coming off from the base portion 310A. Further, the inner diameter of the first opening 401 is smaller than the inner diameter of the second opening 402. As shown in FIG. 8, the inner diameter of the first opening 401 is smaller than the outer diameter of the rotating portion 330. Therefore, when the holding member 400 is fixed to the circuit board 200, the rotating portion 330 can be prevented from falling out of the holding member 400.

Next, a method of attaching the rectifying member 300A to the circuit board 200 will be described.

As shown in FIG. 11A, the base portion 310A and the rotating portion 330 are combined by inserting the protrusion 312 of the base portion 310A into the hole portion 331 of the rotating portion 330. As a result, the rectifying member 330A is completed.

Next, the place where the rectifying member 300A is mounted on the circuit board 200 is determined according to the flow path of the assumed liquid phase refrigerant LP-COO. Then, on the main surface of the circuit board 200, the back surface (the surface shown in FIG. 11E) of the base portion 310A of the rectifying member 300A is attached to a place where the rectifying member 300A is mounted on the circuit board 200 by the above-mentioned adhesive. Then, the holding member 400 is fixed on the main surface of the circuit board 200 with the above-mentioned adhesive so as to cover the outer peripheral portions of the rotating portion 330 and the base portion 310A of the rectifying member 300A. As a result, the rectifying member 300A is mounted on the circuit board 200.

Next, a method of adjusting the orientation of the straightening vane 320 of the straightening vane 300A will be described. As shown in FIG. 8, the rotating portion 330 is attached to the base portion 310A so that the rotating portion 330 can rotate about the protrusion 312 with respect to the base portion 310A. Therefore, even after the straightening vane 300A is attached to the circuit board 200, the angle with respect to the base portion 310A can be adjusted by picking up the straightening vane 320 and rotating the rotating portion 330. The angle with respect to the base portion 310A is, for example, the angle formed by the CC line shown in FIG. 9 and the line along the straightening vane 320. As a result, the flow direction of the liquid phase refrigerant LP-COO can be adjusted, and the extending direction of the straightening vane 320 can be adjusted to the flow path of the liquid phase refrigerant LP-COO.

The diameters of the protrusions 312 and the holes 331 are set to be substantially the same so that the rotating portion 330 does not rotate due to the flow of the liquid phase refrigerant LP-COO. Therefore, the rotating portion 330 can be rotated when adjusting the orientation of the straightening vane 320, but does not rotate due to the pressure of the flow level of the liquid phase refrigerant LP-COO.

In the above description, it has been explained that the rectifying member 300A is mounted on the main surface of the circuit board 200. However, the rectifying member 300A can be mounted on the heating element 201 as well as the rectifying member 300.

FIG. 15 is a cross-sectional view showing a state in which the rectifying member 300A is attached to the heating element 201. As shown in FIG. 15, the rectifying member 300A is fixed on the heating element 201 by a silicone-based adhesive.

In this way, even when the rectifying member 300A is attached to the heating element 201, the inclination angle with respect to the base portion 310A can be adjusted by picking up the rectifying plate 320 and rotating the rotating portion 330. As a result, the flow direction of the liquid phase refrigerant LP-COO can be adjusted, and the extending direction of the straightening vane 320 can be adjusted to the flow path of the liquid phase refrigerant LP-COO.

The rectifying member 300A can be applied to any of the cooling devices 1000, 1000A, 1000B, and 1000C according to the first to third embodiments.

As described above, in the cooling device 1000 according to the first to third embodiments of the present invention, the rectifying plate 320 of the rectifying member 300A is provided so that the angle with respect to the base portion 310A can be adjusted. As a result, even after the straightening vane 300A is attached to the circuit board 200, the extending direction of the straightening vane 320 can be aligned with the flow path of the liquid phase refrigerant LP-COO. As a result, the flow direction of the liquid phase refrigerant LP-COO can be adjusted.

Further, the cooling device 1000 according to the first to third embodiments of the present invention includes a holding member 400 (holding portion). The holding member 400 holds the straightening vane 320 on the base portion 310A so that the angle with respect to the base portion 310A does not change. As a result, it is possible to prevent the angle with respect to the base portion 310A from being changed due to the movement of the rectifying member 320 after adjusting the angle.

<Second modification of the rectifying member>
Next, a second modification of the rectifying member will be described. FIG. 16 is a cross-sectional view showing a state in which the rectifying member 300B, which is a second modification of the rectifying member, is attached to the circuit board 200, and is a view showing a cross section of the DD cut surface of FIG. FIG. 17 is a top view showing a state in which the rectifying member 300B is attached to the circuit board 200. FIG. 18 is a side view showing a state in which the rectifying member 300B is attached to the circuit board 200.

FIG. 19A is a cross-sectional view showing the configuration of the rectifying member 300B, and is a view showing a cross section of the SA-SA cut surface of FIG. 19B. FIG. 19B is a top view showing the configuration of the rectifying member 300B. FIG. 19C is a side view showing the configuration of the rectifying member 300B, and is a view showing the arrowhead SB of FIG. 19B. FIG. 19D is a side view showing the configuration of the rectifying member 300B, and is a view showing the arrowhead SC of FIG. 19B. FIG. 19E is a bottom view showing the configuration of the rectifying member 300B, and is a view showing the arrowhead SD of FIG. 19A.

As shown in FIG. 16, the rectifying member 300B is attached to the circuit board 200. Further, the straightening vane member 300B includes a base portion 310B, a rotating portion 330B, and a straightening vane 320.

First, the configuration of the base portion 310B will be described. FIG. 20A is a cross-sectional view showing the configuration of the base portion 310B of the rectifying member 300B, and is a view showing a cross section of the TA-TA cut surface of FIG. 20B. FIG. 20B is a top view showing the configuration of the base portion 310B of the rectifying member 300B. 20C is a side view showing the configuration of the base portion 310B of the rectifying member 300B, and is a view showing the arrowhead TB of FIG. 20B. FIG. 20D is a bottom view showing the configuration of the base portion 310B of the rectifying member 300B, and is a diagram showing the arrow-viewing TD of FIG. 20A.

The base portion 310B includes a flat plate portion 311, a protrusion portion 312, and a rotation prevention portion 313. The rotation prevention unit 313 is an example of a holding unit. The flat plate portion 311 and the protrusion portion 312 are the same as those of the rectifying member 300A. The rotation prevention portion 313 is provided so that mountain valley-shaped steps are alternately formed along the outer peripheral portion of the flat plate portion 311. The flat plate portion 311 and the protrusion 312 and the rotation prevention portion 313 may be integrally formed or may be formed separately. As the material of the flat plate portion 311 and the protrusion 312 and the rotation prevention portion 313, for example, a resin material (for example, ABS resin) or a metal material (for example, aluminum or an aluminum alloy) is used.

Next, the configuration of the rotating portion 330B and the straightening vane 320 will be described. 21A is a cross-sectional view showing the configuration of the rotating portion 330B and the straightening vane 320 of the rectifying member 300B, and is a view showing a cross section of the UA-UA cut surface of FIG. 21B. FIG. 21B is a top view showing the configuration of the rotating portion 330B and the straightening vane 320 of the straightening vane member 300B. 21C is a side view showing the configuration of the rotating portion 330B and the straightening vane 320 of the straightening member 300B, and is a view showing the arrow view UB of FIG. 21B. 21D is a side view showing the configuration of the rotating portion 330B and the straightening vane 320 of the straightening member 300B, and is a view showing the arrow UC of FIG. 21B. 21E is a bottom view showing the configuration of the rotating portion 330B and the straightening vane 320 of the straightening member 300B, and is a view showing the arrow view UD of FIG. 21C.

The configuration of the straightening vane 320 is the same as that of the straightening vane 300A.

The rotating portion 330B is a plate member formed in a disk shape. The rotating portion 330B includes a hole portion 331 and a rotation preventing portion 332.

The hole portion 331 is formed in the central portion of the lower surface of the rotating portion 330B. The protrusion 312 of the base 310B is inserted into the hole 331. The hole portion 331 is formed according to the shape of the protrusion portion 312. That is, the inner diameter of the hole portion 331 and the outer diameter of the protrusion portion 312 are adjusted to have substantially the same dimensions. Therefore, when the protrusion 312 is inserted into the hole 331, the rotating portion 330B is set so as not to come off from the base portion 310B.

The rotation prevention portion 332 is provided so that mountain valley-shaped steps are alternately formed along the outer peripheral portion of the rotation portion 330B. The rotation prevention portion 332 fits with the rotation prevention portion 313 of the base portion 310B. Therefore, by fitting the rotation prevention portion 313 of the base portion 310B and the rotation prevention portion 313 of the rotation portion 330B to each other, it is possible to prevent the rotation portion 330B from rotating with respect to the base portion 310B.

The rotating portion 330B is provided with one or more straightening vanes 320. As the material of the rotating portion 330B, for example, a resin material (for example, ABS resin) or a metal material (for example, aluminum or an aluminum alloy) is used. The rotating portion 330B and the straightening vane 320 may be integrally formed or may be formed separately.

Next, a method of attaching the rectifying member 300B to the circuit board 200 will be described.

As shown in FIG. 19A, the base portion 310B and the rotating portion 330B are combined by inserting the protrusion 312 of the base portion 310B into the hole portion 331 of the rotating portion 330B. As a result, the rectifying member 300B is completed. At this time, the rotation prevention portion 313 of the base portion 310B and the rotation prevention portion 313 of the rotation portion 330B are fitted to each other. As a result, it is possible to prevent the rotating portion 330B from rotating with respect to the base portion 310B.

Next, the place where the rectifying member 300B is mounted on the circuit board 200 is determined according to the flow path of the assumed liquid phase refrigerant LP-COO. Then, on the main surface of the circuit board 200, the back surface (the surface shown in FIG. 19E) of the base portion 310B of the rectifying member 300B is attached to a place where the rectifying member 300B is mounted on the circuit board 200 with an adhesive.

Next, a method of adjusting the orientation of the straightening vane 320 of the straightening vane 300B will be described.
First, with the protrusion 312 of the base portion 310B inserted into the hole portion 331 of the rotating portion 330B, the fitting between the rotation prevention portion 313 of the base portion 310B and the rotation prevention portion 313 of the rotation portion 330B is released. In this state, the rotating portion 330B is rotated with respect to the base portion 310B to adjust the angle of the straightening vane 320 with respect to the base portion 310A. That is, after the straightening vane 300B is attached to the circuit board 200, the angle of the straightening vane 320 with respect to the base portion 310A can be adjusted without removing the straightening vane 300B from the circuit board 200. The angle with respect to the base portion 310A is, for example, the angle formed by the DD line shown in FIG. 17 and the line along the straightening vane 320. As a result, the flow direction of the liquid phase refrigerant LP-COO can be adjusted, and the extending direction of the straightening vane 320 can be adjusted to the flow path of the liquid phase refrigerant LP-COO.

In the above description, it has been explained that the rectifying member 300B is mounted on the main surface of the circuit board 200. However, the rectifying member 300B can be mounted on the heating element 201 as well as the rectifying member 300.

The rectifying member 300B can be applied to any of the cooling devices 1000, 1000A, 1000B, 1000C according to the first to third embodiments.

As described above, in the cooling devices 1000, 1000A, 1000B, 1000C according to the first to third embodiments of the present invention, the straightening vane 320 of the straightening vane member 300B is provided so that the angle with respect to the base portion 310B can be adjusted. .. As a result, even after the straightening vane 300B is attached to the circuit board 200, the extending direction of the straightening vane 320 can be aligned with the flow path of the liquid phase refrigerant LP-COO. As a result, the flow direction of the liquid phase refrigerant LP-COO can be adjusted.

Further, the cooling device 1000 according to the first to third embodiments of the present invention includes a rotation prevention unit 313 (holding unit). The rotation prevention unit 313 holds the straightening vane 320 on the base portion 310B so that the angle with respect to the base portion 310B does not change. As a result, it is possible to prevent the angle with respect to the base portion 310B from being changed by the movement of the rectifying member 320 after adjusting the angle.

Although the present invention has been described above with reference to the embodiments (and examples), the present invention is not limited to the above embodiments (and examples). Various modifications that can be understood by those skilled in the art can be made to the structure and details of the present invention within the scope of the present invention.

1000, 1000A, 1000B, 1000C Cooling device 100 Container 200 Circuit board 201 Heating element 300, 300A, 300B, 300a-300s Rectifier member 310, 310A, 310B Base part 311 Flat plate part 312 Protrusion part 313 Rotation prevention part 320 Rectifier plate 330, 330B Rotating part 331 Hole part 332 Rotation prevention part 400 Holding member 401 First opening 402 Second opening

Claims (8)

A container for enclosing a refrigerant that undergoes a phase change between a liquid phase refrigerant and a gas phase refrigerant,
A circuit board to which a heating element is attached and at least provided in the container so that the heating element is immersed in the liquid phase refrigerant.
A plurality of rectifying members provided on the circuit board and forming a flow path of the liquid phase refrigerant are provided .
The direction of the flow path formed by one of the plurality of rectifying members is different from the direction of the flow path formed by the other one of the plurality of rectifying members.
Cooling system. The cooling device according to claim 1, wherein at least one of the plurality of rectifying members is attached to the heating element. The cooling device according to claim 2, wherein the rectifying member not attached to the heating element among the plurality of rectifying members is mounted on the circuit board. The cooling device according to claim 2, wherein the rectifying member attached to the heating element is composed of a heat conductive member. The rectifying member is
The base and
The cooling device according to any one of claims 1 to 4, further comprising a straightening vane attached to the base portion and setting a flow direction of the liquid phase refrigerant. The cooling device according to claim 5, wherein the straightening vane is provided so that the angle with respect to the base portion can be adjusted. The cooling device according to claim 6, further comprising a holding portion for holding the straightening vane on the base portion so that the angle with respect to the base portion does not change. The cooling device according to any one of claims 5 to 6 , wherein the distance from the tip end portion of the straightening vane to the main surface of the circuit board is the same among each of the plurality of straightening vanes.

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