JP6989507B2 - heat sink - Google Patents

Description

The present invention relates to a heat sink for an LED that cools lighting using a light emitting diode (LED) element installed on a ceiling or the like.

Since LED lighting provided on the ceiling or the like is easily affected by heat in terms of life and luminous efficiency, it is necessary to always cool the LED lighting during light emission so as to maintain the temperature within an allowable range. A heat sink may be used to cool the LED lighting.

A power supply device is generally arranged on the upper surface of a conventional heat sink that cools LED lighting installed by being suspended from a ceiling or the like. This is because it is necessary to make the center of gravity of the lighting fixture the central portion of the lighting fixture from the installation mode of the LED lighting.

However, in the structure in which the power supply device is arranged on the upper surface of the heat sink, the power supply device receives the exhaust heat from the heat sink and becomes high in temperature, which causes a problem that the life of the power supply device is shortened. Further, since the LED has a longer life than the power supply device, there is a problem that the life of the lighting fixture itself is shortened as the life of the power supply device is shortened. Further, since the power supply device is arranged on the upper surface of the heat sink, there is a problem that the dimension in the height direction of the luminaire increases.

Therefore, by installing a heat shield member between the power supply device and the heat dissipation part of the lighting fixture provided with a large number of heat dissipation fins, the hot air exchanged by the heat dissipation part is blocked and the temperature rise of the power supply device is suppressed. Further, it has been proposed to reduce the overall height of the luminaire by making it possible to shorten the distance between the power supply device and the lamp (Patent Document 1). However, in Patent Document 1, the shielding member hinders the flow of air that cools the power supply as well as the hot air, so that the power supply cannot be sufficiently cooled, that is, the power supply becomes hot. was there. Further, in Patent Document 1, since the power supply device is still arranged on the upper surface of the heat radiating portion composed of a large number of radiating fins, there is a problem that the dimension in the height direction of the luminaire cannot be sufficiently reduced.

Japanese Unexamined Patent Publication No. 2012-129172

In view of the above circumstances, an object of the present invention is to prevent an appliance such as a power supply device from receiving heat exhausted from a heat sink, reduce the height dimension of the luminaire, and be installed in a cold region. It is an object of the present invention to provide a heat sink having a cooling function even when the working fluid of the heat pipe freezes and does not operate.

Aspects of the present invention are a base plate thermally connected to the LED module at the center portion on the back surface side, and a heat pipe provided on the front surface side of the base plate and having a heat receiving portion arranged at a position where the heat receiving portion overlaps with the LED module in a plan view. A heat sink having a plurality of flat plate-shaped heat radiating fins thermally connected to the heat pipe, and the heat radiating fins are not arranged at positions overlapping with the LED module in a plan view. At least one of the heat dissipation fins is a heat sink in contact with the base plate.

In the above aspect, the heat pipe (heat receiving portion of the heat pipe) is arranged at the position of the surface of the base plate that overlaps with the LED module in a plan view, that is, at the center of the surface of the base plate, but the heat radiation fins are arranged. Not. In the above aspect, the heat from the LED module to be cooled is transferred from the back surface to the front surface of the base plate in the thickness direction, and further transferred from the front surface of the base plate to the heat pipe (heat receiving portion of the heat pipe). The heat transferred to the heat receiving part of the heat pipe is transported from the heat receiving part of the heat pipe to the heat radiating part of the heat pipe corresponding to the part where the heat radiating fin is attached, and is externally transmitted from the heat radiating part of the heat pipe via the radiating fin. Released to the environment.

Further, in the above aspect, since the heat radiation fins are not arranged at the positions of the surface of the base plate that overlap with the LED module (that is, the central portion) in the plan view, the central portion of the base plate surface is partitioned by the heat radiation fins. It is a space part. In addition, in this specification, "plan view" means the aspect which was visually recognized from the side facing the surface of the base plate provided with the heat pipe and the heat radiation fin.

In an aspect of the present invention, the heat pipe has a U-shape consisting of a bottom portion and two straight portions extending from both ends of the bottom portion, and the bottom portion is thermally connected to the base plate. It is the heat receiving portion, and is a heat sink in which the heat radiating fins are thermally connected to the two straight portions.

In an aspect of the present invention, the heat pipe has an L-shape including a bottom portion and a straight portion extending from one end of the bottom portion, and the bottom portion is thermally connected to the base plate. It is the heat receiving portion, and is a heat sink in which the heat radiating fin is thermally connected to the straight portion.

In each of the above embodiments, in the U-shaped or L-shaped heat pipe, the straight portion to which the heat radiating fins are thermally connected functions as the heat radiating portion.

An aspect of the present invention is a U-shape in which a plurality of the heat pipes are provided and the bottom portion is composed of a bottom portion and two straight portions extending from both ends of the bottom portion, and the bottom portion is thermally connected to the base plate. From the heat receiving portion, the heat pipe to which the heat radiation fins are thermally connected to the two straight portions, and one straight portion extending from one end of the bottom portion and the bottom portion. It is an L-shaped heat sink having a heat receiving portion whose bottom portion is thermally connected to the base plate, and a heat pipe having the heat radiation fin thermally connected to the straight portion.

An aspect of the present invention is a heat sink in which the heat pipe has a stepped portion between the bottom portion and the straight portion.

In the embodiment of the present invention, the heat pipe has a U-shape including a bottom portion and two straight portions extending from both ends of the bottom portion, and one straight portion of the two straight portions is the straight portion. The heat receiving portion thermally connected to the base plate, and the other straight portion of the two straight portions is a heat sink thermally connected to the heat radiation fin. In the above aspect, of the two straight portions, the other straight portion to which the heat radiating fins are thermally connected functions as the heat radiating portion.

In the embodiment of the present invention, the flat surface portion of the heat radiation fin is a heat sink arranged in the vertical direction with respect to the surface of the base plate, passes through the center of gravity of the heat sink, and is parallel to the flat surface portion of the heat radiation fin. A heat sink in which the heat radiation fins and the heat pipes are arranged symmetrically with respect to a plane in the direction.

The aspect of the present invention is a heat sink in which the flat surface portion of the heat radiation fin is arranged in the vertical direction with respect to the surface of the base plate, and the heat radiation fin and the heat radiation fin are point-symmetrical with respect to the center of gravity of the heat sink in a plan view. It is a heat sink in which the heat pipe is arranged.

An aspect of the present invention is a heat sink in which a fixing member of a power supply device, an electronic component, a control device, or a lighting fixture is housed at a position that overlaps with the LED module in a plan view and does not overlap with the heat radiation fin in a plan view. ..

In the above aspect, the fixing member of the power supply device, the electronic component, the control device or the lighting fixture can be accommodated in the space partitioned by the heat radiation fins.

According to the aspect of the present invention, the central portion of the surface of the base plate is a space portion partitioned by the heat radiation fins. Therefore, by accommodating the equipment such as the power supply device in the space portion, the equipment such as the power supply device Can prevent the heat from being exhausted from the heat sink, and thus prevent the temperature of equipment such as a power supply device from becoming high. Further, according to the aspect of the present invention, the fixture such as a power supply device can be accommodated in the space, that is, the heat radiation fin is not arranged between the base plate and the fixture such as the power supply device, so that the height of the lighting fixture is high. Directional dimensions can be reduced.

Further, according to the aspect of the present invention, even when at least one of the plurality of heat dissipation fins is in contact with the base plate, the working fluid enclosed in the heat pipe freezes and does not operate even if it is installed in a cold region. Since heat is transferred from the base plate to the heat dissipation fins, the heat sink can exhibit cooling performance.

According to the aspect of the present invention, among the U-shaped heat pipes, the bottom portion is a heat receiving portion thermally connected to the base plate, and the two straight portions are thermally connected to the heat radiating fins. Since heat can be efficiently transferred from the portion of the base plate that overlaps with the LED module in plan view to the heat radiation fin that does not overlap with the LED module in plan view, the LED module can be efficiently cooled.

According to the aspect of the present invention, among the L-shaped heat pipes, the bottom portion is a heat receiving portion thermally connected to the base plate, and the straight portion is thermally connected to the heat radiating fin, whereby the plan view is taken. Since heat can be efficiently transported from the portion of the base plate that overlaps with the LED module to the heat radiation fin that does not overlap with the LED module in a plan view, the LED module can be efficiently cooled.

According to the aspect of the present invention, since the heat pipe has a stepped portion between the bottom portion and the straight portion, the heat pipe is placed in the central portion of the heat radiating fin without extending the heat radiating fin to the back surface side of the base plate. Since it can be attached, it is possible to improve the heat dissipation efficiency of the heat radiation fins while improving the degree of freedom in designing the shape and dimensions of the base plate.

According to the aspect of the present invention, of the U-shaped heat pipe, one straight portion is a heat receiving portion thermally connected to the base plate, and the other straight portion is thermally connected to the heat radiation fin. As a result, heat can be efficiently transferred from the portion of the base plate that overlaps with the LED module in plan view to the heat radiation fin that does not overlap with the LED module in plan view, so that the LED module can be efficiently cooled.

It is a perspective view from the bottom surface side of the heat sink which concerns on 1st Embodiment of this invention. It is explanatory drawing of the heat sink which concerns on 1st Embodiment of this invention. It is explanatory drawing of the usage example of the heat sink which concerns on 1st Embodiment of this invention. It is explanatory drawing of the mechanism of the heat transport of the heat sink which concerns on 1st Embodiment of this invention. It is explanatory drawing of the heat sink which concerns on 2nd Embodiment of this invention. It is explanatory drawing of the heat sink which concerns on 3rd Embodiment of this invention. It is explanatory drawing of the heat sink which concerns on 4th Embodiment of this invention. It is explanatory drawing of the heat sink which concerns on 5th Embodiment of this invention. It is explanatory drawing of the heat sink which concerns on 6th Embodiment of this invention.

Hereinafter, the heat sink according to the first embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, the heat sink 1 according to the first embodiment has a flat plate shape that is thermally connected to the LED module 100 on the heat receiving side surface (hereinafter, may be referred to as “back surface”). A heat pipe 11 thermally connected to the base plate 10 on a surface opposite to the heat receiving side of the base plate 10 (hereinafter, may be referred to as a "surface") and the base plate 10 (rectangular in a plan view in the figure). And a plurality of flat plate-shaped heat radiating fins 12 thermally connected to the heat pipe 11.

The heat sink 1 is provided with a plurality of heat pipes 11 (two in the figure). The shape and dimensions of the heat pipe 11 are not particularly limited, but in the heat sink 1, each heat pipe 11 has the same shape and dimensions, and the two straight portions 14 extending from both ends of the bottom portion 13 and the bottom portion 13. It has a U-shape consisting of 14'. The heat pipe 11 is thermally connected to the base plate 10 by contacting the bottom portion 13 with the surface of the base plate 10. The method of thermally connecting the heat pipe 11 to the base plate 10 is not particularly limited, but in the heat sink 1, a groove portion (not shown) is provided on the surface of the base plate 10, and the bottom portion 13 of the heat pipe 11 is fitted in the groove portion to fit the heat pipe. 11 is thermally connected to the base plate 10. Therefore, the bottom portion 13 functions as a heat receiving portion of the heat pipe 11.

The bottom portion 13 of each heat pipe 11 is in contact with the central portion of the surface of the base plate 10. Further, in the heat sink 1, the bottom portions 13 of the heat pipes 11 are arranged in parallel so as to be parallel to each other.

Since the LED module 100 is thermally connected to the central portion on the back surface side of the base plate 10, the bottom portion 13 of each heat pipe 11 is arranged at a position where the LED module 100 overlaps with the LED module 100 in a plan view. Therefore, the heat receiving portion of the heat pipe 11 can efficiently receive heat from the LED module 100.

The two straight portions 14, 14'of each heat pipe 11 extend from the central portion of the surface of the base plate 10 toward the peripheral portion. Further, both of the two straight portions 14 and 14'extend parallel to or substantially parallel to the surface of the base plate 10. In the heat sink 1, the two straight portions 14, 14'of each heat pipe 11 project to the outside of the end face of the base plate 10. Further, of the two heat pipes 11, the two straight portions 14, 14'of one heat pipe 11 extend in the opposite direction to the two straight portions 14, 14'of the other heat pipe 11. ing. Therefore, the two heat pipes 11 are arranged in a plane-symmetrical relationship with respect to the central portion of the surface of the base plate 10.

By attaching a plurality of heat radiating fins 12 to the two straight portions 14 and 14'of the heat pipe 11, the heat pipe 11 is thermally connected to the plurality of heat radiating fins 12. In the heat sink 1, the two straight portions 14, 14'are attached to a common heat radiation fin 12. The mounting method is not particularly limited, but in the heat sink 1, each heat radiation fin 12 is provided with two through holes (not shown), and the straight portions 14 and 14'of the heat pipe 11 are inserted into the through holes. The heat pipe 11 is thermally connected to the heat dissipation fin 12. Therefore, of the straight portions 14 and 14', the portion to which the heat radiating fin 12 is attached functions as the heat radiating portion of the heat pipe 11.

In the heat sink 1, the heat radiating fins 12 are attached so that the flat surface portion of the radiating fins 12 is orthogonal or substantially orthogonal to the longitudinal direction of the straight line portions 14, 14'. Further, the flat surface portion of the heat radiation fin 12 is arranged vertically or substantially vertically with respect to the surface of the base plate 10. Further, the respective heat radiating fins 12 are arranged in parallel along the longitudinal direction of the straight lines 14 and 14'so that the flat surface portion is parallel or substantially parallel to the flat surface portion of the other adjacent heat radiating fins 12. Has been done.

The heat pipe 11 is provided with a step portion 16 between the bottom portion 13 and the straight portions 14, 14'. The step portion 16 is a step in the direction opposite to the base plate 10 side. That is, the straight portions 14, 14'are not in contact with the base plate 10. Therefore, the straight portions 14 and 14'of the heat pipe 11 are attached to the central portion of the heat radiation fin 12 without extending the heat radiation fin 12 to the back surface side of the base plate 10. Therefore, in the heat sink 1, it is possible to improve the heat dissipation efficiency of the heat dissipation fins 12 while improving the degree of freedom in designing the shape and dimensions of the base plate 10.

Since one heat pipe 11 and the other heat pipe 11 are provided with the same number of heat radiation fins 12 having the same size and shape at the same intervals, the heat radiation fins 12 are provided with respect to the central portion of the surface of the base plate 10. They are arranged in a plane-symmetrical relationship. As described above, since the two heat pipes 11 are arranged in a plane-symmetrical relationship with respect to the central portion of the surface of the base plate 10, in the heat sink 1, the heat sink 1 passes through the center of gravity of the heat sink 1 and the heat radiation fins 12 are arranged. The heat dissipation fins 12 and the heat pipes 11 are arranged symmetrically with respect to the plane in the direction parallel to the flat surface portion.

As shown in FIGS. 1 and 2, in the heat sink 1, the heat radiation fins 12 are attached to the straight portions 14 and 14'of the heat pipe 11 so that the heat radiation fins 12 are not arranged at the center of the surface of the base plate 10. .. The heat radiation fins 12 are not provided at positions where they overlap with the LED module 100 in a plan view. That is, the heat radiation fins 12 are arranged at the peripheral edge of the base plate 10 and outside the base plate 10.

From the above, in the region of the surface of the base plate 10 where the heat radiation fins 12 are not arranged and which overlaps with the LED module 100 in a plan view, the space portion 15 is formed on the surface of the base plate 10.

Further, among the plurality of heat radiation fins 12, some of the heat radiation fins 12 are in contact with the surface of the base plate 10. In the heat sink 1, among the plurality of heat radiation fins 12, the region overlapping the base plate 10 in a plan view, that is, the heat radiation fins 12 arranged on the peripheral edge of the base plate 10 are in contact with the surface of the base plate 10.

Therefore, even when the heat sink 1 is installed in a cold region and the working fluid enclosed in the heat pipe 11 freezes and does not operate, heat is transferred from the base plate 10 to the heat radiation fin 12 in contact with the surface of the base plate 10. , The heat sink 1 can exhibit cooling performance. Therefore, even if the heat sink 1 is used in a cold region, the deterioration of the cooling performance of the heat sink 1 can be suppressed.

The materials of the base plate 10 and the heat radiation fins 12 are both metals having good thermal conductivity, and are manufactured of, for example, aluminum, an aluminum alloy, copper, a copper alloy, or the like. Examples of the material of the container of the heat pipe 11 include copper, copper alloy, aluminum, aluminum alloy, stainless steel and the like, and the working fluid enclosed in the container of the heat pipe 11 is compatible with the material of the container. It can be appropriately selected depending on the sex, and examples thereof include water, alternative fron, perfluorocarbon, and cyclopentane.

Next, an example of how to use the heat sink 1 according to the first embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 3 and 4, in the heat sink 1, the space portion 15 can accommodate a power supply device, an electronic component, a control device, a fixing member of a lighting fixture, or the like (power supply device 101 in FIGS. 3 and 4). .. On the other hand, as shown in FIG. 4, the heat H from the LED module 100 is first transmitted to the central portion of the base plate 10, and further transferred from the central portion of the base plate 10 to the heat pipe 11 (heat receiving portion of the heat pipe 11). , It is transported from the heat receiving portion of the heat pipe 11 to the heat radiating portion of the heat pipe 11 corresponding to the portion to which the radiating fin 12 is attached, and is discharged from the heat radiating portion of the heat pipe 11 to the external environment via the radiating fin 12.

Therefore, as shown in FIG. 4, it is possible to prevent the power supply device 101 from receiving the heat H from the heat sink 1, and by extension, prevent the power supply device 101 from becoming hot. Therefore, it is possible to prevent the life of the power supply device 101 from being shortened by receiving heat H, and as a result, it is possible to prevent the life of the lighting fixture itself from being shortened. Further, in the heat sink 1, the power supply device 101 can be accommodated in the space portion 15, and since the heat radiation fins 12 are not arranged between the base plate 10 and the power supply device 101, the dimensions in the height direction can be reduced.

Of the U-shaped heat pipe 11, the bottom portion 13 arranged in the central portion of the base plate 10 functions as a heat receiving portion thermally connected to the base plate 10, and is directed from the central portion to the peripheral portion of the base plate 10. The two extending straight portions 14, 14'are thermally connected to the heat radiation fin 12. Therefore, in the heat sink 1, the heat dissipation fins 12 provided on the peripheral edge portion and the outer side of the base plate 10 which do not overlap with the LED module 100 in the plan view are efficiently moved from the central portion of the base plate 10 which overlaps with the LED module 100 in the plan view. Since heat can be transported, the LED module 100 can be efficiently cooled.

Next, the heat sink according to the second embodiment of the present invention will be described with reference to the drawings. The same components as those of the heat sink according to the first embodiment will be described with reference to the same reference numerals.

In the heat sink according to the first embodiment, the U-shaped heat pipe is provided with a stepped portion, but instead, as shown in FIG. 5, the heat sink according to the second embodiment has a U-shape. The shape of the heat pipe is not provided with a step. In the heat sink 2 according to the second embodiment, the straight portions 14, 14'of the U-shaped heat pipe 21 are in contact with the surface of the base plate 10 at a portion overlapping the base plate 10 in a plan view. Therefore, among the plurality of heat radiation fins 12, the heat radiation fins 12 arranged at the portion overlapping the base plate 10 in a plan view are thermally connected to the heat pipe 21 at the end portion on the base plate 10 side, and further, the base plate 10 is further connected. It is in contact with the surface.

Also in the heat sink 2, of the U-shaped heat pipe 21, the bottom portion 13 arranged in the central portion of the base plate 10 functions as a heat receiving portion thermally connected to the base plate 10, and the peripheral portion from the central portion of the base plate 10 functions as a heat receiving portion. Two straight portions 14, 14'extending in the direction of the portion are thermally connected to the heat radiating fin 12. Therefore, heat can be efficiently transferred from the central portion of the base plate 10 that overlaps the LED module (not shown) to the heat radiation fins 12 provided on the peripheral portion and the outer side of the base plate 10 in a plan view, and the LED module can be efficiently cooled. can.

Even in the heat sink 2, since the power supply device or the like (not shown) can be accommodated in the space portion 15, it is possible to prevent the power supply device or the like from receiving heat from the heat sink 2, and further reduce the dimension in the height direction. can. Further, also in the heat sink 2, since some of the heat radiating fins 12 out of the plurality of heat radiating fins 12 are in contact with the surface of the base plate 10, the heat sink 2 is installed in a cold region and the heat pipe 21 is installed. Even when the working fluid freezes, heat is transferred from the base plate 10 to the heat radiating fins 12 in contact with the surface of the base plate 10, so that the heat sink 2 can exhibit cooling performance.

Next, the heat sink according to the third embodiment of the present invention will be described with reference to the drawings. The same components as those of the heat sink according to the first and second embodiments will be described with reference to the same reference numerals.

The heat sink according to the first embodiment is provided with two U-shaped heat pipes 11, but instead, as shown in FIG. 6, the heat sink according to the third embodiment is U-shaped. Four heat pipes in the shape are provided. In the heat sink 3 according to the third embodiment, another U-shaped heat pipe 31 is adjacent to each U-shaped heat pipe 11 provided in the heat sink 1 according to the first embodiment. Are provided in two.

The width between the two straight portions 34, 34'of the other heat pipe 31 is wider than the width between the two straight portions 14, 14'of the heat pipe 11. Further, the two straight portions 34, 34'of the other heat pipe 31 extend parallel to or substantially parallel to the two straight portions 14, 14'of the heat pipe 11. In the heat sink 3, the two straight portions 14, 14'of the heat pipe 11 and the two straight portions 34, 34'of the other heat pipe 31 are attached to the common heat dissipation fins 12.

In the heat sink 3, the bottom portion 33 of the other heat pipe 31 is also thermally connected to the central portion of the surface of the base plate 10. The longitudinal dimension of the bottom 33 of the other heat pipe 31 is larger than the longitudinal dimension of the bottom 13 of the heat pipe 11. Further, the bottom portion 33 of the other heat pipe 31 is arranged adjacent to the outside of the bottom portion 13 of the heat pipe 11 and parallel to or substantially parallel to the bottom portion 13 of the heat pipe 11.

Like the heat pipe 11, the other heat pipe 31 is provided with a step portion 36 between the bottom portion 33 and the straight portions 34, 34'. The step portion 36 is a step in the direction opposite to the base plate 10 side. Therefore, the straight portions 34, 34'of the other heat pipes 31 are not in contact with the base plate 10.

In the heat sink 3, in addition to the heat pipe 11, another heat pipe 31 is further provided, so that the heat transport characteristics are further improved from the central portion of the base plate 10 to the peripheral portion of the base plate 10 and the heat dissipation fins 12 on the outside. Therefore, the LED module can be cooled more efficiently.

Further, even in the heat sink 3, since the power supply device or the like (not shown) can be accommodated in the space portion 15, it is possible to prevent the power supply device or the like from receiving heat from the heat sink 3, and further, the dimensions in the height direction. Can be reduced. Further, also in the heat sink 3, since some of the heat radiating fins 12 out of the plurality of heat radiating fins 12 are in contact with the surface of the base plate 10, the heat sink 3 is installed in a cold region and becomes a heat pipe 11. Even when the working fluid of the other heat pipe 31 freezes, heat is transferred from the base plate 10 to the heat radiating fins 12 in contact with the surface of the base plate 10, so that the heat sink 3 can exhibit cooling performance.

Next, the heat sink according to the fourth embodiment of the present invention will be described with reference to the drawings. The same components as those of the heat sink according to the first to third embodiments will be described with reference to the same reference numerals.

The heat sink according to the first embodiment is provided with two U-shaped heat pipes, but instead, as shown in FIG. 7, the heat sink according to the fourth embodiment is L-shaped. Four heat pipes are provided. The L-shaped heat pipe 41 provided in the heat sink 4 according to the fourth embodiment includes a bottom portion 43 and one straight portion 44 extending from one end of the bottom portion 43. The L-shaped heat pipe 41 is provided with a step portion 46 between the bottom portion 43 and the straight portion 44. The step portion 46 is a step in the direction opposite to the base plate 10 side. Therefore, the straight line portion 44 is not in contact with the base plate 10.

In the heat sink 4, the bottom portion 43 of each of the four L-shaped heat pipes 41 is arranged at the center of the base plate 10. Further, in each of the four L-shaped heat pipes 41, the straight portion 44 extends from the central portion of the surface of the base plate 10 toward the peripheral portion.

In the heat sink 4, the two L-shaped heat pipes 41 are arranged so that the bottom portions 43 of each other are adjacent to each other and the straight portions 44 of each other face each other and are parallel or substantially parallel to each other in the longitudinal direction thereof. , Combined in a U-shape. Therefore, two U-shapes are formed from the four L-shaped heat pipes 41. Further, in the heat sink 4, the heat radiation fins 12 and the L-shaped heat pipe 41 are arranged point-symmetrically with respect to the center of gravity (center point of the surface of the base plate 10) in the plan view of the heat sink 4.

The heat sink 4 can also efficiently cool the LED module because heat can be efficiently transferred from the central portion of the base plate 10 that overlaps the LED module 100 to the peripheral edge portion of the base plate 10 and the heat radiation fins 12 on the outside in a plan view.

Further, even in the heat sink 4, since the power supply device or the like (not shown) can be accommodated in the space portion 15, it is possible to prevent the power supply device or the like from receiving heat from the heat sink 4, and further, the dimensions in the height direction. Can be reduced. Further, also in the heat sink 4, since some of the heat radiating fins 12 out of the plurality of heat radiating fins 12 are in contact with the surface of the base plate 10, the heat sink 4 is installed in a cold region and L-shaped heat is generated. Even when the working fluid of the pipe 41 freezes, heat is transferred from the base plate 10 to the heat radiating fins 12 in contact with the surface of the base plate 10, so that the heat sink 4 can exhibit cooling performance.

Next, the heat sink according to the fifth embodiment of the present invention will be described with reference to the drawings. The same components as those of the heat sink according to the first to fourth embodiments will be described with reference to the same reference numerals.

In the heat sink according to the first to third embodiments, the bottom portion of the U-shaped heat pipe is attached to the central portion of the surface of the base plate, but instead, as shown in FIG. 8, In the heat sink 5 according to the fifth embodiment, one of the two straight portions (one straight portion 14 and the other straight portion 14') of the U-shaped heat pipe 51 (one straight portion in the figure). 14) is attached to the central portion of the surface of the base plate 10.

The U-shaped heat pipe 51 is thermally connected to the base plate 10 by attaching one straight portion 14 to the central portion of the surface of the base plate 10. In the heat sink 5, the other straight portion 14'of the U-shaped heat pipe 51 is not in contact with the base plate 10 and extends parallel to or substantially parallel to the surface of the base plate 10. By attaching a plurality of heat radiation fins 12 to the other straight portion 14', the U-shaped heat pipe 51 and the heat radiation fins 12 are thermally connected. In the heat sink 5, all the heat radiation fins 12 are in contact with the surface of the base plate 10 at the end portion on the base plate 10 side.

One straight line portion 14 and the other straight line portion 14'extend from a predetermined end portion of the base plate 10 to an end portion facing the predetermined end portion. The bottom portion 13 of the U-shaped heat pipe 51 is not in contact with the base plate 10, and is erected at or near a predetermined end of the base plate 10 at a predetermined angle with respect to the surface of the base plate 10. It is an aspect.

In the heat sink 5, a plurality of (four in the figure) U-shaped heat pipes 51 are provided, and in each U-shaped heat pipe 51, one straight line portion 14 is arranged adjacent to each other in parallel. There is. Further, in each U-shaped heat pipe 51, the bottom portion 13 thereof is erected at different angles with respect to the surface of the base plate 10. Further, in each of the U-shaped heat pipes 51, the bottom portions 13 thereof are arranged on substantially the same plane (on a plane in a substantially vertical direction with respect to the surface of the base plate 10).

Even with the heat sink 5, the heat dissipation fins 12 can be attached to the U-shaped heat pipe 51 so as to form a space 15 in a region of the surface of the base plate 10 that overlaps with the LED module (not shown) in a plan view. By accommodating the power supply device or the like (not shown) in the space portion 15, it is possible to prevent the power supply device or the like from receiving heat from the heat sink 5, and further, the dimension in the height direction can be reduced.

Further, in the heat sink 5, one straight line portion 14 and the other straight line portion 14'extend from a predetermined end portion of the base plate 10 to an end portion facing the predetermined end portion, so that the LED is viewed in a plan view. Since heat can be efficiently transferred from the central portion of the base plate 10 that overlaps the module (not shown) to the heat dissipation fin 12 at the peripheral portion of the base plate 10, the LED module can be efficiently cooled. Further, in the heat sink 5, all the heat radiation fins 12 are in contact with the surface of the base plate 10. Therefore, when the heat sink 5 is installed in a cold region and the working fluid of the U-shaped heat pipe 51 freezes. However, since heat is transferred from the base plate 10 to the heat radiating fins 12 in contact with the surface of the base plate 10, the heat sink 5 can exhibit cooling performance.

Further, in the heat sink 5, since the bottom portion 13 of the U-shaped heat pipe 51 is erected at a predetermined angle with respect to the surface of the base plate 10, a stepped portion is provided on the U-shaped heat pipe 51. The other straight portion 14'of the U-shaped heat pipe 51 can be attached to the central portion of the heat radiating fin 12 without extending the heat radiating fin 12 to the back surface side of the base plate 10.

Next, the heat sink according to the sixth embodiment of the present invention will be described with reference to the drawings. The same components as those of the heat sink according to the first to fifth embodiments will be described with reference to the same reference numerals.

In the heat sink according to the fifth embodiment, the bottom portions 13 of the U-shaped heat pipes were all arranged substantially on the same plane as each other, but instead, as shown in FIG. In the heat sink according to the sixth embodiment, a plurality of U-shaped heat pipes are provided, and the bottom portions thereof are arranged so as to face each other.

In the heat sink 6 according to the sixth embodiment, ten U-shaped heat pipes 61 (U-shaped heat pipes 61-1 and U-shaped heat pipes 61-2) are provided, and the bottom of the U-shaped shape is provided. The portions 13 are arranged in a staggered manner on the surface of the base plate 10. That is, of the 10 U-shaped heat pipes 61, in FIG. 9, the five U-shaped heat pipes 61- are arranged so that the bottom portion 13 is arranged on the right peripheral portion on the surface of the base plate 10. 1 is installed. Further, five U-shaped heat pipes 61-2, which are different from the U-shaped heat pipes 61-1, are installed so that the bottom portion 13 is arranged on the left peripheral portion on the surface of the base plate 10. Has been done. The U-shaped heat pipe 61-1 having the bottom 13 arranged on the right peripheral edge and the U-shaped heat pipe 61-2 having the bottom 13 arranged on the left peripheral edge are on the flat surface of the heat radiation fin 12. On the other hand, they are arranged alternately in the parallel direction.

In each of the U-shaped heat pipes 61-1 in which the bottom portion 13 is arranged on the right peripheral portion, the bottom portions 13 are substantially on the same plane as each other (a plane in a substantially vertical direction with respect to the surface of the base plate 10). It is located at (above). Further, in each of the U-shaped heat pipes 61-2 in which the bottom portion 13 is arranged on the left peripheral portion, the bottom portions 13 are substantially on the same plane as each other (in the substantially vertical direction with respect to the surface of the base plate 10). (On the plane of). The bottom portion 13 of the U-shaped heat pipe 61 is vertically erected with respect to the surface of the base plate 10.

Further, in the heat sink 6, the heat radiation fins 12 and the U-shaped heat pipe 61 are arranged point-symmetrically with respect to the center of gravity (center point of the surface of the base plate 10) in the plan view of the heat sink 6. In the heat sink 6, all the heat radiation fins 12 are in contact with the surface of the base plate 10.

Even in the heat sink 6, since the heat dissipation fins 12 can be arranged so as to form the space portion 15 in the region of the surface of the base plate 10 that overlaps with the LED module (not shown) in a plan view, a power supply device or the like can be arranged in the space portion 15 (FIG. By accommodating (not shown), it is possible to prevent the power supply device and the like from receiving heat from the heat sink 6, and further, it is possible to reduce the dimensions in the height direction.

Further, in the heat sink 6, since all the heat radiation fins 12 are in contact with the surface of the base plate 10, even if the heat sink 6 is installed in a cold region and the working fluid of the U-shaped heat pipe 61 freezes, the base plate Since heat is transferred from 10 to the heat radiating fins 12 in contact with the surface of the base plate 10, the heat sink 6 can exhibit cooling performance.

Further, in the heat sink 6, since the bottom portion 13 of the U-shaped heat pipe 61 is erected with respect to the surface of the base plate 10, the U-shaped heat pipe 61 does not need to have a stepped portion. The U-shaped heat pipe 61 can be attached to the central portion of the heat radiating fin 12 without extending the heat radiating fin 12 to the back surface side of the base plate 10.

Next, another embodiment of the heat sink of the present invention will be described. In each of the above embodiments, the base plate has a rectangular shape in a plan view, but the shape is not particularly limited, and may be, for example, a circular shape, a polygonal shape of pentagons or more, a square shape, a long shape, or the like. In the heat sink of each of the above embodiments, the LED module is thermally connected to the center portion on the back surface side of the base plate, but the LED module may be thermally connected to the peripheral edge portion on the back surface side.

In each of the above embodiments, either a U-shaped heat pipe or an L-shaped heat pipe was used, but instead of this, a U-shaped heat pipe and an L-shaped heat pipe are used in combination. You may.

The heat sink of the present invention can prevent an appliance such as a power supply device from receiving waste heat from the heat sink, can exhibit cooling performance even if the working fluid of the heat pipe freezes in a cold region, and can exhibit cooling performance, and the height of the lighting appliance. Since the dimension in the direction can be reduced, for example, it has high utility value in the field of cooling LED lighting installed in a ceiling or an environment where air conditioning does not work.

1, 2, 3, 4, 5, 6 Heat sink 10 Base plate 11, 21, 31, 41, 51, 61 Heat pipe 12 Heat dissipation fins

Claims (9)

A base plate that is thermally connected to the LED module at the center of the back surface side, a heat pipe that is provided on the front surface side of the base plate and has a heat receiving portion arranged at a position that overlaps with the LED module in a plan view, and the heat pipe. A heat sink having a plurality of flat plate-shaped heat radiating fins, which are thermally connected.
The heat radiation fins are not arranged at positions overlapping with the LED module in a plan view, and at least one of the plurality of heat radiation fins is in contact with the base plate.
The portion of the heat pipe to which the heat radiation fins are thermally connected extends from the central portion of the surface of the base plate toward the peripheral portion to the outside of the end face of the base plate.
Among the plurality of heat radiation fins, the heat pipe intermediate portion is fitted into the heat radiation fins arranged in the region overlapping the base plate in the plan view, so that the heat pipes are arranged in the region overlapping the base plate in the plan view. the heat radiating fins, the contact with the heat pipe thermally connected to and the surface of the base plate, the heat radiating fins arranged in a region that does not overlap with the base plate in a plan view, of the heat pipe, the base plate end surface A heat sink in which an end portion extending to the outside of the heat pipe is fitted and the heat radiation fins arranged in a region that does not overlap with the base plate in a plan view are thermally connected only to the heat pipe. The heat pipe has a U-shape consisting of a bottom portion and two straight portions extending from both ends of the bottom portion, and the bottom portion is the heat receiving portion thermally connected to the base plate. The heat sink according to claim 1, wherein the heat radiation fins are thermally connected to the two straight portions. The heat pipe has an L-shape consisting of a bottom portion and a straight portion extending from one end of the bottom portion, and the bottom portion is thermally connected to the base plate in the heat receiving portion. The heat sink according to claim 1, wherein the heat radiation fins are thermally connected to the straight line portion. The heat receiving portion is provided with a plurality of heat pipes and has a U-shape consisting of a bottom portion and two straight portions extending from both ends of the bottom portion, and the bottom portion is thermally connected to the base plate. It has an L-shape consisting of a heat pipe in which the heat radiation fins are thermally connected to the two straight portions, and a straight portion extending from one end of the bottom portion and the bottom portion. The heat sink according to claim 1, wherein the bottom portion is the heat receiving portion thermally connected to the base plate, and the heat pipe having the heat radiation fins thermally connected to the straight portion. The heat sink according to any one of claims 2 to 4, wherein the heat pipe has a stepped portion between the bottom portion and the straight portion. The heat pipe has a U-shape consisting of a bottom portion and two straight portions extending from both ends of the bottom portion, and one straight portion of the two straight portions is thermally connected to the base plate. The heat sink according to claim 1, wherein the heat receiving portion is the heat receiving portion, and the other straight portion of the two straight portions is thermally connected to the heat radiation fin. The flat surface portion of the heat radiation fin is a heat sink arranged in the vertical direction with respect to the surface of the base plate, passes through the center of gravity of the heat sink, and is parallel to the flat surface portion of the heat radiation fin. The heat sink according to any one of claims 1 to 6, wherein the heat radiation fin and the heat pipe are arranged symmetrically. The flat surface portion of the heat radiation fin is a heat sink arranged in the vertical direction with respect to the surface of the base plate, and the heat radiation fin and the heat pipe are arranged point-symmetrically with respect to the center of gravity of the heat sink in a plan view. The heat sink according to any one of claims 1 to 6. 1 The heat sink described in the section.

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