JP7001729B2 - Printing equipment - Google Patents

Description

The present invention relates to a printing apparatus.

Conventionally, a screen printing device that prints on a substrate under a screen mask by moving the solder on the screen mask with a squeegee has been known. For example, Patent Document 1 discloses a printing device provided with two squeegees in the front-rear direction and printing on a substrate continuously carried in by alternately switching the printing direction. In this printing device, a paste recovery scoop for collecting solder is provided at each of the stroke ends of the two squeegees, and after printing is completed, the paste recovery scoop is raised while the paste recovery scoop is collecting the solder. This makes it possible to change the setup of the screen mask.

Japanese Unexamined Patent Publication No. 2006-62209

In the above-mentioned printing apparatus of Patent Document 1, although it is described that the solder is recovered by the recovery scoop in order to enable the setup change of the screen mask, it is mentioned that the recovery scoop is used for other purposes. It has not been.

An object of the present invention is to provide a printing apparatus capable of more appropriately printing using a recovery plate for recovering solder.

The present invention has taken the following measures to achieve the above-mentioned main object.

The first printing apparatus of the present invention is
A printing device that prints on a substrate under the screen mask by moving the solder on the screen mask.
With a squeegee that can move the solder on the screen mask,
A recovery plate that can recover the solder on the screen mask and
A means of transportation that can move the squeegee and the recovery plate,
A control means for controlling the moving means and
Equipped with
The control means controls the printing control of controlling the moving means to move the squeegee in the first direction to move the solder from the start position to the end position and printing on the substrate, and the moving means. The solder recovery control in which the solder is recovered on the recovery plate at the end position by moving the squeegee or the recovery plate, and the recovery plate in which the squeegee and the solder are recovered by controlling the moving means are described. The gist is to execute solder movement control for moving the squeegee and the solder to the start position by moving the squeegee and the solder in the second direction opposite to the first direction.

The first printing apparatus of the present invention is provided with a recovery plate capable of recovering the solder on the screen mask. Then, the printing apparatus executes printing control, solder recovery control, and solder movement control. The print control moves the solder from the start position to the end position by moving the squeegee in the first direction to print on the board, and the solder recovery control moves the solder at the end position by moving the squeegee or the recovery plate. Collect on a collection plate. Further, in the solder movement control, the squeegee and the solder are moved to the start position by moving the squeegee and the recovery plate from which the solder is collected in the second direction opposite to the first direction. As a result, the printing direction can always be the same (first direction) with respect to the substrate, so that the printing quality can be stabilized. As a result, printing can be performed more appropriately using the recovery plate that recovers the solder.

In such a first printing apparatus of the present invention, the control means, as the solder recovery control, moves the recovery plate along the upper surface of the screen mask after executing the printing control at the end position. It is also possible to collect the solder. In this way, the solder can be scooped up and recovered with the recovery plate.

Further, in the first printing apparatus of the present invention, it is also possible to provide a suction means for sucking the recovery plate on the screen mask. In this way, the screen mask can be held by the recovery plate and the bending of the screen mask can be suppressed.

Further, in the first printing apparatus of the present invention, it is also possible to provide a temperature adjusting means capable of adjusting the temperature of the upper surface of the recovery plate. By doing so, it is possible to more easily control the temperature of the solder as compared with the one that controls the atmospheric temperature in the printing apparatus.

Further, the first printing apparatus of the present invention may be provided with a load detecting means capable of detecting the load of the recovery plate. By doing so, the weight of the solder collected on the recovery plate can be detected, and the remaining amount of the solder can be appropriately managed.

The second printing apparatus of the present invention is
A printing device that prints on a substrate under the screen mask by moving the solder on the screen mask.
With the first and second squeegees that can move the solder on the screen mask,
A means of transportation capable of moving the first squeegee and the second squeegee,
A first recovery plate capable of recovering solder at the first position on the screen mask,
A second recovery plate capable of recovering solder at the second position on the screen mask,
A first adsorption means for adsorbing the first recovery plate on the screen mask,
A second adsorption means for adsorbing the second recovery plate on the screen mask,
The first suction means and the second suction means are controlled to suck the first recovery plate to the first position on the screen mask, and the second recovery plate is moved to the second position on the screen mask. By controlling the suction control for suction and the moving means to move the first squeegee in the first direction during the execution of the suction control, the solder is moved from the first position to the second position for printing. During the execution of the first printing control and the suction control, the moving means is controlled to move the second squeegee in the second direction opposite to the first direction, whereby the solder is moved from the second position to the second position. A control means that can execute a second print control that moves to the first position and prints, and a control means that can execute the second print control.
The gist is to prepare.

The second printing apparatus of the present invention comprises a first squeegee and a second squeegee at a first recovery plate capable of recovering solder at a first position on the screen mask and a second position on the screen mask. A second recovery plate capable of recovering the solder and a first suction means and a second suction means are provided. Then, the printing apparatus executes adsorption control, first printing control, and second printing control. In the suction control, the first suction means and the second suction means are controlled to suck the first recovery plate to the first position on the screen mask and the second recovery plate to the second position on the screen mask. Further, in the first print control, the solder is moved from the first position to the second position by moving the first squeegee in the first direction to perform printing, and in the second print control, the second squeegee is moved in the second direction. By moving the solder to the first position, the solder is moved from the second position to the first position for printing. Thereby, the screen mask can be held by the first recovery plate and the second recovery plate, and the bending of the screen mask can be suppressed. As a result, printing can be performed more appropriately using the recovery plate that recovers the solder.

In such a second printing apparatus of the present invention, the first transport means for transporting the substrate on the first lane, the second transport means arranged in parallel with the first lane and transporting the substrate on the second lane, and the like. The moving means can move the first squeegee and the second squeegee in an orthogonal direction orthogonal to the transport direction of the substrate across the first lane and the second lane. The first recovery plate and the second recovery plate can be moved in the orthogonal direction across the first lane and the second lane independently of the first squeegee and the second squeegee. The control means executes the suction control while executing the first print control or the second print control on the first lane or the second lane, and the first lane and the second lane. When the execution target of the first print control or the second print control is switched from one lane of the lanes to the other lane, the execution of the suction control is canceled and the moving means is controlled to control the first squeegee and the first squeegee. The second squeegee and the first recovery plate and the second recovery plate may be moved onto the other lane. By doing so, the solder can be shared between the plurality of lanes by using the first recovery plate and the second recovery plate, so that it is not necessary to place the solder in each of the plurality of lanes. As a result, the area occupied by the solder with respect to the screen mask can be reduced, the screen mask can be miniaturized, and the printable area can be expanded.

It is a block diagram which shows the outline of the structure of the printing apparatus 10 of this embodiment. It is a block diagram which shows the outline of the structure of the 1st solder recovery device 50. It is a block diagram which shows the electrical connection relation of the control apparatus 70 of a printing apparatus 10. It is a flowchart which shows an example of the bidirectional printing process. It is explanatory drawing which shows the state of bidirectional printing. It is a flowchart which shows an example of one-way printing processing. It is explanatory drawing which shows the state of one-way printing. It is a block diagram which shows the outline of the structure of the belt mechanism 90. It is a block diagram which shows the outline of the structure of the solder recovery device 150 of a modification. It is a flowchart which shows the printing process of the modification. It is explanatory drawing which shows the state at the time of printing start. It is explanatory drawing which shows the state at the time of printing completion.

A mode for carrying out the present invention will be described.

FIG. 1 is a configuration diagram showing an outline of the configuration of the printing device 10 of the present embodiment, FIG. 2 is a configuration diagram showing an outline of the configuration of the first solder recovery device 50, and FIG. 3 is a configuration diagram showing an outline of the configuration of the first solder recovery device 50. It is explanatory drawing which shows the electrical connection relation of the control device 70 of. The left-right direction in FIG. 1 indicates the printing direction, and the front (front) and rear (back) directions indicate the substrate transport direction.

In the printing apparatus 10 of the present embodiment, the solder on the screen mask M is rolled by the squeegees 34a and 34b to push the solder into the formed pattern holes on the screen mask M and onto the substrate S under the screen mask M. It is to be applied (printed). As shown in FIG. 1, the printing device 10 includes a housing 12, a first board transfer device 22a and a second board transfer device 22b, a first backup device 24a and a second backup device 24b, and a screen mask stand 14. A squeegee device 30, a first solder recovery device 50, a second solder recovery device 60, and a control device 70 (see FIG. 3) are provided.

As shown in FIG. 1, both the first substrate transfer device 22a and the second substrate transfer device 22b are provided in the lower part of the housing 12. The first substrate transport device 22a has a first lane extending from the front to the back of FIG. 1, and transports the substrate S along the first lane by driving the belt conveyor device. Further, the second substrate transport device 22b has a second lane that is arranged in parallel with the first lane and extends from the front to the back of FIG. 1, and transports the substrate S along the second lane by driving the belt conveyor device. do.

As shown in FIG. 1, both the first backup device 24a and the second backup device 24b are provided in the lower part of the housing 12. The first backup device 24a and the second backup device 24b are both back-up tables 25a and 25b that can be moved up and down by an elevating device (not shown), and a plurality of backup devices 24a and 25b are installed on the backup tables 25a and 25b to back up the substrate S from the back surface. The backup pins 26a and 26b are provided.

As shown in FIG. 1, the screen mask base 14 is provided in the middle portion of the housing 12, and supports the screen mask M in a horizontal posture.

As shown in FIG. 1, the squeegee device 30 is provided in the upper part of the housing 12. The squeegee device 30 rolls the solder on the screen mask M to print on the substrate S under the screen mask M, and is used for the squeegee head 32, the first squeegee 34a and the second squeegee 34b, and the first squeegee. The elevating device 36a, the elevating device 36b for the second squeegee (see FIG. 3), and the squeegee head moving motor 38 are provided.

The squeegee head 32 rotatably supports the ball screw nut 32a inserted into the ball screw shaft 42 installed in the upper part of the housing 12 so that the axial direction is horizontal, and is a motor for moving the squeegee head. By rotationally driving the ball screw nut 32a by 38, horizontal movement (movement in the printing direction) is possible along the ball screw shaft 42. Further, the squeegee head 32 can move the first squeegee 34a and the second squeegee 34b up and down independently, respectively, of the first squeegee elevating device 36a (see FIG. 3) and the second squeegee elevating device 36b (see FIG. 3). Is built-in.

As shown in FIG. 1, the first squeegee 34a and the second squeegee 34b are arranged so as to face each other and to be inclined by a predetermined angle with respect to the screen mask M.

The squeegee device 30 configured in this way drives and controls the first squeegee elevating device 36a and the second squeegee elevating device 36b to lower the first squeegee 34a and raise the second squeegee 34b. By driving and controlling the moving motor 38 to horizontally move the squeegee head 32 to the right, the solder on the screen mask M can be moved to the right (first direction) for printing. Further, the squeegee device 30 is for moving the squeegee head in a state where the first squeegee elevating device 36a and the second squeegee elevating device 36b are driven and controlled to raise the first squeegee 34a and lower the second squeegee 34b. By driving and controlling the motor 38 to move the squeegee head 32 to the left (second direction), the solder on the screen mask M can be moved to the left for printing.

As shown in FIG. 1, the first solder recovery device 50 is provided in the upper part of the housing 12. The first solder recovery device 50 can recover the solder on the screen mask M, and includes a first recovery head 52, a first recovery plate 54, and a first recovery plate elevating device 56 (see FIG. 3). , A motor 58 for moving the first recovery head, and the like.

The first recovery head 52 rotatably supports the ball screw nut 52a inserted through the ball screw shaft 42 described above, and the ball screw nut 52a is rotationally driven by the first recovery head moving motor 58. Horizontal movement is possible along the ball screw shaft 42. Further, the first recovery head 52 includes a first recovery plate elevating device 56 (see FIG. 3) capable of moving the first recovery plate 54 up and down.

The central portion of the first recovery plate 54 is thicker than the screen mask M, and is gradually formed thinner toward the tip portion (for example, the tip portion has a thickness of 0.2 mm). As a result, the step of the first recovery plate 54 with the screen mask M is small at the tip end portion in a state where the bottom surface is in contact with the upper surface of the screen mask M. Of course, the first recovery plate 54 may be formed as a thin flat plate having a substantially uniform thickness at the tip portion and the center portion.

Further, as shown in FIG. 2, a Pelche element 57 is built in the upper surface of the first recovery plate 54, and is recovered on the first recovery plate 54 by adjusting the voltage applied to the Pelche element 57. The temperature of the solder is adjustable. Further, a suction hole 54a communicating with the negative pressure generator 46 (see FIG. 3) via the air tube 55 is formed on the bottom surface of the first recovery plate 54. By turning on the negative pressure generator 46 while the first recovery plate 54 is in contact with the screen mask M, a negative pressure can be applied to the suction hole 54a and the first recovery plate 54 can be sucked onto the screen mask M. ..

As shown in FIG. 1, the second solder recovery device 60 is provided in the upper part of the housing 12. The second solder recovery device 60 can recover the solder on the screen mask M, and includes a second recovery head 62, a second recovery plate 64, and a second recovery plate elevating device 66 (see FIG. 3). , Equipped with.

The second recovery head 62 rotatably supports the ball screw nut 62a inserted through the ball screw shaft 42 described above, and the ball screw shaft 42 is driven by a horizontal moving motor 44 in which the rotation shaft is connected to the ball screw shaft 42. Is driven to rotate, so that it can move horizontally along the ball screw shaft 42. Since the squeegee head 32 and the first recovery head 52 are also inserted through the ball screw shaft 42, the squeegee head 32 and the first recovery head 52 are also combined with the second recovery head 62 by the rotational drive of the ball screw shaft 42. Move horizontally together. Further, if the squeegee head moving motor 38 is driven, only the squeegee head 32 can be horizontally moved, and if the first recovery head moving motor 58 is driven, only the first recovery head 52 can be horizontally moved. can. Further, the second recovery head 62 includes a second recovery plate elevating device 66 (see FIG. 3) capable of moving the second recovery plate 64 up and down.

Like the first recovery plate 54, the second recovery plate 64 has a central portion thicker than the screen mask M and is gradually formed thinner toward the tip portion. Of course, the second recovery plate 64 may be formed as a thin flat plate having a substantially uniform thickness at the tip portion and the center portion. Further, similarly to the first recovery plate 54, a Pelche element 67 (see FIG. 3) is built in the upper surface of the second recovery plate 64, and a negative pressure generator 46 is mounted on the bottom surface of the second recovery plate 64. A suction hole (not shown) that communicates is formed.

The control device 70 is configured as a microprocessor centered on the CPU 71, and includes a ROM 72, an HDD 73, a RAM 74, an input / output interface 75, and the like in addition to the CPU 71. These are electrically connected to each other via a bus 76. The control device 70 is used to detect a detection signal from the non-contact temperature sensor 48 that detects the temperature of the solder on the screen mask M and a load acting on the first recovery plate 54 and the second recovery plate 64, respectively. Detection signals and the like from the load cells 59 and 69 are input via the input / output interface 75. On the other hand, from the control device 70, a drive signal to the first board transfer device 22a, a second board transfer device 22b, a drive signal to the first backup device 24a, a second backup device 24b, a first squeegee lifting device 36a, Drive signal to the second squeegee lifting device 36b, drive signal to the squeegee head moving motor 38, driving signal to the first recovery head moving motor 58, driving signal to the horizontal moving motor 44, Pelche elements 57, 67. A drive signal to, a drive signal to the negative pressure generator 46, and the like are output via the input / output interface 75.

Next, the operation of the printing apparatus 10 of the present embodiment configured in this way will be described. FIG. 4 is a flowchart showing an example of bidirectional printing processing executed by the CPU 71 of the control device 70. The printing device 10 of the present embodiment has, as printing modes, a bidirectional printing mode in which printing in the right direction by the first squeegee 34a and printing in the left direction by the second squeegee 34b are alternately executed, and a right direction by the first squeegee 34a. There is a one-way printing mode in which only direction printing (or left-hand printing by the second squeegee 34b) is performed. The operator can instruct printing by selecting either a bidirectional printing mode or a one-way printing mode. The bidirectional printing process is executed every time the substrate S to be printed is conveyed when the bidirectional printing mode is selected as the printing mode.

When the bidirectional printing process is executed, the CPU 71 of the control device 70 first determines whether or not the printing target lane this time is the first lane (S100). When it is determined that the print target lane this time is the first lane, it is determined whether or not the previous print target lane was the second lane (S102). When the CPU 71 determines that the print target lane this time is the first lane and the previous print target lane is the second lane, the negative pressure generator 46 is turned off and the first recovery plate 54 and the second recovery plate 64 are turned off. (S104). Then, the CPU 71 moves the squeegee head 32, the first recovery head 52, and the second recovery head 62 to the first lane side (S106), and adsorbs the first recovery plate 54 to the left end of the print area of the first lane. The second recovery plate 64 is adsorbed to the right end of the printing area of the first lane (S108), and the process proceeds to S118. Here, the processing of S106 can be performed by rotationally driving the horizontal movement motor 44 so that the squeegee head 32, the first recovery head 52, and the second recovery head 62 move to the left in FIG. Further, in the processing of S108, the first collection head moving motor 58 is driven and controlled so that the first collection head 52 is above the left end of the printing area of the first lane, and the second collection head 62 prints on the first lane. The horizontal movement motor 44 is driven and controlled so as to be above the right end of the region, and the first recovery plate elevating device 56 and the first recovery plate elevating device 56 and the second recovery plate 64 are lowered until they come into contact with the screen mask M, respectively. This is performed by driving and controlling the lifting device 66 for the second recovery plate and turning on the negative pressure generating device 46 so that the first recovery plate 54 and the second recovery plate 64 are attracted to the screen mask M, respectively. Further, when the CPU 71 determines that the current print target lane is the first lane and the previous print target lane is also the first lane, the CPU 71 skips the processes of S104 to S108 and proceeds to the process of S118.

On the other hand, when the CPU 71 determines that the print target lane this time is not the first lane, that is, the second lane, the CPU 71 determines whether or not the previous print target lane was the first lane (S110). When the CPU 71 determines that the current print target lane is the second lane and the previous print target lane is the first lane, the CPU 71 releases the adsorption of the first recovery plate 54 and the second recovery plate 64 (S112). Then, the CPU 71 moves the squeegee head 32, the first recovery head 52, and the second recovery head 62 to the second lane side (S114), and adsorbs the first recovery plate 54 to the left end of the print area of the second lane. The second recovery plate 64 is adsorbed to the right end of the printing area of the second lane (S116), and the process proceeds to S118. Here, the processing of S114 can be performed by rotationally driving the horizontal movement motor 44 so that the squeegee head 32, the first recovery head 52, and the second recovery head 62 move to the right in FIG. Further, the processing of S116 can be performed by the same processing as that of S108, except that the lanes to be printed are different. Further, when the CPU 71 determines that the current print target lane is the second lane and the previous print target lane is also the second lane, the CPU 71 skips the processes of S112 to S116 and proceeds to the process of S118.

Next, the CPU 71 determines whether or not the solder is on the first recovery plate 54 (S118), and if it is determined that the solder is on the first recovery plate 54, the CPU 71 drives and controls the squeegee head moving motor 38 to control the solder. The 1 squeegee 34a is moved onto the first recovery plate 54 (S120), and the first squeegee elevating device 36a is driven and controlled to lower the first squeegee 34a (S122). In this way, the CPU 71 does not directly contact (press) the first squeegee 34a on the screen mask M, but contacts (presses) it on the first recovery plate 54. As described above, since the central portion of the first recovery plate 54 is thicker than the screen mask M, even if the first squeegee 34a descends and is pressed near the central portion of the first recovery plate 54, the effect of pressing is affected. It can be prevented from reaching the screen mask M. Here, since the thickness of the screen mask M is generally extremely thin, if the squeegee (first squeegee 34a) is pressed directly onto the screen mask M, the screen mask M will not support the screen mask M from below. It bends. Therefore, in the operation of lowering the squeegee (first squeegee 34a) (processing of S122), the substrate S is carried into the machine, positioned, and screened by the backup device (first backup device 24a or second backup device 24b). It must be done by waiting for it to rise until it touches the back surface of the mask M. On the other hand, in the present embodiment, since the first squeegee 34a is pressed onto the first recovery plate 54, it is possible to suppress the screen mask M from bending without supporting the screen mask M from below. .. As a result, the operation of lowering the first squeegee 34a (processing of S122) and the operation of the backup device backing up the substrate S under the screen mask M (backup operation) can be executed in parallel, and the cycle time can be executed. Can be shortened.

Then, the CPU 71 drives and controls the squeegee head moving motor 38 to horizontally move the squeegee head 32 to the right in FIG. 1 to execute printing in the right direction (S124). The elevating device 36a is driven and controlled to raise the first squeegee 34a (S126), and the bidirectional printing process is completed. Here, in the process of S124, the CPU 71 continues the horizontal movement of the first squeegee 34a (squeegee head 32) to the right until the first squeegee 34a rides on the second recovery plate 64. When the first squeegee 34a rides on the second recovery plate 64, the backup device (first backup device 24a or second backup device 24b) sets up the backup table without waiting for the first squeegee 34a to completely stop. The plate is lowered to separate the substrate S from the screen mask M. Further, in the process of S126, the CPU 71 raises the first squeegee 34a without waiting for the substrate S to separate from the screen mask M. Here, when the plate is released, the screen mask M is pulled by the solder on the substrate S and bends downward. Therefore, the plate release is started after the squeegee (first squeegee 34a) is completely stopped after printing in order to minimize the influence on the screen mask M, and the substrate S is separated from the screen mask M. Until then, it is common not to move or raise the squeegee (first squeegee 34a) horizontally. On the other hand, in the present embodiment, if the squeegee (first squeegee 34a) rides on the recovery plate (second recovery plate 64), even if the squeegee is moved on the recovery plate, the screen mask M is affected. Little to give. As a result, the horizontal movement and ascent of the first squeegee 34a and the plate release can be executed in parallel, and the cycle time can be further shortened.

On the other hand, when the CPU 71 determines that the solder is not on the first recovery plate 54, that is, on the second recovery plate 64, the CPU 71 drives and controls the squeegee head moving motor 38 to drive and control the second squeegee 34b to the second recovery plate. It is moved up to 64 (S128), and the second squeegee elevating device 36b is driven and controlled to lower the second squeegee 34b (S130). In this way, the CPU 71 does not directly contact (press) the second squeegee 34b on the screen mask M, but contacts (presses) it on the second recovery plate 64, so that the influence of the pressing is exerted on the screen mask M. Can be avoided. Therefore, similarly to the process of S122 described above, the operation of lowering the second squeegee 34b (process of S130) and the backup operation can be executed in parallel.

Then, the CPU 71 drives and controls the squeegee head moving motor 38 to horizontally move the squeegee head 32 to the left in FIG. 1 to execute printing in the left direction (S132), and when printing is completed, the second squeegee is used. The elevating device 36b is driven and controlled to raise the second squeegee 34b (S134), and the bidirectional printing process is completed. Here, also in the processing of S132, the CPU 71 continues the horizontal movement of the second squeegee 34b (squeegee head 32) to the left until the second squeegee 34b rides on the first recovery plate 54, as in the case of S124. .. Then, when the second squeegee 34b rides on the first recovery plate 54, the backup device releases the plate without waiting for the second squeegee 34b to completely stop. Further, also in the processing of S134, similarly to S126, the CPU 71 raises the second squeegee 34b without waiting for the substrate S to separate from the screen mask M. In this way, it is possible to perform horizontal movement and ascent of the second squeegee 34b and plate release in parallel.

FIG. 5 is an explanatory diagram showing a state of bidirectional printing. When the bidirectional printing mode is selected as the printing mode, as shown in the figure, the CPU 71 of the control device 70 sets the first collection plate 54 at the printing start position of the first squeegee 34a (printing end position of the second squeegee 34b). At the same time, the second recovery plate 64 is sucked at the printing end position of the first squeegee 34a (printing start position of the second squeegee 34b). Subsequently, the CPU 71 horizontally moves the first squeegee 34a onto the first recovery plate 54 with the first recovery plate 54 on which the solder is present as the printing start position, and then lowers the squeegee 34a (see FIG. 5A). .. Then, the CPU 71 prints in the right direction by moving the first squeegee 34a to the right (see FIG. 5B). Since the second recovery plate 64 is at the print end position of the first squeegee 34a, when the printing is finished and the first squeegee 34a moves to the print end position, the solder is present on the second recovery plate 64 (FIG. 5). See (c)). Then, when the substrate S is conveyed next time, the CPU 71 horizontally moves the second squeegee 34b onto the second recovery plate 64 with the second recovery plate 64 on which the solder is present as the printing start position. , And the second squeegee 34b is moved to the left to print in the left direction (see FIG. 5D). In this way, the first recovery plate 54 is adsorbed at the printing start position of the first squeegee 34a (printing end position of the second squeegee 34b), and the second recovery plate 64 is attracted to the printing end position of the first squeegee 34a (second squeegee). The printing in the right direction by the first squeegee 34a and the printing in the left direction by the second squeegee 34b are alternately executed in the state of being adsorbed at the printing start position of 34b). As a result, since the screen mask M is held by the first recovery plate 54 and the second recovery plate 64, bending can be suppressed and print quality can be further improved.

Next, the operation when the one-way printing mode is selected as the printing mode will be described. FIG. 6 is a flowchart showing an example of a one-way printing process executed by the CPU 71 of the control device 70. The one-way printing process is executed every time the substrate S to be printed is conveyed when the one-way printing mode is selected as the printing mode.

When the one-way printing process is executed, the CPU 71 of the control device 70 first determines whether the printing target lane this time is the first lane or the second lane (S200), similarly to S100, S102, and S110. ), Whether or not the previous print target lane was the first lane or the second lane (S202, S208) is determined, respectively. When the CPU 71 determines that the current print target lane is the first lane and the previous print target lane is the second lane, the CPU 71 retracts the second recovery plate 64 (second recovery head 62) from the first lane (2nd recovery head 62). S204). Then, the CPU 71 moves the squeegee head 32 and the first recovery head 52 to the first lane side (S206), and proceeds to the process of S214. Further, when the CPU 71 determines that the current print target lane is the first lane and the previous print target lane is also the first lane, the CPU 71 skips the processes of S204 and S206 and proceeds to the process of S214.

On the other hand, when the CPU 71 determines that the current print target lane is the second lane and the previous print target lane is the first lane, the CPU 71 evacuates the second recovery plate 64 (second recovery head 62) from the second lane. (S210). Then, the CPU 71 moves the squeegee head 32 and the first recovery head 52 to the second lane side (S212), and proceeds to the process of S214. Further, when the CPU 71 determines that the current print target lane is the second lane and the previous print target lane is also the second lane, the CPU 71 skips the processes of S210 and 212 and proceeds to the process of S214.

Then, the CPU 71 moves the first recovery plate 54 from which the solder is recovered to the printing start position (S214). In this process, the first recovery head moving motor 58 is driven and controlled to move the first recovery head 52 above the printing start position, and the first recovery plate elevating device 56 is driven and controlled to drive and control the first recovery plate 54. Can be done by lowering the screen mask M until it comes into contact with the screen mask M.

When the first recovery plate 54 is moved to the printing start position, the CPU 71 drives and controls the squeegee head moving motor 38 to move the first squeegee 34a above the first recovery plate 54 (S216), and the first squeegee The lifting device 36a is driven and controlled to lower the first squeegee 34a (S218), and the squeegee head moving motor 38 is driven and controlled to horizontally move the squeegee head 32 to the right to execute printing in the right direction. (S220). In this way, even in one-way printing, the first squeegee 34a is not directly contacted (pressed) on the screen mask M, but is contacted (pressed) on the first recovery plate 54, so that the influence of pressing is affected by the screen mask. It can be prevented from reaching M. Therefore, similarly to the process of S122 described above, the operation of lowering the second squeegee 34a (process of S218) and the backup operation can be executed in parallel.

When the CPU 71 executes printing in the right direction, the first squeegee elevating device 36a is driven and controlled to raise the first squeegee 34a (S222), and the first collection plate 54 is moved to the printing end position to end printing. The solder at the position is collected on the first collection plate 54 (S224), and the one-way printing process is completed. Here, in the process of S224, the first recovery plate elevating device 56 is driven and controlled before the printing end position to bring the first recovery plate 54 into contact with the screen mask M, and the first recovery head moving motor 58 is driven. This is done by controlling and moving the first recovery plate 54 toward the print end position along the screen mask M.

After printing, the CPU 71 drives and controls the first recovery plate elevating device 56 to raise the first recovery plate 54 from the printing end position, and drives and controls the first recovery head moving motor 58 to control the first recovery plate 54. After the (first collection head 52) is horizontally moved above the printing start position, the first collection plate elevating device 56 is driven and controlled until it comes into contact with the screen mask M to lower the first collection plate 54 (S214). ). That is, the solder recovered on the first recovery plate 54 is returned from the printing end position to the printing start position. Then, the CPU 71 repeatedly executes one-way printing by moving the first squeegee 34a to the right from the printing start position (S216 to S220). In the one-way printing, as described above, the operation of lowering the first recovery plate 54 to bring it into contact with the screen mask M is performed, but the pressing force as in the case of lowering the first squeegee 34a is not required. Therefore, the influence of the contact on the screen mask M can be reduced.

FIG. 7 is an explanatory diagram showing a state of one-way printing. When the one-way printing mode is selected as the printing mode, as shown in the figure, the control device 70 sets the first recovery plate 54 with the solder as the printing start position and the first squeegee 34a on the first recovery plate 54. After being horizontally moved to, it is lowered (see FIG. 7 (a)). Subsequently, the control device 70 prints in the right direction by moving the first squeegee 34a to the right (see FIG. 7B). When printing is completed and the first squeegee 34a is moved to the printing end position, the thin first recovery plate 54 is moved to the printing end position along the screen mask M, so that the solder at the printing end position is first. It is collected on the collection plate 54 (see FIG. 7 (c)). Then, the control device 70 moves the first recovery plate 54 and the first squeegee 34a to the printing start position, so that the substrate S to be transferred next is printed in the right direction (see FIG. 7D). .. In this way, since the printing direction is always the same (right direction), the printing quality can be made uniform.

The CPU 71 of the control device 70 drives and controls the Pelche elements 57 and 67 so that the solder temperature is within an appropriate range based on the solder temperature detected by the non-contact temperature sensor 48. As described above, the Pelche elements 57 and 67 are attached to the first recovery plate 54 and the second recovery plate 64, and the first recovery plate 54 and the second recovery plate 64 are arranged at the printing start position and the printing end position, respectively. .. Therefore, the temperature of the solder is adjusted by the Pelche elements 57 and 67 each time it moves to the printing start position and the printing end position.

Further, the CPU 71 estimates the weight of the solder based on the loads of the first recovery plate 54 and the second recovery plate 64 detected by the load cells 59 and 69. That is, solder is performed by the load of the first recovery plate 54 and the second recovery plate 64 detected by the load cells 59 and 69 at the timing when the first recovery plate 54 and the second recovery plate 64 are raised (for example, when the lane is switched). Detects the weight of the solder and determines if there is a shortage of solder. Then, the control device 70 outputs a warning when it is determined that the solder is insufficient. The warning can be given, for example, by displaying a warning screen indicating that the solder is insufficient on a display device (not shown).

Here, the correspondence between the main elements of the present embodiment and the main elements of the invention described in the disclosure column of the invention will be described. That is, the first squeegee 34a and the second squeegee 34b of the present embodiment correspond to the squeegee of the present invention, the first recovery plate 54 and the second recovery plate 64 correspond to the recovery plates, and the squeegee head moving motor 38 and the first 1 Recovery head moving motor 58, horizontal moving motor 44, first squeegee lifting device 36a, second squeeging lifting device 36b, first recovery plate lifting device 56, second recovery plate lifting device 66 are used as moving means. Correspondingly, the CPU 71 of the control device 70 that executes the bidirectional printing process of FIG. 4 and the one-way printing process of FIG. 6 corresponds to the control means.

In the printing apparatus 10 of the present embodiment described above, when bidirectional printing is performed, the first recovery plate 54 is attracted to the printing start position of the first squeegee 34a (the printing end position of the second squeegee 34b) and the second squeegee 34b. The collection plate 54 is attracted to the printing end position of the first squeegee 34a (the printing start position of the second squeegee 34b), and the solder is moved from the printing start position to the printing end position by the first squeegee 34a. 2 Printing in the left direction, in which the solder is moved in the opposite direction by the squeegee 34b, is alternately executed. As a result, bidirectional printing can be performed while the screen mask M is held by the first recovery plate 54 and the second recovery plate 64, and the bending of the screen mask M during printing is suppressed to further improve the print quality. Can be improved.

Further, in the printing apparatus 10 of the present embodiment, when performing one-way printing, the first recovery plate 54 from which the solder is collected is moved to the printing start position, and the first squeegee 34a is placed on the first recovery plate 54. By moving the first squeegee 34a to the right, printing in the right direction is executed. Further, when printing is completed, the printing apparatus 10 moves the first recovery plate 54 to the printing end position, collects the solder at the printing end position, and moves the solder collected on the first recovery plate 54 to the printing start position. return. As a result, the printing direction of the substrate S can always be the same, so that the printing quality can be made uniform.

Further, in the printing apparatus of the present embodiment, the screen mask M can be easily replaced at the time of setup change by holding the recovery plates 54 and 64 from which the solder has been recovered in an raised state.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be carried out in various embodiments as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the printing mode has a bidirectional printing mode and a one-way printing mode, but it may have only the bidirectional printing mode or only the one-way printing mode. May be good. In the latter case, one of the first squeegee 34a and the first solder recovery device 50 and the second squeegee 34b and the second solder recovery device 60 may be omitted.

Further, in the above-described embodiment, when the one-way printing is executed, the first squeegee 34a is used to execute printing only in the right direction, but the second squeegee 34b is used to execute printing only in the left direction. You may do it.

Further, in the above-described embodiment, two lanes, a first lane and a second lane, are provided as lanes for transporting the substrate S, but three or more lanes may be provided, or only one lane is provided. It may be provided with.

Further, in the above-described embodiment, the squeegee head 32, the first recovery head 52, and the second recovery head 62 are moved by using the ball screw mechanism, but the movement is not limited to this, and the belt mechanism is used. It may be performed by using. FIG. 8 is a configuration diagram showing an outline of the configuration of the belt mechanism 90. As shown in the figure, the belt mechanism 90 includes a timing belt 91 bridged to a drive pulley 92 and a driven pulley 93 attached to the right end and the left end of a housing (not shown), respectively. A drive pulley 94 and an idler 95 that mesh with the timing belt 91 are attached to the squeegee head 132 of the squeegee device 130, and a drive pulley 96 that meshes with the timing belt 91 also to the first recovery head 152 of the first solder recovery device 150. And the idler 97 is attached. Further, the timing belt 91 is directly attached to the second recovery head 162 of the second solder recovery device 160. Thereby, by driving the drive pulley 92, the squeegee head 132, the first recovery head 152 and the second recovery head 162 can be horizontally moved together. Further, by driving the drive pulley 94, only the squeegee head 132 can be horizontally moved, and by driving the drive pulley 96, only the first recovery head 152 can be horizontally moved.

Further, in the above-described embodiment, the recovery plate (first recovery plate 54, second recovery plate 64) is directly mounted by the recovery plate lifting device (first recovery plate lifting device 56, second recovery plate lifting device 66). Although it is configured to be able to move up and down, the present invention is not limited to this, and the recovery plate lifting device and the recovery plate may be connected via a connecting member having two or more joints. FIG. 9 is a configuration diagram showing an outline of the configuration of the solder recovery device 250 of the modified example. In this modification, the squeegee device 230 includes a squeegee head 232 and one squeegee 234 that can be moved up and down by a squeegee elevating device built in the squeegee head 232. As shown in the figure, the solder recovery device 250 of the modified example is arranged on the left side of the squeegee device 230, and has a recovery head 252, a recovery plate 254 formed as a thin plate, and a recovery plate elevating / lowering built in the recovery head 252. The device 256 is provided with a connecting member 258 for connecting the recovery plate 254 and the recovery plate elevating device 256. The joints at both ends of the connecting member 258 have their own rotation ranges, and in the modified example, the rotation of the connecting member 258 from the upright state to the clockwise direction of FIG. 9 is restricted (prohibited) and counterclockwise. Rotation of the connecting member 258 to is allowed up to a predetermined angle (eg 60 degrees). Further, the squeegee head 232 and the recovery head 252 can be horizontally moved together along the ball screw shaft 42 by driving the horizontal movement motor 44, and are configured so that they cannot move independently of each other. .. Further, although not shown, the recovery plate 254 can be adsorbed on the screen mask M by the negative pressure from the negative pressure generator 46, similarly to the first and second recovery plates 54 and 64 described above. In this modification, the solder recovery device 250 is arranged on the left side of the squeegee device 230, but it may be arranged on the right side of the squeegee device 230. In this case, the joints at both ends of the connecting member 258 may be restricted from rotating counterclockwise from an upright state and allowed to rotate clockwise up to a predetermined angle (for example, 60 degrees). ..

FIG. 10 is a flowchart showing a printing process of a modification performed by using the above-mentioned solder recovery device 250, FIG. 11 is an explanatory diagram showing a state at the start of printing, and FIG. 12 is an explanatory diagram at the end of printing. It is explanatory drawing which shows the state. Hereinafter, the printing process of the modified example will be described with reference to FIGS. 11 and 12. When the printing process is executed, the CPU 71 of the control device 70 first determines whether the printing target lane this time is the first lane or the second lane (S300), similarly to S100, S102, and S110. Whether or not the previous print target lane was the first lane or the second lane (S302, S306) is determined, respectively. When the CPU 71 determines that the current print target lane is the first lane and the previous print target lane is the second lane, the squeegee head 232 and the recovery head 252 are moved to the first lane side (S304). Proceed to the process of S310. Further, when the CPU 71 determines that the current print target lane is the first lane and the previous print target lane is also the first lane, the CPU 71 skips the process of S304 and proceeds to the process of S310.

On the other hand, when the CPU 71 determines that the current print target lane is the second lane and the previous print target lane is the first lane, the CPU 71 moves the squeegee head 232 and the recovery head 252 to the second lane side (S308). ), Proceed to the process of S310. Further, when the CPU 71 determines that the current print target lane is the second lane and the previous print target lane is also the second lane, the CPU 71 skips the process of S308 and proceeds to the process of S310.

Next, the CPU 71 moves the recovery plate 254 to the printing start position (see S310, FIG. 11 (a)), and after adsorbing the recovery plate 254 to the screen mask M (see S312, FIG. 11 (b)). The squeegee head 232 is moved above the recovery plate 254 (printing start position) (see S314, FIG. 11 (c)). As described above, since the squeegee head 232 and the recovery head 252 move horizontally together by being driven by the horizontal movement motor 44, when the squeegee head 232 moves above the printing start position, the recovery head 252 moves from the printing start position. Will be located on the left side. Further, as described above, the recovery head 252 and the recovery plate 254 are connected via a connecting member 258 having a rotatable joint. Therefore, even if the recovery head 252 moves to the right side, the connecting member 258 rotates counterclockwise, and the recovery plate 254 is held at the printing start position. The recovery plate elevating device 256 slightly lowers the connecting member 258 in order to smoothly rotate the connecting member 258. Then, the CPU 71 lowers the squeegee 234 (S316), releases the adsorption of the recovery plate 254 (S318), and horizontally moves the squeegee head 232 to the right to execute printing in the right direction (S320, FIG. 11). (D)). The recovery head 252 horizontally moves to the right together with the squeegee head 232.

When printing is completed (see FIG. 12 (a)), the CPU 71 raises the squeegee 234 (see S322 and FIG. 12 (b)) and then moves the collection plate 254 to the print end position to complete the print position. The solder in the above is collected on the collection plate 254 (see S324 and FIG. 12 (c)), and the printing process is completed. As mentioned above, the joints of the connecting member 258 do not rotate clockwise. Therefore, when the collection head 252 is horizontally moved to the right, the collection plate 254 moves to the right along the screen mask M and collects the solder at the printing end position by scooping it. The recovery plate 254 is raised after the solder is recovered, and is moved to the printing start position by S310 when the solder is printed on the substrate S to be carried in next (see FIG. 11A).

In this way, by rotatably connecting the recovery plate elevating device 256 and the recovery plate 254 via the connecting member 258, a mechanism for independently and horizontally moving the recovery head 154 and the squeegee head 232 is provided. It can be eliminated from the need to provide.

Further, in the above-described embodiment, the Peltier elements 57 and 67 are provided on the upper surfaces of the recovery plates 54 and 64, but the present invention is not limited to this, and the temperature of the solder such as the cooling fan and the heater can be adjusted. Other temperature control devices may be used. Further, it may not be provided with such a temperature adjusting device and may not control the temperature of the solder.

Further, in the above-described embodiment, a warning is issued when the weight of the solder on the recovery plates 54 and 64 detected by the load cells 59 and 69 becomes less than a predetermined amount, but the solder is automatically replenished automatically. In the printing apparatus provided with the replenishing device, the solder may be automatically replenished based on the weight of the solder detected by the load cells 59 and 69. Further, the weight of the solder may not be detected.

The present invention can be used in the manufacturing industry of printing equipment and the like.

10 Printing equipment, 12 chassis, 14 screen mask stand, 22a 1st board transfer device, 22b 2nd board transfer device, 24a 1st backup device, 24b 2nd backup device, 25a, 25b backup table, 26a, 26b backup pin , 30,130 squeegee device, 32,132 squeegee head, 34a 1st squeegee, 34b 2nd squeegee, 36a 1st squeegee lifting device, 36b 2nd squeegee lifting device, 38 squeegee head moving motor, 42 ball screw shaft , 44 Horizontal movement motor, 46 Negative pressure generator, 48 Temperature sensor, 50, 150 First solder recovery device, 52, 152 First recovery head, 54 First recovery plate, 54a Suction hole, 55 Air tube, 56 First Lifting device for recovery plate, 57 Pelche element, 58 1st recovery head moving motor, 59 load cell, 60,160 2nd solder recovery device, 62,162 2nd recovery head, 64 2nd recovery plate, 66 2nd recovery plate Lifting device, 67 Pelche element, 69 load cell, 70 controller, 71 CPU, 72 ROM, 73 HDD, 74 RAM, 75 input / output interface, 76 bus, 90 belt mechanism, 91 timing belt, 92, 94, 96 drive pulley , 93 Driven pulley, 95,97 idler, 230 squeegee device, 232 squeegee head, 234 squeegee, 236 squeegee lifting device, 250 solder recovery device, 252 recovery head, 254 recovery plate, 256 recovery plate lifting device, 258 connecting member , S board, M screen mask.

Claims (3)

A printing device that prints on a substrate under the screen mask by moving the solder on the screen mask.
The first transport means for transporting the substrate on the first lane,
A second transport means arranged in parallel with the first lane and transporting the substrate on the second lane,
A first squeegee capable of moving the solder on the screen mask in a first direction orthogonal to the transport direction of the substrate, and a first squeegee.
With a second squeegee that can move the solder on the screen mask in the second direction opposite to the first direction.
A moving means capable of moving the first squeegee and the second squeegee in the orthogonal direction,
A first recovery plate capable of recovering the solder on the screen mask that the second squeegee has moved in the second direction,
A second recovery plate capable of recovering the solder on the screen mask that the first squeegee has moved in the first direction, and a second recovery plate.
The first printing control in which the moving means is controlled to move the first squeegee in the first direction to move the solder in the first direction for printing, and the second printing control in which the moving means is controlled to perform printing. A control means capable of performing a second printing control in which the solder is moved in the second direction to perform printing by moving the squeegee in the second direction.
Equipped with
The moving means makes the first recovery plate and the second recovery plate relative to the first squeegee and the second squeegee in the orthogonal direction across the first lane and the second lane. Movable and
The printing apparatus has, as printing modes, a bidirectional printing mode in which printing in the first direction by the first squeegee and printing in the second direction by the second squeegee are alternately performed, and the printing apparatus using the first squeegee. It is possible to select a one-way printing mode that executes only printing in the first direction.
When the current print target lane is changed from the previous print target lane, the control means controls the moving means when the bidirectional print mode is executed, and controls the first squeegee and the second squeegee. The squeegee, the first recovery plate and the second recovery plate are moved to the print target lane this time, and when the one-way printing mode is executed, the movement means is controlled to control the print target lane this time. A printing apparatus characterized by retracting the second recovery plate from the printing machine and moving the first squeegee, the second squeegee, and the first recovery plate to the lane to be printed this time . The printing apparatus according to claim 1, wherein the moving means can move the first recovery plate and the second recovery plate independently of the first squeegee and the second squeegee. When the bidirectional printing mode is executed , the control means moves the first squeegee, the second squeegee, the first recovery plate, and the second recovery plate to the printing target lane this time. It is determined whether the first recovery plate or the second recovery plate has solder, and if it is determined that the solder is on the first recovery plate, the first squeegee is placed on the first recovery plate. The printing apparatus according to claim 1 or 2, wherein the second squeegee is moved onto the second recovery plate when it is determined that there is solder on the second recovery plate.

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