JP7008169B2 - package - Google Patents

Description

The present invention relates to a package, and more particularly to a package for electronic components.

Japanese Unexamined Patent Publication No. 2006-66791 (Patent Document 1) describes a charge-coupled device (CCD) or a solid such as a complementary metal / oxide / semiconductor (CMOS) used in a digital camera, a video camera, or another image pickup device. The airtight sealing structure of the image pickup device is disclosed. This structure includes a container in which an airtight sealing portion for accommodating a solid-state image sensor is formed, and a translucent lid bonded to the upper surface of a peripheral edge portion surrounding the airtight sealing portion of the container by an adhesive. Have. The container is formed, for example, by laminating or joining ceramic plates.

A first adhesive region and a second adhesive region located on the outer peripheral side of the airtight sealing structure with respect to the first adhesive region are formed between the peripheral edge portion of the container and the lid. The thickness of the adhesive in the second adhesive region is thicker than the thickness of the adhesive in the first adhesive region. According to the description in the above publication, it is possible to prevent moisture from entering the inside of the airtight sealing structure in the first adhesive region where the thickness of the adhesive is relatively thin, and to maintain good airtight sealing inside the structure. At the same time, it is possible to increase the adhesive strength between the container and the lid in the second adhesive region where the adhesive is relatively thick, and prevent the adhesive portion between the two from being easily peeled off due to shear stress due to thermal impact. ..

Japanese Unexamined Patent Publication No. 2006-66791

As mentioned above, the portion between the peripheral edge of the container and the lid attached to it via the adhesive is an important part in ensuring packaging performance. Therefore, if the quality of the peripheral edge of the container, in other words, the mounting surface to which the lid is mounted, is low, the package performance may not be ensured. According to the studies by the present inventors, high precision is specifically important as the quality of the mounting surface. In view of this, it is conceivable to select a ceramic having high density as the composition of the ceramic as the packaging material. However, according to the studies by the present inventors, if the composition of the ceramics is simply adjusted for this purpose, the color unevenness of the package may increase. For commercial use, packages with large color irregularities are often unacceptable. The present invention has been made to solve such a problem, and an object thereof is to improve the fineness of the mounting surface to which the lid is mounted and to avoid large color unevenness. It is to provide a package that can be done.

The package according to one aspect of the present invention includes a mounting surface on which electronic components will be mounted, a cavity located on the mounting surface, and a mounting surface on which a lid for sealing the cavity will be mounted. ,have. The package has a base and a wiring part. The base is provided with a cavity. The base includes a bottom and a frame. The bottom has a mounting surface. The frame portion is provided on the bottom portion on the outside of the mounting surface so as to surround the cavity, and has a mounting surface. The frame portion is made of ceramics containing Al ₂ O ₃ as a main component and Mn O and SiO ₂ as additives. The wiring portion extends from the cavity of the base portion and penetrates the base portion. The weight ratio of the content of SiO ₂ to the content of MnO in the ceramics is defined as R1 inside the frame and R2 on the mounting surface of the frame, and R1> R2 is satisfied and 0. .7≤R2 <1.3 is satisfied .
The package in another aspect of the invention includes a mounting surface on which electronic components will be mounted, a cavity located on the mounting surface, and a mounting surface on which a lid for sealing the cavity will be mounted. ,have. The package has a base and a wiring part. The base is provided with a cavity. The base includes a bottom and a frame. The bottom has a mounting surface. The frame portion is provided on the bottom portion on the outside of the mounting surface so as to surround the cavity, and has a mounting surface. The frame portion is made of ceramics containing Al ₂ O ₃ as a main component and Mn O and SiO ₂ as additives. The wiring portion extends from the cavity of the base portion and penetrates the base portion. The weight ratio of the content of SiO ₂ to the content of MnO in the ceramics is defined as R1 inside the frame portion and R2 on the mounting surface of the frame portion, and R1> R2 is satisfied and 1 .3 ≦ R1 ≦ 2.2 is satisfied.

According to the package according to the embodiment of the present invention, the weight ratio of the content of SiO ₂ to the content of MnO in the ceramics is defined as R1 inside the frame portion and R2 on the mounting surface of the frame portion. , R1> R2 is satisfied. As a result, the composition on the mounting surface of the frame portion is suitable for improving the denseness, and the composition inside the frame portion is suitable for suppressing color unevenness. Since the degree of color unevenness largely depends on the internal composition of the ceramic, which occupies most of the volume, rather than the composition of the surface of the ceramic, the color unevenness is reduced by optimizing the internal composition of the ceramic. be able to. From the above, it is possible to improve the fineness of the mounting surface on which the lid is mounted, and it is possible to avoid large color unevenness.

The objects, features, aspects, and advantages of the present invention will be made clearer by the following detailed description and accompanying drawings.

It is sectional drawing which shows schematically the structure of the electronic apparatus in one Embodiment of this invention. It is sectional drawing which shows the structure of the package of FIG. 1 schematically. It is a stereomicrograph of a ceramic plate when the weight ratio of the content of SiO ₂ to the content of MnO at the time of preparing a raw material powder is 1.00. It is a stereomicrograph of a ceramic plate when the weight ratio of the content of SiO ₂ to the content of MnO at the time of preparing a raw material powder is 1.20. It is a stereomicrograph of a ceramic plate when the weight ratio of the content of SiO ₂ to the content of MnO at the time of preparing a raw material powder is 1.40.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Each of FIGS. 1 and 2 is a cross-sectional view schematically showing the configuration of the electronic device 900 in the present embodiment and the configuration of the package 800 used for manufacturing the electronic device 900.

Package 800 (FIG. 2) includes a mounting surface SM on which the electronic component 902 (FIG. 1) is to be mounted, a cavity CV located on the mounting surface SM, and a lid 907 for sealing the cavity CV. It has a mounting surface SF to be mounted. The package 800 has a base portion 810 and a wiring portion 820.

The base 810 is made of ceramics. The ceramic is substantially made of an insulator so that the base 810 can function as an insulating member. As long as this function can be ensured, the ceramics do not necessarily have to be completely made of an insulator. For example, a small amount of non-insulator grains are dispersed in the insulator grains that occupy the majority in volume. May be.

The base 810 is provided with a cavity CV. The base 810 includes a bottom 811 and a frame 812.

The bottom 811 has a mounting surface SM. It is preferable that the mounting surface SM has a mounting surface SM having a size including a rectangle having a long side of 10 mm or more. For example, the mounting surface SM is a rectangle having a long side of 10 mm or more. The mounting surface SM may have a mounting surface SM having a size including a square having a side of 10 mm or more. A rectangle is a kind of square by definition in geometry.

The frame portion 812 is provided on the bottom portion 811 on the outside of the mounting surface SM so as to surround the cavity CV. The frame portion 812 preferably has a fired surface of ceramics as a mounting surface SF. Here, the word "firing" (as-fired) means a state in which the surface is not processed as it is sintered. Therefore, the "firing surface" is a surface having a "firing" (as-fired) state. In other words, the "fired surface" means the external surface of a ceramic product after sintering. Therefore, the polished surface is not a fired surface. The mounting surface SF of the frame portion 812 is not limited to the fired surface, and may be, for example, a polished surface.

The ceramics contain Al ₂ O ₃ as a main component and Mn O and SiO ₂ as additives. The content of Al ₂ O ₃ is preferably 82.0% by mass or more and 95.0% by mass or less. The content of SiO ₂ is preferably 3.0% by mass or more and 8.0% by mass or less. The content of MnO is preferably 2.0% by mass or more and 6.0% by mass or less. Further, the ceramics may contain at least one of molybdenum (Mo) atom and Cr ₂ O ₃ as an optional component. The total of the Mo atom content and the Cr ₂ O ₃ content in terms of MoO ₃ is 4.0% by mass or less. At least a part of Mo atoms may be contained as Mo oxide. Further, at least a part of Mo atoms may be contained as metal Mo. The content of the balance of the ceramic composition other than the above-mentioned components is preferably less than 0.1% by mass, more preferably less than 0.05% by mass.

Here, the weight ratio of the content of SiO ₂ to the content of MnO in the ceramics is defined as R1 inside the frame portion 812 and R2 on the mounting surface SF of the frame portion 812. In this embodiment, R1> R2 is satisfied. Preferably, 1.3 ≦ R1 ≦ 2.2 is satisfied. Further, preferably, 0.7 ≦ R2 <1.3 is satisfied.

Although R1 is considered to roughly correspond to the composition of the raw material powder at the time of preparation, it is measured by a fluorescent X-ray (XRF: X-ray Fluorescence) elemental analysis method or a chemical analysis method after sufficiently removing the surface portion of the ceramics. May be done. It is considered sufficient that the depth at which the surface portion is removed is about 70 to 80 μm. R2 may be measured by XRF elemental analysis on the mounting surface SF.

The wiring portion 820 extends from the cavity CV and penetrates the base portion 810. Specifically, the wiring portion 820 has an external electrode terminal 821 provided on the outside of the cavity CV, an internal wiring 822 penetrating the base portion 810, and an internal electrode terminal 823 facing the cavity CV. The internal wiring 822 may be composed of at least one of the internal electrode layer and the via wiring. The material of the wiring portion 820 is substantially composed of a conductor so that the wiring portion 820 can function as a wiring member. As long as this function can be ensured, the material does not necessarily have to consist entirely of conductors, for example, even if the non-insulator region is dispersed within the conductor region, which occupies a major volume. good.

The electronic component 902 (FIG. 1) is bonded on the internal electrode terminal 823 by a bonding layer 901. As a result, the electronic component 902 is mounted on the mounting surface SM via the bonding layer 901 and the internal electrode terminal 823. The electronic component 902 may have a size including a rectangle having a long side of 10 mm or more, and has a size including, for example, a square having a side of 10 mm or more. The electronic component 902 may be a solid-state image sensor. The solid-state image sensor is, for example, a CMOS image sensor. In general, a CMOS image sensor is particularly excellent as a solid-state image sensor having a large image pickup unit as required for a single-lens reflex camera, a part of a surveillance camera, an industrial camera, and the like. The planar shape of the solid-state image sensor may be a rectangle having a long side of 10 mm or more, and may be a substantially square shape having a side of 10 mm or more. However, the size and type of the electronic component 902 are not particularly limited.

The lid 907 is mounted on the mounting surface SF of the frame portion 812 via the adhesive layer 906. As a result, the cavity CV of the package 800 is sealed. The adhesive layer 906 is made of, for example, a resin adhesive. The adhesive layer 906 may be in direct contact with each of the mounting surface SF and the lid 907. When the electronic component 902 is a solid-state image sensor, at least a portion of the lid 907 is substantially transparent with respect to the light being imaged, and typically the entire lid 907 is substantially with respect to the light being imaged. Is transparent.

In the present embodiment, the wiring portion 820 penetrates the bottom portion 811, but as a modification, the wiring portion penetrating between the bottom portion 811 and the frame portion 812 or the wiring portion penetrating the frame portion 812 It may be provided. Further, as a modification, a wiring portion to be connected to the electronic component 902 by a bonding wire may be provided. Further, as a modification, the wiring portion may be a lead frame.

According to the present embodiment, since R1> R2 is satisfied as described above, the composition of the frame portion 812 on the mounting surface SF is suitable for improving the denseness, and the frame portion 812 The internal composition is suitable for suppressing color unevenness. The high density makes it easy to ensure acid resistance of the mounting surface SF (for example, pickling in the plating process). In addition, the degree of color unevenness largely depends on the internal composition of the ceramic, which occupies most of the volume, rather than the composition of the surface of the ceramic. Therefore, the color unevenness can be prevented by optimizing the internal composition of the ceramic. Can be reduced. From the above, it is possible to improve the fineness of the mounting surface SF to which the lid is mounted, and it is possible to avoid large color unevenness.

The mounting surface SF of the frame portion 812 is preferably a fired surface of ceramics. In this case, in the manufacture of the package 800, the mounting surface SF of the frame portion 812 is not polished. When the mounting surface SF is polished, the ceramic composition on the mounting surface SF of the frame portion 812 tends to approach the composition inside the frame portion 812. As a result, the above-mentioned relationship of R1> R2 may be difficult to obtain, or it may be difficult to make R1 sufficiently larger than R2. On the other hand, when the mounting surface SF is a fired surface, it is easy to obtain the relationship of R1> R2, and further, it is easy to make R1 sufficiently larger than R2. Further, when the mounting surface SF is a fired surface, the mounting surface SF is not polished, so that there is no possibility that the pores inside the frame portion 812 are surfaced as defects (holes). Therefore, no foreign matter enters this defect during processing. Therefore, it is possible to prevent dust generation due to the detachment of foreign matter.

Regarding the composition of the ceramics, it is preferable that 1.3 ≦ R1 ≦ 2.2 is satisfied. When R1 is 1.3 or more, the color unevenness of the package 800 can be sufficiently reduced. When R1 is 2.2 or less, it is possible to prevent the temperature required for the firing step in manufacturing the package 800 from becoming excessively high. When R1 exceeds 2.2, the firing temperature rises and the strength decreases due to grain growth.

Regarding the composition of the ceramics, it is preferable that 0.7 ≦ R2 <1.3 is satisfied. Since it is difficult to make the difference between R1 and R2 extremely large, it is difficult for R1 to be too small when R2 is 0.7 or more. If R1 is too small, it becomes difficult to suppress color unevenness. On the other hand, when R2 is less than 1.3, the fineness of the ceramics on the mounting surface SF can be sufficiently improved. By controlling R2 within the above range in this way, it becomes easier to control R1 that affects color unevenness, and as a result, it is possible to improve the fineness of the mounting surface and avoid large color unevenness.

The ceramics preferably have the following composition. It contains Al ₂ O ₃ , SiO ₂ and Mn O as essential components, and at least one of molybdenum atom and Cr ₂ O ₃ as an optional component. The content of Al ₂ O ₃ is 82.0% by mass or more and 95.0% by mass or less. The content of SiO ₂ is 3.0% by mass or more and 8.0% by mass or less. The content of MnO is 2.0% by mass or more and 6.0% by mass or less. The total of the molybdenum atom content and the Cr _{2O 3} content in terms of MoO ₃ is 4.0% by mass or less. The content of the balance is less than 0.1% by mass, more preferably less than 0.05% by mass. When the ceramics have such a composition, it becomes easy to obtain the dimensional accuracy of the base 810 made of the ceramics. Therefore, in particular, even when the fired surface is used without polishing, it is easy to secure the flatness of the mounting surface SF, and it is easy to secure the parallelism of the mounting surface SF.

Specifically, since the content of the balance is suppressed to less than 0.1% by mass, each component is uniformly sintered in a dispersed state without segregation. As a result, dimensional variation of the base 810 is suppressed. Therefore, it becomes easy to secure the flatness of the mounting surface SF without polishing. In addition, it becomes easy to secure the parallelism of the mounting surface SF.

Further, as described above, each component is uniformly sintered in a dispersed state without segregation, so that the timing at which the glass component of the base 810 melts is on the side facing the firing setter and on the opposite side. And it will be almost at the same time. Therefore, it is possible to prevent the base portion 810 from warping in the thickness direction due to this timing shift. Therefore, it becomes easy to secure the flatness and parallelism of the mounting surface SF without polishing.

The content of the balance is more preferably less than 0.05% by mass. As a result, dimensional variation can be further suppressed. The content of the balance is particularly preferably 0% by mass. As a result, dimensional variation can be further suppressed.

The ceramics of the base 810 include a crystalline phase and a glass phase. When the ceramics contain Mo atoms as a colorant, the crystal phase includes not only the Al ₂ O ₃ crystal phase as the main crystal phase but also the Mo crystal phase as the sub crystal phase. The crystal phase may contain a crystal phase other than the Al ₂ O ₃ crystal phase and the Mo crystal phase (hereinafter, referred to as “residual crystal phase”). Here, when the X-ray diffraction pattern of the sample obtained by crushing the base 810 is measured _, the main peak intensity of the remaining crystal phase is ₀ . It is preferably 5% or less. As a result, it is possible to prevent the glass phase from being distorted due to the presence of the remaining crystal phase. This makes it possible to improve the bending strength (so-called bending strength) of the ceramics.

Table 1 below shows the results of examining the sintered body density and the color unevenness of the ceramic plate samples A to C having different compositions.

The composition in Table 1 is the one at the time of blending the raw material powder for producing ceramics, and it is considered that the composition substantially corresponds to the internal composition of the ceramic plate obtained by the sintering. Therefore, it is considered that the weight ratio SiO ₂ / MnO here substantially corresponds to the above-mentioned R1. Each of the samples A to C was prepared with the above weight ratios of 1.00, 1.20 and 1.40, while the total weight of SiO ₂ and MnO was 9% by mass in common. As a result, it was found that the smaller the weight ratio, the higher the sintered body density. It was also found that the larger the weight ratio, the more the color unevenness was suppressed. Each of FIGS. 3 to 5 shows stereomicrographs of samples A to C in Table 1 above. Color unevenness is remarkable at a weight ratio of 1.00 (Fig. 3), some color unevenness is observed at a weight ratio of 1.20 (Fig. 4), and almost color unevenness is observed at a weight ratio of 1.40 (Fig. 5). There wasn't.

Based on the experimental results of the above samples A to C, the present inventors reduced the weight ratio of the content of SiO ₂ to the content of MnO relatively small on the surface of the ceramic forming the mounting surface SF, and inside the ceramic. I came up with the idea of making it relatively large. Based on this idea, when the packages were prototyped with the weight ratios shown in Tables 2 and 3 below, the precision of the mounting surface SF can be improved and large color unevenness can be avoided in any of the embodiments. I was able to.

In each of Tables 2 and 3 above, the numerical values in the left column are the compositions (internal composition of ceramics) measured by the XRF elemental analysis method after polishing to a depth of 75 μm from the mounting surface SF, and the values in the lowermost row are the above. Corresponds to R1. From this value, R1 was 1.28 and 2.24 in the examples of Tables 2 and 3, respectively. The numerical values in the right column are the surface composition of the ceramics by the XRF elemental analysis method. From this result, the above-mentioned R2 was 0.70 and 1.26.

Since the degree of color unevenness largely depends on the internal composition of the ceramic, which occupies most of the volume, rather than the surface composition of the ceramic, the color unevenness should be reduced by optimizing the internal composition of the ceramic. Can be done. Since the color unevenness was sufficiently suppressed in the above-mentioned examples in which R1 which was the ratio of the internal composition was 1.28 and 2.24, 1.3 ≦ R1 ≦ 2.2 was satisfied with two significant figures. If so, it is considered that color unevenness is sufficiently suppressed.

On the other hand, since the denseness was sufficiently high in the above-mentioned examples in which R2, which is the ratio of the surface composition, was 0.70 and 1.26, 0.7 ≦ R2 <1.3 was satisfied with two significant figures. If so, it is considered that the precision of the mounting surface SF is sufficiently enhanced.

Although the invention has been described in detail, the above description is exemplary in all aspects and the invention is not limited thereto. It is understood that innumerable variations not illustrated can be assumed without departing from the scope of the present invention.

800 Package 810 Base 811 Bottom 812 Frame 820 Wiring 821 External electrode terminal 822 Internal wiring 823 Internal electrode terminal 900 Electronic device 901 Bonding layer 902 Electronic component 906 Adhesive layer 907 Closure CV cavity SF Mounting surface SM mounting surface

Claims (6)

A package having a mounting surface on which electronic components will be mounted, a cavity located on the mounting surface, and a mounting surface on which a lid for sealing the cavity will be mounted.
The cavity is provided, and the bottom portion having the mounting surface and the bottom portion provided so as to surround the cavity on the outside of the mounting surface, the mounting surface is provided, and Al ₂ O ₃ as a main component is added. A frame portion made of ceramics containing MnO and SiO ₂ as an object, a base portion including, and a base portion including.
A wiring portion extending from the cavity of the base portion and penetrating the base portion,
Equipped with
The weight ratio of the content of SiO ₂ to the content of MnO in the ceramic is defined as R1 inside the frame portion and R2 on the mounting surface of the frame portion.
A package in which R1> R2 is satisfied and 0.7 ≦ R2 <1.3 is satisfied . The package according to claim 1 , wherein 1.3 ≦ R1 ≦ 2.2 is satisfied. A package having a mounting surface on which electronic components will be mounted, a cavity located on the mounting surface, and a mounting surface on which a lid for sealing the cavity will be mounted.
The cavity is provided, and the bottom portion having the mounting surface and the bottom portion provided so as to surround the cavity on the outside of the mounting surface, the mounting surface is provided, and Al ₂ O ₃ as a main component is added. A frame portion made of ceramics containing MnO and SiO ₂ as an object, a base portion including, and a base portion including.
A wiring portion extending from the cavity of the base portion and penetrating the base portion,
Equipped with
The weight ratio of the content of SiO ₂ to the content of MnO in the ceramic is defined as R1 inside the frame portion and R2 on the mounting surface of the frame portion.
A package in which R1> R2 is satisfied and 1.3 ≦ R1 ≦ 2.2 is satisfied . The package according to any one of claims 1 to 3 , wherein the mounting surface of the frame portion is a fired surface of the ceramics. The ceramics contain at least one of a molybdenum atom and Cr ₂ O ₃ as an optional component.
The content of Al ₂ O ₃ is 82.0% by mass or more and 95.0% by mass or less.
The content of SiO ₂ is 3.0% by mass or more and 8.0% by mass or less.
The MnO content is 2.0% by mass or more and 6.0% by mass or less.
The total of the molybdenum atom content in terms of MoO ₃ and the content of Cr ₂ O ₃ is 4.0% by mass or less.
The content of the balance is less than 0.1% by mass,
The package according to any one of claims 1 to 4. The ceramics contain at least one of a molybdenum atom and Cr ₂ O ₃ as an optional component.
The content of Al ₂ O ₃ is 82.0% by mass or more and 95.0% by mass or less.
The content of SiO ₂ is 3.0% by mass or more and 8.0% by mass or less.
The MnO content is 2.0% by mass or more and 6.0% by mass or less.
The total of the molybdenum atom content in terms of MoO ₃ and the content of Cr ₂ O ₃ is 4.0% by mass or less.
The content of the balance is less than 0.05% by mass,
The package according to any one of claims 1 to 4.

Images