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JP7014653B2 - Method for manufacturing a non-linearly processed optical laminate with an adhesive layer - Google Patents
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JP7014653B2 - Method for manufacturing a non-linearly processed optical laminate with an adhesive layer - Google Patents

Method for manufacturing a non-linearly processed optical laminate with an adhesive layer Download PDF

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JP7014653B2
JP7014653B2 JP2018054037A JP2018054037A JP7014653B2 JP 7014653 B2 JP7014653 B2 JP 7014653B2 JP 2018054037 A JP2018054037 A JP 2018054037A JP 2018054037 A JP2018054037 A JP 2018054037A JP 7014653 B2 JP7014653 B2 JP 7014653B2
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cutting
work
adhesive layer
manufacturing
optical laminate
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JP2018167393A (en
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弘明 麓
裕加 山本
誠 中市
勝則 高田
宏太 仲井
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Nitto Denko Corp
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Nitto Denko Corp
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Priority to CN201880021851.0A priority Critical patent/CN110461519B/en
Priority to PCT/JP2018/011680 priority patent/WO2018180977A1/en
Priority to KR1020197026764A priority patent/KR102561432B1/en
Priority to TW107110920A priority patent/TWI783983B/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/10Removing layers, or parts of layers, mechanically or chemically
    • B32B38/105Removing layers, or parts of layers, mechanically or chemically on edges
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23CMILLING
    • B23C1/00Milling machines not designed for particular work or special operations
    • B23C1/04Milling machines not designed for particular work or special operations with a plurality of horizontal working-spindles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23CMILLING
    • B23C3/00Milling particular work; Special milling operations; Machines therefor
    • B23C3/12Trimming or finishing edges, e.g. deburring welded corners
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/30Polarising elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/42Polarizing, birefringent, filtering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polarising Elements (AREA)
  • Laminated Bodies (AREA)
  • Milling Processes (AREA)

Description

本発明は、非直線加工された粘着剤層付光学積層体の製造方法に関する。 The present invention relates to a method for manufacturing a non-linearly processed optical laminate with an adhesive layer.

携帯電話、ノート型パーソナルコンピューター等の画像表示装置には、画像表示を実現し、および/または当該画像表示の性能を高めるために、種々の光学積層体(例えば、偏光板)が使用されている。近年、自動車のインストゥルメントパネルやスマートウォッチなどにも光学積層体の使用が望まれており、光学積層体の形状を矩形以外に加工することが望まれている。 Various optical laminates (for example, polarizing plates) are used in image display devices such as mobile phones and notebook personal computers in order to realize image display and / or enhance the performance of the image display. .. In recent years, it has been desired to use an optical laminate for an automobile instrument panel, a smart watch, and the like, and it is desired to process the shape of the optical laminate to a shape other than a rectangle.

特開2004-114205号公報Japanese Unexamined Patent Publication No. 2004-114205

本発明は上記従来の課題を解決するためになされたものであり、その主たる目的は、不具合を生じることなく、非直線加工された粘着剤層付光学積層体を簡便に製造し得る方法を提供することにある。 The present invention has been made to solve the above-mentioned conventional problems, and a main object thereof is to provide a method capable of easily manufacturing a non-linearly processed optical laminate with an adhesive layer without causing a defect. To do.

本発明の粘着剤層付光学積層体の製造方法は、粘着剤層付光学積層体を複数枚重ねてワークを形成すること;該ワークの外周面に垂直な回転軸と該切断面側に突出して設けられた切削刃とを有する第1切削手段を回転させながら、該ワークおよび該第1切削手段を相対的に移動させて、該ワークの外周面を直線的に切削する第1切削を行うこと;および、該ワークの積層方向に延びる回転軸と該回転軸を中心として回転する本体の最外径として構成された切削刃とを有する第2切削手段を回転させながら、該ワークおよび該第2切削手段を相対的に移動させて、該ワークの外周面を非直線的に切削する第2切削を行うこと;を含む。この製造方法においては、該ワークを上下からクランプした状態で、該第1切削および該第2切削が行われる。
1つの実施形態においては、上記第1切削および上記第2切削は、上記ワークを上下からクランプした状態でクランプを開放することなく連続的に行われる。
1つの実施形態においては、上記光学積層体は偏光板である。
1つの実施形態においては、上記第2切削加工で切削される部分の長さは、上記第1切削加工および該第2切削加工で切削される部分の長さに対して70%以下である。
1つの実施形態においては、上記製造方法においては、上記第2切削の後に上記第1切削が行われる。
1つの実施形態においては、上記第2切削手段の刃角度は45°~75°である。
1つの実施形態においては、上記第2切削手段の直径は3mm~20mmである。
The method for manufacturing an optical laminate with an adhesive layer of the present invention is to stack a plurality of optical laminates with an adhesive layer to form a work; a rotation axis perpendicular to the outer peripheral surface of the work and a protrusion toward the cut surface side. While rotating the first cutting means having the cutting blade provided therein, the work and the first cutting means are relatively moved to perform the first cutting in which the outer peripheral surface of the work is linearly cut. That; and while rotating the second cutting means having a rotation axis extending in the stacking direction of the work and a cutting blade configured as the outermost diameter of the main body rotating about the rotation axis, the work and the first. (2) The second cutting is performed by moving the cutting means relatively to cut the outer peripheral surface of the work in a non-linear manner. In this manufacturing method, the first cutting and the second cutting are performed with the work clamped from above and below.
In one embodiment, the first cutting and the second cutting are continuously performed with the work clamped from above and below without opening the clamp.
In one embodiment, the optical laminate is a polarizing plate.
In one embodiment, the length of the portion cut by the second cutting process is 70% or less with respect to the length of the portion cut by the first cutting process and the second cutting process.
In one embodiment, in the manufacturing method, the first cutting is performed after the second cutting.
In one embodiment, the blade angle of the second cutting means is 45 ° to 75 °.
In one embodiment, the diameter of the second cutting means is 3 mm to 20 mm.

本発明の粘着剤層付光学積層体の製造方法によれば、粘着剤層付光学積層体を複数枚重ねてワークを形成し、当該ワークを両頭フライス加工により直線的に切削し、および、エンドミル加工により非直線的に切削することにより、不具合を生じることなく、非直線加工された粘着剤層付光学積層体を簡便に製造することができる。より詳細には以下のとおりである。粘着剤層付光学積層体を複数枚重ねてワークを形成し、当該ワークを矩形以外の形状に加工する場合、当該加工方法としては、レーザー加工、打ち抜き加工、エンドミル加工等が候補として挙げられる。しかし、レーザー加工は得られる光学積層体の光学特性に悪影響を与える場合があり、打ち抜き加工は形状精度が不十分であり、かつ、クラックが発生する場合がある。そこで、エンドミル加工を試みたところ、ブロッキング(具体的には、ワークにおける粘着剤層付光学積層体同士が端面の粘着剤で接着するという現象)が生じるという課題が新たに発見された。本発明者らは、当該新たな課題について試行錯誤を繰り返した結果、エンドミル加工に伴いワーク端面に粘着剤が塗られた状態となっていることを発見し、ワーク端面に存在する粘着剤の量を減らせばブロッキングを抑制できると推定し、さらなる試行錯誤を重ねた。その結果、エンドミルの切削刃に付着した粘着剤の量を減らすことにより、ワーク端面に存在する粘着剤の量を減らすことができ、ブロッキングの問題を解決できることを見出した。具体的には、直線的な加工(切削)を両頭フライス加工で行い、非直線的な加工(切削)のみをエンドミル加工で行うことにより、エンドミルの切削刃に付着した粘着剤の量を減らし、ブロッキングの問題を解決した。すなわち、本発明は、粘着剤層付光学積層体を非直線加工するという技術において新たに生じた課題を解決したものである。 According to the method for manufacturing an optical laminate with an adhesive layer of the present invention, a plurality of optical laminates with an adhesive layer are stacked to form a work, the work is linearly cut by double-headed milling, and an end mill is used. By cutting non-linearly by processing, it is possible to easily manufacture an optical laminate with an adhesive layer that has been processed non-linearly without causing any trouble. More details are as follows. When a work is formed by stacking a plurality of optical laminates with an adhesive layer and the work is processed into a shape other than a rectangle, laser processing, punching processing, end mill processing and the like can be mentioned as candidates for the processing method. However, laser processing may adversely affect the optical characteristics of the obtained optical laminate, punching processing may have insufficient shape accuracy, and cracks may occur. Therefore, when an end mill process was attempted, a new problem was discovered in which blocking (specifically, a phenomenon in which optical laminates with an adhesive layer in a work adhere to each other with an adhesive on the end face) occurs. As a result of repeated trial and error on the new problem, the present inventors have discovered that the work end face is coated with an adhesive due to end milling, and the amount of the pressure-sensitive adhesive present on the work end face. It was estimated that blocking could be suppressed by reducing the number, and further trial and error was repeated. As a result, it has been found that by reducing the amount of the adhesive adhering to the cutting blade of the end mill, the amount of the adhesive present on the end face of the work can be reduced and the blocking problem can be solved. Specifically, by performing linear machining (cutting) with double-headed milling and performing only non-linear machining (cutting) with end mill machining, the amount of adhesive adhering to the cutting blade of the end mill is reduced. Solved the blocking problem. That is, the present invention solves a new problem in the technique of non-linear processing of an optical laminate with an adhesive layer.

本発明の製造方法により得られ得る非直線加工された粘着剤層付光学積層体の形状の一例を示す概略平面図である。It is a schematic plan view which shows an example of the shape of the optical laminate with a non-linearly processed pressure-sensitive adhesive layer which can be obtained by the manufacturing method of this invention. 本発明の製造方法における第1切削加工を説明するための概略斜視図である。It is a schematic perspective view for demonstrating the 1st cutting process in the manufacturing method of this invention. (a)~(e)は、本発明の製造方法の一連の手順を説明する概略平面図である。(A)-(e) are schematic plan views explaining a series of procedures of the manufacturing method of this invention. 本発明の製造方法における第2切削加工を説明するための概略斜視図である。It is a schematic perspective view for demonstrating the 2nd cutting process in the manufacturing method of this invention. 本発明の製造方法における第2切削加工に用いられる第2切削手段の構造の一例を説明するための概略図である。It is a schematic diagram for demonstrating an example of the structure of the 2nd cutting means used for the 2nd cutting processing in the manufacturing method of this invention.

以下、図面を参照して本発明の具体的な実施形態について説明するが、本発明はこれらの実施形態には限定されない。なお、見やすくするために図面は模式的に表されており、さらに、図面における長さ、幅、厚み等の比率、ならびに角度等は、実際とは異なっている。 Hereinafter, specific embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to these embodiments. The drawings are schematically shown for easy viewing, and the ratios of length, width, thickness, etc., angles, etc. in the drawings are different from the actual ones.

本発明の粘着剤層付光学積層体の製造方法は、粘着剤層付光学積層体を複数枚重ねてワークを形成すること;ワークの外周面を直線的に切削する第1切削を行うこと;および、ワークの外周面を非直線的に切削する第2切削を行うこと;を含む。粘着剤層付光学積層体としては、非直線加工が必要とされる用途に用いられ得る任意の適切な粘着剤層付光学積層体が挙げられる。粘着剤層付光学積層体の具体例としては、偏光板、位相差板、タッチパネル用導電性フィルム、表面処理フィルム、および、これらを目的に応じて適切に積層した積層体(例えば、反射防止用円偏光板、タッチパネル用導電層付偏光板)が挙げられる。粘着剤層付光学積層体の非直線加工において本発明の効果が顕著となる。以下、一例として図1に示すような平面形状の粘着剤層付光学積層体の製造方法における各工程を説明する。 In the method for manufacturing an optical laminate with an adhesive layer of the present invention, a plurality of optical laminates with an adhesive layer are stacked to form a work; the first cutting for linearly cutting the outer peripheral surface of the work is performed; It also includes performing a second cutting that cuts the outer peripheral surface of the work in a non-linear manner. Examples of the optical laminate with an adhesive layer include any suitable optical laminate with an adhesive layer that can be used in applications that require non-linear processing. Specific examples of the optical laminate with the pressure-sensitive adhesive layer include a polarizing plate, a retardation plate, a conductive film for a touch panel, a surface-treated film, and a laminate appropriately laminated according to the purpose (for example, for antireflection). Circular polarizing plate, polarizing plate with conductive layer for touch panel) can be mentioned. The effect of the present invention becomes remarkable in the non-linear processing of the optical laminate with the pressure-sensitive adhesive layer. Hereinafter, as an example, each step in the method for manufacturing a planar optical laminate with an adhesive layer as shown in FIG. 1 will be described.

A.ワークの形成
図2は、第1切削加工を説明するための概略斜視図であり、本図にワーク1が示されている。図2に示すように、光学積層体を複数枚重ねたワーク1が形成される。粘着剤層付光学積層体は、ワーク形成に際し、代表的には任意の適切な形状に切断されている。具体的には、粘着剤層付光学積層体は矩形形状に切断されていてもよく、矩形形状に類似する形状に切断されていてもよい。図示例では、粘着剤層付光学積層体は矩形形状に切断されており、ワーク1は、互いに対向する外周面(切削面)1a、1bおよびそれらと直交する外周面(切削面)1c、1dを有している。ワーク1は、好ましくは、クランプ手段(図示せず)により上下からクランプされている。ワークの総厚みは好ましくは10mm以上、より好ましくは15mm以上、さらに好ましくは20mm以上である。ワークの総厚みの上限は、例えば150mmである。このような厚みであれば、クランプ手段による押圧または切削加工時の衝撃による損傷を防止し得る。粘着剤層付光学積層体は、ワークがこのような総厚みとなるように重ねられる。ワークを構成する粘着剤層付光学積層体の枚数は、1つの実施形態においては10枚以上であり、1つの実施形態においては30枚~50枚である。クランプ手段(例えば、治具)は、軟質材料で構成されてもよく硬質材料で構成されてもよい。軟質材料で構成される場合、その硬度(JIS A)は、好ましくは60°~80°である。硬度が高すぎると、クランプ手段による押し跡が残る場合がある。硬度が低すぎると、治具の変形により位置ずれが生じ、切削精度が不十分となる場合がある。
A. Forming of Work FIG. 2 is a schematic perspective view for explaining the first cutting process, and the work 1 is shown in this figure. As shown in FIG. 2, a work 1 in which a plurality of optical laminates are stacked is formed. The optical laminate with the pressure-sensitive adhesive layer is typically cut into an arbitrary appropriate shape when the work is formed. Specifically, the optical laminate with the pressure-sensitive adhesive layer may be cut into a rectangular shape, or may be cut into a shape similar to the rectangular shape. In the illustrated example, the optical laminate with the pressure-sensitive adhesive layer is cut into a rectangular shape, and the work 1 has outer peripheral surfaces (cutting surfaces) 1a and 1b facing each other and outer peripheral surfaces (cutting surfaces) 1c and 1d orthogonal to them. have. The work 1 is preferably clamped from above and below by clamping means (not shown). The total thickness of the work is preferably 10 mm or more, more preferably 15 mm or more, still more preferably 20 mm or more. The upper limit of the total thickness of the work is, for example, 150 mm. With such a thickness, it is possible to prevent damage due to pressing by the clamping means or impact during cutting. The optical laminate with the pressure-sensitive adhesive layer is laminated so that the workpieces have such a total thickness. The number of optical laminates with an adhesive layer constituting the work is 10 or more in one embodiment, and 30 to 50 in one embodiment. The clamping means (for example, a jig) may be made of a soft material or a hard material. When composed of a soft material, its hardness (JIS A) is preferably 60 ° to 80 °. If the hardness is too high, imprints may remain due to the clamping means. If the hardness is too low, the jig may be deformed and misaligned, resulting in insufficient cutting accuracy.

B.第1切削加工
上記のようにして形成されたワーク1の外周面(粘着剤層付光学積層体の切断面)を、第1切削手段2により直線的に切削する。第1切削加工は、いわゆる両頭フライス加工である。具体的には、第1切削手段2は、回転板3と切削刃4とを有し、外周面1a、1bに垂直な回転軸Sを有し、任意の適切な駆動機構によって回転軸Sを中心としてR方向に回転可能に構成されている。回転板3は、ワーク1の外周面1a、1bに平行に配されるとともに、側面視円形を呈し、その直径がワーク1の厚みhを超える寸法に設計されている。切削刃4は、回転軸Sの軸方向に突き出して設けられており、回転板3の平面部分にそれぞれ所定の間隔を設けて配置されている。図示例では、一対の第1切削手段2が所定の間隔Dを設けて、切削刃4を有する平面部分を対向させることで、それぞれの切削刃4が外周面1a、1bに対応するように配置されている。切削手段2間の距離Dは、ワーク1を搬入可能であるとともに、切削刃4が所定の切削代を切削するように設定される。一対の第1切削手段2は、距離Dを変化させることができるように回転軸S方向に移動可能に構成される。
B. First cutting process The outer peripheral surface of the work 1 formed as described above (the cut surface of the optical laminate with the adhesive layer) is linearly cut by the first cutting means 2. The first cutting process is a so-called double-headed milling process. Specifically, the first cutting means 2 has a rotary plate 3 and a cutting blade 4, has a rotary shaft S perpendicular to the outer peripheral surfaces 1a and 1b, and has a rotary shaft S by an arbitrary appropriate drive mechanism. It is configured to be rotatable in the R direction as the center. The rotary plate 3 is arranged in parallel with the outer peripheral surfaces 1a and 1b of the work 1, has a circular shape in a side view, and is designed so that its diameter exceeds the thickness h of the work 1. The cutting blades 4 are provided so as to project in the axial direction of the rotating shaft S, and are arranged at predetermined intervals on the flat surface portion of the rotating plate 3. In the illustrated example, the pair of first cutting means 2 are provided with a predetermined interval D so that the flat surface portions having the cutting blades 4 face each other, so that the respective cutting blades 4 are arranged so as to correspond to the outer peripheral surfaces 1a and 1b. Has been done. The distance D between the cutting means 2 is set so that the work 1 can be carried in and the cutting blade 4 cuts a predetermined cutting allowance. The pair of first cutting means 2 is configured to be movable in the rotation axis S direction so that the distance D can be changed.

ワーク1は、回転軸Sに直交する方向(図2の矢印A方向)に移動可能であり、かつ、当該移動面内で回転可能に構成された載置台に載置される。図2および図3(a)に示すように、載置台をA方向に移動させて外周面1a、1bを切削する。次に、第1切削手段2の距離Dを外周面1c、1dに対応するよう変更するとともに、載置台を90°回転させる。図3(b)に示すように、この状態で載置台をA方向に移動させて外周面1c、1dを切削する。このようにして、ワークのすべての外周面の切削(直線的切削)が完了する。なお、図示例ではワークを矢印A方向に移動させているが、第1切削手段をA方向と反対方向に移動させてもよく、ワークをA方向に移動させるとともに第1切削手段をA方向と反対方向に移動させてもよい。 The work 1 is movable in a direction orthogonal to the rotation axis S (direction of arrow A in FIG. 2), and is mounted on a mounting table configured to be rotatable in the moving surface. As shown in FIGS. 2 and 3A, the mounting table is moved in the A direction to cut the outer peripheral surfaces 1a and 1b. Next, the distance D of the first cutting means 2 is changed so as to correspond to the outer peripheral surfaces 1c and 1d, and the mounting table is rotated by 90 °. As shown in FIG. 3B, in this state, the mounting table is moved in the A direction to cut the outer peripheral surfaces 1c and 1d. In this way, cutting (straight cutting) of all outer peripheral surfaces of the work is completed. In the illustrated example, the work is moved in the direction of arrow A, but the first cutting means may be moved in the direction opposite to the direction of A, and the work may be moved in the direction of A and the first cutting means may be moved in the direction of A. You may move it in the opposite direction.

なお、第1切削加工(両頭フライス加工)の詳細については、例えば、特開2005-224935号公報および特開2007-223021号公報に記載されており、当該公報の記載は本明細書に参考として援用される。 The details of the first cutting process (double-headed milling process) are described in, for example, Japanese Patent Application Laid-Open No. 2005-224935 and Japanese Patent Application Laid-Open No. 2007-22231, and the description of the relevant publications is referred to in the present specification. It will be used.

C.第2切削加工
次に、ワーク1の外周面の所定の位置を、第2切削手段20により非直線的に切削する。図1に示すような平面視形状の粘着剤層付光学積層体を作製する場合には、ワークの外周の2つの隅部に面取り部4a、4bを形成し、面取り部4a、4bが形成された外周面の中央部に凹部4cを形成する。第2切削加工は、図4に示すように、いわゆるエンドミル加工である。すなわち、第2切削手段(エンドミル)20の側面を用いて、ワーク1の外周面の所定の位置を非直線的に切削する。第2切削手段(エンドミル)20としては、代表的にはストレートエンドミルが用いられ得る。
C. Second cutting process Next, a predetermined position on the outer peripheral surface of the work 1 is cut non-linearly by the second cutting means 20. When an optical laminate with an adhesive layer having a plan view shape as shown in FIG. 1 is produced, chamfered portions 4a and 4b are formed at two corners of the outer periphery of the work, and chamfered portions 4a and 4b are formed. A recess 4c is formed in the central portion of the outer peripheral surface. As shown in FIG. 4, the second cutting process is a so-called end mill process. That is, the side surface of the second cutting means (end mill) 20 is used to cut a predetermined position on the outer peripheral surface of the work 1 in a non-linear manner. As the second cutting means (end mill) 20, a straight end mill can be typically used.

具体的には、第2切削手段20は、図5に示すように、ワーク1の積層方向(鉛直方向)に延びる回転軸21と、回転軸21を中心として回転する本体の最外径として構成される切削刃22と、を有する。図示例では、切削刃22は、回転軸21に沿ってねじれた最外径として構成されている。切削刃22は、刃先22aと、すくい面22bと、逃がし面22cと、を含む。切削刃22の刃数は、目的に応じて適切に設定され得る。図示例における切削刃は3枚の構成であるが、刃数は連続した1枚であってもよく、2枚であってもよく、4枚であってもよく、5枚以上であってもよい。第2切削手段の刃角度(図示例における切削刃のねじれ角θ)は、好ましくは45°~75°であり、より好ましくは45°~60°である。このような刃角度であれば、粘着剤の削りカスが切削刃から容易に排出され得るので、結果として、ブロッキングが抑制され得る。切削刃の逃がし面は、好ましくは、粗面化処理されている。粗面化処理としては、任意の適切な処理が採用され得る。代表例としては、ブラスト処理が挙げられる。逃がし面に粗面化処理を施すことにより、切削刃への粘着剤の付着が抑制され、結果として、ブロッキングが抑制され得る。逃がし面の粗面化処理と刃角度の調整とを適切に組み合わせることにより、上記の相乗的な効果により、ブロッキングがさらに抑制され得る。 Specifically, as shown in FIG. 5, the second cutting means 20 is configured as a rotating shaft 21 extending in the stacking direction (vertical direction) of the work 1 and an outermost diameter of a main body rotating about the rotating shaft 21. It has a cutting blade 22 to be formed. In the illustrated example, the cutting blade 22 is configured as the outermost diameter twisted along the rotating shaft 21. The cutting blade 22 includes a cutting edge 22a, a rake surface 22b, and a relief surface 22c. The number of cutting blades 22 can be appropriately set according to the purpose. The cutting blade in the illustrated example has a configuration of three blades, but the number of blades may be one continuous blade, two blades, four blades, or five or more blades. good. The blade angle of the second cutting means (twist angle θ of the cutting blade in the illustrated example) is preferably 45 ° to 75 °, more preferably 45 ° to 60 °. With such a blade angle, the shavings of the adhesive can be easily discharged from the cutting blade, and as a result, blocking can be suppressed. The relief surface of the cutting blade is preferably roughened. As the roughening process, any appropriate process can be adopted. A typical example is blasting. By applying the roughening treatment to the relief surface, the adhesion of the adhesive to the cutting blade can be suppressed, and as a result, blocking can be suppressed. By appropriately combining the roughening treatment of the relief surface and the adjustment of the blade angle, blocking can be further suppressed by the above synergistic effect.

上記B項のようにして第1切削加工されたワーク1は、第2切削手段(エンドミル)20により非直線的に切削される。まず、図3(c)に示すように、図1の面取り部4aが形成される部分が面取り加工され、次いで、図3(d)に示すように、面取り部4bが形成される部分が面取り加工される。最後に、図3(e)に示すように、凹部4cが切削形成される。第2切削加工の条件は、所望の形状に応じて適切に設定され得る。例えば、第2切削手段(エンドミル)20の直径は、好ましくは3mm~20mmである。第2切削手段の回転数は、好ましくは1000rpm~60000rpmであり、より好ましくは10000rpm~40000rpmである。第2切削手段の送り速度は、好ましくは500mm/分~10000mm/分であり、より好ましくは500mm/分~2500mm/分である。切削箇所の切削回数は、1回削り、2回削り、3回削りまたはそれ以上であり得る。なお、図示例では面取り部4a、面取り部4bおよび凹部4cをこの順に形成しているが、これらは任意の適切な順序で形成されればよい。 The work 1 that has been first cut as described in item B is cut non-linearly by the second cutting means (end mill) 20. First, as shown in FIG. 3 (c), the portion where the chamfered portion 4a of FIG. 1 is formed is chamfered, and then, as shown in FIG. 3 (d), the portion where the chamfered portion 4b is formed is chamfered. It will be processed. Finally, as shown in FIG. 3 (e), the recess 4c is formed by cutting. The conditions for the second cutting process can be appropriately set according to the desired shape. For example, the diameter of the second cutting means (end mill) 20 is preferably 3 mm to 20 mm. The rotation speed of the second cutting means is preferably 1000 rpm to 60,000 rpm, more preferably 10,000 rpm to 40,000 rpm. The feed rate of the second cutting means is preferably 500 mm / min to 10000 mm / min, and more preferably 500 mm / min to 2500 mm / min. The number of cuts at the cutting location can be one cut, two cuts, three cuts or more. In the illustrated example, the chamfered portion 4a, the chamfered portion 4b, and the recess 4c are formed in this order, but these may be formed in any appropriate order.

第2切削加工で切削される部分の長さ(すなわち、非直線的に切削される部分の長さ)は、第1切削加工および第2切削加工で切削される部分の長さ(すなわち、切削部分全体の長さ)に対して、好ましくは70%以下である。 The length of the portion cut in the second cutting process (that is, the length of the portion cut in a non-linear manner) is the length of the portion cut in the first cutting process and the second cutting process (that is, cutting). It is preferably 70% or less with respect to the length of the entire portion).

第1切削加工および第2切削加工は、好ましくは連続的に行われる。より詳細には、第1切削加工および第2切削加工は、ワーク1を上下からクランプした状態で当該クランプを開放することなく行われる。クランプを開放することなく(すなわち、第1切削加工および第2切削加工を連続的に)行うことにより、ワークを第1切削手段から第2切削手段に付け替える作業を省略して作業効率を向上させることができる。ここで、このような連続的な加工はワークを固定したまま全周を切削加工することになるので、ブロッキングの課題が発生しやすい。しかし、本発明の実施形態によれば、非直線的な加工(切削)のみをエンドミル加工で行うことにより、よりブロッキングの発生しやすいエンドミル加工の領域を少なくすることができ、クランプを開放することなく連続で第1切削加工および第2切削加工を行っても、ブロッキングの発生を抑制することができる。すなわち、本発明の実施形態によれば、ブロッキングを良好に抑制しつつ、作業効率を格段に向上させることができる。 The first cutting process and the second cutting process are preferably performed continuously. More specifically, the first cutting process and the second cutting process are performed with the work 1 clamped from above and below without opening the clamp. By performing the first cutting and the second cutting continuously without opening the clamp (that is, the work of changing the work from the first cutting means to the second cutting means is omitted, the work efficiency is improved. be able to. Here, in such continuous machining, the entire circumference is machined while the work is fixed, so that a blocking problem is likely to occur. However, according to the embodiment of the present invention, by performing only non-linear machining (cutting) by end mill machining, it is possible to reduce the area of end mill machining where blocking is more likely to occur, and the clamp can be opened. It is possible to suppress the occurrence of blocking even if the first cutting process and the second cutting process are continuously performed. That is, according to the embodiment of the present invention, it is possible to significantly improve the work efficiency while satisfactorily suppressing blocking.

以上のようにして、非直線加工された粘着剤層付光学積層体が得られ得る。なお、図示例では第1切削加工(直線加工)および第2切削加工(非直線加工)がこの順に行われる形態について説明したが、第1切削加工および第2切削加工の順序は逆であってもよい。なお、第2切削加工(非直線加工)および第1切削加工(直線加工)がこの順に行われる形態によれば、直線加工時のワークの振動により、非直線加工で生じたブロッキングが解消され得る場合がある。 As described above, an optical laminate with a non-linearly processed pressure-sensitive adhesive layer can be obtained. In the illustrated example, the mode in which the first cutting process (straight line processing) and the second cutting process (non-linear processing) are performed in this order has been described, but the order of the first cutting process and the second cutting process is reversed. May be good. According to the mode in which the second cutting process (non-linear processing) and the first cutting process (straight line processing) are performed in this order, the blocking caused by the non-linear processing can be eliminated by the vibration of the work during the linear processing. In some cases.

以下、実施例により本発明を具体的に説明するが、本発明はこれらの実施例には限定されない。実施例における評価項目は以下のとおりである。 Hereinafter, the present invention will be specifically described with reference to Examples, but the present invention is not limited to these Examples. The evaluation items in the examples are as follows.

(1)ブロッキング
実施例および比較例の切削加工後のワークの状態を観察し、以下の基準で評価した。
○:ワークから個々の光学積層体への分離が容易であった
△:ワークから個々の光学積層体への分離は可能であるが、分離操作が困難であった
×:ワークが完全にブロック状となっており、個々の光学積層体への分離が不可能であった
(2)刃汚れ
実施例および比較例の切削加工後の第2切削手段(エンドミル)の粘着剤による汚染状態を観察し、以下の基準で評価した。
○:汚染は実質的に認められなかった
△:汚染が認められたが、加工に問題は生じなかった
×:著しい汚染が認められ、加工にも問題が生じた
(1) Blocking The state of the workpiece after cutting in the examples and comparative examples was observed and evaluated according to the following criteria.
◯: It was easy to separate the work from the individual optical laminates Δ: It was possible to separate the work from the individual optical laminates, but the separation operation was difficult ×: The work was completely block-shaped (2) Blade dirt The state of contamination by the adhesive of the second cutting means (end mill) after cutting in the examples and comparative examples was observed. , Evaluated according to the following criteria.
○: Substantially no contamination was observed △: Contamination was observed, but no problem occurred in processing. ×: Significant contamination was observed, and there was a problem in processing.

<参考例1:ワークの作製>
偏光子として、長尺状のポリビニルアルコール(PVA)系樹脂フィルムにヨウ素を含有させ、長手方向(MD方向)に一軸延伸して得られたフィルム(厚み28μm)を用いた。この偏光子の片側に粘着剤層(厚み5μm)を形成し、当該粘着剤層を介して、長尺状のHC-TACを互いの長手方向を揃えるようにして貼り合わせた。なお、HC-TACフィルムは、トリアセチルセルロース(TAC)フィルム(25μm)にハードコート(HC)層(2μm)が形成されたフィルムであり、TACフィルムが偏光子側となるようにして貼り合わせた。得られた偏光子/TACフィルム/HC層の積層体の両側に粘着剤層を形成し、それぞれの粘着剤層にセパレーターを貼り合わせ、長尺状の粘着剤層付光学積層体(粘着剤層付偏光板)を得た。
得られた粘着剤層付偏光板を5.7インチサイズ(縦140mmおよび横65mm程度)に打ち抜き、打ち抜いた偏光板を40枚重ねてワークとした。
<Reference example 1: Fabrication of work>
As a substituent, a film (thickness 28 μm) obtained by containing iodine in a long polyvinyl alcohol (PVA) -based resin film and uniaxially stretching it in the longitudinal direction (MD direction) was used. A pressure-sensitive adhesive layer (thickness 5 μm) was formed on one side of the polarizing element, and long HC-TACs were bonded together via the pressure-sensitive adhesive layer so as to align their longitudinal directions with each other. The HC-TAC film is a film in which a hard coat (HC) layer (2 μm) is formed on a triacetyl cellulose (TAC) film (25 μm), and the TAC film is bonded so as to be on the substituent side. .. Adhesive layers are formed on both sides of the obtained laminate of the polarizing element / TAC film / HC layer, and a separator is attached to each of the adhesive layers to form an optical laminate with a long adhesive layer (adhesive layer). A polarizing plate) was obtained.
The obtained polarizing plate with an adhesive layer was punched out to a size of 5.7 inches (length 140 mm and width 65 mm), and 40 punched polarizing plates were stacked to form a work.

<実施例1>
参考例1で得られたワークをクランプ(治具)で挟んだ状態で、エンドミル加工により、ワークの外周の2つの隅部に面取り部を形成し、面取り部が形成された外周面の中央部に凹部を形成した。
次いで、図2に示すような装置を用いた両頭フライス加工により、ワークの外周面を直線的に切削し、図1に示すような非直線加工された粘着剤層付偏光板を得た。
ここで、エンドミルの刃数は2枚であり、刃角度(ねじれ角)は45°であった。また、エンドミルの送り速度は1400mm/分であり、回転数は30000rpmであった。
加工後のワークの状態およびエンドミルの刃汚れについて、上記(1)および(2)のようにして評価した。結果を表1に示す。
<Example 1>
With the work obtained in Reference Example 1 sandwiched between clamps (jigs), chamfered portions are formed at the two corners of the outer periphery of the work by end milling, and the central portion of the outer peripheral surface on which the chamfered portions are formed. A recess was formed in.
Next, a double-headed milling cutter as shown in FIG. 2 was used to linearly cut the outer peripheral surface of the work to obtain a non-linearly processed polarizing plate with an adhesive layer as shown in FIG.
Here, the number of blades of the end mill was two, and the blade angle (twist angle) was 45 °. The feed rate of the end mill was 1400 mm / min, and the rotation speed was 30,000 rpm.
The state of the work after processing and the blade stain of the end mill were evaluated as described in (1) and (2) above. The results are shown in Table 1.

<実施例2>
エンドミルの刃角度を60°としたこと以外は実施例1と同様にして、図1に示すような非直線加工された粘着剤層付偏光板を得た。加工後のワークの状態およびエンドミルの刃汚れについて、実施例1と同様にして評価した。結果を表1に示す。
<Example 2>
A polarizing plate with an adhesive layer processed in a non-linear manner as shown in FIG. 1 was obtained in the same manner as in Example 1 except that the blade angle of the end mill was 60 °. The state of the work after processing and the dirt on the blade of the end mill were evaluated in the same manner as in Example 1. The results are shown in Table 1.

<実施例3>
エンドミルの刃角度を20°としたこと以外は実施例1と同様にして、図1に示すような非直線加工された粘着剤層付偏光板を得た。加工後のワークの状態およびエンドミルの刃汚れについて、実施例1と同様にして評価した。結果を表1に示す。
<Example 3>
A polarizing plate with an adhesive layer processed in a non-linear manner as shown in FIG. 1 was obtained in the same manner as in Example 1 except that the blade angle of the end mill was 20 °. The state of the work after processing and the dirt on the blade of the end mill were evaluated in the same manner as in Example 1. The results are shown in Table 1.

<実施例4>
両頭フライス加工とエンドミル加工の順序を入れ替えたこと以外は実施例1と同様にして、図1に示すような非直線加工された粘着剤層付偏光板を得た。加工後のワークの状態およびエンドミルの刃汚れについて、実施例1と同様にして評価した。結果を表1に示す。
<Example 4>
A polarizing plate with a non-linearly processed adhesive layer was obtained in the same manner as in Example 1 except that the order of double-headed milling and end milling was changed. The state of the work after processing and the dirt on the blade of the end mill were evaluated in the same manner as in Example 1. The results are shown in Table 1.

<比較例1>
エンドミル加工のみで図1に示すような非直線加工された粘着剤層付偏光板を得た。加工後のワークの状態およびエンドミルの刃汚れについて、実施例1と同様にして評価した。結果を表1に示す。本比較例においては、ワークのブロッキングが著しかった。さらに、エンドミルの切断刃への粘着剤の付着が激しく、ワークごとにエンドミルを入念に掃除しなければならなかった。
<Comparative Example 1>
A polarizing plate with an adhesive layer processed in a non-linear manner as shown in FIG. 1 was obtained only by end mill processing. The state of the work after processing and the dirt on the blade of the end mill were evaluated in the same manner as in Example 1. The results are shown in Table 1. In this comparative example, work blocking was remarkable. Furthermore, the adhesive adhered severely to the cutting blade of the end mill, and the end mill had to be carefully cleaned for each work.

<比較例2>
トムソン刃を用いた打ち抜き加工により、図1に示すような非直線加工された粘着剤層付偏光板を得た。加工後のワークの状態およびトムソン刃の刃汚れについて、実施例1と同様にして評価した。結果を表1に示す。本比較例においては、得られた偏光板において(特に、凹部で)200μm程度のクラックが発生した。
<Comparative Example 2>
By punching using a Thomson blade, a non-linearly processed polarizing plate with an adhesive layer as shown in FIG. 1 was obtained. The state of the work after processing and the blade stain of the Thomson blade were evaluated in the same manner as in Example 1. The results are shown in Table 1. In this comparative example, cracks of about 200 μm occurred in the obtained polarizing plate (particularly in the recesses).

<比較例3>
COレーザー(波長:9.35μm、出力:150W)を用いて切削し、図1に示すような非直線加工された粘着剤層付偏光板を得た。加工後のワークの状態について、実施例1と同様にして評価した。結果を表1に示す。本比較例においては、切削部近傍において偏光解消領域が認められた。
<Comparative Example 3>
Cutting was performed using a CO 2 laser (wavelength: 9.35 μm, output: 150 W) to obtain a non-linearly processed polarizing plate with an adhesive layer as shown in FIG. The state of the work after processing was evaluated in the same manner as in Example 1. The results are shown in Table 1. In this comparative example, a polarization elimination region was observed near the cutting portion.

Figure 0007014653000001
Figure 0007014653000001

本発明の製造方法は、非直線加工が必要とされる粘着剤層付光学積層体の製造に好適に用いられ得る。本発明の製造方法により得られる粘着剤層付光学積層体は、自動車のインストゥルメントパネルやスマートウォッチに代表される異形の画像表示部に好適に用いられ得る。 The production method of the present invention can be suitably used for producing an optical laminate with an adhesive layer that requires non-linear processing. The optical laminate with an adhesive layer obtained by the production method of the present invention can be suitably used for an image display unit having a deformed shape represented by an instrument panel of an automobile or a smart watch.

1 ワーク
2 第1切削手段
20 第2切削手段
1 Work 2 1st cutting means 20 2nd cutting means

Claims (6)

粘着剤層付光学積層体を複数枚重ねてワークを形成すること、
該ワークの外周面の切断面に垂直な回転軸と該切断面側に突出して設けられた切削刃とを有する第1切削手段を回転させながら、該ワークおよび該第1切削手段を相対的に移動させて、該ワークの外周面を直線的に切削する第1切削を行うこと、および
該ワークの積層方向に延びる回転軸と該回転軸を中心として回転する本体の最外径として構成された切削刃とを有する第2切削手段を回転させながら、該ワークおよび該第2切削手段を相対的に移動させて、該ワークの外周面を非直線的に切削する第2切削を行うこと、
を含み、
該ワークを上下からクランプした状態で、クランプを開放することなく連続的に該第1切削および該第2切削が行われる、
非直線加工された粘着剤層付光学積層体の製造方法。
Forming a work by stacking multiple optical laminates with an adhesive layer,
While rotating the first cutting means having a rotation axis perpendicular to the cutting surface of the outer peripheral surface of the work and a cutting blade provided so as to project toward the cutting surface side, the work and the first cutting means are relatively moved. It was configured to perform the first cutting that linearly cuts the outer peripheral surface of the work by moving it, and as the outermost diameter of the rotation axis extending in the stacking direction of the work and the main body rotating around the rotation axis. While rotating the second cutting means having the cutting blade, the work and the second cutting means are relatively moved to perform the second cutting in which the outer peripheral surface of the work is cut non-linearly.
Including
With the work clamped from above and below , the first cutting and the second cutting are continuously performed without opening the clamp .
A method for manufacturing an optical laminate with an adhesive layer that has been processed in a non-linear manner.
前記光学積層体が偏光板である、請求項に記載の製造方法。 The manufacturing method according to claim 1 , wherein the optical laminate is a polarizing plate. 前記第2切削加工で切削される部分の長さが、前記第1切削加工および該第2切削加工で切削される部分の長さに対して70%以下である、請求項1または2に記載の製造方法。 The first or second claim, wherein the length of the portion cut by the second cutting process is 70% or less with respect to the length of the portion cut by the first cutting process and the second cutting process. Manufacturing method. 前記第2切削の後に前記第1切削が行われる、請求項1からのいずれかに記載の製造方法。 The manufacturing method according to any one of claims 1 to 3 , wherein the first cutting is performed after the second cutting. 前記第2切削手段の刃角度が45°~75°である、請求項1からのいずれかに記載の製造方法。 The manufacturing method according to any one of claims 1 to 4 , wherein the blade angle of the second cutting means is 45 ° to 75 °. 前記第2切削手段の直径が3mm~20mmである、請求項1からのいずれかに記載の製造方法。 The manufacturing method according to any one of claims 1 to 5 , wherein the diameter of the second cutting means is 3 mm to 20 mm.
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