JP7015686B2 - Optical device and manufacturing method of optical device - Google Patents

Description

The present invention relates to an optical device and a method for manufacturing an optical device.

Conventionally, in automatic doors and the like, a person is detected by an infrared sensor to open and close the door. In the infrared sensor provided in the automatic door or the like as described above, since it is necessary to detect only the person standing in front of the door, the viewing angle of the infrared sensor is limited. That is, the angle range of the light input to the light receiving surface of, for example, the photoelectric conversion element included in the infrared sensor is limited by the viewing angle limiting body.
As described above, in the infrared sensor provided with the viewing angle limiting body, a member including the photoelectric conversion element and a member including the viewing angle limiting body are created, and then the members are bonded to each other to limit the viewing angle. A method of manufacturing an infrared sensor having a body, and a method of forming a viewing angle limiting body integrally with a sealing body for sealing a photoelectric conversion element using a mold (see, for example, Patent Document 1). , A method of forming a viewing angle limiting body by etching a sealing body for sealing a photoelectric conversion element (see, for example, Patent Document 2) has been proposed.

Japanese Unexamined Patent Publication No. 2012-215436 International Publication No. 2006/095834

As described above, in the method of bonding the member including the photoelectric conversion element and the member including the viewing angle limiting body, the member including the photoelectric conversion element and the member including the viewing angle limiting body are manufactured in separate steps. After that, it is necessary to bond the two together, which makes the manufacturing process complicated. Similarly, in the method of forming the viewing angle limiting body by etching the sealing member that seals the photoelectric conversion element, it is necessary to provide a step of manufacturing the sealing body and an etching step. Further, in the method of integrally forming the photoelectric conversion element and the viewing angle limiting body by using a mold, for example, a mold is used to cover the light receiving surface of the photoelectric conversion element and the mold resin so as to surround the light receiving surface. When the viewing angle limiting body made of the above is manufactured, there is a possibility that the mold resin leaks from the gap between the mold and the photoelectric conversion element. Therefore, there is a possibility that the mold resin adheres to the light receiving surface of the photoelectric conversion element, the light receiving area of the light receiving surface is reduced, and the light receiving efficiency is lowered. In order to avoid this, if the mold and the light receiving surface are brought into close contact with each other so that the mold resin does not leak to the light receiving surface, stress is applied to the photoelectric conversion element, which may affect the photoelectric conversion element. ..
Therefore, the present invention has been made by paying attention to the above-mentioned conventional unsolved problems, and can be realized without lowering the luminous efficiency of the photoelectric conversion element and without complicated manufacturing process. It is an object of the present invention to provide an optical device having a possible viewing angle limiter and a method for manufacturing the optical device.

In order to achieve the above object, the optical device according to one aspect of the present invention has a photoelectric conversion function, and has a photoelectric conversion unit having a light receiving surface for receiving light, and the light receiving surface is exposed to the photoelectric conversion unit. It is provided with a sealing portion for sealing so as to be provided , and a viewing angle limiting body provided so as to directly adhere to the exposed surface of the light receiving surface of the sealing portion in a plan view and surround the periphery of the light receiving surface. It is characterized in that the distance between the inner walls of the viewing angle limiting body is the narrowest in the height of the light receiving surface and gradually widens as the distance from the light receiving surface increases .
Further, the method for manufacturing an optical device according to another aspect of the present invention has a photoelectric conversion function or an electric light conversion function on a support member, and has a photoelectric conversion unit and a lead terminal having a light receiving / receiving surface for receiving or emitting light. Are arranged apart from each other, the photoelectric conversion unit and the lead terminal are connected by a conductor, and at least a part of the lead terminal and the region excluding the light emitting / receiving surface of the photoelectric conversion unit are first formed by using the first mold. It is sealed with a sealing member, the support member is removed from the photoelectric conversion part and the lead terminal to form a photoelectric conversion block, and a second mold is used on the surface of the photoelectric conversion block where the light emitting / receiving surface is exposed. (Ii) The sealing member is brought into direct contact with each other to form a viewing angle limiting body that surrounds the light emitting / receiving surface so that the light receiving / receiving surface is exposed.

According to one aspect of the present invention, it is possible to realize an optical device provided with a viewing angle limiter without causing a decrease in luminous efficiency of the photoelectric conversion element and without complicated manufacturing steps.

It is a schematic block diagram which shows an example of the optical device which concerns on 1st Embodiment of this invention. It is a process drawing which shows an example of the manufacturing process of the optical device which concerns on 1st Embodiment. This is an example of a lead frame. It is a schematic block diagram which shows an example of the optical device which concerns on 2nd Embodiment. It is a schematic block diagram which shows an example of the optical device which concerns on 3rd Embodiment. It is a schematic block diagram which shows an example of the optical device which concerns on 4th Embodiment. It is a schematic block diagram which shows an example of the optical device which concerns on 5th Embodiment. It is a process diagram which shows an example of the manufacturing process of the optical device which concerns on 5th Embodiment.

The following detailed description describes many specific specific configurations to provide a complete understanding of the embodiments of the present invention. However, it is clear that other embodiments can be implemented without being limited to such specific specific configurations. Further, the following embodiments do not limit the invention according to the claims, but include all combinations of characteristic configurations described in the embodiments.
Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the description of the following drawings, the same parts are designated by the same reference numerals. However, the drawings are schematic, and the relationship between the thickness and the plane dimensions, the ratio of the thickness of each layer, etc. are different from the actual ones.

(1) Configuration of Optical Device FIG. 1 is a schematic configuration diagram showing an example of an optical device 1 according to an embodiment of the present invention.
1 (a) is a bottom view of the optical device 1, FIG. 1 (b) is a sectional view taken along the line AA'of FIG. 1 (a), FIG. 1 (c) is a plan view of the optical device 1, and FIG. d) is a cross-sectional view taken along the line BB'in FIG. 1 (c). Note that FIG. 1D shows a cross-sectional view in a state of being mounted on a substrate.
As shown in FIG. 1, the optical device 1 includes a photoelectric conversion unit 11, a sealing unit 12, and a viewing angle limiting body 13.
The photoelectric conversion unit 11 includes a photoelectric conversion element having a photoelectric conversion function or a lightning conversion function, having a light receiving / receiving surface for receiving or emitting light, and a photodetecting element such as a light emitting diode or an infrared sensor. Will be done.

The photoelectric conversion unit 11 is electrically connected to the lead terminal 15 by the conductor 14. The photoelectric conversion unit 11 is formed in a rectangular shape in a plan view, and the lead terminal 15 is arranged at a position facing the outer surface of the photoelectric conversion unit 11 so as to surround the outside of the photoelectric conversion unit 11 in a plan view. For example, four lead terminals 15 are arranged near the corners of the photoelectric conversion unit 11 so as to face the side surfaces of the photoelectric conversion unit 11 in a plan view, and each of the lead terminals 15 is connected to the photoelectric conversion unit 11 by a conductor 14.
The sealing portion 12 seals a portion of the photoelectric conversion unit 11 excluding the light emitting / receiving surface 11a and a portion excluding a part of the conductor 14 and the lead terminal 15 to form a photoelectric conversion block 10 having a substantially rectangular parallelepiped shape. At this time, when the surface where the light emitting / receiving surface 11a of the photoelectric conversion unit 11 of the photoelectric conversion block 10 is exposed is the upper surface, the lead terminals 15 are exposed on the upper surface, the lower surface, and the pair of side surfaces facing each other of the photoelectric conversion block 10. In each lead terminal 15, a part of the lead terminal 15 is continuously exposed on each of the lower surface of the photoelectric conversion block 10 and one side surface of the pair of side surfaces, and similarly, the other side surface and the lower surface are exposed. In each of the above, a part of the lead terminal 15 is sealed so as to be continuously exposed.

The viewing angle limiting body 13 has a substantially rectangular parallelepiped shape formed on the surface of the photoelectric conversion block 10 where the light emitting / receiving surface 11a is exposed, that is, on the upper surface thereof, and the through hole 13a is formed, and the inner wall of the viewing angle limiting body 13 is formed. , Is formed so as to surround the light receiving / receiving surface 11a. The inner wall of the through hole 13a is formed so that the distance between the inner walls becomes wider as the distance from the light receiving / receiving surface 11a increases in the vertical cross-sectional view.
Further, the through hole 13a is formed at a position overlapping a part of each lead terminal 15 in a plan view.

(2) Manufacturing Method of Optical Device FIG. 2 is a process diagram showing a manufacturing method of the optical device 1.
First, an adhesive sheet 21 is prepared, and the back surface of a lead frame 22 in which a plurality of lead terminals 15 are integrally formed is attached to the adhesive layer of the adhesive sheet 21 (FIG. 2A). As the pressure-sensitive adhesive sheet 21, a resin tape (for example, polyimide tape) having both adhesiveness and heat resistance is used. As for the adhesiveness, it is preferable that the adhesive layer has a thinner adhesive thickness.
As shown in FIG. 3, the lead frame 22 is formed by continuously forming a plurality of portions in which a portion serving as a lead terminal 15 of one optical device is integrally formed, and as shown in FIG. 3, the photoelectric conversion block 10 is formed. The portions of the lead terminals exposed from the side surface are opposed to each other, and the portions of the lead terminals of the plurality of optical devices are continuously formed in one direction.

Next, as shown in FIG. 2B, the photoelectric conversion unit 11 made of a photoelectric conversion element is positioned at the installation location of the photoelectric conversion unit 11 surrounded by the four lead terminals 15 in the lead frame 22. .. Then, the back surface of the photoelectric conversion unit 11 is attached to the adhesive layer of the adhesive sheet 21.
Next, as shown in FIG. 2C, a portion of the lead frame 22 that becomes a lead terminal 15 and an electrode (not shown) of the photoelectric conversion unit 11 are electrically connected by a conductor 14.
Next, as shown in FIG. 2D, the upper mold 23 and the lower mold 24 are used as the first mold for forming the photoelectric conversion block 10, and the upper mold is placed on the surface side of the lead frame 22. The mold 23 is arranged, and the lower mold 24 is arranged on the back surface side of the lead frame 22, that is, on the adhesive sheet 21 side. The surface of the upper mold 23 in contact with the lower mold 24 is a flat surface. The lower mold 24 has a concave portion, and the upper mold 23 and the lower mold 24 are overlapped with each other in a state where the lead frame 22 and the adhesive sheet 21 to which the photoelectric conversion unit 11 is attached are housed in the concave portion. A first sealing member made of molten epoxy resin or the like is injected from the side into the space sandwiched between the mold 23 and the lower mold 24 to fill the space. As a result, the sealing portion 12 is formed. That is, the lead frame 22, the photoelectric conversion unit 11, and the conductor 14 are integrally sealed by the first sealing member.

Next, the upper mold 23 and the lower mold 24 are opened, and a resin layer in which the photoelectric conversion unit 11 and the lead frame 22 are integrated by the first sealing member is formed between the upper mold 23 and the lower mold 24. Take out (FIG. 2 (e)).
Then, the adhesive sheet 21 is removed with the adhesive sheet 21 side facing up (FIG. 2 (f)). The surface from which the adhesive sheet 21 has been removed is exposed from the light receiving / receiving surface 11a from the sealing portion 12. This completes the photoelectric conversion block 10.

Next, the upper mold 25 and the lower mold 26 were used as the second mold for forming the viewing angle limiting body 13, and the light emitting / receiving surface 11a of the photoelectric conversion unit 11 of the photoelectric conversion block 10 was exposed. The upper mold 25 is arranged on the side, and the lower mold 26 is arranged on the opposite surface of the photoelectric conversion block 10. The upper mold 25 is formed with a plurality of recesses for forming a viewing angle limiting body surrounding the light emitting / receiving surface 11a. The lower mold 26 has a recess, and the photoelectric conversion block 10 is housed in this recess with the exposed side of the light emitting / receiving surface 11a facing up, and the film 27 is arranged along the inside of the upper mold 25. In this state, the upper mold 25 and the lower mold 26 are overlapped with each other (FIG. 2 (g)). At this time, a part of the surface of the lead frame 22 and the upper mold 25 are in contact with each other via the film 27. Then, in a state where the upper mold 25, the light emitting / receiving surface 11a, and a part of the lead frame 22 are in contact with each other without a gap through the film 27, the space sandwiched between the upper mold 25 and the lower mold 26 is formed. A second sealing member made of molten epoxy resin or the like is injected from the side and filled. As a result, the viewing angle limiting body 13 is formed.

At this time, since the second sealing member is filled in a state where the upper mold 25, the light emitting / receiving surface 11a, and a part of the lead frame 22 are in contact with each other without a gap through the film 27, the receiver is received. Adhesion of the second sealing member to the surface of the light emitting surface 11a is suppressed.
Next, the upper mold 25 and the lower mold 26 are opened, the photoelectric conversion block 10 is taken out from between the upper mold 25 and the lower mold 26, and the film 27 is removed (FIG. 2 (h)).
After that, a dicing tape 28 is attached to the surface of the photoelectric conversion block 10 opposite to the viewing angle limiting body 13 (FIG. 2 (i)), and a part of the lead frame 22 is attached to the side surface of the photoelectric conversion block 10 by the dicing device. The viewing angle limiting body 13 and the photoelectric conversion block 10 are cut at a position where the light is exposed, and the optical device 1 whose lead terminal 15 is exposed on the side surface is cut out (FIG. 2 (j)). At this time, by cutting only the viewing angle limiting body 13 and the photoelectric conversion block 10 without cutting the dicing tape 28, a plurality of optical devices 1 can be obtained while being fixed to the dicing tape 28.

At least one of the first sealing member and the second sealing member is made of a resin material containing a filler. By including the filler in this way, reliability and thermal conductivity can be improved. Further, the first sealing member and the second sealing member may be the same member or may be different as long as at least one of them contains a filler.
Further, since the viewing angle limiting body 13 is formed by directly contacting the second sealing member with the photoelectric conversion block 10, the sealing portion 12 of the photoelectric conversion block 10 and the viewing angle limiting body 13 are directly connected to each other. In close contact. Here, since the filler is contained in at least one of the first sealing member and the second sealing member, the sealing portion 12 of the photoelectric conversion block 10 and the viewing angle limiting body 13 are monitored by monitoring the distribution state of the filler. You can see the boundaries of. That is, since the filler does not exist across the boundary between the sealing portion 12 and the viewing angle limiting body 13, the distribution state of the filler is monitored, and for example, the position where the filler exists along a substantially straight line is detected. The boundary between the sealing portion 12 and the viewing angle limiting body 13 can be visually confirmed.

(effect)
As shown in FIG. 2, the optical device 1 is configured to perform sealing in two stages of sealing for forming the photoelectric conversion block 10 and sealing for forming the viewing angle limiting body 13. Therefore, it can be produced by a series of sealing steps. Therefore, for example, as in the conventional method, a method of bonding the photoelectric conversion unit side and the viewing angle limiting body side, or a method of etching a sealed body in which a photoelectric conversion element is sealed to form a viewing angle limiting body, Alternatively, the optical device 1 can be manufactured without complicated manufacturing steps as compared with the method of molding the photoelectric conversion unit and forming the viewing angle limiter.

Further, as shown in FIG. 2 (g), the photoelectric conversion block 10 is sealed for producing the viewing angle limiting body 13 by using the molds 25 and 26 for producing the viewing angle limiting body. At this time, the light emitting / receiving surface 11a of the photoelectric conversion unit 11 and the lead frame 22 are flush with each other, and even if the photoelectric conversion block 10 is sandwiched between the molds 25 and 26 for manufacturing the viewing angle limiting body, the viewing angle The movement of the molds 25 and 26 for producing the restricted body is restricted by the lead frame 22. Therefore, even if the photoelectric conversion block 10 is sandwiched between the molds 25 and 26 for manufacturing the viewing angle limiting body, it is possible to suppress the stress applied to the photoelectric conversion unit 11. Since it is possible to suppress the application of stress to the photoelectric conversion unit 11, the molds 25 and 26 for manufacturing the viewing angle limiting body and the photoelectric conversion block 10 can be sandwiched so as to be in close contact with each other. As a result, it is possible to prevent the second sealing member from leaking from the gap between the molds 25 and 26 for manufacturing the viewing angle limiting body and the photoelectric conversion block 10. Therefore, it is possible to prevent the second sealing member from adhering to the light receiving / emitting surface 11a of the photoelectric conversion unit 11 and to suppress the decrease in the luminous efficiency of the photoelectric conversion unit 11.

Further, although the photoelectric conversion block 10 and the viewing angle limiting body 13 are manufactured as separate bodies, after that, the photoelectric conversion block 10 is sealed to manufacture the viewing angle limiting body 13, so that the photoelectric conversion is performed. The exposed portion of the photoelectric conversion block 10 and the viewing angle limiting body 13 can be brought into close contact with each other without providing an adhesive layer for adhering the block 10 and the viewing angle limiting body 13.
Further, the farther the inner wall of the viewing angle limiting body 13 is from the light emitting / receiving surface 11a side of the photoelectric conversion unit 11, the wider the distance between the inner walls in the vertical cross-sectional view is made. Therefore, when removing the molds 25 and 26 for forming the viewing angle limiting body, it can be easily removed from the viewing angle limiting body 13, and when removing the molds 25 and 26, unnecessary stress is applied to the viewing angle limiting body. It is possible to suppress the influence on 13. That is, it is possible to avoid being affected by the deformation of the viewing angle limiting body 13 or the peeling of the viewing angle limiting body 13 due to the application of unnecessary stress, and to obtain the viewing angle limiting body 13 having a good shape. Obtainable.

Further, as shown in FIG. 1, the four lead terminals 15 are exposed on the lower surface of the optical device 1 and each of the pair of side surfaces facing each other, and are continuously exposed on the lower surface and the side surface of the optical device 1. is doing. Therefore, when the optical device 1 is mounted on the substrate 2, as shown in FIG. 1 (d), the side surface of the photoelectric conversion block 10 and the side surface of the photoelectric conversion block 10 are exposed at the lead terminal 15 portion exposed from the pair of opposite side surfaces of the photoelectric conversion block 10. By mounting the optical device 1 on the substrate 2 with, for example, solder 16 so as to be in contact with the lead terminal 15 continuously exposed from the lower surface, the optical device 1 can be reliably fixed by the substrate 2. Further, since the solder 16 can be fixed from the lower surface of the photoelectric conversion block 10 to the pair of facing side surfaces, the optical device 1 can be fixed not only from the lower surface but also from the pair of facing side surfaces, and the mounting strength of the optical device 1 can be fixed. Can be further improved.

Further, as shown in FIG. 1, the lead terminal 15 is arranged so as to surround the photoelectric conversion unit 11. Therefore, when the photoelectric conversion unit 11 is, for example, an infrared sensor, stable sensing can be performed. Further, when the photoelectric conversion unit 11 is, for example, a light emitting diode, the heat dissipation effect can be improved. In particular, since the lead terminal 15 is exposed on the lower surface of the optical device and the pair of side surfaces facing each other, the heat dissipation effect can be improved. Can be enhanced.

Next, the second embodiment of the present invention will be described.
In this second embodiment, as shown in FIG. 4, in the optical device 1 in the first embodiment shown in FIG. 1, a photoelectric conversion unit 11 provided with a filter unit 31 is used. The same parts as those of the optical device 1 in the first embodiment shown in FIG. 1 are designated by the same reference numerals, and detailed description thereof will be omitted. 4 (a) is a bottom view of the optical device 1, FIG. 4 (b) is a sectional view taken along the line AA'of FIG. 4 (a), and FIG. 4 (c) is a plan view of the optical device 1 and FIG. 4 (c). d) is a cross-sectional view taken along the line BB'in FIG. 4 (c). Note that FIG. 4D shows a cross-sectional view in a state of being mounted on the substrate 2.

As shown in FIG. 4, the optical device 1 according to the second embodiment is the optical device 1 according to the first embodiment, for example, a photoelectric conversion unit 11 with a filter unit 31 formed as a chip and a sealing unit 12. And the viewing angle limiting body 13. Here, the surface of the filter unit 31 opposite to the photoelectric conversion unit 11 is referred to as the surface 31a of the filter unit 31.
The sealing portion 12 seals a portion excluding a part of the photoelectric conversion portion 11, the conductor 14, and the lead terminal 15 and a portion of the filter portion 31 excluding the surface 31a to form a substantially rectangular parallelepiped photoelectric conversion block 30. do. That is, when the surface of the photoelectric conversion block 30 where the filter unit 31 is exposed is the upper surface, the surface 31a of the filter unit 31 and a part of each lead terminal 15 are exposed on the upper surface of the photoelectric conversion block 30, and the photoelectric conversion is performed. Each lead terminal 15 is exposed on the lower surface of the block 30 and each of the pair of side surfaces facing each other, and is continuously exposed on one side surface and the lower surface, and similarly continuously exposed on the other side surface and the lower surface. ..

Then, the viewing angle limiting body 13 is formed on the upper surface side of the photoelectric conversion block 30.
Since the optical device 1 according to the second embodiment can obtain the same effect as that of the first embodiment and further includes the filter unit 31, it receives only light having a predetermined wavelength such as infrared rays. be able to.
Further, it is conceivable to provide the filter unit 31 not in the photoelectric conversion unit 11 but in the opening of the viewing angle limiting body 13, but in this case, a step of further providing the filter unit 31 after forming the viewing angle limiting body 13 is required. It becomes. In the optical device 1 according to the second embodiment, since the filter unit 31 is provided in the photoelectric conversion block 30, it is possible to avoid complicating the manufacturing process.

Further, also in the optical device 1 according to the second embodiment, when the optical device 1 is mounted on the substrate 2, as shown in FIG. 4D, the lead terminals exposed from the pair of facing side surfaces of the photoelectric conversion block 30 are exposed. By mounting the solder 16 on the substrate 2 with, for example, solder 16 so as to be in contact with the lead terminals 15 continuously exposed from the lower surface to the side surface of the photoelectric conversion block 30 at the 15th portion, the solder 16 is mounted from both sides of the pair of opposite side surfaces of the optical device 1. By fixing with the solder, it is possible to suppress tilting of the optical device 1 and the like.

Next, a third embodiment of the present invention will be described.
In this third embodiment, as shown in FIG. 5, the width of the viewing angle limiting body 13 is narrower than the width of the photoelectric conversion block 40 in the side view. Here, as shown in FIG. 5, when the optical device 1 is mounted on the substrate 2, the direction extending along the substrate 2 is defined as the width of the optical device 1, and similarly, the direction extending along the substrate 2 is the viewing angle. The width of the limiting body 13 and the width of the photoelectric conversion block 40 are set.

FIG. 5 is a schematic configuration diagram showing an example of the optical device 1 according to the third embodiment. 5 (a) is a bottom view of the optical device 1, FIG. 5 (b) is a sectional view taken along the line AA'of FIG. 5 (a), FIG. 5 (c) is a plan view of the optical device 1, and FIG. 5 (d). Is a cross-sectional view taken along the line BB'in FIG. 5 (c). Note that FIG. 5B shows a cross-sectional view in a state of being mounted on the substrate 2.
As shown in FIG. 5, in the optical device 1 according to the third embodiment, the photoelectric conversion unit 11, the sealing unit 12, and the filter unit 31 are integrally sealed to form a photoelectric conversion block 40, and the photoelectric conversion block 40 is formed. The viewing angle limiting body 13 is provided on the block 40. Further, as shown in FIG. 5A, the lead terminals 15 are symmetrically provided with the photoelectric conversion unit 11 provided with the filter unit 31 interposed therebetween, and the viewing angle limiting body 13 is the left and right lead terminals 15 in a plan view. It is formed so that it fits between.

That is, in a plan view, the width of the viewing angle limiting body 13 is formed to be narrower than the width of the photoelectric conversion block 40, and the viewing angle limiting body 13 on the surface facing the viewing angle limiting body 13 of the photoelectric conversion block 40. The lead terminal 15 is exposed in a region that does not face the lead terminal 15. That is, the lead terminals 15 are exposed on the upper and lower surfaces of the photoelectric conversion block 40, and on each of the side surfaces that are continuous on both the upper and lower surfaces, and the lead terminals 15 on each surface are continuously exposed.

Therefore, when the optical device 1 is mounted on the substrate 2, as shown in FIG. 5B, the side surface of the photoelectric conversion block 40 is mounted so as to face the substrate 2, so that the photoelectric conversion block of the lead terminal 15 is mounted. The optical device 1 is more firmly fixed to the substrate 2 by mounting the portion exposed on the side surface of the 40 and the portion exposed on the upper surface and the lower surface of the photoelectric conversion block 40 on the substrate 2 by, for example, soldering 16. Can be done. Further, since the optical device 1 can be fixed by the solder 16 from both the upper surface and the lower surface of the photoelectric conversion block 40, as shown in FIG. 5B, even the vertical optical device 1 is an optical device. By fixing from both sides of 1 and further fixing at both ends in the width direction of the optical device, the mounting strength of the optical device 1 can be further improved and the optical device 1 can be prevented from tilting.

Next, a fourth embodiment of the present invention will be described.
In the fourth embodiment, as shown in FIG. 6, in the optical device 1 according to the third embodiment, the outer wall of the viewing angle limiting body 13 is further formed to have an inverted tapered shape in a vertical cross-sectional view. That is, the distance between the outer walls of the viewing angle limiting body 13 is formed so as to become narrower as the distance from the light receiving / receiving surface 11a increases in the vertical cross-sectional view.
With such a shape, it can be easily taken out without applying unnecessary stress when removing the mold for forming the viewing angle limiting body, and unnecessary stress is applied when removing the mold. It is possible to prevent the shape of the viewing angle limiting body 13 from being deformed due to the above.

Here, in the optical device 1 according to the third embodiment, the outer wall of the viewing angle limiting body 13 has an inverted tapered shape in a vertical cross-sectional view, but similarly in the first embodiment and the second embodiment, the visual field Even when the outer wall of the angle limiting body 13 has an inverted tapered shape in a vertical cross-sectional view, the same effect can be obtained.
Although the optical device in the second to fourth embodiments has a different shape from the optical device in the first embodiment, it is used to fabricate a mold for manufacturing a photoelectric conversion block and a viewing angle limiting body 13. The essential part of the present invention of manufacturing an optical device using a mold is the same as the manufacturing method in the first embodiment.

Next, a fifth embodiment of the present invention will be described.
FIG. 7 is a schematic configuration diagram showing an example of the optical device 1 according to the fifth embodiment of the present invention. The optical device 1 according to the fifth embodiment is the optical device 1 according to the second embodiment shown in FIG. 4 having a SOP (small outline package) structure. 7A is a bottom view of the optical device 1, FIG. 7B is a sectional view taken along the line AA'of FIG. 7A, and FIG. 7C is a plan view of the optical device 1. 7 (d) is a cross-sectional view taken along the line BB'of FIG. 7 (c). The same parts as those of the optical device 1 according to the second embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

Similar to the optical device 1 according to the second embodiment, the optical device 1 according to the fifth embodiment includes a photoelectric conversion unit 11 provided with a filter unit 31, a sealing unit 12, and a viewing angle limiting body 13. Further, a plurality of lead pins 58 are provided on both sides of the optical device 1.
FIG. 8 is a process diagram illustrating a method for manufacturing the optical device 1 according to the fifth embodiment.
First, an adhesive sheet 51 is prepared, and the back surface of the lead frame 52, which is integrally formed with a plurality of portions to be lead pins 58 later, is attached to the adhesive layer of the adhesive sheet 51 (FIG. 8A). .. As the pressure-sensitive adhesive sheet 51, a resin tape (for example, polyimide tape) having both adhesiveness and heat resistance is used. As for the adhesiveness, it is preferable that the adhesive layer has a thinner adhesive thickness.
Then, a connecting portion 52a plated with Ag to improve the connectivity with the conductor 14 is formed on a part of the lead frame 52.

Next, as shown in FIG. 8B, the photoelectric conversion unit 11 including the filter unit 31 is positioned, and the back surface thereof is attached to the adhesive layer of the adhesive sheet 51.
Next, as shown in FIG. 8C, the connection portion 52a and the electrode (not shown) of the photoelectric conversion portion 11 are electrically connected by the conductor 14.
Next, as shown in FIG. 8D, the upper mold 53 and the lower mold 54 for forming the photoelectric conversion block 50 including the photoelectric conversion unit 11 provided with the filter unit 31 are used, and the lead frame 52 The upper mold 53 is arranged on the front surface side, and the lower mold 54 is arranged on the back surface side of the lead frame 52, that is, on the adhesive sheet 51 side.
The upper mold 53 has a recess, and the surface of the lower mold 54 in contact with the upper mold 53 is a flat surface. The photoelectric conversion unit 11 and the conductor 14 provided with the filter unit 31 attached to the adhesive sheet 51 are housed in the concave portion of the upper mold 53. Further, the lower mold 54 also has a recess (not shown), and the lead frame 52 is housed in the recess. In this state, when the upper mold 53 and the lower mold 54 are overlapped with each other, a part of the surface of the lead frame 52 and a part of the upper mold 53 and the lower mold 54 are in close contact with each other. ..

Then, the lead frame 52 is sandwiched between the upper mold 53 and the lower mold 54, and the first sealing member made of molten epoxy resin or the like is placed on the side in the space sandwiched between the upper mold 53 and the lower mold 54. Inject from and fill. As a result, the sealing portion 12 is formed.
Next, the upper mold 53 and the lower mold 54 are opened, and the photoelectric conversion block 50 in which the photoelectric conversion unit 11 and the lead frame 52 are integrated by the first sealing member is attached to the upper mold 53 and the lower mold 54. Take out from the space (Fig. 6 (e)).
Then, the adhesive sheet 51 is removed (FIG. 6 (f)). The surface from which the adhesive sheet 51 has been removed is in a state where the filter portion 31 is exposed from the sealing portion 12. This completes the photoelectric conversion block 50.

Next, using the upper mold 55 and the lower mold 56 for forming the viewing angle limiting body 13, the upper mold 55 is arranged on the exposed side of the filter portion 31 of the photoelectric conversion block 50, and the photoelectric conversion is performed. The lower mold 56 is arranged on the opposite surface of the block 50. The upper mold 55 is formed with a plurality of recesses for forming a viewing angle limiting body that surrounds the exposed portion of the filter portion 31. The lower mold 56 has a recess, and the photoelectric conversion block 50 is housed in this recess with the exposed side of the filter portion 31 facing up, and the film 57 is arranged along the inside of the upper mold 55. In this state, the upper mold 55 and the lower mold 56 are overlapped with each other (FIG. 8 (g)).

At this time, a part of the surface of the lead frame 52, the upper mold 55, and the lower mold 56 are in close contact with each other. Then, in a state where the upper mold 55, the exposed portion of the filter portion 31, and the lead frame 52 are in contact with each other without a gap through the film 57, the space sandwiched between the upper mold 55 and the lower mold 56 is formed. A second sealing member made of molten epoxy resin or the like is injected from the side and filled. As a result, the viewing angle limiting body 13 is formed.
In the process of forming the viewing angle limiting body 13, the upper mold 55, the lower mold 56, and a part of the lead frame 52 are in close contact with each other, and the film 57 and the lower mold 56 are in close contact with each other. Fill the sealing member. As a result, when the upper mold 55 is removed in the subsequent step, the viewing angle limiting body 13 is formed at a position surrounding the filter portion 31. At this time, since the upper mold 55, the exposed surface of the filter portion 31, and a part of the lead frame 52 are in close contact with each other via the film 57, the second sealing member is filled, so that the filter portion 31 is filled. Adhesion of the second sealing member to the exposed surface is suppressed.

Next, when the upper mold 55 and the lower mold 56 are opened, the viewing angle limiting body 13 is peeled off while the film 57 is still arranged on the surface of the upper mold 55, and the photoelectric viewing angle limiting body 13 is formed. The conversion block 50 can be taken out from between the upper mold 55 and the lower mold 56 (FIG. 8 (h)).
After that, exterior plating was applied to the outer periphery of the photoelectric conversion block 50 integrally formed with the viewing angle limiting body 13 by tin plating or the like (FIG. 8 (i), exterior plating is not shown), and the viewing angle limiting body 13 was formed. The lead frame 52 protruding from the outer periphery of the integrally formed photoelectric conversion block 50 is formed to form the lead pin 58 (FIG. 8 (j)).
As a result, the optical device 1 having a SOP structure is formed. The optical device according to the fifth embodiment can also obtain the same effect as the optical device according to the second embodiment.

Although the embodiment of the present invention has been described above, the above-described embodiment exemplifies a device and a method for embodying the technical idea of the present invention, and the technical idea of the present invention is a component component. It does not specify the material, shape, structure, arrangement, etc. of The technical idea of the present invention may be modified in various ways within the technical scope specified by the claims described in the claims.

1 Optical device 10, 30, 40, 50 Photoelectric conversion block 11 Photoelectric conversion unit 12 Sealing unit 13 Viewing angle limiter 14 Conductor 15 Lead terminal 31 Filter unit

Claims (12)

A photoelectric conversion unit having a photoelectric conversion function and a light receiving surface for receiving light,
A sealing portion that seals the photoelectric conversion portion so that the light receiving surface is exposed, and a sealing portion.
A viewing angle limiting body provided so as to directly adhere to the exposed surface of the light receiving surface of the sealing portion and surround the periphery of the light receiving surface in a plan view is provided .
An optical device in which the distance between the inner walls of the viewing angle limiting body is the narrowest in the height of the light receiving surface and gradually widens as the distance from the light receiving surface increases in a vertical cross-sectional view . The optical device according to claim 1, wherein the distance between the outer walls of the viewing angle limiting body is narrowed as the distance from the light receiving surface increases in a vertical cross-sectional view. The optical device according to claim 1 or 2 , wherein the photoelectric conversion unit includes a photoelectric conversion element including a photodetection element. The optical device according to claim 3 , wherein the photoelectric conversion unit includes the photoelectric conversion element and a filter unit that transmits light having a predetermined wavelength among the light having a wavelength that the photoelectric conversion element can receive . With the lead terminal
A conductor that electrically connects the lead terminal and the photoelectric conversion unit,
The optical device according to any one of claims 1 to 4 . The sealing portion seals the lead terminal together with the photoelectric conversion portion.
The optical device according to claim 5 , wherein the lead terminal is partially exposed continuously from each of a first surface of the sealing portion and a second surface continuous with the first surface. Having a plurality of the lead terminals,
The optical device according to claim 5 or 6 , wherein the lead terminal is arranged at a position facing the outer surface of the photoelectric conversion unit so as to surround the photoelectric conversion unit in a plan view. The optical device according to any one of claims 5 to 7 , wherein the width of the viewing angle limiting body is narrower than the width of the sealing portion. A part of the lead terminal is continuously exposed from each of a surface of the sealing portion facing the viewing angle limiting body, a surface continuous with the facing surface, and a surface facing the facing surface. The optical device according to claim 8 . The optical device according to any one of claims 1 to 9 , wherein at least one of the sealing portion and the viewing angle limiting body is made of a resin material containing a filler. A photoelectric conversion unit having a photoelectric conversion function or a lightning conversion function and having a light receiving / receiving surface for receiving or emitting light and a lead terminal are arranged on the support member so as to be separated from each other.
The photoelectric conversion unit and the lead terminal are connected by a conductor.
At least a part of the lead terminal and the region of the photoelectric conversion unit other than the light receiving / receiving surface are sealed with the first sealing member using the first mold.
The support member is removed from the photoelectric conversion unit and the lead terminal to form a photoelectric conversion block.
The second sealing member is directly brought into contact with the exposed surface of the photoelectric conversion block using the second mold, and the periphery of the light receiving surface is exposed so that the light receiving surface is exposed. A method of manufacturing an optical device that forms a surrounding viewing angle limiter. 11. The optical device according to claim 11, wherein in a vertical cross-sectional view, the distance between the inner walls of the viewing angle limiting body is the narrowest in the height of the light emitting / receiving surface and gradually widens as the distance from the light receiving / receiving surface increases. Manufacturing method.

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