JP7018375B2 - Film forming equipment, film forming method, and electronic device manufacturing method - Google Patents

Description

The present invention relates to a film forming apparatus and a film forming method, and relates to a film forming apparatus having a structure in which the drive mechanism of the cooling plate / magnet plate is separated from the alignment stage and made independent, and a film forming method using the same. ..

Recently, organic EL display devices have been in the limelight as flat panel display devices. The organic EL display device is a self-luminous display, and its characteristics such as response speed, viewing angle, and thinning are superior to those of liquid crystal panel displays. Is being replaced at a high speed. It is also expanding its application fields to automobile displays and the like.

The element of the organic EL display device has a basic structure in which an organic substance layer that emits light is formed between two facing electrodes (cathode electrode and anode electrode). The organic material layer and the electrode metal layer of the organic EL display element are manufactured by depositing a vapor-deposited substance on a substrate via a mask on which a pixel pattern is formed in a vacuum chamber, and the pixel pattern on the mask is produced with high accuracy. In order to transfer to the substrate, the relative positions of the mask and the substrate must be precisely aligned before the deposition on the substrate takes place.

For this purpose, an alignment step in which the alignment stage on which the substrate holding unit for holding the substrate is mounted is driven to adjust the position of the substrate held on the substrate holding unit with respect to the mask on the mask table is performed. However, since the cooling plate / magnet plate elevating mechanism is also mounted on the conventional alignment stage in addition to the elevating mechanism of the substrate holding unit, the position of the substrate on the substrate holding unit is the position of the mask on the mask table. When the alignment stage is moved in the X direction or the Y direction or rotated in the θ direction in order to adjust with respect to the substrate, not only the substrate but also the cooling plate / magnet plate is moved and / or rotated together.

In the process of carrying the substrate into the film forming apparatus by the transfer robot, the substrate may move on the hand of the transfer robot and the position of the substrate on the hand of the transfer robot may deviate from a fixed position. In this case, the position of the board on the board holding unit that receives the board from the hand of the transfer robot also deviates from the position determined by the transfer error of the board by the transfer robot.

The positional deviation of the substrate with respect to the mask due to the transfer error of the substrate by the transfer robot is corrected by driving the alignment stage to which the substrate holding unit is connected in the XYθ direction. For example, if the board is rotated 5 ° around the Z axis from a fixed position due to a problem with the transfer robot and is placed on the board holding unit (that is, the board on the board holding unit and the mask on the mask stand). Is displaced by 5 ° around the Z axis), the alignment stage to which the substrate holding unit is connected is rotated in the opposite direction by 5 ° to correct the displacement of the substrate with respect to the mask on the mask table.

However, since the cooling plate / magnet plate elevating mechanism is installed on the alignment stage together with the board holding unit elevating mechanism, if the alignment stage is rotated 5 ° in the opposite direction to correct the position of the board, the cooling plate / magnet The board also rotates in the opposite direction by about 5 °. Therefore, by driving the alignment stage, the misalignment between the substrate and the mask due to the transfer error of the substrate can be eliminated, but the misalignment between the cooling plate / magnet plate and the substrate and the displacement between the cooling plate / magnet plate and the mask can be eliminated. The misalignment will remain.

Since the degree of substrate transfer error by the transfer robot differs depending on the transfer operation of the transfer robot, the degree of positional deviation between the cooling plate / magnet plate and the substrate and the positional deviation between the cooling plate / magnet plate and the mask. Will vary. This reduces the accuracy of the final positioning between the cooling plate and the substrate that come into contact during film formation (which causes variations in the cooling action of the cooling plate on the substrate), and the substrate and mask that are brought into close contact by the magnet plate. It causes variation in the close contact state of.

Such misalignment between the cooling plate / magnet plate and the substrate / mask due to the transfer error of the substrate and the variation in the amount of the misalignment cause product defects such as film formation blurring and film formation misalignment, and a decrease in yield. It causes problems.

INDUSTRIAL APPLICABILITY The present invention relates to a film forming apparatus, a film forming method, and an electronic device manufacturing method for suppressing a positional deviation between a cooling plate / magnet plate and a substrate / mask even when a substrate transport error occurs due to a transport robot. The main purpose is to provide.

The film forming apparatus according to the first aspect of the present invention includes a chamber, a substrate holding unit installed in the chamber and holding a substrate, a mask holding unit installed in the chamber and holding a mask, and the inside of the chamber. A cooling plate that cools the substrate held in the substrate holding unit or a magnet plate that applies magnetic force to the mask by sandwiching the substrate held in the substrate holding unit, and the substrate holding unit and the mask holding unit. Is moved in at least one of a first direction, a second direction orthogonal to the first direction, and a rotation direction about the first direction and a third direction orthogonal to the second direction. A second that is installed independently from the alignment stage and that moves the cooling plate or the magnet plate in the third direction and does not move in the first direction, the second direction, and the rotation direction. Includes a three-way drive mechanism.

In the film forming method according to the second aspect of the present invention, a step of placing the mask carried into the chamber of the film forming apparatus on the mask holding unit and a mask in a state of being placed on the mask holding unit are used. A mask alignment step for adjusting the position by moving the cooling plate or the magnet plate in at least one of the first direction, the second direction, and the rotation direction, and fixing the position-adjusted mask to the chamber . A step of placing the substrate on the mask stand, a step of carrying the substrate into the chamber of the film forming apparatus and placing the substrate on the substrate holding unit, and a mask of the substrate mounted on the substrate holding unit. A substrate alignment step for adjusting the position of a mask placed on a table by moving it in at least one of the first direction, the second direction , and the rotation direction, and on the mask table. A step of placing the substrate whose position has been adjusted with respect to the placed mask on the mask, and a step of moving at least one of the cooling plate and the magnet plate in the third direction to bring them into contact with the substrate. Includes a step of depositing a vapor deposition material on a substrate through a mask.

The method for manufacturing an electronic device according to the third aspect of the present invention is to manufacture an electronic device using the film forming method according to the second aspect of the present invention.

According to the present invention, by separating the cooling plate / magnet plate elevating mechanism from the alignment stage and making them independent, even if the alignment stage is moved in the XYθ direction in order to correct the transfer error of the substrate by the transfer robot, the cooling plate is used. And the magnet plate does not move in the XYθ direction. As a result, it is possible to suppress the relative positional deviation between the cooling plate / magnet plate and the substrate / mask due to the movement of the alignment stage in the XYθ direction, and it is possible to reduce product defects due to film formation defects. ..

FIG. 1 is a schematic diagram of a part of a production line of an organic EL display device. FIG. 2 is a schematic diagram of the film forming apparatus. FIG. 3 is a schematic diagram showing the configuration of the alignment stage of the embodiment. FIG. 4 is a schematic diagram for explaining mask alignment. FIG. 5 is an overall view of the organic EL display device and a cross-sectional view of an element of the organic EL display device.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples merely illustrate preferred configurations of the present invention, and the scope of the present invention is not limited to those configurations. Further, unless otherwise specified, the hardware configuration and software configuration, processing flow, manufacturing conditions, dimensions, materials, shapes, etc. of the apparatus in the following description are limited to those of the present invention. It is not the purpose.

INDUSTRIAL APPLICABILITY The present invention can be preferably applied to an apparatus for forming a thin film (material layer) of a pattern on the surface of a substrate by vacuum vapor deposition. Any material such as glass, polymer film, or metal can be selected as the substrate material, and any material such as organic material or metallic material (metal, metal oxide, etc.) can be selected as the vapor deposition material. You can choose the material. Specifically, the technique of the present invention can be applied to a manufacturing apparatus such as an organic electronic device (for example, an organic EL display device, a thin film solar cell), an optical member, and the like. Among them, the present invention is one of the preferable application examples to form an organic EL display element by evaporating a vapor-deposited material in a manufacturing device of an organic EL display device.

<Electronic device production line>
FIG. 1 is an upper view schematically showing a part of the configuration of an electronic device manufacturing line. The production line of FIG. 1 is used, for example, for manufacturing a display panel of an organic EL display device for a smartphone. In the case of a display panel for a smartphone, for example, after forming an organic EL film on a substrate having a size of about 1800 mm × about 1500 mm, the substrate is diced to produce a plurality of small-sized panels.

As shown in FIG. 1, a manufacturing line for an electronic device generally has a plurality of film forming chambers 11 and 12 and a transport chamber 13. A transfer robot 14 that holds and conveys the substrate 10 is provided in the transfer chamber 13. The transfer robot 14 is, for example, a robot having a structure in which a robot hand for holding a substrate is attached to an articulated arm, and carries in / out the substrate 10 into each film forming chamber.

Each of the film forming chambers 11 and 12 is provided with a film forming apparatus (also referred to as a vapor deposition apparatus). A series of film forming processes such as transfer of the substrate 10 to and from the transfer robot 14, adjustment (alignment) of the relative position between the substrate 10 and the mask, fixing of the substrate 10 on the mask, and film formation (deposited film) are performed by the film forming apparatus. It is done automatically.

Hereinafter, the configuration of the film forming apparatus in the film forming chamber will be described.

<Film formation device>
FIG. 2 is a cross-sectional view schematically showing the configuration of the film forming apparatus 2. In the following description, an XYZ Cartesian coordinate system with the vertical direction as the Z direction is used. Assuming that the substrate is fixed parallel to the horizontal plane (XY plane) at the time of film formation, the direction parallel to the short side of the substrate is the X direction, and the direction parallel to the long side is the Y direction. Also, the angle of rotation around the Z axis is displayed as θ.

The film forming apparatus 2 includes a vacuum chamber 20 that defines a space in which the film forming process is performed. The inside of the vacuum chamber 20 is maintained in a vacuum atmosphere or an atmosphere of an inert gas such as nitrogen gas.

In the upper part of the vacuum chamber 20 of the film forming apparatus 2, a substrate holding unit 21 for holding and transporting a substrate, a mask holding unit 22 for holding and transporting a mask, a cooling plate 23 for cooling the substrate, and a metal material A magnet plate 24 for applying a magnetic force to the mask, a mask stand 25 on which a position-adjusted mask is placed, and the like are provided. Etc. are provided.

The board holding unit 21 is a means for holding and carrying the board 10 received from the transfer robot 14 in the transfer chamber 13, and is also called a board holder.

The mask holding unit 22 is a means for holding and transporting the mask carried into the vacuum chamber 20 of the film forming apparatus 2 until it is placed on the mask stand 25.

A frame-shaped mask base 25 fixed to the vacuum chamber 20 is installed under the substrate holding unit 21, and the mask base 25 has a mask 251 having an opening pattern corresponding to a thin film pattern formed on the substrate 10. Is placed. In particular, the mask used for manufacturing an organic EL element for a smartphone is a metal mask on which a fine opening pattern is formed, and is also called FMM (Fine Metal Mask).

The cooling plate 23 is installed above the support portion of the substrate holding unit 21 and is brought into close contact with the surface of the substrate 10 opposite to the mask 251 during film formation to suppress an increase in the temperature of the substrate 10 during film formation. It is a plate-shaped member that plays a role of suppressing deterioration and deterioration of organic materials.

A magnet plate 24 is provided on the cooling plate 23 to apply a magnetic force to the metal mask 251 to prevent the mask from bending and to bring the mask 251 and the substrate 10 into close contact with each other. The magnet plate 24 can consist of a permanent magnet or an electromagnet and can be partitioned into a plurality of modules. Further, the magnet plate 24 can also be integrally formed with the cooling plate 23.

The vapor deposition source 26 includes a crucible (not shown) in which the vapor deposition material to be deposited on the substrate is stored, a heater for heating the crucible (not shown), and the vapor deposition material on the substrate until the evaporation rate from the vapor deposition source becomes constant. Includes shutters (not shown) that prevent scattering. The vapor deposition source 26 can have various configurations depending on the application, such as a point vapor deposition source, a linear vapor deposition source, and a revolver vapor deposition source.

Although not shown in FIG. 2, the film forming apparatus 2 includes a film thickness monitor (not shown) for measuring the thickness of the film deposited on the substrate and a film thickness calculation unit (not shown).

An elevating mechanism for raising and lowering the substrate holding unit 21, the mask holding unit 22, the cooling plate 23 / magnet plate 24, and the like in the vertical direction (Z direction, third direction) on the outer upper surface of the vacuum chamber 20 of the film forming apparatus 2. , And move the substrate holding unit 21 and / or the mask holding unit 22 parallel to the horizontal plane (in the X, Y, θ directions) for alignment of the substrate with the mask or of the mask with respect to the cooling plate / magnet plate. A drive mechanism (alignment stage) for the purpose is installed.

In this embodiment, as will be described later with reference to FIG. 3, the elevating mechanism for raising and lowering the cooling plate 23 and the magnet plate 24 in the Z direction is used to move the substrate holding unit 21 in the XYθ direction. By separating / separating from the alignment stage, the cooling plate / magnet plate elevating mechanism is fixed in the XYθ direction without moving by XYθ even when the substrate holding unit 21 connected to the alignment stage moves by XYθ. To be done.

Further, in the film forming apparatus 2 of this embodiment, an alignment camera (non-alignment) that captures an alignment mark formed on the substrate and the mask through a window provided on the ceiling of the vacuum chamber 20 for alignment between the mask and the substrate. (Illustrated) is also provided.

Hereinafter, each step of the film forming process performed by the film forming apparatus of this embodiment will be described.

First, when a new mask is carried into the vacuum chamber 20 of the film forming apparatus and placed on the mask holding unit 22, the position of the mask placed on the mask holding unit 22 is set with respect to the position of the cooling plate 23. A mask alignment step to adjust is performed. The mask whose position has been adjusted with respect to the cooling plate 23 is lowered by the mask holding unit 22 and placed on the mask base 25.

The substrate is carried into the vacuum chamber 20 by the transfer robot 14 in the transfer chamber 13 and placed on the substrate holding unit 21. Subsequently, a substrate alignment step of measuring and adjusting the relative positions of the substrate 10 and the mask 251 is performed. When the substrate alignment process is completed, the substrate holding unit 21 descends by the elevating mechanism to place the substrate 10 on the mask 251. After that, the cooling plate 23 and the magnet plate 24 descend by the elevating mechanism to bring the substrate 10 and the mask 251 into close contact with each other. ..

In this state, the shutter of the vapor deposition source 26 is opened, and the vapor deposition material evaporated from the crucible of the vapor deposition source 26 is vapor-deposited on the substrate through the fine pattern opening of the mask.

When the film thickness of the vapor-deposited material deposited on the substrate reaches a predetermined thickness, the shutter of the vapor deposition source 26 is closed, and then the transfer robot 14 carries out the substrate from the vacuum chamber 20 to the transfer chamber 13.

After repeating the process from loading the substrate to unloading the substrate for a predetermined number of substrates, the mask on which the vapor deposition material is deposited and cannot be used any more is carried out from the film forming apparatus and new. The mask is carried into the film forming apparatus.

<Alignment stage>
Hereinafter, the configuration of the alignment stage 30 of this embodiment will be described with reference to FIG.

On the outer upper surface (first outer surface) of the vacuum chamber 20, the substrate holding unit 21 and the mask holding unit 22 are moved in the XYθ direction in order to adjust the position of the substrate 10 with respect to the mask and the position of the mask with respect to the cooling plate / magnet plate. The alignment stage 30 for raising and lowering the substrate holding unit 21, the substrate Z-axis raising and lowering mechanism 31 (board third direction drive mechanism) for raising and lowering the substrate holding unit 21, and the cooling plate 23 and / or the magnet plate 24 are moved in the Z-axis direction. A cooling plate Z-axis elevating mechanism 32 (cooling plate third-direction drive mechanism) for elevating and lowering, and a mask Z-axis elevating mechanism 33 (mask third-direction drive mechanism) for raising and lowering the mask 251 in the Z-axis direction are installed. ..

The alignment stage 30 receives a driving force in the XYθ direction from an alignment stage driving motor 301 (first motor) fixed to the outer upper surface of the vacuum chamber through a linear guide (first driving force transmission mechanism). That is, a guide rail (not shown) is fixedly installed on the outer upper surface of the vacuum chamber, and the linear block is movably installed on the guide rail. The alignment stage base plate 302 (first base plate) is mounted on the linear block. By moving the linear block in the XYθ direction by the driving force from the alignment stage driving motor 301 fixed to the outer upper surface of the vacuum chamber, the alignment stage base plate 302 mounted on the linear block, that is, the entire alignment stage 30 Can be moved in the XYθ direction.

Since the elevating mechanism for raising and lowering the board holding unit 21 and the raising and lowering mechanism for raising and lowering the mask holding unit 22 are mounted on the alignment stage 30 as described later, the board holding unit 21 and the mask holding unit 22 are mounted on the alignment stage. As it moves in the XYθ direction, it moves in the XYθ direction together with the substrate and the mask held by each of them.

The board Z-axis elevating mechanism 31 is a mechanism for raising and lowering the board holding unit 21 in the Z-axis direction, and is installed on the alignment stage base plate 302. The substrate holding unit 21 in the vacuum chamber 20 is connected to the substrate Z-axis elevating mechanism 31 through the outer upper surface of the vacuum chamber 20. The board Z-axis elevating mechanism 31 is a board elevating driving force transmission mechanism (third driving force) for transmitting the driving force of the board elevating drive motor 311 (third motor) and the board elevating drive motor 311 to the board holding unit 21. A linear guide 312 is included as a transmission mechanism). In the present embodiment, the linear guide 312 is used as the substrate elevating driving force transmission mechanism, but the present invention is not limited to this, and a ball screw or the like can also be used.

The cooling plate Z-axis elevating mechanism 32 includes a cooling plate elevating drive motor 321 (second motor) for driving the cooling plate 23 and / or the magnet plate 24 in the Z direction, and a cooling plate elevating drive force transmission mechanism (second drive). It includes a ball screw 322 as a force transmission mechanism) and is installed on a cooling plate Z-axis elevating mechanism base plate 323 (second base plate) fixed to the outer upper surface of the vacuum chamber. In the present embodiment, the ball screw 322 is used as the cooling plate elevating driving force transmission mechanism, but the present invention is not limited to this, and a linear guide or the like can also be used.

As described above, in this embodiment, the cooling plate Z-axis elevating mechanism 32 is not installed on the alignment stage base plate 302 as in the conventional case, but is separated / independent from the alignment stage 30 and is the outer upper surface of the vacuum chamber 20. Since it is installed on the cooling plate Z-axis elevating mechanism base plate 323 fixed to the cooling plate Z-axis elevating mechanism 32, even if the alignment stage 30 moves in the XYθ direction, the cooling plate Z-axis elevating mechanism 32 does not move in the XYθ direction and is in the XYθ direction. It is fixed. In the present specification, the fact that the cooling plate Z-axis elevating mechanism 32 is separated from the alignment stage 30 and installed independently means that the cooling plate Z-axis elevating mechanism 32 is not installed on the alignment stage 30 in a broad sense. It means that it does not receive the driving force for movement from the alignment stage 30 in the XYθ direction, and in a narrow sense, the cooling plate Z-axis elevating mechanism 32 is not installed on the alignment stage 30, and the vacuum chamber 20 is located in the XYθ direction. It means that it is installed so as to be fixed to the outer upper surface (that is, it is fixed without moving or rotating in the XYθ direction).

The mask Z-axis elevating mechanism 33 is a mechanism for elevating and lowering the mask holding unit 22 in the Z-axis direction, and is mounted on the alignment stage 30. The mask holding unit 22 in the vacuum chamber 20 is connected to the mask Z-axis elevating mechanism 33 through the outer upper surface of the vacuum chamber 20. The mask Z-axis elevating mechanism 33 includes a mask elevating drive motor 331 (fourth motor) and a ball screw 332 (fourth driving force transmission mechanism), and the used mask is discharged by a transport robot when the mask is replaced. A new mask is received, and the function of raising and lowering the mask holding unit 22 until the mask is placed on the mask table 25 through the mask alignment step is performed.

<Mask alignment>
The alignment process of the mask with respect to the cooling plate 23 / magnet plate 24 will be described with reference to FIG.

When it is time to replace the mask, the mask Z-axis elevating mechanism 33 drives the mask holding unit 22 in the Z-axis direction, and the transport robot receives the used mask from the vapor deposition position on the mask table 25. Can be raised to a discharge position. The transfer robot receives the used mask from the mask holding unit 22, discharges it to the outside of the vacuum chamber, carries the new mask into the vacuum chamber, and passes the new mask to the mask holding unit 22 which remains in the discharge position. ..

Subsequently, as shown in FIGS. 4A and 4B, the rough alignment camera 40 installed on the outer upper surface of the vacuum chamber 20 is used to cover the lower surface of the cooling plate 23 or the magnet plate 24. The alignment mark 411 of the alignment mark plate 41 installed on the upper surface and the alignment mark 2511 of the mask 251 mounted on the mask holding unit 22 are photographed and the relative positions between them are measured. The alignment mark plate 41 of the present embodiment has a convex planar shape as shown in FIG. 4 (c), and the alignment mark formed on the alignment mark plate 41 is a circular opening. Not limited to.

If it is found that the relative positions of the cooling plate 23 / magnet plate 24 and the mask 251 mounted on the mask holding unit 22 are displaced in the XYθ direction based on the shooting result of the alignment mark, the mask is held by the alignment stage 30. The unit 22 is moved in the XYθ direction to adjust the position of the mask with respect to the cooling plate 23 / magnet plate 24. At this time, since the cooling plate Z-axis elevating mechanism 32 on which the cooling plate 23 / magnet plate 24 is installed is separated and installed independently from the alignment stage 30, it is cooled with respect to the mask held by the mask holding unit 22. These positions can be adjusted by relatively moving the plate 23 / magnet plate 24.

When the alignment mark plate 41 is installed on the upper surface of the magnet plate 24, it can be easily installed on the magnet plate 24 and the installation position can be accurate. Compared to this, in order to install the alignment mark plate 41 on the lower surface of the cooling plate 23, the alignment mark plate 41 must be embedded on the lower surface side of the cooling plate 23, which makes the installation complicated, but the camera for rough alignment Since it can be installed closer to the alignment mark 2511 of the mask 251 in which the 40 is focused, the recognition accuracy of the alignment mark by the rough alignment camera 40 can be improved.

When the mask alignment is completed, the mask holding unit 22 is lowered by the mask Z-axis elevating mechanism 33 to lower the mask 251 from the ejection position to the vapor deposition position on the mask table 25, and then the mask 251 is placed on the mask table 25. do.

Through such a mask alignment step, the positions of the mask 251 and the cooling plate 23 / magnet plate 24 can be relatively adjusted. That is, conventionally, since the cooling plate Z-axis elevating mechanism 32 is mounted on the alignment stage 30 together with the mask Z-axis elevating mechanism 33 for raising and lowering the mask holding unit 22, it is in a state of being placed on the mask holding unit 22. The position of the mask 251 could not be adjusted relative to the cooling plate 23 / magnet plate 24, but in this embodiment, the cooling plate Z-axis elevating mechanism 32 is installed separately / independently from the alignment stage 30. Therefore, the mask 251 placed on the mask holding unit 22 can be moved and adjusted relative to the cooling plate 23 / magnet plate 24.

<Board alignment>
When the substrate 10 is carried into the vacuum chamber 20 of the film forming apparatus 2 by the transfer robot 14 in the transfer chamber 13 and placed on the substrate holding unit 21 waiting at the carry-in position, the substrate is held by the substrate Z-axis elevating mechanism 31. The unit 21 descends in the Z-axis direction and moves to a measurement position at a fixed height above the mask. Subsequently, the alignment mark of the substrate and the alignment mark of the mask 251 placed on the mask stand 25 are photographed by the rough alignment camera and the fine alignment camera, and the relative positional deviation between the substrate and the mask is measured.

When the substrate is displaced from the substrate holding unit 21 due to a transfer error caused by the transfer robot 14 in the process of carrying the substrate into the vacuum chamber 20 of the film forming apparatus 2, the mask 251 placed on the substrate and the mask stand 25 Relative misalignment occurs between and. In this case, the alignment stage 30 to which the substrate holding unit 21 is connected is moved in the XYθ direction to adjust the relative positions of the substrate 10 and the mask 251. Even if the alignment stage 30 is moved in the XYθ direction in order to adjust the position of the substrate with respect to the mask 251 on the mask base 25 in this way, in this embodiment, the cooling plate Z-axis elevating mechanism 32 is separated from the alignment stage 30. Since it is independently fixed to the outer upper surface of the vacuum chamber 20, the cooling plate Z-axis elevating mechanism 32 does not move in the XYθ direction, and is between the cooling plate 23 / magnet plate 24 and the mask 251 when the mask alignment is completed. It is possible to maintain the adjusted state of.

Further, when the substrate 10 is placed on the substrate holding unit 21 at a position relatively displaced from the cooling plate 23 due to the transfer error of the substrate by the transfer robot 14, the substrate 10 is placed on the mask 251 on the mask base 25. By adjusting the position with respect to the mask, it becomes possible to adjust the position between the cooling plate 23 and the substrate 10 whose position is adjusted with respect to the mask 251 on the mask table 25 through the mask alignment step.

When the alignment of the substrate with respect to the mask is completed, the substrate holding unit 21 descends onto the mask by the substrate Z-axis elevating mechanism 31 and lowers the substrate onto the mask.

Subsequently, the cooling plate 23 and the magnet plate 24 are lowered by the drive of the cooling plate Z-axis elevating mechanism 32 and placed on the upper surface of the substrate 10. At this time, the metallic mask 251 is attracted by the magnetic force of the magnet plate 24, so that the substrate and the mask are in close contact with each other.

According to this embodiment, the positions of the cooling plate 23 and the substrate are adjusted to each other in spite of the transfer error of the substrate by the transfer robot 14, so that the cooling action of the substrate by the cooling plate 23 can be maximized. Further, even when a transfer error of the substrate by the transfer robot 14 occurs, the variation caused by the transfer error can be reduced, so that the offset for correcting the relative position between the cooling plate and the substrate can be stabilized. Further, since the relative positions of the magnet plate 24 and the mask 251 are also adjusted, it is possible to reduce variations in the adhesion state when the substrate and the mask are brought into close contact with each other by the magnetic force from the magnet plate 24. As a result, film formation defects can be effectively reduced.

<Manufacturing method of electronic devices>
Next, an example of a method for manufacturing an electronic device using the film forming apparatus of this embodiment will be described. Hereinafter, the configuration and manufacturing method of the organic EL display device will be illustrated as an example of the electronic device.

First, the organic EL display device to be manufactured will be described. FIG. 5A shows an overall view of the organic EL display device 60, and FIG. 5B shows a cross-sectional structure of one pixel.

As shown in FIG. 5A, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix in the display area 61 of the organic EL display device 60. Although the details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. The pixel referred to here refers to the smallest unit that enables the display of a desired color in the display area 61. In the case of the organic EL display device according to this embodiment, the pixel 62 is composed of a combination of a first light emitting element 62R, a second light emitting element 62G, and a third light emitting element 62B that emit light different from each other. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element, and is particularly limited to at least one color. It is not limited.

5 (b) is a schematic partial cross-sectional view taken along the line AB of FIG. 5 (a). The pixel 62 has a first electrode (anode) 64, a hole transport layer 65, one of the light emitting layers 66R, 66G, 66B, an electron transport layer 67, and a second electrode (cathode) 68 on the substrate 63. It has an organic EL element comprising. Of these, the hole transport layer 65, the light emitting layer 66R, 66G, 66B, and the electron transport layer 67 correspond to the organic layer. Further, in this embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. The light emitting layers 66R, 66G, and 66B are formed in a pattern corresponding to a light emitting element (sometimes referred to as an organic EL element) that emits red, green, and blue, respectively. Further, the first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, 62B, or may be formed for each light emitting element. An insulating layer 69 is provided between the first electrodes 64 in order to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign matter. Further, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 70 for protecting the organic EL element from moisture and oxygen is provided.

In FIG. 5B, the hole transport layer 65 and the electron transport layer 67 are shown as one layer, but they are formed of a plurality of layers including the hole block layer and the electron block layer due to the structure of the organic EL display element. May be done. Further, between the first electrode 64 and the hole transport layer 65, there is an energy band structure capable of smoothly injecting holes from the first electrode 64 into the hole transport layer 65. It is also possible to form a hole injection layer. Similarly, an electron injection layer can be formed between the second electrode 68 and the electron transport layer 67.

Next, an example of a method for manufacturing an organic EL display device will be specifically described.

First, a circuit (not shown) for driving the organic EL display device and a substrate 63 on which the first electrode 64 is formed are prepared.

Acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by a lithography method so that an opening is formed in the portion where the first electrode 64 is formed to form an insulating layer. Form 69. This opening corresponds to a light emitting region where the light emitting element actually emits light.

The substrate 63 in which the insulating layer 69 is patterned is carried into the first organic material film forming apparatus, the substrate is held by the substrate holding unit, and the hole transport layer 65 is shared on the first electrode 64 in the display region. A film is formed as a layer to be formed. The hole transport layer 65 is formed by vacuum vapor deposition. In reality, the hole transport layer 65 is formed to have a size larger than that of the display region 61, so that a high-definition mask is unnecessary.

Next, the substrate 63 on which the hole transport layer 65 is formed is carried into the second organic material film forming apparatus and held by the substrate holding unit. Align the substrate and the mask, place the substrate on the mask, and place the element that emits red on the substrate 63, the light emitting layer 66R that emits red.
Is formed into a film.

According to this embodiment, the cooling plate Z-axis elevating mechanism 32 that elevates and elevates the cooling plate / magnet plate of the film forming apparatus is separated / independent from the alignment stage 30 to perform alignment in order to eliminate the transfer error by the transfer robot 14. Even when the stage 30 is driven to correct the position, the relative position between the cooling plate / magnet plate, the substrate, and the mask can be effectively adjusted, thereby effectively reducing the film formation defect. be able to.

Similar to the film formation of the light emitting layer 66R, the light emitting layer 66G that emits green is formed by the third organic material film forming apparatus, and the light emitting layer 66B that emits blue is further formed by the fourth organic material forming apparatus. .. After the film formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed on the entire display region 61 by the fifth film forming apparatus. The electron transport layer 67 is formed as a layer common to the light emitting layers 66R, 66G, and 66B of three colors.

The substrate formed up to the electron transport layer 67 is moved by a metallic vapor deposition material film forming apparatus to form a second electrode 68.

After that, it moves to a plasma CVD device to form a protective layer 70, and the organic EL display device 60 is completed.

From the time when the substrate 63 in which the insulating layer 69 is patterned is carried into the film forming apparatus until the film formation of the protective layer 70 is completed, when the substrate 63 is exposed to an atmosphere containing moisture or oxygen, a light emitting layer made of an organic EL material is formed. It may be deteriorated by moisture and oxygen. Therefore, in this example, the loading and unloading of the substrate between the film forming apparatus is performed in a vacuum atmosphere or an inert gas atmosphere.

The above-mentioned embodiment describes an example of the present invention, and the present invention is not limited to the configuration of the above-mentioned embodiment, and may be appropriately modified within the scope of the technical idea.

10: Substrate 14: Transfer robot 20: Vacuum chamber 21: Substrate holding unit 22: Mask holding unit 23: Cooling plate 24: Magnet plate 25: Mask stand 30: Alignment stage 31: Board Z-axis elevating mechanism 32: Cooling plate Z-axis Elevating mechanism 33: Mask Z-axis elevating mechanism 41: Alignment mark plate

Claims (16)

It is a film forming device for forming a film-deposited material on a substrate through a mask.
With the chamber
A substrate holding unit installed in the chamber and holding a substrate,
A mask holding unit installed in the chamber and holding a mask,
A cooling plate installed in the chamber to cool the substrate held by the substrate holding unit or a magnet plate that applies a magnetic force to the mask by sandwiching the substrate held by the substrate holding unit.
A rotation direction of the substrate holding unit and the mask holding unit about a first direction, a second direction orthogonal to the first direction, and a third direction orthogonal to the first direction and the second direction. An alignment stage that moves in at least one of the directions,
A third-direction drive mechanism that is separated from the alignment stage and installed independently, moves the cooling plate or the magnet plate in the third direction, and does not move in the first direction, the second direction, and the rotation direction. When,
Film forming equipment including. The film forming apparatus according to claim 1, wherein the third-direction drive mechanism is installed so as to be fixed to the chamber in the first direction, the second direction, and the rotation direction. The first or second aspect of the invention, wherein the alignment stage includes a first base plate that is movably installed in the first direction, the second direction, and the rotation direction with respect to the first outer surface of the chamber. Film forming equipment. 3. The third direction drive mechanism includes a second base plate installed so as to be fixed in the first direction, the second direction, and the rotation direction with respect to the first outer surface of the chamber. The film forming apparatus according to. The film forming apparatus according to claim 3 or 4, further comprising a substrate third-direction drive mechanism installed on the first base plate and moving the substrate holding unit in the third direction. The film forming apparatus according to any one of claims 3 to 5, further comprising a mask third-direction drive mechanism that is installed on the first base plate and moves the mask holding unit in the third direction. The function according to any one of claims 1 to 6, wherein the cooling plate and the magnet plate are integrally formed, and the third-direction drive mechanism moves the magnet plate together with the cooling plate in the third direction. Membrane device. The film forming apparatus according to any one of claims 1 to 7, wherein the alignment stage and the front third direction drive mechanism are arranged outside the chamber. 6. The film forming apparatus according to item 1. The third-direction drive mechanism transmits a second motor that generates a driving force for moving the cooling plate or the magnet plate in the third direction, and the driving force from the second motor to the cooling plate or the magnet plate. The film forming apparatus according to any one of claims 1 to 9, further comprising a second driving force transmission mechanism. The substrate third-direction drive mechanism has a third motor that generates a driving force for moving the substrate holding unit in the third direction, and a third motor that transmits the driving force from the third motor to the substrate holding unit. 3. The film forming apparatus according to claim 5, which includes a driving force transmission mechanism. The mask third direction drive mechanism is a fourth motor that generates a driving force for moving the mask holding unit in the third direction, and a second that transmits the driving force from the fourth motor to the mask holding unit. 4. The film forming apparatus according to claim 6, which includes a driving force transmission mechanism. It is a film forming method for depositing a vapor deposition material on a substrate through a mask.
The step of placing the mask carried into the chamber of the film forming apparatus according to any one of claims 1 to 12 on the mask holding unit, and
A mask alignment step in which the mask mounted on the mask holding unit is moved with respect to the cooling plate or the magnet plate in at least one of the first direction, the second direction, and the rotation direction to adjust the position. When,
The step of placing the position-adjusted mask on the mask table fixed to the chamber, and
The step of carrying the substrate into the chamber of the film forming apparatus and placing it on the substrate holding unit, and
The substrate mounted on the substrate holding unit is moved in at least one of the first direction, the second direction, and the rotation direction with respect to the mask placed on the mask table. Board alignment step to adjust the position and
A step of placing a substrate whose position has been adjusted with respect to the mask placed on the mask table on the mask, and a step of placing the substrate on the mask.
A step of moving at least one of the cooling plate and the magnet plate in the third direction to bring them into contact with the substrate.
Steps to deposit the vapor deposition material on the substrate through the mask,
Film formation method including. In the mask alignment step, the alignment stage of the film forming apparatus is set to the cooling plate third direction drive mechanism on which the cooling plate is mounted, or the magnet plate third on which the magnet plate is mounted.
By moving or rotating relative to at least one of the first direction, the second direction, and the rotation direction with respect to the directional drive mechanism, the mask holding unit is mounted on the mask holding unit connected to the alignment stage. The film forming method according to claim 13, wherein the placed mask is positioned with respect to a cooling plate or a magnet plate. In the mask alignment step, the alignment mark on the alignment mark plate installed on the lower portion of the cooling plate or the upper portion of the magnet plate and the alignment mark of the mask are photographed and placed on the cooling plate and the mask holding unit. The film forming method according to claim 13 or 14, comprising a step of measuring the relative misalignment between the mask and the mask or the relative misalignment between the magnet plate and the mask mounted on the mask holding unit. .. A method for manufacturing an electronic device using the film forming method according to any one of claims 13 to 15.

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