JP7047243B2 - Resin composition and electronic components - Google Patents

Description

The present invention relates to resin compositions used in electronic components.

Thermosetting resin compositions such as epoxy resins containing an inorganic filler are widely used in semiconductor packages as a sealing material for protecting a semiconductor element (chip) from the environment. The sealing material seals a plurality of members having different linear expansion coefficients such as chips, Cu, PPS (polyphenylene sulfide), and insulating substrates. The inorganic filler added to the thermosetting resin lowers the coefficient of thermal expansion of the thermosetting resin, suppresses the warp of the cured resin, and prevents the occurrence of interface peeling and cracks in the semiconductor package.

However, in a semiconductor device using a conventional encapsulant made of a thermosetting resin composition, a minimum amount of peeling may occur at the interface between the encapsulant and the plurality of members, which causes a problem of lowering the power cycle endurance. Was occurring. Further, the heat-resistant temperature rises due to the practical application of next-generation power semiconductors, and it is required to improve the heat resistance of the resin that seals the chip. In order to improve these characteristics, a resin having excellent mechanical strength and heat resistance is required.

As a result of diligent studies, the present inventors have come up with the idea of adding a thermoplastic resin powder such as powdery polyetherimide to a resin composition containing at least a thermosetting resin and an inorganic filler, and the present invention has been made. It came to solve the problem of. That is, the present invention is a resin composition and comprises a thermosetting resin main agent, a thermoplastic resin powder, a curing agent, and an inorganic filler.

In the resin composition, the thermoplastic resin powder is powdered polyetherimide, powdered polybenzoimidazole, powdered thermoplastic polyimide, powdered polyethersulfone, powdered polysulfone, and powdered polyamide 46. And, it is preferable that it is one or more selected from powdered polyamide-imide.

In the resin composition, it is preferable that the thermoplastic resin powder is contained in an amount of 10 to 50 parts by mass with respect to 100 parts by mass of the thermosetting resin main agent.

In the resin composition, the thermoplastic resin powder is preferably powdered polyamide-imide, and preferably contains 5 to 50 parts by mass of powdered polyamide-imide with respect to 100 parts by mass of the thermosetting resin main agent.

In the resin composition, it is preferable that the curing agent contains an acid anhydride-based curing agent.

In the resin composition, the inorganic filler preferably contains one or more selected from fused silica, silica, alumina, aluminum hydroxide, talc, clay, mica, and glass fiber.

It is preferable that the resin composition further contains a curing accelerator, and the curing accelerator contains imidazole or a derivative thereof.

It is preferable that the resin composition is used for encapsulating electronic components.

According to another embodiment, the present invention is a cured resin product obtained by curing the resin composition according to any one of the above.

According to another embodiment of the present invention, the cured resin composition obtained by curing the resin composition according to any one of the above is an electronic component used in at least a part thereof.

According to another embodiment, the present invention comprises sealing a member including a semiconductor element and a metal member mounted on a substrate with a sealing material containing the resin composition according to any one of the above. It is a semiconductor device.

According to the present invention, a cured resin product having excellent mechanical strength and heat resistance can be obtained. Further, as the mechanical strength is improved, the adhesion and moisture resistance are also improved. By using this resin composition as a sealing material for electronic parts, the heat resistance, moisture resistance, and mechanical strength of the sealing material can be improved, and the reliability of electronic parts can be improved. In particular, it is suitable as a sealing material for semiconductor devices, and is suitable for electric / electric power equipment such as automobiles, vehicles, aircraft, ships, vending machines, air conditioners, and generators, which are difficult to control the environment and are used outdoors. Can be used for.

FIG. 1 is a conceptual diagram showing a cross-sectional structure of a semiconductor device, which is an example of an electronic component using the resin composition according to the present invention as a sealing material.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to the embodiments described below.

[First Embodiment: Resin Composition]
According to the first embodiment, the present invention is a resin composition containing a thermosetting resin main agent , a thermoplastic resin powder, a curing agent, and an inorganic filler. Hereinafter, each of these constituent requirements will be described more specifically.

The thermosetting resin main agent used in the present embodiment is not particularly limited, and examples thereof include an epoxy resin, a phenol resin, and a maleimide resin. Epoxy resins having at least two or more epoxy groups in one molecule are particularly preferable for the use of electronic components because they have high dimensional stability, water resistance, chemical resistance, and electrical insulation. Specifically, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol E type epoxy resin, bisphenol S type epoxy resin, bisphenol AD type epoxy resin, naphthalene type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy. Examples thereof include, but are not limited to, resins, alicyclic epoxy resins, maleimide naphthol resins, maleimide triazine resins, maleimide resins, glycidyl ether type epoxy resins, glycidyl ester type epoxy resins, and glycidylamine type epoxy resins. These thermosetting resin main agents may be used alone or in combination of two or more. Physical properties such as heat resistance, toughness, and flame retardancy can be appropriately adjusted by combining the monomer molecules to be copolymerized.

Further, a reactive diluent having a crosslinkable functional group such as an epoxy group at the terminal can be appropriately mixed with the resin composition as an optional component. This is to adjust the viscosity and the crosslink density. Examples of the reactive diluent include phenylglycidyl ether, 2-ethylhexyl glycidyl ether, n-butyl glycidyl ether, cresyl glycidyl ether, ps-butyl phenyl glycidyl ether, allyl glycidyl ether, α-pinene oxide and styrene oxide. , Glycidyl methacrylate, 1-vinyl-3,4-epoxycyclohexane, but are not limited thereto. The amount of the reactive diluent to be added can be appropriately determined by those skilled in the art according to the properties of the thermosetting resin main agent and the like.

The curing agent used in the present embodiment is not particularly limited as long as it can react with the thermosetting resin main agent and can be cured, but it is preferable to use an acid anhydride-based curing agent. Examples of the acid anhydride-based curing agent include aromatic acid anhydrides, specifically, phthalic anhydride, pyromellitic anhydride, trimellitic anhydride and the like. Alternatively, cyclic aliphatic acid anhydrides, specifically tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, etc., or aliphatic acid anhydrides, specifically. Examples thereof include phthalic anhydride, polyadipic acid anhydride, polysevacinic acid anhydride, and polyazeline acid anhydride. The blending amount of the curing agent is preferably 50 to 170 parts by mass, more preferably 80 to 150 parts by mass with respect to 100 parts by mass of the thermosetting resin as the main agent. If the blending amount of the curing agent is less than 50 parts by mass, the glass transition temperature (T _g ) may decrease due to insufficient cross-linking, and if it exceeds 170 parts by mass, the moisture resistance, high thermal deformation temperature, and heat resistance stability decrease. In some cases.

A curing accelerator can be further added to the resin composition as an optional component. As the curing accelerator, imidazole or a derivative thereof, a tertiary amine, boric acid ester, Lewis acid, an organic metal compound, an organic acid metal salt and the like can be appropriately blended. In the case of the imidazole-based curing accelerator, the amount added is preferably 0.01 to 50 parts by mass, more preferably 0.1 to 20 parts by mass with respect to 100 parts by mass of the thermosetting resin main agent. ..

The thermoplastic resin powder is in a powder state under normal temperature and pressure and has no fluidity.
The thermoplastic resin powder preferably has a melting point ( _Tm ) or a glass transition temperature higher than the curing temperature of the thermosetting resin main agent, and in particular, powdery polyetherimide and powdered polybenzone. One or more selected from imidazole, powdered thermoplastic polyimide, powdered polyethersulfone, powdered polysulfone, powdered polyamide 46, powdered semi-aromatic polyamide, and powdered polyamide-imide. Therefore, only one of these may be used, or two or more thereof may be used in combination. The semi-aromatic polyamide is a polyamide in which an aromatic unit is partially introduced into the molecular skeleton of an aliphatic polyamide such as polyamide 46, and examples thereof include polyphthalamide (PPA), PA6T, and PA9T. Not limited to these.

The shape of the thermoplastic resin powder is not particularly limited and may be spherical, needle-like, foil-like, fibrous or the like, but spherical particles are particularly preferable. The average particle size is preferably about 10 to 100 μm, more preferably about 20 to 50 μm, but is not limited to these ranges. This is because good dispersibility can be ensured by setting the average particle size in this range. In the present specification, the average particle size means a value measured by a laser diffraction method.

The thermoplastic resin powder is preferably added in an amount of 1 to 50 parts by mass, more preferably 1 to 30 parts by mass, based on 100 parts by mass of the thermosetting resin as the main agent. ..

The powdery polyetherimide is a polyetherimide which is in a powder state under normal temperature and pressure. The polyetherimide used in the present embodiment is not particularly limited, and is a polymer containing an aliphatic, alicyclic or aromatic ether unit and a cyclic imide as a repeating unit. Of these, a condensate of 2,2-bis [4- (2,3-dicarboxyphenoxy) phenyl] propane dianhydride and m-phenylenediamine or p-phenylenediamine is preferably used. The powdery polyetherimide contains polyetherimide as a main component, and other components may be mixed as long as it is in the form of powder at room temperature. The bending strength of the polyetherimide is 164 MPa, and the elongation rate is 60%. The bending strength of the epoxy resin (bisphenol A type) is 73 MPa, and the elongation rate is 2%. That is, polyetherimide has higher mechanical strength than epoxy resin. Polyetherimide is particularly preferably used in a cured resin because it can contribute to improving adhesion in addition to mechanical strength and heat resistance. The bending strength and the elongation rate are characteristics representing mechanical strength. The bending strength is measured by ISO178 (JIS K7171), which is a test standard for evaluating plastic physical characteristics, and the elongation rate is measured by ISO527-1 (JIS K7161).

The powdered polybenzimidazole contains polybenzimidazole as a main component, and other components may be mixed as long as it is in the form of powder at room temperature. The bending strength of polybenzimidazole is 220 MPa, the elongation rate is 10%, and it has high mechanical properties. Since polybenzimidazole has a particularly high glass transition temperature and high bulk strength such as tensile strength and bending strength, it is possible to impart high mechanical strength and heat resistance to a cured resin product, and accordingly, moisture resistance is also obtained. Can be granted.

The bending strength and elongation of the thermoplastic polyimide are 137 MPa and 90%, respectively.
The bending strength and elongation of the polyethersulfone are 129 MPa and 80%, respectively, the bending strength and elongation of the polysulfone are 106 MPa and 75%, respectively, and the bending strength and elongation of the polyamide 46 are respectively. , 120 MPa, 45%. All of these have higher mechanical strength than epoxy resins. Therefore, like polyetherimide and polybenzimidazole, they are advantageous in terms of moisture resistance and adhesion.

The bending strength of the powdered polyamide-imide is 235 MPa, and the elongation rate is 15%. Further, like powdered polybenzoimidazole, powdered polyamide-imide has a high glass transition temperature and high bulk strength such as tensile strength and bending strength, so that it imparts high mechanical strength and heat resistance to a cured resin product. Along with this, moisture resistance can also be imparted. Further, the powdered polyamide-imide is advantageous in that these effects can be sufficiently imparted even with a small addition amount because of its glass transition temperature and strength characteristics.

Examples of the inorganic filler used in the present embodiment include fused silica, silica, alumina, aluminum hydroxide, titania, zirconia, aluminum nitride, talc, clay, mica, glass fiber and the like, but are limited thereto. Not done. With these inorganic fillers, the thermal conductivity of the cured product can be increased and the coefficient of thermal expansion can be reduced. These inorganic fillers may be used alone or in combination of two or more. Further, these inorganic fillers may be microfillers or nanofillers, and two or more kinds of inorganic fillers having different particle sizes and / or types may be mixed and used. In particular, it is preferable to use an inorganic filler having an average particle size of about 0.2 to 20 μm. The amount of the inorganic filler added is preferably 100 to 600 parts by mass, more preferably 200 to 400 parts by mass, when the total mass of the thermosetting resin main agent and the curing agent is 100 parts by mass. .. If the blending amount of the inorganic filler is less than 100 parts by mass, the coefficient of thermal expansion of the encapsulant may increase and peeling or cracking may easily occur. If the blending amount is more than 600 parts by mass, the viscosity of the composition May increase and the extrudability may deteriorate.

When the resin composition of the present invention is used as a resin for a sealing material of a semiconductor device, it may contain an optional additive as long as the characteristics are not impaired. Examples of the additive include, but are not limited to, a flame retardant, a pigment for coloring a resin, a plasticizer for improving crack resistance, and a silicon elastomer. Those skilled in the art can appropriately determine these optional components and their addition amounts according to the specifications of the semiconductor device.

The method for preparing the resin composition according to the present embodiment can be prepared by mixing the above components by a usual method and preferably dispersing the thermoplastic resin powder in the thermosetting resin substantially uniformly. ..

According to the resin composition according to the first embodiment of the present invention, it is possible to provide a cured resin product having excellent mechanical strength and heat resistance. In addition, due to the improvement of mechanical strength, moisture resistance and adhesion are also excellent. Therefore, the resin composition can be preferably used for encapsulating electronic components, particularly for semiconductor encapsulation.

[Second embodiment: cured resin]
According to another embodiment, the present invention relates to a cured resin product obtained by curing the above resin composition. The method for preparing the cured resin composition is a step of preparing the resin composition by mixing and dispersing each component described for the above-mentioned resin composition by a usual method, and optionally contacting the resin composition with the object to be sealed. It includes a step of heating and curing the resin composition in the state of being in the state. In the heat-curing step, it is preferable to heat the resin at a temperature equal to or higher than the curing temperature of the thermosetting resin and lower than the melting point of the thermoplastic resin, and the thermosetting resin is cured in two steps at a temperature suitable for the curing characteristics of the thermosetting resin. Is more preferable.
In a particularly preferred embodiment, when the thermosetting resin is an epoxy resin, it is held at a temperature of, for example, 80 to 150 ° C. for about 30 minutes to 1 hour, and then held at any temperature of about 100 to 200 ° C. Then, it can be cured by keeping it for about 1 to 10 hours.

In the cured resin product prepared by the above method, the thermoplastic resin powder is preferably dispersed in the thermosetting resin substantially uniformly. As a result, the mechanical properties, heat resistance, moisture resistance, and adhesion of the cured product are improved.

[Third Embodiment: electronic component]
According to the third embodiment, the present invention relates to an electronic component containing the cured resin product described above as a part of a component. Examples of the electronic components include electric / electric power devices such as automobiles, vehicles, aircraft, ships, vending machines, air conditioners, and generators, which are difficult to control the environment and are used outdoors. Specifically, there are a semiconductor module, a mold transformer, a gas-insulated switchgear, and the like, but the present invention is not particularly limited. Typically, the electronic component is a semiconductor device sealed with a sealing material comprising the resin composition according to the first embodiment. Hereinafter, the present embodiment will be described with respect to the semiconductor device, but the electronic component according to the present invention is not limited to the semiconductor device, and there is an interface between the resin and different materials such as metal and ceramics, and the mechanical strength of the resin is present. , And electronic components where heat resistance and peeling at the interface can be a problem, have the same function.

FIG. 1 shows a conceptual cross-sectional view of the semiconductor device according to the present embodiment. The semiconductor device may be a power module or the like used for energizing a large current, but is not particularly limited. In the semiconductor module, the first conductive plate 23 is arranged on the lower surface which is one surface of the insulating substrate 22, and the second conductive plate 21 is arranged on the upper surface which is the other surface to form the laminated substrate 2. The heat spreader 3 is attached to the lower surface of the laminated substrate 2 on the side of the first conductive plate 23 by a bonding layer such as solder. A plurality of SiC semiconductor elements 4 are mounted and mounted on the upper surface of the laminated substrate 2 on the side of the second conductive plate 21 via a conductive bonding layer (not shown). The SiC semiconductor element 4 may be an RC-IGBT element or the like, but is not limited to a specific element. Further, an implant-type printed circuit board 11 provided with an implant pin 6 is attached to the upper surface of the semiconductor element 4 by a bonding layer 5. A control terminal 7 is attached to the upper surface of the second conductive plate 21 so as to be electrically connected to the outside of the semiconductor module. Further, one end of the main terminals N8, P9, and U10 is attached to the upper surface of the second conductive plate 21, and the other end is exposed to the outside of the semiconductor module. Then, these members are sealed with the sealing material 1 made of the resin composition according to the first embodiment to form a semiconductor module. Further, in the present specification, the upper surface and the lower surface are relative terms indicating the upper and lower surfaces in the drawing for the purpose of explanation, and the upper and lower surfaces are not limited in relation to the usage mode of the semiconductor module and the like. not.

In such a method for manufacturing a semiconductor module, the laminated substrate 2 is bonded to the heat spreader 3 by using solder or the like according to the prior art, and the semiconductor element 4 is further mounted on the laminated substrate 2. Next, the implant pin 6, the control terminal 7, the implant type printed circuit board 11, and the main terminals N8, P9, and U10 are attached. Then, the semiconductor module can be manufactured by sealing them with the sealing material 1 by a method such as potting or transfer molding and heat-curing them.

In the illustrated embodiment, the entire semiconductor module is sealed with a sealing material composed of the resin composition according to the first embodiment of the present invention. Not limited. For example, only the peripheral part of the laminated substrate and the peripheral part of the semiconductor element are sealed with the resin composition according to the present invention, and the other parts do not contain the thermoplastic resin powder, and other sealing by the prior art. It may be sealed with a resin.

As another embodiment, although not shown, a semiconductor module having another configuration can be mentioned. Specifically, the module has a case with a built-in external terminal bonded on the heat spreader. A laminated substrate in which an insulating substrate is sandwiched between two upper and lower conductive plates is joined to the heat spreader. Then, the semiconductor element mounted on the laminated substrate, the conductive plate on the upper side of the laminated substrate, and the external terminal are connected by an aluminum wire (wire bonding). The inside of the module case is filled with a sealing material. As for the encapsulation mode with the encapsulant, the whole may be encapsulated with the resin composition according to the present invention as described above, and only the peripheral portion of the laminated substrate and the peripheral portion of the semiconductor element are according to the present invention. It may be sealed with a resin composition, and the other parts may be sealed with another sealing resin according to the prior art, which does not contain thermoplastic resin powder. Alternatively, instead of wire bonding, a lead frame may be used to secure a conductive connection between the semiconductor element and the terminal or the like. Such a configuration is particularly preferably adopted in a semiconductor module equipped with a Si power semiconductor element.

Hereinafter, the present invention will be described in more detail with reference to examples of the present invention. However, the present invention is not limited to the scope of the following examples.

[Example 1-1]
Bisphenol A type epoxy resin (manufactured by Nippon Steel & Sumitomo Metal Corporation, trade name "YD-825GS") and aminoglycidyl ether type epoxy resin (Japan Epoxy Resin Co., Ltd., trade name EP-630) are used as thermosetting resin main agents. A mixture by mass was used. Then, 30 parts by mass of powdered polyetherimide was mixed with the thermosetting resin with respect to 100 parts by mass of the thermosetting resin main agent. The polyetherimide used here was manufactured by SABIC Innovative Plastics Japan GK and had a trade name of "ULTEM". The glass transition point of this polyetherimide was 217 ° C., and the powder was used as a powder having an average particle size of 45 μm. Further, as the curing agent, 120 parts by mass of acid anhydride was used with respect to 100 parts by mass of the thermosetting resin main agent. Further, as the inorganic filler, molten silica particles having an average particle size of 5 μm (manufactured by Takimori Co., Ltd., trade name “ZA-30”) were used. The amount added was adjusted to be 230 parts by mass when the total mass of the thermosetting resin main agent and the curing agent was 100 parts by mass. These were mixed to obtain an uncured resin composition. The obtained resin composition was heated and cured under the conditions of 100 ° C. for 1 h and 200 ° C. for 1 h to obtain a cured resin composition.

[Example 1-2]
In Example 1-1, the composition of the powdered polyetherimide was the same as that of Example 1-1 except that the composition of the powdery polyetherimide was 10 parts by mass with respect to 100 parts by mass of the thermosetting resin main agent. A resin composition and a cured resin product were obtained.

[Example 1-3]
The resin composition and the cured resin of Example 1-3 were obtained in the same manner as in Example 1 except that the composition of the powdered polyetherimide was 50 parts by mass in Example 1-1.

[Comparative Example 1]
In Example 1-1, the powdery polyetherimide was not blended. Other compositions and thermosetting conditions were the same as in Example 1-1, and the resin composition and the cured resin composition of Comparative Example 1 were obtained.

[Example 2-1]
Bisphenol A type epoxy resin (manufactured by Nippon Steel & Sumitomo Metal Corporation, trade name "YD-825GS") and aminoglycidyl ether type epoxy resin (Japan Epoxy Resin Co., Ltd., trade name EP-630) are used as thermosetting resin main agents. A mixture by mass was used. 30 parts by mass of powdered polybenzimidazole was mixed with the thermosetting resin main agent with respect to 100 parts by mass of the thermosetting resin main agent. The powdered polybenzimidazole used here had a glass transition temperature of 427 ° C. and an average particle size of 50 μm, and was manufactured by AZ Electronic Materials Co., Ltd. under the trade name “polybenzimidazole”. Further, as the curing agent, 120 parts by mass of acid anhydride was used with respect to 100 parts by mass of the thermosetting resin main agent. Further, as the inorganic filler, molten silica particles having an average particle size of 5 μm (manufactured by Takimori Co., Ltd., trade name “ZA-30”) were used. The amount added was adjusted to be 230 parts by mass when the total mass of the thermosetting resin main agent and the curing agent was 100 parts by mass. These were mixed to obtain an uncured resin composition. The obtained resin composition was heated and cured at 100 ° C. for 1 h and at 200 ° C. for 10 hours to obtain a cured resin composition.

[Example 2-2]
In Example 2-1 in the same manner as in Example 2-1 except that the composition of the powdered polybenzimidazole was 10 parts by mass with respect to 100 parts by mass of the thermosetting resin main agent, Example 2-2. The resin composition and the cured resin of the above were obtained.

[Example 2-3]
In Example 2-1 in the same manner as in Example 2-1 except that the composition of the powdered polybenzimidazole was 50 parts by mass with respect to 100 parts by mass of the thermosetting resin main agent, Example 2-3. The resin composition and the cured resin of the above were obtained.

[Comparative Example 2]
In Example 2-1 the powdery polybenzimidazole was not blended. Other compositions and thermosetting conditions were the same as in Example 2-1 to obtain the resin composition and the cured resin composition of Comparative Example 2.

[Example 3-1]
As a thermosetting resin main agent, a mixture of bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical, trade name "bisphenol A") and alicyclic epoxy resin (manufactured by Daicel Co., Ltd., trade name "Selokiside") in equal mass is used. Using. 30 parts by mass of powdered polyamide-imide was mixed with the thermosetting resin main agent with respect to 100 parts by mass of the thermosetting resin main agent. The powdery polyamide-imide used here had a glass transition temperature of 280 ° C. and an average particle size of 50 μm, and was manufactured by Toray Industries, Inc. under the trade name “TPS”. Further, as the curing agent, 120 parts by mass of acid anhydride was used with respect to 100 parts by mass of the thermosetting resin main agent. Further, as the inorganic filler, molten silica particles having an average particle size of 5 μm (manufactured by Takimori Co., Ltd., trade name “ZA-30”) were used. The amount added was adjusted to be 230 parts by mass when the total mass of the thermosetting resin main agent and the curing agent was 100 parts by mass. These were mixed to obtain an uncured resin composition. The obtained resin composition was heated and cured at 100 ° C. for 1 h and at 200 ° C. for 10 hours to obtain a cured resin composition.

[Example 3-2]
In Example 3-1 the composition of the powdery polyamide-imide was the same as that of Example 3-1 except that the composition of the powdery polyamide-imide was 10 parts by mass with respect to 100 parts by mass of the thermosetting resin main agent. A resin composition and a cured resin product were obtained.

[Example 3-3]
In Example 3-1, the composition of the powdery polyamide-imide was the same as that of Example 3-1 except that the composition of the powdery polyamide-imide was 5 parts by mass with respect to 100 parts by mass of the thermosetting resin main agent. A resin composition and a cured resin product were obtained.

[Example 3-4]
In Example 3-1, the composition of the powdery polyamide-imide was the same as that of Example 3-1 except that the composition of the powdery polyamide-imide was 50 parts by mass with respect to 100 parts by mass of the thermosetting resin main agent. A resin composition and a cured resin product were obtained.

[Comparative Example 3]
In Example 3-1 the powdery polyamide-imide was not blended. Other compositions and thermosetting conditions were the same as in Example 3-1 to obtain the resin composition and the cured resin composition of Comparative Example 3.

[Glass-transition temperature]
For each of the resin compositions of Examples and Comparative Examples, the amount of change in length with respect to the temperature of the resin was measured using a thermomechanical analysis (TMA) device TMA / SS7100 manufactured by SII, and the inflection point was set to glass. It was defined as the transition temperature.

[Moisture resistance test]
Ten test devices were prepared using the resin compositions obtained in Examples and Comparative Examples as a sealing resin. The test device consists of a lead frame, wires, chips, a DCB (Direct Copper Bonding) board, and a base. This test device was subjected to a high temperature and high humidity storage test. After being left at a temperature of 85 ° C. and a relative humidity of 85% for 1000 hours, the electrical characteristics were evaluated and the resistance value was measured. Compared with the initial resistance value before the high temperature and high humidity storage test, the package whose resistance value increased after the high temperature and high humidity storage test was evaluated as a defective product, and the package whose resistance value did not increase was evaluated as a good product. As a result, when the number of good products was 9 or less out of 10, the moisture resistance was "poor", and when the number of good products was 10, the moisture resistance was "good".

[Bending strength test]
Bending strength tests were performed to evaluate the mechanical strength of the resin composition. As the test piece for the bending strength test, a test piece having a shape and size of 80 mm × 4 mm × 10 mm was cut out from the cured resin obtained in Examples and Comparative Examples. Using a universal material test device (AG-50kNX) manufactured by Shimadzu Corporation, the three-point bending strength was measured under the conditions of a distance between fulcrums of 64 mm and a crosshead speed of 2 mm / min.

[Heat cycle test]
A heat cycle test was performed to evaluate heat resistance and adhesion. A test device sealed with a resin composition having the same specifications as that used for the moisture resistance test is exposed at -40 ° C for 30 minutes and exposed at 175 ° C for 30 minutes as one cycle. The heat cycle until the chip and the sealing resin were peeled off was evaluated as the heat cycle withstand. The occurrence of peeling was confirmed visually and by an ultrasonic flaw detector .

The results of the resin compositions and cured products of Examples 1-1 to 1-3 and Comparative Example 1 are shown in Table 1.

The results of the resin compositions and cured products of Examples 2-1 to 2-3 and Comparative Example 2 are shown in Table 2.

The results of the resin compositions and cured products of Examples 3-1 to 3-4 and Comparative Example 3 are shown in Table 3.

From the results shown in Tables 1, 2 and 3, it was found that the effect of increasing the glass transition temperature of the resin composition (or the cured resin) can be obtained by adding the powdery thermoplastic resin. In particular, the work is carried out by adding 10 to 50 parts by mass of powdered polyetherimide or powdered polybenzoimidazole, or 5 to 50 parts by mass of powdered polyamide-imide to 100 parts by mass of the thermosetting resin main agent. The property was good, and the cured product had good heat resistance, adhesion, moisture resistance, and mechanical strength. These resin compositions can provide highly reliable semiconductor devices. The workability indicates whether or not the resin can be easily poured into the terminal case when the package of the semiconductor device is created. If the viscosity of the resin is high, it becomes difficult to pour it into the terminal case, the labor of the work increases, and the man-hours for creating the package of the semiconductor device increases, which is not preferable. Specifically, workability is evaluated by the viscosity of the resin. When 50 parts by mass of powdered polyetherimide, powdered polybenzoimidazole, or powdered polyamide-imide is added, the viscosity is slightly increased as compared with the case of 30 parts by mass. Therefore, a more preferable amount of powdered polyetherimide or powdered polybenzimidazole to be added is 10 to 30 parts by mass. Further, for powdered polyamide-imide, a more preferable addition amount is 5 to 30 parts by mass.

From the results shown in Tables 1, 2 and 3, it was found that the powdery thermoplastic resin having higher mechanical strength than the epoxy resin imparts the same effect to the epoxy resin even if it is a different compound. In the resin composition according to the present embodiment, the thermoplastic resin powder has a microphase-separated structure in which the thermoplastic resin powder is uniformly dispersed as fine particles in the thermosetting resin, so that the thermoplastic resin powder is mixed with the thermosetting resin. You can increase the amount . Then, it is possible to impart heat resistance and mechanical strength, which are inherent properties of the predetermined thermoplastic resin according to the present invention, to the cured resin product. Further, the resin composition according to the present embodiment is cured at the curing temperature of the epoxy resin, and the curing temperature is lower than the softening temperature of each of polyetherimide, polybenzimidazole, and polyamideimide. Therefore, the foaming of the resin in the curing step is small, and it is possible to prevent the mixing of voids. It is difficult to polymerize by reacting polyetherimide, polybenzimidazole, or polyamideimide with an epoxy resin monomer.

Although it is not intended to be bound by the theory, in this embodiment, the thermoplastic resin powder is dispersed in the epoxy resin which is the matrix resin, so that the epoxy resin and the thermoplastic resin powder are bonded and the epoxy molecule is thermoplastic. It is thought that it is fixed to the resin powder. Therefore, it is considered that the mechanical strength of the resin is increased by the anchor effect. Further, it is considered that the dispersed thermoplastic resin powder hinders the crack elongation together with the contribution of the thermoplastic resin powder itself having high mechanical strength. It is also presumed that the strengthening of the bonding network will improve the adhesion and moisture resistance at the interface. Furthermore, since all of polyetherimide molecules, polybenzimidazoles, and polyamideimides have nitrogen at their ends, they are likely to bind to an inorganic filler composed of a Cu member (oxide) or SiO ₂ by a reaction that does not involve dehydration. Is also possible. Further, the polyamide-imide is a member having plasticity due to an amide bond in addition to an imide bond that can impart excellent mechanical strength. Therefore, it is considered that by adding it to the resin composition for sealing, the followability to the member is improved, the adhesion to the thermosetting resin main agent such as epoxy resin is high, and the pores are less likely to occur. .. As a result, it is considered that the heat cycle resistance was improved even by adding a small amount. It should be noted that such an explanation is merely a consideration for understanding the present invention, and the present invention is not limited to the above-mentioned specific theory.

From the results shown in the examples, according to the resin composition of the present invention, the mechanical strength of the thermoplastic resin is imparted while maintaining the mechanical and thermal properties of the thermosetting resin, and heat resistance, adhesion and moisture resistance are imparted. It was shown that a cured product having excellent properties can be obtained.

1 Encapsulant (cured resin)
2 Laminated board 21 2nd conductive board 22 Insulation board 23 1st conductive board 3 Heat spreader 4 Semiconductor element 5 Bonding layer 6 Implant pin 7 Control terminal 8 Main terminal N
9 Main terminal P
10 Main terminal U
11 Printed circuit board

Claims (10)

It contains an epoxy resin main agent, a thermoplastic resin powder, an epoxy resin curing agent, and an inorganic filler.
A resin composition in which the thermoplastic resin powder is powdered polybenzimidazole and has a bending strength of 144 MPa or more after curing. The resin composition according to claim 1, wherein the thermoplastic resin powder is contained in an amount of 10 to 50 parts by mass with respect to 100 parts by mass of the epoxy resin main agent. The resin composition according to claim 1 or 2 , wherein the epoxy resin curing agent is contained in an amount of more than 80 parts by mass and 150 parts by mass or less with respect to 100 parts by mass of the epoxy resin main agent. The resin composition according to any one of claims 1 to 3 , wherein the epoxy resin curing agent contains an acid anhydride-based curing agent. The invention according to any one of claims 1 to 4 , wherein the inorganic filler comprises one or more selected from fused silica, silica, alumina, aluminum hydroxide, talc, clay, mica, and glass fiber. Resin composition. The resin composition according to any one of claims 1 to 5 , further comprising a curing accelerator, wherein the curing accelerator contains imidazole or a derivative thereof. The resin composition according to any one of claims 1 to 6 , which is used for encapsulating electronic components. A cured resin product obtained by curing the resin composition according to any one of claims 1 to 7 . An electronic component in which a cured resin composition obtained by curing the resin composition according to any one of claims 1 to 7 is used in at least a part thereof. A semiconductor device in which a member including a semiconductor element and a metal member mounted on a substrate is sealed with a sealing material containing the resin composition according to any one of claims 1 to 7 .

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