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JP7060292B2 - Solder filter - Google Patents
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JP7060292B2 - Solder filter - Google Patents

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JP7060292B2
JP7060292B2 JP2019197940A JP2019197940A JP7060292B2 JP 7060292 B2 JP7060292 B2 JP 7060292B2 JP 2019197940 A JP2019197940 A JP 2019197940A JP 2019197940 A JP2019197940 A JP 2019197940A JP 7060292 B2 JP7060292 B2 JP 7060292B2
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solder
sucker
filter
low
temperature
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JP2021062399A (en
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伸一 小松
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Description

本発明は、電子機器のプリント基板の補修に使われる道具に関する。 The present invention relates to a tool used for repairing a printed circuit board of an electronic device.

電子機器の修理で電子部品を取り外すときに、低温ハンダを用いることで、基板と電子部品を高温に晒されずにすむので、劣化を最小限にすることができる。 By using low-temperature solder when removing electronic components for repairing electronic devices, the substrate and electronic components are not exposed to high temperatures, so deterioration can be minimized.

電子機器の修理で電子部品を取り外すときに、基板に負担のかけない低温ハンダを用いるときに、低温ハンダに使われる高価なイリジウム，ビスマスを有効利用するためにリサイクルする必要があり、さらに低温ハンダに使われるイリジウム，カドミウム，鉛は有害なので使用量を低減するためにもリサイクルする必要がある。 When removing electronic components for repairing electronic devices, when using low-temperature solder that does not burden the board, it is necessary to recycle the expensive iridium and bismuth used for low-temperature solder in order to make effective use of them. Iridium, cadmium, and lead used in soldering are harmful and must be recycled to reduce their usage.

基板から電子部品を取り外すときに、ハンダ付けされている部分に低温ハンダを追加ハンダ付けすることにより、融点が下がるので電子部品の取り外しがしやすくなる。
低温ハンダを用いて電子部品を取り外すときは、ハンダ吸取り器１のハンダ吸取り器ノズル２にハンダフィルター８を取り付けて低温ハンダを吸い取る。
低温ハンダを用いないで電子部品を取り外すときは、ハンダフィルター８を取り外して、ハンダ吸取り器１でハンダを吸い取る。When removing the electronic components from the board, adding low-temperature solder to the soldered parts lowers the melting point, making it easier to remove the electronic components.
When removing electronic components using low-temperature solder, a solder filter 8 is attached to the solder sucker nozzle 2 of the solder sucker 1 to suck the low-temperature solder.
When removing the electronic components without using low-temperature solder, the solder filter 8 is removed, and the solder sucker 1 sucks the solder.

ハンダフィルター８には使用した低温ハンダが溜まり、その低温ハンダは再び電子部品を外すために再利用することができる。 The used low-temperature solder is accumulated in the solder filter 8, and the low-temperature solder can be reused to remove the electronic components again.

本発明の模式図である。It is a schematic diagram of this invention. 本発明の組立図である。It is an assembly drawing of this invention.

第２図において、第１図のハンダフィルター８は、ゴム栓４，ハンダフィルター本体５，ハンダ吸取りノズル７で構成され、消耗品であるスチールウール６は、適切に交換される。
ゴム栓４は、ハンダ吸取り器取り付け穴３に、ハンダ吸取り器１のハンダ吸取り器ノズル２を嵌入し、ハンダ吸取り器１とハンダフィルター８を接続するとともに、必要に応じてハンダ吸取り器１から切り離すことができる。
ゴム栓４は、ハンダフィルター本体５にスチールウール６を封入し、ハンダ吸取りノズル７に、ハンダ吸取り器１が発生させる吸引力を伝えるために、ハンダフィルター本体５の気密を保つとともに、必要に応じてスチールウール６を交換するために、ハンダフィルター本体５から外すことができる。In FIG. 2, the solder filter 8 of FIG. 1 is composed of a rubber stopper 4, a solder filter main body 5, and a solder suction nozzle 7, and the consumable steel wool 6 is appropriately replaced.
The rubber stopper 4 fits the solder sucker nozzle 2 of the solder sucker 1 into the solder sucker mounting hole 3, connects the solder sucker 1 and the solder filter 8, and disconnects from the solder sucker 1 as necessary. be able to.
The rubber stopper 4 encloses steel wool 6 in the solder filter main body 5, maintains the airtightness of the solder filter main body 5 in order to transmit the suction force generated by the solder sucker 1 to the solder suction nozzle 7, and if necessary. The steel wool 6 can be removed from the solder filter body 5 in order to replace it.

スチールウール６は、ハンダ吸取り器１が発生させる吸引力によって、ハンダ吸取りノズル７から吸い込まれる空気と低温ハンダから、低温ハンダだけを吸着させ、ハンダ吸取り器１には空気のみ吸取るようにする。 The steel wool 6 adsorbs only the low-temperature solder from the air sucked from the solder suction nozzle 7 and the low-temperature solder by the suction force generated by the solder sucker 1, and sucks only the air into the solder sucker 1.

以上のような構成であるので、低温ハンダを吸取るときに、ハンダ吸取り器１にハンダフィルター８を取り付け、低温ハンダをスチールウール６に溜める。
低温ハンダを回収するときは、ゴム栓４と、ハンダフィルター本体５を外し、スチールウール６をとりだし、ハンダこてをあてると低温ハンダがしたたり落ちるので、これを棒状の型などに入れて凝固させる。
この低温ハンダは、再び基板から電子部品を取り外すのに用いることができる。
なを、ハンダ吸取り器１のハンダ吸取り器ノズル２を、本発明のゴム栓４に簡単に取り付けられるようにしたアタッチメントにし、ゴム栓４もこれにぴったりと嵌入するプラスチック成型品にするのも良いだろう。With the above configuration, when sucking the low temperature solder, the solder filter 8 is attached to the solder sucker 1 and the low temperature solder is stored in the steel wool 6.
When collecting low-temperature solder, remove the rubber stopper 4 and the solder filter body 5, take out the steel wool 6, and apply a soldering trowel to the low-temperature solder. Let me.
This low temperature solder can be used to remove the electronic components from the substrate again.
It is also good to make the solder sucker nozzle 2 of the solder sucker 1 an attachment that can be easily attached to the rubber stopper 4 of the present invention, and the rubber stopper 4 to be a plastic molded product that fits snugly into the attachment. right.

１ ハンダ吸取り器 ２ ハンダ吸取り器ノズル
３ ハンダ吸取り器取り付け穴 ４ ゴム栓
５ ハンダフィルター本体 ６ スチールウール
７ ハンダ吸取りノズル ８ ハンダフィルター1 Solder sucker 2 Solder sucker Nozzle 3 Solder sucker mounting hole 4 Rubber stopper 5 Solder filter body 6 Steel wool 7 Solder sucker nozzle 8 Solder filter

Claims (1)

ハンダ吸取り器１に取り付けるゴム栓４を有し、低温ハンダを溜めるスチールウール６を入れるスペースを設けるハンダフィルター本体５、および、ハンダ吸取りノズル７を具備するハンダフィルター。A solder filter having a rubber stopper 4 attached to a solder sucker 1 and provided with a solder filter main body 5 having a space for storing steel wool 6 for storing low-temperature solder, and a solder sucking nozzle 7.
JP2019197940A 2019-10-10 2019-10-10 Solder filter Active JP7060292B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019197940A JP7060292B2 (en) 2019-10-10 2019-10-10 Solder filter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019197940A JP7060292B2 (en) 2019-10-10 2019-10-10 Solder filter

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JP2021062399A JP2021062399A (en) 2021-04-22
JP7060292B2 true JP7060292B2 (en) 2022-04-26

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003179344A (en) 2001-12-11 2003-06-27 Meisho Kk Intake cylindrical body for solder removing device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2838573B2 (en) * 1990-04-23 1998-12-16 白光株式会社 Desoldering filter for desoldering equipment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003179344A (en) 2001-12-11 2003-06-27 Meisho Kk Intake cylindrical body for solder removing device

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