JP7069739B2 - Coil parts and their manufacturing methods - Google Patents

Description

Application of Article 30, Paragraph 2 of the Patent Act On August 21, 2017, a sample was provided to Texas Instruments.

The present invention relates to a coil component and a manufacturing method thereof, and to a coil component provided with a magnetic resin layer in which a coil pattern is embedded and a manufacturing method thereof.

As a coil component provided with a magnetic resin layer for embedding a coil pattern, Patent Document 1 states that a flat spiral conductor (coil conductor) is formed on a magnetic substrate made of a magnetic material such as sintered ferrite via an insulating resin layer. A coil component having a structure in which a flat spiral conductor is covered with a magnetic resin layer is disclosed.

Further, Patent Document 2 has a structure in which a flat coil is formed on the main surface of a thin ferrite magnetic film via a resin layer or a glass layer, and the upper surface of the flat coil is covered with a thin ferrite magnetic film. A coil component made of a magnetic resin in which one or both of the films have ferrite magnetic powder fixed with a resin binder is disclosed. The resin layer or the glass layer is provided to improve the inconsistency of the flat coil shape due to the unevenness of the surface of the ferrite magnetic film.

Japanese Unexamined Patent Publication No. 2017-79216 Japanese Unexamined Patent Publication No. 2001-244124

In order to make the conventional coil component described in Patent Document 1 thinner, it is necessary to make the magnetic substrate thinner, but if the magnetic substrate is made thinner, cracks and chips are likely to occur, and the reliability of the product is lowered. Therefore, there is a limit to thinning. In addition, it has a structure that tends to be magnetically saturated, and is not suitable for high current applications.

Further, in the conventional coil component described in Patent Document 2, the coil component can be thinned by covering the front and back of the conductor pattern constituting the coil element with a thin ferrite magnetic film, but the characteristics of the coil are maintained. However, there is a problem that it is difficult to suppress the warp.

Therefore, an object of the present invention is to provide a coil component capable of suppressing warpage while maintaining the characteristics of the coil even if it is thin.

In order to solve the above problems, the coil component according to the present invention has an insulating gap layer having a first main surface and a second main surface on the opposite side thereof, and a plurality of coil parts formed on the first main surface of the insulating gap layer. A coil portion in which conductor layers and interlayer insulating layers are alternately laminated, a first magnetic resin layer covering the coil portion and the insulating gap layer from the first main surface side of the insulating gap layer, and the insulating gap layer. A second magnetic resin layer covering the insulating gap layer is provided from the second main surface side of the above, and the insulating gap layer includes a first insulating resin layer and a second insulating resin layer having different elastic ratios from each other. And.

According to the present invention, since the two insulating resin layers having different elastic moduli are provided between the first magnetic resin layer and the second magnetic resin layer sandwiching the coil portion, the total thickness of the coil parts is thin. However, it is possible to suppress the warp of parts while maintaining the characteristics of the coil.

In the present invention, the first insulating resin layer is located closer to the coil portion than the second insulating resin layer, and the elastic modulus of the first insulating resin layer is higher than the elastic modulus of the second insulating resin layer. Small is preferable. As a result, warpage can be suppressed while maintaining the characteristics of the coil parts. Further, in the etching process when forming the coil portion, a gap is generated between the interlayer insulating layer and the insulating gap layer, and the coil pattern is not eroded by the etchant, so that product defects can be prevented. Further, in the coil component manufacturing process, the coil component in the process of being manufactured can be easily peeled off from the carrier substrate, and the coil component whose front and back surfaces of the coil portion are covered with a magnetic resin layer can be easily manufactured.

In the present invention, the coefficient of thermal expansion of the first insulating resin layer is preferably larger than the coefficient of thermal expansion of the second insulating resin layer. According to this, it is possible to reduce the probability that a gap is generated between the interlayer insulating layer and the insulating gap layer in the etching process when forming the coil portion, and it is possible to improve the insulating reliability.

In the present invention, the second insulating resin layer is preferably an insulating resin having an imide bond. According to this, after the coil component is processed on the carrier substrate, it can be easily thermally peeled off from the carrier substrate.

In the present invention, the first insulating resin layer is preferably made of the same material as the interlayer insulating layer. According to this, the adhesiveness between the second insulating resin layer and the interlayer insulating layer can be enhanced, and the probability that a gap is generated between the interlayer insulating layer and the insulating gap layer can be reduced.

In the present invention, the thickness of the first insulating resin layer is preferably thicker than the thickness of the second insulating resin layer. In this case, the thickness of the second insulating resin layer is preferably 0.5 to 6 μm, and the thickness of the first insulating resin layer is preferably 7 to 30 μm. According to this, it is possible to suppress the warp while maintaining the characteristics of the coil component. In addition, it is possible to facilitate thermal separation of the coil component during manufacturing from the carrier substrate, and to improve the adhesiveness between the second insulating resin layer and the interlayer insulating layer to improve the insulation reliability of the coil portion.

In the present invention, the first insulating resin layer has an opening in a part of a region overlapping with at least an inner diameter region of the coil portion in a plan view, and a part of the first magnetic resin layer is the first insulating. It is preferably embedded in the opening of the resin layer. According to this configuration, the magnetic permeability of the magnetic core formed in the inner diameter region of the coil portion can be increased.

Further, in the method for manufacturing a coil component according to the present invention, a carrier substrate having a second insulating resin layer formed on one main surface is prepared, and the elasticity of the second insulating resin layer is higher than that of the second insulating resin layer. A step of forming a first insulating resin layer having a small size, a step of forming a coil portion in which a plurality of conductor layers and an interlayer insulating layer are alternately laminated on the first insulating resin layer, and one of the carrier substrates. A step of forming the first magnetic resin layer so as to cover the coil portion from the main surface side of the above, a step of peeling the carrier substrate from the second insulating resin layer, and a second magnetic force on the second insulating resin layer. It is characterized by comprising a step of forming a resin layer.

According to the present invention, it is possible to manufacture a thin coil component in which both sides of the coil portion are covered with a magnetic resin layer, and even if the total thickness of the coil component is thin, the component can be warped while maintaining the characteristics of the coil. It can be suppressed.

In the present invention, the step of forming the coil portion preferably includes a step of removing an unnecessary portion of the conductor layer by etching. Further, the carrier substrate is a transparent substrate, and the step of peeling the carrier substrate from the second insulating resin layer is a step of irradiating the second insulating resin layer with a laser through the carrier substrate to thermally peel the carrier substrate. It is preferable to include. This makes it possible to easily manufacture a thin coil component provided with a magnetic resin layer for embedding a coil pattern.

In the present invention, the step of forming the first insulating resin layer is a step of selectively removing a part of the first insulating resin layer that overlaps with at least the inner diameter region of the coil portion in a plan view to form an opening. The step of forming the first magnetic resin layer preferably includes a step of embedding the first magnetic resin layer in the opening of the first insulating resin layer. As a result, the magnetic permeability of the magnetic core formed in the inner diameter region of the coil portion can be increased. Further, the insulating gap layer in the inner diameter region of the coil portion can be thinned, and the inductance characteristics of the coil component can be improved.

According to the present invention, it is possible to provide a coil component capable of suppressing warpage while maintaining the characteristics of the coil even if it is thin.

FIG. 1 is a perspective view showing the appearance of a coil component according to a preferred embodiment of the present invention. FIG. 2 is a side sectional view showing the structure of a coil component according to the first embodiment of the present invention. 3 (a) to 3 (d) are plan layout views of each layer of the coil portion having a four-layer structure. 4 (a) to 4 (g) are process diagrams for explaining the manufacturing process of the coil component according to the first embodiment. 5 (a) to 5 (d) are process diagrams for explaining the manufacturing process of the coil component according to the first embodiment. 6 (a) to 6 (c) are process diagrams for explaining the manufacturing process of the coil component according to the first embodiment. 7 (a) to 7 (d) are process diagrams for explaining the manufacturing process of the coil component according to the first embodiment. 8 (a) and 8 (b) are cross-sectional views for explaining the action of the second insulating resin layer. FIG. 9 is a side sectional view showing the structure of the coil component according to the second embodiment of the present invention. 10 (a) and 10 (b) are process diagrams showing a part of the manufacturing process of the coil component according to the second embodiment.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view showing the appearance of a coil component according to a preferred embodiment of the present invention.

The coil component 10 according to the present embodiment is a surface mount type chip component suitable to be used as an inductor for a power supply circuit, and has first and second magnetic resin layers 11 and 12 as shown in FIG. A coil pattern described later is embedded in the first and second magnetic resin layers 11 and 12, one end of the coil pattern is connected to the first external terminal E1, and the other end of the coil pattern is the second external terminal. Connected to E2. However, it is not essential that the coil component according to the present invention is a surface mount type chip component, and a chip component of a type embedded in a circuit board may be used.

The first and second magnetic resin layers 11 and 12 are composite members made of a resin containing metal magnetic particles, and form a magnetic path of magnetic flux generated by passing a current through a coil pattern. As the metal magnetic particles, it is preferable to use a permalloy-based material. Further, as the resin, it is preferable to use a semi-cured epoxy resin which is a liquid or powder. The first and second magnetic resin layers 11 and 12 may be made of the same material or may be made of different materials. If the same materials are used for the first and second magnetic resin layers 11 and 12, the material cost can be reduced.

Unlike a general laminated coil component, the coil component 10 according to the present embodiment is mounted upright so that the z direction, which is the stacking direction, is parallel to the circuit board. Specifically, the surface constituting the xz surface is used as the mounting surface S1. The mounting surface S1 is provided with a first external terminal E1 and a second external terminal E2. The first external terminal E1 is continuously formed from the mounting surface S1 to the side surface S2 constituting the yz surface, and the second external terminal E2 extends from the mounting surface S1 to the side surface S3 forming the yz surface. Formed continuously.

FIG. 2 is a side sectional view showing the structure of the coil component 10 according to the first embodiment of the present invention.

As shown in FIG. 2, the coil portion 20 is embedded inside the laminated body of the first and second magnetic resin layers 11 and 12. The coil portion 20 has four conductor layers 41 to 44, and each conductor layer has a coil pattern C having a plane spiral shape of about 3 turns. As a result, the total number of turns of the coil pattern C becomes about 12 turns. Further, the surface of the coil pattern C of each layer is covered with the insulating gap layer 30 and the interlayer insulating layers 51 to 54, whereby contact with the first and second magnetic resin layers 11 and 12 is prevented.

The first magnetic resin layer 11 covers the coil portion 20 from one side in the coil axial direction (z direction), and has an inner diameter region 22 surrounded by the coil portion 20, an outer peripheral region 23 surrounding the coil portion 20, and a coil. The portion 20 is provided in the upper region 24 on one side in the coil axial direction. On the other hand, the second magnetic resin layer 12 covers the coil portion 20 from the other side in the coil axial direction (z direction), and is provided in the lower region 21 covering the coil portion 20.

An insulating gap layer 30 is provided between the first magnetic resin layer 11 and the second magnetic resin layer 12. The insulating gap layer 30 is made of a non-magnetic material such as a resin, and plays a role of preventing magnetic saturation by forming a magnetic gap between the first magnetic resin layer 11 and the second magnetic resin layer 12. The first magnetic resin layer 11 is provided on the front surface 30a side of the insulating gap layer 30, and the second magnetic resin layer 12 is provided on the back surface 30b side of the insulating gap layer 30.

The insulating gap layer 30 according to the present embodiment has a two-layer structure, and is a first insulating resin layer 31 provided on the first magnetic resin layer 11 side and a second insulating resin provided on the second magnetic resin layer 12 side. It has a layer 32.

The second insulating resin layer 32 not only serves as a magnetic gap, but also serves to facilitate thermal separation of the coil component (intermediate body) during manufacturing from the carrier substrate. Therefore, it is preferable to use a material having a low elastic modulus and a high coefficient of thermal expansion for the second insulating resin layer 32. Specifically, it is preferable to use an insulating resin having an imide bond typified by a polyimide resin for the second insulating resin layer 32.

On the other hand, the first insulating resin layer 31 not only serves as a magnetic gap, but also plays a role of suppressing warpage of the coil component 10 while maintaining the characteristics of the coil. Further, the first insulating resin layer 31 plays a role of preventing the coil characteristics from being deteriorated due to the etching of even the coil pattern C when the unnecessary portions of the conductor layers 41 to 44 are etched. Therefore, it is preferable that the elastic modulus of the first insulating resin layer 31 is smaller than that of the second insulating resin layer 32, and the thermal expansion coefficient of the first insulating resin layer 31 is larger than that of the second insulating resin layer 32. For example, the elastic modulus of the second insulating resin layer 32 is preferably 5.3 Gpa, whereas the elastic modulus of the first insulating resin layer 31 is preferably 3.5 Gpa. Further, the coefficient of thermal expansion of the second insulating resin layer 32 is preferably 17 ppm, whereas the coefficient of thermal expansion of the first insulating resin layer 31 is preferably 60 ppm.

The thickness of the first insulating resin layer 31 is preferably thicker than that of the second insulating resin layer 32. For example, the thickness of the second insulating resin layer 32 is preferably 0.5 to 6 μm, while the thickness of the first insulating resin layer 31 is preferably 7 to 30 μm. As a result, warpage can be suppressed while maintaining the characteristics of the coil. Further, it is possible to facilitate heat separation of the coil component 10 during manufacturing from the carrier substrate and to improve the adhesiveness between the first insulating resin layer 31 and the interlayer insulating layer 51 to improve the insulation reliability of the coil portion 20. can.

The material of the first insulating resin layer 31 is preferably the same as that of the interlayer insulating layers 51 to 54. The first insulating resin layer 31 plays a role of insulatingly separating the coil pattern C from the first and second magnetic resin layers 11 and 12 together with the interlayer insulating layers 51 to 54, and the material of the first insulating resin layer 31 is the interlayer insulating layer 51. By making it the same as ~ 54, the bonding force at the boundary between the two can be increased. Therefore, it is possible to prevent the etchant from invading from the boundary portion between the interlayer insulating layer 51 and the first insulating resin layer 31 and eroding the coil pattern C.

3 (a) to 3 (d) are plan layout views of each layer of the coil portion 20 having a four-layer structure.

As shown in FIGS. 3A to 3D, the outer peripheral end of the coil pattern C1 of the first layer of the coil portion 20 is connected to the first external terminal E1. Further, the inner peripheral end of the coil pattern C1 of the first layer is connected to the inner peripheral end of the coil pattern C2 of the second layer via a through-hole conductor 41a penetrating the interlayer insulating layer 51. The outer peripheral end of the second layer coil pattern C2 is connected to the outer peripheral end of the third layer coil pattern C3 via a through-hole conductor 42a penetrating the interlayer insulating layer 52, and the third layer coil pattern C3. The inner peripheral end is connected to the outer peripheral end of the fourth layer coil pattern C4 via a through-hole conductor 43a penetrating the interlayer insulating layer 53. Further, the outer peripheral end of the fourth layer coil pattern C4 is connected to the second external terminal E2. In this way, the four coil patterns C1 to C4 are connected in series to form a single coil element.

Next, a method of manufacturing the coil component 10 according to the present embodiment will be described.

4 to 7 are process diagrams for explaining a method of manufacturing the coil component 10 according to the first embodiment.

First, as shown in FIG. 4A, a carrier substrate 60 having a predetermined strength is prepared, and a second insulating resin layer 32 is formed on the upper surface thereof. As the material of the carrier substrate 60, a transparent glass substrate is preferably used from the viewpoint of easy peeling of the intermediate from the carrier substrate 60, but a ferrite substrate, a silicon substrate, or the like may be used. Further, the method for forming the second insulating resin layer 32 is not particularly limited, and the second insulating resin layer 32 may be formed by applying a resin material to the surface of the carrier substrate 60 by a spin coating method or a printing method, or may be formed into a film in advance. The second insulating resin layer 32 may be attached to the carrier substrate 60.

Next, as shown in FIG. 4B, the first insulating resin layer 31 is formed on the entire surface of the second insulating resin layer 32. The method for forming the first insulating resin layer 31 is not particularly limited, and the first insulating resin layer 31 may be formed by a spin coating method or a printing method, or the first insulating resin layer 31 molded in a film shape in advance is attached. You can attach it. In this way, the insulating gap layer 30 having a two-layer structure is formed on the carrier substrate 60.

Next, as shown in FIGS. 4C to 4F, a first conductor layer 41 including the coil pattern C1 is formed on the surface 30a (first main surface) of the insulating gap layer 30. In the formation of the conductor layer 41, a base metal film 40a (seed pattern) is formed by using a thin film process such as a sputtering method as shown in FIG. 4 (c), and then a coil pattern is formed as shown in FIG. 4 (d). A photosensitive permanent resist pattern 50a (resist post) composed of a negative pattern of C1 is formed. Next, as shown in FIG. 4 (e), the base metal film 40a is plated and grown to a desired film thickness by an electrolytic plating method, and further, as shown in FIG. 4 (f), the photosensitive permanent resist pattern 50a is formed by ashing. The upper end portion is removed, and the coil pattern C1 is cueed.

Next, as shown in FIG. 4 (g), a resist pattern 50b covering the upper surface of the coil pattern C1 is formed. As a result, the interlayer insulating layer 51 is formed of the resist patterns 50a and 50b and surrounds the coil pattern C1.

After that, by repeating the steps of FIGS. 4 (c) to 4 (g), as shown in FIGS. 5 (a) to 5 (c), the conductor layers 42 to 44 of the 2nd to 4th layers and the 2nd to 4th layers are formed. Interlayer insulation layers 52 to 54 are alternately formed.

Next, as shown in FIG. 5D, the conductor layers 41 to 44 other than the coil patterns C1 to C4 are selectively removed by dry etching or milling. That is, the conductor layers 41 to 44 existing in the inner diameter region 22 and the outer peripheral region 23 of the coil patterns C1 to C4 are partially removed. Since the coil patterns C1 to C4 are covered with the interlayer insulating layers 51 to 54, they are not removed by etching, but the other conductor patterns are removed by etching. As a result, a space is formed in the inner diameter region 22 surrounded by the coil pattern C and the outer peripheral region 23 located outside the coil pattern C.

8 (a) and 8 (b) are cross-sectional views for explaining the action of the second insulating resin layer 32.

As shown in FIG. 8A, if the insulating gap layer 30 is composed of a single layer of the second insulating resin layer 32 and the lower end of the interlayer insulating layer 51 is connected to the second insulating resin layer 32, The adhesion between the lower end of the interlayer insulating layer 51 and the insulating gap layer 30 becomes insufficient, and cracks are likely to occur at the boundary between the interlayer insulating layer 51 and the insulating gap layer 30 in the process of stacking the coil patterns C1 to C4. .. Therefore, when the interlayer insulating layers 51 to 54 are selectively removed, an etchant is formed in the formation region of the coil pattern C1 of the first layer from the slight gap 50c of the contact interface between the interlayer insulating layer 51 and the second insulating resin layer 32. May invade and erode the coil pattern C1. When a gap is formed at the interface between the interlayer insulating layer 51 and the second insulating resin layer 32, the insulation reliability between the coil pattern C1 and the insulating resin layer 31 is lowered. Further, when the coil pattern C1 of the first layer is eroded, the electrical characteristics of the coil may be deteriorated immediately, or may be deteriorated as the coil parts are used continuously, and the desired electrical characteristics may not be obtained. Highly sexual.

However, as shown in FIG. 8B, the insulating gap layer 30 has a two-layer structure of the first and second insulating resin layers 31 and 32, and the lower end of the interlayer insulating layer 51 is connected to the first insulating resin layer 31. If this is the case, the adhesion between the connection interfaces of the two can be improved, and the quality and insulation reliability of the coil pattern C1 can be maintained. Therefore, it is possible to maintain the characteristics of the coil and provide a highly reliable coil component.

Next, as shown in FIG. 6A, a semi-cured first magnetic resin layer 11 held on a film 11a made of PET resin or the like is prepared, and the first magnetic resin layer 11 has a coil pattern C. It is attached to the carrier substrate 60 so as to face each other. As a result, the first magnetic resin layer 11 is formed in the inner diameter region 22, the outer peripheral region 23, and the upper region 24 of the coil pattern C. Alternatively, a semi-cured composite member made of a resin containing metal magnetic particles may be embedded in the space formed by removing unnecessary portions of the conductor layers 41 to 44 by a printing method.

Next, as shown in FIG. 6B, by pressing the first magnetic resin layer 11, the gaps formed in the inner diameter region 22 and the outer peripheral region 23 of the coil pattern C are completely filled by the first magnetic resin layer 11. Fill in.

Next, as shown in FIG. 6 (c), the film 11a is peeled off, the support plate 62 is attached to the first magnetic resin layer 11 via the adhesive 61, and then as shown in FIG. 7 (a). The carrier substrate 60 is peeled off. As a result, the back surface 30b (second main surface) of the insulating gap layer 30 is exposed. The support plate 62 is a support member in the process of peeling the carrier substrate 60, and when it is not necessary to support the entire support in the process of peeling the carrier substrate 60, it is not necessary to attach the support plate 62.

As a method for peeling the carrier substrate 60, thermal peeling by laser irradiation is preferable, but mechanical peeling may be used. When the carrier substrate 60 is thermally peeled off, a glass substrate is preferably used for the carrier substrate 60, and a laser is irradiated from the back side of the carrier substrate 60 toward the second insulating resin layer 32. The laser beam reaches the second insulating resin layer 32 through the glass substrate, and the second insulating resin layer 32 is rapidly heated, so that the adhesive force of the second insulating resin layer 32 is increased at the interface with the carrier substrate 60. Since it is lowered, the carrier substrate 60 can be easily peeled off from the second insulating resin layer 32.

Next, as shown in FIG. 7B, the support plate 62 is peeled off, the intermediate body is turned upside down, and then the second magnetic resin layer 12 in a semi-cured state held on the film 12a made of PET resin or the like. Is prepared, and the second magnetic resin layer 12 is attached to the carrier substrate 60 so as to face the insulating gap layer 30. As a result, the first magnetic resin layer 11 is formed on the back surface 30b of the insulating gap layer 30.

Next, as shown in FIG. 7 (c), after pressing the first and second magnetic resin layers 11 and 12, heat and ultraviolet rays are applied to the semi-cured first and second magnetic resin layers 11 and 12. By giving, the first and second magnetic resin layers 11 and 12 are completely cured. After that, the film 12a is peeled off.

Then, as shown in FIG. 7D, if the external terminals E1 and E2 shown in FIG. 1 are formed after the individualization by dicing, the coil component 10 according to the present embodiment is completed.

As described above, according to the present embodiment, since the insulating gap layer 30 is composed of two insulating resin layers, the heat separation of the coil component in the process of manufacturing from the carrier substrate 60 is facilitated, and the layers are layered. The adhesiveness between the insulating layer 51 and the insulating gap layer 30 can be improved. Therefore, in the step of removing the unnecessary conductor layer by etching (FIG. 5D), it is possible to prevent the situation where even the coil pattern C1 is etched.

FIG. 9 is a side sectional view showing the structure of the coil component according to the second embodiment of the present invention.

As shown in FIG. 9, the feature of the coil component 10 is the opening 32a in a part of the first insulating resin layer 31 in the region (see the broken line) overlapping the inner diameter region 22 and the outer peripheral region 23 of the coil pattern C in a plan view. , 32b are formed, respectively, and a part of the first magnetic resin layer 11 is embedded in the openings 32a and 32b. Therefore, the thickness of the insulating gap layer 30 arranged in the inner diameter region 22 and the outer peripheral region 23 of the coil pattern C is thinner than that of the first embodiment. Other configurations are the same as those of the first embodiment.

10 (a) and 10 (b) are process diagrams showing a part of the manufacturing process of the coil component according to the second embodiment.

In the manufacture of the coil component according to the present embodiment, as shown in FIG. 10 (a), the first insulating resin layer 31 is first formed on the second insulating resin layer 32, and then the first insulating resin layer 31 is formed as shown in FIG. 10 (b). 1 The insulating resin layer 31 is patterned to form an opening 32a in a region overlapping the inner diameter region 22, and an opening 32b is formed in a region overlapping the outer peripheral region 23. After that, the coil components are formed by alternately forming the coil patterns C1 to C4 and the interlayer insulating layers 51 to 54, and further forming the first and second magnetic resin layers 11 and 12, as in the first embodiment. 10 is completed. In the coil component 10 according to the present embodiment, since the insulation gap layer 30 in the inner diameter region 22 and the outer peripheral region 23 of the coil pattern C is thin, the inductance characteristics of the coil component can be improved.

Although the preferred embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the gist of the present invention, and these are also the present invention. Needless to say, it is included in the range.

For example, the coil component in the above embodiment includes a coil pattern C composed of a 12-turn spiral pattern, but the specific pattern shape of the coil pattern is not limited to this in the present invention.

10 Coil component 11 1st magnetic resin layer 11a Film 12 2nd magnetic resin layer 12a Film 20 Coil part 21 Lower region 22 Inner diameter region 23 Outer region 24 Upper region 30 Insulation gap layer 30a Surface of insulation gap layer (first main surface)
30b Back surface of insulation gap layer (second main surface)
31 First Insulating Resin Layer 32 Second Insulating Resin Layers 32a, 32b Opening 40a of First Insulating Resin Layer Underlying Metal Film (Seed Pattern)
41 1st layer conductor layer 42 2nd layer conductor layer 43 3rd layer conductor layer 44 4th layer conductor layer 41a Through-hole conductor 42a Through-hole conductor 43a Through-hole conductor 50a, 50b Resist pattern 50c Gap (crack)
51 First interlayer insulating layer 52 Second interlayer insulating layer 53 Third layer interlayer insulating layer 54 Fourth interlayer insulating layer 60 Carrier substrate 61 Adhesive 62 Support plates C, C1 to C4 Coil patterns E1, E2 External terminal S1 Mounting surface of coil component S2 Side surface of coil component S3 Side surface of coil component

Claims (11)

A coil in which an insulating gap layer having a first main surface and a second main surface on the opposite side thereof, a plurality of conductor layers formed on the first main surface of the insulating gap layer, and an interlayer insulating layer are alternately laminated. Department and
From the first main surface side of the insulating gap layer to the coil portion and the first magnetic resin layer covering the insulating gap layer,
A second magnetic resin layer covering the insulating gap layer is provided from the second main surface side of the insulating gap layer.
The insulating gap layer includes a first insulating resin layer and a second insulating resin layer having different elastic moduli .
The first insulating resin layer is located closer to the coil portion than the second insulating resin layer.
A coil component characterized in that the elastic modulus of the first insulating resin layer is smaller than the elastic modulus of the second insulating resin layer . The coil component according to claim 1 , wherein the coefficient of thermal expansion of the first insulating resin layer is larger than the coefficient of thermal expansion of the second insulating resin layer. The coil component according to claim 1 or 2 , wherein the second insulating resin layer is an insulating resin having an imide bond. The coil component according to any one of claims 1 to 3 , wherein the first insulating resin layer is made of the same material as the interlayer insulating layer. The coil component according to any one of claims 1 to 4 , wherein the thickness of the first insulating resin layer is thicker than the thickness of the second insulating resin layer. The coil component according to claim 5 , wherein the thickness of the first insulating resin layer is 7 to 30 μm, and the thickness of the second insulating resin layer is 0.5 to 6 μm. The first insulating resin layer has an opening in a part of the coil portion that overlaps at least the inner diameter region in a plan view, and a part of the first magnetic resin layer is the first insulating resin layer. The coil component according to any one of claims 1 to 6 , which is embedded in the opening. A step of preparing a carrier substrate on which a second insulating resin layer is formed on one main surface and forming a first insulating resin layer having a lower elastic modulus than the second insulating resin layer on the second insulating resin layer. ,
A step of forming a coil portion in which a plurality of conductor layers and an interlayer insulating layer are alternately laminated on the first insulating resin layer.
A step of forming a first magnetic resin layer so as to cover the coil portion from the one main surface side of the carrier substrate, and a step of forming the first magnetic resin layer.
The step of peeling the carrier substrate from the second insulating resin layer and
A method for manufacturing a coil component, which comprises a step of forming a second magnetic resin layer on the second insulating resin layer. The method for manufacturing a coil component according to claim 8 , wherein the step of forming the coil portion includes a step of removing an unnecessary portion of the conductor layer by etching. The carrier substrate is a transparent substrate, and the step of peeling the carrier substrate from the second insulating resin layer includes a step of irradiating the second insulating resin layer with a laser through the carrier substrate to thermally peel the carrier substrate. , The method for manufacturing a coil component according to claim 8 or 9 . The step of forming the first insulating resin layer includes a step of selectively removing a part of the first insulating resin layer that overlaps with at least the inner diameter region of the coil portion in a plan view to form an opening.
The coil component according to any one of claims 8 to 10 , wherein the step of forming the first magnetic resin layer includes a step of embedding the first magnetic resin layer in the opening of the first insulating resin layer. Manufacturing method.

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