JP7075893B2 - Manufacturing method of double-sided adhesive sheet and semiconductor device - Google Patents

Description

The present invention relates to a double-sided pressure-sensitive adhesive sheet and a method for manufacturing a semiconductor device using the double-sided pressure-sensitive adhesive sheet.

In the method of manufacturing a semiconductor device, a component constituting the semiconductor device may be fixed on a support via a double-sided adhesive sheet, and then the component may be processed on the double-sided adhesive sheet. For example, after fixing a semiconductor package as a component on a stainless steel plate as a support via a double-sided adhesive sheet, a solder bump is mounted at a predetermined position on the surface of the semiconductor package, and further IR reflow is performed. According to such a method, the solder bump can be provided on the surface of the semiconductor package with excellent position accuracy.

Further, as described above, it is also considered to perform chemical solution treatment such as plating, vapor deposition treatment, surface coating treatment, etc. on the parts fixed on the support via the double-sided adhesive sheet as described above. Most of the processing for is accompanied by heating. Therefore, the double-sided adhesive sheet for fixing the component is required to have heat resistance as well as adhesiveness capable of satisfactorily fixing the component and the support.

By the way, in the case of a double-sided adhesive sheet, in general, from the viewpoint of improving handleability and making it suitable for the use of the double-sided adhesive sheet, the adhesive force to the adherend and the peeling when peeling the release sheet are performed. The force may be set independently for both sides of the double-sided adhesive sheet. For example, Patent Document 1 describes a double-sided adhesive sheet adjusted so that the ratio of adhesive strength on both sides is within a predetermined range from the viewpoint of peeling off the double-sided adhesive sheet so that the adherend can be reused. It has been disclosed. Further, Patent Document 2 discloses a double-sided pressure-sensitive adhesive sheet adjusted so that the ratio of the peeling force when the peeling sheet is peeled off on both sides is within a predetermined range from the viewpoint of improving the peelability of the peeling sheet. There is.

International Publication No. 2015/151222 JP-A-11-29751

In recent years, as a component constituting a semiconductor device, a component having a fragile member such as a fine electrode or a terminal on the surface thereof has been manufactured. When such a component is fixed on the support via the double-sided adhesive sheet as described above, the member may be damaged by contact with the double-sided adhesive sheet. Therefore, a method of fixing the component on the support via the double-sided adhesive sheet without bringing the member into contact with the double-sided adhesive sheet is being developed.

As an example of such a method, a double-sided adhesive sheet having a grid-like shape by having a plurality of holes aligned in the X-axis direction and the Y-axis direction in a plan view is used in a component. A method of laminating the parts on the double-sided adhesive sheet is conceivable so that the portion of the above structure fits in the hole. Alternatively, a plurality of tape-shaped double-sided adhesive sheets are used as the double-sided adhesive sheet, and the double-sided adhesive sheets are attached on the support in parallel at intervals from each other, and then the portion of the above structure in the component is double-sided adhesive. A method of laminating the parts on the double-sided adhesive sheet is conceivable so that the parts fit in the area where the sheet is not attached.

However, it has been found that when the conventional double-sided adhesive sheet as disclosed in Patent Documents 1 and 2 is used in such a method, there arises a problem that the double-sided adhesive sheet is easily peeled off from the support. In the above method, after the double-sided adhesive sheet is laminated on the support, the release sheet laminated on the adhesive surface on the opposite side of the double-sided adhesive sheet from the support is peeled off. The sheet is pulled by the release sheet, and the double-sided adhesive sheet is likely to be peeled off from the support. Further, after the processing of the part is completed on the double-sided adhesive sheet, the part is picked up from the double-sided adhesive sheet. Is likely to occur.

Further, the double-sided pressure-sensitive adhesive sheets disclosed in Patent Documents 1 and 2 do not have heat resistance that can withstand heating when processing a part. Therefore, when the parts and the support cannot be properly fixed when heated, the pickup becomes defective when the parts are picked up from the double-sided adhesive sheet, or the used double-sided adhesive sheet is peeled off from the support. In addition, there is a problem that adhesive residue is generated on the support, which hinders the reuse of the support.

The present invention has been made in view of such an actual situation, and is a double-sided pressure-sensitive adhesive sheet that can be used without problems in a method for manufacturing a semiconductor device including a process involving heating, and a semiconductor device having excellent productivity. The purpose is to provide a manufacturing method.

In order to achieve the above object, first, the present invention is laminated with a core material, a first pressure-sensitive adhesive layer laminated on one surface side of the core material, and the other surface side of the core material. The second pressure-sensitive adhesive layer, the first release sheet laminated on the surface of the first pressure-sensitive adhesive layer opposite to the core material, and the core material of the second pressure-sensitive adhesive layer are A double-sided pressure-sensitive adhesive sheet including a second release sheet laminated on the opposite surface, wherein the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer are each composed of a silicone-based pressure-sensitive adhesive. The peeling force P2 when peeling the second peeling sheet from the second pressure-sensitive adhesive layer is 30 mN / 50 mm or more and 1000 mN / 50 mm or less, and the first peeling sheet is peeled from the double-sided pressure-sensitive adhesive sheet. With respect to the double-sided adhesive sheet in which the exposed adhesive surface of the first adhesive layer is attached to a stainless steel plate (SUS304), 180 ° peeling adhesive strength with respect to the stainless steel plate measured in accordance with JIS Z0237: 2009. The ratio of the adhesive force A1 to the peeling force P2 (A1 / P2) is 10 or more and 5000 or less, and the first peeling sheet is peeled off from the double-sided adhesive sheet to be exposed. The adhesive surface of the first adhesive layer is attached to a stainless steel plate (SUS304), and the double-sided adhesive sheet after heating at 260 ° C. for 1 minute is measured in accordance with JIS Z0237: 2009. The 180 ° peeling adhesive force B1 to the steel plate is 500 mN / 25 mm or more and 15000 mN / 25 mm or less, and the adhesiveness of the second adhesive layer exposed by peeling the second release sheet from the double-sided adhesive sheet. After the surface is attached to a stainless steel plate (SUS304) and heated at 260 ° C. for 1 minute, the double-sided adhesive sheet has a 180 ° peeling adhesive force with respect to the stainless steel plate measured in accordance with JIS Z0237: 2009. Provided is a double-sided adhesive sheet characterized in that the difference in adhesive strength obtained by subtracting the adhesive strength B2 from the adhesive strength B1 is 1000 mN / 25 mm or more and 20000 mN / 25 mm or less when the adhesive strength is B2. Invention 1).

The double-sided pressure-sensitive adhesive sheet according to the above invention (Invention 1) has excellent heat resistance because the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer are each composed of a silicone-based pressure-sensitive adhesive. Further, when the double-sided adhesive sheet is used, the first release sheet is first peeled from the first adhesive layer, but at that time, the release force P2 is within the above range. The peeling of the peeling sheet of 2 from the second adhesive layer is suppressed. Subsequently, after the adhesive surface of the first pressure-sensitive adhesive layer exposed by the peeling of the first release sheet is attached to the support, the second release sheet is peeled off from the second pressure-sensitive adhesive layer. When the ratio (A1 / P2) of the adhesive force A1 to the force P2 is in the above range, the peeling of the double-sided adhesive sheet from the support is suppressed when the second release sheet is peeled off. Further, since the difference between the adhesive force B1 and the adhesive force B2 related to the adhesive force after heating at 260 ° C. for 1 minute is within the above range, after performing a process involving heating for processing the part, When the component is picked up from the double-sided adhesive sheet, peeling from the support of the double-sided adhesive sheet is suppressed. When the adhesive force B1 is within the above range, the adhesive residue when the sheet is peeled off from the support after the use of the double-sided adhesive sheet is suppressed. As described above, the semiconductor device can be manufactured with excellent productivity.

In the above invention (Invention 1), when the peeling force P1 is used when the first peeling sheet is peeled from the first pressure-sensitive adhesive layer, the peeling force P1 is larger than the peeling force P2. It is preferable (Invention 2).

In the above inventions (Inventions 1 and 2), the first peeling force P1 is preferably 50 mN / 50 mm or more and 2000 mN / 50 mm or less (Invention 3).

In the above inventions (Inventions 1 to 3), the adhesive strength A1 is preferably 500 mN / 25 mm or more and 15000 mN / 25 mm or less (Invention 4).

In the above inventions (Inventions 1 to 4), the double-sided pressure-sensitive adhesive in which the pressure-sensitive adhesive surface of the second pressure-sensitive adhesive layer exposed by peeling the second-sided pressure-sensitive adhesive sheet from the double-sided pressure-sensitive adhesive sheet is attached to a stainless steel plate (SUS304). With respect to the sheet, the 180 ° peeling adhesive force A2 with respect to the stainless steel plate measured in accordance with JIS Z0237: 2009 is preferably 100 mN / 25 mm or more and 15000 mN / 25 mm or less (Invention 5).

In the above inventions (Inventions 1 to 5), the adhesive strength B2 is preferably 100 mN / 25 mm or more and 15000 mN / 25 mm or less (Invention 6).

In the above inventions (Inventions 1 to 6), it is preferable that the invention has a grid-like shape by having a plurality of holes, and the width between the two adjacent holes is 0.001 mm or more and 10 mm or less. (Invention 7).

In the above inventions (Inventions 1 to 6), it is preferable to have a tape-like shape having a width of 0.1 mm or more and 5 mm or less (Invention 8).

In the above inventions (Inventions 1 to 8), it is preferable that the first release sheet is peeled before the second release sheet (Invention 9).

Secondly, the present invention is a step of peeling the first release sheet from the double-sided pressure-sensitive adhesive sheets (Inventions 1 to 9), and the adhesive surface of the first pressure-sensitive adhesive layer exposed by the peeling of the first release sheet. On the support, a step of providing a region surrounded by or sandwiched by the double-sided adhesive sheet in which the double-sided adhesive sheet does not exist, at the same time as or after the application. A step of peeling the second release sheet from the attached double-sided adhesive sheet, a plurality of parts are laminated on the second pressure-sensitive adhesive layer so as to cover the region or straddle the region. The present invention provides a method for manufacturing a semiconductor device, which comprises a step of performing a process of processing the component with heating, and a step of peeling the component from the second pressure-sensitive adhesive layer (Invention 10). ).

In the above invention (Invention 10), it is preferable to further include a step of peeling the double-sided pressure-sensitive adhesive sheet from the support after the step of peeling the component from the second pressure-sensitive adhesive layer (Invention 11).

In the above inventions (Inventions 10 and 11), the region is laminated by removing the first release sheet from the double-sided pressure-sensitive adhesive sheet after the pressure-sensitive adhesive surface of the first pressure-sensitive adhesive layer is attached to the support. It is preferable that the body is provided by forming a plurality of holes penetrating the laminated body (Invention 12).

In the above inventions (Inventions 10 and 11), it is preferable that the region is provided by attaching a plurality of tape-shaped double-sided adhesive sheets in parallel to the support at intervals of each other (invention). 13).

The double-sided pressure-sensitive adhesive sheet according to the present invention can be used without problems in a method for manufacturing a semiconductor device including a process involving heating. Further, the method for manufacturing a semiconductor device according to the present invention is excellent in productivity.

It is sectional drawing of the double-sided adhesive sheet which concerns on this embodiment. It is sectional drawing explaining the manufacturing method of the semiconductor device which concerns on this Embodiment. It is sectional drawing explaining the manufacturing method of the semiconductor device which concerns on this Embodiment.

Hereinafter, embodiments of the present invention will be described.
[Double-sided adhesive sheet]
FIG. 1 shows a cross-sectional view of the double-sided adhesive sheet 1 according to the present embodiment. The double-sided adhesive sheet 1 according to the present embodiment has a core material 11, a first pressure-sensitive adhesive layer 12 laminated on one surface side of the core material 11, and a first laminated material 11 on the other surface side. The pressure-sensitive adhesive layer 13 of 2, the first release sheet 14 laminated on the surface of the first pressure-sensitive adhesive layer 12 opposite to the core material 11, and the core material 11 of the second pressure-sensitive adhesive layer 13 are A second release sheet 15 laminated on the opposite surface is provided.

Here, the surface of the first pressure-sensitive adhesive layer 12 that comes into contact with the first release sheet 14 (the surface that is attached to the adherend) and the surface of the second pressure-sensitive adhesive layer 13 that comes into contact with the second release sheet 15 are in contact with each other. The surfaces to be attached (the surfaces to be attached to the adherend) are referred to as adhesive surfaces, and the surface in contact with the first adhesive layer 12 in the first release sheet 14 and the second surface in the second release sheet 15. The surfaces that come into contact with the pressure-sensitive adhesive layer 13 of the above are referred to as peeling surfaces.

The double-sided adhesive sheet 1 according to the present embodiment is provided with the first release sheet 14 and the second release sheet 15 as described above, so that the first adhesive layer 12 and the second adhesive layer 13 can be adhered to each other. The surface is protected. Therefore, only one surface is protected by the release sheet, as in the case of the double-sided adhesive sheet drawn from a roll formed by winding a laminate of a double-sided adhesive sheet and a single release sheet whose both sides have been peeled off. Unlike the case, for example, when one adhesive surface is attached to the adherend, external foreign matter such as dust is prevented from adhering to the other adhesive surface.

1. 1. Physical Properties of Double-sided Adhesive Sheet In the double-sided adhesive sheet 1 according to the present embodiment, the peeling force P2 when peeling the second peeling sheet 15 from the second pressure-sensitive adhesive layer 13 is 30 mN / 50 mm or more, and 40 mN / 50 mm. It is preferably 50 mN / 50 mm or more, and particularly preferably 50 mN / 50 mm or more. The peeling force P2 is 1000 mN / 50 mm or less, preferably 500 mN / 50 mm or less, and particularly preferably 300 mN / 50 mm or less.

Generally, when one of the release sheets is peeled from the double-sided adhesive sheet on which the release sheets are laminated on both sides, the other release sheet is likely to be peeled off. In particular, when a heavy peeling sheet having a large peeling force is peeled before a light peeling sheet having a small peeling force, the light peeling sheet is very likely to be peeled when the heavy peeling sheet is peeled off.

When the double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment is used in the method for manufacturing a semiconductor device, first, the first release sheet is peeled off from the double-sided pressure-sensitive adhesive sheet 1. Here, in the double-sided adhesive sheet 1 according to the present embodiment, the peeling force P1 when peeling the first peeling sheet 14 is the peeling force when peeling the second peeling sheet 15 for the reason described later. It tends to be larger than P2. In this case, the heavy peeling sheet is peeled before the light peeling sheet, but in the double-sided adhesive sheet 1 according to the present embodiment, the peeling force P2 is within the above range, so that the second peeling sheet 15 is peeled off. Is prevented from peeling off from the second pressure-sensitive adhesive layer 13. As a result, external foreign matter is suppressed from adhering to the adhesive surface of the second adhesive layer. Further, when the peeling force P2 is in the above range, the ratio of the adhesive force A1 to the peeling force P2 (A1 / P2) can be easily adjusted in the range described later, and the double-sided adhesive sheet 1 attached on the support can be easily adjusted. When the second release sheet 15 is peeled off, the peeling of the double-sided adhesive sheet 1 from the support can be effectively suppressed. The details of the method for measuring the peeling force P2 are as shown in the test examples described later.

The peeling force P1 tends to be larger than the peeling force P2, as described later, that the difference in the adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 is 1000 mN / 25 mm or more. caused by. When the adhesive strength B1 is larger than the adhesive strength B2 as described above, such a magnitude relationship tends to be maintained even when the adhesive strength before heating is compared, that is, the adhesive strength A1 described above tends to be maintained. The adhesive strength tends to be higher than that of A2 described above. Therefore, the peeling force P1 when peeling the first peeling sheet 14 from the adhesive surface of the first adhesive layer 12 exhibiting the adhesive force A1 is the second adhesive layer 13 exhibiting the adhesive force A2. The peeling force P2 when peeling the first peeling sheet 14 from the adhesive surface of No. 1 tends to be larger than that of P2. Therefore, in a preferred embodiment of the double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment, the peeling force P1 is larger than the peeling force P2.

In the double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment, the peeling force P1 when the first peeling sheet 14 is peeled from the first pressure-sensitive adhesive layer 12 is preferably 50 mN / 50 mm or more, and particularly 150 mN / 50 mm or more. It is preferably 300 mN / 50 mm or more. Further, the peeling force P1 is preferably 2000 mN / 50 mm or less, particularly preferably 1000 mN / 50 mm or less, and further preferably 600 mN / 50 mm or less. When the peeling force P1 is within the above range, the first peeling sheet 14 can be easily peeled from the first pressure-sensitive adhesive layer 12, and accordingly, at the time of the peeling, the second peeling sheet 15 and the second peeling sheet 15 and the second are easily peeled off. The burden on the adhesion to the pressure-sensitive adhesive layer 13 is reduced, and unintentional peeling of the second release sheet 15 from the second pressure-sensitive adhesive layer 13 can be effectively suppressed. The details of the method for measuring the peeling force P1 are as shown in the test examples described later.

In the double-sided adhesive sheet 1 according to the present embodiment, the adhesive surface of the first adhesive layer 12 exposed by peeling the first release sheet 14 from the double-sided adhesive sheet 1 is attached to a stainless steel plate (SUS304). For the sheet 1, when the 180 ° peeling adhesive force (mN / 25 mm) for the stainless steel plate measured in accordance with JIS Z0237: 2009 is defined as the adhesive force A1, the ratio of the adhesive force A1 to the peeling force P2 ( A1 / P2) is 10 or more, preferably 15 or more, and particularly preferably 20 or more. The ratio is 5000 or less, preferably 1000 or less, and particularly preferably 500 or less.

In the method for manufacturing a semiconductor device using the double-sided adhesive sheet 1, after the first release sheet 14 is peeled from the double-sided adhesive sheet 1, the adhesive surface of the first adhesive layer 12 is attached to the support. Subsequently, the second release sheet 15 is peeled from the second pressure-sensitive adhesive layer 13. At this time, the ratio of the adhesive force A1 to the peeling force P2 (A1 / P2) is within the above range, so that the adhesive force A1 at the interface between the first adhesive layer 12 and the support is the second peeling sheet 15. It becomes sufficiently larger than the peeling force P2 at the time of peeling, and the peeling of the double-sided adhesive sheet 1 from the support at the time of peeling the second peeling sheet 15 from the double-sided adhesive sheet 1 is suppressed. Such peeling is particularly likely to occur when the double-sided adhesive sheet 1 is attached to the surface of the support having the unevenness where the unevenness exists, but according to the double-sided adhesive sheet 1 according to the present embodiment, such peeling occurs. Even in this case, the peeling of the double-sided adhesive sheet 1 from the support can be satisfactorily suppressed.

When the ratio of the adhesive force A1 to the peeling force P2 (A1 / P2) is less than 10, the first adhesive layer 12 and the support adhere to each other in a state where the double-sided adhesive sheet 1 is attached on the support. The property becomes too small as compared with the adhesiveness between the second release sheet 15 and the second adhesive layer 13, and when the double-sided adhesive sheet 1 is peeled from the second release sheet 15, the double-sided adhesive sheet 1 is used. Is easy to peel off from the support. Further, when the ratio exceeds 5000, the adhesive force A1 becomes excessively large, it becomes difficult to peel off the used double-sided adhesive sheet 1 from the support, and adhesive residue on the support is likely to occur. Further, as described above, the adhesive force A1 is measured in the unit mN / 25 mm, and the peeling force P2 is measured in the unit mN / 50 mm. However, when calculating the above ratio (A1 / P2), these units are used. The ratio shall be calculated from each numerical value without considering the difference between.

In the double-sided adhesive sheet 1 according to the present embodiment, the above-mentioned adhesive force A1 is preferably 500 mN / 25 mm or more, particularly preferably 1000 mN / 25 mm or more, and further preferably 5000 mN / 25 mm or more. .. Further, the adhesive strength A1 is preferably 15000 mN / 25 mm or less, particularly preferably 14000 mN / 25 mm or less, and further preferably 13000 mN / 25 mm or less. When the adhesive force A1 is in the above range, the ratio of the adhesive force A1 to the peeling force P2 (A1 / P2) can be easily set in the above-mentioned range, and the double-sided adhesive sheets 1 to 2 attached on the support can be easily set. When the release sheet 15 is peeled off, the peeling of the double-sided adhesive sheet 1 from the support can be effectively suppressed. The details of the method for measuring the adhesive strength A1 are as shown in the test examples described later.

In the double-sided adhesive sheet 1 according to the present embodiment, the adhesive surface of the first adhesive layer 12 exposed by peeling the first release sheet 14 from the double-sided adhesive sheet 1 is attached to a stainless steel plate (SUS304), 260. For the double-sided adhesive sheet 1 after heating at ° C for 1 minute, the 180 ° peeling adhesive force B1 to the stainless steel plate measured according to JIS Z0237: 2009 is 500 mN / 25 mm or more, and 1000 mN / 25 mm or more. It is preferably present, and particularly preferably 5000 mN / 25 mm or more. The adhesive strength B1 is preferably 15,000 mN / 25 mm or less, preferably 14,000 mN / 25 mm or less, and particularly preferably 13000 mN / 25 mm or less.

In the method for manufacturing a semiconductor device using the double-sided adhesive sheet 1, the double-sided adhesive sheet 1 may be peeled off from the support after the pickup of parts is completed. At this time, the adhesive force B1 is in the above range. Thereby, the double-sided adhesive sheet 1 can be satisfactorily peeled off from the support, and the adhesive residue on the support can be suppressed. Therefore, the support can be easily reused. Further, when the adhesive force B1 is within the above range, it becomes easy to adjust the difference in the adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 within the range described later, and the parts laminated on the double-sided adhesive sheet 1 can be easily adjusted. When picking up, the peeling of the double-sided adhesive sheet 1 from the support can be effectively suppressed.

If the adhesive force B1 exceeds 15,000 mN / 25 m, when the used double-sided adhesive sheet 1 is peeled off from the support, adhesive residue is generated on the support, making it difficult to reuse the support. Further, when the adhesive force B1 is less than 500 mN / 25 mm, the double-sided adhesive sheet 1 tends to be easily peeled off from the support when the parts fixed on the double-sided adhesive sheet 1 are treated with heating. It becomes impossible to properly manufacture semiconductor devices. The details of the method for measuring the adhesive strength B1 are as shown in the test examples described later.

In the double-sided adhesive sheet 1 according to the present embodiment, the adhesive surface of the second adhesive layer 13 exposed by peeling the second release sheet 15 from the double-sided adhesive sheet 1 is attached to a stainless steel plate (SUS304), 260. Regarding the double-sided adhesive sheet 1 after heating at ° C. for 1 minute, when the 180 ° peeling adhesive force (mN / 25 mm) to the stainless steel plate measured according to JIS Z0237: 2009 is set to the adhesive force B2, the above adhesiveness The difference in the adhesive force obtained by subtracting the adhesive force B2 from the force B1 is 1000 mN / 25 mm or more, preferably 1500 mN / 25 mm or more, and particularly preferably 2000 mN / 25 mm or more. Further, the difference is preferably 20000 mN / 25 mm or less, preferably 15000 mN / 25 mm or less, and particularly preferably 13000 mN / 25 mm or less.

In the method for manufacturing a semiconductor device using the double-sided adhesive sheet 1, a component is attached onto a support via the double-sided adhesive sheet 1, and then the component is treated with heating. Therefore, although the double-sided adhesive sheet 1 is also heated, the difference in the adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 is within the above range, so that the double-sided adhesive sheet 1 is used for picking up parts. It is possible to suppress the peeling of the sheet 1 from the support. As a result, the double-sided adhesive sheet 1 is not pulled by the parts to be picked up, and the parts attached to the double-sided adhesive sheet 1 do not collide with each other, so that damage to the parts is suppressed.

If the above difference is less than 1000 mN / 25 mm, the double-sided adhesive sheet 1 is likely to be peeled off from the support when the parts are picked up from the double-sided adhesive sheet 1. As a result, the double-sided adhesive sheet 1 is pulled by the parts to be picked up, or the parts attached on the double-sided adhesive sheet 1 collide with each other, and the parts are damaged. Further, if the difference exceeds 20000 mN / 25 mm, the adhesive force B2 becomes extremely small, and the parts cannot be sufficiently fixed on the double-sided adhesive sheet 1.

In the double-sided adhesive sheet 1 according to the present embodiment, the above-mentioned adhesive force B2 is preferably 100 mN / 25 mm or more, particularly preferably 150 mN / 25 mm or more, and further preferably 500 mN / 25 mm or more. .. The adhesive strength B2 is preferably 15,000 mN / 25 mm or less, particularly preferably 10,000 mN / 25 mm or less, and further preferably 5000 mN / 25 mm or less. When the adhesive force B2 is in the above range, it becomes easy to adjust the difference in the adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 within the above-mentioned range, and the parts laminated on the double-sided adhesive sheet 1 are picked up. At the same time, peeling of the double-sided adhesive sheet 1 from the support can be effectively suppressed. The details of the method for measuring the adhesive strength B2 are as shown in the test examples described later.

In the double-sided adhesive sheet 1 according to the present embodiment, the adhesive surface of the second adhesive layer 13 exposed by peeling the second release sheet 15 from the double-sided adhesive sheet 1 is attached to a stainless steel plate (SUS304). For the sheet 1, the 180 ° peeling adhesive force A2 for the stainless steel plate measured in accordance with JIS Z0237: 2009 is preferably 100 mN / 25 mm or more, particularly preferably 150 mN / 25 mm or more, and further. Is preferably 500 mN / 25 mm or more. The adhesive strength A2 is preferably 15,000 mN / 25 mm or less, particularly preferably 10,000 mN / 25 mm or less, and further preferably 5000 mN / 25 mm or less. Since the adhesive force A2 also affects the magnitude of the peeling force P2 when the second release sheet 15 is peeled off, the peeling force P2 is described above when the adhesive force A2 is within the above range. The range can be easily set, and when the first release sheet 14 is peeled from the double-sided adhesive sheet 1, the peeling of the second release sheet 15 from the double-sided adhesive sheet 1 can be effectively suppressed. The details of the method for measuring the adhesive strength A2 are as shown in the test examples described later.

In the double-sided adhesive sheet 1 according to the present embodiment, the difference in adhesive strength obtained by subtracting the adhesive strength A2 from the adhesive strength A1 is preferably 10 mN / 25 mm or more, and particularly preferably 300 mN / 25 mm or more. It is preferable, more preferably 500 mN / 25 mm or more. Further, the difference is preferably 30,000 mN / 25 mm or less, particularly preferably 20,000 mN / 25 mm or less, and further preferably 15,000 mN / 25 mm or less. Since the difference between the adhesive force A1 and the adhesive force A2 before heating of the double-sided adhesive sheet 1 is within the above range, the difference between the adhesive force B1 and the adhesive force B2 after heating can be easily adjusted to the above-mentioned range, and both sides can be easily adjusted. When picking up the parts laminated on the pressure-sensitive adhesive sheet 1, peeling of the double-sided pressure-sensitive adhesive sheet 1 from the support can be effectively suppressed.

In the double-sided adhesive sheet 1 according to the present embodiment, the adhesive surface of the first adhesive layer 12 exposed by peeling the first release sheet 14 from the double-sided adhesive sheet 1 is attached to a stainless steel plate (SUS304) to 125. For the double-sided adhesive sheet 1 after heating at ° C. for 24 hours, the 180 ° peeling adhesive force C1 to the stainless steel plate measured according to JIS Z0237: 2009 is preferably 1000 mN / 25 mm or more, particularly 1500 mN. It is preferably / 25 mm or more, and more preferably 2000 mN / 25 mm or more. Further, the adhesive strength C1 is preferably 21000 mN / 25 mm or less, particularly preferably 20000 mN / 25 mm or less, and further preferably 19000 mN / 25 mm or less. When the adhesive strength C1 is within the above range, even when the double-sided adhesive sheet 1 is exposed to heating conditions such as 125 ° C. for 24 hours, it is possible to effectively suppress the generation of adhesive residue on the support. can. The details of the method for measuring the adhesive force C1 are as shown in the test examples described later.

In the double-sided adhesive sheet 1 according to the present embodiment, the adhesive surface of the second adhesive layer 13 exposed by peeling the second release sheet 15 from the double-sided adhesive sheet 1 is attached to a stainless steel plate (SUS304) to 125. For the double-sided adhesive sheet 1 after heating at ° C. for 24 hours, the 180 ° peeling adhesive force C2 to the stainless steel plate measured according to JIS Z0237: 2009 is preferably 100 mN / 25 mm or more, particularly 150 mN. It is preferably / 25 mm or more, and more preferably 500 mN / 25 mm or more. Further, the adhesive strength C2 is preferably 20000 mN / 25 mm or less, particularly preferably 15000 mN / 25 mm or less, and further preferably 13000 mN / 25 mm or less. Since the adhesive strength C2 is within the above range, even when the double-sided adhesive sheet 1 is exposed to heating conditions such as 125 ° C. for 24 hours, the parts can be fixed on the double-sided adhesive sheet 1 and the double-sided adhesive sheet 1 can be used. The parts can be picked up well. The details of the method for measuring the adhesive force C2 are as shown in the test examples described later.

In the double-sided adhesive sheet 1 according to the present embodiment, the difference in adhesive force obtained by subtracting the adhesive force C2 from the adhesive force C1 is preferably 10 mN / 25 mm or more, and particularly preferably 300 mN / 25 mm or more. It is preferable, more preferably 500 mN / 25 mm or more. Further, the difference is preferably 30,000 mN / 25 mm or less, particularly preferably 20,000 mN / 25 mm or less, and further preferably 15,000 mN / 25 mm or less. When the difference is within the above range, even when the double-sided pressure-sensitive adhesive sheet 1 is exposed to heating conditions such as 125 ° C. for 24 hours, parts can be satisfactorily picked up from the double-sided pressure-sensitive adhesive sheet 1.

2. 2. Components of Double-sided Adhesive Sheet (1) Core Material The core material 11 is not limited as long as the first pressure-sensitive adhesive layer 12 and the second pressure-sensitive adhesive layer 13 can be laminated, but has heat resistance in particular. It is preferably made of a material. Examples of the core material 11 include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, polyolefin films such as polyethylene and polypropylene, cellulose films such as triacetyl cellulose, polyimide films, polyurethane films, polyurethane acrylate films, and poly. Plastic films such as vinyl chloride film, polyvinylidene chloride film, polyvinyl alcohol film, ethylene-vinyl acetate copolymer film, polystyrene film, polycarbonate film, acrylic resin film, norbornene resin film, cycloolefin resin film, liquid crystal polymer film; Examples thereof include a laminate of two or more of these. The plastic film may be uniaxially stretched or biaxially stretched. Among the above, it is preferable to use a polyester film such as a polyethylene terephthalate film or a polybutylene terephthalate film or a polyimide film from the viewpoint of having heat resistance, and it is particularly preferable to use a polyimide film.

Further, the core material 11 is subjected to an oxidation method or unevenness on one side or both sides, if desired, for the purpose of improving the adhesion to the first pressure-sensitive adhesive layer 12 or the second pressure-sensitive adhesive layer 13 provided on the surface thereof. Surface treatment by method or primer treatment can be applied. Examples of the oxidation method include corona discharge treatment, plasma discharge treatment, chromium oxidation treatment (wet), flame treatment, hot air treatment, ozone, ultraviolet irradiation treatment and the like, and examples of the unevenness method include sandblasting and sandblasting. Examples include a thermal spraying method. These surface treatment methods are appropriately selected depending on the type of the base film, but in general, the corona discharge treatment method is preferably used from the viewpoint of effectiveness and operability.

The thickness of the core material 11 is preferably 3 μm or more, particularly preferably 5 μm or more, and further preferably 15 μm or more. The thickness is preferably 300 μm or less, particularly preferably 100 μm or less, and further preferably 50 μm or less.

(2) First Adhesive Layer and Second Adhesive Layer In the double-sided adhesive sheet 1 according to the present embodiment, the first adhesive layer 12 and the second adhesive layer 13 are each composed of a silicone-based adhesive. Has been done. Therefore, the double-sided adhesive sheet 1 according to the present embodiment has excellent heat resistance, and the adhesive force to the parts and the support is excessively lowered or the adhesive force is excessively improved by heating the double-sided adhesive sheet 1. It is suppressed. As a result, even when the parts fixed on the support via the double-sided adhesive sheet 1 are treated with heating, the parts and the support can be satisfactorily fixed, and the subsequent double-sided adhesive sheet 1 can be fixed well. When picking up the parts from, the pick-up defect is suppressed, and further, when the used double-sided adhesive sheet 1 is peeled off from the support, the adhesive residue on the support is suppressed. By suppressing the adhesive residue, it becomes easy to reuse the support.

The silicone-based pressure-sensitive adhesive constituting the first pressure-sensitive adhesive layer 12 and the second pressure-sensitive adhesive layer 13, respectively, is not particularly limited as long as the double-sided pressure-sensitive adhesive sheet 1 exhibits the above-mentioned adhesive strength and peeling power. Although the silicone-based pressure-sensitive adhesive constituting the first pressure-sensitive adhesive layer 12 and the silicone-based pressure-sensitive adhesive constituting the second pressure-sensitive adhesive layer 13 may have the same composition, as described above. It is preferable to have different compositions in order to easily cause a difference in adhesive force and peeling force between the first pressure-sensitive adhesive layer 12 side and the second pressure-sensitive adhesive layer 13 side.

The silicone-based pressure-sensitive adhesive preferably contains organopolysiloxane, particularly an additive-type organopolysiloxane (cured product). Such a silicone-based pressure-sensitive adhesive easily satisfies the above-mentioned adhesive strength and is also excellent in processability.

The addition-type organopolysiloxane is preferably obtained by reacting an organopolysiloxane having a siloxane bond as a main skeleton and having an alkenyl group with an organohydrogenpolysiloxane.

The organopolysiloxane having a siloxane bond as a main skeleton and having an alkenyl group is preferably a compound represented by the following average unit formula (1) and having at least two alkenyl groups in the molecule.
R ¹ _a SiO _{(4-a) / 2} ... (1)
(In the formula, R ¹ is an unsubstituted or substituted monovalent hydrocarbon group having the same or different carbon atoms of 1 to 12, preferably 1 to 8, and a is 1.5 to 2.8, preferably 1. It is a positive number in the range of .8 to 2.5, more preferably 1.95 to 2.05.)

Examples of the unsubstituted or substituted monovalent hydrocarbon group bonded to the silicon atom represented by R ¹ include a vinyl group, an allyl group, a propenyl group, an isopropenyl group, a butenyl group, a hexenyl group, a cyclohexenyl group and an octenyl group. Alkenyl group, methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, cyclohexyl group, octyl group, nonyl group, decyl group, etc. Alkyl group such as alkyl group, phenyl group, trill group, xylyl group, naphthyl group, aralkyl group such as benzyl group, phenylethyl group and phenylpropyl group, and some or all of the hydrogen atoms of these groups are fluorine. Examples thereof include halogen atoms such as bromine and chlorine, those substituted with a cyano group and the like, such as a chloromethyl group, a chloropropyl group, a bromoethyl group, a trifluoropropyl group and a cyanoethyl group. As the alkenyl group, a vinyl group is preferable from the viewpoint of short curing time and productivity.

Organohydrogenpolysiloxane has a SiH group in the molecule. When the alkenyl group of the organopolysiloxane and the SiH group of the organohydrogenpolysiloxane react with each other, they undergo an addition reaction to obtain an addition-type organopolysiloxane.

Since the additive-type organopolysiloxane cures well in the presence of a platinum catalyst, the silicone-based pressure-sensitive adhesive preferably contains a platinum catalyst. Examples of the platinum catalyst include platinum black, second platinum chloride, platinum chloride acid, a reaction product of platinum chloride acid and a monovalent alcohol, a complex of platinum chloride acid and olephens, platinum bisacetoacetate and the like. ..

The content of the platinum catalyst in the silicone-based pressure-sensitive adhesive is preferably 0.01 part by mass or more, and particularly preferably 0.05 part by mass or more with respect to 100 parts by mass of the additive-type organopolysiloxane. .. The content is preferably 3 parts by mass or less, and particularly preferably 2 parts by mass or less, based on 100 parts by mass of the additive-type organopolysiloxane. When the content of the platinum catalyst is within the above range, the additive-type organopolysiloxane is cured without interfering with the coating, and the first pressure-sensitive adhesive layer 12 and the second pressure-sensitive adhesive layer 13 are formed. Can be done.

The additive organopolysiloxane may contain an organopolysiloxane (silicone resin) containing a trifunctional or tetrafunctional siloxane unit in the molecule from the viewpoint of adjusting the peeling force and the adhesive force described above.

Generally, by increasing the content of the silicone resin in the silicone-based pressure-sensitive adhesive, the pressure-sensitive adhesive force of the pressure-sensitive adhesive layer made of the pressure-sensitive adhesive is increased, and the peeling power of the release sheet laminated on the pressure-sensitive adhesive layer is increased. Can be increased. Therefore, it is preferable to adjust the content of the silicone resin for each of the silicone-based pressure-sensitive adhesive constituting the first pressure-sensitive adhesive layer 12 and the silicone-based pressure-sensitive adhesive constituting the second pressure-sensitive adhesive layer 13.

Further, the desired adhesive strength can be achieved by adjusting the crosslink density in the silicone-based pressure-sensitive adhesive and the amount of catalyst in the silicone-based pressure-sensitive adhesive.

The thickness of the first pressure-sensitive adhesive layer 12 is preferably 1 μm or more, particularly preferably 3 μm or more, and further preferably 5 μm or more. The thickness is preferably 100 μm or less, particularly preferably 50 μm or less, and further preferably 40 μm or less. When the thickness of the first pressure-sensitive adhesive layer 12 is within the above range, it becomes easy to adjust the above-mentioned adhesive force A1, adhesive force B1, adhesive force C1 and peeling force P1 to the above-mentioned ranges, respectively.

The thickness of the second pressure-sensitive adhesive layer 13 is preferably 1 μm or more, particularly preferably 5 μm or more, and further preferably 10 μm or more. The thickness is preferably 100 μm or less, particularly preferably 50 μm or less, and further preferably 40 μm or less. When the thickness of the second pressure-sensitive adhesive layer 12 is within the above range, it becomes easy to adjust the above-mentioned adhesive force A2, adhesive force B2, adhesive force C2, and peeling force P2 to the above-mentioned ranges, respectively.

(3) The first release sheet and the second release sheet The first release sheet 14 is not particularly limited as long as it can exhibit the release property to the first pressure-sensitive adhesive layer 12 on its release surface. Further, the second release sheet 15 is not particularly limited as long as it can exert the above-mentioned release force P2. The first release sheet 14 and the second release sheet 15 may be different release sheets or may be the same type of release sheet.

The configurations of the first release sheet 14 and the second release sheet 15 are arbitrary, and for example, a polyester film such as polyethylene terephthalate, polybutylene terephthalate, or polyethylene naphthalate, or a plastic film such as a polyolefin film such as polypropylene or polyethylene may be used. Can be mentioned. It is preferable that these peeled surfaces are subjected to a peeling treatment. Examples of the peeling agent used for the peeling treatment include a silicone-based peeling agent, a fluorine-based peeling agent, a long-chain alkyl-based peeling agent, and the like. Among these, a first pressure-sensitive adhesive layer made of a silicone-based pressure-sensitive adhesive. A fluorine-based release agent that easily exhibits good release property with respect to 12 and the second pressure-sensitive adhesive layer 13 is preferable.

Examples of the fluorine-based release agent include those composed of a release agent composition containing a compound containing a fluorine atom. The compound is particularly preferably a polymer having a group containing a fluorine atom in the side chain. Examples of the group containing a fluorine atom include a perfluoro group, and more specifically, a perfluoroalkyl group, a perfluoroalkylene group and the like. In particular, the polymer preferably contains a perfluoroalkyl group from the viewpoint of easily adjusting the peeling force described above.

Specific examples of the perfluoroalkyl group include CF ₃ -CF ₂ -group, CF ₃ -CF ₂ -CF ₂ -group and the like. Further, the perfluoroalkyl group may be bonded to the main chain via another group (—O— group, —OCO— group, alkylene group, etc.).

The thicknesses of the first release sheet 14 and the second release sheet 15 are not particularly limited, but are usually 20 μm or more and 250 μm or less, for example.

3. 3. Shape of Double-sided Adhesive Sheet The double-sided adhesive sheet 1 according to the present embodiment may have a grid-like shape by having a plurality of holes. It is preferable that the plurality of holes are aligned in the X-axis direction and the Y-axis direction on the double-sided pressure-sensitive adhesive sheet 1. When the double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment is used in a method for manufacturing a semiconductor device, the plurality of holes may be formed in advance or may be formed in the middle of the manufacturing method. In the method of manufacturing a semiconductor device, by laminating parts so as to cover the holes, protrusions and the like existing on the surface of the parts can be accommodated in the holes.

In the above-mentioned double-sided pressure-sensitive adhesive sheet 1 having a grid-like shape by having a plurality of holes, the width between two adjacent holes is preferably 0.001 mm or more, and particularly 0.01 mm or more. It is preferably 0.1 mm or more, and more preferably 0.1 mm or more. Further, the width is preferably 10 mm or less, particularly preferably 5 mm or less, and further preferably 3 mm or less. In the double-sided adhesive sheet 1 according to the present embodiment, the ratio of the adhesive force A1 to the peeling force P2 (A1 / P2) and the difference in the adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 are in the above-mentioned ranges. As a result, even when the width is within the above range, the double-sided adhesive sheet 1 is peeled off from the support when the second release sheet 15 is peeled off or when the component is picked up from the double-sided adhesive sheet 1. Can be satisfactorily suppressed.

In the double-sided adhesive sheet 1 having a grid-like shape due to having a plurality of holes, the shape and size of the holes are the size of the component laminated on the double-sided adhesive sheet 1 and the members such as protrusions existing on the surface of the component. Can be set according to the size of. For example, the shape of the hole may be square, rectangular or circular, and when it is square, the length of one side is preferably 1 mm or more, and particularly preferably 3 mm or more. Further, in the case of a square, the length of one side is preferably 20 mm or less, and particularly preferably 15 mm or less. When the shape of the hole is rectangular, the length of the short side is preferably 1 mm or more, and particularly preferably 3 mm or more. The length of the short side is preferably 20 mm or less, and particularly preferably 15 mm or less. On the other hand, the length of the long side is preferably 3 mm or more, and particularly preferably 5 mm or more. The length of the long side is preferably 25 mm or less, and particularly preferably 20 mm or less. When the shape of the hole is circular, the length of the diameter of the circular shape is preferably 1 mm or more, and particularly preferably 3 mm or more. The length of the circular diameter is preferably 25 mm or less, and particularly preferably 20 mm or less.

The double-sided adhesive sheet 1 according to the present embodiment may have a tape-like shape. When the double-sided adhesive sheet 1 having such a tape-like shape is used in a method for manufacturing a semiconductor device, a plurality of the double-sided adhesive sheets 1 are attached to a support in parallel at intervals. .. As a result, it is possible to form a plurality of grooves having the end face existing along the length direction of the double-sided adhesive sheet 1 as the side surface and the support as the bottom. Then, by laminating the parts so as to straddle the adjacent double-sided adhesive sheets 1, the protrusions and the like existing on the surface of the parts can be accommodated in the groove.

The width of the double-sided pressure-sensitive adhesive sheet 1 having a tape-like shape is preferably 0.1 mm or more, particularly preferably 0.5 mm or more, and further preferably 1 mm or more. Further, the width is preferably 10 mm or less, particularly preferably 5 mm or less, and further preferably 3 mm or less. In the double-sided adhesive sheet 1 according to the present embodiment, the ratio of the adhesive force A1 to the peeling force P2 (A1 / P2) and the difference in the adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 are in the above-mentioned ranges. As a result, even when the width is within the above range, the double-sided adhesive sheet 1 is peeled off from the support when the second release sheet 15 is peeled off or when the component is picked up from the double-sided adhesive sheet 1. Can be satisfactorily suppressed.

4. Method for Manufacturing Double-sided Adhesive Sheet As an example of the method for manufacturing the double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment, after forming the first pressure-sensitive adhesive layer 12 on one surface of the core material 11, the first pressure-sensitive adhesive layer is formed. A first release sheet 14 is laminated on the surface of the core material 12 opposite to the core material 11, and subsequently, a second pressure-sensitive adhesive layer 13 is formed on the other surface of the core material 11, and then the second pressure-sensitive adhesive layer is formed. A method of laminating the second release sheet 15 on the surface of the agent layer 13 opposite to the core material 11 can be mentioned. Alternatively, after forming the second pressure-sensitive adhesive layer 13 on one surface of the core material 11, the second release sheet 15 is laminated on the surface of the second pressure-sensitive adhesive layer 13 opposite to the core material 11. Subsequently, after forming the first pressure-sensitive adhesive layer 12 on the other surface of the core material 11, the first release sheet 14 is placed on the surface of the first pressure-sensitive adhesive layer 12 opposite to the core material 11. A method of laminating can be mentioned. According to these methods, a double-sided pressure-sensitive adhesive sheet 1 having excellent adhesion between the core material 11 and the first pressure-sensitive adhesive layer 12 and between the core material 11 and the second pressure-sensitive adhesive layer 13 can be manufactured. Can be done.

When the first pressure-sensitive adhesive layer 12 or the second pressure-sensitive adhesive layer 13 is formed on one side of the core material 11, for example, the components constituting the silicone-based pressure-sensitive adhesive are diluted with a solvent to prepare a coating liquid. The coating liquid is applied on one side of the core material 11 and the obtained coating film is heated and cured. As the solvent, methyl ethyl ketone, toluene, ethyl acetate, xylene and the like can be used. Further, as a coating method, a roll knife coater, a die coater, a curtain coater, a spray coater, a slit coater, a knife coater and the like can be used. The heating conditions can be, for example, a temperature of 90 ° C. or higher and 180 ° C. or lower for a time of 1 minute or longer and 5 minutes or shorter.

[Manufacturing method of semiconductor device]
The method for manufacturing a semiconductor device according to an embodiment of the present invention is a method for manufacturing a semiconductor device using the double-sided adhesive sheet 1 described above.

The method for manufacturing a semiconductor device according to the present embodiment is a step of peeling the first peeling sheet 14 from the double-sided adhesive sheet 1 according to the present embodiment (hereinafter, may be referred to as a "first peeling step"), a first. The step of sticking the adhesive surface of the first adhesive layer 12 exposed by peeling the peeling sheet 14 onto the support (hereinafter, may be referred to as “sticking step”), at the same time as the sticking, or after the sticking. From the double-sided adhesive sheet 1 affixed on the support, a step of providing a region surrounded by or sandwiched by the double-sided adhesive sheet 1 in which the double-sided adhesive sheet 1 does not exist (hereinafter, may be referred to as a “region forming step”). A step of peeling the second peeling sheet 15 (hereinafter, may be referred to as a "second peeling step"), a second adhesive so that a plurality of parts each cover the above-mentioned area or straddle the above-mentioned area. A step of laminating on the agent layer 13 (hereinafter, may be referred to as a “part laminating step”), a step of performing a treatment involving heating on a part (hereinafter, may be referred to as a “heating step”), and a part. A step of peeling from the second pressure-sensitive adhesive layer 13 (hereinafter, may be referred to as a “part peeling step”) is provided.

Further, the method for manufacturing a semiconductor device according to the present embodiment preferably further includes a step of peeling the double-sided adhesive sheet 1 from the support (hereinafter, may be referred to as "sheet peeling step") after the component peeling step. ..

Hereinafter, as an example of the method for manufacturing the semiconductor device according to the present embodiment, the method for manufacturing the semiconductor device according to the first aspect, the second aspect, and the third aspect will be described.

1. 1. 1st Embodiment FIG. 2 and FIG. 3 are cross-sectional views illustrating a method for manufacturing a semiconductor device according to the first aspect. Each of the above steps will be described below with reference to these figures.

(1) First peeling step In the first peeling step, as shown in FIG. 2A, the first peeling sheet 14 is peeled from the double-sided adhesive sheet 1 according to the present embodiment. In the double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment, since the peeling force P2 described above is within the range described above, the adhesiveness between the second pressure-sensitive adhesive layer 13 and the second peeling sheet 15 becomes appropriate. When the first release sheet 14 is peeled off, the peeling of the second adhesive layer 13 of the second release sheet 15 is suppressed. As a result, it is possible to prevent external foreign matter from adhering to the adhesive surface of the second adhesive layer 13.

(2) Pasting Step In the pasting step, as shown in FIG. 2B, the adhesive surface of the first adhesive layer 12 exposed by the peeling of the first peeling sheet 14 is pasted on the support 2. .. The support 2 is not limited as long as it can attach the double-sided adhesive sheet 1 and can support parts and can withstand heating in the heating step described later, and is, for example, a stainless steel plate, an aluminum plate, a copper plate, or the like. Is preferable.

(3) Region forming step In the region forming step, as shown in FIG. 2 (c), a plurality of laminated bodies excluding the first release sheet 14 in the double-sided adhesive sheet 1 penetrate the laminated body. Hole 3 is formed. In the method for manufacturing a semiconductor device according to the first aspect, the hole 3 is a region surrounded by the double-sided adhesive sheet 1 in which the double-sided adhesive sheet 1 does not exist.

When forming the plurality of holes 3, the width between the two adjacent holes 3 is preferably 0.1 mm or more, particularly preferably 0.3 mm or more, and further 0.5 mm or more. Is preferable. The width is preferably 15 mm or less, particularly preferably 10 mm or less, and further preferably 5 mm or less. The shape of the hole may be square or rectangular.

The holes 3 can be formed by cutting the double-sided adhesive sheet 1 into the shape of the holes 3 using a blade, a laser, an engraving blade, a cutter, or the like, and removing unnecessary portions.

(4) Second Peeling Step In the second peeling step, as shown in FIG. 3A, the second peeling sheet 15 is peeled from the double-sided adhesive sheet 1 attached on the support 2. In the double-sided adhesive sheet 1 according to the present embodiment, the ratio of the adhesive force A1 to the peeling force P2 (A1 / P2) is within the above-mentioned range, so that when the second release sheet 15 is peeled off, the support 2 is used. The peeling of the double-sided adhesive sheet 1 is suppressed. The second peeling step may be performed before the region forming step.

(5) Parts Laminating Step In the parts laminating step, as shown in FIG. 3B, a plurality of parts 4 are laminated on the second adhesive layer 13. At this time, the parts 4 are laminated so as to cover one hole 3. As a result, even if a easily damaged protrusion 41 is present on the surface of the component 4, the protrusion 41 can be accommodated in the hole 3, whereby contact with the double-sided adhesive sheet 1 can be achieved. It is possible to suppress the damage of the protrusion 41 due to the damage.

(6) Heating Step In the heating step, as shown in FIG. 3B, a treatment involving heating is performed on the component 4 in a state where a plurality of components 4 are laminated on the second adhesive layer 13. I do. Examples of the treatment include IR reflow, chemical treatment such as plating, vapor deposition treatment, surface coating treatment, baking treatment for drying, heat curing of a protective agent, and the like. Further, the heating temperature in the treatment involving heating may be 100 ° C. or higher, and particularly may be 150 ° C. or higher. Further, the heating temperature may be 400 ° C. or lower, particularly 300 ° C. or lower. Further, the heating time in the treatment involving heating may be 1 minute or more, particularly 5 minutes or more. Further, the heating time may be 300 minutes or less, and in particular, 200 minutes or less.

In the double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment, the double-sided pressure-sensitive adhesive sheet 1 has excellent heat resistance because the first pressure-sensitive adhesive layer 12 and the second pressure-sensitive adhesive layer 13 are each composed of a silicone-based pressure-sensitive adhesive. Will have. As a result, even if the treatment accompanied by heating as described above is performed, the adhesive strength of the double-sided adhesive sheet 1 is unlikely to change, and in the subsequent component peeling step, the occurrence of pick-up defects of the component 4 is suppressed, and the sheet is also suppressed. In the peeling step, the adhesive residue on the support 2 can be suppressed, and the double-sided adhesive sheet 1 can be satisfactorily peeled from the support 2.

(7) Part peeling step In the part peeling step, the part 4 is peeled from the second adhesive layer 13 as shown in FIG. 3 (c). The peeling can be performed, for example, by individually picking up the parts 4 using a pick-up device.

In the double-sided adhesive sheet 1 according to the present embodiment, the difference in the adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 is within the above-mentioned range, so that the double-sided adhesive sheet 1 is suppressed from peeling from the support 2. To. As a result, the double-sided adhesive sheet 1 is not pulled by the component 4 to be picked up, and the components 4 attached to the double-sided adhesive sheet 1 do not collide with each other, so that damage to the component 4 is suppressed. To.

(8) Sheet peeling step In the sheet peeling step, the double-sided adhesive sheet 1 from which all the parts 4 have been peeled is peeled from the support 2. In the double-sided adhesive sheet 1 according to the present embodiment, since the adhesive force B1 is within the above-mentioned range, the adhesiveness between the second adhesive layer 13 and the support 2 does not become excessively high, and therefore. The double-sided pressure-sensitive adhesive sheet 1 can be satisfactorily peeled off from the support 2 without causing adhesive residue on the support 2 due to the pressure-sensitive adhesive component of the second pressure-sensitive adhesive layer 13. As a result, the support 2 can be reused as it is without the need for a treatment for removing the adhesive residue.

2. 2. Second aspect In the method for manufacturing a semiconductor device according to the second aspect, the above-mentioned double-sided pressure-sensitive adhesive sheet 1 having a grid-like shape by having a plurality of holes is used. Since the double-sided pressure-sensitive adhesive sheet 1 has a plurality of holes 3 formed in advance, the plurality of holes 3 penetrating the laminate except for the first release sheet 14 in the double-sided pressure-sensitive adhesive sheet 1 in the above-mentioned region forming step. There is no need to form.

Specifically, after performing the first peeling step in the same manner as in the method for manufacturing a semiconductor device according to the first aspect, as a sticking step, the adhesive surface of the first adhesive layer 12 in the double-sided adhesive sheet 1 is supported. Attach to 2. As a result, the plurality of holes 3 previously formed in the double-sided adhesive sheet 1 become a region surrounded by the double-sided adhesive sheet 1 in which the double-sided adhesive sheet 1 does not exist. Therefore, in the method for manufacturing a semiconductor device according to the second aspect, the pasting step also serves as a region forming step. After that, the second peeling step, the component laminating step, the heating step, the component peeling step, and the sheet peeling step can be performed in the same manner as in the method for manufacturing the semiconductor device according to the first aspect.

In the method for manufacturing a semiconductor device according to the second aspect, the peeling of the second peeling sheet 15 from the second pressure-sensitive adhesive layer 13 in the first peeling step is similar to the method for manufacturing the semiconductor device according to the first aspect. It is possible to suppress the peeling of the double-sided adhesive sheet 1 from the support 2 in the second peeling step, and it is possible to suppress the change in the adhesive force of the double-sided adhesive sheet 1 in the heating step. It is possible to suppress the peeling of the double-sided adhesive sheet 1 from the support 2 in the peeling step, and it is possible to suppress the adhesive residue on the support 2 in the sheet peeling step.

3. 3. Third aspect In the method for manufacturing a semiconductor device according to the third aspect, a plurality of double-sided adhesive sheets 1 having a tape-like shape as described above are used. Specifically, after performing the first peeling step in the same manner as in the method for manufacturing a semiconductor device according to the first aspect, as a sticking step, a double-sided pressure-sensitive adhesive sheet having a plurality of tape-like shapes with respect to the support 2. 1 is attached in parallel with a space between them. As a result, a region sandwiched between the adjacent double-sided adhesive sheets 1 on the support 2 in which the double-sided adhesive sheet 1 does not exist is formed. Therefore, in the method for manufacturing a semiconductor device according to the third aspect, the pasting step also serves as a region forming step. It is preferable to repeat the work of peeling the first release sheet 14 for each double-sided adhesive sheet 1 and attaching the double-sided adhesive sheet 1 to the support 2 as many times as necessary, and in particular, peeling off the first release sheet 14. However, it is preferable to attach the adhesive surface of the first adhesive layer 12 exposed thereby to the support 2. After the completion of the pasting step that also serves as the region forming step, the second peeling step, the component laminating step, the heating step, the component peeling step, and the sheet peeling step can be performed in the same manner as in the manufacturing method of the semiconductor device according to the first aspect. can.

In the method for manufacturing a semiconductor device according to the third aspect, the peeling of the second peeling sheet 15 from the second pressure-sensitive adhesive layer 13 in the first peeling step is similar to the method for manufacturing the semiconductor device according to the first aspect. It is possible to suppress the peeling of the double-sided adhesive sheet 1 from the support 2 in the second peeling step, and it is possible to suppress the change in the adhesive force of the double-sided adhesive sheet 1 in the heating step. It is possible to suppress the peeling of the double-sided adhesive sheet 1 from the support 2 in the peeling step, and it is possible to suppress the adhesive residue on the support 2 in the sheet peeling step.

The embodiments described above are described for facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

For example, another layer may be provided between the core material 11 and the first pressure-sensitive adhesive layer 12, or between the core material 11 and the second pressure-sensitive adhesive layer 13.

Hereinafter, the present invention will be described in more detail with reference to Examples and the like, but the scope of the present invention is not limited to these Examples and the like.

[Examples 1 to 3 and Comparative Examples 1 to 5]
The components shown in Table 1 were mixed and diluted with methyl ethyl ketone to obtain a coating liquid for the pressure-sensitive adhesive composition for the first pressure-sensitive adhesive layer having a solid content concentration of 20% by mass. The coating liquid was applied to one side of a polyimide film (manufactured by Toray DuPont, product name "Kapton 100H", thickness: 25 μm) as a core material using a roll knife coater, and the obtained coating was obtained. The film was heated at 130 ° C. for 2 minutes to cure and form a first pressure-sensitive adhesive layer. A release film formed by peeling one side of a 38 μm-thick polyethylene terephthalate film as a first release sheet with a fluorine-based release agent on the surface of the obtained first pressure-sensitive adhesive layer opposite to the core material. A laminate made by Lintec Corporation, product name "SP-PET 38E-0010YCS") is attached, and a core material, a first pressure-sensitive adhesive layer, and a first release sheet are laminated in this order. Obtained. The thickness of the first pressure-sensitive adhesive layer is shown in Table 1.

Subsequently, the components shown in Table 1 were mixed and diluted with methyl ethyl ketone to obtain a coating liquid for the pressure-sensitive adhesive composition for the second pressure-sensitive adhesive layer having a solid content concentration of 20% by mass. .. The coating liquid is applied on the surface of the laminate obtained as described above on the core material side using a roll knife coater, and the obtained coating film is heated at 130 ° C. for 2 minutes to be cured. The pressure-sensitive adhesive layer of 2 was formed. Further, on the surface of the obtained second pressure-sensitive adhesive layer opposite to the core material, one side of a 38 μm-thick polyethylene terephthalate film as a second release sheet is peeled off by a fluorine-based release agent. A peeling surface of a film (manufactured by Lintec Corporation, product name "SP-PET 38E-0010YCS") is attached, and a second peeling sheet, a second pressure-sensitive adhesive layer, a core material, and a first pressure-sensitive adhesive layer are attached. , A double-sided adhesive sheet formed by laminating the first release sheet in this order was obtained. The thickness of the second pressure-sensitive adhesive layer is shown in Table 1.

Here, the details of the constituents shown in Table 1 are as follows.
Silicone adhesive A: Silicone adhesive (manufactured by Toray Dow Corning, product name "SD 4587 L")
Silicone adhesive B: Silicone adhesive (manufactured by Toray Dow Corning, product name "SD 4580")
Silicone adhesive C: Silicone adhesive (manufactured by Toray Dow Corning, product name "SD 4584")
Primer: Primer (manufactured by Toray Dow Corning, product name "BY24-712")
Platinum catalyst: Platinum catalyst (manufactured by Toray Dow Corning, product name "SRX 212")

[Test Example 1] (Measurement of adhesive strength)
After cutting the double-sided adhesive sheet produced in Examples and Comparative Examples into a width of 25 mm and a length of 100 mm, the adhesive strength (mN) of each of the adhesive surface of the first adhesive layer and the adhesive surface of the second adhesive layer. / 25 mm) was measured according to JIS Z0237 as described below.

When measuring the adhesive strength of the adhesive surface of the first pressure-sensitive adhesive layer, the second release sheet was peeled off from the double-sided pressure-sensitive adhesive sheet to expose the adhesive surface of the second pressure-sensitive adhesive layer. Then, the surface opposite to the peeled surface of the second peeling sheet obtained by the peeling was attached to the adhesive surface using a 2 kg rubber roller in an environment of a temperature of 23 ° C. and a relative humidity of 50%. .. This operation prevents the second release sheet from peeling from the second adhesive layer when measuring the adhesive force of the adhesive surface of the first adhesive layer, which hinders accurate measurement of the adhesive force. This is done to avoid it.

Then, the first release sheet is peeled off from the first pressure-sensitive adhesive layer, and the pressure-sensitive adhesive surface of the exposed first pressure-sensitive adhesive layer is subjected to an environment of a temperature of 23 ° C. and a relative humidity of 50% using a 2 kg rubber roller. Then, it was attached to one side of a stainless steel plate (SUS304 mirror plate, arithmetic average roughness Ra: 0.05 μm) as a support, left for 20 minutes, and the double-sided adhesive sheet and stainless steel excluding the first release sheet. A test laminate consisting of a plate was obtained.

The obtained test laminate was used as a double-sided adhesive sheet using a universal tensile tester (manufactured by Shimadzu Corporation, product name "Autograph AG-IS") under the conditions of a peeling angle of 180 ° and a peeling speed of 300 mm / min. Was peeled off from the stainless steel plate, and the adhesive strength (mN / 25 mm) at that time was measured. This adhesive force was defined as the adhesive force A1 (mN / 25 mm) for the first pressure-sensitive adhesive layer. The results are shown in Table 2.

When measuring the adhesive strength of the adhesive surface of the second adhesive layer, the side of the first release sheet and the first adhesive layer and the second release sheet and the second adhesive in the double-sided adhesive sheet are used. The measurement was performed in the same manner as in the above-mentioned method for measuring the adhesive strength A1 except that the side of the adhesive layer was replaced, and the obtained adhesive strength was defined as the adhesive strength A2 (mN / 25 mm) for the second adhesive layer. The results are shown in Table 2.

Further, the value of the adhesive force A2 was subtracted from the value of the adhesive force A1 measured as described above, and the difference between these adhesive forces (A1-A2) (mN / 25 mm) was calculated. The results are shown in Table 2.

[Test Example 2] (Measurement of adhesive strength after heating)
After obtaining the test laminate in the same manner as in Test Example 1, the test laminate was heated at 260 ° C. for 1 minute. The heating condition is defined as heating condition 1. For the test laminate after heating, the adhesive strength (mN / 25 mm) of the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer was measured in the same manner as in Test Example 1. The obtained adhesive strengths are used as the adhesive strength B1 (mN / 25 mm) under the heating condition 1 for the first pressure-sensitive adhesive layer and the adhesive strength B2 (mN / 25 mm) under the heating condition 1 for the second pressure-sensitive adhesive layer, respectively. ). The results are shown in Table 2.

Further, the value of the adhesive force B2 was subtracted from the value of the adhesive force B1 measured as described above, and the difference between these adhesive forces (B1-B2) (mN / 25 mm) was calculated. The results are shown in Table 2.

Further, after obtaining the test laminate in the same manner as in Test Example 1, the test laminate was heated at 125 ° C. for 24 hours. The heating condition is defined as heating condition 2. For the test laminate after heating, the adhesive strength (mN / 25 mm) of the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer was measured in the same manner as in Test Example 1. The obtained adhesive strengths are used as the adhesive strength C1 (mN / 25 mm) under the heating condition 2 for the first pressure-sensitive adhesive layer and the adhesive strength C2 (mN / 25 mm) under the heating condition 2 for the second pressure-sensitive adhesive layer, respectively. ). The results are shown in Table 2.

Further, the value of the adhesive force C2 was subtracted from the value of the adhesive force C1 measured as described above, and the difference between these adhesive forces (C1-C2) (mN / 25 mm) was calculated. The results are shown in Table 2.

[Test Example 3] (Measurement of peeling force)
After cutting the double-sided adhesive sheet produced in Examples and Comparative Examples to a width of 50 mm and a length of 200 mm, the peeling force (mN / 50 mm) of each of the first peeling sheet and the second peeling sheet is applied to JIS Z0237. The measurement was performed accordingly as described below.

When measuring the peeling force of the first peeling sheet, the second peeling sheet is peeled from the double-sided pressure-sensitive adhesive sheet, and the pressure-sensitive adhesive surface of the exposed second pressure-sensitive adhesive layer is subjected to an environment of a temperature of 23 ° C. and a relative humidity of 50%. In, a 2 kg rubber roller was used to attach it to one side of a stainless steel plate (SUS304 mirror plate, arithmetic average roughness Ra: 0.05 μm) as a support. Twenty minutes after pasting, the first peeling sheet was used under the conditions of a peeling angle of 180 ° and a peeling speed of 300 mm / min using a universal tensile tester (manufactured by Shimadzu Corporation, product name "Autograph AG-IS"). Was peeled off from the first pressure-sensitive adhesive layer on the double-sided pressure-sensitive adhesive sheet, and the peeling force (mN / 50 mm) at that time was measured. This peeling force was defined as the peeling force P1 (mN / 50 mm) for the first peeling sheet. The results are shown in Table 2.

When measuring the peeling force of the second release sheet, the side of the first release sheet and the first pressure-sensitive adhesive layer and the side of the second release sheet and the second pressure-sensitive adhesive layer in the double-sided pressure-sensitive adhesive sheet. The peeling force P1 was measured in the same manner as in the above-mentioned measuring method of the peeling force P1, and the obtained peeling force was defined as the peeling force P2 (mN / 50 mm) for the second peeling sheet. The results are shown in Table 2.

Further, the ratio (A1 / P2) of the adhesive force A1 measured in Test Example 1 to the peeling force P2 measured as described above was calculated. The results are shown in Table 2.

[Test Example 4] (Support attachment test)
(1) Preparation of semiconductor package for test After forming a circuit pattern on the copper foil in a copper foil-clad laminate (manufactured by Mitsubishi Gas Chemical Company, product name "CCL-HL830", copper foil thickness: 18 μm), the pattern A substrate (manufactured by Chigiken Co., Ltd., product name "LN001E-001 PCB (Au) AUS303") formed by laminating a solder resist (manufactured by Taiyo Ink Co., Ltd., product name "PSR-4000 AUS303") was prepared.

A mold resin (manufactured by Kyocera Chemical Co., Ltd., product name "KE-1100AS3") is used on the above substrate by using a sealing device (manufactured by Apic Yamada Corporation, product name "MPC-06M TriAl Press") without mounting a chip. ), The sealing thickness was 400 μm. Then, the mold resin was cured by heating at 175 ° C. for 5 hours.

Subsequently, the sealed substrate is attached to a dicing tape (manufactured by Lintec Corporation, product name "Adwill D-510T"), and then installed on a dicing device (manufactured by Disco Corporation, product name "DFD651") for dicing. By doing so, a test semiconductor package having a size of 8 mm × 8 mm was obtained.

(2) Implementation of Support Attachment Test The first release sheet is peeled off from the double-sided adhesive sheet manufactured in Examples and Comparative Examples, and the adhesive surface of the exposed first adhesive layer is a stainless steel plate (SUS304 mirror surface plate). , Arithmetic mean roughness Ra: 0.05 μm, dimensions: 15 cm × 7 cm × 0.5 mm) attached to one side.

Then, on the stainless steel plate, unnecessary parts of the double-sided adhesive sheet were cut off using a cutter so that the double-sided adhesive sheet had a grid pattern. Specifically, a plurality of rectangular regions having a size of 6 mm × 6 mm, which are aligned in the vertical direction and the horizontal direction of the double-sided adhesive sheet at intervals of 3 mm, were cut out using a cutter.

Subsequently, the second release sheet was peeled off from the double-sided adhesive sheet to expose the adhesive surface in the second adhesive layer. Then, the semiconductor package manufactured in the above step (1) was placed on the adhesive surface in an environment of a temperature of 23 ° C. and a relative humidity of 50% using tweezers, and pressure-bonded using a 2 kg rubber roller. .. At this time, the adhesive surface of the double-sided adhesive sheet and the sealed surface of the test semiconductor package were placed so as to be in contact with each other. Further, the holes formed in the double-sided adhesive sheet were placed so as to be covered with the test semiconductor package. More specifically, it was placed so that the center of gravity of the test semiconductor package and the center of gravity of the holes formed in the double-sided adhesive sheet coincide with each other in a plan view. As a result, a laminate in which a plurality of test semiconductor packages were attached to a stainless steel plate via a double-sided adhesive sheet was obtained.

Next, the obtained laminate was subjected to IR reflow once in a reflow oven (manufactured by Sagami Riko Co., Ltd., product name "WL-15-20DNX type") under the conditions of a maximum temperature of 240 ° C. and a heating time of 1 minute. I did it. Then, the laminate was taken out from the reflow oven, cooled to room temperature, and then the test semiconductor packages were individually picked up from the double-sided adhesive sheet using tweezers. After all the test semiconductor packages were picked up, the double-sided adhesive sheet was peeled off from the stainless steel plate.

(3) Evaluation In the process described in the above step (2), the following four evaluation items were confirmed and evaluated in three stages of "○", "×" and "△" based on the evaluation criteria described later. .. The results are shown in Table 2.

(Evaluation item)
Item 1: Presence or absence of peeling at the interface between the second adhesive layer and the second release sheet when the first release sheet is peeled from the double-sided adhesive sheet Item 2: Double-sided adhesive affixed on a stainless steel plate Presence or absence of peeling at the interface between the stainless steel plate and the double-sided adhesive sheet when peeling the second release sheet from the sheet Item 3: Double-sided adhesive to the stainless steel plate when picking up the test semiconductor package from the double-sided adhesive sheet Presence or absence of peeling at the interface with the sheet Item 4: Presence or absence of the adhesive residue constituting the first adhesive layer on the surface of the stainless steel plate after the double-sided adhesive sheet is peeled from the stainless steel plate.

(Evaluation criteria)
◯: It was possible to clearly judge "none" by visual inspection.
Δ: Although it could not be clearly judged visually, it could be judged as “none” when the loupe was used.
X: It was judged to be "yes" by visual inspection.

As can be seen from Table 2, the double-sided pressure-sensitive adhesive sheet obtained in the examples was used to peel off the second release sheet from the second pressure-sensitive adhesive layer when the first release sheet was peeled off, and to obtain the second release sheet. Neither the double-sided adhesive sheet peeled off from the support when peeling off, nor did the double-sided adhesive sheet peel off from the support when picking up the parts. Further, in the double-sided pressure-sensitive adhesive sheet obtained in the examples, when the used double-sided pressure-sensitive adhesive sheet was peeled off from the support, adhesive residue on the support was less likely to occur.

The double-sided pressure-sensitive adhesive sheet of the present invention can be suitably used in a method for manufacturing a semiconductor device including a component having a easily damaged member on the surface.

1 ... Double-sided adhesive sheet 11 ... Core material 12 ... First adhesive layer 13 ... Second adhesive layer 14 ... First release sheet 15 ... Second release sheet 2 ... Support 3 ... Hole 4 ... Parts 41 …protrude

Claims (11)

A core material, a first pressure-sensitive adhesive layer laminated on one surface side of the core material, a second pressure-sensitive adhesive layer laminated on the other surface side of the core material, and the first pressure-sensitive adhesive. A first release sheet laminated on the surface of the layer opposite to the core material and a second release sheet laminated on the surface of the second pressure-sensitive adhesive layer opposite to the core material. It is a double-sided adhesive sheet that is provided.
The first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer are each composed of a silicone-based pressure-sensitive adhesive containing an addition-type organopolysiloxane .
The peeling force P2 when peeling the second peeling sheet from the second pressure-sensitive adhesive layer is 30 mN / 50 mm or more and 1000 mN / 50 mm or less.
The double-sided adhesive sheet in which the adhesive surface of the first adhesive layer exposed by peeling the first release sheet from the double-sided adhesive sheet is attached to a stainless steel plate (SUS304) is in accordance with JIS Z0237: 2009. The ratio (A1 / P2) of the adhesive force A1 to the peeling force P2 is 10 or more and 5000 or less when the 180 ° peeling adhesive force to the stainless steel plate to be measured is the adhesive force A1.
The adhesive strength A1 is 500 mN / 25 mm or more and 15000 mN / 25 mm or less.
The double-sided adhesive sheet in which the adhesive surface of the second adhesive layer exposed by peeling the second release sheet from the double-sided adhesive sheet is attached to a stainless steel plate (SUS304) is in accordance with JIS Z0237: 2009. The 180 ° peeling adhesive force A2 with respect to the stainless steel plate measured by the above method is 500 mN / 25 mm or more and 15000 mN / 25 mm or less.
The adhesive surface of the first adhesive layer exposed by peeling the first release sheet from the double-sided adhesive sheet is attached to a stainless steel plate (SUS304), and the double-sided adhesive is heated at 260 ° C. for 1 minute. Regarding the sheet, the 180 ° peeling adhesive strength B1 to the stainless steel plate measured in accordance with JIS Z0237: 2009 is 500 mN / 25 mm or more and 15000 mN / 25 mm or less.
The adhesive surface of the second adhesive layer exposed by peeling the second release sheet from the double-sided adhesive sheet is attached to a stainless steel plate (SUS304), and the double-sided adhesive is heated at 260 ° C. for 1 minute. With respect to the sheet, when the 180 ° peeling adhesive force to the stainless steel plate measured in accordance with JIS Z0237: 2009 is set to the adhesive force B2, the adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 is obtained. The difference is 1000 mN / 25 mm or more and 20000 mN / 25 mm or less .
The double-sided adhesive sheet is for use in a method for manufacturing a semiconductor device including a step of performing a treatment involving heating.
Double-sided adhesive sheet featuring that. The first aspect of the present invention is characterized in that, when the peeling force P1 is used when the first peeling sheet is peeled from the first pressure-sensitive adhesive layer, the peeling force P1 is larger than the peeling force P2. The described double-sided adhesive sheet. The double-sided pressure-sensitive adhesive sheet according to claim 1 or 2, wherein the peeling force P1 is 50 mN / 50 mm or more and 2000 mN / 50 mm or less. The double-sided adhesive sheet according to any one of claims 1 to 3 , wherein the adhesive strength B2 is 100 mN / 25 mm or more and 15000 mN / 25 mm or less. By having a plurality of holes, it has a grid-like shape and has a grid-like shape.
The double-sided pressure-sensitive adhesive sheet according to any one of claims 1 to 4 , wherein the width between the two adjacent holes is 0.001 mm or more and 10 mm or less. The double-sided pressure-sensitive adhesive sheet according to any one of claims 1 to 4 , which has a tape-like shape having a width of 0.1 mm or more and 5 mm or less. The double-sided pressure-sensitive adhesive sheet according to any one of claims 1 to 6 , wherein the first release sheet is peeled before the second release sheet. The step of peeling the first release sheet from the double-sided adhesive sheet according to any one of claims 1 to 7 .
A step of attaching the adhesive surface of the first adhesive layer exposed by peeling the first release sheet onto a support.
A step of providing a region in which the double-sided adhesive sheet does not exist, which is surrounded by or sandwiched by the double-sided adhesive sheet at the same time as or after the application.
A step of peeling the second release sheet from the double-sided adhesive sheet attached on the support.
A step of laminating a plurality of parts on the second pressure-sensitive adhesive layer so as to cover or span the region.
A method for manufacturing a semiconductor device, which comprises a step of processing the component with heating and a step of peeling the component from the second pressure-sensitive adhesive layer. The method for manufacturing a semiconductor device according to claim 8 , further comprising a step of peeling the double-sided pressure-sensitive adhesive sheet from the support after the step of peeling the component from the second pressure-sensitive adhesive layer. The region penetrates the laminate with respect to the laminate obtained by removing the first release sheet from the double-sided adhesive sheet after the adhesive surface of the first adhesive layer is attached to the support. The method for manufacturing a semiconductor device according to claim 8 or 9 , wherein the holes are provided by forming a plurality of holes. The semiconductor device according to claim 8 or 9 , wherein the region is provided by attaching a plurality of tape-shaped double-sided adhesive sheets in parallel to the support at intervals of each other. Manufacturing method.

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