JP7085754B2 - Optical encoder - Google Patents

Description

The present invention relates to an optical encoder that uses light to change an electrical output signal.

Conventionally, an encoder has a slider (60) on an on / off pattern (35, 37) formed on a circuit board (30), for example, as in the rotary electronic component (1) shown in FIG. 2 of Patent Document 1. ) Is configured to be elastically contacted, and the rotating body (50) to which the slider (60) is attached is rotated to bring the sliding contact portion (61) of the slider (60) into contact with the sliding contact portion (61). It was configured to slide on the on / off pattern (35, 37), thereby extracting the on / off waveform signal from each terminal plate (46).

Japanese Unexamined Patent Publication No. 2013-1228848

However, in the encoder having the above configuration, the sliding contact portion (61), which is a movable contact, mechanically slides on the circuit board (30), so that the sliding contact portion (61) wears over time. Alternatively, wear debris may accumulate on the circuit board (30) and disturb the on / off waveform signal, resulting in poor contact or short circuit, which makes it impossible to further improve the durability of the encoder. There was a problem.

The present invention has been made in view of the above points, and an object thereof is to eliminate the mechanical sliding contact portion, thereby preventing wear and abrasion powder generated in the sliding contact portion, and the durability is obtained from these points. It is an object of the present invention to provide an optical encoder which can greatly improve the property.

The present invention has a circuit board to which a light emitting element and a light receiving element are attached, a rotating body installed facing the circuit board, and a storage unit for accommodating the rotating body, and the circuit board is housed in the storage unit. An optical encoder comprising a case to be insert-molded on the bottom surface of the The rotating body is provided with a reflecting portion or a transmitting portion that reflects or transmits the light emitted from the light emitting element, while the circuit board has the light emitting element and the light emitted from the light emitting element on the same substrate. The light receiving element that receives light after being reflected or transmitted by the reflecting portion or the transmitting portion of the rotating body and converts it into an electric signal, and the signal that converts the electric signal output from the light receiving element into a desired electric signal and outputs the signal. A processing circuit and a processing circuit are mounted , a positioning hole to be penetrated is formed in the center of the circuit board, and a plurality of through holes are provided at positions surrounding the periphery of the positioning hole. Further, in the case, the storage portion is provided. It is characterized in that a shaft portion that is erected in the storage portion from the bottom surface of the circuit board through a plurality of through holes provided in the circuit board and rotatably supports the rotating body is integrally formed with the case .
The signal processing circuit corresponds to, for example, a waveform shaping circuit using an IC circuit. In the waveform shaping circuit, for example, it is preferable to install a switching circuit in which the switch is turned on when the voltage of the input waveform exceeds a predetermined value and the switch is turned off when the voltage falls below the predetermined value. In the switching circuit, it is preferable to amplify the current of the output signal in order to obtain a more accurate output signal.
According to the present invention, since there is no mechanical contact portion between the light emitting element and the light receiving element mounted on the circuit board and the reflecting portion or the transmitting portion provided on the rotating body, wear does not occur, so that the durability of the encoder is high. Can be greatly improved.
Further, since the electric signal output from the light receiving element is converted into a desired electric signal by the signal processing circuit provided on the circuit board and output, the output is accurately shaped and cannot be obtained only by the light emitting element and the light receiving element. It becomes possible to obtain a waveform signal.
Further, since the light emitting element, the light receiving element, and the signal processing circuit are mounted on the same substrate, the device can be made compact.

Further, in addition to the above features, the present invention is characterized in that the signal processing circuit is a circuit that converts a waveform of an electric signal output from the light receiving element into a square wave.
According to the present invention, the waveform of the electric signal output from the light receiving element can be converted into an accurately shaped rectangular wave output waveform signal by the signal processing circuit provided on the circuit board.

Further, in addition to the above features, the present invention is characterized in that all the components constituting the light emitting element, the light receiving element, and the signal processing circuit are mounted on only one side of the circuit board.
According to the present invention, since all the components are mounted on only one side of the circuit board, the mounting process is simplified and the manufacturing cost is reduced as compared with the case of mounting on both sides. It is also possible to reduce the thickness of the device.

Further, in addition to the above-mentioned features, the present invention is characterized in that the light emitted from the light emitting element is reflected by the reflecting portion provided on the rotating body and then received by the light receiving element.
The reflecting unit is provided with, for example, a portion that easily reflects light and a portion that does not easily reflect light on the reflection locus surface (reflection track surface) of the rotating body that reflects the light emitted from the light emitting element, or reflects light. It is configured by changing the amount of reflected light incident on the light receiving element by providing a portion having a different direction.

Further, in addition to the above features, the present invention is characterized in that the signal processing circuit has a component having a switching function for shaping the waveform of an electric signal output from the light receiving element.
According to the present invention, the waveform of the electric signal output from the light receiving element can be accurately shaped into a square wave (on-off waveform signal).

According to the present invention, it is possible to eliminate the mechanical sliding contact portion, thereby preventing wear and abrasion powder generated in the sliding contact portion, and it is possible to greatly improve the durability of the encoder.

It is a perspective view of the encoder 1. It is an exploded perspective view of the encoder 1. FIG. 1 is a schematic cross-sectional view taken along the line AA of FIG. It is a perspective view which shows the circuit board 30. It is a perspective view which looked at the rotating body 60 from the lower side. It is a figure which shows the positional relationship between the black-and-white surface 615a, 615b of the reflection part 615 of the lower surface of a rotating body 60, and two photosensors 33, 35. It is an output waveform diagram of both photosensors 33, 35 when the rotating body 60 is rotated. It is a shaped output waveform diagram of both photosensors 33, 35 when the rotating body 60 is rotated. It is a perspective view of the main part of encoder 1-2.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 is a perspective view of an encoder 1 according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of the encoder 1, and FIG. 3 is a schematic cross-sectional view taken along the line AA of FIG. As shown in these figures, the encoder 1 includes a case 10 containing a circuit board 30, a rotating body 60, and a cover 80. In the following description, "upper" means the direction in which the rotating body 60 is viewed from the circuit board 30, and "lower" means the opposite direction.

FIG. 4 is a perspective view showing the circuit board 30. As shown in the figure, the circuit board 30 has a rigid and substantially rectangular insulating substrate 31, a positioning hole 313 penetrating is formed in the center of the insulating substrate 31, and a plurality of positions surrounding the insulating substrate 30 (this). In the example, four through holes 315) are provided. Further, two photosensors (light receiving and emitting elements) 33 and 35 and a signal processing circuit 37 are installed at predetermined positions on the upper surface (hereinafter referred to as “upper surface”) 311 of the insulating substrate 31, and the insulating substrate 31 is provided with two photosensors (light receiving and emitting elements) 33 and 35. One ends of a plurality of (six in this example) terminal plates 39 are abutted in parallel on the upper surface near one side.

The two photosensors 33 and 35 are reflective photosensors (photoreflectors) of the same type and each include a light emitting element and a light receiving element, and therefore, the light emitting portions 331 and 351 and the light receiving units 333 and 353, respectively. On its upper surface. The light receiving unit 333 receives the light emitted from the light emitting unit 331 to generate an output voltage. Similarly, the light receiving unit 353 receives the light emitted from the light emitting unit 351 to generate an output voltage.

The signal processing circuit 37 inputs the output signals from both the photosensors 33 and 35, converts these input signals (electrical signals) into rectangular electric signals (on / off signals), and amplifies the current value thereof. It is a circuit to output (waveform shaping circuit). This signal processing circuit can be configured by an IC circuit, various other semiconductor circuits, or the like. In the case of this example, a switching circuit is installed in which the switch is turned on when the voltage value of the input waveform of the signals from the photo sensors 33 and 35 exceeds the predetermined value, and the switch is turned off when the voltage value is lower than the predetermined value and the current value is amplified. is doing. Since this switching circuit amplifies the current of the output signal, a more accurate output signal can be obtained. Then, the output signal of the signal processing circuit 37 is drawn out to a connection pattern (not shown) provided in parallel on one side of the circuit board 30, and is electrically connected to each terminal board 39 abutting on the connection pattern (not shown).

As shown in FIGS. 2 and 3, the case 10 is formed by molding a synthetic resin into a box shape having an open upper surface. A rectangular concave storage portion 11 is formed on the upper surface side of the case 10. The upper surface of the circuit board 30 insert-molded in the case 10 is exposed on the bottom surface of the storage portion 11, and a circular columnar shaft portion forming a part of the case 10 is further centered on the upper surface of the circuit board 30. 13 is erected. A circular hole 14 is formed in the center of the shaft portion 13. In other words, the case 10 has a substantially rectangular bottom portion 15, a side wall portion 17 erected so as to surround the bottom portion 15, and a shaft that penetrates the circuit board 30 from the center of the bottom portion 15 and projects toward the upper surface side thereof. It is configured to include a portion 13, and the tip end side portions of the six terminal plates 39 project outward from one side wall portion 17 of the case 10. The portion of each terminal board 39 in contact with the circuit board 30 is fixed by the resin constituting the case 10, and the connection state of the circuit board 30 with each connection pattern is well maintained. Further, a small protrusion-shaped positioning portion 19 projects from the upper surface of the two corner portions of the side wall portion 17.

In order to manufacture the case 10, the circuit board 30 and the terminal board 39 are housed in a mold having a cavity in the shape of the case 10, and at that time, a portion on one end side of each terminal board 39 is stored in the circuit board 30. It is in contact with each connection pattern (not shown). Then, if the molten synthetic resin is injected into the cavity in this state and the mold is removed after the synthetic resin is solidified, the case 10 in which the circuit board 30 and the terminal plate 39 are insert-molded is completed. At this time, the shaft portion 13 and the bottom portion 15 of the case 10 are connected through four through holes 315 provided in the circuit board 30.

FIG. 5 is a perspective view of the rotating body 60 as viewed from below. As shown in the figure and FIGS. 1 to 3, the rotating body 60 is made of synthetic resin, and has a disk-shaped main body portion 61 and a circular columnar knob portion (shaft) 63 protruding from the center of the upper surface of the main body portion 61. And are integrally molded. The lower surface of the main body 61 is a reflective portion forming surface 62. The outer diameter of the main body 61 is formed so as to be stored in the storage portion 11 of the case 10. A shaft support portion 611 formed of a circular recess is formed in the center of the reflection portion forming surface 62 on the lower surface of the main body portion 61. A circumferential reflective portion 615 is formed at a position surrounding the shaft support portion 611 of the reflective portion forming surface 62. The reflection portion 615 is formed by a plurality of sets of black and white surfaces 615a and 615b, which are circumferential reflection locus surfaces (reflection track surfaces). In the case of the reflecting portion 615 of this example, the color of the synthetic resin constituting the rotating body 60 is black, and the black and white surfaces 615a and 615b (reflecting surfaces) are colored in white at equal intervals on the circumference. And the non-reflective surface) are continuously and endlessly alternately appearing. The black and white surfaces 615a and 615b constituting the reflective portion 615 are all fan-shaped, and the left and right sides of each surface 615a and 615b are on a line extending radially from the rotation center axis L1 (see FIG. 6) of the rotating body 60. It is formed to be located.

The cover 80 is made of a metal plate and has a substantially rectangular shape and is connected to a pair of opposite side surfaces of the cover main body 81 having a dimensional shape covering the storage portion 11 of the case 10 and at a substantially right angle. It is configured to have side surface portions 83, 83 that can be bent downward. A cylindrical bearing portion 811 is formed in the center of the cover main body portion 81, and the center thereof is a through hole. Further, in the vicinity of the two corners of the cover main body 81, a positioning portion 813 formed of a small hole into which the positioning portion 19 of the case 10 is inserted is formed. A case mounting portion 831 projecting downward is formed in the central portion of the lower side of each side surface portion 83, and a case mounting portion 833 projecting downward is formed on both sides of the other member mounting portion 831. Is formed.

Next, in order to assemble the encoder 1, the main body 61 of the rotating body 60 is housed in the storage portion 11 of the case 10. At this time, the shaft portion 13 of the case 10 is inserted into the shaft support portion 611 of the rotating body 60 to rotatably support the rotating body 60, and at the same time, the lower surface of the main body portion 61 and the two photosensors 33 and 35. The separation distance between the light emitting unit 331, 351 and the light receiving unit 333, 353 is set as a predetermined separation distance. That is, the rotation operation of the rotating body 60 and the accurate setting of the separation distance between the light emitting parts 331 and 351 and the light receiving parts 333 and 353 and the reflecting part 615 by the shaft portion 13 of the case 10 and the shaft support portion 611 of the rotating body 60. Are done at the same time.

Next, the cover main body 81 of the cover 80 is put on the upper surface of the case 10 in which the main body 61 of the rotating body 60 is housed to close the storage portion 11 of the case 10. At this time, at the same time, the knob portion 63 of the rotating body 60 is inserted into the bearing portion 811 of the cover 80, and the rotating body 60 is rotatably supported. Then, when each case mounting portion 833 of the cover 80 is bent toward the lower surface side of the case 10, the cover 80 is fixed to the case 10, and the encoder 1 shown in FIG. 1 is completed. The above assembly procedure is an example thereof, and it goes without saying that the assembly may be performed using various other different assembly procedures.

In the encoder 1 configured as described above, first, a voltage is applied to one of the terminal plates 39 to activate the electric circuit on the circuit board 30. As a result, light is irradiated from the light emitting portions 331 and 351 of both photo sensors 33 and 35 to the reflecting portion 615 on the lower surface of the rotating body 60, and when the irradiated portion is the white surface 615a, most of the light is reflected. When the light is received by the light receiving portions 333 and 353 of the photo sensors 33 and 35 and the irradiated portion is the black surface 615b, most of the light is not reflected and is not received by the light receiving portions 333 and 353 of the photo sensors 33 and 35. Therefore, when the rotating body 60 is rotated, the output signals from both the photo sensors 33 and 35 change according to the light receiving state of the light receiving units 333 and 353.

FIG. 6 is a diagram showing the positional relationship between the black-and-white surfaces 615a and 615b of the reflecting portion 615 on the lower surface of the rotating body 60 and the two photosensors 33 and 35. As shown in the figure, the two photosensors 33 and 35 are located on the same circumference around the rotation center axis L1 of the rotating body 60 and at positions facing the two photosensors 33 and 35, respectively. They are arranged so that they are slightly offset from each other in the circumferential direction with respect to a certain white surface 615a (or black surface 615b).

Then, when the knob portion 63 of the rotating body 60 is rotated, the reflecting portion 615 of the rotating body 60 moves above the pair of photosensors 33 and 35, and the black and white surfaces 615a and 615b are on the photosensors 33 and 35. The amount of light incident on the light receiving units 333 and 353 changes. When the rotating body 60 rotates, the timing at which one photosensor 33 passes through the white surface 615a (or the black surface 615b) at the opposite position and the white surface at the other photosensor 35 opposite position. The timing of passing through the 615a (or the black surface 615b) is slightly different. FIG. 7 is a diagram showing output waveforms of both photosensors 33 and 35 when the rotating body 60 is rotated. As shown in the figure, both waveforms have a phase shift in the rotation direction of the rotating body 60. Further, as shown in the figure, the output waveforms of the photosensors 33 and 35 have a shape close to a sine wave.

Next, the output signals from both the photo sensors 33 and 35 are input to the signal processing circuit 37 and shaped into the waveform shown in FIG. That is, in the case of this example, in the waveform shown in FIG. 7, the switch is turned on when the predetermined voltage value (amplitude) is reached, and the switch is turned off when the voltage value (amplitude) is lower than the predetermined voltage value (amplitude). As a result, the waveform shown in FIG. 7 is converted into a rectangular output signal (on / off signal) and output. As described above, since this output signal is current amplified (impedance conversion), a more accurate output signal can be obtained. Then, the output signal shown in FIG. 8 is output to the terminal board 39.

By using the output signal thus obtained, it is possible to measure the rotation direction, rotation speed, and the like of the rotating body 60 by analyzing a pair of on-off waveforms that are out of phase.

In the encoder 1 according to the above embodiment, an example in which reflection type photosensors (reflection type light emitting element and light receiving element) 33 and 35 are installed on the circuit board 30 is shown, but a transmission type photosensor is used as the photosensor. You may use it. FIG. 9 is a perspective view of a main part of an encoder 1-2 according to another embodiment of the present invention using a transmission type photo sensor (transmission type light emitting element and light receiving element). In the encoder 1-2 shown in the figure, the same reference numerals are given to the same or corresponding parts as those of the encoder 1 according to the embodiments shown in FIGS. 1 to 8 (provided that each reference numeral has a subscript "-2". ). Items other than the items described below are the same as those shown in FIGS. 1 to 8.

The rotating body 60-2 used for the encoder 1-2 has a lower outer circumference formed in a cylindrical shape, and a transmission portion 65-2 penetrating the cylindrical portion in a rectangular shape at equal intervals is formed in the rotating body 60. It is provided in place of the provided reflecting portion 615. On the other hand, the photosensors 33-2 and 35-2 installed on the upper surface of the circuit board 30-2 are transmissive photosensors (photointerruptors), and face each other via the central recess 335-2,355-2. A light emitting unit 331-2,351-2 and a light receiving unit 333-2,353-2 are provided on both inner side surfaces thereof. Therefore, the light emitted from the light emitting unit 331-2,351-2 passes through the transmission unit 65-2 of the rotating body 60-2 and is received by the light receiving unit 333-2,353-2, so that the output voltage is reached. Occurs. Similarly, if the light emitted from the light emitting unit 331-2,351-2 hits a portion other than the transmitting portion 65-2 of the rotating body 60-2, this light is received by the light receiving unit 333-2,353-2. No output voltage is generated. The positions of the two photosensors 33-2 and 35-2 facing the transmission portion 65-2 of the rotating body 60-2 are slightly displaced, whereby the output waveform as shown in FIG. 7 can be obtained. Other operations are the same as the operation of the encoder 1. The transmission portion 65-2 may be formed not as a through hole but as a recess having a shape in which the lower side of the cylinder of the rotating body 60-2 is cut out in a concave shape.

By the way, when the transmissive photosensors 33-2 and 35-2 are used, the structure of the rotating body 60-2 becomes more complicated than that of the rotating body 60 using the reflective photosensors 33 and 35. In addition, the height dimension tends to be large. Therefore, the encoder 1 using the reflective photosensors 33 and 35 is more suitable. On the other hand, when the transmissive photosensors 33-2 and 35-2 are used, the light can be transmitted and blocked reliably, so that the on / off output signal from the light receiving unit 333-2,353-2 becomes a more accurate signal. Become. On the other hand, since the reflection type photo sensors 33 and 35 compensate for the defect (inaccuracy) of the on / off output signal, it becomes more necessary to use the signal processing circuit 37.

In each of the above embodiments, an example using a photosensor in which a light emitting element and a light receiving element are integrated has been described, but the light emitting element and the light receiving element may be configured as separate elements, and these may be installed respectively. good.

As described above, the encoders 1, 1-2 include circuit boards 30, 30-2 to which photosensors (light emitting elements and light receiving elements) 33, 35, 33-2, 35-2 are attached, and circuit boards 30. The rotating body 60 is provided with the rotating body 60, 60-2 installed facing the 30-2, and the light emitted from the light emitting element of the photosensors 33, 35, 33-2, 35-2 is used. , 60-2 is an optical encoder that outputs an electrical signal with a waveform corresponding to the rotation position of 60-2. The photosensors 33, 35, which have a light emitting element and a light receiving element on the same substrate, are provided with a reflecting unit 615 or a transmitting unit 65-2 that reflects or transmits the light emitted from the circuit boards 30 and 30-2. 33-2, 35-2 and a signal processing circuit 37 that converts an electric signal output from the photosensor (light receiving element) 33, 35, 33-2, 35-2 into a desired electric signal and outputs the signal. It is implemented and configured.

As a result, the photosensors (light emitting element and light receiving element) 33, 35, 33-2, 35-2 attached to the circuit boards 30, 30-2 and the reflecting portion 615 or the transmitting portion provided on the rotating bodies 60, 60-2 are transmitted. Since there is no mechanical contact portion with the portion 65-2 and no wear occurs, the durability of the encoders 1 and 1-2 can be significantly improved.

In particular, in this encoder 1, the shaft portion 13 of the case 10 protruding from the center of the upper surface of the circuit board 30 is rotatably supported by the concave shaft support portion 611 provided in the center of the lower surface of the rotating body 60. Since the contact area is small, the structure has less wear. At the same time, the upper surface of the shaft portion 13 abuts on the bottom surface of the shaft support portion 611 to support the rotating body 60 in the vertical direction. Can be. As a result, the light emitted from the light emitting units 331 and 351 of the photo sensors (light emitting elements) 33 and 35 is reflected by the reflecting unit 615 and received by the light receiving units 333 and 353 of the photo sensors (light receiving elements) 33 and 35. Can be configured with high accuracy, and an output signal with high accuracy can be obtained.

Further, according to the above encoder 1, the signal processing circuit 17 provided on the circuit board 30 converts the electric signal output from the photosensors (light receiving elements) 33 and 35 into a desired electric signal and outputs the photo. It is possible to obtain an accurately shaped output waveform signal that cannot be obtained only by the sensors (light emitting element and light receiving element) 33 and 35.

Further, since the photosensors (light emitting element and light receiving element) 33 and 35 and the signal processing circuit 37 are mounted on the same substrate, the device can be made more compact than the case where each of the above components is mounted on a plurality of boards. Can be planned.

Further, the signal processing circuit 37 is a circuit that converts the waveform of the electric signal output from the photosensors (light receiving elements) 33 and 35 into a square wave, and is further output from the photosensors (light receiving elements) 33 and 35. It has a component having a switching function for shaping the waveform of an electric signal. That is, the signal processing circuit 37 provided on the circuit board 30 can convert the waveform of the electric signal output from the photosensors (light receiving elements) 33 and 35 into an accurately shaped rectangular wave output waveform signal. can.

Further, in the above encoder 1, all the components constituting the photosensors (light emitting element and light receiving element) 33 and 35 and the signal processing circuit 37 are mounted on only one side of the circuit board, so that they are mounted on both sides of the circuit board. The mounting process is simplified and the manufacturing cost is reduced. Further, for example, when the photosensors 33 and 35 are mounted on the upper surface side of the circuit board 30 and the signal processing circuit 37 is mounted on the lower surface side of the circuit board 30, the thickness of the circuit board 30 becomes thicker, but the signal processing circuit 37 is mounted. Since it is installed on the same surface side as the photosensors 33 and 35, the signal processing circuit 37 is installed by utilizing the gap between the photosensors 33 and 35 and the rotating body 60 which must be originally provided between the photosensors 33 and 35. can. Therefore, the thickness of the encoder 1 can be reduced.

By the way, in the above encoder 1, the color (including light and shade) of the reflective part 615 is changed by coloring the reflective part 615, but instead of changing the color (including light and shade) (or together with it), the reflective part is changed. By providing an uneven surface or an inclined surface on the surface, the light reflection direction and the reflection position may be changed, whereby the amount of reflected light incident on the light receiving element may be changed. In other words, the reflecting unit provides, for example, a portion that easily reflects light and a portion that does not easily reflect light on the reflection locus surface (reflection track surface) of the rotating body that reflects light from the light emitting element, or reflects light. It is configured by changing the amount of reflected light incident on the light receiving element by providing a portion having different directions and reflection positions. In short, any configuration may be used as long as the amount of light emitted from the light emitting portion of the light emitting element changes the amount of light incident on the light receiving portion of the light receiving element according to the rotation position of the rotating body.

Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications may occur within the scope of claims and the technical idea described in the specification and drawings. It is possible. It should be noted that any shape, structure or material not directly described in the specification or drawings is within the scope of the technical idea of the present invention as long as the action and effect of the present invention are exhibited. For example, only one set of the light emitting element and the light receiving element may be installed, or three or more sets may be installed. Further, in the above embodiment, a rigid circuit board is used as the circuit board, but a flexible circuit board having flexibility may be used. Further, various electronic components other than the light emitting element, the light receiving element, and the signal processing circuit may be mounted on the circuit board. It is preferable that these mounting components are also mounted on the surface side on which the light emitting element or the like is placed (the surface side facing the reflecting portion of the rotating body). Further, the light emitted from the light emitting element may be configured not only to be reflected by the reflecting portion at one place but also to be reflected by the light receiving element after being reflected at a plurality of places.

In addition, the above description and the embodiments shown in each figure can be combined with each other as long as there is no contradiction in the purpose, configuration, and the like. Further, the above description and the description contents of each figure can be independent embodiments even if they are a part thereof, and the embodiment of the present invention is one embodiment in which the above description and each figure are combined. Not limited to.

1 Encoder (optical encoder)
10 Case 30 Circuit board 31 Insulation board 33 Photo sensor (light emitting element, light receiving element)
331 Light emitting part 333 Light receiving part 35 Photo sensor (light emitting element, light receiving element)
351 Light emitting part 353 Light receiving part 37 Signal processing circuit 60 Rotating body 615 Reflecting part 80 Cover 65-2 Transmissing part

Claims (5)

It has a circuit board to which a light emitting element and a light receiving element are attached, a rotating body installed facing the circuit board, and a storage portion for accommodating the rotating body, and the circuit board is placed on the bottom surface of the storage portion. An optical encoder comprising a case for insert molding and outputting an electric signal having a waveform corresponding to the rotation position of the rotating body by using the light emitted from the light emitting element.
The rotating body is provided with a reflecting portion or a transmitting portion that reflects or transmits the light emitted from the light emitting element.
On the other hand, in the circuit board, the light receiving element and the light emitted from the light emitting element are reflected or transmitted by the reflecting portion or the transmitting portion of the rotating body on the same substrate, and then received and converted into an electric signal. An element and a signal processing circuit that converts an electric signal output from the light receiving element into a desired electric signal and outputs the element are mounted , and a positioning hole penetrating is formed in the center of the circuit board. Multiple through holes are provided at positions surrounding the positioning holes,
Further, in the case, a shaft portion that stands upright in the storage portion from the bottom surface of the storage portion through a plurality of through holes provided in the circuit board and rotatably supports the rotating body is integrally formed with the case. An optical encoder characterized by the fact that it has been used. The optical encoder according to claim 1.
The signal processing circuit is an optical encoder characterized by being a circuit that converts a waveform of an electric signal output from the light receiving element into a square wave. The optical encoder according to claim 1 or 2.
An optical encoder characterized in that all the components constituting the light emitting element, the light receiving element, and the signal processing circuit are mounted on only one side of the circuit board. The optical encoder according to claim 1, 2 or 3.
An optical encoder characterized in that the light emitted from the light emitting element is reflected by a reflecting portion provided on the rotating body and then received by a light receiving element. The optical encoder according to claim 2.
The signal processing circuit is an optical encoder having a component having a switching function for shaping a waveform of an electric signal output from the light receiving element.

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