JP7087328B2 - Electronic devices and manufacturing methods for electronic devices - Google Patents

Description

The present application relates to an electronic device and a method for manufacturing the electronic device.

Electronic devices are becoming smaller and smaller. In recent years, in order to cope with the miniaturization of electronic devices, various forms have been proposed for mounting structures of semiconductor chips, for example (see, for example, Patent Document 1-5).

Japanese Unexamined Patent Publication No. 2005-340738 Japanese Unexamined Patent Publication No. 2008-147317 Japanese Unexamined Patent Publication No. 2015-149314 Japanese Patent No. 4022139 Japanese Patent No. 5443489

As the amount of information processed by electronic devices increases, the number of solder balls used for mounting electronic components such as semiconductor chips is steadily increasing. In addition, as the amount of information processed by electronic devices increases, the power consumption of electronic components also increases, and the solder balls used for mounting electronic components such as semiconductor chips do not exceed the allowable current density. Size is required. Therefore, the pitch between the solder balls used for mounting electronic components is inevitably narrowed.

When the pitch between the solder balls is narrowed, the possibility of short-circuiting the electric circuit increases. Therefore, the solder balls provided on the BGA package substrate are required to be fused to the BGA package substrate in a state of being separated from each other. However, with the progress of miniaturization of the electrode pitch, it is becoming difficult to avoid contact between the solder balls.

Therefore, it is an object of the present invention to provide a technique for suppressing a short circuit between electrodes.

In one embodiment, the electronic device comprises a wiring board in which a plurality of electrodes are arranged on the surface, an electronic component bonded to the wiring board via a solder covering a portion in which the plurality of electrodes are arranged, and solder. It is provided with an insulating wall partitioning between a plurality of electrodes.

As one aspect, it is possible to suppress a short circuit in the connection portion between the electrodes.

FIG. 1 is a diagram showing an internal structure of an electronic device according to an embodiment. FIG. 2 is a first diagram showing an example of a method for manufacturing an electronic component. FIG. 3 is a perspective view showing an example of an electronic component. FIG. 4 is a first diagram showing an example of a mounting method of electronic components. FIG. 5 is a second diagram showing an example of a mounting method of electronic components. FIG. 6 is a third diagram showing an example of a mounting method of electronic components. FIG. 7 is a first diagram showing an example of a method for manufacturing a wiring board. FIG. 8 is a diagram showing a modified example and a comparative example of the electronic device. FIG. 9 is a second diagram showing an example of a method for manufacturing a wiring board. FIG. 10 is a third diagram showing an example of a method for manufacturing a wiring board. FIG. 11 is a second diagram showing an example of a method for manufacturing an electronic component. FIG. 12 is a first diagram showing a comparative example. FIG. 13 is a second diagram showing a comparative example.

Hereinafter, embodiments will be described. The embodiments shown below are merely examples, and the technical scope of the present disclosure is not limited to the following aspects.

FIG. 1 is a diagram showing an internal structure of an electronic device according to an embodiment. The electronic device 1 is an electronic device including an electronic component 2 and a wiring board 3. Specific examples of the electronic device 1 include computers, communication devices, mobile terminals, medical devices, industrial devices, and various other electronic devices.

The electronic component 2 is joined to the wiring board 3 by the solder 4. Examples of the solder 4 include SnAg solder containing Sn as a main component, SnAgCu solder, and InSn solder. The electronic component 2 has an electronic component body 2A having a plate-like shape, electrodes 2B arranged vertically and horizontally on the surface of the electronic component body 2A, and an insulating wall 2C formed on the surface of the electronic component body 2A. The electronic component main body 2A is an electronic component having a fine wiring structure. Specific examples of the electronic component main body 2A include a semiconductor device in which fine circuits are integrated. Since the electrode 2B is formed on the surface of the electronic component main body 2A having a fine wiring structure, it is a fine electrode similar to the wiring structure of the electronic component main body 2A.

The insulating wall 2C is a structure of an insulating material formed on the surface of the electronic component main body 2A. The insulating wall 2C is a wall-shaped structure formed so as to stand upright from the surface of the electronic component main body 2A. Since the insulating wall 2C is a structure that forms a wall-like structure between the electrodes 2B arranged vertically and horizontally, when the entire insulating wall 2C is viewed from a bird's-eye view, it exhibits a grid-like shape as described later. ..

The wiring board 3 has a base material 3A having a plate-like shape and electrodes 3B arranged vertically and horizontally on the surface of the base material 3A. The base material 3A is a base material for forming the electrode 3B on the surface, and for example, a plate-shaped component obtained by solidifying a resin or a fibrous material can be applied. The electrode 3B is formed on the surface of the base material 3A at a portion where the electronic component 2 is mounted. The electrodes 3B are arranged at positions corresponding to the respective electrodes 2B of the electronic component 2. That is, the electrodes 3B are arranged vertically and horizontally on the surface of the base material 3A, like the electrodes 2B.

By the way, the solder 4 is arranged in a sheet shape so as to cover the entire portion of the surface of the base material 3A where the plurality of electrodes 3B are arranged. However, the solder 4 is partitioned between the electrodes 3B by the insulating wall 2C. Further, when the tip of the insulating wall 2C on the wiring board 3 side is buried in the base material 3A, the tip of the insulating wall 2C on the wiring board 3 side and the two side surfaces sandwiching the tip are in contact with the base material 3A. There is. As shown in FIG. 1, the insulating wall 2C that partitions the solder 4 between the electrodes 3B has the tip on the wiring board 3 side embedded in the base material 3A at the portion between the electrodes 3B (pierced). It can also be regarded as). That is, although the solder 4 is arranged so as to cover the entire portion where the plurality of electrodes 3B are arranged, the insulating wall 2C partitioning the electrodes 3B provides electrical electrical between the electrodes 3B through the solder 4. The continuity is cut off. Therefore, the electrodes 3B are insulated from each other by the insulating wall 2C for the electrical path through the portion of the solder 4. Like the electrode 3B, the electrodes 2B are also insulated from each other by the insulating wall 2C with respect to the electrical path through the portion of the solder 4.

FIG. 2 is a first diagram showing an example of a method for manufacturing the electronic component 2. The electronic component 2 can be manufactured, for example, by the following method. That is, in the present manufacturing method, first, a film 10 having holes 10A for forming the insulating wall 2C is prepared (see FIG. 2A). The hole 10A can be formed, for example, by laser machining. In the case of laser processing, it is possible to form a tapered hole on the bottom side. Next, the insulating material is filled in the hole 10A, and the insulating wall 2C is formed in the hole 10A (see FIG. 2B). The insulating wall 2C can be formed, for example, by filling the hole 10A with a thermosetting resin and heating to cure it. Next, the film 10 is mounted on the electronic component body 2A so that the insulating wall 2C formed in the hole 10A is located between each 2B, and the insulating wall 2C is joined to the electronic component body 2A (FIG. 2 (C). ). Next, the film 10 is removed from the surface of the electronic component body 2A (see FIG. 2D). By removing the film 10 from the surface of the electronic component body 2A, the electronic component 2 in which the insulating wall 2C is formed on the surface of the electronic component body 2A is completed.

FIG. 3 is a perspective view showing an example of the electronic component 2. In the above-mentioned manufacturing method of the electronic component 2, for example, when the film 10 in which the holes 10A for forming the insulating wall 2C are formed in a grid pattern is used, as shown in FIG. 3, on the surface of the electronic component main body 2A. The electronic component 2 in which the insulating wall 2C is formed in a grid pattern is completed.

The electronic component 2 manufactured by the above method is mounted on the wiring board 3 as follows, for example. FIG. 4 is a first diagram showing an example of a mounting method of the electronic component 2. As shown in FIG. 4, for example, the electronic component 2 is mounted on a wiring board 3 in which electrodes 3B are arranged vertically and horizontally on the surface of the base material 3A. When the electronic component 2 is mounted on such a wiring board 3, for example, the electronic component 2 is mounted by the following method.

FIG. 5 is a second diagram showing an example of a mounting method of the electronic component 2. When mounting the electronic component 2 on the wiring board 3, for example, the sheet-shaped solder 4 is arranged so as to cover the portion of the surface of the base material 3A where the electrodes 3B are arranged. Then, the electronic component 2 is placed on the solder 4 with the insulating wall 2C facing toward the wiring board 3.

FIG. 6 is a third diagram showing an example of a mounting method of the electronic component 2. After the electronic component 2 is placed on the solder 4 with the insulating wall 2C facing toward the wiring board 3, the electronic component 2 is pushed toward the wiring board 3 while the solder 4 is heated (FIG. 6 (FIG. 6). See A)). When the solder 4 is melted by heating, the insulating wall 2C of the electronic component 2 descends while scraping the solder 4, and eventually the tip of the insulating wall 2C comes into contact with the wiring board 3 (see FIG. 6B). Then, when the solder 4 is cured by stopping the heating and the volume of the solder 4 is thermally shrunk due to the temperature drop, the electronic component 2 is attracted to the wiring board 3 side. When the electronic component 2 is attracted to the wiring board 3 side, the tip of the insulating wall 2C bites into the base material 3A between the electrodes 3B (see FIG. 6C). When the solder 4 is thermally shrunk, the electronic component 2 is attracted to the wiring board 3 side, so that the possibility of voids occurring in the solder 4 is low. Although Bi may be contained in the solder 4, it is desirable that the volume ratio of Bi is 40% or less in view of the heat shrinkage characteristics of the solder 4. If the volume ratio of Bi is 40% or less, the solder 4 causes sufficient heat shrinkage at the time of solidification, so that the tip of the insulating wall 2C sufficiently bites into the base material 3A between the electrodes 3B.

When the tip of the insulating wall 2C bites into the base material 3A, the electrodes 3B are in a state of being insulated from each other by the insulating wall 2C with respect to the electrical path through the portion of the solder 4. Further, like the electrode 3B, each electrode 2B is also in a state of being insulated from each other by the insulating wall 2C with respect to the electrical path through the portion of the solder 4. The electronic device 1 is completed by mounting the electronic component 2 on the wiring board 3 by the above method.

In order for the tip of the insulating wall 2C to bite into the base material 3A, it is preferable that the base material 3A is made of a material more flexible than the insulating wall 2C. The flexible material used for the base material 3A is a material having an elastic modulus lower than the elastic modulus of the insulating wall 2C. The modulus of elasticity of the material can be derived from the value of the indentation depth corresponding to the load obtained by the nanoindentation method. If the base material 3A is made of a material that is more flexible than the insulating wall 2C, the tip of the insulating wall 2C easily bites into the base material 3A between the electrodes 3B. In order for the tip of the insulating wall 2C to easily bite into the base material 3A between the electrodes 3B, not only the entire base material 3A is formed of a material more flexible than the insulating wall 2C, but also, for example, it is manufactured by the following method. It may be in the form.

FIG. 7 is a first diagram showing an example of a method for manufacturing the wiring board 3. In the present manufacturing method, the resin material 11 which is more flexible than the base material 3A1 is mounted on the surface of the base material 3A1 which is an insulating plate material obtained by solidifying a resin or a fibrous material (see FIG. 7A). ). Next, the resin material 11 is patterned to form the electrode 3B (see FIG. 7B). The patterned resin material 11 forms the soft portion 3A2. Next, the conductive material is embedded in the patterned portion of the resin material 11 to form the electrode 3B (see FIG. 7C). As described above, the wiring board 3 having the soft portion 3A2 between the electrodes 3B is completed.

After the wiring board 3 having the soft portion 3A2 between the electrodes 3B is completed, the same method as described with reference to FIG. 6 is performed. That is, the sheet-shaped solder 4 is arranged so as to cover the portion of the surface of the base material 3A1 where the electrodes 3B are arranged (see FIG. 7D). Then, the electronic component 2 is placed on the solder 4 with the insulating wall 2C facing toward the wiring board 3. Then, while the solder 4 is heated, the electronic component 2 is pushed toward the wiring board 3 (see FIG. 7E). When the solder 4 is melted by heating, the insulating wall 2C of the electronic component 2 descends while scraping the solder 4, and the tip of the insulating wall 2C comes into contact with the wiring board 3. Then, when the solder 4 is hardened by stopping the heating and the volume of the solder 4 shrinks due to the temperature drop, the electronic component 2 is attracted to the wiring board 3 side. When the electronic component 2 is attracted to the wiring board 3 side, the tip of the insulating wall 2C bites into the soft portion 3A2 between the electrodes 3B (see FIG. 7F).

If the wiring board 3 has the soft portion 3A2 between the electrodes 3B, the tip of the insulating wall 2C easily bites into the soft portion 3A2. Therefore, for each electrode 3B, the electrical path through the portion of the solder 4 can be more reliably isolated from each other by the insulating wall 2C. The insulation state of each other's electrical paths through the portion of the solder 4 in each electrode 2B is the same as that of the electrode 3B.

Further, the electronic device 1 is not limited to the above-mentioned form. FIG. 8 is a diagram showing a modified example and a comparative example of the electronic device 1. FIG. 8A corresponds to the electronic device 1 of the above embodiment. On the other hand, FIG. 8B is a diagram showing a first comparative example of the electronic device 1. Further, FIG. 8C is a diagram showing a second comparative example of the electronic device 1. FIG. 8D is a diagram showing a modified example of the electronic device 1.

The electronic device 201 of the first comparative example shown in FIG. 8B is an electronic device including an electronic component 202 and a wiring board 203, as in the electronic device 1 of the above embodiment, and the electronic component 202 is made of solder 204. It is joined to the wiring board 203. The solder 204 that electrically connects the electrode 202B provided on the electronic component main body 202A of the electronic component 202 and the electrode 203B provided on the base material 203A of the wiring board 203 is partitioned by the insulating wall 202C. ing. The tip of the insulating wall 202C on the wiring board 203 side is in contact with the recess 203A3 of the base material 203A.

The electronic device 201 of the second comparative example shown in FIG. 8C is almost the same as the electronic device 201 of the first comparative example shown in FIG. 8B, but the tip of the insulating wall 202C on the wiring board 203 side is The difference is that it fits into the recess 203A4 of the base material 203A.

In the electronic devices 201 of the first comparative example and the second comparative example, the solder 204 that electrically connects the electrode 202B and the electrode 203B is formed in a wall shape between the electrodes 202B as in the electronic device 1 of the above embodiment. Although it is partitioned by the insulating wall 202C to be formed, since the insulating wall 202C only touches the base material 203A, the insulating function of the insulating wall 202C may not be fully exhibited. On the other hand, in the electronic device 1 of the above embodiment, since the tip of the insulating wall 2C is embedded in the base material 3A, there is a low possibility that the insulating function of the insulating wall 2C is deteriorated due to the warp of the electronic device 1.

However, even when the insulating wall 2C does not have a tapered shape, it is possible to bury the tip of the insulating wall 2C in the base material 3A without providing the recess 3A4. Depending on the flexibility of the base material 3A between the electrodes 3B, for example, as shown in FIG. 8D, the insulating wall 2C having no tapered shape may be embedded in the base material 3A having no recess 3A4. Is possible.

In the electronic device 201 of the first comparative example shown in FIG. 8B, the tip of the insulating wall 202C on the wiring board 203 side only touches the recess 203A3 of the base material 203A, and the wiring of the insulating wall 202C. As described above, the tip of the substrate 203 side is not buried in the base material 203A, but the tip of the insulating wall on the wiring board side can be buried in the recess of the base material in the following form. FIG. 9 is a second diagram showing an example of a method for manufacturing the wiring board 3. That is, a resin material 11 that is more flexible than the base material 3A1 and a resin material 12 that is harder than the resin material 11 are mounted on the surface of the base material 3A1 (see FIG. 9A). Next, the resin material 11 and the resin material 12 are patterned to form the electrode 3B (see FIG. 9B). The patterned resin material 11 (which is an example of the "second material" in the present application) forms the soft portion 3A2. Further, the patterned resin material 12 (which is an example of the "first material" in the present application) forms the hard portion 3A5. Next, the conductive material is embedded in the patterned portions of the resin material 11 and the resin material 12, and the electrode 3B is formed (see FIG. 9C). Next, the recess 3A3 is formed in the hard portion 3A5 (see FIG. 9D). The recess 3A3 can be formed, for example, by sliding a sword-shaped jig or a laser beam having a spacing similar to that of the hard portion 3A5 while irradiating the hard portion 3A5. As described above, the wiring board 3 having the recesses 3A3 between the electrodes 3B is completed. Since the resin material 12 is harder than the resin material 11, the bottom portion of the recess 3A3 becomes more flexible than the side portion.

After the wiring board 3 having the recesses 3A3 between the electrodes 3B is completed, the same method as described with reference to FIG. 6 is performed. That is, the solder 4 is arranged so as to cover the portion of the surface of the base material 3A1 where the electrodes 3B are arranged (see FIG. 9E). Then, the electronic component 2 is placed on the solder 4 with the insulating wall 2C facing toward the wiring board 3. Then, while the solder 4 is heated, the electronic component 2 is pushed toward the wiring board 3 (see FIG. 9F). When the solder 4 is melted by heating, the insulating wall 2C of the electronic component 2 descends while scraping the solder 4, and the tip of the insulating wall 2C comes into contact with the wiring board 3. Then, by guiding the tip of the insulating wall 2C into the recess 3A3, the relative alignment of the electronic component 2 with respect to the wiring board 3 is performed (see FIG. 9 (G)). When the solder 4 is hardened by stopping the heating and the volume of the solder 4 shrinks due to the temperature drop, the electronic component 2 is attracted to the wiring board 3 side, and the tip of the insulating wall 2C bites into the soft portion 3A2 between the electrodes 3B.

The method for manufacturing the wiring board 3 shown in FIG. 9 may be modified as follows, for example. FIG. 10 is a third diagram showing an example of a method for manufacturing the wiring board 3. That is, after the resin material 11 and the resin material 12 are mounted on the surface of the base material 3A1 (see FIG. 10A) and the resin material 11 and the resin material 12 are patterned (see FIG. 10B). ), The conductive material is embedded in the patterned portion of the resin material 11 and the resin material 12, and the electrode 3B having the raised portion 3B1 is formed (see FIG. 10C). Next, the recess 3A3 is formed in the hard portion 3A5 (see FIG. 10D). As described above, the electrode 3B having the raised portion 3B1 and the wiring board 3 having the concave portion 3A3 are completed.

After the wiring board 3 having the recesses 3A3 between the electrodes 3B is completed, the same method as described with reference to FIG. 6 is performed. That is, the sheet-shaped solder 4 is arranged so as to cover the portion of the surface of the base material 3A1 where the electrodes 3B are arranged (see FIG. 10F). Then, the electronic component 2 is placed on the solder 4 with the insulating wall 2C facing toward the wiring board 3. Then, while the solder 4 is heated, the electronic component 2 is pressed toward the wiring board 3 (see FIG. 10F). When the solder 4 is melted by heating, the insulating wall 2C of the electronic component 2 descends while scraping the solder 4, and the tip of the insulating wall 2C comes into contact with the wiring board 3. Then, the tip of the insulating wall 2C is guided into the recess 3A3 by the raised portion 3B1, and the relative alignment of the electronic component 2 with respect to the wiring board 3 is performed (see FIG. 10 (G)). When the solder 4 is hardened by stopping the heating and the volume of the solder 4 shrinks due to the temperature drop, the electronic component 2 is attracted to the wiring board 3 side, and the tip of the insulating wall 2C bites into the soft portion 3A2 between the electrodes 3B.

As described above, if the recess 3A3 and the raised portion 3B1 are provided on the wiring board 3, the alignment of the electronic component 2 with respect to the wiring board 3 can be easily performed.

FIG. 11 is a second diagram showing an example of a method for manufacturing the electronic component 2. The electronic component 2 can also be manufactured by, for example, the following method. That is, in the present manufacturing method, first, the film 13 is attached to the electronic component main body 2A in which the electrodes 2B are arranged on the surface (see FIG. 11A). Next, a hole 13A for forming the insulating wall 2C is formed in the film 13 (see FIG. 11B). The hole 13A is formed by, for example, laser processing. Next, the insulating material is filled in the hole 13A, and the insulating wall 2C is formed in the hole 13A (see FIG. 11C). The insulating wall 2C can be formed, for example, by filling the hole 13A with a thermosetting resin and heating it. Next, the film 13 is removed from the surface of the electronic component body 2A, and cleaning is performed (see FIG. 11D). By removing the film 13 from the surface of the electronic component body 2A, the electronic component 2 in which the insulating wall 2C having a non-tapered tip is formed on the surface of the electronic component body 2A is completed.

FIG. 12 is a first diagram showing a comparative example. For example, as shown in FIG. 12, when the solder balls 104 are provided on the electrodes 103B of the wiring board 103, even if the solder balls 104 are aligned at predetermined positions before the start of reflow (see FIG. 12 (A1)). ), The tacking force decreases due to the decrease in the viscosity of the flux 105 during the reflow, and the solder ball 104 moves around on the electrode 103B following the flow of the flux 105 (see FIG. 12 (B1)). Then, if the solder balls 104 are normally reflowed, each solder ball 104 is welded to each electrode 103B (see FIG. 12 (C1)). However, when the electrodes 103B arranged on the surface of the base material 103A are miniaturized, the distance between the electrodes 103B becomes narrower. If the distance between the electrodes 103B is narrow, even if the solder balls 104 are aligned in a predetermined position before the start of reflow (see FIG. 12A2), the solder balls 104 moving around during the reflow may come into contact with each other. Increase (see FIG. 12 (B2)). When the solder balls 104 come into contact with each other during reflow, the solder balls 104 are cured, for example, in a state of being integrated with the adjacent solder balls 104 (see reference numeral A shown in FIG. 12 (C2)). If the electrodes 103B are cured in a state of being integrated with the adjacent solder balls 104, the electrodes 103B will be short-circuited. Reducing the amount of solder in the joint, such as using a small-diameter solder ball 104 to suppress the possibility of the solder balls 104 coming into contact with each other, increases the electrical resistance at the connection, reduces the reliability of the connection, and has heat transfer properties. Leads to a decline in.

FIG. 13 is a second diagram showing a comparative example. Contact between the solder balls 104 can occur not only during reflow on the wiring board 103, but also when the electronic component 102 is mounted on the wiring board 103, for example, as shown in FIG. That is, even if the electronic component 102 in which the solder ball 104 is normally welded is prepared on the electrode 102B, in the reflow when the electronic component 102 is mounted on the wiring board 103, for example, the solder ball 104 is generated by the weight of the electronic component 102. When expanded, the solder balls 104 may come into contact with each other, as indicated by reference numeral B in FIG.

In this respect, in the case of the electronic device 1 of the above embodiment and each modification, the solder 4 that electrically connects the electrodes 2B and the electrodes 3B is partitioned by the insulating wall 2C formed in a wall shape between the electrodes 2B. Therefore, unlike the solder balls 104, the solders of the adjacent electrodes do not come into contact with each other. Therefore, even if the electrodes 2B and 3B are miniaturized, short circuits between the electrodes are suppressed. Further, since a sufficient amount of solder can be secured in the joint portion, the electric resistance in the joint portion can be suppressed as much as possible. Further, since a sufficient amount of solder can be secured at the joint portion, heat transferability can be ensured. Further, since there is an insulating wall between the solders, it is possible to withstand migration due to the electric field strength between the adjacent solders.

1,201 ... Electronic device: 2,102,202 ... Electronic component: 2A, 202A ... Electronic component body: 2B, 102B, 202B ... Electrode: 2C, 202C ... Insulation wall: 3,103,203 ...・ Wiring board: 3A, 3A1,103A, 203A ・ ・ Base material: 3A2 ・ ・ Soft part: 3A3,3A4,203A3,203A4 ・ ・ Recessed part: 3A5 ・ ・ Hard part: 3B, 103B ・ ・ Electrode: 3B1 ・ ・ Uplift Part: 4,204 ... Solder: 10,13 ... Film: 10A, 13A ... Holes: 11,12 ... Resin material: 104 ... Solder ball: 105 ... Flux

Claims (14)

A wiring board with multiple electrodes arranged on the surface,
An electronic component bonded to the wiring board via solder covering a portion where the plurality of electrodes are arranged, and
By partitioning the solder between the plurality of electrodes with an insulating material in contact with the solder, electrical conduction between the electrodes through the solder is cut off, and the tip on the wiring board side is the wiring board. An insulating wall embedded in a material between the plurality of electrodes.
Electronic device. The material between the plurality of electrodes of the wiring board has an elastic modulus lower than the elastic modulus of the material of the insulating wall.
The electronic device according to claim 1. The wiring board has a recess between the plurality of electrodes.
The electronic device according to claim 1 or 2. The wiring board has a first material that forms a side portion of the recess and a second material that forms the bottom surface of the recess and has a modulus of elasticity lower than that of the first material.
The electronic device according to claim 3. Each of the plurality of electrodes has a raised central portion.
The electronic device according to any one of claims 1 to 4. The insulating wall is formed in a grid pattern on the surface of the electronic component.
The electronic device according to any one of claims 1 to 5. A process of arranging solder on a wiring board in which a plurality of electrodes are arranged on the surface in a state of covering the portion where the plurality of electrodes are arranged, and a process of arranging the solder.
An electronic component having an insulating wall for partitioning the solder between the plurality of electrodes is placed on the wiring board so that the tip of the insulating wall on the wiring board side is embedded in the material between the plurality of electrodes of the wiring board. Has a step of joining,
Manufacturing method of electronic device. In the joining step, the electronic component is subjected to the electronic component so that the insulating wall is pressed against the wiring board in a state where the solder arranged so as to cover the portion where the plurality of electrodes are arranged is heated and melted. Joined to the wiring board,
The method for manufacturing an electronic device according to claim 7. In the arranging step, solder containing Sn and having a Bi content of 40% or less is arranged on the wiring board.
The method for manufacturing an electronic device according to claim 7. The material between the plurality of electrodes of the wiring board has an elastic modulus lower than the elastic modulus of the material of the insulating wall.
In the joining step, the tip of the insulating wall on the wiring board side comes into contact with the material between the plurality of electrodes of the wiring board.
The method for manufacturing an electronic device according to any one of claims 7 to 9. The wiring board has a recess between the plurality of electrodes, and the wiring board has a recess.
In the joining step, the tip of the insulating wall on the wiring board side enters the recess.
The method for manufacturing an electronic device according to any one of claims 7 to 10. The wiring board has a first material that forms a side portion of the recess and a second material that forms the bottom surface of the recess and has a modulus of elasticity lower than that of the first material.
In the joining step, the tip of the insulating wall on the wiring board side comes into contact with the second material on the bottom surface of the recess.
The method for manufacturing an electronic device according to claim 11 . Each of the plurality of electrodes has a raised central portion.
In the joining step, the tip of the insulating wall on the wiring board side is guided to the recess by the ridges of the electrodes.
The method for manufacturing an electronic device according to claim 11 or 12 . The insulating wall is formed in a grid pattern on the surface of the electronic component.
In the joining step, the electronic component is joined to the wiring board so that the lattice of the insulating wall is located between the plurality of electrodes.
The method for manufacturing an electronic device according to any one of claims 8 to 13.

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