JP7092543B2 - Vacuum deposition equipment - Google Patents

Description

The present invention relates to a vacuum vapor deposition apparatus in which a thin-film deposition source is provided in a vacuum chamber, the vapor-film deposition material is sublimated or vaporized by the vapor-film deposition source in a vacuum atmosphere, and the sublimated or vaporized vapor-film deposition material is vapor-deposited on the object to be vapor-deposited. More specifically, the present invention relates to a device further provided with a regulating plate that regulates the scattering range of the vapor-deposited material scattered from the thin-film deposition source toward the vapor-film-deposited material.

This type of vacuum vapor deposition apparatus is known, for example, in Patent Document 1. This has a vacuum chamber, and a crucible as a vapor deposition source in which a vapor deposition substance appropriately selected according to a thin film to be formed is housed is arranged at the bottom of the vacuum chamber. Then, while moving the material to be vapor-deposited in one direction in a vacuum chamber in a vacuum atmosphere at a predetermined speed, the vapor-film-deposited material is sublimated or vaporized by heating it with a thin-film deposition source, and the sublimated or vaporized material is scattered from the vapor-film deposition source. The thin-film film to be deposited is adhered to and deposited on the object to be vapor-deposited so that a thin film having a predetermined film thickness is deposited. At this time, a regulating means (shielding means) is provided between the vapor-deposited material and the vapor-deposited source in the vacuum chamber to regulate the vapor-deposited region of the sublimated or vaporized vapor-filmed material on the vapor-deposited material. There is. As the regulating means, a plate-shaped member (regulating plate) that is cantilevered and supported by a support column that is located around the vapor deposition source and is erected at the bottom of the vacuum chamber is used.

Here, the vapor deposition material scattered from the vapor deposition source at the time of vapor deposition adheres and deposits not only on the material to be deposited but also on one side of the regulation plate facing the vapor deposition source side and its side surface, but usually, it is deposited on the vapor deposition source. The amount of deposition tends to be the largest on the free end side of the near regulatory plate. Then, the vapor deposition material is deposited from one surface of the regulation plate to the side surface of the regulation plate located at the free end, and the deposit swells so as to block the scattering path of the sublimated or vaporized vaporized material toward the vapor deposition material. .. For this reason, there is a problem that the vapor deposition area in the object to be treated is narrowly limited by the bulging deposit. In such a case, it becomes necessary to replace the plate-shaped member frequently, which impairs mass productivity.

Japanese Unexamined Patent Publication No. 7-98862

In view of the above points, the present invention is a regulation plate that prevents the sublimated or vaporized vaporized material from blocking the scattering path toward the vaporized material as much as possible even if the vaporized material adheres and accumulates. It is an object of the present invention to provide a vacuum vapor deposition apparatus having the above.

In order to solve the above problems, the present invention is provided with a thin-film deposition source in a vacuum chamber, and the vapor-filmed material is sublimated or vaporized by the thin-film deposition source in a vacuum atmosphere, and the sublimated or vaporized vapor-film-deposited material is vapor-deposited on the object to be vapor-deposited. The vacuum vapor deposition apparatus of No. 1 is cantilevered by a support provided in the vacuum chamber, and further includes a regulating plate that regulates the scattering range of the vapor-deposited material scattered from the vapor deposition source toward the object to be deposited. One surface facing the vapor deposition source side is the lower surface, and the other side is the upper surface, and an inclined surface that intersects the lower surface at an blunt angle and at a sharp angle with the upper surface end is formed at the free end of the regulation plate.

According to the present invention, the regulation plate is located between the vapor-deposited material and the vapor-deposited source in the vacuum chamber and regulates the vapor-deposited region of the vapor-deposited material sublimated or vaporized on the free end side on the vapor-deposited material. When vapor deposition is carried out on an object to be vapor-deposited in a state where Since the inclined surface is formed so that the side surface of the plate is omitted, it is possible to prevent the deposit from swelling so as to block the scattering path of the sublimated or vaporized vaporized material toward the deposited matter. Will be done. As a result, it is possible to suppress the problem that the vapor deposition area in the object to be treated is narrowly limited by the deposit, and the frequency of replacement of the regulation plate can be significantly reduced as compared with the above-mentioned conventional example.

Here, when the vapor-deposited substance scattered from the vapor-film deposition source is deposited on the regulation plate to a thickness of a predetermined value or more, the deposit causes a problem such as becoming a source of particles, and therefore, if the predetermined film-forming time is exceeded. , The regulation plate needs to be replaced. At this time, if the vacuum chamber is opened to the atmosphere and replaced each time, mass productivity is impaired. In the present invention, when the support is composed of columns erected on the bottom surface of the vacuum chamber in which the vapor deposition source is installed, a plurality of regulation plates are attached to the columns, and each regulation plate is vapor-deposited. A configuration may be adopted in which a moving means for moving the substance to a retracted position that does not limit the scattering range of the substance is further provided. In this case, the moving means includes an actuator that supports only the regulation plate located at the lowest stage, and when deposits of a predetermined value or more are formed on the regulation plate, the regulation plate is guided to the support column by the operation of the actuator. It may be configured to be moved to the retracted position on the bottom side of the vacuum chamber. Further, when the support has a rotating shaft and is provided with a drive motor for rotationally driving the rotating shaft, a configuration in which a plurality of the regulating plates are attached at intervals around the rotating shaft is provided. It may be adopted. Further, when the support has a plurality of rollers and a conveyor belt wound around the rollers in an endless manner, a configuration in which a plurality of the restricting plates are attached to the conveyor belt at intervals. It may be adopted. As a result, the vacuum chamber can be opened to the atmosphere and the frequency of replacing the regulation plate can be reduced, and high mass productivity can be achieved.

The cross-sectional view schematically which shows the vacuum vapor deposition apparatus provided with the control plate of embodiment of this invention. (A) is an enlarged view explaining the deposition of the vapor-deposited substance on the regulation plate of the conventional example, and (b) is an enlarged view explaining the deposition of the vapor-deposited substance on the regulation plate of the present embodiment. A partial cross-sectional view showing a part of the vacuum vapor deposition apparatus shown in FIG. 1 in an enlarged manner. The figure explaining the deformation example when a plurality of regulation plates are provided. The figure explaining another modification in the case of providing a plurality of regulation plates. The figure explaining still another modification in the case of providing a plurality of regulation plates.

Hereinafter, referring to the drawings, a glass substrate having a predetermined thickness having a rectangular outline (hereinafter referred to as “substrate Sw”), a metal or the like that transfers the vapor-deposited substance 5 to the gas phase via the liquid phase, etc. An embodiment of the vacuum vapor deposition apparatus of the present invention will be described by taking as an example a case where a predetermined thin film is vapor-deposited on one surface of the substrate Sw. In the following, the terms indicating the directions such as "up" and "down" are based on FIG. 1, which indicates the installation posture of the vacuum vapor deposition apparatus.

With reference to FIG. 1, DM is a vacuum vapor deposition apparatus of this embodiment. The vacuum vapor deposition apparatus DM includes a vacuum chamber 1, and although not particularly illustrated, a vacuum pump is connected to the vacuum chamber 1 via an exhaust pipe, and the vacuum chamber 1 can be evacuated to a predetermined pressure (vacuum degree) and held. It has become like. Further, a substrate transfer device 2 is provided above the vacuum chamber 1. The substrate transfer device 2 has a carrier 21 that holds the substrate Sw in a state where the lower surface as a film forming surface is open, and the carrier 21 and thus the substrate Sw are predetermined in one direction in the vacuum chamber 1 by a drive device (not shown). It is designed to move at speed. Since a known substrate transfer device 2 can be used, further description thereof will be omitted. Further, in the following, the relative movement direction of the substrate Sw with respect to the vapor deposition source 4 is the X-axis direction, and the width direction of the substrate Sw orthogonal to the X-axis direction is orthogonal to the Y-axis direction, the X-axis direction and the Y-axis direction in FIG. The vertical direction is the Z-axis direction.

A plate-shaped mask plate 3 is provided between the substrate Sw transported by the substrate transport device 2 and the vapor deposition source 4 described later. In the present embodiment, the mask plate 3 is integrally attached to the substrate Sw and is conveyed together with the substrate Sw by the substrate transfer device 2. The mask plate 3 may be fixedly arranged in the vacuum chamber 1 in advance. A plurality of openings 31 penetrating in the plate thickness direction are formed in the mask plate 3, and the adhesion range of the vapor-deposited substance to the substrate Sw is limited at a position where these openings 31 do not exist, so that the substrate Sw is formed in a predetermined pattern. It is designed to be filmed. As the mask plate 3, a metal such as Invar, aluminum, alumina or stainless steel, or a resin such as polyimide is used. The bottom surface of the vacuum chamber 1 is provided with the vapor deposition source 4 of the present embodiment facing the substrate Sw that is moved in the X-axis direction.

The vapor deposition source 4 has a storage box 41 for accommodating the vapor deposition substance 5. The vapor-deposited substance 5 is appropriately selected from materials such as metal and resin according to the thin film to be formed on the substrate Sw, and granules or tablets are used. A metal saucer 42 is provided at the lower part of the storage box 41, and the vapor-deposited substance 5 is installed on the saucer 42. A heating means (not shown) is provided between the saucer 42 and the bottom wall of the storage box 41, and the vaporized substance 5 is heated to the vaporization temperature via the saucer 42. As the heating means, known means such as a sheath heater and a lamp heater can be used, and such a heating means can be arranged outside the storage box 41. Although not particularly illustrated and described, a dispersion plate is provided in the storage box 41 so as to be located above the saucer 42, and the vaporized vaporized substance 5 can be injected from each of the injection nozzles described later at a substantially uniform flow rate. It has become like.

On the upper surface (opposite surface of the substrate Sw) 41a of the storage box 41, injection nozzles 43a and 43b for injecting the vaporized vaporized substance 5 composed of a cylinder having a predetermined height are arranged at predetermined intervals in the Y-axis direction. (6 in this embodiment) are arranged in a row. In this case, the two injection nozzles 43a located at both ends in the Y-axis direction are erected so that their hole axes are inclined outward in the Y-axis direction at a predetermined angle with respect to the Z-axis direction, and each of the other injection nozzles. The nozzle 43b is erected along the Z-axis direction. The number of injection nozzles 43a and 43b and the distance between them, the number of injection nozzles 43a and 43b to be tilted and their inclination angles, the nozzle diameter of each injection nozzle 43a and 43b, and the height from the upper surface 41a to the tip of the nozzle are For example, it is appropriately set in consideration of the film thickness distribution in the Y-axis direction when vapor-deposited on the substrate Sw and the avoidance of nozzle clogging (due to those deposited on the upper surface 41a) during vapor deposition.

Further, on the bottom surface of the vacuum chamber 1, columns 6 as supports are erected on both sides of the vapor deposition source 4 in the Y-axis direction, and at the tip thereof, the substrate Sw and the vapor deposition source 4 are arranged in the vertical direction. The regulation plate 7 is cantilevered and supported by being positioned between the two. Then, when the solid vaporized substance 5 installed on the saucer 42 of the storage box 41 is heated in the vacuum chamber 1 in a vacuum atmosphere, the vaporized substance 5 is transferred to the gas phase via the liquid phase, and the vaporized vaporized substance 5 is transferred to the gas phase. Scatters toward the substrate Sw through the injection nozzles 43a and 43b, and the vapor deposition substance 5 adheres, accumulates, and is vaporized. At this time, the vapor deposition region of the vapor-filmed substance 5 vaporized by the regulation plate 7 on the substrate Sw is restricted (that is, the regulation line Rl connecting the injection nozzles 43a located at both ends in the Y-axis direction and both ends in the Y-axis direction of the substrate Sw). The scattering of the vapor-filmed substance 5 in the Y-axis direction is further limited), for example, the film thickness distribution along the Y-axis direction on the substrate Sw can be made uniform.

By the way, the vapor deposition substance 5 scattered from the vapor deposition source 4 at the time of vapor deposition adheres and deposits not only on the lower surface of the substrate Sw but also on the lower surface of the regulation plate 7 facing the vapor deposition source 4 side and its side surface. The deposition amount is the largest on the free end side of the regulation plate 7 near the source 4. In this case, in the conventional regulation plate 70, as shown in FIG. 2A, the vapor deposition material 5 is deposited from the lower surface 70a to the side surface 70b on the free end side located in the Y-axis direction, and the deposit 51 is deposited. , It swells so as to block the scattering path of the vapor deposition material 5 scattered from the vapor deposition source 4 toward the substrate Sw (that is, across the regulation line Rl and inward in the Y-axis direction). For this reason, the bulging deposit 51 causes a problem that the vapor deposition region in the substrate Sw is narrowly limited.

Therefore, in the present embodiment, as shown in FIG. 2B, the free end of the regulation plate 7 has an obtuse angle with the lower surface 71 of the regulation plate 7 facing the vapor deposition source 4 side and an acute angle with the end of the upper surface 72. It was decided to form the inclined surfaces 73 intersecting with each other (that is, the side surface on the free end side of the restricting plate 7 located in the Y-axis direction was omitted). In this case, the angle α1 when the lower surface 71 of the regulation plate 7 and the inclined surface 73 intersect is preferably in the range of 5 degrees to 45 degrees. As a result, the vapor deposition material 5 scattered from the vapor deposition source 4 adheres to and deposits on the lower surface 71 and the inclined surface 73 of the regulation plate 7, but the deposit 51 is the substrate Sw of the vapor deposition material 5 scattered from the vapor deposition source 4. It is suppressed as much as possible to bulge so as to block the scattering path toward (that is, to the inside in the Y-axis direction across the regulation line Rl). As a result, the problem that the vapor deposition region in the substrate Sw is narrowly limited by the deposit 51 is suppressed, and the replacement frequency of the regulation plate 7 can be significantly reduced as compared with the conventional example.

By the way, when the vapor-deposited substance 5 scattered from the injection nozzles 43a and 43b of the vapor-film deposition source 4 is deposited on the lower surface 71 or the inclined surface 73 of the regulation plate 7 with a thickness of a predetermined value or more, the deposit 51 is used as a source of particles, for example. Problems such as Therefore, when the predetermined film formation time is exceeded, it is necessary to replace the regulation plate 7, but if the vacuum chamber 1 is opened to the atmosphere and replaced each time, mass productivity is impaired. In the present embodiment, as shown in FIG. 3, a plurality of restricting plates 7 having the same configuration are cantilevered and supported at the upper end of the support column 6. The support column 6 is provided with two actuators 8a and 8b having a support rod 81 that can freely appear and disappear inward in the Y-axis direction of the vacuum chamber 1 from the support column 6 at intervals in the vertical direction. In this case, a plurality of actuators 8a and 8b can be provided at intervals in the X-axis direction according to the area of the regulation plate 7 (that is, the length in the X-axis direction), and the tip of the support rod 81 can be provided. It is also possible to further provide a longitudinal one in the X-axis direction. As the actuators 8a and 8b, known actuators such as pneumatic type and electric type can be used, so detailed description thereof will be omitted here.

The first actuator 8a located below supports only the regulation plate 7 located at the lowest stage, and in this state, the free end of the regulation plate 7 is positioned on the regulation line Rl. Further, the portion of the support column 6 located above the first actuator 8a is inclined outward in the Y-axis direction, and the second actuator 8b is provided on the portion of the inclined column 6. The support rod 81 of the second actuator 8b is supported in a state where a plurality of regulation plates 7 are stacked, and in this state, the Y axis is provided so that the free ends of the respective regulation plates 7 are spaced from the regulation line Rl. It is offset outward in the direction so as not to block the scattering path of the vapor deposition material 5 scattered from the vapor deposition source 4 toward the substrate Sw (see FIG. 1). Then, when a predetermined or more deposit 51 is formed on the lowermost restricting plate 7 supported by the first actuator 8a, the support rod 81 of the first actuator 8a is moved to the immersion position, and the restricting plate 7 is moved to the immersion position. Is guided by the support column 6 and moved to the bottom surface (retracted position) of the vacuum chamber 1.

Next, when the support rod 81 of the first actuator 8a is moved to the protruding position (state shown in FIG. 3) and then the support rod 81 of the second actuator 8b is moved to the immersion position, it is supported by the second actuator 8b. Of the regulation plates 7, the lowest one is lowered and supported by the first actuator 8a (film formation position). In the present embodiment, the actuators 8a and 8b provided on the support column 6 constitute a moving means for moving each of the regulating plates 7 to a retracted position that does not limit the scattering range of the vapor-deposited substance. After that, this operation is repeated, and the vapor deposition region of the vapor-deposited substance 5 vaporized by the regulation plate 7 on the substrate Sw for a long time until the deposit 51 above a predetermined value is formed on the regulation plate 7 located at the uppermost stage is formed. Be regulated. As a result, the frequency of replacement of the regulation plate 7 itself due to the deposit 51 can be reduced, and the frequency of replacement of each regulation plate 7 by opening the vacuum chamber 1 to the atmosphere can be reduced (maintenance cycle can be lengthened). ), High mass productivity can be achieved.

Although the embodiments of the present invention have been described above, various modifications are possible as long as they do not deviate from the scope of the technical idea of the present invention. In the above embodiment, as the vapor deposition source 4, a method in which injection nozzles 43 are arranged in a row on the upper surface 41a of the storage box 41 (so-called line source) has been described as an example, but the invention is not limited to this, and vapor deposition is not limited to this. The present invention is also applicable when the source 4 is composed of a crucible. Further, in the above embodiment, the case where the regulating plates 7 are arranged on both sides of the vapor deposition source 4 in the Y-axis direction to regulate the vapor deposition region of the vapor deposition substance 5 on the substrate Sw has been described as an example, but the present invention is limited to this. is not. Although not particularly illustrated and described, for example, in the vapor deposition source 4, a support column is erected on the upper surface 41a of the storage box 41, and a plurality of regulation plates are provided on the support column in the same manner as described above, and one of the injection nozzles 43a is provided. The present invention can also be applied to those that regulate the scattering range of the vapor-filmed substance 5 from 43b.

Further, in the above embodiment, the support using the support column 6 as the support for cantilevering the regulation plate 7 has been described as an example, but the present invention is not limited to this, and for example, the regulation plate is formed on the inner wall surface of the vacuum chamber 1. 7 can be supported, in which case a moving means is provided on the inner wall of the vacuum chamber 1. Further, although the case of using two actuators 8a and 8b as the moving means has been described as an example, if the restricting plate 7 on which the deposit 51 having a predetermined value or more is formed can be moved to the evacuation position along the support column 6. , The form does not matter.

In the modified example shown in FIG. 4, two plate-shaped columns 60 are erected in the vacuum chamber 1 with an interval in the X-axis direction, and a plurality of rotating shafts 61 are provided in the Z-axis directions on both columns 60. A regulation plate 7 is swingably attached to each rotating shaft 61 so as to be pivotally supported at intervals. Then, when a predetermined or more deposit 51 is formed on the regulation plate 7, the rotary shaft 61 is rotationally driven by the drive motor Dm as a moving means, and the respective regulation plates 7 are overlapped with the inner wall surface of the vacuum chamber 1 (positions where the respective regulation plates 7 are overlapped with the inner wall surface of the vacuum chamber 1. It is possible to move to each of the evacuation positions). In this case, each rotation axis 61 is inward in the Y-axis direction as it goes upward in the Z-axis direction so that the regulation plates 7 on which the deposit 51 is formed can be stacked along the inner wall surface of the vacuum chamber 1. Is eccentric towards. Further, the length of the regulation plate 7 in the Y-axis direction increases in the upward direction of the Z-axis so that the unused regulation plate 7 does not block the scattering path of the vapor-filming substance 5 scattered from the vapor deposition source 4 toward the substrate Sw. It is set to be short.

Further, in another modification shown in FIG. 5, a single rotation shaft 90 extending in the X-axis direction is provided in the vacuum chamber 1, and a plurality of rotation shafts 90 are restricted around the rotation shaft 90 at intervals in the circumferential direction. A plate 7 is provided. Then, when deposits 51 of a predetermined value or more are formed on one regulation plate 7, the rotary shaft 90 is rotationally driven by a predetermined angle by the drive motor Dm as a means of transportation, and the next regulation plate 7 is used to drive the vapor-deposited substance 5 by the next regulation plate 7. The vapor deposition area on the substrate Sw is regulated.

Further, in still another modification shown in FIG. 6, at least two rollers 91 extending in the X-axis direction at intervals in the Y-axis direction in the vacuum chamber 1 and winding around each roller 91 in an endless manner. The transport belt 92 is provided, and a plurality of regulating plates 7 are provided on the transport belt 92 at intervals. Then, when a predetermined or more deposit 51 is formed on one regulation plate 7, the roller 91 is intermittently rotationally driven by a motor (not shown), and the next regulation plate 7 is used to transfer the vapor deposition material 5 to the substrate Sw. The vapor deposition area is regulated.

DM ... Vacuum vapor deposition equipment, 1 ... Vacuum chamber, 4 ... Evaporation source, 5 ... Evaporation material, 51 ... Evaporation material deposit, 6 ... Support (support), 7 ... Regulation plate, 71 ... Bottom surface of regulation plate, 72 ... The upper surface of the regulation plate, 73 ... Inclined surface, 8a, 8b ... Actuator (moving means), 91 ... Roller, 92 ... Conveyance belt, Dm ... Drive motor, Sw ... Substrate (film-film deposition).

Claims (2)

A vacuum vapor deposition apparatus in which a thin-film deposition source is provided in a vacuum chamber, the vapor-film deposition material is sublimated or vaporized by this vapor-film deposition source in a vacuum atmosphere, and the sublimated or vaporized vapor-film deposition material is vapor-deposited on the object to be vapor-deposited.
It is cantilevered by a support provided in the vacuum chamber, and is further equipped with a regulating plate that regulates the scattering range of the vapor-deposited material that scatters from the vapor deposition source toward the object to be deposited. In a case where an inclined surface that intersects the lower surface at an obtuse angle and at an acute angle with the upper surface end is formed at the free end of the regulation plate, with the surface of the surface as the lower surface and the other side as the upper surface.
The support is composed of columns erected on the bottom surface of the vacuum chamber in which the vapor deposition source is installed, and a plurality of regulation plates are attached to the columns, and each regulation plate limits the scattering range of the vapor deposition material. Further provision of transportation means to move each to the evacuation position
The moving means includes an actuator that supports only the regulation plate located at the lowest stage, and when deposits equal to or larger than a predetermined value are formed on the regulation plate, the regulation plate is guided to the support column by the operation of the actuator to guide the vacuum chamber. A vacuum vapor deposition apparatus characterized in that it is configured to be moved to a retracted position on the bottom surface side. A vacuum vapor deposition apparatus in which a thin-film deposition source is provided in a vacuum chamber, the vapor-film deposition material is sublimated or vaporized by this vapor-film deposition source in a vacuum atmosphere, and the sublimated or vaporized vapor-film deposition material is vapor-deposited on the object to be vapor-deposited.
It is cantilevered by a support provided in the vacuum chamber, and is further equipped with a regulating plate that regulates the scattering range of the vapor-deposited material that scatters from the vapor deposition source toward the object to be deposited. In a case where an inclined surface that intersects the lower surface at an obtuse angle and at an acute angle with the upper surface end is formed at the free end of the regulation plate, with the surface of the surface as the lower surface and the other side as the upper surface.
The support has a rotating shaft, a drive motor for rotationally driving the rotating shaft is provided, and a plurality of the regulating plates are attached around the rotating shaft at intervals. Device.

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